JP2013029347A - Magnetic sensor device and connector mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic sensor device capable of reducing costs and preventing disconnection between electronic components to be mounted on a circuit board and the circuit board even when a frequency and acceleration of vibration to be applied to the magnetic sensor device are large.SOLUTION: A magnetic sensor device with a magnetic resistance element includes: a circuit board 17 for processing a signal to be output from the magnetic resistance element; a connector 19 for electrically connecting the circuit board 17 to a host device to which the magnetic sensor device is attached; and a housing 20 to the inside of which the circuit board 17 is arranged. The connector 19 is directly fixed to one end of the circuit board 17 and held by the housing 20, and the circuit board 17 is fixed to the housing 20 by a fixing member 25. On the circuit board 17, electronic components 18, 27-29 are mounted between the connector 19 and the fixing member 25.

Description

  The present invention relates to a magnetic sensor device having a magnetoresistive element. The present invention also relates to a connector mechanism having a connector that is directly fixed to one end of a circuit board.

  2. Description of the Related Art Conventionally, a magnetic sensor device for detecting the position of a movable part in an electronic component mounting apparatus or a machine tool is known (for example, see Patent Document 1). The magnetic sensor device described in Patent Document 1 includes a read head in which a magnetoresistive element is disposed and a magnetic scale. In general, a magnetic head device electrically connects a circuit board to a mounting unit or the like, and a main body part in which a circuit board for performing predetermined processing on a signal output from a magnetoresistive element is disposed. And a connector portion having a connector for the purpose. The read head, the main body portion, and the connector portion are formed separately, and the read head and the main body portion are connected via a cable, and the main body portion and the connector portion are connected via a cable. .

JP 2006-84407 A

In recent years, in the market for mounting devices and the like, there is an increasing demand for a higher moving speed of the movable part. When the moving speed of the movable part such as the mounting device increases, the frequency and acceleration of vibration applied to the magnetic sensor device attached to the mounting device and the like increase. On the other hand, in the conventional magnetic sensor device, since the main body portion and the connector portion are formed separately, the cost of the magnetic sensor device increases. Therefore, the inventor of the present application is examining the integration of the main body portion and the connector portion. However, when the vibration test was performed with a large vibration frequency and vibration acceleration on the integrated body part and connector part, the circuit board resonated by vibration, and the signal processing for signal processing mounted on the circuit board was performed. Disconnection occurred between the IC electrode and the circuit board. For example, when a vibration test was performed using a circuit board having a thickness of 1.2 mm under the conditions of a vibration frequency of 50 to 2000 Hz and an acceleration of 58.8 m / sec ² (6G), an electrode of the signal processing IC and the circuit board Disconnection occurred between

  Accordingly, an object of the present invention is to reduce the cost, and even if the frequency and acceleration of vibration applied to the magnetic sensor device are large, the disconnection between the electronic component mounted on the circuit board and the circuit board It is an object of the present invention to provide a magnetic sensor device that can prevent the above-described problem. Another object of the present invention is to reduce the cost and to prevent disconnection between the electronic component mounted on the circuit board and the circuit board even if the frequency and acceleration of vibration applied to the connector mechanism are large. It is an object of the present invention to provide a connector mechanism that can be prevented.

  In order to solve the above problems, a magnetic sensor device according to the present invention includes a circuit board for processing a signal output from a magnetoresistive element and a host device to which the magnetic sensor device is attached. A connector for electrically connecting the circuit board and a housing in which the circuit board is disposed are fixed directly to one end of the circuit board and held by the housing, and the circuit board is fixed The circuit board is fixed to the housing by a member, and an electronic component is mounted between the connector and the fixing member.

  In the magnetic sensor device of the present invention, the connector for electrically connecting the circuit board to the host device to which the magnetic sensor device is attached is directly fixed to one end of the circuit board, and the housing in which the circuit board is disposed. Is held in. Therefore, it is possible to integrate the part where the circuit board is arranged and the part where the connector is arranged. Therefore, in the present invention, it is possible to reduce the cost of the magnetic sensor device as compared with the case where the portion where the circuit board is disposed and the portion where the connector is disposed are formed separately. .

  In general, since the connector is held by the housing so as not to move largely with respect to the housing, in the present invention, one end side of the circuit board is placed via the connector so as not to move greatly with respect to the housing. Is held in. In the present invention, the circuit board is fixed to the housing by the fixing member, and in this circuit board, the electronic component is mounted between the connector and the fixing member. That is, in the present invention, the electronic component is mounted between a portion of the circuit board that is held by the housing via the connector and a portion that is fixed to the housing by the fixing member. Therefore, in the present invention, even if the frequency and acceleration of vibration applied to the magnetic sensor device are large, it is possible to suppress the resonance of the portion of the circuit board on which the electronic component is mounted and suppress the bending of this portion. . Therefore, in the present invention, it is possible to prevent disconnection between the electronic component mounted on the circuit board and the circuit board.

  In addition, by increasing the thickness of the circuit board, it is possible to suppress the bending of the part on which the electronic component of the circuit board is mounted and to prevent disconnection between the electronic component mounted on the circuit board and the circuit board. Is possible. However, for example, when the terminal is formed on the connector so as to sandwich the circuit board, the terminal is fixed on both sides of the circuit board, and the connector is a standard product conforming to a predetermined standard. In this case, the thickness of the circuit board cannot be made a predetermined thickness or more, and it becomes difficult to suppress the bending of the portion of the circuit board on which the electronic component is mounted. Further, when the thickness of the circuit board is increased, the magnetic sensor device may be increased in size. On the other hand, in the present invention, even if the thickness of the circuit board is not increased, the bending of the part on which the electronic component of the circuit board is mounted is suppressed, and the electronic component mounted on the circuit board and the circuit board are It becomes possible to prevent disconnection between the two.

  In the present invention, for example, a signal processing IC that performs predetermined arithmetic processing on a signal output from the magnetoresistive element is mounted as an electronic component between the connector and the fixing member of the circuit board. Yes. In recent years, the pitch between a plurality of terminals of a signal processing IC and the width of the terminals tend to be narrower. Therefore, if the portion of the circuit board on which the signal processing IC is mounted bends, the signal processing mounted on the circuit board However, in this case, it is possible to prevent disconnection between the signal processing IC and the circuit board.

  In the present invention, for example, a variable resistor for adjusting variation in the resistance value of the magnetoresistive element is mounted as an electronic component between the connector and the fixing member of the circuit board. In this case, it is possible to prevent disconnection between the variable resistor mounted on the circuit board and the circuit board. In this case, the resonance of the portion of the circuit board where the variable resistor is mounted can be suppressed, so that the resistance value of the adjusted variable resistor is prevented from fluctuating due to the resonance of the circuit board. It becomes possible to do.

  In the present invention, for example, the magnetic sensor device includes a head portion in which the magnetoresistive element is disposed and a main body portion in which the circuit board is disposed, and the head portion is connected to the main body portion via a cable. A cable connector for connecting a cable is mounted as an electronic component between the connector and the fixing member of the circuit board. Stress is applied to the cable connector when the cable is inserted or removed. In this case, even if the stress is applied when the cable is inserted or removed, bending of the portion of the circuit board where the cable connector is mounted is suppressed. Therefore, it becomes possible to prevent disconnection between the cable connection connector mounted on the circuit board and the circuit board.

  In the present invention, the fixing member is a screw, and the screw is preferably electrically connected to the circuit board and constitutes a part of the frame ground of the circuit board. If comprised in this way, it will become possible to ensure the noise resistance of a magnetic sensor apparatus. Also, with this configuration, a part of the frame ground can be configured by a screw for fixing the circuit board. Therefore, a member for the frame ground is provided in addition to the screw for fixing the circuit board. Compared with the case where it is provided, it becomes possible to simplify the structure of a magnetic sensor apparatus.

  In the present invention, it is preferable that the fixing member is a screw, and a light emitter for indicating the state of the magnetic sensor device is mounted on the circuit board in the vicinity of the screw. If comprised in this way, it will become possible to escape the heat which generate | occur | produced with the light-emitting body via the screw | thread.

  In order to solve the above problems, a connector mechanism of the present invention includes a circuit board, a connector directly fixed to one end of the circuit board, and a housing in which the circuit board is disposed. The circuit board is fixed to the housing by a fixing member, and the circuit board has an electronic component mounted between the connector and the fixing member.

  In the connector mechanism of the present invention, the connector is directly fixed to one end of the circuit board, and is held by a housing in which the circuit board is disposed. Therefore, it is possible to integrate the part where the circuit board is arranged and the part where the connector is arranged. Therefore, in the present invention, the cost of the connector mechanism can be reduced.

  In general, since the connector is held by the housing so as not to move largely with respect to the housing, in the present invention, one end side of the circuit board is placed via the connector so as not to move greatly with respect to the housing. Is held in. In the present invention, the circuit board is fixed to the housing by the fixing member, and in this circuit board, the electronic component is mounted between the connector and the fixing member. That is, in the present invention, the electronic component is mounted between a portion of the circuit board that is held by the housing via the connector and a portion that is fixed to the housing by the fixing member. Therefore, in the present invention, even if the frequency and acceleration of vibration applied to the connector mechanism are large, it is possible to suppress the resonance of the portion of the circuit board on which the electronic component is mounted and suppress the bending of this portion. Therefore, in the present invention, it is possible to prevent disconnection between the electronic component mounted on the circuit board and the circuit board.

  In addition, by increasing the thickness of the circuit board, it is possible to suppress the bending of the part on which the electronic component of the circuit board is mounted and to prevent disconnection between the electronic component mounted on the circuit board and the circuit board. Is possible. However, for example, when the terminal is formed on the connector so as to sandwich the circuit board, the terminal is fixed on both sides of the circuit board, and the connector is a standard product conforming to a predetermined standard. In this case, the thickness of the circuit board cannot be made a predetermined thickness or more, and it becomes difficult to suppress the bending of the portion of the circuit board on which the electronic component is mounted. Further, when the thickness of the circuit board is increased, the connector mechanism may be increased in size. On the other hand, in the present invention, even if the thickness of the circuit board is not increased, the bending of the part on which the electronic component of the circuit board is mounted is suppressed, and the electronic component mounted on the circuit board and the circuit board are It becomes possible to prevent disconnection between the two.

  As described above, in the magnetic sensor device of the present invention, the cost can be reduced, and the electronic component and the circuit substrate that are mounted on the circuit board even when the frequency and acceleration of vibration applied to the magnetic sensor device are large. It is possible to prevent disconnection between the two. Further, in the connector mechanism of the present invention, it becomes possible to reduce the cost, and even if the frequency and acceleration of vibration applied to the connector mechanism are large, the disconnection between the electronic component mounted on the circuit board and the circuit board Can be prevented.

It is a one part perspective view of the magnetic sensor apparatus concerning embodiment of this invention. It is a top view of the main-body part which comprises the magnetic sensor apparatus shown in FIG. It is a top view of the state which removed the 1st housing from the main-body part shown in FIG. It is sectional drawing of the main-body part shown in FIG. It is a figure which shows the board | substrate and connector shown in FIG. 4 from an upper surface. It is a figure which shows the board | substrate and connector shown in FIG. 4 from a side surface. It is a figure which shows the board | substrate and connector shown in FIG. 4 from a lower surface.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Configuration of magnetic sensor device)
FIG. 1 is a perspective view of a part of a magnetic sensor device 1 according to an embodiment of the present invention. FIG. 2 is a plan view of the main body 6 constituting the magnetic sensor device 1 shown in FIG. FIG. 3 is a plan view showing a state in which the first casing 21 is removed from the main body 6 shown in FIG. 4 is a cross-sectional view of the main body 6 shown in FIG. FIG. 5 is a diagram showing the substrate 17 and the connector 19 shown in FIG. 4 from above. FIG. 6 is a side view of the substrate 17 and the connector 19 shown in FIG. FIG. 7 is a diagram showing the substrate 17 and the connector 19 shown in FIG. 4 from the bottom surface.

  The magnetic sensor device 1 of this embodiment is used by being mounted on a host device such as an electronic component mounting device or a machine tool, and detects the position and speed of a movable member in the mounting device or machine tool. This is a magnetic linear encoder. This magnetic sensor device 1 includes a magnetic scale 2, a head portion 4 in which a magnetoresistive element (not shown) is disposed, and a main body portion 6 (connector mechanism) connected to the head portion 4 via a cable 5 ( 2). The magnetic scale 2 is alternately magnetized with N and S poles in the length direction. In the magnetic sensor device 1, for example, a magnetic scale 2 is attached to a movable member such as a mounting device, and a head portion 4 and a main body portion 6 are attached to a fixed member such as a mounting device. In addition, a magnetoresistive element in the head unit 4 is disposed so as to face the magnetic scale 2, and by performing predetermined processing on a signal output from the magnetoresistive element, the movable side member of the mounting apparatus or the like Position and speed are detected.

  The head unit 4 includes a housing 10 in which a magnetoresistive element is disposed (accommodated). One end side of the cable 5 is drawn into the housing 10. The housing 10 is formed of a conductive metal material such as an aluminum alloy. In this embodiment, analog sine wave signals and cosine wave signals output from the magnetoresistive elements and amplified by the amplifier circuit are output from the head unit 4 to the main body unit 6.

  The main body 6 includes a substrate 17 as a circuit board for processing a signal output from the head 4 (more specifically, a magnetoresistive element), and an LED as a light emitter for indicating the state of the magnetic sensor device 1. (Light Emitting Diode) 18, a connector 19 for electrically connecting the substrate 17 to an electronic component mounting apparatus, a machine tool, or the like, and a housing 20 in which the substrate 17 and the LED 18 are disposed (accommodated) It has. In the following description of the main body 6, as shown in FIGS. 3 to 7, the three directions orthogonal to each other are defined as an X direction, a Y direction, and a Z direction. Also, the X direction is the “front-rear direction”, the Y direction is the “left-right direction”, the Z direction is the “vertical direction”, the X1 direction side is the “front” side, the X2 direction side is the “rear” side, and the Z1 direction side Is the “upper” side, and the Z2 direction side is the “lower” side.

  The housing 20 is formed of a conductive metal material such as an aluminum alloy. Moreover, the housing 20 is comprised by the 1st housing 21 and the 2nd housing 22 which can be divided | segmented to an up-down direction. The housing 20 is formed in a substantially rectangular parallelepiped shape that is flat in the vertical direction, and is formed in a hollow shape. The lower surface of the first housing 21 is opened, and the upper surface of the second housing 22 is opened. In the present embodiment, the first casing 21 and the second casing 22 are combined in the upper and lower sides and fixed to each other by screws 23 (see FIGS. 2 and 4), so that the opening of the first casing 21 and the second casing 22 The opening 20 is closed to form the housing 20.

  An opening (not shown) is formed on the lower surface of the second housing 22 so that visible light emitted from the LED 18 can be seen from the outside of the second housing 22. The opening is closed by a cover member (not shown) having visible light permeability and conductivity that transmits visible light. This cover member is, for example, a film obtained by depositing an ITO (Indium Tin Oxide) film on a transparent resin film made of PET.

  The connector 19 is, for example, a D-sub type connector, and is disposed on the front end side of the housing 20. The connector 19 is sandwiched between the front end side portion of the first housing 21 and the front end side portion of the second housing 22 in the vertical direction and is held on the front end side of the housing 20. Specifically, the connector 19 is held on the front end side of the housing 20 so as not to move greatly with respect to the housing 20. That is, the connector 19 is sandwiched between the front end side portion of the first housing 21 and the front end side portion of the second housing 22 in the vertical direction and is fixed to the front end side of the housing 20.

  The connector 19 is directly fixed to the front end side of the substrate 17. A plurality of terminals 24 are formed on the connector 19 so as to sandwich the front end side of the substrate 17 in the vertical direction. Specifically, as shown in FIG. 3, the plurality of terminals 24 arranged at predetermined intervals in the left-right direction are vertically arranged so as to sandwich the front end side of the substrate 17 in the vertical direction as shown in FIG. 4. It is formed at a predetermined interval.

  The substrate 17 is a rigid substrate made of glass epoxy resin or the like. The thickness of the substrate 17 is, for example, 1.2 mm or 1.6 mm. The connector 19 is fixed to the front end side of the substrate 17 as described above. As shown in FIGS. 4 and 6, the terminals 24 of the connector 19 are fixed by soldering to both upper and lower surfaces on the front end side of the substrate 17.

  The rear end side of the substrate 17 is fixed to the second casing 22 with a screw 25 as a fixing member. Specifically, the rear end side of the substrate 17 is fixed to the second housing 22 by two screws 25 arranged at a predetermined interval in the left-right direction. As shown in FIGS. 5 and 7, a through hole 17 a through which the screw 25 is inserted is formed so as to penetrate the substrate 17. As shown in FIG. 5, a frame ground land 17b of the substrate 17 is formed on the edge of the through hole 17a on the upper surface of the substrate 17, and the substrate 17 and the screw 25 are electrically connected. . In this embodiment, a frame ground of the substrate 17 is configured by the screw 25 and the housing 20, and electrical conduction is established between the substrate 17 and the housing 20 via the screw 25 and the land 17 b.

  Various electronic components are mounted on the substrate 17. Specifically, as shown in FIGS. 5 to 7, the above-described LED 18 is mounted on the substrate 17, and a signal output from the magnetoresistive element (more specifically, output from the head unit 4). A signal processing IC 27 for processing the amplified analog sine wave signal and cosine wave signal), a plurality of variable resistors 28 for adjusting variations in resistance values of the magnetoresistive elements, and the cable 5 on the substrate 17. A cable connection connector 29 and the like for connecting to the cable are mounted. In FIG. 3, illustration of electronic components mounted on the substrate 17 is omitted.

  As described above, the LED 18 functions to indicate the state of the magnetic sensor device 1. In the present embodiment, the state of an EEPROM (Electrically Erasable Programmable Read-Only Memory) included in the signal processing IC 27 (or mounted on the substrate 17), the detection speed (response frequency) of the magnetic sensor device 1, When all conditions of the offset voltage level of the sine wave signal and cosine wave signal output from the head unit 4 and the output level (amplitude) of the sine wave signal and cosine wave signal output from the head unit 4 are normal The LED 18 emits green visible light. On the other hand, when any one of the above four conditions is abnormal, the LED 18 emits red visible light.

  The signal processing IC 27 performs AD conversion on the analog sine wave signal and cosine wave signal input from the head unit 4, and the position and speed of a movable member such as a mounting apparatus with respect to the signal after AD conversion. Predetermined arithmetic processing or the like for detecting is performed. The variable resistor 28 includes a disk-shaped slider, and by rotating the slider, variations in the magnetoresistive elements are adjusted. A cable-side connector (not shown) that is fixed to the other end of the cable 5 is inserted and fixed to the cable connector 29. The other end side of the cable 5 is drawn into the housing 20 from the rear surface of the housing 20.

  As shown in FIG. 5, the variable resistor 28 and the cable connection connector 29 are mounted on the upper surface of the substrate 17, and as shown in FIG. 7, the LED 18 and the signal processing IC 27 are mounted on the lower surface of the substrate 17. Yes. The LED 18, the signal processing IC 27, the variable resistor 28, and the cable connection connector 29 are mounted between the connector 19 and the screw 25 on the substrate 17 in the front-rear direction. Specifically, in the front-rear direction, the signal processing IC 27 is mounted at a substantially central position of the substrate 17, and the LED 18 is mounted in front of and in the vicinity of one of the two screws 25. The device 28 is mounted in the vicinity of the LED 18, and the cable connection connector 29 is mounted in front of and in the vicinity of the other screw 25 of the two screws 25.

(Main effects of this form)
As described above, in this embodiment, the connector 19 for electrically connecting the substrate 17 to a mounting device or the like is directly fixed to the front end of the substrate 17 that processes a signal output from the magnetoresistive element. A connector 19 is held by a housing 20 in which the substrate 17 is disposed. That is, in the main body 6 of this embodiment, a substrate 17 that processes a signal output from the magnetoresistive element and a connector 19 for electrically connecting the substrate 17 to a mounting device or the like are integrated. Therefore, in this embodiment, the cost of the magnetic sensor device 1 can be reduced as compared with the case where the main body portion having the substrate 17 and the connector portion having the connector 19 are formed separately.

  In this embodiment, the connector 19 is held by the housing 20 so as not to move greatly with respect to the housing 20, and the front end side of the substrate 17 is connected via the connector 19 so as not to move with respect to the housing 20. 20 is held. In this embodiment, the rear end side of the substrate 17 is fixed to the housing 20 with screws 25, and electronic components are mounted between the connector 19 and the screws 25 on the substrate 17. Specifically, on the substrate 17, the LED 18, the signal processing IC 27, the variable resistor 28, and the cable connection connector 29 are mounted between the connector 19 and the screw 25. As described above, in this embodiment, the LED 18, the signal processing IC 27, and the variable resistor are provided between the portion of the substrate 17 held by the housing 20 via the connector 19 and the portion fixed to the housing 20 by the screw 25. 28 and a cable connecting connector 29 are mounted.

  Therefore, in this embodiment, even if the frequency and acceleration of vibration applied to the magnetic sensor device 1 are large, the resonance of the portion of the substrate 17 where the LED 18, the signal processing IC 27, the variable resistor 28, and the cable connector 29 are mounted. It is possible to suppress the bending of this portion. Therefore, in this embodiment, it is possible to prevent disconnection between the substrate 17 and the LED 18, the signal processing IC 27, the variable resistor 28, and the cable connection connector 29.

  Particularly, in recent years, the pitch between the plurality of terminals and the width of the terminals of the signal processing IC 27 tend to be narrower. Therefore, if the portion of the substrate 17 where the signal processing IC 27 is mounted is bent, the signal processing IC 27 and the substrate However, in this embodiment, it is possible to prevent the disconnection between the signal processing IC 27 and the substrate 17. In the case of the variable resistor 28, if the portion of the substrate 17 where the variable resistor 28 is mounted greatly resonates after adjusting the slider, the resistance value of the adjusted variable resistor 28 may fluctuate due to the resonance of the substrate 17. However, in this embodiment, it is possible to prevent the resistance value of the variable resistor 28 after adjustment from fluctuating due to resonance of the substrate 17. In addition, stress is applied to the cable connection connector 29 when the cable 5 is inserted / removed. In this embodiment, even if stress is applied when the cable 5 is inserted / removed, the portion of the board 17 where the cable connection connector 29 is mounted is bent. Therefore, it is possible to prevent disconnection between the cable connecting connector 29 and the substrate 17.

  In addition, by increasing the thickness of the substrate 17, it is possible to suppress the bending of the portion of the substrate 17 on which the electronic component is mounted and to prevent disconnection between the signal processing IC 27 and the like and the substrate 17. . However, in this embodiment, the terminal 24 is formed so as to sandwich the substrate 17 in the connector 19 which is a D-sub type connector, and the terminals 24 are fixed to both surfaces of the substrate 17. This cannot be done. That is, in this embodiment, it is difficult to suppress the bending of the portion of the substrate 17 where the electronic component is mounted by increasing the thickness of the substrate 17. Even if the thickness of the substrate 17 can be increased, the main body 6 becomes thicker when the thickness of the substrate 17 is increased. On the other hand, in this embodiment, even if the thickness of the substrate 17 is not increased, the bending of the portion on which the electronic component of the substrate 17 is mounted is suppressed, and the disconnection between the signal processing IC 27 and the like and the substrate 17 is performed. Can be prevented.

  In this embodiment, the screw 25 constitutes a part of the frame ground of the substrate 17. Therefore, it becomes possible to ensure the noise resistance of the magnetic sensor device 1. Further, in this embodiment, since the electrical connection between the housing 20 and the substrate 17 is taken by the screw 25 for fixing the substrate 17, in addition to the screw 25 for fixing the substrate 17, The configuration of the magnetic sensor device 1 can be simplified as compared with the case where a member for conducting the substrate 17 is provided.

  In this embodiment, the LED 18 is mounted in the vicinity of the screw 25. Therefore, the heat generated in the LED 18 can be released to the housing 20 via the screw 25.

(Other embodiments)
The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited to this, and various modifications can be made without departing from the scope of the present invention.

  In the embodiment described above, the LED 18, the signal processing IC 27, the variable resistor 28, and the cable connection connector 29 are mounted between the connector 19 and the screw 25 of the substrate 17 in the front-rear direction. In addition, for example, electronic components other than the LED 18, the signal processing IC 27, the variable resistor 28, and the cable connection connector 29 may be mounted between the connector 19 and the screw 25 of the substrate 17.

  In the embodiment described above, the rear end side of the substrate 17 is fixed to the second casing 22 by the screw 25. In addition to this, for example, the rear end side of the substrate 17 may be fixed to the second casing 22 by caulking using protrusions formed on the second casing 22. In this case, the protrusion formed on the second casing 22 serves as a fixing member for fixing the substrate 17 to the casing 20. Further, the rear end side of the substrate 17 may be fixed to the second casing 22 by bonding. In this case, the adhesive serves as a fixing member for fixing the substrate 17 to the housing 20.

  In the embodiment described above, the terminals 24 are formed on the connector 19 so as to sandwich the substrate 17, and the terminals 24 are fixed to both surfaces of the substrate 17. In addition, for example, the terminal 24 may be formed on the connector 19 so as to be in contact with one surface of the substrate 17, and the terminal 24 may be fixed to only one surface of the substrate 17.

  In the form mentioned above, the head part 4 and the main-body part 6 are formed separately. In addition, for example, the head portion 4 and the main body portion 6 may be integrally formed. That is, a magnetoresistive element may be arranged inside the housing 20 of the main body 6. In the above-described form, the substrate 17 is fixed to the housing 20 with two screws 25. However, the substrate 17 may be fixed to the housing 20 with one screw 25, or three or more. You may fix to the housing 20 with the screw | thread 25. FIG.

DESCRIPTION OF SYMBOLS 1 Magnetic sensor apparatus 4 Head part 5 Cable 6 Main part (connector mechanism)
17 Board (circuit board)
18 LED (light emitter, electronic component)
19 Connector 20 Housing 24 Terminal 25 Screw (fixing member)
27 Signal Processing IC (Electronic Components)
28 Variable resistors (electronic components)
29 Connector for cable connection (electronic component)

Claims (9)

In a magnetic sensor device comprising a magnetoresistive element,
A circuit board for processing a signal output from the magnetoresistive element, a connector for electrically connecting the circuit board to a host device to which the magnetic sensor device is attached, and a housing in which the circuit board is disposed And
The connector is directly fixed to one end of the circuit board and is held by the housing,
The circuit board is fixed to the housing by a fixing member,
In the circuit board, an electronic component is mounted between the connector and the fixing member. The connector is formed with terminals so as to sandwich the circuit board,
The magnetic sensor device according to claim 1, wherein the terminals are fixed to both surfaces of the circuit board.   Between the connector and the fixing member of the circuit board, as the electronic component, a signal processing IC for executing a predetermined arithmetic process on a signal output from the magnetoresistive element is mounted. The magnetic sensor device according to claim 1, wherein the magnetic sensor device is a magnetic sensor device.   A variable resistor for adjusting variation in resistance value of the magnetoresistive element is mounted as the electronic component between the connector and the fixing member of the circuit board. Item 4. The magnetic sensor device according to any one of Items 1 to 3. A head portion in which the magnetoresistive element is disposed; and a main body portion in which the circuit board is disposed;
The head portion is connected to the main body portion via a cable,
5. The connector for connecting a cable for connecting the cable as the electronic component is mounted between the connector and the fixing member of the circuit board. A magnetic sensor device according to claim 1. The fixing member is a screw;
6. The magnetic sensor device according to claim 1, wherein the screw is electrically connected to the circuit board and constitutes a part of a frame ground of the circuit board. The fixing member is a screw;
The magnetic sensor device according to claim 1, wherein a light emitter for indicating a state of the magnetic sensor device is mounted on the circuit board in the vicinity of the screw. A circuit board, a connector directly fixed to one end of the circuit board, and a housing in which the circuit board is disposed,
The connector is held by the housing;
The circuit board is fixed to the housing by a fixing member,
In the circuit board, an electronic component is mounted between the connector and the fixing member. The connector is formed with terminals so as to sandwich the circuit board,
The connector mechanism according to claim 8, wherein the terminals are fixed to both surfaces of the circuit board.

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