JP2012242519A - Production method of original plate for pattern alignment layer for three-dimensional display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a high-quality pattern retardation film for three-dimensional display.SOLUTION: A production method of an original plate for a pattern alignment layer is provided, the method including: a first layer preparation step of preparing a first layer made of a metal material or an inorganic material; a first concavo-convex structure formation step of forming a minute linear concavo-convex structure in approximately a given direction on the surface of the first layer; a resist formation step of forming a resist having a pattern of parallel strips on the first layer after the first concavo-convex structure is formed; a second layer formation step of forming a second layer made of a metal material or an inorganic material on the surface of the exposed first layer where the resist is not formed; a protective layer formation step of forming a protective layer made of a resist material on the surface of the first layer where the second layer is not formed; a second concavo-convex structure formation step of forming a second concavo-convex structure by forming a minute linear concavo-convex structure having an approximately given direction on the surface of the second layer, the given direction different from the formation direction of the first concave-convex structure; and a peeling step of peeling the protective layer.

Description

  The present invention relates to a three-dimensional display pattern alignment film master capable of easily and mass-producing a three-dimensional display pattern alignment film capable of forming a high-quality three-dimensional display pattern retardation film. It is.

  Conventionally, as a flat panel display, a two-dimensional display has been mainstream, but in recent years, a flat panel display capable of three-dimensional display has begun to attract attention, and some of them are commercially available. . Further, in future flat panel displays, it is a natural tendency to be capable of three-dimensional display, and flat panel displays capable of three-dimensional display are being studied in a wide range of fields.

  In order to perform three-dimensional display on a flat panel display, it is usually necessary to display a right-eye video and a left-eye video separately to the viewer in some manner. As a method for separately displaying the right-eye video and the left-eye video, for example, a passive method is known. Such a passive three-dimensional display method will be described with reference to the drawings. FIG. 15 is a schematic diagram illustrating an example of a passive three-dimensional display. As shown in FIG. 15, in this method, first, the pixels constituting the flat panel display are divided into a plurality of two types of pixels, a right-eye video display pixel and a left-eye video display pixel, and one group of The pixel displays a right-eye image, and the other group of pixels displays a left-eye image. In addition, the image for the right eye and the image for the left eye are converted into circularly polarized light by using a linearly polarizing plate and a pattern retardation film in which a patterned retardation layer corresponding to the division pattern of the pixel is formed. In addition, viewers can wear 3D display by wearing right-eye and left-eye circular polarizing glasses so that the right-eye video reaches only the right eye and the left-eye video only reaches the left eye. Things are passive.

  Such a passive method has an advantage that three-dimensional display can be easily performed by using the pattern retardation film and the corresponding circular polarizing glasses.

By the way, in patent document 1, as a manufacturing method of a pattern phase difference film, the roll plate which formed the pattern with the laser was used, and by contacting such a roll plate and the layer for alignment layer formation, a pattern shape is formed on the surface. A method of forming a shaped pattern alignment film having fine irregularities is disclosed. Patent Document 1 describes a method of forming fine irregularities in a pattern on the same plane by polishing.
However, the pattern retardation film manufactured using the original plate on which the pattern is formed by the laser is a pattern of the retardation layer for the right eye and the left eye, i.e., near the end between the regions in which the alignment directions of the liquid crystal compounds are different, That is, an alignment defect in which the alignment direction of the liquid crystal compound is disturbed easily occurs at the boundary between the first retardation region and the second retardation region, and when used in a liquid crystal display device, the alignment defect is present in the liquid crystal near the end portion. There was a problem of causing it. As a result, there is a problem that light leaks from the vicinity of the end portion and the contrast becomes low. Further, when drawing fine irregularities with a laser, it takes considerable time to form irregularities of several tens nm and several hundreds nm over a large area (liquid crystal TV size) because fine irregularities are drawn one by one. . In addition, there is a problem that a device for controlling with high accuracy with a pitch of unevenness of several tens nm or several hundreds nm is required.
In general, the processing with a laser has a problem that the line width is several hundreds of nanometers at the lower limit and the line width of several tens of nanometers is difficult, and it is difficult to obtain a pattern alignment film having excellent alignment regulation power, There was a problem that the laser processing apparatus was expensive.
Moreover, although patent document 1 has description of the original plate preparation by a grinding | polishing method, when a pattern is formed by grinding | polishing on the same plane in the method of patent document 1, grinding | polishing is performed for every several hundred micrometer pattern area | region, There is a problem that a roll plate needs to be formed by combining region patterns on which fine irregularities are formed, and the process is complicated, requiring considerable time and high-precision work.

JP 2010-152296 A

  The present invention has been made in view of such a situation, and it is possible to easily and in large quantities produce a three-dimensional display pattern alignment film capable of forming a high-quality three-dimensional display pattern retardation film. The main object of the present invention is to provide a method for producing an original plate for a three-dimensional display pattern alignment film.

  In order to solve the above-described problems, the present invention provides a first layer preparation step of preparing a first layer made of a metal material or an inorganic material, and a fine line-shaped uneven structure on the surface of the first layer in a substantially constant direction. A first concavo-convex structure forming step for forming a first concavo-convex structure, and a resist forming step for forming a resist having a parallel strip pattern on the surface of the first layer on which the first concavo-convex structure is formed, A second layer forming step for forming a second layer made of a metal material or an inorganic material and having a parallel strip pattern on the surface of the first layer exposed after the resist step; and a resist on the surface of the first layer. A protective layer forming step of forming a protective layer made of a material, and forming a fine line-shaped concavo-convex structure in a substantially constant direction on the surface of the second layer in a formation direction different from the formation direction of the first concavo-convex structure. Second recess that forms a rugged structure It provides a structure forming step, a manufacturing method of three-dimensional display pattern alignment film precursor characterized by having a peeling step of peeling the protective layer.

  According to the present invention, in the protective layer forming step, the first concavo-convex structure is protected by forming the protective layer in the region where the second layer is not formed, that is, the region where the first layer is exposed. The second concavo-convex structure can be efficiently formed in the two layers. Therefore, it is possible to easily and highly accurately form a fine line-shaped uneven structure on the surfaces of the first layer and the second layer. By using the original plate for a 3D display pattern alignment film manufactured in this way, a high quality 3D display pattern alignment film that hardly causes alignment failure when used in a 3D display device can be obtained. .

  In addition, the present invention provides a first layer preparation step of preparing a first layer made of a metal material or an inorganic material, and a first line unevenness by forming a minute line-shaped uneven structure on the surface of the first layer in a substantially constant direction. A first concavo-convex structure forming step for forming a structure, a resist forming step for forming a resist having a parallel strip pattern on the surface of the first layer on which the first concavo-convex structure is formed, and exposure after the resist step. A second layer forming step of forming a second layer made of a metal material or an inorganic material and having a parallel strip pattern on the surface of the first layer; and a protective layer made of a resist material on the surface of the first layer. A protective layer forming step to be formed, and forming a second concavo-convex structure by forming a minute line-shaped concavo-convex structure in the same formation direction as the first concavo-convex structure in a substantially constant direction on the surface of the second layer. Second uneven structure forming step and above To provide a method of manufacturing a three-dimensional display pattern alignment film precursor characterized by having a peeling step of peeling off the protective layer.

  According to the present invention, in the protective layer forming step, the first concavo-convex structure is protected by forming the protective layer in the region where the second layer is not formed, that is, the region where the first layer is exposed. The second concavo-convex structure can be efficiently formed in the two layers. Therefore, it is possible to easily and highly accurately form a fine line-shaped uneven structure on the surfaces of the first layer and the second layer. By using the original plate for a 3D display pattern alignment film manufactured in this way, a high quality 3D display pattern alignment film that hardly causes alignment failure when used in a 3D display device can be obtained. .

  In the present invention, in the second layer forming step, the second layer is formed on the exposed surfaces of the first layer and the resist, and in the protective layer forming step, the resist and the layer laminated on the surface thereof are stacked. It is preferable to form the protective layer by rough polishing a laminate composed of the second layer. Since the resist for patterning the second layer can also be used as a protective layer, the manufacturing cost can be reduced and the manufacturing process can be simplified. .

  In the present invention, in the second layer forming step, the second layer is formed on the exposed surfaces of the first layer and the resist, and in the protective layer forming step, the resist and the layer laminated on the surface thereof are stacked. After peeling off the laminate composed of the second layer, a second resist is formed so as to cover the first layer and the second layer, and the protective layer is formed by roughly polishing the second resist. It is also preferable. Since the protective layer is formed by peeling the above-mentioned laminated body to form a second resist and roughly polishing the second resist, the second layer is free from metallic materials and inorganic materials. It is possible to reduce the generation of scratches caused by the contact of the polishing residue with the surface. Therefore, the second concavo-convex structure can be formed with high accuracy on the surface of the second layer, and the alignment film for three-dimensional display using the original plate manufactured according to this aspect is less likely to cause alignment failure. be able to.

  In the present invention, the three-dimensional display pattern alignment film original plate is preferably a roll plate having a roll shape. The three-dimensional display pattern alignment film master produced by the production method of the present invention is in the form of a roll, that is, the three-dimensional display pattern alignment film master of the present invention is a roll plate so that three-dimensional display is achieved. Which can be molded into an alignment layer forming layer for continuously forming a three-dimensional display pattern alignment film while rotating the pattern alignment film original plate, that is, easily and in large quantities three-dimensional display pattern alignment film Can be formed, and manufacturing efficiency can be increased.

  According to the present invention, it is preferable that at least one of the first concavo-convex structure forming step or the second concavo-convex structure forming step is performed by roll pressing. By performing roll press processing to form a fine line-shaped uneven structure, the first uneven structure forming process and the second uneven structure forming process in the present invention can be easily performed. In addition, by roll pressing, it is possible to perform orientation and constant pressure, the thickness of the processed first layer and / or the second layer can be made uniform, and intermittent and continuous production is possible. Become.

  The present invention relates to a three-dimensional display pattern alignment film precursor capable of easily and mass-producing a three-dimensional display pattern alignment film capable of forming a high-quality three-dimensional display pattern retardation film. There is an effect that can be manufactured.

It is process drawing which shows an example of the manufacturing method of the original for pattern alignment films for three-dimensional displays of this invention. It is process drawing which shows the other example of the manufacturing method of the original for pattern orientation film for three-dimensional displays of this invention. It is the schematic which shows an example of the original plate for 3D display pattern orientation films manufactured by the manufacturing method of this invention. It is a schematic plan view which shows the surface of the original plate for 3D display pattern orientation films of FIG. It is a schematic perspective view which shows an example of the aspect in which the 1st uneven structure in this invention is formed. It is explanatory drawing explaining the 1st uneven structure in this invention. It is the schematic which shows an example of the roll press process in this invention. It is explanatory drawing explaining the formation direction of the 1st uneven structure and 2nd uneven structure in this invention. It is explanatory drawing explaining the formation direction of the 1st uneven structure and 2nd uneven structure in this invention. It is explanatory drawing explaining the formation direction of the 1st uneven structure and 2nd uneven structure in this invention. It is explanatory drawing explaining a pattern phase difference film. It is the schematic which shows the other example of the pattern orientation film for three-dimensional displays manufactured by the manufacturing method of this invention. It is a figure explaining the formation direction of the 1st uneven structure and the 2nd uneven structure in this invention. It is a figure explaining the formation direction of the 1st uneven structure and the 2nd uneven structure in this invention. It is the schematic which shows the example of the liquid crystal display device which can display a three-dimensional image | video with a passive system.

  Hereinafter, a method for producing an original plate for a three-dimensional display pattern alignment film according to the present invention (hereinafter sometimes referred to simply as an original plate) will be described. The method for producing an original plate of the present invention is roughly divided into two modes depending on the formation direction of the first concavo-convex structure and the second concavo-convex structure.

I. 1st aspect The 1st aspect of the manufacturing method of the negative | original plate of this invention is a 1st layer preparation process which prepares the 1st layer which consists of a metal material or an inorganic material, and a fine line-shaped uneven structure on the surface of the said 1st layer. A first concavo-convex structure forming step for forming a first concavo-convex structure by forming in a substantially constant direction, and a resist for forming a resist having a parallel strip-like pattern on the surface of the first layer on which the first concavo-convex structure is formed Forming step, second layer forming step of forming a second layer made of a metal material or an inorganic material and having a parallel strip pattern on the surface of the first layer exposed after the resist step, and the first layer A protective layer forming step of forming a protective layer made of a resist material on the surface of the substrate, and forming a fine line-shaped uneven structure on the surface of the second layer in a substantially constant direction with a forming direction different from the forming direction of the first uneven structure. To form a second concavo-convex structure The manufacturing method characterized by having a 2nd uneven | corrugated structure formation process and the peeling process which peels the said protective layer.

  Here, the manufacturing method of the original of this aspect is demonstrated using figures. FIGS. 1A to 1G are process diagrams showing an example of a method for producing an original according to this embodiment. In this embodiment, first, in the first layer preparation step, a base layer 1 ′ is prepared, and the first layer 1 made of a metal material or an inorganic material is formed on the base layer 1 ′ (FIG. 1A). Next, in the first concavo-convex structure forming step, a fine line-shaped concavo-convex structure is formed in a substantially constant direction on the surface of the first layer 1 by cutting or roll pressing, and the first concavo-convex structure 11 is formed. Form (FIG. 1B). Next, in the resist forming step, a resist material is formed on the surface of the first layer on which the first concavo-convex structure is formed to form a resist film, and the resist film is formed into a parallel strip pattern by a laser drawing method or the like. Is exposed (not shown) to form a resist 2 having a strip-like pattern parallel to the surface of the first layer 1 (FIG. 1C). Next, in the second layer forming step, the second layer 3 is formed on the exposed surfaces of the first layer 1 and the resist 2 (FIG. 1D). Next, in the protective layer forming step, the protective layer 4 made of a resist material is formed on the surface of the first layer 1 by roughly polishing the laminate made up of the resist 2 and the second layer 3 laminated on the surface thereof. (FIG. 1 (e)). Next, in the second concavo-convex structure forming step, the surface of the second layer 3 is subjected to the same processing as in the first concavo-convex structure forming step, so that the formation direction is different from the formation direction of the first concavo-convex structure 11. A line-shaped uneven structure is formed in a substantially constant direction to form a second uneven structure 31 (FIG. 1 (f)). Next, in the peeling step, the protective layer 4 formed on the first layer 1 is peeled off (FIG. 1 (g)). The original plate manufacturing method of this aspect is a manufacturing method for manufacturing the original plate 100 through the above-described steps.

2A to 2D are process diagrams showing another example of the method for producing an original plate according to this aspect. In the first layer preparation step in this embodiment, as shown in FIGS. 2A to 2D, the first layer 1 made of a single layer such as a metal substrate can be prepared and used. Further, in the protective layer forming step in this aspect, as shown in FIGS. 2A and 2B, after peeling the laminated body composed of the resist 2 and the second layer 3 laminated on the surface, A second resist 22 is formed so as to cover the first layer 1 and the second layer 3 as shown in FIG. 2C, and the second resist 22 is roughened as shown in FIG. The protective layer 4 can also be formed on the first layer 1 by polishing. In this case, the second resist 22 is roughly polished to such an extent that the surface of the second layer 3 is exposed.
The first concavo-convex structure forming step, the resist forming step, the second layer forming step, the second concavo-convex structure forming step, and the peeling step are shown in FIGS. 1 (b) to 1 (d), (f), (g), etc. Since the steps can be the same as those described, the drawings and the like are omitted.

Next, the original plate manufactured by the manufacturing method of this embodiment will be described with reference to the drawings. FIG. 3 is a schematic view showing an example of an original 100 manufactured by the manufacturing method according to this embodiment, FIG. 4 (a) is a schematic plan view showing the surface of the original 100, and FIG. 4 (b) is an illustration of FIG. 4 (a). It is an AA sectional view taken on the line.
As illustrated in FIGS. 4A and 4B, the original 100 manufactured by the manufacturing method of this aspect is formed on the surface of the first layer 1 having the first uneven structure 11 and the first layer 1. And a second layer 3 having a parallel strip-shaped pattern and having a second concavo-convex structure 31, and the first concavo-convex structure 11 and the second concavo-convex structure 31 are formed in the first layer 1. And the surface of the second layer 3, that is, the surface of the exposed first layer 1 and second layer 3 adjacent to the second layer 3 is different. Further, the surface of the original 10 has a concave portion (first layer 1) and a convex portion (second layer 3) formed in parallel strips.
FIG. 3 shows an example in which the original plate 100 is a roll plate having a roll shape. 4A is the surface of the original plate 100 shown in FIG. 3, the forming direction of the first uneven structure 11 and the second uneven structure 31 on the surface of the first layer 1 and the second layer 3 is the original plate. (Roll plate) It is 135 ° and 45 ° with respect to the rotation direction of 100, and is different by 90 °. Moreover, the arrow in Fig.4 (a) shows the formation direction of the 1st uneven structure 11 and the 2nd uneven structure 31. FIG.

  According to this aspect, in the protective layer forming step, the protective layer is formed on the surface of the first layer by forming the protective layer in the region where the second layer is not formed, that is, the region where the first layer is exposed. The first uneven structure can be protected, and the second uneven structure can be efficiently formed in the second layer. Therefore, it is possible to easily and highly accurately form a fine line-shaped uneven structure on the surfaces of the first layer and the second layer. By using the original plate manufactured in this way, a high-quality three-dimensional display pattern alignment film (hereinafter simply referred to as a pattern alignment film) is difficult to cause alignment failure when used in a three-dimensional display device. There is.)

  Hereafter, each process in the manufacturing method of the original of this aspect is demonstrated.

1. First Layer Preparation Step The first layer preparation step in this aspect is a step of preparing a first layer made of a metal material or an inorganic material. The first layer prepared in this step may be one in which the first layer is laminated on the base layer, or may be composed of only the first layer without the base layer. Hereinafter, the case where the first layer has an underlayer and the case where the first layer does not have an underlayer will be described separately.

(1) When it has a foundation layer The case where the 1st layer prepared by this process has a foundation layer is explained. Hereinafter, the first layer and the base layer will be described.

(I) First Layer First, the first layer will be described. The first layer is formed on an underlayer described later.

  The material of the first layer is a metal material or an inorganic material, has adhesiveness with an underlayer to be described later, and has a desired first uneven structure (a minute line-shaped unevenness in the first uneven structure forming step to be described later). The structure is not particularly limited as long as it can form a structure and can have adhesion to the second layer formed in the second layer forming step described later.

  Specifically, when the material of the first layer is a metal material, nickel, stainless steel, tinplate, iron, copper, silver, gold, chromium, zinc, silicon, titanium, tantalum, tin, aluminum, nickel-phosphorus and These alloys and anodized can be mentioned, and among these, nickel, copper, chromium and stainless steel are preferable. This is because these metal materials have a relatively high hardness, so that the first concavo-convex structure can be formed with high accuracy.

On the other hand, when the material of the first layer is an inorganic material, titanium oxide (TiO ₂ , Ti ₃ O ₅ ), tantalum oxide (Ta ₂ O ₅ ), silicon oxide (SiO, SiO ₂ ), tin oxide (SnO ₂ ). ), Aluminum oxide (Al ₂ O ₃ ), chromium oxide (Cr ₂ O ₃ ), barium titanate (BaTiO ₃ ), indium oxide (In ₂ O ₃ ), and zinc oxide (ZnO, ZnO ₂ ). , Carbides such as TiC, SiC, BC, WC, nitrides such as TiN, SiN, CrN, BN, AIN, CN, ZrN, barium fluoride (BaF ₂ ), magnesium fluoride (MgF ₂ ), oxidation Magnesium (MgO), diamond-like carbon (DLC), glassy carbon, ceramic, silicon nitride, carbon nitride, etc. can be mentioned. C, TiC, SiC, BC, carbides such as WC, TiN, SiN, CrN, BN, AIN, CN, be a nitride such as ZrN preferred. This is because these inorganic materials have a relatively high hardness, so that the first uneven structure can be formed with high accuracy.

  The material for the first layer is particularly preferably chromium, nickel, or DLC, and more preferably DLC, among the metal materials and inorganic materials described above. This is because since DLC is hard, a first uneven structure described later can be easily formed on the surface.

  The surface of the first layer is preferably excellent in smoothness. This is because, when the surface of the first layer is inferior in smoothness, it may be difficult to form a desired first uneven structure in a first uneven structure forming step described later. The method for imparting smoothness to the first layer is not particularly limited as long as desired smoothness can be obtained, and examples thereof include a cutting method such as supermirror polishing.

The surface roughness of the first layer is not particularly limited as long as the first concavo-convex structure can be accurately formed in the first concavo-convex structure forming step described later. For example, Ra = 10000 nm or less. In particular, Ra = 5000 nm or less is preferable, and Ra = 1000 nm or less is particularly preferable.
In addition, "surface roughness (Ra)" here is "arithmetic mean surface roughness", and is measured based on JIS-B0601.

  The thickness of the first layer is not particularly limited as long as the first concavo-convex structure can be formed in the first concavo-convex structure forming step, which will be described later, and is, for example, in the range of 1 nm to 5000 μm. Among them, it is preferable that it is within the range of 10 nm to 1000 μm, particularly preferably within the range of 50 nm to 5 μm, and more preferably within the range of 100 nm to 2 μm.

The method for forming the first layer is not particularly limited as long as it is a method capable of forming the first layer having desired smoothness and thickness on the surface of the underlayer described later.
When the material of the first layer is a metal material, for example, a wet plating process, a dry plating process, and the like can be given. Examples of the wet plating process include an electroplating method, an electroless plating method, a hot dip galvanizing method, a hot dip aluminum plating method, and an insoluble anode method. As the dry plating treatment, chemical vapor deposition such as vacuum deposition plating method, resistance heating method, sputtering method, ion plating method, etc., physical vapor deposition method (PVD method), atmospheric pressure CVD method, reduced pressure CVD method, plasma CVD method, etc. Method (CVD method) and the like.
On the other hand, when the material of the first layer is an inorganic material, the above-described dry plating treatment can be exemplified.

(Ii) Underlayer Next, the underlayer will be described. The underlayer may be a single layer or a plurality of layers.

  The material used for the base layer is not particularly limited as long as it has adhesion to the first layer formed on the base layer. For example, chromium, nickel, stainless steel, copper, aluminum, etc. Can be mentioned.

When the first layer formed on the base layer is made of a metal material, the material of the base layer and the material of the first layer may be the same material or different materials. When the materials of the underlayer and the first layer are different, the combination of the respective materials (underlayer / first layer) is preferably aluminum / chromium, aluminum / copper, or aluminum / nickel. This is because desired adhesion can be obtained.
On the other hand, when the material of the first layer is an inorganic material, the combination of the material of the base layer and the first layer (base layer / first layer) is preferably chromium / DLC or nickel / DLC. This is because the underlayer can be excellent in smoothness.

  Moreover, it is preferable that the outermost surface of the underlayer is excellent in smoothness. When the surface smoothness of the underlayer is inferior, it adversely affects the smoothness of the first layer formed on the upper layer of the underlayer, so that a desired first uneven structure is formed in the first uneven structure forming step described later. This may be difficult. Since the method for imparting smoothness to the underlayer can be the same as the method for imparting smoothness to the first layer described above, description thereof is omitted here.

  Examples of the shape of such an underlayer include a plate shape and a roll shape, and among these, a roll shape is preferable. The master produced according to this embodiment is roll-shaped, that is, the master can be made into a roll so that it can be continuously molded into the alignment layer forming layer while rotating the master. This is because the pattern alignment film can be formed easily and in large quantities, and the production efficiency can be increased.

The roll shape is not particularly limited as long as it can stably form a pattern alignment film. Specifically, the roll shape can be a roll shape, a sleeve shape, etc. The shape is preferred.
This is because the pattern shape film can be manufactured with high manufacturing efficiency by using the original plate manufactured by the manufacturing method according to this embodiment. Further, the sleeve-shaped original plate is advantageous in that it is lighter than the roll-shaped original plate and easy to handle.
Here, specifically as a roll shape, a roll with a shaft, a pipe without a shaft, etc. can be mentioned. Here, the shaftless pipe refers to a cylindrical pipe having a thickness of 3000 μm or more.
The sleeve shape represents a seamless belt-like body, which can be easily deformed by air pressure or stress, and specifically refers to a cylindrical shape having a thickness of 1000 μm or less.
In the present embodiment, in the case of a roll shape such as a roll shape or a sleeve shape, it is preferable that the seamless shape is seamless, but a plate-like base layer having a cylindrical seam can also be used.

(2) Case of not having base layer The case where the first layer prepared by this step does not have the base layer, that is, the case of being composed only of the first layer will be described.

  The material of the first layer used in this embodiment is made of a metal material or an inorganic material, can form a first uneven structure on the surface, and has adhesion with the second layer formed in the second layer forming step described later. If it has, it will not specifically limit. The specific material of the first layer can be the same as the material of the first layer described in the above-mentioned section “(1) In the case of having a base layer”, and thus the description thereof is omitted here.

  Moreover, even when it consists only of a 1st layer, it is preferable that the surface is excellent in smoothness. In addition, about this reason and about the smoothness of the specific 1st layer surface, since it can be the same as that of the content described in the section of "(1) When it has a base layer", description here is Omitted.

  The shape of the first layer is not particularly limited as long as the first concavo-convex structure can be formed on the surface, and examples thereof include a plate shape and a roll shape, and in particular, a roll shape. It is preferable. The shape of the first layer can be the same as the shape of the underlayer described in the section “(1) In the case of having an underlayer”, and thus the description thereof is omitted here.

  The thickness of the first layer is not particularly limited as long as the first concavo-convex structure can be formed in the first concavo-convex structure forming step described later, and is not particularly limited as long as it has a self-supporting property. Not.

2. First concavo-convex structure forming step The first concavo-convex structure forming step in this aspect is a step of forming a first concavo-convex structure by forming a minute line-shaped concavo-convex structure in a substantially constant direction on the surface of the first layer.

(1) 1st uneven structure First, the 1st uneven structure formed by this process is demonstrated. The first concavo-convex structure is formed on the surface of the first layer, and a fine line-shaped concavo-convex structure is formed in a substantially constant direction.

  As such a first concavo-convex structure, a high-quality three-dimensional display pattern phase difference film (hereinafter, simply referred to as a pattern phase difference film may be described) using the original plate manufactured according to this aspect. There is no particular limitation as long as it is possible to produce a pattern alignment film capable of forming a film. The first concavo-convex structure may be formed at random or may be formed in a stripe shape. FIG. 5A shows a case where the first concavo-convex structure 11 is a mode in which minute line-like concavo-convex structures are randomly formed in a substantially constant direction, and FIG. The case where it is the aspect formed in the stripe form in the substantially constant direction is shown. 5A and 5B are schematic views showing an example of the first concavo-convex structure formed by this process.

  Here, a mode in which minute line-shaped uneven structures are randomly formed in a substantially constant direction is, for example, a line-shaped uneven structure such as a minute scratch formed when the surface is rubbed. Means an aspect formed in a substantially constant direction. On the other hand, the aspect in which the line-shaped uneven structure is formed in a stripe shape means an aspect in which convex portions formed in a wall shape are formed in a stripe shape at regular intervals. The size of the line-shaped concavo-convex structure is relatively larger than the above-described random mode, and for example, the concavo-convex structure such as a minute scratch formed when the surface is rubbed is not included. is there.

  When the first concavo-convex structure is a stripe shape, the cross-sectional shape thereof has the concavo-convex structure, and when the alignment film manufactured using the original plate manufactured according to the present embodiment is used for the pattern retardation film, It is not particularly limited as long as the rod-like compound used in the retardation layer of the pattern retardation film can be arranged in a predetermined direction by the concavo-convex structure formed in the alignment film, and it is not particularly limited, substantially rectangular, substantially triangular, substantially trapezoidal, etc. It can be. Moreover, it may not be a fixed shape.

The height, width, and period of the first concavo-convex structure are such that when the alignment film is formed using the original plate manufactured according to this aspect, the liquid crystal compound is aligned by the concavo-convex structure formed on the alignment film. If it is in the range which can be made, it will not specifically limit. When the first concavo-convex structure is a striped line-shaped concavo-convex structure, the height of the first concavo-convex structure is preferably in the range of 1 nm to 500 nm, and in particular, in the range of 1 nm to 100 nm. It is more preferable, and it is particularly preferable to be within the range of 1 nm to 50 nm.
In addition, when the first uneven structure is a striped line-shaped uneven structure, the width of the first uneven structure is preferably in the range of 1 nm to 1000 nm, and in particular, in the range of 1 nm to 500 nm. More preferably, it is more preferably in the range of 1 nm to 100 nm.
Furthermore, when the first concavo-convex structure is a striped line-shaped concavo-convex structure, the period of the first concavo-convex structure may not necessarily be constant, but is preferably in a range of approximately 1 nm to 1000 nm. In particular, it is preferably in the range of 1 nm to 100 nm.
When the first concavo-convex structure is a striped line-shaped concavo-convex structure, the height, width, and period of the first concavo-convex structure are within the above ranges, whereby the rod-shaped compound can be stably formed using the original plate. This is because a pattern alignment film that can be arranged can be manufactured.

  The height, width, and period of the first concavo-convex structure refer to the lengths indicated by l, m, and n in FIG. Moreover, FIG. 6 is explanatory drawing which shows the case where the cross-sectional shape of the 1st uneven structure 11 is a rectangular shape.

(2) Method for forming first concavo-convex structure The method for forming the first concavo-convex structure used in this step is not particularly limited as long as it is a method capable of forming the first concavo-convex structure in a desired size and direction. However, for example, a cutting process for polishing the surface of the first layer and a roll press process for pressing a mold having a concavo-convex pattern to form can be mentioned.
Hereinafter, cutting and roll pressing will be described.

(I) Cutting Process The cutting process used in this step is a cutting process in which a desired uneven structure is formed by polishing the surface. In this step, a general method can be used, for example, grinding stone polishing, paper polishing, tape polishing, sand blasting method, shot blasting method, grit blasting method, blasting method such as glass bead blasting method, nylon, polypropylene, chloride While supplying synthetic resin hair made of synthetic fibers such as vinyl resin, non-woven fabric, animal hair, brush graining method using brush material such as steel wire, wire graining method by scratching with metal wire, supplying slurry liquid containing abrasive Examples thereof include a brush polishing method (brush graining method), a ball grain method, a buffing method such as a liquid honing method, and a shot peening method. In this step, tape polishing and paper polishing are particularly preferable. This is because the direction of minute line-shaped irregularities can be easily controlled.

(Ii) Roll press process The roll press process used in this step is a rolling process for forming a desired concavo-convex structure on the surface by pressing a rotating roller having a concavo-convex pattern. Further, in the roll press process, a concavo-convex structure is formed on the surface of the molding object by passing a rotating roller in the roll press machine a plurality of times.

FIG. 7 is a schematic view showing an example of roll press processing. As shown in FIG. 7, the roll press machine 200 is provided with a rotating roller 5 having a concavo-convex pattern so as to contact the workpiece 6. By rotating the rotating roller 5 provided so as to be in contact with the molding object 6, the uneven pattern installed on the rotating roller 5 is pressed against the molding object 6.
In this way, the roll press process is performed by pressurizing with a rotating roller provided in contact with the object to be molded, whereby the uneven pattern installed on the rotating roller becomes a mold, and not by cutting but by deformation by pressing. Can be processed.

  By performing such a roll press process, it is possible to perform a localization / constant pressure press, the thickness of the molded body can be made uniform, and intermittent / continuous production is possible.

  Since the cross-sectional shape, height, width, and period of the uneven pattern on the surface of the rotating roller used for the roll press process can be the same as the height, width, and period of the first uneven structure described above, Is omitted.

3. Resist forming step The resist forming step in this embodiment is a step of forming a resist having a parallel strip-shaped pattern on the surface of the first layer on which the first concavo-convex structure is formed.

(1) Resist pattern shape The resist pattern shape formed in this step will be described. The pattern shape of the resist is a parallel strip.

  In the original plate manufactured according to this aspect, depending on the formation direction of the resist pattern formed in this step and the pattern shape of the resist, as shown in FIG. A first layer width W1 ′ and a second layer width W2 ′ are defined.

  As shown in FIG. 3, when the original plate 100 is a roll plate, the first layer 1 and the second layer 3 are formed as a resist forming direction formed in this step, that is, a parallel strip-shaped direction. A direction along the rotation direction of the roll is preferable.

Further, as shown in FIG. 1C, the width W1 of the resist 2 and the width W2 of the gap between the adjacent resists 2 may be different or the same. However, in this embodiment, the width W1 of the resist 2 and the width W2 of the gap between the adjacent resists 2 are preferably the same.
Usually, in a 3D liquid crystal display device or the like capable of three-dimensional display, the right-eye pixel and the left-eye pixel portion are formed with the same width, and therefore the width of the first layer ( W1 ′) and the width (W2 ′) of the second layer (that is, in FIG. 1C, the width W1 of the resist 2 and the width W2 of the gap between the adjacent resists 2) are made the same. Of the first alignment region and the second alignment region of the pattern alignment layer formed corresponding to the first uneven structure of the first layer and the second uneven structure of the second layer. This is because the width can be made the same. As a result, when the pattern alignment film formed from the original plate is used in a liquid crystal display device capable of three-dimensional display, the pattern in which the first alignment region and the second alignment region are formed and the liquid crystal display device are used. In the color filter, it becomes easy to make the correspondence with the pattern in which the pixel portion is formed, and a 3D liquid crystal display device can be easily manufactured using the pattern alignment film formed by the original plate. Because.
Further, since the pixel portion used in the light emitting display device is also formed with the same width, the first alignment region and the second alignment region are formed with the same width by setting the widths of the first alignment region and the second alignment region to the same width. When the pattern alignment film is used in a 3D light emitting display device capable of three-dimensional display, a pattern in which the first alignment region and the second alignment region are formed and a pixel portion used in the light emitting display device are formed. This is because a 3D light emitting display device can be easily manufactured using the pattern alignment film formed from the original plate.

  A specific width of the width W1 of the resist 2 and the width W2 of the gap between the adjacent resists 2 shown in FIG. 1C (in FIG. 1H, the width W1 ′ and the first width 1 of the first layer 1 of the original 100). The width W2 ′) of the two layers 3 is appropriately determined according to the use of the pattern alignment film formed using the original plate produced according to this embodiment. For example, when used for manufacturing a liquid crystal display device capable of three-dimensional display, the width W1 of the resist 2 and the width W2 of the gap between adjacent resists 2 are for the right eye of the liquid crystal display device capable of three-dimensional display. It is determined appropriately so as to correspond to the width in which the pixel portion for the left eye is formed. As described above, the width W1 of the resist 2 and the width W2 of the gap between the adjacent resists 2 are not particularly limited, but are usually preferably in the range of 50 μm to 1000 μm, and in the range of 100 μm to 600 μm. More preferably.

(2) Resist structure The thickness of the resist formed in this step is particularly limited as long as the second layer having a desired parallel belt-like pattern can be formed in the second layer forming step described later. Not. In the protective layer forming step described later, when the protective layer is formed by roughly polishing a laminate composed of the resist and the second layer stacked on the surface thereof, the second layer forming step described later is used. It is preferable to be formed thicker than the thickness of the two layers. The thickness of such a resist is in the range of 0.1 μm to 200 μm, in particular in the range of 0.1 μm to 50 μm, particularly in the range of 0.1 μm to 10 μm, more preferably in the range of 3 μm to 5 μm. Preferably there is.

(3) Resist material and resist formation method The resist material used in this step is not particularly limited as long as it can be peeled off after forming a second layer to be described later. Any of (a light-irradiated part dissolves) and a negative resist material (a light-irradiated part hardens) can be used. Examples of the positive resist material include a chemically amplified resist using a novolac resin as a base resin. Examples of the negative resist material include a chemically amplified resist based on a crosslinked resin, specifically, a chemically amplified resist obtained by adding a crosslinking agent to polyvinylphenol and further adding an acid generator.

  Examples of a method for forming the resist used in this step into parallel strips include a method in which a resist film is formed by applying a resist material, then exposed to parallel strips, and then developed. Can do.

  As a method for forming the resist film by applying the resist material described above, a general coating method can be used. For example, a spin coating method, a casting method, a dipping method, a bar coating method, a blade coating method, a roll A coating method, a gravure coating method, a flexographic printing method, a spray coating method, or the like can be used.

As a method for exposing the resist film in parallel strips, an electron beam drawing method or a laser drawing method used for normal photomask drawing can be used. Alternatively, a method of performing ultraviolet irradiation through a mask can be used.
In this step, the laser drawing method is particularly preferable. This is because even if the shape of the metal substrate is a roll shape, the pattern can be accurately exposed.
Moreover, as a developing method of the resist film after exposure, a general developing method can be used.

4). Second layer forming step The second layer forming step in this aspect is a step of forming a second layer having a parallel strip-like pattern made of a metal material or an inorganic material on the surface of the first layer exposed after the resist step. It is.

The material of the second layer is a metal material or an inorganic material, can be formed with a desired thickness, has adhesiveness with the first layer, and is desired on the surface in the second concavo-convex structure forming step described later. If it can form the 2nd uneven structure of this, it will not specifically limit.
Since the specific metal and inorganic material used for the material of the second layer can be the same as the metal and inorganic material used for the material of the first layer described above, the description here is Omitted.

  Further, the second layer formed in this step has a parallel strip pattern. The pattern of the second layer can be the same as the content described in the section of the resist pattern shape in “3. Resist formation step” described above, and thus the description thereof is omitted here.

  The thickness of the second layer formed in this step, that is, the step between the first layer and the second layer is preferably in the range of 10 nm to 5 μm, and in particular, in the range of 50 nm to 1 μm. Is preferred. When the step is within the above-mentioned range, when the pattern alignment film is formed using the original plate manufactured according to this aspect, the first formed on the pattern alignment layer corresponding to the first layer and the second layer. This is because disorder of the alignment of the liquid crystal compound in the vicinity of the end portions of the first retardation region and the second retardation region can be effectively suppressed.

In addition, the thickness of the 2nd layer formed in this process considers the thickness of the 2nd layer in which the 2nd uneven structure was formed in the original plate manufactured by this aspect.
In addition, the thickness of the 2nd layer in which the 2nd uneven structure was formed shall mean the distance shown by D1 in FIG.4 (b). D1 is an average value of the distance from the first layer surface to the convex portion of the second concavo-convex structure and the distance from the first layer surface to the concave portion of the second concavo-convex structure. Further, the surface of the first layer (reference point for measuring the thickness of the second layer) is obtained by calculating the average value of the convex portion and the concave portion in the first concave-convex structure.

  The method for forming the second layer in this step is not particularly limited as long as it can be accurately formed to have a desired thickness, and examples thereof include dry plating and wet plating. Note that the specific dry plating process and wet plating process can be the same as the above-described method for forming the first layer, and thus description thereof is omitted here.

  In the case where the second layer is formed by dry plating in this step, the second layer is normally formed continuously, so that the second layer is formed on the surface of the first layer and the resist. It will be.

  On the other hand, when the second layer made of a metal material is formed by wet plating in this step, the first layer made of metal is selected. For example, when wet plating is used, the second layer is formed so that the second layer is formed only on the exposed surface of the first layer without forming the second layer on the resist surface. Is also possible.

5. Protective layer forming step The protective layer forming step in this embodiment is a step of forming a protective layer made of a resist material on the surface of the first layer.

  This step can be divided into two embodiments depending on the method for forming the protective layer. That is, a mode in which the protective layer is formed on the first layer by rough polishing the laminate formed of the resist formed in the second layer forming step and the second layer stacked on the surface (first embodiment) ), And a laminate composed of the resist and the second layer laminated on the surface thereof, and then a second resist is formed so as to cover the first layer and the second layer, and the second resist is roughly polished. By doing so, it can be divided into two modes: a mode in which a protective layer is formed on the first layer (second mode). Hereinafter, each aspect will be described.

(1) First Embodiment The resist formation step of this embodiment is a laminate comprising the resist formed in the second layer formation step and the second layer laminated on the surface thereof (hereinafter simply referred to as a laminate). Is a step of forming a protective layer on the first layer by rough polishing.

  In this embodiment, “the protective layer is formed by roughly polishing the laminate” means that the second layer is removed by polishing the laminate, and the thickness of the resist is changed to that of the first layer. The protective layer is formed by polishing to a thickness that can protect the surface and does not hinder the formation of the second uneven structure on the surface of the second layer in the second uneven structure forming step described later. Refers to that.

  In this embodiment, since it becomes possible to form a protective layer using the above-mentioned laminated body, manufacturing cost can be reduced and the manufacturing process can be simplified.

  As the method for polishing the above-mentioned laminate, the first layer in which the second layer is not formed can be protected by polishing the above-described laminate, and the surface of the second layer is not damaged. And if it is a method which can form the protective layer which does not prevent forming a desired 2nd uneven structure on the surface of a 2nd layer in the 2nd uneven structure formation process mentioned later, it will not specifically limit. Specifically, a paper polishing method, a sand blast method, a rubbing method, a grindstone polishing method, a buff polishing method, a vertical polishing method, an electrolytic polishing method, a lapping polishing method, and the like can be given.

  The thickness of the protective layer formed in this step can protect the first layer, does not cause scratches on the surface of the second layer, and the second layer in the second uneven structure forming step described later. Although it will not specifically limit if it is the thickness of the grade which does not prevent forming a desired 2nd uneven structure on the surface, Usually, it is set as the thickness equivalent to the thickness of a 2nd layer. Therefore, the thickness of the protective layer is preferably in the range of 10 nm to 5 μm, and more preferably in the range of 50 nm to 1 μm. This is because if the thickness of the protective layer is less than the above range, the surface of the second layer may be scratched during the process of polishing the above-mentioned laminate to form the protective layer. Further, when the thickness of the protective layer exceeds the above range, in the second uneven structure forming step described later, there is a possibility that the process of forming the second uneven structure on the surface of the second layer may be hindered.

  Further, in this step, after the above-mentioned laminate is roughly polished to form a protective layer, there is a step of cleaning the resist or polishing residue remaining on the surface of the second layer using an organic alkaline solution or the like. It may be. This makes it possible to form the second concavo-convex structure with higher accuracy on the surface of the second layer in the second concavo-convex structure forming step described later.

(2) Second Embodiment In the protective layer forming step of this embodiment, after peeling off the laminate, a second resist is formed so as to cover the first layer and the second layer, and the second resist is formed. In this step, a protective layer is formed on the first layer by rough polishing.

  In this embodiment, “the protective layer is formed by roughly polishing the second resist” means that the surface of the first layer can be protected by the second resist, and the second layer The protective layer is formed by polishing to such a thickness that it can be exposed without damaging the surface.

  In this embodiment, since the protective layer is formed by peeling the above-mentioned laminate to form the second resist and roughly polishing this, the polishing residue contains a metal material, an inorganic material, or the like. Therefore, it is possible to reduce the generation of scratches caused by the contact of the polishing residue with the surface of the second layer. Therefore, the second concavo-convex structure can be formed with high accuracy on the surface of the second layer, and the alignment film for three-dimensional display using the original plate manufactured according to this aspect is less likely to cause alignment failure. be able to.

  As a peeling method of the laminate used in this step, a general resist peeling method can be used. Specifically, a method of ashing by oxygen plasma treatment or cleaning with an organic alkali solution can be exemplified. Especially, in this embodiment, the method using an organic alkali liquid is preferable.

  Further, the resist material used for the second resist can be the same as that described in the above-mentioned section “3. Resist forming step”, and thus the description thereof is omitted here.

  The second resist is usually formed by applying a resist material so as to cover the first layer and the second layer. The resist material coating method can be the same as that described in the above-mentioned section “3. Resist formation step”, and thus the description thereof is omitted here.

  The thickness of the second resist is not particularly limited as long as it is possible to form a protective layer having a desired thickness by rough polishing the second resist, depending on the thickness of the second layer and the like. It can be selected appropriately.

  Regarding the polishing method of the second resist used in this step, the thickness of the protective layer formed by this step, and the like, the second layer and the lamination of the resist described in the above-mentioned section “(1) First embodiment” Since it can be the same as the polishing method of the body and the thickness of the protective layer, description thereof is omitted here.

(3) Other Embodiments As another embodiment of the protective layer forming step in this aspect, for example, in the second layer forming step described above, the second layer is not formed on the surface of the resist by wet plating, and exposed. When the second layer is formed so that the second layer is formed only on the surface of the first layer, a mode in which a protective layer is formed by rough polishing the resist can be exemplified. In this case, the resist formed for pattern formation of the second layer can be used as a protective layer, and it is possible to prevent the polishing residue from containing a metal material or an inorganic material.
In this case, the resist polishing method, the thickness of the protective layer, and the like can be the same as the contents described in the above-mentioned section “(1) First embodiment”, and thus the description thereof is omitted here. To do.

6). Second concavo-convex structure forming step In the second concavo-convex structure forming step in this aspect, a minute line-like concavo-convex structure having a formation direction different from the formation direction of the first concavo-convex structure is formed on the surface of the second layer in a substantially constant direction. And forming the second uneven structure.

(1) 2nd uneven structure The 2nd uneven structure formed in this process is demonstrated. The second concavo-convex structure is formed on the surface of the second layer, and a minute line-shaped concavo-convex structure having a formation direction different from the formation direction of the first concavo-convex structure is formed in a substantially constant direction.

(I) Formation direction The formation direction of the second uneven structure is not particularly limited as long as the formation direction is different from the formation direction of the first uneven structure. Especially, as the formation direction of the second concavo-convex structure, the first concavo-convex structure can be used as a master capable of forming a pattern alignment film that can be used for a pattern retardation film capable of three-dimensional display. It is preferable that the forming direction be different from the forming direction of the second concavo-convex structure. Specifically, as the formation direction of the second concavo-convex structure, there are a case where the formation direction of the second concavo-convex structure differs by 90 ° and a case where it differs by 45 ° with respect to the formation direction of the first concavo-convex structure described above. Can be mentioned.
Hereinafter, each case will be described separately.

(a) Case of 90 ° Difference The second concavo-convex structure has a formation direction different from the formation direction of the first concavo-convex structure by 90 °. Such a second concavo-convex structure is not particularly limited as long as the formation directions of the first concavo-convex structure and the second concavo-convex structure are different by 90 °. For example, when the original plate is a roll plate, the rotation direction of the roll On the other hand, the formation direction of the first concavo-convex structure and the second concavo-convex structure (first concavo-convex structure / second concavo-convex structure) is preferably 45 ° / 135 ° and 0 ° / 90 °.
In FIG. 4A, the directions of the first concavo-convex structure 11 formed on the surface of the first layer and the second concavo-convex structure 31 formed on the surface of the second layer are 45 ° and 135 °. 8 indicates the roll plate surface at 0 ° and 90 °.
Moreover, since the reference numerals in FIG. 8 indicate the same members as those in FIG. 4A, description thereof is omitted here.

  Here, the original plate manufactured by the manufacturing method of this embodiment is used for forming the alignment layer of the pattern alignment film. The alignment layer has a first alignment region and a second alignment region each having a fine line-shaped uneven structure corresponding to the first uneven structure and the second uneven structure of the original plate, which are formed in a pattern. . The pattern alignment film is used for a pattern retardation film, and is used for forming a retardation layer by arranging rod-like compounds such as liquid crystal in the alignment layer. Furthermore, the retardation layer of the patterned retardation film is such that the first retardation region and the second retardation region corresponding to the first alignment region and the second alignment region are formed in a pattern.

  As described above, when the formation directions of the first concavo-convex structure and the second concavo-convex structure are orthogonal to each other, the first alignment region and the second alignment region are formed using the original plate having the first concavo-convex structure and the second concavo-convex structure. By forming the patterned alignment film, the in-plane retardation of the first retardation region and the second retardation region of the patterned retardation film formed on the first alignment region and the second alignment region is λ / 4. It can be equivalent to minutes. In this case, since the linearly polarized light becomes right circularly polarized light and left circularly polarized light by transmitting through these retardation regions, respectively, in order to manufacture a display device capable of easily three-dimensionally displaying the pattern retardation film. Can be suitably used.

Here, the in-plane retardation (Re) value is an index indicating the degree of birefringence in the in-plane direction of the refractive index anisotropic body, and the refraction in the slow axis direction having the largest refractive index in the in-plane direction. When the refractive index is Nx, the refractive index in the fast axis direction orthogonal to the slow axis direction is Ny, and the thickness in the direction perpendicular to the in-plane direction of the refractive index anisotropic body is d,
Re [nm] = (Nx−Ny) × d [nm]
It is a value represented by. The in-plane retardation value (Re value) can be measured by, for example, KOBRA-WR manufactured by Oji Scientific Instruments Co., Ltd. by the parallel Nicol rotation method. It is also possible to measure using the Mueller matrix with AxoScan made by. In the present specification, unless otherwise stated, the Re value means a value at a wavelength of 589 nm.

(b) When different by 45 ° The second concavo-convex structure has a formation direction different from the formation direction of the first concavo-convex structure by 45 °. Such a second concavo-convex structure is not particularly limited as long as the formation directions of the first concavo-convex structure and the second concavo-convex structure are different by 45 °. For example, when the original plate is a roll plate, the rotation direction of the roll On the other hand, the formation direction of the first concavo-convex structure and the second concavo-convex structure (first concavo-convex structure / second concavo-convex structure) is preferably 0 ° / 45 ° and 0 ° / 135 °.
9 shows the direction of the first concavo-convex structure 11 formed on the surface of the first layer and the second concavo-convex structure 31 formed on the surface of the second layer, and FIG. 10 shows the direction of 0 ° / 135. It shows the roll plate surface in the case of °.
Also, the reference numerals in FIGS. 9 and 10 indicate the same members as those in FIG. In addition, the arrows in the drawing indicate the direction in which the first concavo-convex structure 11 and the second concavo-convex structure 31 are formed.

  When the formation direction of the first concavo-convex structure differs from the formation direction of the second concavo-convex structure by 45 °, when the pattern alignment film in which the first alignment region and the second alignment region are formed using the original plate, Furthermore, the in-plane retardation value of the said 1st phase difference area | region and 2nd phase difference area | region of a pattern phase difference film using this can be made to correspond to (lambda) / 2 minutes. Further, in this case, by using in combination with a λ / 4 plate, it can be suitably used for easily manufacturing a 3D display device.

Here, the point that a 3D display device can be easily manufactured by combining a pattern retardation film having such a retardation region and a λ / 4 plate will be described in more detail. FIG. 11 shows an example in which a liquid crystal display device capable of three-dimensional display is manufactured using a combination of a pattern retardation film formed using an original plate manufactured by the manufacturing method of the present invention and a λ / 4 plate. FIG. As shown in FIG. 11, a liquid crystal display device using a combination of a pattern retardation film formed using an original plate manufactured by the manufacturing method of the present invention and a λ / 4 plate can perform three-dimensional display by a passive method. It will be something. The principle is as follows.
First, the pixel portion of the light-emitting display is divided into a plurality of two types of pixels, a right-eye video display pixel and a left-eye video display pixel, and a right-eye video is displayed on one group of pixels, The left eye image is displayed on the pixels of the group. Next, as the pattern retardation film, the first retardation region of the retardation layer is formed so as to correspond to the arrangement pattern of the left-eye image display pixels, and the second retardation region is the arrangement pattern of the right-eye image display pixels. Prepare one that is formed to correspond to. And such a pattern phase difference film is arrange | positioned at the display surface side of a polarizing plate, Furthermore, (lambda) / 4 board is arrange | positioned at the display surface side of a pattern phase difference film. At this time, the direction of the slow axis of the first retardation region and the direction of the polarization axis of the polarizing plate intersect at 45 °, and further, the slow axis direction of the first retardation region and the λ / 4 plate The slow axis direction should be parallel or orthogonal. By disposing the pattern retardation film and the λ / 4 plate in this manner, images displayed by the right-eye image display pixel and the left-eye image display pixel (hereinafter referred to as “right-eye image” and “left-eye image”, respectively) Is visually recognized by the observer through the following route.
That is, each image displayed by the right-eye image display pixel and the left-eye image display pixel first passes through the polarizing plate, and thus is converted into linearly polarized light. Here, in FIG. 11, since the polarization axis of the polarizing plate is in the 0 ° direction, each image transmitted through the polarizing plate is also linearly polarized light in the 0 ° direction. Next, each image converted into linearly polarized light (0 °) in this way enters the pattern phase difference film, but the image for the left eye passes through the first phase difference region, and the image for the right eye is the first image. Since it passes through the two phase difference regions, the left-eye image is transmitted through the pattern retardation film as linearly polarized light (L1) having a polarization axis of 90 °, but the right-eye image has no change and the polarization axis is 0 °. The pattern retardation film is transmitted through the linearly polarized light (L2). Next, when L1 and L2 are incident on the λ / 4 plate, the left-eye image is converted into right-handed circularly polarized light (C1), and the right-eye image is converted into left-handed circularly polarized light (C2). It will be.
As described above, the right-eye image and the left-eye image that have passed through the pattern retardation film and the λ / 4 plate are converted into circularly polarized light orthogonal to each other. Wearing circularly polarized glasses with circularly polarized lenses that are orthogonal to each other so that the right-eye image passes only through the right-eye lens and the left-eye image passes only through the left-eye lens. Can reach only the right eye, and the left-eye video can reach only the left eye, and three-dimensional display becomes possible.

(Ii) Second concavo-convex structure As the second concavo-convex structure, a pattern alignment film capable of forming a high-quality pattern retardation film can be manufactured using the original plate manufactured according to this aspect. If it is a thing, it will not specifically limit. The second concavo-convex structure may be formed at random or may be formed in a stripe shape.

  In addition, the second concavo-convex structure and the first concavo-convex structure described above are the same aspect, that is, an aspect in which both the second concavo-convex structure and the first concavo-convex structure are formed in a stripe shape, or the second concavo-convex structure and the first concavo-convex structure. An aspect in which both of the concavo-convex structure are randomly formed may be used. Moreover, the aspect from which the said 2nd uneven structure and the said 1st uneven structure differ, ie, the aspect in which one is formed in stripe form among the said 2nd uneven structure or the 1st uneven structure, and the other is formed at random. It may be.

  The height, width, period, and the like of the second concavo-convex structure can be the same as the contents described in the section of the first concavo-convex structure described above, and thus description thereof is omitted here.

(2) Method for forming second concavo-convex structure The method for forming the second concavo-convex structure used in this step can be the same as the method for forming the first concavo-convex structure described above, and the description thereof is omitted here. .

7). Peeling process The peeling process in this aspect is a process of peeling the protective layer.

  The method for removing the protective layer used in this step can be the same as the general resist removing step. Specifically, since it can be the same as the peeling method of the laminate described in the section of the second embodiment of the protective layer forming step, description thereof is omitted here.

8). Other Steps The method for producing an original according to this aspect includes the above-described steps, but may include other steps as necessary.
As such other processes, for example, polishing performed by cutting the surface of the first layer or the second layer when the first concavo-convex structure forming process and the second concavo-convex structure forming process are performed. Examples include a removal step for removing waste. Examples of the removal method include a suction method, a removal method using a solvent, and the like.

II. Second Aspect A second aspect of the method for producing an original plate according to the present invention includes a first layer forming step of forming a first layer made of a metal material or an inorganic material, and a fine line-shaped uneven structure on the surface of the first layer. A first concavo-convex structure forming step for forming a first concavo-convex structure by forming in a substantially constant direction, and a resist for forming a resist having a parallel strip-like pattern on the surface of the first layer on which the first concavo-convex structure is formed Forming step, second layer forming step of forming a second layer made of a metal material or an inorganic material and having a parallel strip pattern on the surface of the first layer exposed after the resist step, and the first layer A protective layer forming step of forming a protective layer made of a resist material on the surface of the substrate, and a fine line-shaped uneven structure in the same formation direction as the formation direction of the first uneven structure on the surface of the second layer in a substantially constant direction. Forming a second concavo-convex structure The manufacturing method characterized by having a 2nd uneven | corrugated structure formation process and the peeling process which peels the said protective layer.

Here, the original plate 100 manufactured by the manufacturing method of this aspect will be described with reference to the drawings. FIG. 3 is a schematic view showing an example of a three-dimensional display pattern alignment film master according to this embodiment. 12A is a schematic plan view showing the surface of the three-dimensional display pattern alignment film original plate 100, and FIG. 12B is a cross-sectional view taken along the line BB of FIG. 12A.
As illustrated in FIGS. 12A and 12B, the original 100 manufactured by the manufacturing method of this aspect is formed on the surface of the first layer 1 having the first uneven structure 11 and the first layer 1. And a second layer 3 having a parallel strip-shaped pattern and having a second concavo-convex structure 31, wherein the first concavo-convex structure 11 and the second concavo-convex structure 31 are formed in the first layer. The surfaces of the first layer 2 and the second layer 3, that is, the exposed surfaces of the first layer 1 and the second layer 3 adjacent to the second layer 3 are the same.
FIG. 3 shows an example in which the original plate 100 for a three-dimensional display pattern alignment film is a roll plate having a roll shape. When FIG. 12A is the surface of the original plate 100 shown in FIG. 2, the formation direction of the first uneven structure 11 and the second uneven structure 31 is the three-dimensional display pattern alignment film original plate (roll plate) 100. It is 45 degrees with respect to the rotation direction of the same, and is the same. In addition, the arrows in FIG. 12A indicate the direction in which the first concavo-convex structure 11 and the second concavo-convex structure 31 are formed.

  In addition, about the process drawing of the manufacturing method of the original plate of this aspect, since it can be the same as that described in FIGS. 1A to 1G described in the section of the first aspect described above, here The description in is omitted.

  In this aspect, similarly to the first aspect described above, in the protective layer forming step, the first layer is formed by forming the protective layer in the region where the second layer is not formed, that is, the region where the first layer is exposed. The first uneven structure formed on the surface of the layer can be protected, and the second uneven structure can be efficiently formed in the second layer. Therefore, it is possible to easily and highly accurately form a fine line-shaped uneven structure on the surfaces of the first layer and the second layer. By using the original plate thus produced, it is possible to obtain a high-quality pattern alignment film in which alignment failure hardly occurs when used in a three-dimensional display device.

  Hereafter, each process of the manufacturing method of the original plate of this aspect is demonstrated. In addition, about the 1st layer preparation process in this aspect, the 1st uneven structure formation process, the resist formation process, the protective layer formation process, the exfoliation process, and other processes etc., in the above-mentioned "1. First aspect" section. Since it can be made to be the same as that of the content demonstrated, description here is abbreviate | omitted.

1. Second layer forming step The second layer forming step in this aspect is a step of forming a second layer having a parallel strip-like pattern made of a metal material or an inorganic material on the surface of the first layer exposed after the resist step. It is.

  Here, the thickness of the second layer formed by this step is usually the low retardation region in the pattern retardation film using the pattern alignment film produced using the original produced by the production method of this embodiment. This is appropriately determined depending on how much the difference in the phase difference value from the high phase difference region is. Hereinafter, this point will be described.

  Since the original plate manufactured according to this aspect has the second layer on the surface of the first layer, the original plate has a convex portion and a concave portion on the surface of the original plate. Since the alignment layer of the pattern alignment film manufactured using such an original plate is formed by forming the above-described convex portions and concave portions, the portions having different thicknesses on the surface of the alignment layer, that is, the thickness A film region and a thin film region are formed. In addition, in a pattern retardation film using such a pattern alignment film, a pattern having different retardation values corresponding to the difference in thickness between the thick film region and the thin film region is formed in the retardation layer. Become.

Therefore, the thickness of the second layer manufactured by this step corresponds to the difference in thickness between the thick film region and the thin film region of the alignment layer of the pattern alignment film manufactured by the manufacturing method of this aspect.
Here, the difference in thickness between the thick film region and the thin film region is appropriately determined depending on how much the difference in the retardation value between the low retardation region and the high retardation region is to be made. Accordingly, the difference in thickness between the thick film region and the thin film region is appropriately determined depending on the use of the pattern retardation film, the type of rod-shaped compound used in the retardation layer described later, and the like, and is particularly limited. It is not a thing. In particular, in the present invention, the difference in thickness between the thick film region and the thin film region is the in-plane retardation value of the high retardation region of the retardation layer and the in-plane retardation value of the low retardation region of the retardation layer. The difference is preferably a distance corresponding to λ / 2 minutes. Thereby, for example, when forming the retardation layer on the alignment layer, the in-plane retardation of the low retardation region corresponds to λ / 4 minutes, so that the obtained pattern retardation film has a low retardation. The in-plane retardation value of the region corresponds to λ / 4 minutes, and the in-plane retardation value of the high retardation region corresponds to λ / 4 + λ / 2. In such a pattern retardation film, This is because the linearly polarized light passing through the low phase difference region and the high phase difference region becomes circularly polarized light that is orthogonal to each other, so that it can be more suitably used for manufacturing a three-dimensional display device.

  Therefore, as the thickness of the second layer, the difference in thickness between the thick film region and the thin film region in the alignment layer of the pattern alignment film manufactured using the original plate manufactured by the manufacturing method of this aspect is the distance described above. It is preferable to adjust and form so that it may become.

  In addition, since it can be made to be the same as that of the content of the 2nd layer formation process in the above-mentioned "1. 1st aspect" except the point mentioned above about the 2nd layer formation process in this aspect, it is here. Description of is omitted.

2. Second concavo-convex structure forming step In the second concavo-convex structure forming step in this aspect, a minute line-like concavo-convex structure having the same formation direction as the first concavo-convex structure is formed on the surface of the second layer in a substantially constant direction. Forming the second concavo-convex structure.

The second uneven structure formed in this step is not particularly limited as long as it has the same formation direction as the first uneven structure. For example, as shown in FIG. 13, the formation direction of the first concavo-convex structure 11 and the second concavo-convex structure 31 may be 0 °, or the first concavo-convex structure 11 and the second layer as shown in FIG. The direction of the minute line-shaped concavo-convex structure 31 formed on the surface may be 90 °.
The detailed contents of the fine line-like uneven structure other than the above and the second uneven structure forming step can be the same as those described in the first aspect.

III. Other Embodiments The original plate produced in the first embodiment of the method for producing an original plate of the present invention is different from the first retardation region and the second retardation layer in the pattern retardation film because the arrangement directions of the rod-like compounds constituting the retardation layer are different. It is used for manufacturing a pattern alignment film in which a retardation region is formed. On the other hand, the original produced in the second aspect of the original production method of the present invention is different from the first retardation region and the first retardation region in the pattern retardation film because the thicknesses of the first retardation region and the second retardation region are different. It is used for manufacturing a pattern alignment film in which two retardation regions are formed.
Therefore, as another aspect of the manufacturing method of the original plate of the present invention, for example, in the pattern retardation film, the arrangement direction of the rod-shaped compounds constituting the retardation layer is different, and the first retardation region and the second retardation region Examples thereof include a method for producing an original plate capable of producing a pattern alignment film in which the first retardation region and the second retardation region are formed by different thicknesses. More specifically, in the second layer forming step in the original plate manufacturing method of the present invention, the second layer forming step in the second aspect described above is applied as the method for manufacturing the original plate, thereby forming the second uneven structure. The manufacturing method which applies the 2nd uneven structure formation process in the 1st aspect mentioned above in a process is mentioned.

IV. Others The original plate produced by the production method of the present invention has a concave portion (first layer) and a convex portion (second layer) formed in a strip shape, and a minute line-like concave-convex structure is formed on the surface in a substantially constant direction. It has been done.

  The original plate is used for producing a three-dimensional display pattern alignment film used for a three-dimensional display pattern retardation film. More specifically, a fine line-shaped uneven structure of the original plate is formed on the alignment film forming layer made of the resin composition, and a first alignment region (convex having a fine line-shaped uneven structure corresponding to this shape is formed. Shape) and a pattern alignment film for three-dimensional display having a second alignment region (concave shape).

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

  Hereinafter, the present invention will be specifically described with reference to examples.

[Example]
The first layer forming step was performed by the following procedure. First, the underlayer was prepared as follows. Plate making was performed using an aluminum pipe having a diameter of 300 mm and a surface length of 1260 mm. As the aluminum material used for the aluminum pipe, it is possible to use a soft 1000 series aluminum material, but since it is more preferable to have a free cutting property, a 5000 series aluminum material was used this time. The surface of the aluminum pipe was surfaced by a lathe, and then an electrolytic copper plating of 200 μm to 300 μm was formed on the surface of the aluminum pipe as an underlayer for forming the first layer, and grinding was performed for centering and flatness. An Ni plating of about 5 μm was formed thereon. This is for the purpose of filling the scratches during grinding of the grindstone with the thickness of the Ni plating layer. If the grindstone polishing scratches are not filled, the liquid crystal or the like may be aligned in the alignment film produced using the obtained original plate due to scratches during the grindstone polishing. At this time, Cr plating may be used instead of Ni plating. However, since Cr plating has micro cracks such as micro cracks, when Cr plating is laminated, it is necessary to select one having no micro cracks. In addition, the wet plating method is used this time, but film formation by a dry plating method may be used. In order to fill the scratches at the time of grinding the grinding wheel, it is preferable to use a wet plating method because it is preferable to increase the thickness.

  Next, the first layer was formed as follows. On the Ni plating layer, about 2 μm of DLC (diamond-like carbon) was laminated as a first layer by plasma CVD. Note that the PVD method may be used instead of the CVD method. A thicker thickness is better because the material has its own hardness, but a thin film of about 0.1 μm may be used.

Next, the 1st uneven | corrugated structure formation process was performed. The entire surface of the DLC film is polished with a paper polishing machine manufactured by Sink Laboratories. At this time, the polishing angle was inputted to the paper polishing machine by specifying the angle, and scratched in the 45 degree direction. The angle can be 45 degrees because the moving speed of the polishing head and the rotational speed of the cylinder are the same.
The polishing film used for polishing is No. 20000 (model number: LDF # 20000) of a diamond film manufactured by Sankyori Chemical. The reason why diamond is used is that DLC has high hardness (Hv 1100-2500), and when alumina oxide, which is a general abrasive, is used, the abrasive itself is scraped, resulting in thick polishing scratches. This is to cause alignment failure.
After the polishing in the 45 degree direction, the plate surface was washed with a solvent or the like. Although the above-described cleaning is optional, it is preferable to perform the above-described cleaning because of polishing residue and abrasive grains adhering thereto.

A resist formation step was performed after the cleaning. Resist plate making was performed with a drawing apparatus manufactured by Sink Laboratory. First, a resist is coated on the entire surface of the plate with an appropriate thickness (about 3 μm to 5 μm) and dried at room temperature. Although drying can be performed quickly by raising the drying temperature, there is concern about dimensional changes due to resist shrinkage and expansion of the aluminum pipe itself, and drying at room temperature is desirable. The resist uses a negative resist manufactured by Synch Laboratories, but does not stick to the products manufactured by Synch Laboratories, and may be a positive resist. The reason why the negative resist is used is that the DLC film formation for forming the second layer, which will be described later, is a heat-treating process, and the positive resist is weak against heat and peels off, so that a negative resist is preferable. When the resist film is formed, pattern drawing and development are performed with a laser head adjusted to the photosensitive wavelength of the resist, and portions with and without the resist are formed in stripes.
In the second layer formation step, the second layer was formed to a thickness of about 0.1 μm on the plate surface with the stripe pattern by dry plating. Although the material of the second layer is DLC this time, this is not a limitation, and other hard film materials may be used. The DLC film thickness should be as thin as possible, preferably 0.1 μm to 1 μm.

  Next, a protective layer forming step was performed. The resist was polished to the upper layer position of the DLC film where there was no resist so that the upper layer position of the resist and the DLC film was flat so that the resist became the first protective layer.

  Next, the 2nd uneven | corrugated structure formation process was performed. The resist (protective layer) and the DLC film (second layer) were polished in the 45 ° direction. The polishing conditions at this time are almost the same as those for DLC polishing of the first layer, but the polishing pressure for the second layer is lower than the pressure for the first layer polishing, and it is better to set the value to about half. This is because the DLC film of the second layer is formed in a pattern, and the actual polishing amount is half that of the entire solid DLC film, so that the second layer is weaker in terms of linear pressure.

  Next, the peeling process was performed. When the second layer polishing is completed, the resist pattern is peeled off. The stripping solution at this time may be a mixed solution of MEK, IPA, and methanol, but an alkaline stripping solution may be used without being limited thereto. By stripping the resist, the first layer DLC pattern and the second layer DLC pattern were alternately striped, and an original plate with a 45 ° / 135 ° polishing mark on the plate surface could be produced. .

[Evaluation]
Using the base film without retardation on the original plate produced in the above example, for example, a TAC film, COP (Zeonor), an acrylic film, the shape of the plate surface is shaped with an ultraviolet curable resin applied to the surface, A film retardation film was prepared by adjusting the film thickness so that the retardation value was 125 nm by spin coating with an ultraviolet curable liquid crystal made by Merck on the shaping resin side.
As a result of evaluating the film, since there is a resist protective film, it is possible to polish only the second layer without overwriting polishing scratches on the first layer at the time of polishing the second layer, and 45 degrees / 135 for each stripe. It was confirmed that the optical axis of the liquid crystal was neatly aligned at 45 degrees / 135 degrees.

DESCRIPTION OF SYMBOLS 1 ... 1st layer 11 ... 1st uneven structure 2 ... Resist 3 ... 2nd layer 31 ... 2nd uneven structure 4 ... Protective layer 5 ... Rotating roller 6 ... Molding object 100 ... (For pattern orientation film for three-dimensional displays) Original 200 ... Roll press machine

Claims (6)

A first layer preparation step of preparing a first layer made of a metal material or an inorganic material;
A first concavo-convex structure forming step for forming a first concavo-convex structure by forming a minute line-shaped concavo-convex structure in a substantially constant direction on the surface of the first layer;
Forming a resist having a parallel strip-shaped pattern on the surface of the first layer on which the first uneven structure is formed; and
A second layer forming step of forming, on the surface of the first layer exposed after the resist step, a second layer made of a metal material or an inorganic material and having a parallel strip pattern;
A protective layer forming step of forming a protective layer made of a resist material on the surface of the first layer;
A second concavo-convex structure forming step of forming a second concavo-convex structure on the surface of the second layer by forming a fine line-shaped concavo-convex structure in a formation direction different from the formation direction of the first concavo-convex structure in a substantially constant direction;
A method for producing an original plate for a three-dimensional display pattern alignment film, comprising: a peeling step for peeling the protective layer. A first layer preparation step of preparing a first layer made of a metal material or an inorganic material;
A first concavo-convex structure forming step for forming a first concavo-convex structure by forming a minute line-shaped concavo-convex structure in a substantially constant direction on the surface of the first layer;
Forming a resist having a parallel strip-shaped pattern on the surface of the first layer on which the first uneven structure is formed; and
A second layer forming step of forming, on the surface of the first layer exposed after the resist step, a second layer made of a metal material or an inorganic material and having a parallel strip pattern;
A protective layer forming step of forming a protective layer made of a resist material on the surface of the first layer;
A second concavo-convex structure forming step of forming a second concavo-convex structure on the surface of the second layer by forming a fine line-shaped concavo-convex structure in the same formation direction as the first concavo-convex structure in a substantially constant direction;
A method for producing an original plate for a three-dimensional display pattern alignment film, comprising: a peeling step for peeling the protective layer.   In the second layer forming step, the second layer is formed on the exposed surface of the first layer and the resist, and in the protective layer forming step, the resist and the second layer stacked on the surface thereof are formed. The method for producing an original plate for a three-dimensional display pattern alignment film according to claim 1, wherein the protective layer is formed by roughly polishing the laminate.   In the second layer forming step, the second layer is formed on the exposed surface of the first layer and the resist, and in the protective layer forming step, the resist and the second layer stacked on the surface thereof are formed. After peeling off the laminated body, a second resist is formed so as to cover the first layer and the second layer, and the protective layer is formed by rough polishing the second resist. The manufacturing method of the original for pattern alignment films for three-dimensional displays of Claim 1 or Claim 2.   5. The three-dimensional display pattern alignment film precursor according to claim 1, wherein the three-dimensional display pattern alignment film original plate is a roll plate having a roll shape. 6. Manufacturing method.   The three-dimensional according to any one of claims 1 to 5, wherein at least one of the first uneven structure forming step or the second uneven structure forming step is performed by roll pressing. A method for producing an original for a pattern alignment film for display.