JP2012247844A5 - - Google Patents

Download PDF

Info

Publication number
JP2012247844A5
JP2012247844A5 JP2011117057A JP2011117057A JP2012247844A5 JP 2012247844 A5 JP2012247844 A5 JP 2012247844A5 JP 2011117057 A JP2011117057 A JP 2011117057A JP 2011117057 A JP2011117057 A JP 2011117057A JP 2012247844 A5 JP2012247844 A5 JP 2012247844A5
Authority
JP
Japan
Prior art keywords
information storage
storage medium
conductive
medium manufacturing
thin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011117057A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012247844A (ja
JP5845632B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2011117057A external-priority patent/JP5845632B2/ja
Priority to JP2011117057A priority Critical patent/JP5845632B2/ja
Priority to PCT/JP2011/078771 priority patent/WO2012081572A1/ja
Priority to EP11849119.0A priority patent/EP2653997B1/en
Priority to US13/993,660 priority patent/US9710681B2/en
Priority to CN201180060004.3A priority patent/CN103262098B/zh
Publication of JP2012247844A publication Critical patent/JP2012247844A/ja
Publication of JP2012247844A5 publication Critical patent/JP2012247844A5/ja
Publication of JP5845632B2 publication Critical patent/JP5845632B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011117057A 2010-12-13 2011-05-25 情報記憶媒体製造方法 Active JP5845632B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011117057A JP5845632B2 (ja) 2011-05-25 2011-05-25 情報記憶媒体製造方法
CN201180060004.3A CN103262098B (zh) 2010-12-13 2011-12-13 通信系统、中继通信装置、中继通信装置与电磁感应通信装置的组合、电磁感应通信装置、信息存储介质、信息存储介质制造方法
EP11849119.0A EP2653997B1 (en) 2010-12-13 2011-12-13 Communications system and relay communications device
US13/993,660 US9710681B2 (en) 2010-12-13 2011-12-13 Communications system, relay communications device, relay communications device and electromagnetic induction communications device combination, electromagnetic induction communications device, information storage medium, and information storage medium production method
PCT/JP2011/078771 WO2012081572A1 (ja) 2010-12-13 2011-12-13 通信システム、中継通信装置、中継通信装置及び電磁誘導通信装置の組み合わせ、電磁誘導通信装置、情報記憶媒体、情報記憶媒体製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011117057A JP5845632B2 (ja) 2011-05-25 2011-05-25 情報記憶媒体製造方法

Publications (3)

Publication Number Publication Date
JP2012247844A JP2012247844A (ja) 2012-12-13
JP2012247844A5 true JP2012247844A5 (enExample) 2013-09-26
JP5845632B2 JP5845632B2 (ja) 2016-01-20

Family

ID=47468269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011117057A Active JP5845632B2 (ja) 2010-12-13 2011-05-25 情報記憶媒体製造方法

Country Status (1)

Country Link
JP (1) JP5845632B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624488A (en) 1983-12-16 1986-11-25 Hydril Company Tubular connection
JP6960254B2 (ja) * 2017-06-22 2021-11-05 東日本旅客鉄道株式会社 小型非接触icカード
JP2024020919A (ja) * 2022-08-02 2024-02-15 Nissha株式会社 Rfidタグ、rfidタグの製造方法及びrfidタグロール
JP2024020920A (ja) * 2022-08-02 2024-02-15 Nissha株式会社 Rfidタグ、rfidタグの製造方法及びrfidタグロール

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4671560B2 (ja) * 2001-08-29 2011-04-20 トッパン・フォームズ株式会社 静電結合型rf−idの検査方法およびその検査システム
JP4694217B2 (ja) * 2004-04-27 2011-06-08 大日本印刷株式会社 Icタグ付シートの検査方法
US7180423B2 (en) * 2004-12-31 2007-02-20 Avery Dennison Corporation RFID devices for enabling reading of non-line-of-sight items

Similar Documents

Publication Publication Date Title
JP2012247844A5 (enExample)
JP2012003266A5 (enExample)
WO2014051511A3 (en) Electroless metal through silicon via
CN103687309B (zh) 一种高频电路板的生产工艺
JP2011186966A5 (enExample)
EP2876680A3 (en) Electronic device incorporating a randomized interconnection layer
JP2010129899A5 (enExample)
JP2013098332A5 (enExample)
JP2005051149A5 (enExample)
JP2013115648A5 (enExample)
TWM511111U (zh) 磁芯電感器
CN104470257B (zh) 一种提高pcb板金手指插拔位置精度的加工方法
JP2017046526A5 (enExample)
WO2013139470A3 (de) Substrat für einen portablen datenträger
CN105592639B (zh) 电路板及其制作方法
CN107734850B (zh) 一种印刷电路板的制作方法及印刷电路板
EP2784519B1 (en) Method for manufacturing a contact for testing a semiconductor device
CN102496582B (zh) 一种双界面ic卡的制作方法
JP2011258663A5 (enExample)
WO2013177299A3 (en) Three dimensional microelectronic components and fabrication methods for same
JP2013045893A5 (enExample)
CN103400674A (zh) 超薄合金片感测电阻的制造方法
WO2011099772A3 (en) Semiconductor substrate, semiconductor device, and manufacturing methods thereof
WO2012093868A3 (ko) 자성 시트 회로기판 및 그 제조 방법
JP2013224880A5 (enExample)