JP2012507858A - 半導体ウエハ処理のための音響を用いた枚葉式ウエハ湿式洗浄 - Google Patents

半導体ウエハ処理のための音響を用いた枚葉式ウエハ湿式洗浄 Download PDF

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Publication number
JP2012507858A
JP2012507858A JP2011534486A JP2011534486A JP2012507858A JP 2012507858 A JP2012507858 A JP 2012507858A JP 2011534486 A JP2011534486 A JP 2011534486A JP 2011534486 A JP2011534486 A JP 2011534486A JP 2012507858 A JP2012507858 A JP 2012507858A
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JP
Japan
Prior art keywords
substrate
liquid medium
acoustic energy
rinse
transducer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
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JP2011534486A
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English (en)
Japanese (ja)
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JP2012507858A5 (enExample
Inventor
ペン・グラント
ムイ・デビッド
コン・シン−チャン
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Lam Research Corp
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Lam Research Corp
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Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2012507858A publication Critical patent/JP2012507858A/ja
Publication of JP2012507858A5 publication Critical patent/JP2012507858A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2011534486A 2008-10-30 2009-10-14 半導体ウエハ処理のための音響を用いた枚葉式ウエハ湿式洗浄 Withdrawn JP2012507858A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/262,094 US8585825B2 (en) 2008-10-30 2008-10-30 Acoustic assisted single wafer wet clean for semiconductor wafer process
US12/262,094 2008-10-30
PCT/US2009/005638 WO2010096041A1 (en) 2008-10-30 2009-10-14 Acoustic assisted single wafer wet clean for semiconductor wafer process

Publications (2)

Publication Number Publication Date
JP2012507858A true JP2012507858A (ja) 2012-03-29
JP2012507858A5 JP2012507858A5 (enExample) 2012-11-29

Family

ID=42129948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011534486A Withdrawn JP2012507858A (ja) 2008-10-30 2009-10-14 半導体ウエハ処理のための音響を用いた枚葉式ウエハ湿式洗浄

Country Status (6)

Country Link
US (2) US8585825B2 (enExample)
JP (1) JP2012507858A (enExample)
KR (1) KR20110079830A (enExample)
CN (1) CN102197462B (enExample)
TW (1) TW201029060A (enExample)
WO (1) WO2010096041A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019117952A (ja) * 2019-04-16 2019-07-18 株式会社ホロン 被洗浄体の異物除去装置およびその異物除去方法
KR20200078656A (ko) * 2017-11-15 2020-07-01 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼를 세정하는 방법
US11752529B2 (en) 2015-05-15 2023-09-12 Acm Research (Shanghai) Inc. Method for cleaning semiconductor wafers

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8171877B2 (en) * 2007-03-14 2012-05-08 Lam Research Corporation Backside mounted electrode carriers and assemblies incorporating the same
US8075701B2 (en) * 2008-06-30 2011-12-13 Lam Research Corporation Processes for reconditioning multi-component electrodes
US8276604B2 (en) * 2008-06-30 2012-10-02 Lam Research Corporation Peripherally engaging electrode carriers and assemblies incorporating the same
US8957564B1 (en) * 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
US8926762B2 (en) 2011-09-06 2015-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for movable megasonic wafer probe
US9117760B2 (en) * 2013-01-30 2015-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for energized and pressurized liquids for cleaning/etching applications in semiconductor manufacturing
WO2015042263A1 (en) * 2013-09-18 2015-03-26 Akrion Systems Llc System, apparatus, and method for processing substrates using acoustic energy
US10688536B2 (en) * 2014-02-24 2020-06-23 The Boeing Company System and method for surface cleaning
US10343193B2 (en) * 2014-02-24 2019-07-09 The Boeing Company System and method for surface cleaning
US10507498B2 (en) * 2016-06-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus for particle cleaning
SG11202007002YA (en) * 2018-01-23 2020-08-28 Acm Research Shanghai Inc Methods and apparatus for cleaning substrates
KR102395972B1 (ko) * 2020-07-29 2022-05-09 가천대학교 산학협력단 초고주파 진동을 이용한 고종횡비 나노채널의 세정 또는 에칭방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US550785A (en) * 1895-12-03 J e friend
US4715392A (en) * 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
US5505785A (en) 1994-07-18 1996-04-09 Ferrell; Gary W. Method and apparatus for cleaning integrated circuit wafers
JPH1133506A (ja) * 1997-07-24 1999-02-09 Tadahiro Omi 流体処理装置及び洗浄処理システム
US7520284B2 (en) * 2000-06-30 2009-04-21 Lam Research Corporation Apparatus for developing photoresist and method for operating the same
KR100522845B1 (ko) * 2000-09-01 2005-10-20 가부시끼가이샤 도꾸야마 잔류물 제거용 세정액
JP2002093765A (ja) * 2000-09-20 2002-03-29 Kaijo Corp 基板洗浄方法および基板洗浄装置
US7198055B2 (en) * 2002-09-30 2007-04-03 Lam Research Corporation Meniscus, vacuum, IPA vapor, drying manifold
US7810513B1 (en) * 2002-09-30 2010-10-12 Lam Research Corporation Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same
US7696141B2 (en) * 2003-06-27 2010-04-13 Lam Research Corporation Cleaning compound and method and system for using the cleaning compound
US7111632B2 (en) * 2003-09-22 2006-09-26 Seagate Technology Llc Ultrasonic cleaning device for removing undesirable particles from an object
JP2006005246A (ja) * 2004-06-18 2006-01-05 Fujimi Inc リンス用組成物及びそれを用いたリンス方法
EP1696011B1 (en) * 2005-02-23 2009-01-07 JSR Corporation Chemical mechanical polishing method
WO2007085015A2 (en) * 2006-01-20 2007-07-26 Akrion Technologies, Inc. Acoustic energy system, method and apparatus for processing flat articles

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11752529B2 (en) 2015-05-15 2023-09-12 Acm Research (Shanghai) Inc. Method for cleaning semiconductor wafers
KR20200078656A (ko) * 2017-11-15 2020-07-01 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼를 세정하는 방법
JP2021510008A (ja) * 2017-11-15 2021-04-08 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法
JP2022180654A (ja) * 2017-11-15 2022-12-06 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法
KR102517663B1 (ko) 2017-11-15 2023-04-05 에이씨엠 리서치 (상하이), 인코포레이티드 반도체 웨이퍼를 세정하는 방법
JP7455743B2 (ja) 2017-11-15 2024-03-26 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法
JP7495461B2 (ja) 2017-11-15 2024-06-04 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法
JP2019117952A (ja) * 2019-04-16 2019-07-18 株式会社ホロン 被洗浄体の異物除去装置およびその異物除去方法

Also Published As

Publication number Publication date
TW201029060A (en) 2010-08-01
CN102197462A (zh) 2011-09-21
CN102197462B (zh) 2013-12-18
US20140034096A1 (en) 2014-02-06
KR20110079830A (ko) 2011-07-08
US20100108093A1 (en) 2010-05-06
WO2010096041A1 (en) 2010-08-26
US8585825B2 (en) 2013-11-19

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