CN219425874U - Reflow oven for circuit board production - Google Patents
Reflow oven for circuit board production Download PDFInfo
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- CN219425874U CN219425874U CN202320166081.7U CN202320166081U CN219425874U CN 219425874 U CN219425874 U CN 219425874U CN 202320166081 U CN202320166081 U CN 202320166081U CN 219425874 U CN219425874 U CN 219425874U
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Abstract
The utility model discloses a reflow oven for producing circuit boards, which comprises two material conveying roller frames, wherein the material conveying roller frames are arranged in a furnace body frame; the electric heating sheet is arranged on one side of the furnace body frame, an electric refrigerating sheet is arranged on one side of the electric heating sheet, and one ends of the electric heating sheet and the electric refrigerating sheet penetrate through and extend to the inside of the furnace body frame; the electric control cabinet is arranged on one side of the furnace body frame, damping supporting legs are arranged below the furnace body frame and four damping supporting legs are arranged at four corners of the furnace body frame, and the clamping mechanism is arranged on the object placing plate of the reflow furnace main body, so that the welding stability of the circuit board can be ensured, the heating temperature of the reflow furnace can be accurately controlled, the welding requirements of the circuit boards at different temperatures are met, the accurate position of solder paste can be ensured, and the welding quality of the circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of surface mounting, in particular to a reflow oven for producing a circuit board.
Background
The names of the circuit boards are: ceramic circuit board, aluminium oxide ceramic circuit board, aluminium nitride ceramic circuit board, PCB board, aluminium base board, high frequency board, thick copper, impedance board, PCB, ultra-thin circuit board, printed circuit board etc. the circuit board makes the circuit miniaturized, the observability plays important roles to fixed circuit's batch production and optimization electrical apparatus overall arrangement. Reflow ovens, i.e., reflow ovens, are one type of equipment required for SMT processes in the electronics industry that mechanically and electrically connect the solder terminals or pins of surface mount components to the pads of the printed board by remelting paste solder pre-dispensed onto the pads of the printed board.
The reflow soldering device for the circuit board comprises a furnace body, wherein two ends of the furnace body are provided with rotating shafts, the rotating shafts are fixed on the furnace body through brackets, bearings are arranged on the rotating shafts, and the rotating shafts are connected with a driving motor; the conveying mechanism comprises a conveying chain, a bearing jig arranged on the conveying chain and limiting columns arranged at two ends of the conveying chain; the zeolite box is arranged in the furnace body and between the two rotating shafts; an activated carbon adsorption layer is arranged on the inner wall of the zeolite box; the welding gun mechanism is connected with the air cylinder; the utility model has the characteristics of simple structure and convenient use, the equipment volume is smaller, the welding gun can rapidly process the workpiece by driving the cylinder, the cost is low, the processing efficiency is effectively improved, and the utility model has higher practicability; and (5) purifying and removing the soldering flux generated in the welding process.
The existing reflow oven is mainly applied to rectangular circuit boards, the circuit boards are directly placed on the boards, the circuit boards are not limited, stress is offset when the circuit boards are conveyed, welding spots on the circuit boards are offset, the welding quality of the circuit boards is reduced, and the use requirements cannot be met.
Disclosure of Invention
The utility model aims to provide a reflow oven for producing a circuit board, which aims to solve the problems that the prior reflow oven is mainly applied to a rectangular circuit board in the prior art, the circuit board is directly placed on the board, the circuit board is not limited, stress is offset when the circuit board is conveyed, welding spots on the circuit board are offset, the welding quality of the circuit board is reduced, and the use requirement cannot be met.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the reflow oven for producing the circuit board comprises an oven body frame and a porous carrying board, and further comprises:
the conveying roller frames are arranged in the furnace body frame, two conveying roller frames are arranged and are rotationally connected with the furnace body frame, a motor is arranged on one side of the furnace body frame and is connected with the furnace body frame through screws, chains are arranged between the two conveying roller frames, and the chains are in transmission connection with the conveying roller frames;
the electric heating plate is arranged on one side of the furnace body frame, an electric refrigerating plate is arranged on one side of the electric heating plate, the electric heating plate and the electric refrigerating plate are fixedly connected with the furnace body frame, and one ends of the electric heating plate and the electric refrigerating plate penetrate through and extend to the inside of the furnace body frame;
the electric control cabinet is arranged on one side of the furnace body frame and fixedly connected with the furnace body frame, shock absorption supporting legs are arranged below the furnace body frame and are four, and the shock absorption supporting legs are connected with the furnace body frame through screws.
Preferably, the top of porous year thing board is provided with the spacing, and the spacing is provided with two, and spacing and porous year thing board fixed connection, two all be provided with the lift chamber on the spacing, two one side of spacing all is provided with the clamp plate, and the one end of clamp plate extends to the inside in lift chamber, clamp plate and spacing sliding connection, the inside in lift chamber is provided with the spring, and the both ends of spring respectively with spacing and clamp plate elastic connection, the lower extreme of clamp plate is provided with flexible head, and flexible head and clamp plate fixed connection.
Preferably, two locating holes are formed in the chains, the locating holes are formed in the chains at equal intervals, locating columns are arranged below the porous carrying plates, the two locating columns are fixedly connected with the porous carrying plates, and the locating columns are arranged corresponding to the locating holes.
Preferably, the inside of furnace body frame is provided with the heat insulating board, and the heat insulating board is provided with two, and heat insulating board and furnace body frame fixed connection, the inboard of furnace body frame is provided with first temperature sense strip and second temperature sense strip, and first temperature sense strip and second temperature sense strip and furnace body frame fixed connection, first temperature sense strip and second temperature sense strip set up in one side of electric heating piece and electric refrigerating piece.
Preferably, the furnace body frame is provided with the bell in the top, and the bell rotates with the furnace body frame to be connected, one side of bell is provided with the handle, and the handle passes through screw connection with the bell, the upper end of bell is provided with the dust screen, and the dust screen sets up as an organic wholely with the bell, one side of dust screen is provided with the air-blower, and air-blower and bell fixed connection.
Preferably, the lower extreme of furnace body frame is provided with the relief valve subassembly, and the relief valve subassembly is connected as an organic wholely with the furnace body frame, the bottom slope setting of furnace body frame.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the device, through the arrangement of the electric heating plate, the electric refrigerating plate, the material conveying roller frame, the motor and the chain, the electric heating plate raises the temperature of a heating area, and the electric refrigerating plate lowers the temperature of a cooling area, so that the circuit board is quickly welded and cooled, the motor drives the material conveying roller frame to rotate, the chain is driven along with the rotation of the material conveying roller frame, and the driven chain forms a conveying mechanism, so that the automatic conveying of the circuit board is realized;
2. according to the device, through the arrangement of the positioning columns and the positioning holes, the positioning columns are inserted in alignment with the positioning holes, the porous carrying plate is connected with the chain quickly, the positioning columns are pulled out of the positioning holes, the porous carrying plate is taken down quickly, and feeding and discharging of the circuit board are facilitated;
3. the device provided by the utility model has the advantages that through the arrangement of the pressing plate, the spring and the flexible head, the spring applies thrust to the pressing plate, the circuit board to be processed is clamped and fixed by the pressing plate, and the flexible head can play a protective role on the clamped circuit board, so that the reflow soldering stability of the circuit board is ensured;
4. according to the device, through the arrangement of the first temperature sensing strip, the second temperature sensing strip and the discharge valve assembly, the first temperature sensing strip monitors the temperature of a heating area, the second temperature sensing strip monitors the temperature of a cooling area, and sundries in the reflow soldering process can be discharged through the discharge valve assembly.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a cross-sectional view of the present utility model;
FIG. 3 is a diagram showing the connection relationship between the porous carrier plate and the chain;
fig. 4 is an enlarged view of a portion of area a of fig. 3 in accordance with the present utility model.
In the figure: 1. a furnace body frame; 2. damping support legs; 3. an electric control cabinet; 4. a furnace cover; 5. a dust screen; 6. a blower; 7. a handle; 8. an electric heating plate; 9. an electric cooling plate; 10. a material conveying roller frame; 11. a motor; 12. a chain; 13. positioning holes; 14. a heat insulating plate; 15. a first temperature sensing strip; 16. a second temperature sensing strip; 17. a discharge valve assembly; 18. a porous carrier plate; 19. positioning columns; 20. a limiting frame; 21. a pressing plate; 22. a lifting cavity; 23. a spring; 24. a flexible head.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, an embodiment of the present utility model is provided: a reflow oven for circuit board production, comprising a oven body frame 1 and a porous carrier plate 18, and further comprising:
the material conveying roller frames 10 are arranged in the furnace body frame 1, two material conveying roller frames 10 are arranged, the material conveying roller frames 10 are rotationally connected with the furnace body frame 1, a motor 11 is arranged on one side of the furnace body frame 1, the motor 11 is connected with the furnace body frame 1 through screws, a chain 12 is arranged between the two material conveying roller frames 10, two chains 12 are arranged, and the chain 12 is in transmission connection with the material conveying roller frames 10;
the electric heating plate 8 is arranged on one side of the furnace body frame 1, an electric refrigerating plate 9 is arranged on one side of the electric heating plate 8, the electric heating plate 8 and the electric refrigerating plate 9 are fixedly connected with the furnace body frame 1, and one ends of the electric heating plate 8 and the electric refrigerating plate 9 penetrate and extend into the furnace body frame 1;
the electric control cabinet 3, it sets up in one side of furnace body frame 1, and electric control cabinet 3 and furnace body frame 1 fixed connection, and the below of furnace body frame 1 is provided with shock attenuation supporting leg 2, and shock attenuation supporting leg 2 is provided with four, and shock attenuation supporting leg 2 passes through screw connection with furnace body frame 1, and four shock attenuation supporting legs 2 set up in the four corners of furnace body frame 1.
When in use, the utility model is characterized in that: the circuit board is mounted on the porous carrying board 18, the porous carrying board 18 is mounted on the chain 12, the motor 11 is started to drive the material conveying roller frame 10 to rotate, the chain 12 is driven to move along with the rotation of the material conveying roller frame 10, so that the conveying of the circuit board is realized, the electric heating sheet 8 is started to raise the temperature of a heating area, the circuit board is moved into the heating area, solder paste is melted and welded by heat, the electric cooling sheet 9 is started to reduce the temperature of a cooling area, the motor 11 is started to send the welded circuit board into the cooling area for rapid cooling, and the circuit board can be taken down to continue the circuit board welding.
Referring to fig. 3 and 4, a limiting frame 20 is disposed above the porous carrier plate 18, two limiting frames 20 are disposed, the limiting frames 20 are fixedly connected with the porous carrier plate 18, lifting cavities 22 are disposed on the two limiting frames 20, a pressing plate 21 is disposed on one side of each of the two limiting frames 20, one end of the pressing plate 21 extends to the inside of the lifting cavity 22, the pressing plate 21 is slidably connected with the limiting frame 20, a spring 23 is disposed in the lifting cavity 22, two ends of the spring 23 are respectively elastically connected with the limiting frames 20 and the pressing plate 21, a flexible head 24 is disposed at the lower end of the pressing plate 21, the flexible head 24 is fixedly connected with the pressing plate 21, thrust is applied to the pressing plate 21 through the spring 23, the pressing plate 21 is pressed onto the porous carrier plate 18 under the action of the thrust, and the flexible head 24 plays a protective role on the pressed circuit board, so that stability of a welding process of the circuit board is ensured.
Referring to fig. 3 and 4, two chains 12 are provided with positioning holes 13, the positioning holes 13 are equidistantly formed in the chains 12, positioning columns 19 are arranged below the porous carrier plates 18, the positioning columns 19 are provided with two positioning columns, the positioning columns 19 are fixedly connected with the porous carrier plates 18, the positioning columns 19 are correspondingly arranged with the positioning holes 13, the porous carrier plates 18 are connected with the chains by inserting the positioning columns 19 into the positioning holes 13, the positioning columns 19 are pulled out from the positioning holes 13, the porous carrier plates 18 are quickly taken down, and feeding and discharging of the circuit boards are facilitated.
Referring to fig. 2, the inner side of the furnace body frame 1 is provided with two heat insulation boards 14, the heat insulation boards 14 are fixedly connected with the furnace body frame 1, the inner side of the furnace body frame 1 is provided with a first temperature sensing strip 15 and a second temperature sensing strip 16, the first temperature sensing strip 15 and the second temperature sensing strip 16 are fixedly connected with the furnace body frame 1, the first temperature sensing strip 15 and the second temperature sensing strip 16 are arranged on one sides of the electric heating sheet 8 and the electric cooling sheet 9, and the temperature of a heating area and a cooling area is monitored respectively through the first temperature sensing strip 15 and the second temperature sensing strip 16, so that the temperature can be conveniently and accurately controlled.
Referring to fig. 1 and 3, a furnace cover 4 is arranged above a furnace body frame 1, the furnace cover 4 is rotationally connected with the furnace body frame 1, a handle 7 is arranged on one side of the furnace cover 4, the handle 7 is connected with the furnace cover 4 through a screw, a dust screen 5 is arranged at the upper end of the furnace cover 4, the dust screen 5 and the furnace cover 4 are integrated, a blower 6 is arranged on one side of the dust screen 5, the blower 6 is fixedly connected with the furnace cover 4, a protection effect can be achieved through the furnace cover 4, dust can be prevented from entering the dust screen 5, the blower 6 quickens air flow in a cooling area, and a circuit board is quickened in cooling.
Referring to fig. 3, a discharge valve assembly 17 is disposed at the lower end of the furnace frame 1, and the discharge valve assembly 17 is integrally connected with the furnace frame 1, the bottom of the furnace frame 1 is inclined, and impurities generated in the reflow furnace are discharged through the discharge valve assembly 17.
Working principle: lifting the pressing plate 21 to place the circuit board on the porous carrying plate 18, loosening the pressing plate 21, and applying thrust to the pressing plate 21 by the springs 23 to press the circuit board on the porous carrying plate 18; the positioning column 19 is inserted into the positioning hole 13, the porous carrying plate 18 is quickly connected with a chain, the electric heating plate 8 is started to raise the temperature of a heating area, the motor 11 is started to drive the material conveying roller frame 10 to rotate, the chain 12 is driven to move along with the rotation of the material conveying roller frame 10, so that the conveying of a circuit board is realized, the circuit board is moved into a heating area, solder paste is melted and welded by utilizing heat, the electric cooling plate 9 is started to reduce the temperature of a cooling area, the motor 11 is started to send the welded circuit board into the cooling area to be quickly cooled, and the circuit board can be taken down to continue the circuit board welding.
What is not described in detail in this specification is prior art known to those skilled in the art.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a reflow oven for circuit board production, includes furnace body frame (1) and porous year thing board (18), its characterized in that still includes:
the material conveying roller frames (10) are arranged in the furnace body frames (1), the two material conveying roller frames (10) are arranged, the material conveying roller frames (10) are rotationally connected with the furnace body frames (1), one side of each furnace body frame (1) is provided with a motor (11), the motors (11) are connected with the furnace body frames (1) through screws, a chain (12) is arranged between the two material conveying roller frames (10), the two chains (12) are arranged, and the chain (12) is in transmission connection with the material conveying roller frames (10);
the electric heating sheet (8) is arranged on one side of the furnace body frame (1), an electric refrigerating sheet (9) is arranged on one side of the electric heating sheet (8), the electric heating sheet (8) and the electric refrigerating sheet (9) are fixedly connected with the furnace body frame (1), and one ends of the electric heating sheet (8) and the electric refrigerating sheet (9) penetrate through and extend to the inside of the furnace body frame (1);
the electric control cabinet (3) is arranged on one side of the furnace body frame (1), the electric control cabinet (3) is fixedly connected with the furnace body frame (1), shock-absorbing support legs (2) are arranged below the furnace body frame (1), the shock-absorbing support legs (2) are four, the shock-absorbing support legs (2) are connected with the furnace body frame (1) through screws, and the four shock-absorbing support legs (2) are arranged at four corners of the furnace body frame (1).
2. The reflow oven for producing circuit boards according to claim 1, wherein: the utility model discloses a porous carrier plate, including porous carrier plate (18), including porous carrier plate, pressure plate (21), spring (23), pressure plate (21) and flexible head (24), spacing (20) are provided with spacing (20) in the top of porous carrier plate (18), spacing (20) are provided with two, and spacing (20) and porous carrier plate (18) fixed connection, two all be provided with lift chamber (22) on spacing (20) one side of spacing (20) is provided with clamp plate (21), and the one end of clamp plate (21) extends to the inside of lift chamber (22), clamp plate (21) and spacing (20) sliding connection, the inside of lift chamber (22) is provided with spring (23), and the both ends of spring (23) are provided with flexible head (24) respectively with spacing (20) and clamp plate (21) elastic connection, the lower extreme of clamp plate (21), and flexible head (24) and clamp plate (21) fixed connection.
3. The reflow oven for producing circuit boards according to claim 1, wherein: two all be provided with locating hole (13) on chain (12), and locating hole (13) equidistance sets up on chain (12), the below of porous year thing board (18) is provided with reference column (19), and reference column (19) are provided with two, and reference column (19) and porous year thing board (18) fixed connection, reference column (19) correspond setting with locating hole (13).
4. The reflow oven for producing circuit boards according to claim 1, wherein: the inside of furnace body frame (1) is provided with heat insulating board (14), and heat insulating board (14) are provided with two, and heat insulating board (14) and furnace body frame (1) fixed connection, the inboard of furnace body frame (1) is provided with first temperature sense strip (15) and second temperature sense strip (16), and first temperature sense strip (15) and second temperature sense strip (16) and furnace body frame (1) fixed connection, first temperature sense strip (15) and second temperature sense strip (16) set up in one side of electric heating piece (8) and electric refrigerating piece (9).
5. The reflow oven for producing circuit boards according to claim 1, wherein: the utility model discloses a furnace body frame, including furnace body frame (1), furnace body frame (1) and furnace body frame (4), one side of furnace body frame (1) rotates to be connected, one side of furnace body (4) is provided with handle (7), and handle (7) pass through screw connection with furnace body (4), the upper end of furnace body (4) is provided with dust screen (5), and dust screen (5) set up as an organic wholely with furnace body (4), one side of dust screen (5) is provided with air-blower (6), and air-blower (6) and furnace body (4) fixed connection.
6. The reflow oven for producing circuit boards according to claim 1, wherein: the lower extreme of furnace body frame (1) is provided with discharge valve subassembly (17), and discharge valve subassembly (17) are connected as an organic wholely with furnace body frame (1), the bottom slope of furnace body frame (1) sets up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320166081.7U CN219425874U (en) | 2023-02-09 | 2023-02-09 | Reflow oven for circuit board production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320166081.7U CN219425874U (en) | 2023-02-09 | 2023-02-09 | Reflow oven for circuit board production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219425874U true CN219425874U (en) | 2023-07-28 |
Family
ID=87331251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320166081.7U Active CN219425874U (en) | 2023-02-09 | 2023-02-09 | Reflow oven for circuit board production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219425874U (en) |
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2023
- 2023-02-09 CN CN202320166081.7U patent/CN219425874U/en active Active
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