JP2013024622A - Wiring board for electronic component inspection device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board for an electronic component inspection device capable of easily arranging a plurality of pieces of surface wiring for connecting a pad for a probe with an external connection terminal to the same surface of a board body, shortening design and manufacturing periods and being easily manufactured, and a method for manufacturing the same.SOLUTION: A wiring board 1 for an electronic component inspection device includes: a board body 2 which is constituted by laminating a plurality of ceramic layers s1, s2, and has a surface 3 and a rear surface 4 whose planar views are rectangle; a plurality of pads 5 for a probe which are formed on a center side 3a on the surface 3 of the board body 2 and on which a probe 16 is mounted; a plurality of external connection terminals 6 formed on a peripheral side 3b on the surface 3 of the board body 2 and outside the plurality of pads 5 for the probe; surface wiring 7 which individually connects between the pads 5 for the probe and the external connection terminals 6, and is formed on the surface 3 of the board body 2; and pieces of internal wiring 8, 9 formed between the ceramic layers s1, s2 of the board body 2, in which the pieces of internal wiring 8, 9 are at least one of a power source wiring layer 8 and a ground wiring layer 9.

Description

  The present invention relates to a wiring board for an electronic component inspection apparatus used for inspecting the continuity of an electronic component, the availability of operation, and the like, and a manufacturing method thereof.

  A plurality of testers for connecting a tester to a peripheral portion of one surface of a printed circuit board having a relatively wide plan view in order to inspect the continuity of the electronic components to be inspected such as an IC chip and an LSI and whether the operation is possible. A contact is provided, and an electrical trace is wired inside the circuit board so that a plurality of connection parts are located at the center of the other surface of the circuit board, and one surface is electrically connected via the connection part. A probe in which a plurality of probes that contact a test point of an electronic component to be inspected are projected on the other surface of the probe head via a trace inside the connected relatively narrow probe head (circuit board) A card assembly has been proposed (see, for example, Patent Document 1).

However, in the probe card assembly using the two boards as described above, the test points differ for each electronic component to be inspected, so it is necessary to design the internal wiring (trace) layout on each board. Therefore, it takes a lot of time to design and manufacture the wiring, and it may be difficult to cope with a relatively short delivery time.
In order to solve the above problems, the probe pad for mounting the probe, the external connection pad (terminal), and the signal, power supply, and ground wiring for conducting between these pads are insulated. The formation of a surface wiring located on the same surface of a conductive substrate has also been studied. However, in this case, on the same surface of the insulating substrate, the density of the surface wiring to be wired between a plurality of sets of pads to be connected becomes excessively dense, and it is extremely difficult to arrange all the wiring on the same surface. There was a case.

JP 2008-197118 A (pages 1 to 39, FIGS. 2 and 3)

  The present invention solves the problems described in the background art, and can easily arrange a plurality of surface wirings for connecting probe pads and external connection terminals on the same surface of the substrate body, and shortens the design and manufacturing period. It is an object of the present invention to provide a wiring board for an electronic component inspection apparatus that can be manufactured easily and a manufacturing method thereof.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problem, the present invention forms a probe pad, an external connection terminal, and a surface wiring that conducts between them on the surface of a substrate body in which a plurality of ceramic layers are laminated, and a power source between the ceramic layers The idea is to form an internal wiring composed of at least one of a wiring layer and a ground wiring layer.
That is, a wiring board for an electronic component inspection apparatus according to the present invention (Claim 1) is formed by laminating a plurality of ceramic layers, and has a substrate body having a rectangular surface and a back surface in plan view, and a center on the surface of the substrate body. A plurality of probe pads which are formed on the side and on which the probe is mounted; a plurality of external connection terminals which are formed on the peripheral side of the surface of the substrate body and outside the plurality of probe pads; and the probe pad A wiring board for an electronic component inspection apparatus, comprising: a surface wiring formed on the surface of the substrate body, and an internal wiring formed between the ceramic layers of the substrate body. The internal wiring is at least one of a power wiring layer and a ground wiring layer.

  According to this, a plurality of signal wirings (layers) and the like are individually provided between the plurality of probe pads located on the center side on the surface of the substrate body and the plurality of external connection terminals located on the peripheral side. At least one of a power wiring layer and a ground wiring layer having a relatively large area in plan view is formed as an internal wiring between a plurality of ceramic layers formed as a surface wiring and constituting the substrate body. Therefore, on the same surface of the substrate body, the center side probe pad and the peripheral side external connection terminal can be easily connected by signal wiring, and one of the power wiring layer and the ground wiring layer which requires a relatively large area. Alternatively, both may be formed between a plurality of ceramic layers constituting the substrate body, and the internal wiring and the pads or terminals may be easily connected via via conductors penetrating the upper ceramic layer. it can. Therefore, excellent inspection accuracy can be achieved, design and manufacturing period can be shortened, and manufacturing can be easily performed.

The ceramic layer is made of high-temperature fired ceramic such as alumina or mullite, or glass-ceramic which is a kind of low-temperature fired ceramic. In the former case, the power wiring layer, the ground wiring layer, or these and the surface side For the via conductor for conducting between the probe pad and the external connection terminal, W or Mo is used for simultaneous firing, and in the latter case, Ag or Cu is used for simultaneous firing.
Further, the power supply wiring layer and the ground wiring layer of the internal wiring have a so-called solid shape which has a flat plate shape in a plan view, and have a flat plate shape having no gap on the inside or a very slight gap in a plan view. It is presented.
Further, one or both of a power supply wiring layer and a ground wiring layer are formed between the plurality of ceramic layers constituting the substrate body. Among these, a part of the power supply wiring layer is not limited to the internal wiring but can be formed as a part of the surface wiring.

In addition, the probe pad preferably resists positional displacement due to the attachment of the probe mounted on the upper surface of the pad, and thus preferably has a form in which the plan view is a circle or a regular polygon having a square shape or more.
Further, the external connection terminal easily absorbs a positional deviation when a bonding wire disposed between the relay board on which the wiring board is to be mounted or the connection terminal on the mother board side is attached. It is desirable that the planar view in which the long sides or the long diameters are parallel to the direction along the arrangement direction of the above has a rectangular shape, an oval shape, or an elliptical shape.
In addition, the signal wiring (layer) or the power wiring layer is mainly used as the surface wiring for connecting between the probe pad and the external connection terminal. In order to reduce the electrical resistance, the pad and the connection terminal It is desirable to have the same line width as the width (diameter).

Further, in the present invention, the substrate body is formed by laminating three or more ceramic layers, and at least one of the power wiring layer and the ground wiring layer is formed for each of the plurality of ceramic layers. A wiring board for an inspection apparatus (Claim 2) is also included.
According to this, since one or both of the power supply wiring layer and the ground wiring layer are formed for each of the plurality of ceramic layers, the plurality of probe pads positioned on the center side on the surface of the substrate body, and the peripheral side For example, it is possible to reliably form all the surface wirings as a plurality of signal wirings between the plurality of external connection terminals located at the same position.
One or both of the power supply wiring layer and the ground wiring layer are formed for every two or more ceramic layers formed by laminating the three or more ceramic layers. However, a part of the power supply wiring layer can be formed as a part of the surface wiring.

  On the other hand, a method for manufacturing a wiring board for an electronic component inspection apparatus according to the present invention (claim 3) is a method for manufacturing the surface of a plurality of green sheets that become two or more ceramic layers of the uppermost layer, the middle layer, or the lowermost layer. A step of printing a conductive paste on the back surface to form an unfired wiring layer, a step of laminating and pressing the plurality of green sheets to form a green sheet laminate, and firing the green sheet laminate Forming a ceramic laminate, and on the surface of each of the plurality of substrate bodies included in the ceramic laminate, a plurality of probe pads on the center side of the surface and on which the probe is mounted are arranged around the surface. A plurality of external connection terminals on the side and outside the plurality of probe pads, and a plurality of tables individually connecting the probe pads and the external connection terminals A method of manufacturing a wiring board for an electronic component inspection apparatus, comprising the steps of forming wirings, wherein the wiring layer is formed as at least one of a power wiring layer and a ground wiring layer. To do.

According to this, a green sheet obtained by forming one or both of an unfired power wiring layer and a ground wiring layer having a flat or solid shape between a plurality of green sheets, and laminating the plurality of green sheets. A ceramic laminate is obtained by firing the laminate together with the wiring layers. Furthermore, on the surface of the ceramic laminate, it is possible to easily and accurately form a center side probe pad, a peripheral side external connection terminal, and a surface wiring mainly connecting a signal wiring between them. Become.
The green sheet is formed into a sheet shape by blending a required amount of a binder resin, a solvent, or the like with a high-temperature fired ceramic powder such as alumina or mullite, or a low-temperature fired ceramic containing a glass component and ceramic powder. It is.
Also, at the same time as or before the step of forming the unfired wiring layer, a step of forming a via conductor by filling a via hole previously opened in the upper green sheet with a conductive paste is performed. Is called.
Further, the probe pad, the external connection terminal, and the surface wiring are formed by performing, for example, sputtering, a photolithography technique, and electrolytic metal plating on the surface of the ceramic laminate after the firing step.

Furthermore, the present invention includes a method for manufacturing a wiring board for an electronic component inspection apparatus (Claim 4) in which a step of dividing the plurality of substrate bodies into individual pieces is performed after each step.
According to this, it is possible to efficiently manufacture the wiring board for an electronic component inspection apparatus as described above in a multi-cavity form, and it is also possible to shorten the delivery time.
Note that divided grooves having a V-shaped cross section may be formed in a lattice shape in a plan view around the areas to be the individual wiring boards in the plurality of green sheets.

The top view which shows the wiring board for electronic component inspection apparatuses of one form by this invention. The typical vertical sectional view of the said wiring board for electronic component inspection apparatuses. The expanded sectional view of the surface wiring vicinity in the surface of the board | substrate body of the said wiring board. FIG. 3 is a horizontal sectional view including a power supply wiring layer taken along the line XX in FIG. 2. The horizontal sectional view which shows the power wiring layer of the same position and a different form as FIG. The horizontal sectional view which shows the ground wiring layer in the same position as FIG. FIG. 3 is a vertical sectional view showing a state where the wiring board is mounted on a relay board. The vertical sectional view which shows the state which mounted the said wiring board in a different relay board | substrate. The typical vertical sectional view which shows the wiring board which is an application form of the said wiring board. FIG. 5 is a schematic cross-sectional view showing one manufacturing process for obtaining the wiring board. FIG. 11 is a schematic cross-sectional view illustrating a manufacturing process subsequent to FIG. 10. FIG. 12 is a schematic cross-sectional view illustrating a manufacturing process subsequent to FIG. 11. FIG. 13 is a schematic cross-sectional view showing a manufacturing process following FIG. 12. FIG. 14 is a schematic enlarged cross-sectional view showing a manufacturing process following FIG. 13. FIG. 15 is a schematic enlarged cross-sectional view illustrating a manufacturing process subsequent to FIG. 14. FIG. 16 is a schematic enlarged cross-sectional view illustrating a manufacturing process subsequent to FIG. 15. FIG. 17 is a schematic enlarged cross-sectional view illustrating a manufacturing process subsequent to FIG. 16. FIG. 18 is a schematic enlarged cross-sectional view illustrating a manufacturing process subsequent to FIG. 17. FIG. 19 is a schematic enlarged cross-sectional view illustrating a manufacturing process subsequent to FIG. 18. The vertical sectional view which shows the wiring board for multi-cavity obtained by the above process.

Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a plan view showing an electronic component inspection apparatus wiring board (hereinafter simply referred to as a wiring board) 1 according to an embodiment of the present invention, and FIG. 2 is a schematic vertical sectional view of the wiring board 1.
As shown in FIGS. 1 and 2, the wiring substrate 1 is formed by laminating upper and lower ceramic layers s <b> 1 and s <b> 2, and has a front surface 3 and a rear surface 4 that are square (rectangular) in plan view. 2, a plurality of probe pads 5 that are formed on the center side 3 a of the surface 3 of the substrate body 2, and the probe is mounted on the upper surface, and each of the probes on the peripheral side 3 b of the surface 3 of the substrate body 2. A plurality of external connection terminals 6 formed on the outer side of the pad 5, a surface wiring 7 individually connected between the connection terminal 6 and the pad 5 and formed on the surface 3, and the ceramic layer s 1. , S2 and internal wirings 8 and 9 are provided.
The thick broken lines in FIG. 1 indicate the positions of the internal wirings 8 and 9 that are electrically connected between the pad 5 and the connection terminal 6 that are not connected to the surface wiring 7 and independent.

The center side 3a and the peripheral side 3b on the surface 3 of the substrate body 2 indicate relative positions that do not overlap each other and have a space where the surface wiring 7 can be wired therebetween.
The ceramic layers s1 and s2 are, for example, high-temperature fired ceramics containing alumina or mullite. Between these, the ceramic layers s1 and s2 are made of W or Mo fired at the same time, and have a substantially solid or flat shape in plan view. At least one of the power supply wiring layer 8 and the ground wiring layer 9 is formed. Among them, the upper ceramic layer s1 has via conductors va for individually connecting the wiring layers 8 and 9 and a part of independent probe pads 5 or a part of independent external connection terminals 6. , Vb penetrates.
Further, as shown in FIG. 1, the probe pad 5, the external connection terminal 6, and the surface wiring 7 connected between them have the same width or diameter in plan view, and are an enlarged vertical sectional view of FIG. 3. As shown in FIG. 1, the Ti thin film layer 10, the Cu thin film layer 11, and the Cu plating layer 12 that are sequentially formed on the surface 3 of the substrate body 2, and the Ni plating film 13 and the gold plating film that are sequentially coated on the entire outer periphery thereof. 14 and.

As shown in FIGS. 1 and 2, some probe pads 5 and some external connection terminals 6 formed independently on the center side 3 a and the peripheral side 3 b on the surface 3 of the substrate body 2 are: Power supply wiring between the ceramic layers s1 and s2 and the via conductors va and vb penetrating the ceramic layer s1 so as not to intersect the surface wiring 7 connecting the remaining probe pads 5 and the remaining connection terminals 6 with the surface 3. It is possible to conduct through a detour path including at least one of the layer and the ground wiring layer 9.
For example, as shown in FIG. 4, the power wiring layer 8 is divided into four locations by two diagonal lines between the ceramic layers s1 and s2, and the plan view spans between the central side 3a and the peripheral side 3b. Consists of a power wiring layer 8a having a substantially right triangle. One via conductor va connected to the probe pad 5 is in contact with the central side 3a of the power supply wiring layer 8a, and two via conductors vb connected to the external connection terminal 6 are provided on the peripheral side 3b. In contact.

Further, for example, as shown in FIG. 5, the power supply wiring layer 8 is divided into six portions by one horizontal line and two vertical lines between the ceramics s1 and s2, and the center side 3a and the peripheral side 3b. Rectangular power supply wiring layers 8b and 8c having different sizes in plan view extending between the two may be used. One via conductor va connected to the probe pad 5 is in contact with the central side 3a of the power supply wiring layers 8b and 8c, and one via conductor connected to the external connection terminal 6 is connected to the peripheral side 3b. vb is in contact.
Further, for example, as shown in FIG. 6, the power wiring layer 9 has a single form extending almost over the entire surface between the ceramics s <b> 1 and s <b> 2 and having a substantially square shape in plan view. A plurality of via conductors va connected to the independent probe pads 5 shown in FIG. 1 are connected, and the peripheral side 3b of the power supply wiring layer 9 is connected to the independent external connection terminals 6 shown in FIG. A plurality of via conductors vb are connected.

FIG. 7 is a vertical sectional view showing a state in which the wiring board 1 is mounted above the surface 23 of the board body 22 in the relay board 20.
As shown in FIG. 7, the relay substrate 20 is made of, for example, a high-temperature fired ceramic (insulating material) such as alumina, and has a substrate body 22 having a front surface 23 and a rear surface 24 that are substantially square in plan view, and the substrate body 22. A plurality of via conductors 25 formed in each of a plurality of via holes penetrating between the front surface 23 and the back surface 24 at substantially equal intervals, and a plurality of connections connected to end portions on the front surface 23 side of the respective via conductors 25. A terminal 26 and a plurality of external terminals 27 connected to the end of the via conductor 25 on the back surface 24 side and used for electrical continuity are provided.
The via conductor 25, the connection terminal 26, and the external terminal 27 are mainly made of W or Mo when the substrate body 22 is made of alumina or the like, and the substrate body 22 is a kind of low-temperature fired ceramic (insulating material). In the case of glass-ceramic, it is made of Cu or Ag.

As shown in FIG. 7, for each of the probe pads 5 on the wiring board 1, for example, for making electrical contact with a plurality of electronic components to be inspected (all not shown) provided on the Si wafer. The probe 16 is installed upright. Further, the wiring substrate 1 is mounted on the front surface 23 of the relay substrate 20 by adhering the back surface 4 side of the wiring substrate 1 to the central portion of the front surface 23 of the relay substrate 20 via the adhesive 18. Furthermore, the probe 16 and the external terminal 27 are connected by individually connecting the connection terminals 26 located on the periphery of the surface 23 of the relay board 20 and the external connection terminals 6 of the wiring board 1 via bonding wires w. Can be conducted individually. As a result, it is possible to continuously inspect a plurality of electronic components to be inspected.
In addition, since the said relay board | substrate 20 is a general form, the existing thing can be diverted.

FIG. 8 is a vertical sectional view showing a state in which the wiring board 1 is mounted on the surface 23 side of the relay board 21 having a different form. As shown in FIG. 8, the relay substrate 21 includes a substrate body 22 a similar to the above, a plurality of via conductors 25 penetrating only the peripheral sides of the front surface 23 and the back surface 24 of the substrate body 22 a, and each via conductor 25. A connection terminal 26 on the front surface 23 side and an external terminal 27 on the back surface 24 side which are individually connected to both ends, and a concave portion 23a having a rectangular shape in a plan view opening upward at the center of the front surface 23.
As shown in FIG. 5, by inserting the back surface 4 side of the wiring board 1 into the recess 23a of the relay board 21, the wiring board 1 is mounted on the front surface 23 side of the relay board 21, and then the probe is used in the same manner as described above. The probe 16 is erected above each of the pads 5 and the connection terminals 26 on the surface 23 side of the relay board 21 and the external connection terminals 6 of the wiring board 1 are individually connected by bonding wires w. Thus, the probe 16 and the external terminal 27 can be individually conducted. As a result, it is possible to continuously inspect a plurality of electronic components to be inspected.
Only the relay substrate 21 may be manufactured in advance.

FIG. 9 is a vertical cross-sectional view showing a wiring board 1 a which is an application form of the wiring board 1. The wiring board 1a is formed by laminating upper and lower three (several) ceramic layers s1 to s3, a substrate body 2 having the same front surface 3 and rear surface 4, and a probe body formed on the front surface 3 in the same manner as described above. Via conductor va penetrating through the pad 5, the surface wiring 7, the external connection terminal 6, the internal wiring layers 8 and 9 formed between the ceramic layers s1 to s3, and the upper and middle ceramic layers s2 and s3. , Vb. The internal wiring layers 8 and 9 are one or both of the same power supply wiring layers 8a to 8c and the solid ground wiring layer 9 as described above.
According to the wiring board 1a as described above, since a relatively large number of power wiring layers 8 and ground wiring layers 9 are formed between the ceramic layers s1 to s3, the center side 3a on the surface 3 of the substrate body 2 is formed. For example, it is possible to reliably form all the surface wirings 7 as a plurality of signal wirings between the probe pad 5 located on the peripheral side and the external connection terminals 6 located on the peripheral side 3b.

According to the wiring boards 1 and 1a as described above, a plurality of probe pads 5 are formed on the center side 3a of the surface 3 of the substrate body 2, and a plurality of external connection terminals are provided on the peripheral side 3b of the same surface 3. 6 is formed. Therefore, surface wiring 7 for connecting between the probe pad 5 and the external connection terminal 6 is formed at a relatively high density only on the surface 3 of the substrate body 2, and intersects the surface wiring 7 and the surface 3. Only a part of the independent probe pads 5 and a part of the external connection terminals 6 independent of each other are electrically connected via the via conductors va and vb and the power supply wiring layer 8 or the ground wiring layer 9. . As a result, in the wiring boards 1 and 1a, the internal wirings 8 and 9 can be reduced to the minimum and can be dealt with mainly by the surface wiring 7 formed on the surface 3, so that the inspection circuit is designed and manufactured according to each electronic component to be inspected. Can be shortened.
Therefore, the required inspection required for each electronic component can be performed accurately and quickly, can be designed in a short time, and can be easily manufactured, and the wiring boards 1 and 1a for the electronic component inspection apparatus can be provided reliably. It becomes possible to do.

Below, the manufacturing method of the said wiring board 1 is demonstrated.
Preliminary amounts of resin binder and solvent are mixed with alumina powder to make a ceramic slurry, and the ceramic slurry is made into a sheet by the doctor blade method to produce two upper and lower green sheets g1 and g2 as shown in FIG. did. In addition, the dashed-dotted line shown in FIG. 10 is a virtual cutting plan surface cf having a lattice shape in plan view, the product area pa is located between these, and the ear part ma is located outside these. .
Next, a predetermined position of the upper green sheet g2 is punched out, and the obtained via hole h is filled with a conductive paste containing W or Mo powder. As shown in FIG. 11, unfired via conductors va, In addition to forming vb, a conductive paste similar to the above was disposed by printing at a predetermined position on the surface of the green sheet g1 on the lower layer side to form unfired internal wiring layers 8 and 9. Among these, the internal wiring layer 8 is one of the power supply wiring layers 8a to 8c. As shown in FIG. 11, each product area pa corresponds to the substrate body 2.

Next, as indicated by the white arrows in FIG. 11, two upper and lower green sheets g1 and g2 having the via conductors va and vb and the internal wiring layers 8 and 9 are laminated and pressure-bonded along the thickness direction. did. As a result, as shown in FIG. 12, a green sheet laminate gs having green sheets g1 and g2, internal wiring layers 8 and 9, and via conductors va and vb and having a front surface 3 and a back surface 4 was obtained. At this time, a dividing groove (not shown) having a V-shaped cross section may be further formed along at least one of the planned cutting surface cf exposed on the front surface 3 and the back surface 4.
Further, the green sheet laminate gs was fired at a predetermined firing temperature. As a result, as shown in FIG. 13, the green layers g1 and g2 are fired and integrated ceramic layers s1 and s2, the internal wiring layers 8 and 9 fired at the same time, and the via conductors va and vb. A ceramic laminate ss having a front surface 3 and a back surface 4 was obtained.
Next, as shown in FIG. 14, the entire surface 3 of the substrate body 2 corresponding to the product area pa in the ceramic laminate ss is sputtered to form a Ti thin film layer 10 having a thickness of about 0.2 μm. And a Cu thin film layer 11 having a thickness of about 0.5 μm were sequentially coated.

Next, after a resist layer r made of a photosensitive resin was formed on the entire surface of the Cu thin film layer 11, a photolithography technique with a predetermined pattern was applied to the resist layer r. As a result, as shown in FIG. 15, a plurality of through holes H having a circular shape in plan view were formed in the resist layer r above the via conductors va and vb.
Further, as shown in FIG. 16, electrolytic Cu plating was performed on the Cu thin film layer 11 exposed on the bottom surface in each of the upper through holes H to form a Cu plating layer 12 having a thickness of about 10 μm. At this time, a Ni plating layer (not shown) having a required thickness may be further formed on the Cu plating layer 12 by electrolytic Ni plating. Thereafter, as shown in FIG. 17, the resist layer r was removed from the Cu plating layer 12 by contacting with the developer.
Subsequently, as shown in FIG. 18, the portions of the Ti thin film layer 10 and the Cu thin film layer 11 that are not covered with the Cu plating layer 12 were removed by contact with an etching solution. As a result, three layers of the Ti thin film layer 10, the Cu thin film layer 11, and the Cu plating layer 12 were formed in a cylindrical shape immediately above the via conductors va and vb exposed on the surface 3 of the ceramic laminate ss. .

Then, electrolytic Ni plating and electrolytic Au plating were sequentially performed on the entire surface of the three-layered cylinder including the Ti thin film layer 10, the Cu thin film layer 11, and the Cu plating layer 12. As a result, as shown in FIG. 19, the Ni plating film 13 having a thickness of about 5 μm and the Au plating film 14 having a thickness of about 2 μm are almost uniformly coated, and the central side 3a and the peripheral side 3b on the surface 3 are An independent probe pad 5 and external connection terminal 6 were formed at each predetermined position.
During this period, the probe pad 5 having the same cross-sectional structure as that shown in FIG. 3 and the external connection terminal are formed by the same sputtering, photolithography technique, electrolytic metal plating, and etching including contact with the developer. 6 and surface wiring 7 connecting them were formed in parallel at predetermined positions.

As a result, as shown in FIG. 20, a multi-piece wiring board 1u having a plurality of wiring boards 1 adjacent to each other and having an ear portion ma around them can be obtained. Finally, along the planned cutting line cf indicated by a one-dot chain line, a process of dividing the circuit board 1 into individual pieces was performed. As a result, it was possible to easily obtain a plurality of wiring boards 1 shown in FIGS.
According to the method for manufacturing the wiring substrate 1 as described above, at least one of the unfired power wiring layer 8 and the ground wiring layer 9 having a flat or solid shape is formed between the green sheets g1 and g2, and the green sheet is formed. A ceramic laminate ss was obtained by firing the green sheet laminate gs obtained by laminating g1 and g2 together with the wiring layers 8 and 9 at the same time. Further, on the surface 3 of the ceramic laminate ss, the probe pad 5 on the central side 3a, the external connection terminal 6 on the peripheral side 3b, and the surface wiring 7 mainly connecting the signal wiring are formed with high accuracy. Thus, the plurality of wiring substrates 1 could be easily manufactured. The wiring board 1a can also be manufactured by performing the above-described steps.

The present invention is not limited to the embodiments described above.
For example, the ceramic layers s1 to s3 may be made of glass-ceramic which is a kind of low-temperature fired ceramic.
Further, the front surface 3 and the back surface 4 of the substrate body 2 of the wiring substrates 1 and 1a may have a rectangular shape in plan view.
Further, the substrate body 2 may be a laminate of four or five ceramic layers.
Further, the surface wiring 7 is not limited to a signal but a part thereof may be used for a power source.
Further, the external connection terminals 6 of the wiring boards 1 and 1a and the first terminals 26 on the side of the relay boards 20 and 21 may be made conductive through connectors instead of the bonding wires w.
In addition, the wiring boards 1 and 1a may be manufactured not by the multi-cavity form as described above but by an individual manufacturing method.

  According to the present invention, an electronic component inspection apparatus that can easily arrange a plurality of surface wirings for connecting probe pads and external connection terminals on the same surface of the substrate body, can reduce the design and manufacturing period, and can be easily manufactured. It is possible to provide a wiring board for manufacturing and a manufacturing method thereof.

1,1a ………… Wiring board (wiring board for electronic component inspection equipment)
2 ………………… Board body 3 …………………… Front side 3a ……………… Center side 3b ……………… Peripheral side 4 ………………… Back side 5 ……… ………… Pad pad 6 …………… External connection terminal 7 ………………… Surface wiring 8, 8a to 8c… Internal wiring / power supply wiring layer 9 ………………… Internal wiring / Ground wiring layer 16 ……………… Probe s1 to s3 ……… Ceramic layer g1, g2 ……… Green sheet gs ……………… Green sheet laminate ss ……………… Ceramic laminate

Claims (4)

A substrate body that is formed by laminating a plurality of ceramic layers and has a front surface and a back surface that are rectangular in plan view;
A plurality of probe pads formed on the center side of the surface of the substrate body and mounted with probes;
A plurality of external connection terminals formed on the peripheral side of the surface of the substrate body and outside the plurality of probe pads;
An electronic component inspection apparatus including a surface wiring individually connected between the probe pad and the external connection terminal and formed on the surface of the substrate body, and an internal wiring formed between the ceramic layers of the substrate body Wiring board for
The internal wiring is at least one of a power wiring layer and a ground wiring layer,
A wiring board for an electronic component inspection apparatus. The substrate body is formed by laminating three or more ceramic layers, and at least one of the power wiring layer and the ground wiring layer is formed for each of the plurality of ceramic layers.
The wiring board for an electronic component inspection apparatus according to claim 1. A step of forming an unfired wiring layer by printing a conductive paste on the front surface or back surface of a plurality of green sheets to be two or more ceramic layers of the uppermost layer, the middle layer, or the lowermost layer,
Laminating the plurality of green sheets and pressing to form a green sheet laminate;
Firing the green sheet laminate to form a ceramic laminate;
On the surface of each of the plurality of substrate bodies included in the ceramic laminate, a plurality of probe pads on the center side of the surface and on which the probes are mounted are arranged on the peripheral side of the surface and outside the plurality of probe pads. Forming a plurality of external connection terminals and a plurality of surface wirings for individually connecting the probe pads and the external connection terminals, respectively, with a method of manufacturing a wiring board for an electronic component inspection apparatus There,
The wiring layer is formed as at least one of a power wiring layer and a ground wiring layer.
A method of manufacturing a wiring board for an electronic component inspection apparatus. After each step, a step of dividing the plurality of substrate bodies into individual pieces is performed.
The method for manufacturing a wiring board for an electronic component inspection apparatus according to claim 3.

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