JP2013020530A - Touch sensor panel member, display device with touch sensor panel member, and method of manufacturing touch sensor panel member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve insulation performance between electrodes and reduce cost in manufacture.SOLUTION: A touch sensor panel member comprises a first transparent electrode 4 formed directly on a transparent substrate 2, a second transparent electrode 5 formed in a direction orthogonal to the first transparent electrode 4 directly or indirectly on the transparent substrate 2, and an insulator layer to electrically insulate between the first transparent electrode 4 and the second transparent electrode 5, in which the insulator layer comprises a first insulator layer 6, and a second insulator layer 7 laminated on the first insulator layer 6; the first insulator layer 6 and the second insulator layer 7 are formed of photosensitive siloxane resin; and the first insulator layer 6 is thicker than the second insulator layer 7.

Description

  The present invention relates to a touch sensor panel member, a display device including the touch sensor panel member, and a method for manufacturing the touch sensor panel member.

  The touch sensor panel attracts attention as an input device that combines a display device and a coordinate detection device. Touch sensor panels are often used in small electronic devices that require more information input in a limited space, such as mobile phones, portable music players, portable game machines, vending machines, and ATMs. The function of the key can be changed according to the location touched with a finger or a pen. The touch sensor panel can be directly touched and input with a finger or the like while viewing an image displayed on the display screen, and more intuitive operations can be performed recently. Not only that, it is also used in personal computer screens, and its use tends to expand.

  Touch sensor panel members constituting the touch sensor panel are classified according to a sensing method into a resistance film method, a capacitance method, an infrared method, an ultrasonic method, an electromagnetic inductive coupling method, and the like. These touch sensor panel members have merits and demerits for each method, and suitable ones are appropriately used according to the application to be used.

  Of these, a resistive film type touch sensor panel member generally has a pair of transparent electrodes arranged with an insulating layer sandwiched therebetween, and changes in resistance value when the transparent electrodes come into contact with each other and become conductive. The position where the finger or the like touched from the outside can be detected based on the change in the voltage applied to each electrode. Various researches have been made on resistive film type touch sensor panel members. For example, a gel-type siloxane resin is used as an insulating layer, and dot spacers are omitted (Patent Document 1), or an insulating resin material. An insulating layer is formed by applying (Patent Document 2).

  In recent years, capacitive touch sensor panel members have received particular attention because of their high transmittance and durability compared to other methods, as well as the ability to perform multipoint detection and complex operations. Yes. Generally, a capacitive touch sensor panel member has a patterned first transparent electrode and a second transparent electrode stacked via an insulating layer, and an external conductor such as a fingertip is in contact therewith. The position is detected by detecting a change in capacitance at the position (for example, Patent Document 3). In the case of a capacitance type touch sensor panel member, a substrate in which the first transparent electrode is patterned and a substrate in which the second transparent electrode is patterned are stacked, or on one substrate. There are a plurality of modes of lamination, such as a single transparent electrode layer that forms the first transparent electrode and the second transparent electrode is patterned, and a surface protective layer is further laminated on the upper surface thereof.

  The touch sensor panel member configured in this manner is finally attached to a display device such as an organic EL display device, and a display device including the touch sensor panel member is configured. In recent years, reduction in thickness and weight of display devices has been a continuing issue. In order to solve this problem, various attempts such as integrating the touch sensor panel function with a cover glass installed for the purpose of preventing air from entering the organic EL display device have been made in order to reduce the thickness of the entire display device. It has been broken.

JP-A-2-12517 JP-A-11-224157 JP 2007-47990 A

  In recent years, especially in the technical field of mobile type terminals, the use of touch sensor panel members tends to expand, and research for mounting touch sensor panel members on display devices using organic EL has been conducted. Generally, in an organic EL display device using a touch sensor panel member, an insulating layer in the touch sensor panel member is installed on the light emitting side of the organic EL display substrate in order to integrate the organic EL display device and the touch sensor panel member. And it is comprised combining so that the transparent substrate of a touch sensor panel member may become a cover glass of an organic electroluminescence display. However, when configured in this manner, degassing occurs from the touch sensor panel member side to the light emitting layer side, which may reduce the electrical reliability of the organic EL display device. In order to prevent the occurrence of this degassing, before the touch sensor panel member is installed on the organic EL display substrate, a heat treatment is performed in advance at a high temperature of 400 ° C. or higher to forcibly reduce the molecular weight from the touch sensor panel member. It is desirable to perform a process for removing impurity components.

  In addition, when a touch sensor panel member is mounted on an organic EL display device, it is necessary to perform a process called glass sealing. The glass sealing operation is generally performed by using a touch sensor panel member heated at a high temperature of about 420 ° C. in order to dissolve the low melting point glass previously applied to the surface in contact with the organic EL display device. The outer peripheral portion of the surface in contact with the surface is heated by a YAG laser or the like and laminated on the surface of the organic EL display device which is locally dissolved. Between the touch sensor panel member bonded in this way and the organic EL display device, the periphery is sealed with glass, and external air can be prevented from flowing in from the outside of the touch sensor panel member.

  However, the heat resistance of an insulating layer formed of an unspecified resin material, an insulating resin material, or a photosensitive material as described in Patent Documents 1 and 2 is about 230 ° C., and is 400 ° C. or higher. Since it cannot withstand the heat treatment, the heat treatment for preventing degassing described above could not be performed.

  Therefore, an insulating film made of silicon-based SOG (Spin On Glass) that is generally used in the technical field of semiconductors different from the technical field of touch sensor panel members is used. Silicon-based SOG is an insulating film that has high heat resistance and can withstand heat treatment at 400 ° C. or higher. However, the semiconductor technical field and the touch sensor panel member technical field are completely different from each other in terms of the harshness of the usage environment and the required precision, and the technical background is different. Cannot be directly applied to the technical field of touch sensor panel members, and a new insulating film must be formed from a different material.

  Silicon-based SOG itself does not have a patterning function. Therefore, in order to form a patterning layer using a silicon-based SOG material, first, after depositing the silicon-based SOG material on the entire surface, a positive photosensitive material is laminated on a desired region on the upper surface, and photolithography is performed. It is necessary to pattern by the method and then remove unnecessary portions by wet etching with an acid solvent such as hydrofluoric acid. After the etching is completed, the patterning is completed by removing the unnecessary positive photosensitive material. As described above, when a silicon-based SOG material is used, it is necessary to make a positive photosensitive material, and it is necessary to perform wet etching using an acid solvent that is difficult to handle. Conventionally, the manufacturing process is complicated as compared with the photosensitive material used in the touch sensor panel member, and there is a big problem in productivity.

  In addition, when an acid solvent is used in wet etching, the acid solvent comes into contact with the transparent electrode layer located on the lower surface of the insulating layer or surface protective layer to be formed, and thereby a part of the transparent electrode is roughened. There was also a risk that the electrical reliability would decrease. Although it is possible to adopt dry etching by vapor phase instead of the wet etching described above, in this case, a vacuum process is required, which may not be easily performed with conventional equipment. there were.

  In addition, in the capacitance type touch sensor panel member, in order to ensure the capacitance between the first transparent electrode and the second transparent electrode, it is necessary to ensure insulation between these electrodes. Needed. However, in the case of the touch sensor panel member described in Patent Documents 1 and 2 described above, since it is a resistance film type on the premise that the electrodes are electrically connected to each other by external contact, high insulation between the electrodes is required. There was a problem that sex could not be secured.

  The present invention has been made in view of such problems, and improves the insulation resistance between electrodes and the heat resistance during heat treatment, and can reduce the manufacturing cost, It is an object of the present invention to provide a display device in which the touch sensor panel member is integrated and a method for manufacturing the touch sensor panel member.

The present invention
(1) a first transparent electrode directly formed on a transparent substrate, a second transparent electrode formed directly or indirectly on the transparent substrate in a direction orthogonal to the first transparent electrode, and An insulating layer that electrically insulates the first transparent electrode and the second transparent electrode, and the insulating layer includes a first insulating layer and a second layer stacked on the first insulating layer. The first insulating layer and the second insulating layer are made of a photosensitive siloxane resin, and the thickness of the first insulating layer is thicker than that of the second insulating layer. A touch sensor panel member, wherein the touch sensor panel member is formed to be
(2) The second transparent electrode is formed directly on the transparent substrate, and one of the first transparent electrode and the second transparent electrode has a bridge electrode straddling the other transparent electrode. The touch sensor panel member according to (1), wherein a portion of the bridge electrode that intersects with the other transparent electrode is located on the first insulating layer.
(3) The touch sensor panel member according to (1), wherein the second transparent electrode is formed on the first insulating layer.
(4) The organic EL according to any one of (1) to (3), wherein the first insulating layer and the second insulating layer have a withstand voltage performance of at least 2.5 MV / cm. Touch sensor panel member,
(5) A display device in which the touch sensor panel member according to any one of (1) to (4) is combined, wherein the touch sensor panel member includes a transparent substrate of the touch sensor panel. A display device characterized by being combined to be a substrate of
(6) A method of manufacturing a touch sensor panel member for detecting a position where an object is in contact with a first transparent electrode and a second transparent electrode, wherein at least the first transparent electrode is directly formed on a transparent substrate, and photosensitive A first insulating layer formed of a photosensitive siloxane resin, and a second insulating layer formed of the photosensitive siloxane resin, wherein the first insulating layer is thicker than the second insulating layer. A method of manufacturing a touch sensor panel member, characterized in that the touch sensor panel member is formed with a thickness such that the thickness increases.
(7) The method for manufacturing a touch sensor panel member according to (6), wherein the second transparent electrode is formed on the first insulating layer.
(8) After the second transparent electrode is formed on the transparent substrate together with the first transparent electrode and the first insulating layer is formed, either the first transparent electrode or the second transparent electrode is formed. The method for manufacturing a touch sensor panel member according to the above (6), wherein a bridge electrode straddling the other transparent electrode is connected to one of the two,
Is the gist.

  According to the touch sensor panel member of the present invention, since the photosensitive siloxane resin is used for the insulating layer, it is possible to form an insulating layer exhibiting heat resistance that can withstand a high temperature of 400 ° C. to 500 ° C. Therefore, the insulating layer is not damaged even when a process of heating at a high temperature of about 400 ° C. to 500 ° C. is performed during or after the manufacture of the touch sensor panel member. According to the touch sensor panel member of the present invention, the insulating layer is composed of the first insulating layer and the second insulating layer, and the first insulating layer is thicker than the second insulating layer. Since it forms so that the space | interval of a 1st transparent electrode and a 2nd transparent electrode can be enlarged, the insulation between these 1st transparent electrodes and 2nd transparent electrodes is ensured. And good electrical reliability can be maintained.

  Further, according to the method for manufacturing a touch sensor panel member according to the present invention, when forming an insulating layer using a photosensitive siloxane resin, it is formed with the same manufacturing equipment as when using a conventional photosensitive resin material. Since it is possible, the manufacturing process can be greatly reduced as compared with the conventional case, and the manufacturing cost can be greatly reduced. Further, since wet etching with an acid solvent is unnecessary as in the case of using silicon-based SOG, the transparent electrode layer is not roughened with an acid solvent, and better electrical reliability can be maintained. .

It is a schematic sectional drawing of the touch sensor panel member laminated | stacked by the 1st lamination | stacking aspect of this invention. It is a top view which shows the 1st lamination | stacking aspect of a 1st transparent electrode, a 2nd transparent electrode, and an insulating layer. It is a schematic sectional drawing of the touch sensor panel member laminated | stacked on the 2nd lamination | stacking aspect. It is a top view which shows the 2nd lamination | stacking aspect of a 1st transparent electrode, a 2nd transparent electrode, and an insulating layer. It is a top view which shows the 3rd lamination | stacking aspect of a 1st transparent electrode, a 2nd transparent electrode, and an insulating layer. It is a schematic sectional drawing which shows the one aspect | mode of the organic electroluminescence display of this invention of a touch sensor panel member integrated type. It is explanatory drawing for demonstrating the manufacturing method of a touch sensor panel member. It is explanatory drawing for demonstrating the manufacturing method of a touch sensor panel member.

  Below, the structure of the touch sensor panel member of this invention and the organic EL display device of a touch sensor panel member integrated type is demonstrated using drawing.

  The touch sensor panel member of the present invention can be desirably used as a capacitive touch sensor panel member.

[Touch sensor panel members]
(Embodiment 1)
FIG. 1 is a schematic cross-sectional view of a touch sensor panel member showing an embodiment of the present invention when cut in a direction substantially perpendicular to a transparent substrate. In this specification, the “object contact” state includes not only a state in which the object is in direct contact but also a state in which the object is close enough to allow the touch sensor panel member to detect that the object is in contact. Shall be included.

  The touch sensor panel member 1 includes two transparent electrode layers on which a take-out electrode 3 is formed on a transparent substrate 2 and each of a first transparent electrode 4 and a second transparent electrode 5 is formed. In the touch sensor panel member 1, a first insulating layer 6 is provided between the first transparent electrode 4 and the second transparent electrode 5, and a second insulating layer 7 is provided on the second transparent electrode 5. Configured. Therefore, the second insulating layer 7 is exposed on the surface of the touch sensor panel member 1 opposite to the transparent substrate 2, and an OCA (Optical Clear Adhesive) tape is exposed on the exposed surface of the second insulating layer 7. The cover glass 8 is laminated and disposed via the.

  The transparent substrate 2 is a base material for forming the touch sensor panel member 1. Generally, a glass substrate is used as the transparent substrate 2, but the glass substrate is not limited to this, and any transparent substrate used as a transparent substrate for a touch sensor panel member or a transparent substrate for a display device may be selected and used as appropriate. can do. Further, the first transparent electrode 4 and the second transparent electrode 5 described above can be formed by appropriately selecting a material generally known as a material for forming the transparent electrode in the touch sensor panel member. For example, ITO or IZO is preferably used. Moreover, you may form the bridge electrode mentioned later with a metal material. Moreover, the thickness of the 1st transparent electrode 4 and the 2nd transparent electrode 5 is although it does not specifically limit, Generally, it is about 10 nm-about 100 nm, respectively.

  Although not shown, a surface protective layer may be formed on the second insulating layer 7 in the touch sensor panel member 1 of the present invention. For example, in this case, a surface protective layer is interposed between the second insulating layer 7 and the cover glass 8 in the touch sensor panel member 1.

Lamination mode of the first transparent electrode, the second transparent electrode, and the insulating layer:
In the present invention, the first transparent electrode 4, the second transparent electrode 5, the first insulating layer 6, and the second insulating layer 7 touch the surface of the touch sensor panel member with a fingertip in the capacitance method. Each pattern is formed so as to be able to detect a change in electric capacity. More specifically, in order to show examples of these lamination modes, a top view of a state in which the first transparent electrode 4, the second transparent electrode 5, and the first insulating layer 6 are laminated on the transparent substrate 2 is shown. FIG. 3 shows a cross-sectional view of the touch sensor panel member of the embodiment shown in FIG. 2, FIG. 4 and FIG. 2, 4, and 5, the transparent substrate 2 is present in the lowermost layer of the laminate, and the second insulating layer 7 is present on the first insulating layer 6. Is omitted.

  FIG. 2 shows a first mode in which the first transparent electrode 4 is directly formed on the transparent substrate and the second transparent electrode 5 is indirectly formed on the transparent substrate. In this embodiment, a plurality of diamond shapes aligned on a transparent substrate are connected in a straight line in the x direction, and a plurality of rows of first transparent electrodes 4 and a first insulation provided so as to cover the first transparent electrodes 4. The layer 6 includes a plurality of diamond shapes aligned on the first insulating layer 6 and a plurality of rows of second transparent electrodes 5 connected in a straight line in the y direction. The first insulating layer 6 is patterned so as to cover the entire surface of the first transparent electrode 4 and not cover the extraction electrode provided on the transparent substrate and the upper portion of the metal wiring described later. The same applies to the first insulating layer 6 shown in FIGS. 4 and 5 in that the first insulating layer 6 is patterned so as not to cover the extraction electrode and the metal wiring.

  3 and 4 show a second mode in which the first transparent electrode 4 and the second transparent electrode 5 are formed directly on the transparent substrate, and the second transparent electrode has a bridge electrode. . In this aspect, the plurality of diamond shapes aligned on the transparent substrate are configured by alternately forming columns that are independently aligned in the x direction and columns that are linearly connected in the x direction. The rows connected linearly in the direction form the first transparent electrode 4. In addition, the diamond shapes that are aligned independently of each other are connected by a plurality of bridge electrodes 9 for coupling in the y direction to form a second transparent electrode 5. The first insulating layer 6 is patterned so as to be partially perforated so that the bridge electrode 9 and the diamond shape of the first transparent electrode 4 can be contacted at a predetermined position.

  The third mode shown in FIG. 5 is configured as a pattern in which the first transparent electrode 4 and the second transparent electrode 5 shown in FIG.

  The above-described lamination mode is not intended to limit the present invention. Capacitance such as a lamination mode in which the x direction and the y direction are interchanged in the pattern, a lamination mode in which a linear electrode is used instead of a diamond shape, etc. The patterning mode of the transparent electrode and the insulating layer known in the touch sensor panel member of the type can be appropriately employed.

  In addition, in the touch sensor panel member of the present invention, when two or more transparent electrode layers are provided, as described above, the embodiment is limited to a mode in which two transparent electrode layers are patterned and laminated on one surface of the transparent substrate. Is not to be done. For example, the aspect formed by patterning two or more transparent electrode layers on both surfaces of a transparent substrate may be sufficient. More specific examples include an ITO transparent electrode layer, a transparent glass substrate, and an ITO transparent electrode layer in this order, and a photosensitive siloxane resin layer is formed on the upper surface of at least one of the ITO transparent electrode layers. Then, the touch sensor panel member of the present invention may be configured. Also in this embodiment, it is possible to satisfactorily prevent the surface of the photosensitive siloxane resin layer from being damaged by forming the photosensitive siloxane resin layer on the upper surface of the ITO transparent electrode layer. Further, even if the touch sensor panel member is manufactured as necessary or heated at a high temperature of about 400 ° C. to 500 ° C. after the manufacture, the surface of the photosensitive siloxane resin layer is not damaged.

Insulating layer (photosensitive siloxane resin layer):
The insulating layer ensures insulation between the first transparent electrode 4 and the second transparent electrode 5 or between the first transparent electrode 4 and the bridge electrode 9 of the second transparent electrode 5. This is to ensure insulation between the outside of the touch sensor panel member 1 on the upper end side of the bridge electrode 9. This insulating layer is formed using a photosensitive siloxane resin. As a result of intensive studies, the inventors of the present invention have a very favorable heat resistance if an insulating layer is formed using a photosensitive siloxane resin, and a desirable resin layer constituting the first insulating layer 6 and the second insulating layer 7. It was found that it can be provided in the touch sensor panel member.

The photosensitive siloxane resin material is a photosensitive (that is, ionizing radiation curable) material containing a siloxane resin as a constituent resin, and as such means a siloxane resin material that can be patterned by a photolithography method. If it is such a photosensitive siloxane resin material, a conventionally well-known material can be selected suitably and it can be used in order to manufacture this invention. Among them, the radiation curable resin composition disclosed in Japanese Patent No. 3821165, that is, a siloxane resin (excluding an aqueous base-soluble silicon-containing polymer having a phenol group), a photoacid generator or a photobase generator, and The siloxane resin can be dissolved, and aprotic solvents (ie, diethyl ether, methyl ethyl ether, methyl-n-di-n-propyl ether, di-iso-propyl ether, methyltetrahydrofuran, dimethyldioxane, etc.) The composition of the photosensitive siloxane resin layer according to the present invention comprises a radiation curable composition containing an aprotic solvent containing at least one ether-based solvent listed in claim 1 and cured by irradiation with radiation. It can be suitably used as a material. Alternatively, the radiation curable resin composition disclosed in Japanese Patent No. 3758669, that is, a siloxane resin, a photoacid generator that releases an acidic active substance by irradiation with radiation having a specific wavelength used in the exposure step. Or a photobase generator that releases a basic active substance, a solvent that can dissolve the siloxane resin component, and a curing-accelerating catalyst that does not release an acidic active substance or a basic active substance even when irradiated with radiation of the specific wavelength. The radiation curable composition containing the can be suitably used as the photosensitive siloxane resin material of the present invention. Examples of siloxane resins that can be patterned by photolithography include resins obtained by hydrolytic condensation of a compound represented by the following general formula (1).
(Formula 1) R ¹ _n SiX _4-n (1)
(In the formula, R ¹ represents an H atom or F atom, or a group containing B atom, N atom, Al atom, P atom, Si atom, Ge atom or Ti atom, or an organic group having 1 to 20 carbon atoms. , X represents a hydrolyzable group, n represents an integer of 0 to 2, and when n is 2, each R ¹ may be the same or different, and when n is 0 to 2, each X is the same But it may be different.)
In addition, the photosensitive siloxane resin layer in this invention may be formed from 1 type of photosensitive siloxane resins, or is formed from arbitrary combinations of 2 or more types of photosensitive siloxane resins represented by different structural formulas. Also good. For example, the siloxane resin layer may be formed by arbitrarily combining two or more types of photosensitive siloxane resins represented by the above formula 1 and having different side chains.

  In addition, the siloxane resin used for the insulating layer according to the present invention is characterized by having heat resistance. This is appropriately determined from the step of pre-baking by semi-curing the siloxane resin by heating at a relatively low temperature of about 100 ° C. and the range of about 220 ° C. to 500 ° C. after pre-baking when forming the insulating layer. Because it is necessary to perform post-baking to cure the siloxane resin by heating at a high temperature, and when the touch sensor panel member 1 is mounted on the organic EL display device, it is necessary to heat at a high temperature of about 420 ° C. The siloxane resin used in the present invention desirably has heat resistance that can withstand heating at a high temperature of about 400 ° C to 500 ° C. Moreover, it is preferable that the siloxane resin used for the insulating layer according to the present invention has a withstand voltage performance of at least 2.5 MV / cm when formed as an insulating layer. By having this voltage resistance, it becomes possible to maintain even better electrical reliability.

In addition, when two or more photosensitive siloxane resin layers are formed in the touch sensor panel member, each layer is formed using a photosensitive siloxane resin material containing siloxane resins having different components. May be.
However, when two or more photosensitive siloxane resin layers are formed in the touch sensor panel member, if each layer is formed of the same component photosensitive siloxane resin, the shrinkage rate of each layer can be made the same. It is desirable that the touch sensor panel member as designed can be easily manufactured and the refractive index of each layer is the same, so that the occurrence of reflection can be optically prevented. In the present invention, “the photosensitive siloxane resin layer as the first insulating layer and the photosensitive siloxane resin layer as the second insulating layer are formed using the photosensitive siloxane resin of the same component”. When the first insulating layer and the second insulating layer are each formed from one type of photosensitive siloxane resin, the structural formula of the photosensitive siloxane resin forming each layer is the same. means. On the other hand, when each of the first insulating layer and the second insulating layer is formed of a combination of two or more types of photosensitive siloxane resins, it means that the combination of the photosensitive siloxane resins in the respective layers is the same. However, the identity is not limited to the content ratio of the photosensitive siloxane resin to be combined.

The photosensitive siloxane resin layer in the present invention is formed by using the above photosensitive siloxane resin material in the same manufacturing process as the conventional insulating layer manufacturing process, that is, the insulating layer manufacturing process using the acrylic photosensitive material. be able to.
More specifically, a photosensitive siloxane resin material is prepared and applied onto the substrate surface to form a coating film. As the coating method, any method may be adopted as long as the photosensitive siloxane resin material can be applied to the substrate surface with a substantially uniform film thickness. For example, a spin coating method, a die coating method, etc. A method, a slit coating method, a gravure coating method, a coating method combining these methods, or an ink jet method can be selected as appropriate.

  Then, after drying under reduced pressure as necessary, it is heated (prebaked) at an appropriate temperature, and then exposed to ionizing radiation such as ultraviolet rays through a photomask having a desired pattern to cure the exposed portion, The photosensitive siloxane resin layer can be formed by removing the mask, developing the unexposed portion with an alkali developer, and heating (post-baking) as necessary. However, the difference from the acrylic photosensitive material is that the heating temperature in the heating step of the photosensitive siloxane resin contained in the photosensitive siloxane resin material can be appropriately determined from the range of about 220 ° C to 500 ° C. Generally, when a photosensitive siloxane resin material is used, during pre-baking, the resin is semi-cured by heating at a relatively low temperature of around 100 ° C., and during post-baking, a temperature of about 220 ° C. to 500 ° C. The heating temperature can be selected so that the surface hardness required in the range is exhibited.

  In the present invention, ionizing radiation includes both electromagnetic waves including ultraviolet rays and particle beams having energy quanta that can polymerize molecules including electron beams. The term “photosensitive” or “ionizing radiation curable” means that it can be cured by the ionizing radiation.

  The insulating layer formed using the siloxane resin described in detail above is composed of the first insulating layer 6 and the second insulating layer 7. The first insulating layer 6 and the second insulating layer 7 are formed so that the second insulating layer 7 is laminated on the first insulating layer 6. The bridge electrode 9 is embedded in the second insulating layer 7. Further, siloxane resin is also present inside the space surrounded by the bridge electrode 9, and the siloxane resin inside this space also constitutes the first insulating layer 6 in the present invention. As shown in FIG. 1, the second transparent electrode 5 is located on the first insulating layer 6 and inside the second insulating layer 7. Further, as shown in FIG. 3, when the laminated mode of the first transparent electrode 4 and the second transparent electrode 5 is the above-described second mode, these first insulating layer 6 and second insulating layer The thickness of 7 and the height of the bridge electrode 9 are in such a positional relationship that at least a portion of the bridge electrode 9 that intersects the first transparent electrode protrudes above the first insulating layer 6. In addition, since the second insulating layer 7 is laminated on the first insulating layer 6, the portion of the bridge electrode 9 that intersects the first transparent electrode is inside the second insulating layer 7. Configured to be located.

  The first insulating layer 6 is formed so as to be thicker than the second insulating layer 7. That is, when the thickness of the first insulating layer 6 is D1 and the thickness of the second insulating layer 7 is D2, there is a relationship of D1> D2 between these D1 and D2. The total film thickness D3 of the first insulating layer 6 and the second insulating layer 7 can ensure insulation between the first transparent electrode 4 and the second transparent electrode 5 in the insulating layer. In addition, it is preferable that the insulating layer is formed so as to have a thickness that does not exceed the crack limit, which is the limit at which cracking or the like occurs in the insulating layer. Specifically, the film thickness D3 is preferably 0.4 μm to 2.3 μm. By ensuring the film thickness D3 within this range, the withstand voltage from the outside of the touch sensor panel member 1 can be improved to about 500V. Further, the film thickness D1 of the first insulating layer 6 is set so that the insulation between the first transparent electrode 4 and the second transparent electrode 5 is as much as possible within the range in which the film thickness D3 of the insulating layer is determined. It is preferable to secure the thickness and not to exceed the crack limit of the first insulating layer 6. Specifically, the film thickness D1 is preferably 0.3 μm to 2 μm. By ensuring the film thickness D1 within this range, the withstand voltage between the first transparent electrode 4 and the second transparent electrode 5 can be about 75V to 500V. Further, the film thickness D2 of the second insulating layer 7 is within the range where the film thickness D3 of the insulating layer is determined, and the insulation with the outside of the touch sensor panel member 1, particularly the subsequent electrostatic breakdown. It is preferable that the thickness be such that the above can be prevented. Specifically, the film thickness D2 is preferably 0.1 μm to 0.3 μm.

  The first insulating layer 6 and the second insulating layer 7 have high transmittance in the entire visible light region and are almost colorless and transparent, but have a slight absorption band in the short wavelength region of the visible light region, May be colored yellow. Such coloring is not preferable in the touch sensor panel member. In addition to the above-mentioned crack limit problem, the exposure area increases due to the influence of diffracted light at the time of exposure, resulting in pattern fattening and resolution deterioration as the insulating layer thickness is set larger. Problems can also arise. Therefore, in order to avoid such a problem of coloring and a problem of deterioration of resolution, it is preferable that the insulating layer is formed with a minimum necessary thickness within a range satisfying the above-mentioned withstand voltage.

  Furthermore, due to the diligent study of the present inventors, there are advantages unique to the photosensitive siloxane resin layer that are not exhibited in the resin layer (or the formation process) formed of silicon-based SOG used in the semiconductor field. I found out that

  First, there is a point having a selectable range for the heating temperature when forming the photosensitive siloxane resin layer. That is, when an insulating film is formed using silicon-based SOG, a solid film is formed using the silicon-based SOG on the substrate surface, and the positive resist is laminated at a high temperature of about 400 ° C. to 500 ° C. It needs to be baked and hardened sufficiently. Although the surface hardness of the formed SOG is sufficiently hardened by such heating, if there is a member having a heat resistant temperature of less than 400 ° C. in another layer already provided on the substrate, the member is heated by heating. There was a risk of damage. On the other hand, when forming a photosensitive siloxane resin layer, post-baking is performed to cure the resin after the exposure treatment, and the heating temperature at this time can be selected in the range of about 220 ° C to 500 ° C. It is. Moreover, it was found that the photosensitive siloxane resin is sufficiently cured within such a temperature range. Therefore, the heating temperature can be determined in consideration of the heat resistance of other layers already formed on the substrate surface.

  Accordingly, the first insulating layer 6 and the second insulating layer 7 in the touch sensor panel member 1 of the present invention can be arbitrarily heated depending on the mode of the touch sensor panel member itself, the method of use, or the combination with the display device. It has the advantageous property of being selectable.

Second, when an insulating layer or a surface protective layer is manufactured using a photosensitive siloxane resin material, the manufacturing process can be shortened as compared with the case where a silicon-based SOG is used.
Generally, the first transparent electrode 4 and the second transparent electrode 5 in the touch sensor panel member 1 are formed using ITO. When using ITO, especially low-temperature film-forming ITO, first form an ITO film on the substrate, then stack a positive resist in the desired area, etch with acid, and then heat treatment The first transparent electrode 4 and the second transparent electrode 5 patterned by baking are formed.
Here, the first insulating layer 6 and the second insulating layer 7 are formed on the first transparent electrode 4 and the second transparent electrode 5, and a photosensitive siloxane resin material is used as the material. In this case, the heat treatment after etching the ITO film with an acid is omitted, and at the same time when the heat treatment in the insulating layer manufacturing process or the surface protective layer manufacturing process is performed, the ITO film is heated and baked. It was found that a transparent electrode layer can be formed.

  On the other hand, when silicon-based SOG is used, if the heat treatment of the ITO film is omitted in the same manner as described above, the surface of the ITO film becomes rough, resulting in a problem that the electrical resistance value increases and the electrical reliability decreases. It was speculated that the occurrence of this problem was caused by wet etching using an acid solvent in the step of forming an insulating film using silicon-based SOG. That is, as described above, since silicon-based SOG does not have a patterning function by itself, it is necessary to perform plate making / peeling using a positive photosensitive material, and the acid solvent used at this time is applied to the transparent electrode layer. Contact may cause the surface to become rough. Moreover, it was considered that the damage was particularly large when the acid solvent contacted the ITO film before the ITO film was firmly heated and baked. On the other hand, in the step of forming the first insulating layer 6 and the second insulating layer 7, an acid solvent is not used and an alkali developer is used, so that the transparent electrode layer (ITO film) before baking is solidified. Even when the alkali developer is in contact, the ITO film is not damaged to such an extent that the electrical reliability is lowered. Therefore, it was considered that the heat treatment can be omitted as described above. In particular, when the first transparent electrode 4 and the second transparent electrode 5 are laminated in two layers, the heat treatment can be omitted for each manufacturing process of each layer, so that there is a great merit in shortening the manufacturing process. . In addition, it is desirable to reduce the heating process as much as possible for the generated touch sensor panel member itself because a touch sensor panel member with good quality can be provided by reducing the damage caused by the entire heat.

Thirdly, the first insulating layer 6 and the second insulating layer 7 formed using the photosensitive siloxane resin material are good even when formed for multi-surface processing using a large substrate. In-plane uniformity can be obtained.
That is, a substrate (wafer) in the semiconductor field generally has a diameter of 300 mm or less, and it is sufficient if film forming properties on a relatively small substrate surface are ensured. On the other hand, display members in recent years and touch sensor panel members used therefor tend to be manufactured with multiple chamfers on a large substrate of, for example, 300 cm × 300 cm. It is unclear whether a material that exhibits good film formability on a small substrate surface can also exhibit good film formability on a large substrate surface. Therefore, the present inventors have studied the multi-surface layout of a plurality of substrates using a large substrate using silicon-based SOG used in the semiconductor field. As a result, when a dry etching or wet etching process is performed on a large substrate using a silicon-based SOG in the same manner as a semiconductor process, in-plane uniformity cannot be ensured, and the silicon-based SOG is used. It was inferred that good in-plane uniformity of the film could not be obtained. On the other hand, if it is a photosensitive siloxane resin material, a film can be formed using the technology established by the manufacture of flat panel displays, and even when a large substrate is used, the insulating layer and In / plane uniformity of the surface protective layer is sufficiently secured.

Metal wiring:
If necessary, metal wiring can be provided on the outer periphery of the effective display area on the transparent substrate of the touch sensor panel member of the present invention to reduce the electrical resistance. The metal wiring is generally connected to the outer peripheral side of the transparent electrode layer, and is configured to easily take out an electric signal generated by the capacitive method and guide the signal to the take-out electrode.

  As a material constituting the metal wiring, a silver alloy or a copper alloy is generally used. Alternatively, silver, gold, copper, chromium, platinum, aluminum, APC (Au / Pd / Cu, silver / palladium / copper), It may be MAM (Mo-Nb / Al-Nd / Mo-Nb, molybdenum alloy / aluminum alloy / molybdenum alloy), chromium oxide / chromium laminate, or the like. Further, a metal wiring may be configured by stacking a plurality of different metals.

As mentioned above, although the aspect of this invention was demonstrated using the touch sensor panel member shown by drawing, the touch sensor panel member of this invention is not limited to this. In the present invention, the first insulating layer 6 and the second insulating layer 7 made of a photosensitive siloxane resin are formed on the transparent electrode layer, and the thickness D1 of the first insulating layer 6 is the second insulating layer. It is important that the layer 7 is formed to be larger than the thickness D2, and it is important that the intended purpose of the present invention is solved satisfactorily.
Therefore, the touch sensor panel member of the present invention can be changed as appropriate without departing from the spirit of the present invention.

[Display device]
As described above, the touch sensor panel member of the present invention to be described can be combined with a display device to provide a touch sensor panel member integrated display device. In the present invention, “the touch sensor panel member and the display device are integrally combined” means that the transparent substrate of the touch sensor panel member of the present invention described above is a substrate on one side of the two substrates facing each other in the display device. This means that the functions of the touch sensor panel member and the substrate on one side of the display device are integrated into a single substrate. As a result, the number of substrates can be reduced compared to the conventional mode in which the substrate of the touch sensor panel member is mounted on one side of the display device, for example, and the display device can be made thinner and lighter. Can do.

  In the display device integrated with the touch sensor panel member, two electrode layers are formed on one substrate via an organic EL element as a display medium, and the other substrate (cover) faces the one substrate. There is an organic EL display device on which glass 8) is installed.

(Embodiment 3)
As an embodiment of the touch sensor panel member-integrated display device of the present invention, a touch sensor panel member-integrated organic EL display device is used, and a schematic cross-sectional view when cut in a direction substantially perpendicular to the substrate surface is shown in FIG. As shown. In order to manufacture the touch sensor panel member-integrated organic EL display device 31 shown in FIG. 6, a touch sensor panel member 32 formed in the same manner as the touch sensor panel member 1 shown in FIG. The extraction electrode 3 is not shown). On the other hand, an organic EL substrate 35 in which an organic EL element 34 is provided on a transparent substrate 33 is prepared. And it can manufacture by combining the 2nd transparent electrode 5 in the touch sensor panel member 32, and the organic EL element 34 in the organic EL substrate 35 in the facing direction. At this time, the two substrates are kept at an appropriate distance by the spacer 36.

  In general, the organic EL element 34 is formed with a driving circuit including TFTs on a transparent substrate 33, and a flattening film or a protective film is provided on the driving circuit as necessary. By forming a metal electrode using a known material as a metal electrode in an organic EL element such as Au, and then forming an organic layer including a light emitting layer from a known material, and then forming a metal electrode. Composed. However, the configuration of the organic EL element or the organic EL substrate including the organic EL element in the present invention is not limited to this, and a conventionally known organic EL substrate may be appropriately selected and combined with the touch sensor panel member. The metal electrode formed on the touch sensor panel member side is formed as a transparent electrode such as a transparent conductive film made of a metal oxide for light extraction.

In the organic EL display device according to the present embodiment, the transparent substrate 2 is installed to face the organic EL substrate, but the cover glass 8 may also be used as the transparent substrate 2 in the touch sensor panel member 32. This makes it possible to reduce the thickness and weight of the entire display device.
In the touch sensor panel member of the present invention, both the first insulating layer 6 and the second insulating layer 7 have high heat resistance and can withstand heat treatment at 400 ° C. or higher. During the manufacturing process, the first insulating layer 6 and the second insulating layer 7 are formed by heating at 400 ° C. or higher, or the manufactured touch sensor panel member is subjected to heat treatment at 400 ° C. or higher. The problem of degassing, which has been a conventional problem, can be solved.

(Embodiment 4)
Moreover, the touch sensor panel member of the present invention can be used not only for combining with a display device in an integrated manner, but also for manufacturing an independent touch sensor panel member.

  The touch sensor panel member of the present invention is manufactured by using the touch sensor panel member shown in FIG. 1 and installing a second substrate facing the transparent substrate via a transparent electrode layer or the like. As the second substrate, a transparent glass substrate, a transparent film substrate, or the like is preferably used, but is not limited thereto. Note that the distance between the transparent substrate and the second substrate is secured by a spacer provided on the edge of the substrate outside the display area.

  On the other hand, the liquid crystal display device is configured such that a display-side substrate and an electrode substrate are opposed to each other, closely contacted with a seal member in a state where a space is provided between both substrates, and the space is filled with a driving liquid crystal material. The display-side substrate is provided with a black matrix on a transparent substrate, followed by a colored layer composed of red colored pixels, green colored pixels, and blue colored pixels, and an alignment film for driving liquid crystal material provided on the colored layer. It is configured. The electrode substrate is configured by providing a liquid crystal driving circuit (not shown), a liquid crystal driving electrode, and the like on a transparent substrate. The liquid crystal display device is merely an example, and if it is a device generally understood as a liquid crystal display device using a driving liquid crystal material, the transparent substrate constituting the display side substrate and the touch sensor panel of the present invention The touch sensor panel member of the present invention can be mounted so that the transparent substrate of the member directly or indirectly overlaps. Similarly, in other display devices such as an organic EL display device, the touch sensor panel member of the present invention is similarly arranged so that the display side substrate and the transparent substrate of the touch sensor panel member of the present invention are directly or indirectly overlapped. It can be mounted by pasting.

  In Embodiment 4, an example in which the touch sensor panel member is used in the present invention so that the second substrate is on the surface side to be touched with a finger has been shown, but the touch surface in the touch sensor panel member of the present invention is this. It is not limited to. The touch sensor panel member in the liquid crystal display device equipped with the touch sensor panel member of the present invention may be rotated up and down to bring the second substrate and the transparent substrate into contact with each other. As described above, by mounting the touch sensor panel member on the liquid crystal display device, the touch sensor panel member-mounted liquid crystal display device can be configured with the transparent substrate as the touch surface side.

[Method for manufacturing touch sensor panel member]
Next, a method for manufacturing the touch sensor panel member according to the present embodiment will be described with reference to FIGS. 7 and 8 are explanatory views for explaining a manufacturing process of the touch sensor panel member. FIG. 7 shows a manufacturing method of the touch sensor panel member of the aspect shown in FIG. 8 represents a manufacturing method of the touch sensor panel member of the embodiment shown in FIG.

  When manufacturing the touch sensor panel member of the aspect shown in FIG. 1, the glass substrate 2 as a transparent substrate is prepared first. The glass substrate 2 is preferably cleaned by a surface activation process or an ultrasonic cleaning process using ultrapure water or the like. Next, as shown in FIG. 7, APC is formed on the entire surface of the glass substrate 2 by sputtering, and a metal wiring layer 41 is laminated (FIG. 7A). Then, using a positive photosensitive material, a metal wiring pattern and an electrode extraction portion pattern are printed out of the effective display area by a photolithography process. Further, unnecessary portions are removed using an etchant, and then the unnecessary positive photosensitive material is peeled off to form a metal wiring pattern (FIG. 7B).

  Next, ITO is formed on the glass substrate 2 by sputtering, and the first transparent electrode layer 42 is laminated (FIG. 7C). Then, using a positive photosensitive material, a pattern in which a line connected linearly in the X direction is formed by a photolithography process. Further, unnecessary portions are removed using an etchant, and then the positive photosensitive material that has become unnecessary is peeled off to form the first transparent electrode 4 (FIG. 7D).

  Next, a photosensitive siloxane resin material is applied onto the first transparent electrode 4 and the glass substrate 2 (FIG. 7E). The photosensitive siloxane resin material can be applied by appropriately selecting a spin coating method, a die coating method, a slit coating method, a gravure coating method, a coating method combining these methods, or an inkjet method. . At this time, the first insulating layer 6 is formed so as to have a film thickness of D1. Then, after drying under reduced pressure as necessary, prebaking is performed at an appropriate temperature, and then exposure is performed by irradiating with an ionizing radiation such as ultraviolet rays through a photomask having a desired pattern to cure the exposed portion. Then, the mask is removed, the unexposed portion is developed with an alkaline developer, and post-baked as necessary to cure the photosensitive siloxane resin material, thereby forming the first insulating layer 6. Although not shown in FIG. 7E, a photolithography process is performed at a location where the first insulating layer 6 is not formed, such as a location where a flexible substrate (hereinafter simply referred to as FPC) is connected. When the step of curing the photosensitive siloxane resin material is performed, the photosensitive siloxane resin material is removed.

  Next, ITO is deposited on the first insulating layer 6 by sputtering, and the second transparent electrode layer 43 is laminated (FIG. 7F). Then, using a positive photosensitive material, a pattern in which rows connected in a straight line in the Y direction are formed by a photolithography process. Further, unnecessary portions are removed using an etchant, and then the unnecessary positive photosensitive material is peeled off to form the second transparent electrode 5 (FIG. 7G).

  Next, the photosensitive siloxane resin material is applied on the second transparent electrode 5 and the first insulating layer 6 to form the second insulating layer 7 (FIG. 7H). The method for forming the second insulating layer 7 is the same as the first insulating layer 6, such as a spin coating method, a die coating method, a slit coating method, a gravure coating method, a coating method combining these methods, or an ink jet method. Can be selected as appropriate. At this time, the second insulating layer 7 is formed to have a thickness of D2. As described above, the film thickness D2 is formed so as to satisfy the relationship D1> D2. Then, after drying under reduced pressure as necessary, prebaking is performed at an appropriate temperature, and then exposure is performed by irradiating with an ionizing radiation such as ultraviolet rays through a photomask having a desired pattern to cure the exposed portion. Then, the mask is removed, the unexposed portion is developed with an alkali developer, and post-baked as necessary to cure the photosensitive siloxane resin material, thereby forming the second insulating layer 7. As described above, in a place where the second insulating layer 7 is not formed, such as a place where the FPC is connected, when performing a step of curing the photosensitive siloxane resin material by a photolithography process, The photosensitive siloxane resin material is removed.

  Next, an OCA tape is affixed on the second insulating layer 7, and a cover glass 8 is laminated thereon to form a touch sensor panel member having the form shown in FIG. 1 (FIG. 7 (i)). .

  Next, a method for manufacturing the touch sensor panel member according to the embodiment shown in FIG. 3 will be described.

  When manufacturing the touch sensor panel member of the aspect shown in FIG. 3, the glass substrate 2 as a transparent substrate is prepared first. The glass substrate 2 is preferably cleaned by a surface activation process or an ultrasonic cleaning process using ultrapure water or the like. Next, as shown in FIG. 8, APC is formed on the entire surface of the glass substrate 2 by sputtering, and a metal wiring layer 41 is laminated (FIG. 8A). Then, using a positive photosensitive material, a metal wiring pattern and an electrode extraction portion pattern are printed out of the effective display area by a photolithography process. Further, unnecessary portions are removed using an etchant, and then the unnecessary positive photosensitive material is removed to form a metal wiring pattern (FIG. 8B).

  Next, ITO is formed into a film on the glass substrate 2 by sputtering, and a transparent electrode layer is laminated (FIG. 8C). Then, using a positive photosensitive material, a pattern in which a plurality of diamond shapes to be aligned are alternately formed in a row that is independently aligned in the X direction and a row that is linearly connected in the X direction by a photolithography process. Then, a transparent electrode is formed (FIG. 8D). Here, the columns connected linearly in the X direction are the first transparent electrodes 4, and the electrodes formed to be independently aligned in the X direction are the second transparent electrodes 5.

  Next, the photosensitive siloxane resin material is applied onto the first transparent electrode 4, the second transparent electrode 5, and the glass substrate 2 (FIG. 8E). The photosensitive siloxane resin material can be applied by appropriately selecting a spin coating method, a die coating method, a slit coating method, a gravure coating method, a coating method combining these methods, or an inkjet method. . At this time, the first insulating layer 6 is formed so as to have a film thickness of D1. Then, after drying under reduced pressure as necessary, prebaking is performed at an appropriate temperature, and then exposure is performed by irradiating with an ionizing radiation such as ultraviolet rays through a photomask having a desired pattern to cure the exposed portion. Then, the mask is removed, the unexposed portion is developed with an alkaline developer, and post-baked as necessary to cure the photosensitive siloxane resin material, thereby forming the first insulating layer 6. As shown in FIG. 8E, in this embodiment, when the first insulating layer 6 is formed, a hole is formed from the upper surface of the first insulating layer 6 to the upper surface of the first transparent electrode 4. ing. This hole is for connecting a bridge electrode. Although not shown in FIG. 8 (e), a step of curing the photosensitive siloxane resin material by a photolithography process at a location where the first insulating layer 6 is not formed, such as a location where an FPC is connected. In carrying out the process, the photosensitive siloxane resin material is removed.

  Next, the electrodes constituting the rows that are independently aligned in the x direction are connected by a bridge electrode (FIG. 8F). As shown in FIG. 8 (f), the bridge electrode is formed in a U shape and is configured such that the leg portion can be inserted into a hole formed in the first insulating layer 6. The bridge electrode is configured so that the legs constituting the second transparent electrode 5 can be electrically connected to each other by inserting a leg portion into the hole formed in the previous process. At this time, since the photosensitive siloxane resin material constituting the first insulating layer 6 is interposed inside the bridge electrode, insulation between the bridge electrode and the first transparent electrode 4 is ensured.

  Next, a photosensitive siloxane resin material is applied on the bridge electrode and the first insulating layer 6 to form the second insulating layer 7 (FIG. 8G). The method for forming the second insulating layer 7 is the same as the first insulating layer 6, such as a spin coating method, a die coating method, a slit coating method, a gravure coating method, a coating method combining these methods, or an ink jet method. Can be selected as appropriate. At this time, the second insulating layer 7 is formed to have a thickness of D2. As described above, the film thickness D2 is formed so as to satisfy the relationship D1> D2. Then, after drying under reduced pressure as necessary, prebaking is performed at an appropriate temperature, and then exposure is performed by irradiating with an ionizing radiation such as ultraviolet rays through a photomask having a desired pattern to cure the exposed portion. Then, the mask is removed, the unexposed portion is developed with an alkali developer, and post-baked as necessary to cure the photosensitive siloxane resin material, thereby forming the second insulating layer 7. As described above, in a place where the second insulating layer 7 is not formed, such as a place where the FPC is connected, when performing a step of curing the photosensitive siloxane resin material by a photolithography process, The photosensitive siloxane resin material is removed.

  Next, an OCA tape is pasted on the second insulating layer 7, and a cover glass 8 is laminated thereon to form a touch sensor panel member having the mode shown in FIG. 3 (FIG. 8 (h)).

  According to the method for manufacturing a touch sensor panel member according to the present embodiment, since the first insulating layer 6 and the second insulating layer 7 are formed using the photosensitive siloxane resin material, the photosensitive siloxane resin material is applied. The first insulating layer 6 and the second insulating layer 7 can be formed only by being worked and UV-cured. This eliminates the need for a process performed in the vacuum apparatus, and can greatly improve the manufacturing efficiency of the touch sensor panel member.

Example 1
(Preparation of base substrate)
First, a glass substrate (non-alkali glass, NH Techno Glass Co., Ltd., (model number: NA35)) 550 mm × 650 mm as a transparent substrate is prepared, treated with a surfactant using ultrapure water, and subsequently subjected to ultrasonic cleaning treatment. Washed. In addition, it designed so that 50 touch sensor panel members could take on the said transparent substrate, it created as follows, and one arbitrary surface was made into Example 1. FIG.

(Metal wiring plate making)
As a metal wiring for assisting the resistance of the outer peripheral wiring portion, APC was formed to a thickness of 200 nm by sputtering on the entire surface of the glass substrate. Subsequently, using a positive photosensitive material (manufactured by Rohm and Haas), a metal wiring pattern and an electrode extraction pattern were printed out of the effective display area by a photolithography process. Further, a phosphoric acid, nitric acid, and acetic acid mixed solution was used as an etchant, unnecessary portions were removed, and then the unnecessary positive photosensitive material was peeled off with caustic soda to form a metal wiring pattern.

(Film formation of the first transparent electrode)
Next, in order to form the first transparent electrode and the second transparent electrode on the glass substrate on which the metal wiring was made, ITO was formed to a thickness of 20 nm on the entire surface by sputtering. A plurality of diamond shapes that are aligned in the x direction by a photolithography technique using a positive photosensitive material similar to the metal wiring, and a column that is linearly connected in the x direction, The first transparent electrode and the second transparent electrode were formed in a pattern in which are alternately formed. An oxalic acid-based solution was used as an ITO etchant. In the present embodiment, the first transparent electrode, the second transparent electrode, the first insulating layer, and the second insulating layer formed on the glass substrate adopt the laminated form shown in FIG. It should be noted that the electrodes in a line linearly connected in the x direction become the first transparent electrode 4, and the electrodes formed by being independently aligned in the x direction become the second transparent electrode 5.

(Formation of the first insulating layer)
In the method described in Example 2 (paragraph 0125) of Japanese Patent No. 3821165, that is, “a solution in which 317.9 g of tetraethoxysilane and 247.9 g of methyltriethoxysilane are dissolved in 1116.7 g of diethylene glycol dimethyl ether, 167.5 g of nitric acid prepared to 0.644% by weight was added dropwise over 30 minutes with stirring, and after 3 hours of reaction, after reaction was completed, a portion of the ethanol and diethylene glycol dimethyl ether formed was distilled off in a warm bath under reduced pressure. As a result, 1077.0 g of a polysiloxane solution was obtained, 525.1 g of this polysiloxane solution was added with 53.0 g of diethylene glycol dimethyl ether, a tetramethylammonium nitrate aqueous solution (pH 3.6) prepared to 2.38% by weight, and 3.0 g of water. And stir for 30 minutes at room temperature (25 ° C) A polysiloxane solution for a radiation curable composition was obtained by dissolution, and the weight average molecular weight of the polysiloxane measured by the GPC method was 830. A photoacid was added to 10.0 g of the polysiloxane solution for a radiation curable composition. A radiation curable composition was prepared by blending 0.193 g of a generator (PAI-1001, manufactured by Midori Chemical Co., Ltd.) The amount of component (a) used was 15% by weight based on the total amount of the radiation curable composition. The amount of component (b) used is 1.9% by weight with respect to the total amount of the radiation curable composition, and the amount of component (d) used is 0.075% by weight with respect to the total amount of the radiation curable composition. According to the description, a photosensitive siloxane resin material capable of patterning was prepared.

On the glass transparent substrate provided with the 1st transparent electrode and the 2nd transparent electrode which formed the above-mentioned photosensitive siloxane resin material as mentioned above, and on the surface of the 1st transparent electrode and the 2nd transparent electrode The coating film was formed directly by spin coating. Subsequently, the solvent was partially removed by reducing the pressure to 20 Pa using a vacuum drying apparatus, and further heated (prebaked) for 45 seconds on a hot plate at 90 ° C. to completely remove the solvent component. After cooling the substrate to room temperature, a photomask having a pattern in which contact holes for connecting bridge electrodes to be formed in a later process were connected was applied, and exposure processing was performed with a proxy aligner at an exposure amount of 200 mJ at 365 nm.
As described above, the coating surface on which the exposure processing has been completed is dip-developed with 2.38 wt% (TMAH, manufactured by Tokyo Ohka Kogyo Co., Ltd .: model number NMD-3), which is a developer, to remove unexposed portions. A pattern was formed. Further, the exposed substrate is cured by heating (post-baking) at 420 ° C. for 1 hour in a heating furnace in an air atmosphere, and a patterned first insulating layer having a thickness of 0.7 μm is formed on the glass substrate, the first Formed on the transparent electrode and the second transparent electrode.

(Bridge electrode formation)
Further, a U-shaped electrode member was inserted into the contact hole formed in the first insulating layer from above the first insulating layer to electrically connect the second transparent electrodes. The U-shaped electrode member connecting the second transparent electrodes was used as a bridge electrode.

(Formation of second insulating layer)
The same product as that of the first insulating layer, except that the photo-sensitive siloxane resin layer prepared when forming the first insulating layer was changed to a photomask for the pattern for the outermost surface layer. A second insulating layer having a thickness of 0.3 μm was formed on the surfaces of the first transparent electrode and the second transparent electrode by a film technique.

Sensing operation evaluation:
Capacitive sensing evaluation was performed using Example 1. In the sensing evaluation, the touch sensor panel member was connected to the FPC, and the FPC was further connected to a capacitance sensor (Cypress PSOC (model number: CY3240-I2USB)) via a driver. And it performed by aiming at the change of an electrostatic capacitance when a finger was made to contact this touch sensor panel member. As a result of this operation evaluation, the sensing operation result is good if the change in capacitance can be detected and the contact position can be detected, and the sensing operation result is bad if the contact position is not detected. As a result of performing such an operation evaluation, it was confirmed that the sensing operation result of the touch sensor panel member according to Example 1 was good.

(Example 2)
A touch sensor panel member is manufactured using the same material and method as in Example 1 except that the thickness of the first insulating layer is 2.0 μm and the thickness of the second insulating layer is 0.3 μm. Was taken as Example 2. Then, using Example 2, the sensing operation was evaluated. As a result, it was confirmed that the sensing operation result of the touch sensor panel member according to Example 2 was good.

(Comparative Example 1)
In Comparative Example 1, the same materials and methods as in Example 1 were used except that the thickness of the first insulating layer in Example 1 was 0.2 μm and the thickness of the second insulating layer was 0.3 μm. The touch sensor panel member was manufactured, and the sensing operation was evaluated in the same manner as in Example 1. As a result, it was confirmed that the sensing operation result of the touch sensor panel member according to the comparative example 1 caused an operation failure due to an insulation failure, could not be sensed, and was defective.

  The results of Examples 1 and 2 and Comparative Example 1 obtained as described above are summarized in Table 1.

  As shown in Table 1, in Examples 1 and 2, it was confirmed that the touch sensor panel member showed a good operation. On the other hand, in Comparative Example 1, sufficient insulation could not be secured, and it was confirmed that the sensing operation was defective.

  From the above results, in the touch sensor panel member of the present invention, it is possible to form a touch sensor panel member for organic EL with low throughput by applying a high heat-resistant photosensitive siloxane resin, and it is inexpensive and has insulation reliability. It was confirmed that an excellent panel can be provided.

1, 11, 32 Touch sensor panel member 2 Transparent substrate 3 Extraction electrode 4 First transparent electrode 5 Second transparent electrode 6 First insulating layer 7 Second insulating layer 7
8 Cover glass 9 Bridge electrode 33 Transparent substrate 34 Organic EL element 35 Organic EL substrate

Claims (8)

A first transparent electrode formed directly on the transparent substrate;
A second transparent electrode formed directly or indirectly on the transparent substrate in a direction perpendicular to the first transparent electrode;
An insulating layer that electrically insulates the first transparent electrode and the second transparent electrode,
The insulating layer is composed of a first insulating layer and a second insulating layer stacked on the first insulating layer,
The first insulating layer and the second insulating layer are formed of a photosensitive siloxane resin, and are formed so that the thickness of the first insulating layer is thicker than that of the second insulating layer. A touch sensor panel member. The second transparent electrode is formed directly on the transparent substrate,
Either one of the first transparent electrode and the second transparent electrode has a bridge electrode straddling the other transparent electrode,
The touch sensor panel member according to claim 1, wherein a portion of the bridge electrode that intersects with the other transparent electrode is located on the first insulating layer.   The touch sensor panel member according to claim 1, wherein the second transparent electrode is formed on the first insulating layer.   The touch sensor panel member according to claim 1, wherein the first insulating layer and the second insulating layer have a withstand voltage performance of at least 2.5 MV / cm. A display device in which the touch sensor panel member according to any one of claims 1 to 4 is combined,
The display device, wherein the touch sensor panel member is combined so that a transparent substrate of the touch sensor panel is also a substrate of the display device. A method of manufacturing a touch sensor panel member that detects a position where an object contacts with a first transparent electrode and a second transparent electrode,
Forming at least the first transparent electrode directly on the transparent substrate;
Forming a first insulating layer formed of a photosensitive siloxane resin;
The touch sensor panel member, wherein the second insulating layer formed of the siloxane resin is formed with a thickness such that the thickness of the first insulating layer is larger than that of the second insulating layer. Manufacturing method.   The method of manufacturing a touch sensor panel member according to claim 6, wherein the second transparent electrode is formed on the first insulating layer. Forming the second transparent electrode on the transparent substrate together with the first transparent electrode;
The bridge electrode straddling the other transparent electrode is connected to either the first transparent electrode or the second transparent electrode after forming the first insulating layer. The manufacturing method of the touch sensor panel member of description.