JP2013004651A - Print wiring board, and motor or electrical equipment including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a print wiring board on which components are soldered capable of preventing deterioration of insulation performance of an adherend surface of an uncured flux residual leading to the print wiring board in a short-circuit failure when the uncured flux residual presents in a closed narrow space of a junction surface between the components and the print wiring board.SOLUTION: The print wiring board is arranged such that a through hole is provided on a component junction part and a flux-containing solvent is evaporated from the through hole to facilitate curing of the flux.

Description

  The present invention belongs to a peripheral technique of soldering and joining printed wiring boards, and in particular, a component (QFN) in which a flat ceramic or epoxy resin mold package is provided with a plurality of flat electrodes on the surface on the joining side with the printed wiring board. It is suitable for bonding of package components.

  A printed wiring board used for various electric devices is a wiring obtained by printing a copper foil pattern on an insulating resin base material, and an insulating performance higher than a desired resistance value is required between the copper foils. The insulation performance between the copper foils is maintained by the insulation performance of the base resin and the surface of the base. The desired insulation performance is generally desirably a resistance value of 100 MΩ or more between each of the plurality of copper foils.

  A reflow soldering method is widely used as a method for joining various components to a printed wiring board. The reflow soldering method is a method in which solder alloy particles such as lead and tin are kneaded with a volatile solvent together with a flux to form a paste of solder paste, which is applied to a desired location on the printed wiring board. After putting various components on the cream solder, the alloy particles of the cream solder heated and applied by passing through a heating furnace called a reflow furnace are melted and solidified, and the component electrode and the copper foil are joined. The

  During the process, the volatile solvent contained in the cream solder is vaporized by heating and the flux contained with the solder alloy particles is also cured and adheres to the surface of the printed wiring board. The insulation performance of the printed wiring board is not affected. The role of the flux is to chemically remove the copper foil of the printed wiring board to be soldered and the oxide film on the metal surface of the component electrode.

  In recent years, from the viewpoint of reducing the size of equipment and the use of materials due to demands for resource saving, the size of printed wiring boards has been reduced, and the multilayer wiring and three-dimensional wiring technology for substrates has been remarkable. On the other hand, the miniaturization of various components soldered to the printed wiring board is also progressing remarkably with the progress of miniaturization technology. Particularly in the package technology of semiconductor integrated circuit components such as microcomputers and ICs, a plurality of electrodes are provided on the back side surface of the package, that is, the side in contact with the printed wiring board, instead of the SOP or QFP package having electrodes on the package end surface. BGA and QFN package parts that have the same have appeared and are becoming widespread (see, for example, Patent Document 1).

  However, when soldering a component having a plurality of flat electrodes on the back surface of a component package such as the QFN package described in Patent Document 1 on a printed wiring board using cream solder, the following is performed. There are challenges.

  In a component having a plurality of flat electrodes on the back surface of a component package such as the QFN package, the solder joint location is an extremely narrow space sandwiched between the component and the printed wiring board, so that the solvent contained in the cream solder is vaporized. Insufficient and uncured flux residue may remain.

  FIG. 9 is a configuration diagram showing a problem of the conventional printed wiring board 101. The copper foil 8 stretched on the base material and the electrode 6 of the component 4 are joined by a joining material 3 (solder). The electrode 6a of the component 4 is an electrode necessary for the internal structure of the component 4, and is not joined to the copper foil.

The uncured flux 102 is present as a residue between the electrodes as shown in the figure because the solvent was insufficiently vaporized. When the flux is uncured, that is, when a solvent is contained, molecules and ions contained in the residue have fluidity, and there is a problem that the insulating performance is deteriorated.

  Examples of the material contained in the flux include polymers which are high molecular polymers and bromine which is a halogen group element. These substances are widely used to suppress cracking of the cured flux and improve wettability of solder alloy electrodes and copper foil.

  When the component 4 is a motor drive device or the like, the main power supply voltage is high, for example, it may be a rectified voltage of the commercial power supply AC200V, and a high voltage according to the rectified voltage of AC200V is applied between the electrodes on the back of the component. When insulation performance deteriorates due to an uncured flux residue between the electrodes, a leakage current is generated between the electrodes, which eventually causes a short circuit failure.

  10 and 11 are diagrams showing the problem. In FIG. 10, a high voltage is applied to the left and right sides of the copper foil 8 in the figure by the signal source 104. Due to the residue 102, the resistance value between the left and right sides of the copper foil 8 is lowered, that is, the insulation performance is lowered, so that a minute current starts to flow, and finally, a spark 103 is generated, leading to a failure in which the corresponding part and the periphery are burned out. .

  FIG. 11 shows a case where a high voltage is applied between the electrode 6a of the component 4 and the adjacent electrode 6 by the signal source 104. The electrode 6a is necessary for the structure of the component 4, and is printed wiring. It is an electrode that does not need to be joined to the copper foil of the plate. Similar to FIG. 10, the residue 103 reduces the resistance value between the electrodes 6 and 6 a, that is, the insulation performance deteriorates, so that a very small current begins to flow. Finally, a spark 103 is generated and the relevant part and the periphery are burned out. This leads to a failure.

  To solve such a problem, as shown in FIG. 11, a through via hole is provided in a copper foil portion (land portion) to which cream solder is applied, and a film is formed with a solder resist in a ring shape around the opening of the via hole. There is a conventional technique in which the gas generated when the cream solder is melted is exhausted to the outside (see, for example, Patent Document 2).

JP 2009-105212 A JP 2010-245075 A

  However, in Patent Document 2, it is insufficient for discharging the vaporized gas of the solvent present between the electrodes, and the amount of cream solder applied is large, or when the distance from the outer periphery of the solder resist ring to the hole is short, There was a problem that the cream solder flowed into the via hole and closed the via hole, and gas was not sufficiently discharged.

  An object of the present invention is to solve the above-described conventional problems, and to provide a printed wiring board that can sufficiently evaporate a flux solvent to cure the flux and prevent a decrease in insulation performance between the back electrodes of the components. To do.

In order to solve the above problems, the printed wiring board of the present invention is a volatile solvent in which a part having a structure in which a plurality of electrodes are arranged around the back surface of a planar package and at least one island-like flat electrode is provided. Printed wiring board to be bonded using a bonding material containing
The printed wiring board is provided with a land made of copper foil at a position facing the electrode in the mounting range of the component, and further, an insulating region between the copper foils stretched on the printed wiring board at a location on the back side of the component Are provided with through holes that are not subjected to copper plating. In the process of joining the component and the printed wiring board, the volatile solvent is vaporized and discharged to the outside through the through hole from the narrow space on the surface where the component is joined to the printed wiring board. Features.

  According to the present invention, the flux solvent is sufficiently vaporized by the through hole formed in the printed wiring board to cure the flux, and the deterioration of the insulation performance between the component back electrodes can be prevented.

  In addition, by using a flux solvent that does not contain a halogen-based element, the insulation performance between the back electrodes of the component can be maintained at a desired value or more even when an uncured flux residue is present.

  Moreover, even if an uncured flux residue exists by using a flux solvent that does not contain a polymer, it is possible to maintain the insulation performance between the back electrodes of the component at a desired value or more.

  Moreover, the insulation performance between component back electrodes can be maintained at a desired value or more by combining all three or any of the above three.

Sectional drawing of the printed wiring board of Embodiment 1 of this invention The top view from the component mounting side of the printed wiring board of Embodiment 2 of this invention The top view from the component mounting side of the printed wiring board of Embodiment 3 of this invention The top view from the component mounting side of the printed wiring board of Embodiment 4 of this invention The top view from the component mounting side of the printed wiring board of Embodiment 5 of this invention (A) Sectional view of the test printed wiring board of the sixth embodiment of the present invention (b) Characteristic diagram showing the relationship between the temperature and the insulation resistance value between the copper foils of the test printed wiring board of the sixth embodiment of the present invention (A) Sectional view of motor of embodiment 7 incorporating the printed wiring board of the present invention (b) Circuit diagram of motor of embodiment 7 incorporating the printed wiring board of the present invention (c) Printed wiring of the present invention FIG. 11 is a characteristic diagram showing the relationship between the input power of the motor of Embodiment 7 with a built-in board and the temperature of the printed wiring board. The internal structure figure of the room air conditioner of Embodiment 8 which used the motor incorporating the printed wiring board of this invention for ventilation. Cross-sectional view of a conventional printed wiring board The figure which showed the subject around the electrode 6 of the printed wiring board of a prior art example The figure which showed the subject in the electrode 6a periphery of the printed wiring board of a prior art example Figure around the via hole of the printed wiring board of the conventional example

The present invention relates to a print in which a part having a structure in which a plurality of electrodes are arranged around the back surface of a planar package and at least one island-like flat electrode is provided using a bonding material containing a volatile solvent. A wiring board,
The printed wiring board is provided with a land made of copper foil at a position facing the electrode in the mounting range of the component, and further, an insulating region between the copper foils stretched on the printed wiring board at a location on the back side of the component Are provided with through holes that are not subjected to copper plating.

  Further, the present invention, in the process of joining the component and the printed wiring board, vaporizes the volatile solvent from the narrow space on the surface where the component is joined to the printed wiring board, through the through hole, It is made to discharge | release.

  In the present invention, the shape of the through hole is a round hole.

  In the present invention, the shape of the through hole is a long hole or a slit shape.

  Further, in the present invention, the position of the through hole is provided at a position where an electrode that is not joined to the printed wiring board is present among one or a plurality of electrodes on the surface of the component that is in contact with the printed wiring board, An electrode that is not bonded to the printed wiring board is exposed through the through hole on the side opposite to the printed wiring board of the component.

  Further, in the present invention, the position of the through hole is provided at a position where an electrode that is not joined to the printed wiring board is present among one or a plurality of electrodes on a surface that contacts the printed wiring board of the component, A part of the electrode joined to the printed wiring board is exposed through the through hole on the side opposite to the printed wiring board of the component.

  Further, the present invention provides a plurality of electrodes on the surface of the component that are in contact with the printed wiring board, and all of the electrodes that are not joined to the printed wiring board are on the non-joining side of the printed wiring board. And exposed through the through hole.

  Further, the present invention is characterized in that the volatile solvent does not contain a Group 17 (halogen) element.

  In the present invention, the volatile solvent does not contain a polymer (polymer).

  Further, the present invention is characterized in that the volatile solvent contains neither a Group 17 (halogen) element nor a polymer (polymer).

  In the present invention, a high voltage is applied between a plurality of electrodes on a surface of the component that contacts the printed wiring board.

  In the present invention, the high voltage is a voltage of DC 40 V or higher or an effective value of 40 V or higher.

  Moreover, this invention is a motor or an air conditioner incorporating the printed wiring board as described above.

(Embodiment 1)
FIG. 1 is a cross-sectional view showing the configuration of the printed wiring board according to Embodiment 1 of the present invention. The surface of the base material 7 made of an insulating material typified by an epoxy resin is printed with a copper foil 8. A component 4 typified by a semiconductor integrated circuit includes a plurality of flat electrodes 6 on the back surface of a planar package, and the copper foil 8 and the electrodes 6 are bonded to each other with a bonding material (for example, a solder alloy) 3. Are joined. The base material 7 has a configuration in which a plurality of through holes 5 are provided at a non-joined portion between the copper foil 8 and the electrode 6. The electrode 6a does not need to be joined to the printed wiring on the base material 7, but is an electrode existing in the structure of the component 4.

  The operation of the through hole 5 will be described below. In the process of solder bonding between the electrode 6 of the component 4 and the copper foil 8 on the base material 7, first, a solder paste is printed and applied to a location facing the electrode 6 of the component 4 of the copper foil 8. After the component 4 is placed thereon, it is passed through a heating furnace so that the alloy particles in the solder paste are melted and cooled and solidified to be joined, and the component 4 is mounted.

  The solder paste contains a flux and a volatile solvent 2 in addition to the alloy particles as the main component, and the solvent 2 is vaporized and diffused through the through hole 5 during the heating. Thus, the uncured flux residue does not remain in the space on the surface where the component 4 and the substrate 7 are in contact with each other.

  Therefore, with the configuration in which the through hole 5 is provided, there is an operation and effect that the insulation performance between the plurality of electrodes on the side where the component 4 and the base material 7 are in contact is maintained at a desired value or more. The desired value is preferably a resistance value of 100 MΩ or more when the voltage between the electrodes is DC 40 V or more, or an effective value of 40 V or more.

(Embodiment 2)
FIG. 2 is a plan view showing the configuration of the printed wiring board according to Embodiment 2 of the present invention. A component 4 is mounted on the printed wiring board 1, and a plurality of flat electrodes 6 are provided on the back surface where the component 4 and the printed wiring board 1 are in contact. The copper foil 8 is bonded directly below the electrode 6 via a bonding material (not shown). The copper foil 8 extends from directly below the electrode 6 to the outside of the component 4 to form an electric circuit. The island-like flat electrodes 6a, 6b, 6c, 6d are provided because of the structural necessity of the component 4, and in order to maintain the bonding strength between the component 4 and the printed wiring board 1, The large dimensions 6b, 6c, and 6d are bonded to the copper foil via a bonding material.

  A large number of round holes 5a are provided between the plurality of electrodes 6 and around the island-shaped flat electrodes 6a, 6b, 6c, 6d to penetrate the printed wiring board 1. With the configuration in which the round hole 5a penetrating the printed wiring board 1 is provided, uncured flux residue does not remain as in the first embodiment, and a plurality of electrodes on the surface where the component 4 and the substrate 7 are in contact with each other. Insulation performance has the effect of being maintained at or above a desired value.

  Since the round hole 5a has a round hole shape, it can be arbitrarily penetrated to a desired place by an NC drill, and there is an effect unique to the second embodiment that the processing of the printed wiring board 1 becomes easy.

(Embodiment 3)
FIG. 3 is a plan view showing the configuration of the printed wiring board according to Embodiment 3 of the present invention. FIG. 3 is the same as the second embodiment shown in FIG. 2 except that the shape of the through hole is different. In FIG. 3, a slit 5b provided in a groove shape between a plurality of electrodes forms a through hole. With the configuration in which the slit 5b penetrating the printed wiring board 1 is provided, uncured flux residue does not remain as in the first embodiment, and the insulation between a plurality of electrodes on the surface where the component 4 and the substrate 7 are in contact with each other There is an effect that the performance is maintained at a desired value or more.

  Since the slits 5b are slit-shaped, the locations of the minimum distance between adjacent electrodes are all spaces by through holes, so there is no room for uncured flux residue to remain on the surface of the printed wiring board. There is an effect unique to the third embodiment that the insulation performance between the plurality of electrodes can be easily maintained at a desired value.

(Embodiment 4)
FIG. 4 is a plan view showing the configuration of the printed wiring board according to Embodiment 4 of the present invention. FIG. 4 is the same as Embodiment 2 shown in FIG. 2 except that a square hole 5c that completely exposes the electrode 6a on the opposite side of the component mounting surface of the printed wiring board 1 is newly provided. It is.

In FIG. 4, the electrode 6a is an electrode necessary for the structure of the component 4, and does not need to be joined to the copper foil of the printed wiring board. The electrode 6a is located very close to the upper electrode 6 in the figure, and even if the round holes 5a of the second embodiment are provided on the four sides of the 6a, the place where the substrate of the printed wiring board continues remains, Since there is room for uncured flux residue to remain on the surface of the printed wiring board, as described above, by providing the square holes 5c, all of the electrodes 6a and a part of the adjacent electrodes 6 are spaces formed by through holes. Therefore, there is no room for the uncured flux residue to remain on the surface of the printed wiring board, and there is an effect unique to the fourth embodiment that the insulating performance between the plurality of electrodes can be easily maintained at a desired value.

(Embodiment 5)
FIG. 5 is a plan view showing the configuration of the printed wiring board according to the fifth embodiment of the present invention. 5 is compared with the second embodiment shown in FIG. 2 between the plurality of electrodes 6 and between the island-like flat electrodes 6a, 6b, 6c, and 6d on the component mounting surface of the printed wiring board 1. This is the same except that all the punched holes 5d that are completely exposed on the opposite side are provided integrally.

  In FIG. 5, flat electrodes 6a, 6b, 6c, and 6d are electrodes necessary for the structure of the component 4, and do not need to be joined to the copper foil of the printed wiring board. As described above, by providing all the punched holes 5d, the spaces between the electrodes 6 and the surroundings of 6a, 6b, 6c, 6d are all through-holes, so that the uncured flux residue is formed on the printed wiring board. There is no room left on the surface, and there is an effect unique to Embodiment 5 in that the insulation performance between the plurality of electrodes can be easily maintained at a desired value.

(Embodiment 6)
6A and 6B of the sixth embodiment of the present invention are a measurement diagram and a characteristic diagram of the temperature characteristics of the insulation resistance of the printed wiring board 1. FIG. In FIG. 6 (a), cream solder was applied on the copper foil to the portion where the electrode 6 of the component 4 of the printed wiring board 1 and the copper foil 8 were soldered, and the component 4 was placed on the cream solder. After that, it is heated and melted and solidified. An uncured flux 102 is attached as a residue between the gaps between the copper foils 8 on the left and right sides in the figure, surrounded by the component 4 and the solder 3. Mega (insulation resistance meter) 12 is connected to both ends of the copper foil 8.

  FIG. 6 (b) shows the temperature characteristics of the resistance value between the copper foils measured by the mega 12, and shows the characteristics when using three types of cream solder pastes with different flux solvents. It is. Note that the temperature in FIG. 6B is the uncured flux 102 and its surrounding temperature.

  The solid line A in the figure indicates that the flux solvent does not contain both a halogen element and a polymer material, the one-dot chain line B does not contain a halogen element, and the two-dot chain line C does not contain a polymer material, a broken line D contains both a halogen element and a polymer material.

  Rmax is a resistance value of 100 MΩ or more, for example, the measurement limit value 5000 MΩ of the mega 12. The solid line A stably maintains a constant value Rmax regardless of the temperature up to the upper limit temperature Tmax of the component 4, and the resistance value decreases when reaching a certain transition temperature T3, T2, T1 in the order of B, C, D. End up.

  The characteristic of the said broken line D is the cream solder used for the conventional printed wiring board, and the cream used for the conventional printed wiring board by using the cream solder which shows the characteristic of C or B or A As compared with the case where solder is used, there is an effect unique to the sixth embodiment that a high resistance value can be maintained even at a higher temperature.

  Further, even if the cream solder of the sixth embodiment is used for soldering the printed wiring board provided with various through holes of the first, second, third, fourth or fifth embodiment, further effects can be expected.

(Embodiment 7)
7A, 7B, and 7C are a structure diagram, a circuit diagram, and a characteristic diagram of the motor 13 in which the printed wiring board 1 according to the sixth embodiment is incorporated. In FIG. 7A, a stator 15 is obtained by resin-molding a laminated iron core 14 with a plurality of phases of winding L. The rotor 15 and the printed wiring board 1 are accommodated in the stator 15. The bracket 19 is covered with a lid. The rotor 16 has a structure in which a yoke 21 having a permanent magnet 18 on a shaft 20 and a bearing 17 are provided. A component 4 is soldered and mounted on the printed wiring board 1, and a plurality of through holes 5 are provided on the back surface of the component 4.

  The flux solvent of the cream solder used for soldering the component 4 in the figure may not contain a halogen-based element as shown in the sixth embodiment, or may not contain a polymer material. Alternatively, it may be one containing neither a halogen element nor a polymer material. The shape of the through hole 5 in the figure may be any of those described in the second, third, fourth, or fifth embodiment.

  A component 4 in the figure is an inverter IC, which has a function of converting a DC voltage into a plurality of phases of AC voltage and applying it to the winding L.

  FIG. 7B is a circuit diagram in which the DC power source 23 is connected to the motor 13 via the wattmeter 22. The power meter 22 can measure the input power Pin (W) to the motor 13.

  FIG. 7C is a characteristic diagram showing the relationship between the input power Pin (W) and the temperature rise of the surface of the printed wiring board 1 in contact with the component 4 and its surrounding temperature. The upper limit of the input power of the motor using the printed wiring board according to the sixth embodiment of the present invention will be described below using FIG.

  In FIG. 7 (c), Pin = 0 (W) and the temperature matches the ambient temperature Ta (T = Ta (° C.)). Subsequently, a voltage is applied to the winding L of the motor 13 so that the input power Pin increases and the temperature also increases. However, when the temperature increases, as shown in FIG. 6B of the sixth embodiment, the temperature reaches a transition temperature at which the insulation resistance starts to decrease. The transition temperature varies as T1, T2, and T3 depending on the flux solvent-containing material of cream solder used when the component 4 is joined to the printed wiring board 1. When the insulation resistance is lowered, a current that does not originally flow is generated between copper foils having different voltages on the back surface of the component 4 (not shown), and the component 4 of the printed wiring board 1 does not function normally and enters a failure state.

  In FIG. 7 (c), a, b, and c are those in which the flux solvent of the cream solder used for soldering the part 4 does not contain any halogen element or polymer material, or does not contain any halogen element, It means the upper limit of input power without containing a polymer material, and d means the upper limit of input power in a conventional printed wiring board that contains both a halogen element and a polymer material.

  Compared with d, there is an effect that the upper limit of the input power Pin allows a larger Pin in the order of c, b, and a. In addition, if the flux of the surface which contacts the printed wiring board of the component 4 is fully hardened using the printed wiring board of Embodiment 1 or 2 or 3 or 4 or 5, the same effect as said a is acquired. .

(Embodiment 8)
FIGS. 8A and 8B are a structural diagram of 24 of the eighth embodiment and a plan view when the room air conditioner indoor unit 24 is installed in a room 28 in the house. FIG. 8 (a) shows the internal configuration of the 24, and includes a heat exchanger 25, a shaft and a cross flow fan 26.
The motor 13 and the electrical BOX 27 according to the seventh embodiment provided with the above are the main components. On the other hand, FIG. 8B is a plan view of a room 28 in which the room air conditioner indoor unit 24 of FIG.

  By using the motor of the seventh embodiment for the room air conditioner indoor unit 24, as compared with the motor incorporating the printed wiring board of the conventional example, as shown in FIG. Since input is possible, it becomes possible to adjust air in a larger room.

  The range of X in FIG. 8 (b) shows the range of the air-adjustable room of the room air conditioner indoor unit using the motor incorporating the printed wiring board of the conventional example. The wide range Y indicates the range of the room in which the air conditioner of the room air conditioner indoor unit according to Embodiment 8 of the present invention can be adjusted.

  The present invention is suitable when the printed wiring board is exposed to a high temperature environment, or when the temperature of the mounted component is large and the surface where the component contacts the printed wiring board becomes high. Use of a printed wiring board that embodies the drive device inside the motor, or the motor used in an air conditioner such as a room air conditioner, for example, a device in which another heat generating device such as a heat exchanger is housed in the same housing. A utilization method is suitable. It can also be used for other general electric devices.

1 Printed wiring board 2 Solvent 3 Joining material (solder)
4 Parts 5 Through-hole 5a Round hole 5b Slit 5c Square hole 5d Full hole 6, 6a, 6b, 6c, 6d Electrode 7 Base material 8 Copper foil 13 Motor 24 Room air conditioner indoor unit 102 Uncured flux

Claims (13)

A printed wiring board in which a part having a structure in which a plurality of electrodes are arranged around the back surface of a planar package and at least one island-like flat electrode is provided is bonded using a bonding material containing a volatile solvent. And
The printed wiring board is provided with a land made of copper foil at a position facing the electrode in the mounting range of the component, and further, an insulating region between the copper foils stretched on the printed wiring board at a location on the back side of the component A printed wiring board with through holes that are not copper plated. In the process of joining the component and the printed wiring board, the volatile solvent is vaporized and discharged to the outside through the through hole from a narrow space on a surface where the component is joined to the printed wiring board. Printed wiring board. The printed wiring board according to claim 1, wherein the shape of the through hole is a round hole. The printed wiring board according to claim 1, wherein the shape of the through hole is a long hole or a slit shape. The position of the through hole is provided at a position where an electrode that is not joined to the printed wiring board among one or a plurality of electrodes on the surface of the component that contacts the printed wiring board exists. 5. The printed wiring board according to claim 1, wherein an electrode that is not bonded is exposed through the through hole on a side opposite to the printed wiring board of the component. The position of the through hole is provided at a position where an electrode that is not joined to the printed wiring board among one or a plurality of electrodes on a surface of the component that is in contact with the printed wiring board exists. 5. The printed wiring board according to claim 1, wherein a part of the electrode to be bonded is exposed through the through hole on a side opposite to the printed wiring board of the component. Between the plurality of electrodes on the surface in contact with the printed wiring board of the component, and among the electrodes, all the portions that are not joined to the printed wiring board have the through holes on the anti-joining side of the printed wiring board. The printed wiring board according to claim 3 or 4, wherein the printed wiring board is exposed through the wiring board. The printed wiring board according to any one of claims 1 to 7, wherein the volatile solvent does not contain a Group 17 (halogen) element. The printed wiring board according to any one of claims 1 to 7, wherein the volatile solvent does not contain a polymer (polymer). The printed wiring board according to any one of claims 1 to 7, wherein the volatile solvent contains neither a Group 17 (halogen) element nor a polymer (polymer). . The printed wiring board according to any one of claims 1 to 10, wherein a high voltage is applied between a plurality of electrodes on a surface in contact with the printed wiring board of the component. The printed wiring board according to claim 11, wherein the high voltage is a voltage of DC 40 V or higher or an effective value of 40 V or higher. A motor or an electric device in which the printed wiring board according to claim 1 is incorporated.