JP2012240153A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device capable of properly irradiating vacuum ultraviolet light onto an object surface to be polished and accurately and efficiently planarizing the object surface to be polished.SOLUTION: The polishing device 1 includes: a platen 3 having transmitting property for vacuum ultraviolet light L; a vacuum ultraviolet light emitting part 4 which emits the vacuum ultraviolet light L from the backside of the platen 3; a polishing pad 5 which is fixed to the surface of the platen 3 for polishing the object 2 and has a plurality of through holes 51 for passing through the vacuum ultraviolet light L emitted from the vacuum ultraviolet light emitting part 4 and having passed through the platen 3; a driving means for rotating the platen 3; a nitrogen supply means 8 for nitrogen-purging a container 7 containing the vacuum ultraviolet light emitting part 4; and a polishing liquid supply means for supplying polishing liquid onto the surface of the polishing pad 5.

Description

  The present invention relates to a polishing apparatus for highly efficiently planarizing a surface to be polished of an object to be polished.

  Conventionally, in order to increase the polishing effect due to the relative movement between the polishing object and the polishing pad, the surface to be polished of the polishing object is polished by using the surface chemical action of the abrasive grains or the action of the chemical polishing liquid. Chemical mechanical polishing for planarizing the surface is known. However, in such chemical mechanical polishing, environmental problems such as waste liquid treatment at the time of polishing are pointed out.

  On the other hand, the inventors have made the surface to be polished of the object to be polished while irradiating the surface of the polishing platen having transparency to the ultraviolet light and having a reflective film on the back side while irradiating the surface with the ultraviolet light. A polishing apparatus was invented that performs polishing by pressing against the surface of a polishing surface plate and rubbing the object to be polished relative to the polishing surface plate (see, for example, Patent Document 1). In this polishing apparatus, the ultraviolet light irradiated from the surface side of the polishing surface plate passes through the polishing surface plate to the back surface thereof, is reflected by the reflective film, and is indirectly irradiated onto the surface to be polished of the object to be polished. As a result, the surface to be polished is activated and an oxide film is formed. Then, polishing proceeds by removing the oxide film by mutual friction between the surface to be polished and the polishing surface plate.

JP 2007-253244 A

  However, in the configuration of the polishing apparatus of Patent Document 1, when vacuum ultraviolet light having a shorter wavelength than normal ultraviolet light is used, air is applied before the vacuum ultraviolet light is irradiated onto the surface to be polished of the object to be polished. There is a problem that a sufficient effect cannot be obtained because it is absorbed by the oxygen contained therein.

  The present invention has been made in view of the problems as described above, and appropriately irradiates the surface to be polished of the object to be polished with vacuum ultraviolet light so that the surface to be polished of the object to be polished has high precision and high accuracy. An object of the present invention is to provide a polishing apparatus capable of efficiently flattening.

  In order to achieve the above object, the polishing apparatus according to claim 1 includes a surface plate that is transparent to vacuum ultraviolet light, and a vacuum ultraviolet light irradiation unit that irradiates vacuum ultraviolet light from the back side of the surface plate. A driving means for rotating the surface plate, a nitrogen supply means for purging the inside of the container in which the vacuum ultraviolet light irradiation unit is accommodated, and a polishing liquid supply for supplying a polishing liquid to the surface of the surface plate Means. The vacuum ultraviolet light has a wavelength of 10 to 200 nm which is shorter than that of normal ultraviolet light. In the present invention, it is preferable to use vacuum ultraviolet light having a wavelength near 172 nm.

  The polishing apparatus according to claim 2 is attached to the surface of the surface plate, and has a plurality of through holes through which the vacuum ultraviolet light irradiated from the vacuum ultraviolet light irradiation unit and transmitted through the surface plate is passed. A polishing pad is provided, and the polishing supply means supplies the polishing liquid to the surface of the polishing pad.

  The polishing apparatus according to claim 3 is characterized in that the polishing liquid is pure water or functional water.

  The polishing apparatus according to claim 4 is characterized in that the surface plate is made of quartz glass.

  The polishing apparatus according to claim 5 is characterized in that a flange for draining the polishing liquid supplied by the polishing liquid supply means is provided on the outer periphery of the surface plate.

  The polishing apparatus according to claim 6 is characterized in that the vacuum ultraviolet light irradiation unit is provided so as to be close to the back surface of the surface plate.

  The polishing apparatus according to claim 7, wherein the polishing supply unit is disposed below the surface plate, and the polishing liquid from the polishing supply unit is passed through the surface plate or through the surface plate. A polishing liquid supply hole for supplying the liquid to the surface of the polishing pad through the hole is formed.

  The polishing apparatus according to claim 8, wherein a cover portion that covers an upper portion of the surface plate or the polishing pad in a state having a processing space for polishing an object to be polished, and an atmosphere that supplies an atmospheric gas into the processing space Gas supply means, and the cover is formed with an exhaust hole for discharging the gas in the processing space.

  The polishing apparatus according to claim 9 is characterized in that the atmospheric gas supply means supplies oxygen gas as the atmospheric gas.

  The polishing apparatus according to claim 10, wherein the atmosphere gas supply means is disposed below the surface plate, and the atmosphere gas from the atmosphere gas supply means is supplied to the surface plate into the processing space. It is characterized in that a gas supply hole is formed.

  According to the polishing apparatus of claim 1, the inside of the container in which the vacuum ultraviolet light irradiation unit for irradiating the vacuum ultraviolet light from the back side of the surface plate that is permeable to the vacuum ultraviolet light is accommodated with a nitrogen purge. Has been. Therefore, the vacuum ultraviolet light irradiated from the vacuum ultraviolet light irradiation part is not absorbed by oxygen, passes through the surface plate, and comes into contact with the surface (polishing surface) of the surface plate to be polished. Is properly irradiated. As a result, the oxide film formed on the surface to be polished of the object to be polished is decomposed to generate a photoelectric effect, and the surface to be polished of the object to be polished can be flattened with high accuracy by the action of this photoelectric effect. Further, since the polishing liquid is supplied to the surface of the surface plate, the polishing efficiency can be improved by irradiating the polishing liquid with vacuum ultraviolet light transmitted through the surface plate and causing a chemical reaction.

  According to the polishing apparatus of claim 2, the polishing pad in which a plurality of through-holes for passing the vacuum ultraviolet light transmitted through the surface plate is formed on the surface of the surface plate having transparency to the vacuum ultraviolet light. It is attached. Therefore, the vacuum ultraviolet light irradiated from the vacuum ultraviolet light irradiation part passes through the surface plate without being absorbed by oxygen, and further passes through the through-hole, so that the polishing object that comes into contact with the surface of the polishing pad is in contact with the surface. The surface to be polished is appropriately irradiated. As a result, the oxide film formed on the surface to be polished of the object to be polished is decomposed to generate a photoelectric effect, and the surface to be polished of the object to be polished can be flattened with high accuracy by the action of this photoelectric effect.

According to the polishing apparatus of the third aspect, the polishing liquid made of pure water or functional water is supplied to the surface of the surface plate. Therefore, when this polishing liquid is irradiated with vacuum ultraviolet light transmitted through the surface plate, oxygen molecules in the polishing liquid are decomposed and ozone is generated. Thereby, OH ⁻ ions and OH radicals are generated in the polishing liquid by the self-decomposing action of ozone, and elution of the object to be polished into the polishing liquid can be promoted by these OH ⁻ ions and OH radicals. The surface to be polished of the object to be polished can be planarized with high efficiency. In addition, since the surface to be polished of the object to be polished can be flattened with high accuracy using a polishing liquid made of pure water or functional water without using a polishing liquid containing abrasive grains, it is environmentally friendly.

  According to the polishing apparatus of claim 4, since quartz glass having a relatively high transmittance in the vacuum ultraviolet region is used for the surface plate, the vacuum ultraviolet light irradiated from the back side of the surface plate is more reliably polished. The surface to be polished of the object can be irradiated.

  According to the polishing apparatus of claim 5, since the flange for draining the polishing liquid supplied to the surface of the surface plate or the surface of the polishing pad is provided on the outer periphery of the surface plate, the polishing process It is possible to prevent the polishing liquid from staying on the surface of the surface plate or the surface of the polishing pad later. In addition, during polishing, the polishing plate is rotated together with the polishing liquid by centrifugal force due to the rotation of the platen, and spreads outward and flows to the buttock, so that the polishing residue remains on the surface of the polishing pad. Can be prevented.

  According to the polishing apparatus of the sixth aspect, since the vacuum ultraviolet light irradiation part is arranged so as to be close to the back surface of the surface plate, the vacuum ultraviolet light is more reliably applied to the surface to be polished of the object to be polished. Can be irradiated.

  According to the polishing apparatus of the seventh aspect, the polishing liquid supply means is disposed below the surface plate, and the surface plate is for supplying the polishing liquid to the surface of the surface plate or the surface of the polishing pad. Since the polishing liquid supply hole is formed, the polishing liquid can be reliably supplied directly to the surface to be polished of the object to be polished on the surface plate or the polishing pad, and the working efficiency can be improved.

  According to the polishing apparatus of the eighth aspect, it is possible to influence the polishing characteristics by supplying the atmospheric gas into the processing space for polishing the object to be polished.

  According to the polishing apparatus of claim 9, by using oxygen gas as the atmospheric gas, it is possible to increase the amount of ozone generated in the processing space and further promote elution of the object to be polished. High-precision polishing can be performed.

  According to the polishing apparatus of claim 10, the atmosphere gas supply means is disposed below the surface plate, and the surface plate has gas supply holes for supplying the atmosphere gas into the processing space. Therefore, the apparatus itself can be miniaturized and the atmospheric gas can be directly supplied to the surface to be polished of the object to be polished.

1 is a schematic sectional view showing an example of a polishing apparatus according to a first embodiment of the present invention. 1 is a schematic plan view showing an example of a polishing apparatus according to a first embodiment of the present invention. Schematic which shows a mode when the supporting member which supports a surface plate is seen from the back side. The partially expanded view of FIG. The schematic sectional drawing which shows an example of the grinding | polishing apparatus which concerns on the 2nd Embodiment of this invention. The schematic sectional drawing which shows an example of the grinding | polishing apparatus which concerns on the 3rd Embodiment of this invention. The schematic sectional drawing which shows an example of the grinding | polishing apparatus which concerns on the 4th Embodiment of this invention. The schematic sectional drawing which shows another example of the grinding | polishing apparatus which concerns on the 4th Embodiment of this invention.

  Hereinafter, embodiments of a polishing apparatus according to the present invention will be described with reference to the drawings. A polishing apparatus 1 according to the first embodiment of the present invention is for polishing a surface to be polished of a workpiece 2 to be polished, and as shown in FIGS. Xe excimer lamp (vacuum ultraviolet light irradiation part) 4 that irradiates vacuum ultraviolet (Vacuum Ultra-Violet) light L from the back side of the surface plate 3, a polishing pad 5 attached to the surface of the surface plate 3, and the surface plate 3 Driving means (not shown) for rotating the rotary shaft 6 around the rotation shaft 6, nitrogen supply means 8 for purging the inside of the lamp vessel 7 in which the Xe excimer lamp 4 is accommodated, and the polishing liquid W with the polishing pad 5 A polishing liquid supply nozzle 9 that supplies the surface of the surface plate 3 and a flange 10 provided outside the outer periphery of the surface plate 3 in order to drain the polishing liquid W to the outside.

  The workpiece 2 to be polished is not particularly limited. For example, a silicon wafer, a semiconductor wafer such as GaAs, a glass substrate, a Cu wiring material used as a wiring material for ULSI (Ultra-Large Scale Integration), and the like. Various processing materials that require high-precision flattening can be mentioned.

The surface plate 3 is made of a material having transparency to the vacuum ultraviolet light L. For example, quartz (SiO ₂ ) having relatively high transparency in the vacuum ultraviolet region is used. This quartz is excellent not only in transmitting vacuum ultraviolet light efficiently and with low loss, but also in absorbing infrared light, so that it is excellent in terms of heatability. In addition, fluorides such as calcium fluoride and magnesium fluoride may be used as the material of the surface plate 3.

  The surface plate 3 is formed in a disk shape and is supported by a support member 11 as shown in FIGS. 1 and 3. The support member 11 is formed in a disk shape having a larger diameter than the surface plate 3. The support member 11 is integrally formed with an outer peripheral support portion 11 a for supporting the outer peripheral portion 31 of the surface plate 3 and a plurality of support pieces 11 b provided radially from the center so as to support the back surface of the surface plate 2. There is an opening between adjacent support pieces 11b. Therefore, a part of the back surface of the surface plate 3 is shielded from the vacuum ultraviolet light L by the support piece 11b, but the other part is open, so the vacuum ultraviolet light L is irradiated to the back surface of the surface plate 3. . Further, the central portion of the support member 11 is pivotally supported by a rotating shaft 6 that is rotated by rotational torque applied from a driving means (not shown) such as a motor. Accordingly, the support member 11 is rotated by the rotation of the rotary shaft 6, and the surface plate 3 supported by the support member 11 is also rotated. Note that the number of rotations at this time can be freely set, and an appropriate number of rotations is selected depending on the type of the workpiece 2 to be polished, the type of the polishing pad 5 and the like. Further, the number of the support pieces 11b is not particularly limited, and may be provided so that the surface plate 3 can be sufficiently supported.

  As shown in FIGS. 1 and 4, the Xe excimer lamp 4 irradiates the vacuum ultraviolet light L from the back side of the surface plate 3, and is accommodated in the lamp vessel 7. The vacuum ultraviolet light L has a wavelength of 10 to 200 nm shorter than that of normal ultraviolet light, and the Xe excimer lamp 4 irradiates the vacuum ultraviolet light L with a wavelength of 172 nm, for example. The lamp vessel 7 is provided with a nitrogen gas introduction port 71 for introducing nitrogen gas supplied from the nitrogen supply means 8 into the inside. The nitrogen supply means 8 is connected to a nitrogen supply source such as a nitrogen cylinder filled with nitrogen gas to the inlet 71 via a tube or the like. By purging nitrogen with such nitrogen supply means 8, the inside of the lamp vessel 7 in which the Xe excimer lamp 4 is accommodated is filled with nitrogen gas. Therefore, when the vacuum ultraviolet light L is irradiated by the Xe excimer lamp 4, it is possible to prevent the vacuum ultraviolet light L from being absorbed by oxygen before passing through the surface plate 3. Note that when the vacuum ultraviolet light L having a very short wavelength is used, the vacuum ultraviolet light L may be absorbed by nitrogen and not be irradiated to the surface to be polished of the workpiece 2, so a vacuum having a wavelength of 160 to 180 nm. It is preferable to use the ultraviolet light L. The Xe excimer lamp 4 is preferably arranged as close to the back surface of the surface plate 3 as possible in order to irradiate the surface to be polished of the workpiece 2 with vacuum ultraviolet light more reliably.

  The polishing pad 5 is formed in a disk shape and is attached to the surface of the surface plate 3. The polishing surface of the surface of the polishing pad 5 is placed so that the surface to be polished of the workpiece 2 to be polished contacts. When the work 2 is a Cu wiring material or the like, for example, as shown in FIG. 2, the work 2 is polished to a predetermined level by a roller 12 provided at the tip of an arm 13 fixed to a base (not shown). It is held rotatably at the position. Accordingly, the polishing surface of the workpiece 2 is polished by rotating the polishing pad 5 attached to the surface plate 3 as the surface plate 3 rotates about the rotation shaft 6 together with the support member 11. Can do. The polishing pad 5 has a plurality of through holes 51 through which the vacuum ultraviolet light L passes so that the vacuum ultraviolet light L transmitted through the surface plate 3 is irradiated onto the surface to be polished of the workpiece 2. ing. The size of the through-hole 51 is not particularly limited, but is formed to have a diameter of about several mm to several tens mm so that the workpiece 2 to be polished is not fitted. Further, the location and the number of the through holes 51 are not particularly limited, but at least when the polishing process is performed, the surface to be polished of the workpiece 2 is always irradiated with the vacuum ultraviolet light L. It only has to be done.

The polishing liquid supply nozzle 9 is for supplying the polishing liquid W from the polishing liquid supply source (not shown) in which the polishing liquid W is stored to the surface of the polishing pad 5, for example. Here, the case where pure water or functional water such as ozone water or electrolytic reduction water is used as the polishing liquid W will be described as an example. However, the polishing liquid W is not limited to this, and a conventionally known polishing slurry is used. Etc. may be used. When the polishing liquid W is supplied to the surface of the polishing pad 5, it also flows into the through hole 51 of the polishing pad 5 located below the surface to be polished of the workpiece 2 shown in FIG. In this state, the vacuum ultraviolet light L is irradiated onto the polishing liquid W, whereby oxygen molecules in the polishing liquid W are decomposed and ozone is generated. Thereby, OH ⁻ ions and OH radicals are generated in the polishing liquid W due to the self-decomposing action of ozone, and elution of the workpiece 2 into the polishing liquid W is promoted by these OH ⁻ ions and OH radicals. Since the surface to be polished of the workpiece 2 is rubbed by the polishing pad 5, the surface to be polished of the workpiece 2 can be flattened with high efficiency and high accuracy.

  Further, on the outer peripheral side of the surface plate 3 and the polishing pad 5, a flange 10 for draining the polishing liquid W supplied to the surface of the polishing pad 5 is provided via a support member 11. The flange 10 is formed as a base (not shown) or integrally with the base. Further, as shown in FIG. 1, a V ring or the like is provided between the support member 11 and the flange portion 10 so that the polishing liquid W does not leak to the back side of the surface plate 3 on which the Xe excimer lamp 4 is disposed. A sealing member 14 is arranged. Further, as shown in FIG. 2, the flange portion 10 is formed with a discharge port 15 for discharging the flowing polishing liquid W to the outside. This can prevent the polishing liquid W from remaining on the surface of the polishing pad 5 after polishing. Moreover, since the polishing waste generated during the polishing process can be discharged to the outside together with the polishing liquid W, it is possible to prevent the polishing waste from remaining on the surface of the polishing pad.

  Hereinafter, the polishing process of the workpiece 2 using the polishing apparatus 1 will be described with reference to FIGS. 1 and 2. First, the workpiece 2 is placed so that the surface to be polished is in contact with the surface of the polishing pad 5, and the workpiece 2 is rotatable at a predetermined polishing position by the roller 12 provided at the tip of the arm 13. To hold. In this state, as shown in FIG. 1, the Xe excimer lamp 4 irradiates the surface to be polished of the work 2 with the vacuum ultraviolet light L, and the polishing liquid supply nozzle 9 applies the polishing liquid W to the surface of the polishing pad 5. Supply.

Then, by rotating the rotation shaft 6, the polishing pad 5 is rotated to polish the surface to be polished of the work 2. Thus, the vacuum ultraviolet light L that has passed through the through-hole 51 of the polishing pad 5 is irradiated to the polishing liquid W supplied to the surface of the polishing pad 5, and oxygen molecules in the polishing liquid W are decomposed to generate ozone. The OH ⁻ ions and OH radicals are generated in the polishing liquid W due to the self-decomposing action of ozone, and the elution of the workpiece 2 is promoted by these OH ⁻ ions and OH radicals. The surface to be polished of the workpiece 2 can be flattened efficiently and with high accuracy. Further, in this embodiment, the work 2 is rotatably held at a predetermined polishing position by the roller 12, but the work 2 is polished in a state of being pressed with a predetermined pressure according to the type of the work 2. You may comprise.

  Next, a polishing apparatus 1a according to a second embodiment of the present invention will be described with reference to FIG. This polishing apparatus 1a is for polishing a workpiece 2 with a surface plate 3 having a polishing surface on the surface side, and the same reference numerals are given to the same configurations and the like as the polishing apparatus 1 according to the first embodiment. Detailed description thereof will be omitted.

  As shown in FIG. 5, the polishing apparatus 1a includes a surface plate 3a having a polishing surface on the surface side, a work holding unit 16 that holds the work 2 to be polished and presses it against the surface of the surface plate 3a, and a surface plate Xe excimer lamp (vacuum ultraviolet light irradiation unit) 4 for irradiating vacuum ultraviolet (Vacuum Ultra-Violet) light L from the back side of 3a, and driving means for rotating the surface plate 3a around the rotation axis 6 (not shown) ), A nitrogen supply means 8 for purging the inside of the lamp vessel 7 in which the Xe excimer lamp 4 is accommodated, and a polishing liquid supply nozzle for supplying a polishing liquid W made of pure or functional water to the surface of the polishing pad 5 9 and a flange 10 provided outside the outer periphery of the surface plate 3a in order to drain the polishing liquid W to the outside.

The surface plate 3a is made of quartz (SiO ₂ ) or the like having transparency to the vacuum ultraviolet light L. The workpiece holding unit 16 includes a polishing head 17 that holds the workpiece 2 to be polished, a shaft 18 that presses the workpiece 2 held by the polishing head 17 against the polishing surface of the surface plate 3a, and a rotational force applied to the shaft 18. And a driving means (not shown) for rotating the work 2 together with the polishing head 17.

  In the polishing apparatus 1a, as shown in FIG. 5, the work 2 is pressed against the polishing surface of the surface plate 3a while being held by the work holding unit 16. At this time, the pressure is appropriately selected according to the type of the workpiece 2 and the type of the surface plate 3a. In this state, similarly to the polishing apparatus 1, the vacuum ultraviolet light L is transmitted through the surface plate 3 a by the Xe excimer lamp 4 to irradiate the surface to be polished of the workpiece 2, and the surface plate 3 is polished by the polishing liquid supply nozzle 9. A polishing liquid W is supplied to the surface.

Then, the surface plate 3a is rotated by rotating the rotating shaft 6, and the surface to be polished of the workpiece 2 is polished by rotating the shaft 2 while being in pressure contact with the shaft 18 and relatively rubbing. . In this manner, the polishing liquid W supplied to the polishing surface of the surface plate 3 is irradiated with the vacuum ultraviolet light L that has passed through the surface plate 3, and oxygen molecules in the polishing liquid W are decomposed to generate ozone. Since the OH ⁻ ions and OH radicals are generated in the polishing liquid W by the self-decomposing action of ozone, and the elution of the work 2 is promoted by these OH ⁻ ions and OH radicals, the object to be polished is a substrate such as diamond. Even so, the surface to be polished can be flattened with high efficiency and high accuracy using the surface plate 3a made of quartz softer than the substrate.

  Next, a polishing apparatus 1b according to a third embodiment of the present invention will be described with reference to FIG. In addition, about the structure similar to the grinding | polishing apparatus 1, 1a, the same code | symbol is attached | subjected and the detailed description is abbreviate | omitted. The polishing apparatus 1b functions as a cover portion 19 that covers the upper surface of the surface plate 3b in a state where the processing space S for polishing the workpiece 2 is provided, and atmospheric gas supply means for supplying atmospheric gas into the processing space S. The gas supply slip ring 20 is provided.

  The gas supply slip ring 20 and the polishing liquid supply slip ring 21 functioning as the polishing liquid supply means are fixed to the rotary shaft 6 below the surface plate 3b. The gas supply slip ring 20 is, for example, for supplying a gas such as oxygen gas or alkaline water vapor to the processing space S as an atmospheric gas, and the flow path 22 formed in the rotating shaft 6 and the support piece 11b. Is connected to the gas supply hole 23 formed in the surface plate 3b. Similarly, the polishing liquid supply slip ring 21 is connected to a polishing liquid supply hole 25 formed in the surface plate 3b through a flow path 24 formed in the rotary shaft 6 and the support piece 11b. Therefore, it is possible to supply the polishing liquid directly to the surface to be polished of the workpiece 2 and supply the atmospheric gas to the processing space S. Thereby, for example, when oxygen gas is supplied as the atmospheric gas, the amount of ozone generated in the processing space S can be increased, and polishing can be performed in a state where the elution of the work 2 is further promoted. The polished surface of the work 2 with high efficiency and high accuracy can be flattened.

  In addition, the cover 3 is formed with an exhaust hole 26 for discharging the gas in the processing space S when the atmospheric gas is supplied from the gas supply slip ring 20 through the gas supply hole 23. . Here, the exhaust hole 26 is formed in such a size that the work holding part 16 that holds the work 2 and presses it against the surface of the surface plate 3 a can be inserted into the machining space S.

  As shown in FIG. 7, the polishing apparatus 1c according to the fourth embodiment of the present invention externally attaches to the cover portion 19a instead of fixing the gas supply slip ring 20 to the rotary shaft 6 as in the polishing apparatus 1b. Air supply holes 28 for supplying atmospheric gas from the provided atmospheric gas supply means 27 into the processing space S are formed. As a result, the atmospheric gas is supplied from the atmospheric gas supply means 27 into the machining space S through the air supply holes 28, and the gas in the machining space S is discharged to the outside through the exhaust holes 26.

  Further, a polishing liquid supply hole 25 for supplying the polishing liquid from the polishing liquid supply slip ring 21 onto the surface of the surface plate 3 c through the flow path 24 is formed in the surface plate 3 c. Accordingly, the polishing liquid can be directly supplied to the surface to be polished of the workpiece 2 as in the polishing apparatus 1b, and the atmospheric gas can be supplied to the processing space S.

  In the polishing apparatus 1c, instead of fixing the polishing liquid supply slip ring 21 to the rotating shaft 6, the gas supply slip ring 20 is fixed, and the polishing liquid is supplied instead of the air supply holes 28 of the cover portion 19a. You may comprise so that a polishing liquid can be supplied from the exterior on the surface of the surface plate 3c by forming a hole.

  Moreover, as shown in FIG. 8, you may provide the collar part 10 via the supporting member 11 in the outer periphery of the surface plate 3c. In this case, a drainage channel 11c for guiding the polishing liquid supplied to the surface of the surface plate 3c to the flange 10 may be formed on the support member 11.

  Further, when polishing is performed by attaching the polishing pad 5 on the surfaces of the surface plates 3b and 3c of the polishing apparatuses 1b and 1c, the through holes 51 formed in the polishing pad 5 and the surface plates 3b and 3c are formed. By configuring the gas supply hole 23 and the polishing liquid supply hole 25 so as to be aligned, it is possible to supply the atmospheric gas into the processing space S and supply the polishing liquid onto the surface of the polishing pad 5.

  Further, the surface plates 3 to 3 c in the present embodiment are configured such that the standard plates 3 and 3 a rotate when the support member 11 rotates while being supported by the support member 11. -3c may be rotatably supported by the rotating shaft 6. In the present embodiment, the case where one Xe excimer lamp (vacuum ultraviolet light irradiation unit) 4 is arranged has been described as an example. However, the Xe excimer lamp 4 is placed at a predetermined position on the back side of the surface plates 3 to 3c. A plurality may be provided. Thereby, it is also possible to polish a plurality of workpieces 2 at the same time as appropriate.

  The embodiment of the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the scope of the idea of the present invention.

  The polishing apparatus according to the present invention can be effectively used as a polishing apparatus for planarizing a surface to be polished of various workpieces to be polished with high efficiency and high accuracy.

1, 1a, 1b, 1c Polishing device 2 Workpiece (polishing object)
3, 3a, 3b, 3c Surface plate 4 Xe excimer lamp (vacuum ultraviolet light irradiation part)
5 Polishing pad 51 Through hole 6 Rotating shaft 7 Lamp container (container)
8 Nitrogen supply means 9 Polishing liquid supply nozzle 10 Gutter part 19 Cover part 20 Slip ring for gas supply (atmosphere gas supply means)
21. Slip ring for polishing liquid supply (polishing liquid supply means)
23 Gas supply hole 25 Polishing liquid supply hole 26 Exhaust hole L Vacuum ultraviolet light W Polishing liquid

Claims (10)

A surface plate that is transparent to vacuum ultraviolet light;
A vacuum ultraviolet light irradiation unit that irradiates vacuum ultraviolet light from the back side of the platen;
Drive means for rotating the surface plate;
Nitrogen supply means for purging the inside of the container in which the vacuum ultraviolet light irradiation unit is accommodated;
A polishing apparatus comprising: a polishing liquid supply means for supplying a polishing liquid to the surface of the surface plate. A polishing pad attached to the surface of the surface plate, and formed with a plurality of through holes through which the vacuum ultraviolet light that has been irradiated from the vacuum ultraviolet light irradiation unit and transmitted through the surface plate is formed;
The polishing apparatus according to claim 1, wherein the polishing liquid supply unit supplies the polishing liquid to a surface of the polishing pad.   The polishing apparatus according to claim 1, wherein the polishing liquid is pure water or functional water.   The polishing apparatus according to claim 1, wherein the surface plate is made of quartz glass.   The outer periphery of the said surface plate is provided with the collar part for draining the said polishing liquid supplied by the said polishing liquid supply means to the exterior. Polishing equipment.   The polishing apparatus according to claim 1, wherein the vacuum ultraviolet light irradiation unit is provided so as to be close to a back surface of the surface plate. The polishing liquid supply means is disposed below the surface plate,
The surface plate is formed with a polishing liquid supply hole for supplying the polishing liquid from the polishing liquid supply means to the surface of the surface plate or the through-hole to the surface of the polishing pad. The polishing apparatus according to any one of claims 1 to 6. A cover portion that covers the upper surface of the surface plate or the polishing pad in a state having a processing space for polishing an object to be polished;
Atmosphere gas supply means for supplying atmosphere gas into the processing space,
The polishing apparatus according to claim 1, wherein an exhaust hole for discharging the gas in the processing space is formed in the cover.   The polishing apparatus according to claim 8, wherein the atmosphere gas supply unit supplies oxygen gas as the atmosphere gas. The atmosphere gas supply means is disposed below the surface plate,
The polishing apparatus according to claim 8 or 9, wherein a gas supply hole for supplying an atmosphere gas from the atmosphere gas supply means into the processing space is formed in the surface plate.

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