CN203313516U - Pcb - Google Patents

Pcb Download PDF

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Publication number
CN203313516U
CN203313516U CN2013202352881U CN201320235288U CN203313516U CN 203313516 U CN203313516 U CN 203313516U CN 2013202352881 U CN2013202352881 U CN 2013202352881U CN 201320235288 U CN201320235288 U CN 201320235288U CN 203313516 U CN203313516 U CN 203313516U
Authority
CN
China
Prior art keywords
pcb board
components
parts
louvre
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013202352881U
Other languages
Chinese (zh)
Inventor
张世伟
陈标
陈恒留
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN JINGFUYUAN TECHNOLOGY CO., LTD.
Original Assignee
SHENZHEN JINGFUYUAN TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN JINGFUYUAN TECH Co Ltd filed Critical SHENZHEN JINGFUYUAN TECH Co Ltd
Priority to CN2013202352881U priority Critical patent/CN203313516U/en
Application granted granted Critical
Publication of CN203313516U publication Critical patent/CN203313516U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a PCB which is provided with heat radiating holes. According to the PCB, air channels are formed by the heat radiating holes arranged around or among components so that convection is produced among air near the air channels, and thus temperature of the components near the air channels is lowered.

Description

A kind of pcb board
Technical field
The utility model relates to a kind of pcb board.
Background technology
On the pcb board of existing product, the heat radiation of components and parts is by increasing the every structure class parameter of self, improving heat dispersion and heat resistanceheat resistant performance from components and parts itself.When the pcb board horizontal positioned, components and parts are unreasonable because of radiating mode, and temperature is obviously than high when other angle of pcb board is placed.As shown in Figure 1, components and parts are placed on pcb board, and the heat sent during components and parts work only distributes from a direction.Because of radiating mode bad, on component structure, improve every structure class parameter index, increased significantly cost and also increased volume simultaneously, particularly when the pcb board horizontal positioned, even increase the structure class parameter of components and parts, can not effectively improve the heat radiation of components and parts.
Summary of the invention
The purpose of this utility model is the defect existed for above-mentioned prior art, and a kind of pcb board is provided.
The technical solution adopted in the utility model is, designs a kind of pcb board, and wherein, described pcb board is provided with louvre.
In one embodiment, described louvre be arranged on components and parts around or between.
Described louvre is strip hole, square hole or circular port.
Compared with prior art, adopt pcb board of the present utility model, due to around components and parts or between the louvre that is provided with form air channel, make near the air air channel produce convection current, thereby reduce near the temperature of components and parts louvre.
The accompanying drawing explanation
Fig. 1 is the schematic diagram of prior art pcb board.
Fig. 2 is the schematic diagram of the utility model pcb board.
Embodiment
Below in conjunction with accompanying drawing 2 and embodiment, utility model is described in detail.
As shown in Figure 2, the pcb board 1 the utility model proposes, be equipped with the components and parts such as radiator 3 and a plurality of inductance 2 on this pcb board 1, on pcb board 1, be equipped with radiator 3 and inductance 2 position periphery or between be provided with louvre 4.
In the present embodiment, louvre adopts strip hole, square hole or circular port.
Louvre 4 by car or mill etc. method directly on the pcb board body once property process, the size in hole, quantity are adjusted accordingly by the structure class parameter of components and parts self.
Components and parts power hour, also can not use radiator 3, by 4 pairs of components and parts of the louvre carried on pcb board 1, dispelled the heat.
Adopt pcb board of the present utility model, at components and parts periphery and bottom, have a small amount of louvre, louvre forms heat dissipation wind channel, the problem of components and parts heat radiation on the pcb board of determining by air stream kinetic energy efficient solution, very easy and useful to stability that product is provided, and do not affect the cost of product and the volume of components and parts.
Above-described embodiment is only be used to illustrating embodiment of the present utility model.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and variation, these distortion and variation all should belong to protection range of the present utility model.

Claims (1)

1. pcb board, it is characterized in that: described pcb board is provided with louvre;
Described louvre be arranged on components and parts around or between;
Described louvre adopts strip hole, square hole or circular port.
CN2013202352881U 2013-05-04 2013-05-04 Pcb Expired - Fee Related CN203313516U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013202352881U CN203313516U (en) 2013-05-04 2013-05-04 Pcb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013202352881U CN203313516U (en) 2013-05-04 2013-05-04 Pcb

Publications (1)

Publication Number Publication Date
CN203313516U true CN203313516U (en) 2013-11-27

Family

ID=49619682

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013202352881U Expired - Fee Related CN203313516U (en) 2013-05-04 2013-05-04 Pcb

Country Status (1)

Country Link
CN (1) CN203313516U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113210786A (en) * 2021-04-30 2021-08-06 南京西普尔科技实业有限公司 Single-sided circuit board SMT reflow soldering production process and equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113210786A (en) * 2021-04-30 2021-08-06 南京西普尔科技实业有限公司 Single-sided circuit board SMT reflow soldering production process and equipment
CN113210786B (en) * 2021-04-30 2022-05-20 南京西普尔科技实业有限公司 Single-sided circuit board SMT reflow soldering production process and equipment

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SHENZHEN JINGFUYUAN TECH. CO., LTD.

Free format text: FORMER NAME: SHENZHEN JINGFUYUAN TECHNOLOGY CO., LTD.

CP03 Change of name, title or address

Address after: Shenzhen Nanshan District City, Guangdong province 518000 white pine Luxili Nangang Second Industrial Park 12 Building 1, 2, 5 floor

Patentee after: SHENZHEN JINGFUYUAN TECHNOLOGY CO., LTD.

Address before: Shenzhen Nanshan District City, Guangdong province 518000 white pine Luxili Nangang Second Industrial Park twelfth 5 floor

Patentee before: Shenzhen Jingfuyuan Tech Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131127

Termination date: 20160504

CF01 Termination of patent right due to non-payment of annual fee