JP2013001048A - Apparatus and method for welding resin plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for welding resin plates in which a melt zone of a front surface side is narrowed by shifting a part becoming hottest by means of dielectric heating to a back surface side to prevent a concavity from generating on the front surface side.SOLUTION: The apparatus for welding resin plates welds a welding objective of at least two resin plates 1 with front surfaces aligned and each having a predetermined thickness by applying dielectric heating to a part where their end faces 1a abut each other, and includes: facing electrodes 411, 4221 for dielectric heating with long bodies having predetermined thicknesses and whose end faces face each other the resin plates 1; and a heat-bearing layer material 413 disposed on the back surfaces of the resin plates 1 held by the facing electrodes 411, 4221.

Description

  The present invention relates to an apparatus and a method for supplying high-frequency power between opposing electrodes and welding resin plates between end faces by dielectric heating.

  Conventionally, for example, using an intaglio original engraved with image lines of securities, etc., press transfer technology to a resin plate, technology to accurately cut to a predetermined size, and end face joining technology between multiple resin plates A multi-sided plate making method for making a multi-sided resin plate is known (Patent Document 1). And a printing plate is created from this multi-sided resin plate, and it is used for a printing process, and many printed matter (the said securities) is obtained. In Patent Document 2, as a method of welding the multi-sided resin plate, a plurality of resin plates having a relief printed on the front surface are prepared, and the end faces of each other, that is, the state where the sides are abutted with each other are prepared. In addition, it is described that this butted portion is pressed and sandwiched between upper and lower electrodes, subjected to dielectric heating, and welded.

JP 2010-253880 A Japanese Patent No. 4649627

  Patent Document 2 discloses a structure of an upper electrode and a lower electrode for solving the conventional problem that a dent is formed on the front surface because the front surface cools and solidifies later than the back surface at the butt portion. Proposed. More specifically, the lower electrode in contact with the back surface side of the resin plate has a structure including the upper end surface of the upright plate-like electrode and the heat retaining resin portions on the left and right sides thereof, while the resin plate The upper electrode that is in contact with the front surface (upper surface) side has a structure having an upper surface that contacts a wider surface by horizontally bending the lower portion of the electrode having a plate shape. With this structure, when the dielectric plate is subjected to the dielectric heat treatment, the resin plate is melted in a substantially V-shaped cross-sectional area at the butt portion, and then, after the dielectric heat treatment, the resin plate is more than the lower surface surrounded by the heat retaining resin The front side is cooled quickly and solidified by utilizing heat radiation from the upper electrode having a wide contact surface. As a result, a recess is formed on the back surface side of the resin plate, and the formation of the recess on the front surface side is prevented.

  However, in Patent Document 2, while the structure around the electrodes is devised in order to give a time difference in cooling between the front side and the back side of the resin plate, the melting region of the resin plate by dielectric heating is Since it is a substantially V-shaped cross-sectional area that is sufficiently or rather wide to the front surface side, it is in contact with the lower surface of the upper electrode by clamping with a predetermined pressing force from the upper electrode at the time of melting In addition, there is a possibility that a mark corresponding to the shape of the electrode is formed as a stepped depression.

  The present invention has been made in view of the above, and does not use the time difference of solidification, but by displacing the part that becomes the highest temperature due to dielectric heating to the back side of the resin plate, It is an object of the present invention to provide a resin plate welding apparatus and method for reducing the size of the area and preventing the depression on the front surface.

  The invention according to claim 1 is a resin plate welding in which at least two resin plates to be welded having a predetermined thickness whose front surfaces are aligned are welded by applying dielectric heating to the butted portions of the end surfaces. In the apparatus, each is a long body having a required thickness, and the end surfaces are opposed to each other with a counter electrode for dielectric heating arranged across the resin plate, and a back surface of the resin plate held between the counter electrodes. And a heat carrying layer material to be laid.

  Further, the invention according to claim 8 is a resin for welding by subjecting at least two resin plates to be welded having a predetermined thickness with the front surfaces aligned to each other to a portion where the end faces are subjected to dielectric heating. In the plate welding method, the resin plate is placed between the opposing electrodes for dielectric heating, each of which is a long body having a required thickness, and the end surfaces are opposed to each other, and the thickness of each end surface of the counter electrode is the butted portion. The high frequency power is supplied between the counter electrodes in a state of being sandwiched in a state of being aligned within the vertical dimension and having a heat carrying layer material laid on the back surface of the resin plate.

  First, a general internal temperature distribution of an object to be heated by dielectric heating will be described. Usually, when a high-frequency power is supplied between electrodes, a heating target having a required thickness interposed between the electrodes is heated internally by the amount of heat corresponding to the dielectric loss, and the internal temperature rises. On the other hand, since the electrode itself does not generate heat, the internal temperature of the object to be heated is low on both surface sides in contact with the electrode, the inside becomes high, and the central portion mainly becomes high.

  On the other hand, according to the present invention, in addition to the resin plate having a predetermined thickness to be welded, a heat-carrying layer material is laid on the back surface side between the opposing electrodes. When dielectric heating is performed, the resin plate and the heat-carrying layer material are heated and each rises to a required temperature. At this time, the internal temperature distribution of the resin plate is relatively low because the front side is in contact with the counter electrode and receives heat transfer (heat escapes), while the back side is the heat carrying layer. Since it is in contact with the material, it becomes the heat generation temperature or heat retention temperature of the heat carrying layer material, that is, the temperature is raised on the back surface side. Accordingly, the portion where the temperature is increased inside the resin plate is displaced to a portion closer to the back surface than the center position in the thickness direction by the amount of the temperature increase due to the heat carrying layer material. By displacing the high-temperature part to a part close to the back surface, at the abutting part of the end face of the resin plate, the back surface side is sufficiently melted (a sufficient region), while the front surface side is relatively narrow. It is possible to perform melting in the region, that is, to the extent that the end faces can be welded. Therefore, during solidification, regardless of the solidification time difference between the front surface side and the back surface side, even if a dent due to shrinkage may occur on the back surface, the dent also has a step on the front surface side. Will hardly occur. The heat carrying layer material may be preliminarily laid or may be preliminarily prepared and laid during the dielectric heating process.

  Invention of Claim 2 was equipped with the deformation | transformation absorption layer material laid in the front surface of the said resin board of the state clamped by the said counter electrode in the resin plate welding apparatus of Claim 1. Features. The invention according to claim 9 is the resin plate welding method according to claim 8, wherein a deformation absorbing layer material is laid on the front surface of the resin plate sandwiched between the counter electrodes. . According to this configuration, the front side of the resin plate is kept smooth. That is, the end surface of the electrode facing the front surface of the counter electrodes comes into contact with the front surface of the abutting portion of the resin plate. The end face of the electrode does not necessarily have high flatness, and considering the use over time, it may be somewhat uneven, and in such a case, the resin plate is directly on the end face of the electrode. In the contact mode, the unevenness of the electrode end face may be transferred to the surface melted by dielectric heating although it is partially. It can be said that this is hardly a problem if the pressing force is appropriate when the surface of the front surface is controlled to a suitable narrow region, the electrode end surface has high flatness. On the other hand, by laying the deformation absorbing layer material, even if the above aspect is not perfect, the unevenness of the electrode end surface is absorbed by the deformation absorbing layer material and is not transferred to the front surface of the resin plate. In addition, the edge of the electrode end face is not transferred to the front surface of the resin plate as a step. Furthermore, when an insulating material that is flush with the electrode end surface is provided as an auxiliary material on the side wall of the electrode on the front surface side, the edge of the insulating material is transferred as a step to the surface of the resin plate. It will not happen. The deformation absorber is preferably a material having rigidity, hardness, and heat resistance. For example, a thin layer material or a film-like material such as polyimide and polyethylene terephthalate (PET) is preferable.

  According to a third aspect of the present invention, in the resin plate welding apparatus according to the first or second aspect, the heat carrying layer material is a dielectric. According to such a configuration, the temperature rises to the required temperature by self-heating at the time of dielectric heating, so that the temperature increase is actively realized.

  According to a fourth aspect of the present invention, in the resin plate welding apparatus according to the first or second aspect, the heat carrying layer material is a material having a high thermal conductivity. According to such a configuration, regardless of whether it is dielectric heating or external heating, heat generation is facilitated, so that raising the temperature is effective.

  A fifth aspect of the present invention is the resin plate welding apparatus according to any one of the first to fourth aspects, wherein the heat carrying layer material has a predetermined thickness. According to such a configuration, by setting the amount of heat as a required amount, it is possible to set a raised temperature (in consideration of heat dissipation), and it is possible to adjust a portion where the temperature of the resin plate becomes high to a desired portion close to the back surface side. It becomes possible. As a result, it becomes possible or easy to adjust the front surface of the resin plate to a relatively low temperature, that is, to adjust the melting region on the front surface to a narrowest possible region.

  The invention according to claim 6 is the resin plate welding apparatus according to any one of claims 1 to 5, wherein the resin plate is a thermoplastic resin material, and the heat carrying layer material is a fluororesin. Features. According to such a configuration, when, for example, polyvinyl chloride is employed as the thermoplastic resin material, the melting point is 180 ° C., whereas, for example, Teflon (registered trademark) is employed as the fluororesin. In this case, since the melting point is 300 ° C. or higher and the dielectric constant (that is, dielectric loss) is low, the heat carrying layer material does not melt when the butted portion of the resin plate is melted. There is no inconvenience that the materials adhere.

  A seventh aspect of the present invention is the resin plate welding apparatus according to any one of the first to sixth aspects, wherein the counter electrodes have substantially the same end face thickness. According to such a configuration, effective or intensive melting can be performed on the abutting portion between the end faces of the resin plate, and generation of dents is prevented as much as possible because an unnecessary melting region is not formed. It also leads to power saving.

  According to the present invention, the region where the highest temperature is generated by dielectric heating is displaced to the back side of the resin plate, thereby narrowing the melting region on the front side and preventing the depression on the front side. can do.

It is a top view which shows schematic structure which shows one Embodiment of the resin board welding apparatus which concerns on this invention. It is a front view which shows schematic structure which shows one Embodiment of the resin board welding apparatus which concerns on this invention. It is a left view which shows schematic structure which shows one Embodiment of the resin board welding apparatus which concerns on this invention. It is a top view which shows the arrangement | positioning mounting state of the several resin board. It is a partial cross section figure which shows the detailed structure of an electrode structure part. It is a figure which shows the temperature gradient at the time of dielectric heating, (a) shows the temperature gradient when the heat carrying layer material is laid, (b) shows the temperature gradient when the heat carrying layer material is not laid. ing.

  1 to 3 are schematic configuration diagrams showing an embodiment of a resin plate welding apparatus according to the present invention. FIG. 1 is a plan view, FIG. 2 is a front view, and FIG. 3 is a left side view. FIG. 4 is a plan view showing an arrayed state of a plurality of resin plates.

  As shown in these drawings, the resin plate welding apparatus includes a robust main body 10 made of metal or the like for supporting each processing unit for performing a welding process. As each process part for performing a welding process, the mounting part 20 which arranges and mounts the some resin board 1, the transfer part 30 which transfers the mounting part 20, and the end surface of the arranged resin board 1 A welding portion 40 is provided for welding the butted portions of each other. The main body 10 is for supporting each processing unit, and various shapes and structures can be adopted. In this embodiment, a structure in which a plurality of frames are assembled is adopted. The main body 10 includes a frame body portion 11 that supports the placement portion 20 and a frame body portion 12 that supports the welding portion 40. As can be seen from FIG. 2, the frame body portion 11 and the frame body portion 12 are adjacent to each other in the horizontal direction, for example, and are integrally configured. The transfer part 30 is arranged between the frame part 11 and the frame part 12. Each of the frame body portions 11 and 12 has a substantially square frame body parallel to each other through the upright support and a plurality of steps assembled at a predetermined distance in the vertical direction. In the present embodiment, the frame body portion 11 has a two-stage configuration, and the frame body portion 12 has a three-stage configuration. A plurality of girders 121 (see FIG. 1) are hung on the uppermost stage of the frame body portion 12, and an upper electrode portion 42 and the like to be described later are supported on the girders 121.

  The mounting portion 20 is for positioning and mounting a predetermined number of resin plates 1 in a matrix. As shown in FIG. 4, the mounting portion 20 includes a planar mounting plate 21 having a substantially square shape made of a metal material such as aluminum, a stepped portion 22 with a raised peripheral edge of the mounting plate 21, and a mounting portion 20. Positioning and fixing plates 231 and 232 provided on two orthogonal sides of the mounting plate 21, and positioning slide plates 241 and 242 that are opposed to the positioning and fixing plates 231 and 232 and are slidable in the contact and separation directions.

  4 (similarly in FIG. 1), it can also be described as a plan view of the mounting plate 21 itself (see FIG. 5 for a sectional view), but in the following, a plurality of resin plates 1 and the like are placed on the mounting plate 21. It is described as an arrayed state. A resin plate 1 having a predetermined size and a predetermined shape (mainly a quadrangle) is arranged in, for example, a matrix in the central area of the upper surface of the mounting plate 21, and a dummy resin plate 1 f is disposed around the front, rear, left and right sides thereof. Yes. Here, the resin plate 1 and the dummy resin plate 1f are made of, for example, a vinyl chloride material. The resin plate 1 is assumed to have a predetermined size, for example, a centimeter (cm) order to a few tens of centimeters (cm) order. In this embodiment, the length and width are several centimeters and tens of centimeters. The thickness is 0. Several millimeters to several millimeters are assumed, and in this embodiment, it is a general 0.7 mm. In the present embodiment, the resin plate 1 is a 6 × 4 rectangular resin plate 1 arranged in a matrix, and a dummy resin plate 1f is arranged around the resin plate 1. The dummy resin plate 1f is used for finishing the peripheral portion of the multi-sided resin plate after welding into a welded state similar to that of the inner end surface 1a, and is adopted as necessary in consideration of applications and the like.

  In this arrangement, the positioning slide plates 241 and 242 are moved to and away from the opposing positioning fixing plates 231 and 232, so that all the resin plates 1 are positioned at predetermined positions in a state where the end surfaces 1a are in contact (butting) with each other. Is done. On the mounting plate 21, direction regulating guides 241a and 242a for sliding the positioning slide plates 241 and 242 in the contact / separation direction are provided. Further, the mounting plate 21 is provided with position deviation regulating members 241b and 242b for regulating the position deviation of the positioning slide plates 241 and 242 in a state where the positioning slide plates 241 and 242 are positioned. As the positional deviation regulating members 241b and 242b, known mechanical locking members can be adopted, or the positional deviation regulation can be performed by applying an urging force using an air cylinder or the like.

  The mounting plate 21 has a required number of suction holes 25 in the range of the planned mounting position of the resin plate 1. In this embodiment, each suction hole 25 is formed from the upper surface of a heat-carrying layer material 413 (described later) to the back side of the mounting plate 21, and is further connected to a compressor (not shown) via a communication tube (not shown). In this case, the resin plate 1 placed on the placement plate 21 is sucked from the back surface, thereby preventing turning and the like and ensuring the positional accuracy. The suction hole 25 is also provided on the dummy resin plate 1f side.

  The mounting plate 21 constitutes a part of the lower electrode portion 41 of the welding portion 40. The structure of the lower electrode part 41 will be described later.

  The transfer unit 30 includes a support unit 31 on which the mounting unit 20 is mounted, a lifting unit 32 that is disposed below the support unit 31 and lifts the mounting unit 20 above the support unit 31, and the support unit 31 as a frame. A movement mechanism unit 33 that moves between the body unit 11 and the frame body unit 12 and a movement drive unit 34 for applying a movement force to the support unit 31 via the movement mechanism unit 33 are provided.

  The support portion 31 has an annular body 311 having an area slightly smaller than the square of the mounting plate 21. At least two alignment structures (not shown) are employed on the upper surface around the annular body 311 and at the position facing the appropriate position on the lower surface of the mounting plate 21 (or the position facing the stepped portion 22). . A well-known alignment structure can be employed, and although not shown, for example, one pin is erected downward on the lower surface of the mounting plate 21 (or stepped portion 22), while the annular body 311 is provided. A structure in which two alignment holes are perforated at a circumferential position at a central angle of 90 degrees on the upper surface is preferable. According to this, by placing one pin on the placement unit 20 side into each alignment hole, the placement unit 20, that is, the resin plate 1 placed on the placement unit 20 is oriented in the 90 ° direction. It is possible to change the orientation and maintain the orientation.

  The elevating part 32 is below the annular body 311, and is at least one, in this case, two cylinders, at a suitable position around the disk-shaped horizontal substrate 320 fixed to the frame body 11 and the horizontal substrate 320. 321 is attached in the vertical direction. A plunger 322 can be projected and retracted from the top of the cylinder 321. An elevating plate 326 oriented horizontally is attached to the upper end of the plunger 322 so that it can be moved up and down integrally with the elevating of the plunger 322. The lifting mechanism is not limited to the cylinder 321 and may be another known driving mechanism. Further, the horizontal substrate 320 has three or more, and here four caster bases 323 extending in the vertical direction on the circumference of a predetermined radius from the center of the annular body 311 (inside the ring of the annular body 311). It is attached toward. The caster base 323 is a cylindrical body, and a slide shaft 324 that can be projected and retracted from the upper part is fitted therein. A caster 325 is attached to the upper end of the slide shaft 324 so as to be driven around a horizontal axis. The rotation axis of the caster 325 is directed to the center of the annular body 311. By adopting such a structure, the plunger 322 is raised (the engagement between the pin and the positioning hole is disengaged), and the caster 325 is lifted upward from the inner gap of the annular body 311 to lift the mounting portion 20. In this state, when a rotational force in the circumferential direction is applied to the mounting portion 20, the caster 325 rolls to change the orientation of the mounting portion 20 relative to the support portion 31, that is, the orientation of the resin plate 1 by 90 degrees. It becomes possible to change. Then, when the plunger 322 is lowered, the pin and the new positioning hole are inserted and the position in the direction shifted by 90 degrees is locked.

  The moving mechanism unit 33 includes two linear guides 331 arranged between the frame units 11 and 12 and parallel to each other, and a bottom plate disposed on the back surface of the support unit 31, that is, on the inner part of the annular body 311. And a movable body 332 that is fitted to and slides on the linear guide 331, and is disposed between the frame body portions 11 and 12, and is a long ball screw parallel to the linear guide 331. A portion 333 and a female screw portion 334 which is attached to an appropriate position of the bottom plate of the annular body 311 and is screwed to the ball screw portion 333. In the present embodiment, there are two linear guides 331, which are arranged in parallel with each other with a predetermined distance apart on a horizontal plane.

  According to this structure, when the ball screw portion 333 rotates, the turning force is transmitted to the support portion 31 via the female screw portion 334, and the support portion 31 and the placement portion 20 placed thereon are linearly guided. It moves along 331.

  The movement drive unit 34 is attached to the frame body unit 12 and applies a rotational force to the ball screw unit 333. The movement drive unit 34 is interposed between a first operation unit 341 and a second operation unit 342 which are, for example, handles, which can be operated from the outside, and between the first operation unit 341 and the second operation unit 342 and the ball screw unit 333. And a rotational force transmission mechanism 343 that transmits the rotational force from the first operation unit 341 and the second operation unit 342 to the ball screw unit 333 via a plurality of gear stages. Note that the first operation unit 341 and the second operation unit 342 have a gear ratio within the two-path transmission system, so that the first operation unit 341 is for high-speed movement, and the second operation unit 342 is for low-speed movement. That is, it is used for accuracy (positioning) (the second operation unit 342 is omitted in FIG. 2). For example, if a one-way clutch or the like is interposed on the second operation unit 342 side, rotation during operation of the first operation unit 341 can be prevented. According to such a structure, when the first operating portion 341 is operated, the rotational force is transmitted to the ball screw portion 333 via the rotational force transmitting mechanism portion 343. As a result, the placement portion 20 can be quickly moved in the left-right direction in FIG. Moving. The second operation unit 342 can be accurately positioned at the welding position by being used for fine alignment after the placement unit 20 has been transferred to the welding unit 40 side.

  The welding part 40 includes a lower electrode part 41, an upper electrode part 42, and a console-type power supply part 43 including an oscillator and an operation part that generate a high-frequency current (electric power). The upper electrode part 42 includes an elevating part 421 attached to an upper beam 121 of the frame part 12, and an electrode constituting part 422 supported by the elevating part 421. Although various drive mechanisms can be employed for the elevating part 421, in this embodiment, a cylinder is employed, and a plunger 4212 is arranged to be able to protrude and retract downward from the lower end of the cylinder body 4211. Further, the elevating part 421 is provided with a pair of elevating guide parts 4213 and 4214 on both sides of the cylinder facing downward. In FIG. 2, the front elevation guide portion 4214 is omitted for convenience. A horizontal support plate 4215 is attached to the lower ends of the plunger 4212 and the lifting guide portions 4213 and 4214. The raising / lowering guide parts 4213 and 4214 are formed with a cylindrical part at the attachment part to the frame part 12, and a slide bar is slidably fitted to the cylindrical body. Accordingly, the slide rods of the lifting guide portions 4213 and 4214 are lifted and lowered in conjunction with the raising and lowering of the plunger 4212. As a result, the support plate 4215 attached thereto is lifted and lowered while maintaining a horizontal posture. A plurality of support columns 4216 made of an insulating material are erected in the vertical direction below the support plate 4215, and a metal support 4217 that supports the electrode component 422 is attached to the lower end thereof. The support portion 4217 is a long body having a length corresponding to the length of the electrode constituent portion 422, for example, a slightly longer size, and a conductive portion 4218 for connecting a high-frequency power conductor at a central position in the length direction. Is provided.

  As shown in FIG. 3, the electrode configuration unit 422 applies one line of the maximum dimension (including the dummy resin plate 1 f) to the plurality of resin plates 1 arranged on the mounting plate 21 at a time. It has a long dimension that can be dielectrically heated.

  FIG. 5 is a partial cross-sectional view showing the detailed structure of the electrode component. FIG. 5 exaggerates the thickness direction for convenience of explanation. In FIG. 5, the electrode component portion 422 of the upper electrode portion 42 includes an electrode plate 4221 protruding downward from the support portion 4217, and an auxiliary plate made of a resin such as an epoxy resin disposed on both side surfaces of the electrode plate 4221. 4222 and a connector 4223 such as a bolt and nut for connecting the auxiliary plate 4222 to the electrode plate 4221. The electrode plate 4221 is a long metal body having a length corresponding to the one line, and the width, that is, the thickness of the lower end surface is preferably about several millimeters. In this embodiment, about 3 mm is adopted. . Each auxiliary plate 4222 has the same length as the electrode plate 4221, and the thickness is set to a dimension including a region width that is softened during dielectric heating, and in this embodiment, 5 mm each.

  The lower electrode portion 41 is formed on the upper surface of the mounting plate 21 in the present embodiment. As shown in FIG. 4, the lower electrode portion 41 is provided in a region that covers at least the placement surfaces of the plurality of resin plates 1 and dummy resin plates 1 f arranged on the placement plate 21. The lower electrode portion 41 includes a metal electrode plate 411 disposed corresponding to the electrode plate 4221, an auxiliary plate 412 made of a resin such as an epoxy resin disposed on both side surfaces of the electrode plate 411, and an electrode plate 411 and the auxiliary plate 412 have a heat-carrying layer material 413 such as Teflon (registered trademark), and a fastener 414 such as a bolt and nut for fixing the electrode plate 411 to the mounting plate 21. ing. The mounting plate 21 made of aluminum is the ground side for high-frequency current.

  The electrode plate 411 uses a relationship in which the arrangement positions of the resin plate 1 and the dummy resin plate 1f placed on the placement plate 21 are determined in advance, and has a length shape corresponding to the determined arrangement. Is formed. That is, as shown in FIG. 4, the planar shape of the electrode plate 411 is along the abutting position of the resin plates 1 and the end surfaces 1a of the resin plate 1 and the dummy resin plate 1f (and FIG. 5). ing. The electrode plate 411 is set to be the same as or slightly narrower than the electrode plate 4221, and in this embodiment, the thickness of the upper end surface is set to about 2 mm, that is, not much different from the electrode plate 4221 or slightly narrower. As shown by a broken line in FIG. 5, when the electrode plate 4221 and the electrode plate 411 are opposed to each other, the resin plates 1 to be welded (also between the resin plate 1 and the dummy resin plate 1f) are positioned at intermediate positions in the thickness dimension. The end face 1a is positioned.

  The electrode plate 411 is fastened to the mounting plate 21 via a fastener 414 at a bent lower portion 4111. The attachment structure of the electrode plate 411 to the mounting plate 21 is not limited to this embodiment, and various methods such as a form of engaging with the auxiliary plate 412 can be employed. The auxiliary plate 412 is laid on both side surfaces of the electrode plate 411 and bonded to the mounting plate 21, for example. Note that a notch for the fastener 414 is formed on one side of the auxiliary plate 412, for example, on the right side of FIG. 5.

  Further, the lower electrode portion 41 is not limited to the structure provided on the mounting plate 21. For example, the mounting plate 21 may be a member on the lower side of the broken line shown in FIG. 5, while the upper side of the broken line may be the lower electrode substrate 41a. Can be manufactured in advance on a flexible substrate 41a.

  The heat-carrying layer material 413 is laid so as to cover the upper surface of the electrode plate 411 and the upper surface of the auxiliary plate 412, and the end surfaces 1a of the resin plate 1 (and the dummy resin plate 1f) to be welded are joined together during dielectric heating. It is laminated in a region and a region that is melted or softened by dielectric heating. The heat-carrying layer material 413 has a predetermined width, for example, a width of about 50 mm, on both sides of the butted portion between the end faces 1a. In FIG. 4, a portion indicated by a broken line illustrates a part of the laying region of the heat carrying layer material 413. The heat carrying layer material 413 exhibits a function of carrying heat as will be described later, and may be a material that self-heats by dielectric heating, or receives the amount of heat generated by the resin plate 1 (or other external heating). It may be a material with good thermal conductivity that does not release heat. In this embodiment, Teflon (registered trademark) such as a fluororesin having a required thickness is employed. The thickness is related to the amount of heat carried (temperature), and is about 0.5 mm here. Note that the heat-carrying layer material 413 is not limited to the upper surface of the electrode plate 411 and a partial upper surface of the auxiliary plate 412, and may be laid on the entire surface. In this case, laying work becomes easy.

  At the time of the dielectric heating process, the electrode component 422 is lowered by the elevating cylinder 421 and sandwiched between the lower electrode 41 and the resin plate 1 and pressed with a required pressure. The deformation absorbing layer material 44 is interposed between the electrode plate 4221 and the resin plate 1 to be welded during dielectric heating, and traces of pressing of the electrode plate 4221 and the auxiliary plate 4222 due to melting or softening of the resin plate 1, Specifically, this is to prevent a step from occurring. The deformation absorbing layer material 44 is preferably a heat-resistant material having a required thickness, excellent strength and rigidity, and required elasticity. In this embodiment, a polyimide film is used. Although the thickness depends on the pressing force of the electrode plate 4221, the strength of the material, the elasticity, and the hardness, it is preferably several μm to several hundred μm, more preferably several tens of μm, and in this embodiment about 25 μm. Yes.

  Then, the placement unit 20 on which a plurality of resin plates 1 or the like to be welded are arranged and placed is transferred to the position of the welding unit 40 by the moving mechanism unit 33 and the movement driving unit 34, and the upper electrode unit 42 is moved up and down. After being lowered onto the deformation absorbing layer material 44 laid on the resin plate 1 by the cylinder 421, the power supply unit 43 is driven. The power supply unit 43 includes a power supply unit, a high-frequency unit that generates a high-frequency current having a predetermined frequency of, for example, 10 MHz to 40 MHz from the power supply unit, and an operation unit. The operation unit includes an operation unit such as a button for performing an operation instruction to each drive unit and a starting instruction for dielectric heating processing, in addition to enabling setting of a supply power level and a power supply time per one time. The supplied power is the processing length when the line length is different between the processing on the end surface 1a of the resin plate 1 and the dummy resin plate 1f and the processing on the end surface 1a between the resin plates 1 (in the vertical and horizontal directions). The power corresponding to the dimension is set in advance. The magnitude of the electric power is adjusted by the supply level or the supply time so as to make the melting zone uniform.

  FIG. 6 is a diagram showing a temperature gradient during dielectric heating, FIG. 6 (a) shows a temperature gradient when a heat carrying layer material is laid, and FIG. 6 (b) is a drawing showing a heat carrying layer material. It shows the temperature gradient when not. The electrode plate 4221 has a width of 3 mm, the electrode plate 411 has a width of 2 mm, the resin plate 1 has a thickness of 0.7 mm, and the heat-carrying layer material 413 has a thickness of 0.5 mm (only in FIG. 6A). And based on the structure of FIG.

  First, dielectric heating means that when a high-frequency current is supplied to a dielectric material typified by a resin, the direction of the electric field is alternately reversed, so that the poles of the molecules of the dielectric repeatedly alternate, and the internal heating according to the dielectric loss. This generates heat. A thermoplastic resin such as polyvinyl chloride (PVC) having a large dielectric loss is considered a suitable material.

  In FIG. 6B, when a high frequency voltage is applied between the electrode plate 4221 and the electrode plate 411, that is, when high frequency power is supplied, the resin plate 1 causes internal heating. Then, a temperature gradient is generated in the thickness direction according to the boundary conditions on both side surfaces of the resin plate 1. The temperature gradient is such that the opposing surfaces of the upper and lower electrode plates 411 and 4221 do not increase in temperature, and the heat of the internal heating of the resin plate 1 is radiated at a position in contact with the electrode plates 411 and 4221, Is relatively low. Therefore, in the thickness direction of the resin plate 1, as shown by the temperature gradient Td in FIG. 6B, the middle position is the highest temperature position P, and the temperature decreases from there to both the upper and lower surfaces. . At the abutting portion between the end faces 1a of the resin plate 1, the position where the temperature is highest is the middle position in the thickness direction, so that the upper and lower surfaces are close and the upper and lower surfaces are sufficiently melted. As a result, the front surface side is also sufficiently melted, so that dents are likely to occur due to thermal contraction during cooling and solidification after dielectric heating. Assuming the case where the deformation absorbing layer material 44 is laid in FIG. 6B, the cooling and solidification on the front surface side may be slower than the back surface side. There is a risk that a dent will occur on the front surface.

  On the other hand, in FIG. 6A, when the heat-carrying layer material 413 is laid, the result of heat generation by self-heating or heat conduction by dielectric heating (Teflon (registered trademark) has a low dielectric constant and generates heat by heat transfer). ), The heat carrying layer material 413 has a predetermined temperature. Then, when the temperature gradient Td in the thickness direction of the resin plate 1 is observed, the front surface is in contact with the electrode plate 4221, so that the temperature is relatively low, while the back surface is in contact with the heat carrying layer material 413. , Raised to a predetermined temperature. Therefore, the side closer to the heat carrying layer material 413 in the thickness direction of the resin plate 1 has the highest temperature (maximum temperature position P), and the distance from the position P to the front surface is increased. The temperature at is lower than that in FIG. Or it becomes easy to implement | achieve by adjusting supply electric power so that it may become low temperature. Therefore, the resin plate 1 can be melted to the extent that the back surface side is most melted and the front surface side is welded at least at the abutting portion between the end surfaces 1a. Thus, by displacing the hottest portion in the resin plate 1 to the back side in the thickness direction, it is possible to limit or adjust the melting region of the front surface to the butted portion of the end faces 1a. Become. Therefore, since the melting region and the melting amount can be suppressed as much as possible, the heat shrinkage can be almost eliminated.

  6 compares the temperature gradient in the presence or absence of the heat-carrying layer material 413 or the melting state in the thickness direction, and the presence or absence of the deformation absorbing layer material 44 is irrelevant. In order to indicate that either of them may be used, parentheses are added to the corresponding symbol “44”.

  Next, a series of operations for manufacturing a multi-faced resin plate will be described.

  A plurality of resin plates 1 (and dummy resin plates 1 f) are placed on the placement plate 21 in the orientation of FIG. 1, positioned, and welded by a transfer unit 30 that is operated in response to an operation to the movement drive unit 34. It is transferred to a predetermined position of the unit 40. In this state, the upper electrode portion 42 is lowered and comes into contact with the abutting portion between the end faces 1a of the resin plate 1 (and the resin plate 1 and the dummy resin plate 1f) with a required pressure. Subsequently, the welding part 40 is driven, the power supply part 43 is driven, and dielectric heating is performed for a predetermined time. In the example of FIG. 4, the transfer unit 30 positions the upper electrode portion 42 with respect to the long line I1 (see FIG. 4), which is the end surface 1a with the rightmost dummy resin plate 1f. High power high frequency is supplied. When the power supply is finished, the upper electrode part 42 is raised, then the movement drive part 34 is operated, the line I2 is positioned directly below the upper electrode part 42, the upper electrode part 42 is lowered, and in this state the line I1 and The same level of high frequency power is supplied. When the power supply is completed, the upper electrode part 42 is raised, and then the movement drive part 34 is operated to position the line I3 directly below the upper electrode part 42 and the upper electrode part 42 is lowered. Low power high frequency is supplied. Similarly, the supply of high-frequency power is repeated with the lines L4,.

  When the supply processing of the high frequency power to the final line is finished, the upper electrode part 42 is raised, and the movement driving part 34 is operated to return the mounting plate 21 to the frame part 11. At the position of the frame body part 11, the mounting plate 21 is lifted by the elevating part 32, rotated 90 ° (for example, rotated counterclockwise in FIG. 4), and lowered to the original position. Subsequently, the movement drive unit 34 is operated to move to the frame body 12 side, and high-frequency power is supplied in the order of line K1, line K2,. The amount of power supplied to the line K side is adjusted and set in advance corresponding to the length of the line I side. The supply of high-frequency power to all the lines K is completed, and a multi-sided resin plate is produced.

  In addition, the following aspects are employable for this invention.

(1) This embodiment relates to the production of stamps of valuable printed matter such as securities, but may also be valuable printed matter such as stock certificates and gift certificates, and can also be applied to printed matter that is not limited to valuable materials. It is.

(2) In the present embodiment, the placement unit 20 and the transfer unit 30 are not necessarily essential. For example, a structure provided with the mounting plate 21 and the upper and lower electrode portions 41 and 42 may be used. Further, the arrangement of the resin plates 1 is not limited to a matrix, and an arrangement according to the required form of the multi-sided resin plate can be employed.

(3) The deformation absorbing layer material 44 is not necessarily essential, but by providing the deformation absorbing layer material 44, the uniformity of the front surface of the resin plate 1 can be improved.

(4) Although the maximum temperature position P (see FIG. 6) is displaced from the position closer to the back side of the resin plate 1 by the heat carrying layer material 413, the closer to the back surface, the greater the distance from the front surface. Therefore, it becomes easy to adjust the melting region of the front surface. In addition, on the back side, in the range where other influences such as bending do not occur, the melting region may be wide to some extent, so only the melting region on the front surface side needs to be considered, and power adjustment is easy accordingly. Become.

DESCRIPTION OF SYMBOLS 1 Resin board 1a End surface 20 Mounting part 30 Transfer part 40 Welding part 41 Lower electrode part 411 Electrode plate (counter electrode)
412 Auxiliary plate 413 Heat-carrying layer material 42 Upper electrode portion 4221 Electrode plate (counter electrode)
4222 Auxiliary plate 44 Deformation absorbing layer material

Claims (9)

In the resin plate welding apparatus for welding the resin plates to be welded at least two sheets having a predetermined thickness with the front surfaces aligned by applying dielectric heating to the butted portions of the end surfaces,
Each of the elongated bodies each having a required thickness, the end faces of which are opposed to each other with the resin plate interposed therebetween, and a counter electrode for dielectric heating,
A resin plate welding apparatus comprising: a heat carrying layer material laid on the back surface of the resin plate in a state of being sandwiched between the counter electrodes.   The resin plate welding apparatus according to claim 1, further comprising a deformation absorbing layer material laid on a front surface of the resin plate sandwiched between the counter electrodes.   The resin plate welding apparatus according to claim 1, wherein the heat carrying layer material is a dielectric.   The resin plate welding apparatus according to claim 1, wherein the heat carrying layer material is a material having high thermal conductivity.   The resin plate welding apparatus according to claim 1, wherein the heat carrying layer material has a predetermined thickness.   The resin plate welding apparatus according to claim 1, wherein the resin plate is a thermoplastic resin material, and the heat carrying layer material is a fluororesin.   The resin plate welding apparatus according to any one of claims 1 to 6, wherein the counter electrodes have substantially the same end face thickness. In the resin plate welding method in which the resin plates to be welded having a predetermined thickness with the front surfaces aligned are welded by applying dielectric heating to the butted portions of the end surfaces,
The resin plate is positioned between the opposing electrodes for dielectric heating, each of which is a long body having a required thickness, and the end surfaces are opposed to each other, and the butted portion is positioned within the thickness dimension of each end surface of the counter electrode. A resin plate welding method characterized in that high frequency power is supplied between the counter electrodes in a state where the heat carrying layer material is laid on the back surface of the resin plate while being sandwiched together.   The resin plate welding method according to claim 8, wherein a deformation absorbing layer material is laid on the front surface of the resin plate sandwiched between the counter electrodes.

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