CN217389149U

CN217389149U - Positioning and adjusting device of hot melting machine

Info

Publication number: CN217389149U
Application number: CN202220882550.0U
Authority: CN
Inventors: 成文平
Original assignee: Suzhou Ruhui Electromechanical Equipment Co ltd
Current assignee: Suzhou Ruhui Electromechanical Equipment Co ltd
Priority date: 2022-04-15
Filing date: 2022-04-15
Publication date: 2022-09-06
Anticipated expiration: 2032-04-15

Abstract

The utility model provides a pair of hot melt machine positioning control device, it includes that at least two sets of processing units set up in the both sides of support body to set up in the top at PCB base plate both sides. The first motor of the adjusting unit rotates to drive the support arranged on the first screw rod to move. And the relative movement of the position of the processing unit is realized through the contraction and extension of the output end of the second air cylinder. And the processing unit is driven to move rapidly by the rotation of the first motor. Thus, the processing unit can be moved to the relative position of the PCB substrate with the width dimension. And set up the second cylinder on the support and be connected with the processing unit through the output, to processing unit position adjustment make two sets of processing units can transversely align centrally to the PCB base plate, guarantee to the holistic heating of whole PCB base plate and exert pressure evenly. Meanwhile, the whole applicability of the equipment is improved by adjusting the PCB substrates with different specifications and sizes, the hot melting equipment is suitable for incoming materials of the same specification batch by one-time adjustment, and the hot melting efficiency is improved.

Description

Positioning and adjusting device of hot melting machine

Technical Field

The utility model relates to a hot melt machine technical field specifically is a hot melt machine positioning control device.

Background

When manufacturing a main substrate for producing a PCB substrate, a hot melting machine is required to perform hot melting lamination of multiple layers of different materials. The principle is that a layer of heated and melted substance is attached to a PCB substrate, when the PCB substrate is processed, copper foil needs to be attached to the PCB substrate, after the PCB substrate is melted in a heating mode, pressure is applied to the PCB substrate to press the copper foil into the PCB substrate, and then the PCB substrate is cooled and shaped.

In the prior art, multiple layers of PCB substrates are mostly stacked and then sent into a heating cavity of a hot melting machine, and a heating head is pressed down to heat the PCB substrates and apply pressure so as to transfer heat to the multiple layers of PCB substrates. The applicant finds that during the processing operation of the PCB substrate, the position of the heating head and the PCB substrate is relatively fixed, so that the PCB substrate is heated unevenly when the heating head is deviated to one side of the PCB substrate. Resulting in excessive heating of the PCB substrate on one side to cause melting defects and insufficient heating of the other side to cause insufficient melting. Meanwhile, the pressure applied to the PCB substrate by the heating head is not uniform, and the position or angle deviation of the multilayer overlapped PCB substrate is easy to occur, so that the processing quality of the PCB substrate is influenced. And the PCB substrates in different batches have different specifications and sizes, the positions of the PCB substrates in different batches need to be manually adjusted, the efficiency is low, and the equipment universality is poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a hot melt machine positioning control device, its purpose provides a positioning control device, removes the position of processing unit through the regulating unit for parts including heating device can remove the relative position of adjustment processing unit and PCB base plate, guarantees to the heating of PCB base plate and apply pressure evenly, promotes the hot melt quality of PCB base plate.

In order to achieve the above object, the utility model provides a following technical scheme:

a positioning and adjusting device of a hot melting machine, which comprises a frame body,

the processing unit is used for conducting heat to the PCB substrate in a contact mode;

an adjusting unit for adjusting the position of the processing unit;

and the pressing unit is used for fixing the position of the PCB substrate.

Preferably, the frame body comprises a first frame body and a second frame body, and the adjusting unit is arranged on the first frame body and the second frame body.

Preferably, the adjusting unit comprises a first motor, an output end of the first motor is connected with a first screw rod, a support is in threaded connection with the first screw rod, a moving plate is connected onto the support, a second cylinder is arranged on the moving plate, and an output end of the second cylinder is connected with the processing unit and used for adjusting the position of the processing unit.

Preferably, the output end of the first motor is further connected with a driving wheel, the surface of the driving wheel is in transmission connection with the surface of the driving wheel through a belt, the driving wheel is connected to the second frame body through a connecting piece, and the axis of the driving wheel is connected with a second screw rod.

Preferably, the pressing unit comprises a pushing cylinder, the output end of the pushing cylinder is in threaded connection with a first adjusting rod, the first adjusting rod is connected with a first fixing and pressing plate, the pushing cylinder is connected with a cylinder plate, and the cylinder plate is connected to the frame body.

Preferably, the processing unit comprises a heating device, a cooling device and a driving device, the heating device is used for heating the PCB substrate in a contact mode, the cooling device is used for cooling and shaping the contact part of the heating device, and the driving device is used for driving the heating device and the cooling device to move up and down.

Preferably, the driving device comprises a third cylinder and a fourth cylinder, the third cylinder is connected with the heating device, and the fourth cylinder is connected with the cooling device.

Preferably, the heating device comprises a heating head, a heating frame is arranged on the heating head, the heating frame is connected with the output end of the third cylinder, a first limiting rod is connected to the heating frame, an upper pressing plate is connected to the surface of the first limiting rod in a sliding mode, and the upper pressing plate is connected with the output shaft of the second cylinder.

Preferably, the cooling device comprises a cooling plate, a second limiting rod is connected to the cooling plate, the surface of the second limiting rod is in sliding connection with the upper pressure plate, and the cooling plate is connected with an output shaft of the fourth cylinder.

Compared with the prior art, the beneficial effects of the utility model are that:

the positioning and adjusting device of the hot melting machine comprises at least two groups of processing units, wherein the two groups of processing units are arranged on two sides of a frame body and are arranged above two sides of a PCB (printed circuit board) substrate. A first motor of the adjusting unit rotates to drive a support with threads arranged on the first screw rod to move. And the relative movement of the position of the processing unit is carried out through the contraction and extension of the output end of the second air cylinder. The first motor rotates to drive the processing unit to move rapidly, so that the processing unit can be moved rapidly to the relative position of the PCB substrate with the width size. And set up the second cylinder on the support and be connected with the processing unit through the output, to processing unit position adjustment make two sets of processing units can transversely align centrally to the PCB base plate, guarantee to the holistic heating of whole PCB base plate and exert pressure evenly. Meanwhile, the whole applicability of the equipment is improved by adjusting the PCB substrates with different specifications and sizes, the equipment is suitable for incoming materials in batches with the same specification by one-time adjustment, and the hot melting efficiency is improved. Meanwhile, the cylinder of the pressing unit is used for controlling the fixing pressing plate to be pressed on the PCB substrate in a telescopic mode, so that the stability of the PCB substrate in the hot melting process is improved, and the PCB substrate is prevented from being influenced by the displacement in the operation process.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural diagram of an adjusting unit in the present invention;

fig. 3 is a schematic structural position diagram of the middle pressing unit of the present invention;

fig. 4 is a schematic structural diagram of the middle processing unit of the present invention.

In the figure: 1. a first frame body; 2. a second frame body; 3. an adjustment unit; 31. a first motor; 32. a drive wheel; 33. a belt; 34. a driving wheel; 35. a second lead screw; 36. a first lead screw; 37. a support; 38. moving the plate; 39. a second cylinder; 4. a heating head; 5. a pressing unit; 51. a push cylinder; 52. a cylinder plate; 53. adjusting a rod I; 54. fixing and pressing the plate; 6. a processing unit; 61. an upper pressure plate; 62. a third cylinder; 63. a fourth cylinder; 64. a cooling plate; 65. a second limiting rod; 66. a heating rack; 67. and a first limiting rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1-4, the present invention provides a technical solution:

the processing unit 6 is used for conducting heat to the PCB substrate in a contact mode;

an adjusting unit 3 for adjusting the position of the processing unit 6;

and the pressing unit 5 is used for fixing the position of the PCB substrate.

In this embodiment, the frame body includes a first frame body 1 and a second frame body 2, and the adjusting unit 3 is disposed on the first frame body 1 and the second frame body 2.

As shown in fig. 1, the two sets of processing units 6 are respectively disposed on two sides of the first frame body 1 and the second frame body 2. After being laminated, the general PCB substrates are placed between the heating heads 4 which are symmetrically arranged up and down of the processing unit 6, the heating heads 4 move up and down by the force provided by the pushing air cylinder 51 of the pressing unit 5, pressure is applied to the laminated PCB substrates, and the heating heads 4 heat the contact parts of the laminated PCB substrates to realize hot melting.

The processing unit 6 comprises a heating device, a cooling device and a driving device, wherein the heating device is used for heating the PCB substrate in a contact mode, the cooling device is used for cooling and shaping the contact part of the heating device, and the driving device is used for driving the heating device and the cooling device to move up and down.

Heating device including heating head 4, be provided with heating frame 66 on heating head 4, heating frame 66 is connected with third cylinder 62's output, be connected with gag lever post 67 on the heating frame 66, the surperficial sliding connection of gag lever post 67 has top board 61, top board 61 is connected with the output shaft of second cylinder 39, carry out the surface meltable material of contact hot melt PCB base plate and press the copper foil in the molten material through heating head 4 and PCB base plate, make holistic PCB base plate carry out the hot melt and become whole. And synchronous contact heating about adopting for holistic PCB base plate heating is more quick, and efficiency is higher, and a plurality of gag lever posts that set up also provide spacing effect, avoids heating head 4 position excursion appearing at the in-process that removes, influences the condition of PCB base plate heating.

Cooling device including the cooling plate 64, be connected with gag lever post two 65 on the cooling plate 64, the surface and the top board 61 sliding connection of gag lever post two 65, cooling plate 64 and fourth cylinder 63's output shaft, carry out cold contact through the cooling plate 64 and the heating part that set up, come to carry out rapid cooling's effect to this position, avoid in process of production, this department regional overheated unable in time cooling leads to warping the condition on limit, influence the whole quality of PCB base plate.

The driving device comprises a third cylinder 62 and a fourth cylinder 63, the third cylinder 62 is connected with the heating device, the fourth cylinder 63 is connected with the cooling device, and driving force is provided by the third cylinder 62 and the fourth cylinder 63 so as to drive the heating device and the cooling device to move up and down to be in contact with the surface of the PCB substrate.

In the present embodiment, the processing unit 6 composed as above is subjected to position movement by the adjusting unit 3. And two sets of adjusting units 3 correspond to two sets of processing units 6. Any one group of adjusting units 3 comprises a first motor 31, the output end of the first motor 31 is connected with a first screw rod 36, a support 37 is connected to the first screw rod 36 in a threaded manner, a moving plate 38 is connected to the support 37, a second air cylinder 39 is arranged on the moving plate 38, and the output end of the second air cylinder 39 is connected with the processing unit 6 and used for adjusting the position of the processing unit 6. The first screw rod 36 is driven to rotate by the driving of the first motor 31, and the whole processing unit 6 is driven to move rapidly by the threaded connection mode. When the processing unit 6 needs to be further adjusted in a smaller range, the support 37 is connected with a moving plate 38, the moving plate 38 is provided with a second cylinder 39, the output end of the second cylinder 39 is connected with the processing unit 4, and the processing unit 4 is driven to be adjusted in a smaller range through the expansion and contraction of the output end. The output end of the first motor 31 is further connected with a driving wheel 32, the surface of the driving wheel 32 is in transmission connection with the surface of a driving wheel 34 through a belt 33, the driving wheel 34 is connected to the second frame body 2 through a connecting piece, the axis of the driving wheel 34 is connected with a second screw rod 35, synchronous movement of the upper position and the lower position is achieved through a belt transmission mode, synchronization can also be achieved through a chain transmission mode, the consistency of the upper position and the lower position is ensured, and heating efficiency is prevented from being influenced by dislocation of the upper heating head 4 and the lower heating head 4.

The pressing unit 5 comprises a pushing cylinder 51, an adjusting rod 53 is connected to the output end of the pushing cylinder 51 in a threaded mode, a fixing pressing plate 54 is connected to the adjusting rod 53, a cylinder plate 52 is connected to the pushing cylinder 51, the cylinder plate 52 is connected to the frame body, the fixing pressing plate 54 is controlled to be pressed on the PCB substrate in a telescopic mode through the pushing cylinder 51, stability of the PCB substrate in the hot melting process is improved, and the PCB substrate is prevented from being machined due to the fact that the PCB substrate is displaced in the operation process.

The utility model discloses a hot melt machine positioning control device is when using to the basic horizontal central line of PCB aligns the line for centering. The first motor 31 of the adjusting unit 3 rotates to drive the processing units 6 to move rapidly, and then the output end of the air cylinder 39 stretches and retracts to adjust the positions of the processing units 6 so that the two processing units 6 are aligned relative to the centering alignment line. The heating head 4 of the processing unit 6 after centering uniformly applies heat energy and pressure to the PCB substrate so as to improve the hot melting quality. And according to the specification of the PCB substrate, the hot melting device is adaptive to adjustment so as to achieve the purpose of improving the hot melting efficiency and improve the overall applicability of the device. Receive the effect of belt 33 simultaneously for the processing unit 6 of bottom also can be driven to second lead screw 35 on the second support body 2 carries out synchronous motion, realizes two-way synchronous motion's effect, makes the processing operation in-process, heats PCB base plate upper and lower synchronous position, improves the efficiency of heating. When the processing unit 6 moves to a proper position, the pushing cylinder 51 is controlled to be pressed downwards at the moment, so that the fixed pressing plate 54 is pressed on the upper surface of the PCB substrate to compress and fix the position of the PCB substrate, the situation of displacement in the heating and cooling process is avoided, then the synchronous relative movement of the plurality of third cylinders 62 is controlled, the heating head 4 is contacted with the upper surface and the lower surface of the PCB substrate, the power is supplied for heating, after the heating is completed, the third cylinders 62 contract and reset, then the second cylinders 39 contract to contract the cooling plate 64 to be above the heating position of the heating head 4, the fourth cylinders 63 are started to extend, so that the cooling plate 64 moves to the heating position of the heating head 4 for cooling, and the effect of heating and cooling displacement conversion is achieved, and the processing unit is convenient and fast.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a hot melt machine positioning control device which characterized in that: comprises a frame body and a plurality of supporting legs,

the PCB substrate processing device comprises at least two groups of processing units (6), wherein the two groups of processing units (6) are arranged on two sides of the frame body, each group of processing units (6) comprises a heating device, a cooling device and a driving device, the heating device is used for heating a PCB substrate in a contact mode, the cooling device is used for cooling and shaping the contact part of the heating device, and the driving device is used for driving the heating device and the cooling device to move up and down;

the adjusting unit (3) comprises a first motor (31), the output end of the first motor (31) is connected with a first screw rod (36), a support (37) is connected to the first screw rod (36) in a threaded manner, a moving plate (38) is connected to the support (37), a second air cylinder (39) is arranged on the moving plate (38), and the output end of the second air cylinder (39) is connected with the processing unit (6) and used for adjusting the position of the processing unit (6);

and the pressing unit (5) is used for fixing the position of the PCB substrate.

2. The hot melt machine positioning adjustment device according to claim 1, characterized in that: the support body includes first support body (1) and second support body (2), regulating unit (3) set up between first support body (1) and second support body (2).

3. The hot melt machine positioning adjustment device according to claim 1, characterized in that: the output end of the first motor (31) is further connected with a driving wheel (32), the surface of the driving wheel (32) is in transmission connection with the surface of a driving wheel (34) through a belt (33), the driving wheel (34) is connected onto the second frame body (2) through a connecting piece, and a second screw rod (35) is connected to the axis of the driving wheel (34).

4. The hot melt machine positioning adjustment device according to claim 1, characterized in that: the pressing unit (5) comprises a pushing cylinder (51), the output end of the pushing cylinder (51) is in threaded connection with a first adjusting rod (53), the first adjusting rod (53) is connected with a fixed pressing plate (54), and the pushing cylinder (51) is connected with a cylinder plate (52).

5. The hot melt machine positioning adjustment device according to claim 1, characterized in that: the driving device comprises a third cylinder (62) and a fourth cylinder (63), the third cylinder (62) is connected with the heating device, and the fourth cylinder (63) is connected with the cooling device.

6. The hot melt machine positioning adjustment device according to claim 1, characterized in that: heating device is including heating head (4), be provided with heating frame (66) on heating head (4), heating frame (66) are connected with the output of third cylinder (62), be connected with gag lever post (67) on heating frame (66), the surperficial sliding connection of gag lever post (67) has top board (61), the output shaft of top board (61) and second cylinder (39).

7. The hot melt machine positioning adjustment device according to claim 1, characterized in that: the cooling device comprises a cooling plate (64), a second limiting rod (65) is connected to the cooling plate (64), the surface of the second limiting rod (65) is in sliding connection with the upper pressure plate (61), and the cooling plate (64) is connected with an output shaft of the fourth cylinder (63).