CN113210786B - Single-sided circuit board SMT reflow soldering production process and equipment - Google Patents
Single-sided circuit board SMT reflow soldering production process and equipment Download PDFInfo
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- CN113210786B CN113210786B CN202110479346.4A CN202110479346A CN113210786B CN 113210786 B CN113210786 B CN 113210786B CN 202110479346 A CN202110479346 A CN 202110479346A CN 113210786 B CN113210786 B CN 113210786B
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- circuit board
- plate
- bottom plate
- rod
- base
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- 238000005476 soldering Methods 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 230000001105 regulatory effect Effects 0.000 claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 18
- 238000001125 extrusion Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of circuit board production, in particular to a single-sided circuit board SMT reflow soldering production process and equipment; the top cover is fixedly connected with the base, the guide rail is movably connected with the base and is positioned between the base and the top cover, a placing groove is formed in the top end of the bottom plate, the two adjusting plates are fixedly connected with the bottom plate and are positioned in the placing groove, the two supporting frames are fixedly connected with the bottom plate and are positioned above the bottom plate, each supporting frame is provided with a rectangular hole, and the two pressing rods are movably connected with the corresponding supporting frames respectively; through the position of adjusting the regulating plate, change the size of standing groove for the circuit board closely fits in the standing groove, and the bottom plate supports the circuit board bottom surface, and the depression bar supports the circuit board top surface, makes the deflection after the circuit board is heated reduce, thereby improves product quality.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a single-sided circuit board SMT reflow soldering production process and equipment.
Background
Reflow soldering, which is used for melting soldering paste to firmly bond the surface assembly components and the circuit board together, and the used equipment is a reflow soldering furnace which is positioned behind a chip mounter in an SMT production line.
At present, in the conventional reflow soldering, glue is coated on four corners of one surface of a jointed board, and then a circuit board is fixed on the upper part, so that the fixation is not firm, and the circuit board is easy to deform in the heating process.
Disclosure of Invention
The invention aims to provide a single-sided circuit board SMT reflow soldering production process and equipment, and aims to solve the technical problem that in the prior art, glue is coated on four corners of one surface of a jointed board, then the circuit board is fixed above the jointed board, and the circuit board is easy to deform in the heating process.
In order to realize the aim, the invention provides a single-sided circuit board SMT reflow soldering production process, which comprises the following steps:
clamping a circuit board to be processed by using a clamping plate;
putting the clamped circuit boards on a guide rail of a reflow oven one by one;
preheating, heat preservation, welding and cooling by using a reflow furnace;
and cleaning and drying the welded circuit board by using a cleaning machine to finish processing.
The circuit board is fixed through the clamping plate, so that the circuit board is prevented from being deformed by heating, the step of trimming is omitted, and the production efficiency is improved.
The invention also provides production equipment adopting the single-sided circuit board SMT reflow soldering production process, which comprises a reflow soldering furnace and a clamping plate, wherein the reflow soldering furnace comprises a base, a top cover and a guide rail, the top cover is fixedly connected with the base and is positioned above the base, the guide rail is movably connected with the base and is positioned between the base and the top cover, the number of the clamping plates is multiple, and each clamping plate is respectively movably connected with the guide rail and is respectively positioned above the guide rail;
the grip block includes bottom plate, regulating plate, support frame and depression bar group, the top of bottom plate is provided with the standing groove, the quantity of regulating plate is two, two the regulating plate all with bottom plate fixed connection, and all be located the inside of standing groove, the quantity of support frame is two, two the support frame all with bottom plate fixed connection, and all be located the top of bottom plate, every the support frame all is provided with the rectangular hole, the quantity of depression bar group is two, two the depression bar group respectively with correspond support frame swing joint, and be located the correspondence respectively the below of support frame, every the depression bar group comprises a plurality of depression bars, the quantity of depression bar is two at least, every the depression bar respectively with correspond support frame swing joint to be located the correspondence respectively the inside in rectangular hole.
Through adjusting the position of regulating plate, change the size of standing groove for the circuit board closely fits in the standing groove, the bottom plate supports the bottom surface of circuit board, the pressure bar supports the top surface of circuit board, makes the deflection of circuit board after being heated reduce, thereby improves product quality.
The clamping plate comprises a bottom plate and a clamping groove, wherein the bottom plate is provided with a rectangular hole, the rectangular hole is located at the bottom of the placing groove, the clamping plate further comprises a cross supporting plate, and the cross supporting plate is fixedly connected with the bottom plate and located in the rectangular hole.
The cross support plate is used for strengthening the support of the bottom surface of the circuit board, and the bottom surface of the circuit board is partially exposed in the air through the rectangular hole, so that hot air generated by the reflow soldering furnace can be contacted with the bottom surface of the circuit board, and the circuit board is heated more uniformly.
Wherein, single face circuit board SMT reflow soldering's production facility, the top of cross backup pad is provided with a plurality of mounting grooves, the bottom plate still includes the magnet piece, the quantity of magnet piece is a plurality of, every the magnet piece all with cross backup pad fixed connection to be located the correspondence respectively the inside of mounting groove.
The magnetic blocks are utilized to generate magnetic force to the circuit board, and the adsorption force of the clamping plate to the circuit board is increased.
The bottom plate is provided with two through holes and two first threaded holes, the two through holes are located in the inner side wall of the placing groove, the two first threaded holes are located in the outer side wall of the bottom plate, and the two through holes are respectively communicated with the corresponding first threaded holes.
The through hole is used for installing the transmission rod, and the first threaded hole is used for installing the extrusion plate.
Wherein, every the regulating plate all includes first threaded rod, transfer line and stripper plate, first threaded rod with bottom plate threaded connection, and be located in the first threaded hole, the transfer line with through-hole swing joint, and be located the inside of through-hole, the stripper plate with transfer line fixed connection, and be located the side of transfer line, and be located the inside of standing groove.
By rotating the first threaded rod, the transmission rod drives the extrusion plate to move, so that the size of the placing groove is changed.
According to the single-sided circuit board SMT reflow soldering production process and the single-sided circuit board SMT reflow soldering production equipment, a preheating area, a heat preservation area, a welding area and a cooling area are sequentially arranged in a reflow soldering furnace, a circuit board is fixed on a clamping plate before soldering is conducted, then the circuit board is placed above a guide rail, the size of a placing groove is changed by adjusting the position of an adjusting plate, the circuit board is tightly attached to the placing groove, the bottom plate supports the bottom surface of the circuit board, and the pressing rod supports the top surface of the circuit board, so that the deformation of the circuit board after being heated is reduced, and the product quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of the steps of the single-sided circuit board SMT reflow soldering production process provided by the invention.
FIG. 2 is a schematic structural diagram of a single-sided circuit board SMT reflow soldering production apparatus provided by the invention.
Fig. 3 is a top view of the clamping plate of the present invention.
Fig. 4 is a cross-sectional view of a clamping plate of the present invention.
Fig. 5 is a cross-sectional view of the support bracket of the present invention.
FIG. 6 is a cross-sectional view of an adjustment lever of the present invention
1-reflow oven, 11-base, 12-top cover, 13-guide rail, 2-clamping plate, 21-bottom plate, 211-placing groove, 212-rectangular hole, 213-through hole, 214-first threaded hole, 22-adjusting plate, 221-first threaded rod, 222-transmission rod, 223-extrusion plate, 23-supporting frame, 24-pressure rod, 241-a moving cylinder, 2411-a limiting groove, 242-an L-shaped rod, 243-a limiting ring, 244-an adjusting rod, 2441-a rod body, 2442-a second threaded rod, 2443-a pressing block, 2444-a second threaded hole, 25-a cross supporting plate, 251-a mounting groove, 26-a magnet block, 3-a cleaning machine, 4-an air duct, 5-a fan and 6-a valve.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1, the invention provides a single-sided circuit board SMT reflow soldering production process, comprising the following steps:
s1, clamping the circuit board to be processed by using a clamping plate;
s2, placing the clamped circuit boards on the guide rails of a reflow oven one by one;
s3, preheating, preserving heat, welding and cooling the aluminum alloy by using a reflow oven;
and S4, cleaning and drying the welded circuit board by using a cleaning machine to finish the processing.
In the embodiment, the circuit board is fixed through the clamping plate, so that the circuit board is prevented from being deformed by heating, a trimming step is omitted, and the production efficiency is improved.
Referring to fig. 2 to 6, the invention further provides a production apparatus using the single-sided circuit board SMT reflow soldering production process, where the production apparatus includes a reflow soldering oven 1 and clamping plates 2, the reflow soldering oven 1 includes a base 11, a top cover 12 and guide rails 13, the top cover 12 is fixedly connected to the base 11 and is located above the base 11, the guide rails 13 are movably connected to the base 11 and are located between the base 11 and the top cover 12, the number of the clamping plates 2 is multiple, and each clamping plate 2 is respectively movably connected to the guide rails 13 and is respectively located above the guide rails 13; the clamping plate 2 comprises a bottom plate 21, two adjusting plates 22, two supporting frames 23 and two pressing rod groups, wherein a placing groove 211 is formed in the top end of the bottom plate 21, the number of the adjusting plates 22 is two, the two adjusting plates 22 are fixedly connected with the bottom plate 21 and are respectively located in the placing groove 211, the number of the supporting frames 23 is two, the two supporting frames 23 are fixedly connected with the bottom plate 21 and are respectively located above the bottom plate 21, each supporting frame 23 is provided with a rectangular hole 212, the number of the pressing rod groups is two, the two pressing rod groups are respectively movably connected with the corresponding supporting frames 23 and are respectively located below the corresponding supporting frames 23, each pressing rod group is composed of a plurality of pressing rods, the number of the pressing rods 24 is at least two, and each pressing rod 24 is respectively movably connected with the corresponding supporting frame 23, and are respectively located inside the corresponding rectangular holes 212.
In this embodiment, the top cover 12 is provided with a heating component and an air-cooling component, the base 11 is provided with a water-cooling component, the reflow furnace 1 is internally provided with a preheating zone, a heat preservation zone, a welding zone and a cooling zone in sequence, before welding, a circuit board is fixed on the clamping plate 2 and then placed above the guide rail 13, and the guide rail 13 sequentially conveys the circuit board to four zones for processing; the size of the placing groove 211 is changed by adjusting the position of the adjusting plate 22, so that the circuit board is tightly attached to the placing groove 211, the bottom plate 21 supports the bottom surface of the circuit board, and the pressing rod 24 supports the top surface of the circuit board, so that the deformation of the circuit board after being heated is reduced, and the product quality is improved.
Further, the bottom plate 21 is provided with a rectangular hole 212, the rectangular hole 212 is located at the bottom of the placing groove 211, the clamping plate 2 further comprises a cross support plate 25, and the cross support plate 25 is fixedly connected with the bottom plate 21 and located inside the rectangular hole 212; in the single-sided circuit board SMT reflow soldering apparatus, a plurality of mounting grooves 251 are disposed at the top end of the cross support plate 25, the bottom plate 21 further includes a plurality of magnet blocks 26, the number of the magnet blocks 26 is multiple, and each magnet block 26 is fixedly connected to the cross support plate 25 and is respectively located inside the corresponding mounting groove 251.
In the present embodiment, the cross support plate 25 is used to strengthen the support for the bottom surface of the circuit board, and the bottom surface of the circuit board is partially exposed to the air through the rectangular hole 212, so that the hot air generated by the reflow oven 1 can contact with the bottom surface of the circuit board, and the circuit board is heated more uniformly; the magnetic force generated by the magnet block 26 on the circuit board increases the adsorption force of the clamping plate 2 on the circuit board, thereby reducing the deformation of the circuit board.
Further, the bottom plate 21 is provided with two through holes 213 and two first threaded holes 214, the two through holes 213 are located on the inner side wall of the placing groove 211, the two first threaded holes 214 are located on the outer side wall of the bottom plate 21, and the two through holes 213 are respectively communicated with the corresponding first threaded holes 214; each adjusting plate 22 includes a first threaded rod 221, a driving rod 222 and a pressing plate 223, the first threaded rod 221 is in threaded connection with the bottom plate 21 and is located in the first threaded hole 214, the driving rod 222 is movably connected with the through hole 213 and is located inside the through hole 213, and the pressing plate 223 is fixedly connected with the driving rod 222 and is located on the side of the driving rod 222 and is located inside the placing groove 211.
In this embodiment, the through hole 213 is used for mounting the driving rod 222, and the first threaded hole 214 is used for mounting the pressing plate 223; by rotating the first threaded rod 221, the first threaded rod 221 is displaced laterally while rotating along the threaded hole, so as to push the transmission rod 222 to move along the through hole 213, and drive the extrusion plate 223 to move, thereby changing the size of the placing groove 211.
Further, each of the pressure levers 24 includes a moving cylinder 241, an L-shaped lever 242, a limiting ring 243 and an adjusting lever 244, the moving cylinder 241 is fixedly connected to the supporting frame 23 and located above the supporting frame 23, the L-shaped lever 242 is rotatably connected to the moving cylinder 241 and located below the moving cylinder 241, a limiting groove 2411 is formed in the moving cylinder 241, the limiting ring 243 is fixedly connected to the L-shaped lever 242 and located in the limiting groove 2411, and the adjusting lever 244 is fixedly connected to the L-shaped lever 242 and located at the bottom of the L-shaped lever 242.
In this embodiment, the moving cylinder 241 tightly presses the rectangular hole 212, so that displacement is not easily generated without an external force, the limit ring 243 tightly presses the limit groove 2411, and the L-shaped lever 242 is not easily rotated without an external force, so that the moving cylinder 241 is pushed along the rectangular hole 212 to drive the adjusting lever 244 under the L-shaped lever 242 to move, the L-shaped lever 242 is rotated to drive the adjusting lever 244 to rotate, and contact points of the adjusting lever 244 and a circuit board are staggered with welding points under combined action.
Further, the adjusting rod 244 includes a rod body 2441, a second threaded rod 2442 and a pressing block 2443, the rod body 2441 is fixedly connected to the L-shaped rod 242 and is located at the bottom of the L-shaped rod 242, a second threaded hole 2444 is formed in the top end of the rod body 2441, the second threaded rod 2442 is in threaded connection with the rod body 2441 and is located inside the second threaded hole 2444, and the pressing block 2443 is fixedly connected to the second threaded rod 2442 and is located below the second threaded rod 2442.
In this embodiment, after the adjusting rod 244 is adjusted to a proper position, the second threaded rod 2442 is rotated, and the threaded rod rotates and drives the pressing block 2443 to move downward until contacting the circuit board, so that the circuit board is supported by pressing at multiple points, and the deformation of the circuit board is reduced.
Furthermore, single face circuit board SMT reflow soldering's production facility still includes circuit board cleaning machine 3, air duct 4, fan 5 and valve 6, the one end of air duct 4 with top cover 12 fixed connection, the other end of air duct 4 with circuit board cleaning machine 3 fixed connection, and be located top cover 12 with between the circuit board cleaning machine 3, fan 5 with air duct 4 fixed connection, and be located the inside of air duct 4, valve 6 with air duct 4 swing joint, and be located the side of fan 5.
In this embodiment, after the reflow oven 1 stops working and the circuit board is cleaned by the cleaning machine 3, the valve 6 is opened, the fan 5 is started to guide the heat remaining in the reflow oven 1 into the cleaning machine 3 to dry the circuit board, and energy is saved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. A production device for single-sided circuit board SMT reflow soldering is characterized in that,
the single-sided circuit board SMT reflow soldering production equipment comprises a reflow soldering furnace and a clamping plate, wherein the reflow soldering furnace comprises a base, a top cover and a guide rail, the top cover is fixedly connected with the base and positioned above the base, the guide rail is movably connected with the base and positioned between the base and the top cover, the number of the clamping plates is multiple, and each clamping plate is respectively movably connected with the guide rail and respectively positioned above the guide rail;
the clamping plate comprises a bottom plate, two adjusting plates, two supporting frames and two pressure rod groups, wherein a placing groove is formed in the top end of the bottom plate, the two adjusting plates are fixedly connected with the bottom plate and are located inside the placing groove, the two supporting frames are fixedly connected with the bottom plate and are located above the bottom plate, each supporting frame is provided with a rectangular hole, the two pressure rod groups are movably connected with the corresponding supporting frames respectively and are located below the corresponding supporting frames respectively, each pressure rod group is composed of a plurality of pressure rods, the number of the pressure rods is at least two, and each pressure rod is movably connected with the corresponding supporting frame and is located inside the corresponding rectangular hole respectively;
the press rods support the top surface of the circuit board, each press rod comprises a moving cylinder, an L-shaped rod, a limiting ring and an adjusting rod, the moving cylinder is fixedly connected with the supporting frame and is positioned above the supporting frame, the L-shaped rod is rotatably connected with the moving cylinder and is positioned below the moving cylinder, a limiting groove is formed in the moving cylinder, the limiting ring is fixedly connected with the L-shaped rod and is positioned in the limiting groove, the adjusting rod is fixedly connected with the L-shaped rod and is positioned at the bottom of the L-shaped rod, the moving cylinder is pushed along the rectangular hole to drive the adjusting rod below the L-shaped rod to move, the adjusting rod is driven to rotate by rotating the L-shaped rod, and under the combined action of the rotating of the L-shaped rod, the contact point of the adjusting rod and the circuit board is staggered with the welding point;
the production process comprises the following steps: the top cover is provided with a heating component and an air cooling component, the base is provided with a water cooling component, a preheating zone, a heat preservation zone, a welding zone and a cooling zone are sequentially arranged in the reflow soldering furnace, a circuit board is fixed on the clamping plate before being welded and then placed above the guide rail, and the guide rail sequentially conveys the circuit board to the preheating zone, the heat preservation zone, the welding zone and the cooling zone for preheating, heat preservation, welding and cooling; and cleaning and drying the welded circuit board by using a cleaning machine to finish processing.
2. An SMT reflow manufacturing apparatus for a single-sided circuit board according to claim 1,
the clamping plate comprises a base plate and a clamping plate, wherein the base plate is provided with a rectangular hole, the rectangular hole is located at the bottom of the placing groove, the clamping plate further comprises a cross supporting plate, and the cross supporting plate is fixedly connected with the base plate and located inside the rectangular hole.
3. An SMT reflow manufacturing apparatus for a single-sided circuit board according to claim 2,
single face circuit board SMT reflow soldering's production facility, the top of cross backup pad is provided with a plurality of mounting grooves, the bottom plate still includes the magnet piece, the quantity of magnet piece is a plurality of, every the magnet piece all with cross backup pad fixed connection to be located the correspondence respectively the inside of mounting groove.
4. An SMT reflow manufacturing apparatus for a single-sided circuit board according to claim 3,
the bottom plate is provided with two through holes and two first threaded holes, the two through holes are located in the inner side wall of the placing groove, the two first threaded holes are located in the outer side wall of the bottom plate, and the two through holes are respectively communicated with the corresponding first threaded holes.
5. An SMT reflow manufacturing apparatus for a single-sided circuit board according to claim 4,
every the regulating plate all includes first threaded rod, transfer line and stripper plate, first threaded rod with bottom plate threaded connection, and be located in the first threaded hole, the transfer line with through-hole swing joint, and be located the inside of through-hole, the stripper plate with transfer line fixed connection, and be located the side of transfer line, and be located the inside of standing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110479346.4A CN113210786B (en) | 2021-04-30 | 2021-04-30 | Single-sided circuit board SMT reflow soldering production process and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110479346.4A CN113210786B (en) | 2021-04-30 | 2021-04-30 | Single-sided circuit board SMT reflow soldering production process and equipment |
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| Publication Number | Publication Date |
|---|---|
| CN113210786A CN113210786A (en) | 2021-08-06 |
| CN113210786B true CN113210786B (en) | 2022-05-20 |
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| CN202110479346.4A Expired - Fee Related CN113210786B (en) | 2021-04-30 | 2021-04-30 | Single-sided circuit board SMT reflow soldering production process and equipment |
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| CN (1) | CN113210786B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203313516U (en) * | 2013-05-04 | 2013-11-27 | 深圳市晶福源电子技术有限公司 | Pcb |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004230871A (en) * | 2003-02-03 | 2004-08-19 | Nippon Dempa Kogyo Co Ltd | Solder printing method onto print substrate |
| JP2014060253A (en) * | 2012-09-18 | 2014-04-03 | Ibiden Co Ltd | Substrate holding jig |
| CN207252044U (en) * | 2017-10-16 | 2018-04-17 | 沈阳中光电子有限公司 | One kind crosses reflux welding clamp |
| CN207432061U (en) * | 2017-11-28 | 2018-06-01 | 深圳市亚星达科技有限公司 | A kind of clamping device of PCB patch jigs |
| CN208758851U (en) * | 2018-07-13 | 2019-04-19 | 苏州市吴通智能电子有限公司 | A kind of elastic slice Product jointing device applied to SMT attachment line |
| CN210053656U (en) * | 2019-06-03 | 2020-02-11 | 深圳市东迪电路有限公司 | Flexible circuit board positioning carrier |
| CN211210070U (en) * | 2019-12-10 | 2020-08-07 | 惠州益泰利科技有限公司 | Fixing device for PCB (printed circuit board) surface mounting jig |
| CN213073251U (en) * | 2020-10-20 | 2021-04-27 | 江苏烁迈特电子科技有限公司 | Be applied to PCB board wave-soldering tool of SMT subsides dress line |
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2021
- 2021-04-30 CN CN202110479346.4A patent/CN113210786B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203313516U (en) * | 2013-05-04 | 2013-11-27 | 深圳市晶福源电子技术有限公司 | Pcb |
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