TW449530B - Air pressure type polishing method and apparatus - Google Patents
Air pressure type polishing method and apparatus Download PDFInfo
- Publication number
- TW449530B TW449530B TW088106338A TW88106338A TW449530B TW 449530 B TW449530 B TW 449530B TW 088106338 A TW088106338 A TW 088106338A TW 88106338 A TW88106338 A TW 88106338A TW 449530 B TW449530 B TW 449530B
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- workpiece
- gas
- water
- wafer
- bracket
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Description
4495 3 Ο 五、發明說明（l) [發明背景] [發明領域] 本發明係有關於一種以氣壓方式研磨板而磨光工件之 氣壓式磨光方法與裝置。 [相關技術之說明] 第6圖係顯示一種習知技藝之氣壓式磨光裝置之剖視 圖。 如第6圖所示，該磨光裝置係以支架1〇〇支持住工件之 磨光表面，例如，晶圓W，藉著使支架1〇〇旋轉並推壓晶圓示w 至旋轉的研磨板同時供應一未圖示的研漿至研磨板 110上以磨光該工件的表面。當磨光晶圓W時，基於磨光之 精確度，晶圓w之背面壓力最好一致。因此，於本磨光裝置 中，支架100之底面101開設有多數個通氣道102，並且供應 氣體A至該等通氣道102，使得自支架1〇〇之底面ιοί與晶圓w 之背面之間流出的氣體A可施加均勻的壓力至晶圓w的背 面。 然而前文所述之氣壓式磨光裝置之相關技術遭遇如後 所述之問題。 之間的氣體A供應至底面1 0 1與晶圓之背面，流經支架 100之通氣道102,再從晶圓ff之背面之外周通過支架1〇〇之 間隙B流至外部。因此，從間隙B進入並且沉澱於晶圓ff之背 面之外周上的研漿被氣體A烘乾，使得研漿内的磨料凝固而 晶圓W之背面之外周上。即使清洗也無法消除這些沉澱物， 而造成晶圓W品質之劣化。4495 3 〇 5. Description of the invention (l) [Background of the invention] [Field of the invention] The present invention relates to a pneumatic polishing method and device for polishing a workpiece by pneumatically polishing a plate. [Explanation of the related art] Fig. 6 is a sectional view showing a conventional polishing device of a pneumatic type. As shown in FIG. 6, the polishing device supports a polished surface of a workpiece with a bracket 100, for example, wafer W. By rotating the bracket 100 and pressing the wafer to w, the grinding is performed. The plate also supplies a slurry, not shown, to the grinding plate 110 to polish the surface of the workpiece. When wafer W is polished, based on the accuracy of polishing, the back pressure of wafer w is preferably uniform. Therefore, in the polishing device, the bottom surface 101 of the holder 100 is provided with a plurality of air passages 102, and a gas A is supplied to the air passages 102, so that between the bottom surface of the holder 100 and the back surface of the wafer w The outflowing gas A can apply a uniform pressure to the back surface of the wafer w. However, the related art of the pneumatic polishing device described above suffers from the problems described below. The gas A therebetween is supplied to the bottom surface 101 and the back surface of the wafer, flows through the air passage 102 of the holder 100, and flows from the outer periphery of the back surface of the wafer ff through the gap B of the holder 100 to the outside. Therefore, the slurry entering from the gap B and deposited on the outer periphery of the back surface of the wafer ff is dried by the gas A, so that the abrasive in the slurry solidifies and the outer periphery of the wafer W is on the outer periphery. These deposits cannot be eliminated even by cleaning, and the quality of the wafer W is deteriorated.
C:\ProgramFiIes\Patent\3i0561.ptd 第 5 頁 4^3u 五、發明說明（2) — 〜---- [發明概述] 本發明之目的在提供一種氣壓式磨光方法及裝置，可 止因氣體而乾涸之研漿磨料沉殿於已加工部份。 為達成上述目的，根據本發明之一構想，該種氣壓式磨 方法包括：第一步驟係以支架支持2件旋轉，使工件接&觸 旋轉的研磨板，以磨光工件表面；及第二步驟係供應氣想與 水至開設在支持工件之支架之支持表面上的流體通道中 俾均勻地施壓至工件的背面。 ’ 藉由此種結構，在第一步驟中，當支架旋轉時，工件被 推壓而接觸旋轉研磨板，使得研磨板得以磨光工件表面。 接著，進行第二步驟，供應氣體及水至開設在支架之支持表 面上的流體通道，使得工件之背面的受壓均勻。此時，所供 應的水與氣體將從工件之背面之外周流出至支架外部。 所供應的水與氣體可為任何狀態。例如，根據本#0月 之一構想，在第二步驟中可供應氣體及水蒸氣至流趙％ 道。再者，如另一例所示，根據本發明之一構想，在第二步 驟t可供應氣體及液態水至流體通道。 本發明之裝置可進行上述之氣壓式磨光方法《因此 根據本發明之構想，該種氣壓式磨光裝置包括：一旋轉式’研 磨板；一用於支持工件之支架，當旋轉時能使工件接觸到研 磨板，及以及多數個開設在支持工件之支持表面的流雜竭L 道，一用於供應氣體至支架之流體通道的氣體供應装置；及 一用於供應水蒸氣或液態水至支架之流體通道的水供應農 置。C: \ ProgramFiIes \ Patent \ 3i0561.ptd Page 5 4 ^ 3u 5. Description of the Invention (2) — ~ ---- [Summary of the Invention] The purpose of the present invention is to provide a pneumatic polishing method and device, which can stop Grinding abrasives that have dried up due to gas are in the processed part. In order to achieve the above object, according to an idea of the present invention, the pneumatic grinding method includes: the first step is to support a two-piece rotation with a bracket, so that the workpiece contacts the rotating grinding plate to polish the surface of the workpiece; and The second step is to supply gas and water to the fluid channel provided on the support surface of the support for supporting the workpiece, and press the back of the workpiece evenly. ’With this structure, in the first step, when the holder rotates, the workpiece is pushed to contact the rotating grinding plate, so that the grinding plate can polish the surface of the workpiece. Next, a second step is performed to supply gas and water to the fluid channels provided on the support surface of the support, so that the pressure on the back surface of the workpiece is uniform. At this time, the supplied water and gas will flow from the outer periphery of the back surface of the workpiece to the outside of the holder. The supplied water and gas can be in any state. For example, according to one idea of this # 0 month, gas and water vapor can be supplied to the flow path in the second step. Furthermore, as shown in another example, according to an aspect of the present invention, gas and liquid water can be supplied to the fluid channel in the second step t. The device of the present invention can perform the above-mentioned pneumatic polishing method. Therefore, according to the concept of the present invention, the pneumatic polishing device includes: a rotary 'grinding plate; a support for supporting a workpiece, which can be used when rotating. The workpiece is in contact with the grinding plate, and most of the flow-exhaust channels, which are provided on the supporting surface supporting the workpiece, a gas supply device for supplying gas to the fluid passage of the support; and a gas supply device for supplying water vapor or liquid water to The water supply for the fluid passage of the support is agricultural.
449530 五、發明說明（3) 藉由此種結構，當支架予以旋轉，研磨板同時予以旋 轉，而工件以支架支持住並被推壓接觸至研磨板時，該旋轉 中的研磨板將磨光工件的表面。再者，當啟動氣體供應裝 置供應氣體至支架之流體通道，同時啟動水供應裝置供應 水蒸氣或液態水至支架之流體通道時氣體或水蒸氣或液 態水將從支架之支持表面的通口流出至工件之背面以均勻 地施壓在。此時，所供應的水蒸氣或液態水與氣體將一起 從工件背面之外周流出至支架外部。 [圖式之簡單說明] 從如下所述之本發明之較佳實施例以及參照圖式的說 明將使本發明之前述及其他目的、特徵、及優點更容易瞭 解，其中包括： 第1圖係本發明之氣壓式磨光裝置之實施例之局部切 面正視圖； 第2圖係旋轉驅動機構之剖視圖； 第3圖係支架結構之剖視圖； 第4圖係顯示供應氣體或水蒸氣或水霧之情況的剖視 圖； 第5圖係顯示輸入研漿之情況的局部放大剖視圖； 第6圖係習知技術之氣壓式磨光裝置之刮視圖。 [元件符號簡單說明] 1 研磨板 3 旋轉驅動機構 5 水泵 2, 100 支架 4 氣體泵 6 流體通道449530 V. Description of the invention (3) With this structure, when the bracket is rotated, the grinding plate is rotated at the same time, and when the workpiece is supported by the bracket and is pushed to contact the grinding plate, the rotating grinding plate will be polished The surface of the workpiece. Furthermore, when the gas supply device is activated to supply gas to the fluid passage of the stent, and the water supply device is activated to supply water vapor or liquid water to the fluid passage of the stent, the gas or water vapor or liquid water will flow out from the port on the support surface of the stent To the back of the workpiece to apply even pressure. At this time, the supplied water vapor or liquid water and gas will flow out from the periphery of the back surface of the workpiece to the outside of the holder. [Brief description of the drawings] The foregoing and other objects, features, and advantages of the present invention will be easier to understand from the preferred embodiments of the present invention described below and the description with reference to the drawings, including: Figure 1 A partial cutaway front view of an embodiment of the pneumatic polishing device of the present invention; FIG. 2 is a cross-sectional view of a rotary drive mechanism; FIG. 3 is a cross-sectional view of a support structure; and FIG. 4 is a diagram showing a supply of gas or water vapor or water mist. Sectional view of the situation; FIG. 5 is a partially enlarged sectional view showing the condition of input of the slurry; and FIG. 6 is a scraping view of the air-pressure polishing device of the conventional technology. [Simple description of component symbols] 1 Grinding plate 3 Rotary drive mechanism 5 Water pump 2, 100 bracket 4 Gas pump 6 Fluid channel
C:\Program FiIes\Patent\310561.ptd 第7頁 4495 3 Ο 五、發明說明（4) 10 研磨塾片 11 主馬達 12,15 滑輪 13 變速器 14 輪入軸 16 皮帶 17 輪出轴 20 軍殼 20a 旋轉連結構件 20b 内齒輪 21 支架基板 21a, 21b 嫘絲 21c 凹槽 21d, 21e, 〇形環 22 扣環 30 圓筒 31 圓筒主體 32 活塞桿 33 活塞 34 馬達 35,37 齒輪 36 轴承 38 支撐部 39 圓筒狀内桿 39a 外齒輪 39b 内齒輪 40 氣體軟管 45 混合容器 45a 軟管 50 水管 60 淺槽 61 流體入口 /出口 62 通孔 101 底面 102 通氣道 110 旋轉研磨板 [較佳實施例之說明] 本發明之較佳實施例將參照圖式說明如下。 局 第1圖係顯示本發明之氣壓式磨光裝置之實施例之 部切面正視圖。 如第1圖所示，該氣壓式磨光裝置包括— 動機構3控制其轉C: \ Program FiIes \ Patent \ 310561.ptd Page 7 4495 3 〇 5. Description of the invention (4) 10 Grinding cymbals 11 Main motor 12, 15 Pulley 13 Transmission 14 Wheel-in shaft 16 Belt 17 Wheel-out shaft 20 Military housing 20a Rotating connecting member 20b Internal gear 21 Bracket base plate 21a, 21b Filament 21c Groove 21d, 21e, 〇 ring 22 Retaining ring 30 Cylinder 31 Cylinder body 32 Piston rod 33 Piston 34 Motor 35, 37 Gear 36 Bearing 38 Support Section 39 Cylindrical inner rod 39a External gear 39b Internal gear 40 Gas hose 45 Mixing container 45a Hose 50 Water pipe 60 Shallow groove 61 Fluid inlet / outlet 62 Through hole 101 Bottom surface 102 Air passage 110 Rotary grinding plate [preferred embodiment [Description] A preferred embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a partial sectional front view showing an embodiment of a pneumatic polishing device according to the present invention. As shown in Figure 1, the pneumatic polishing device includes a moving mechanism 3 to control its rotation
C:\ProgramFUes\Patent\310561.ptd 第 8 頁 設有研磨墊片10的研磨板1，一由旋轉 在其前表面上 4495 3 wC: \ ProgramFUes \ Patent \ 310561.ptd page 8 Abrasive plate 1 with abrasive pads 10, one rotated on its front surface 4495 3 w
=高度的支架2 —用作氣趙供應褒置的氣體泵4以及一用 作供應褒置的水泵5。 研磨板1係藉由裝設在本裝置之罩殼内的主馬達丨丨予 ^即，皮帶1 6係捲繞在設置在主馬達11上的滑輪1 2以及 。又置在變速器13之輸入軸14上的滑輪15。研磨板1係裝設 在變速器13的輸出轴17上。 因此’主馬達11之旋轉傳導至滑輪15，滑輪15之旋轉經 由變速器13轉變速度並傳導至輸出軸17，使研磨！以預定的 速度旋轉。 旋轉驅動機構3的功能係當進行推壓時驅動支架2使之 旋轉，該機構設有圓筒30及馬達34。 第2圖係顯示旋轉驅動機構之剖視圖。 如第2圖所示，圓筒3〇包括一穿過圓筒主體31的活塞桿 32，以及一以氣密方式嵌合在圓筒主體31内的活塞33，活塞 33係固定在活塞桿32的外側。 因此’藉由調整圓筒主體31内部之氣壓，可使活塞桿32 與活塞33—起上昇及下降，而調節整施加至支架2的推壓 力。 另外，馬達34係連接至圓筒30之活塞桿32。即，馬達34 之轴部之齒輪35係經由軸承36與設置在活塞桿32之頂部的 齒輪37相嚙合。再者，圓筒狀内桿3 9之頂端係固定在設置 於齒輪37之上表面的支撐件38中。 因此，當馬達3 4驅動時，旋轉作用藉由齒輪35、37及支= Height bracket 2-a gas pump 4 used as a gas supply unit and a water pump 5 used as a supply unit. The polishing plate 1 is provided by a main motor installed in the casing of the device, that is, the belt 16 is wound around a pulley 12 and provided on the main motor 11. The pulley 15 is placed on the input shaft 14 of the transmission 13 again. The polishing plate 1 is mounted on the output shaft 17 of the transmission 13. Therefore, the rotation of the main motor 11 is transmitted to the pulley 15, and the rotation of the pulley 15 is converted to a speed by the transmission 13 and transmitted to the output shaft 17, so that the grinding is performed! Rotate at a predetermined speed. The function of the rotary drive mechanism 3 is to drive the bracket 2 to rotate when it is pushed, and this mechanism is provided with a cylinder 30 and a motor 34. Fig. 2 is a cross-sectional view showing a rotary driving mechanism. As shown in FIG. 2, the cylinder 30 includes a piston rod 32 passing through the cylinder body 31 and a piston 33 fitted into the cylinder body 31 in an airtight manner. The piston 33 is fixed to the piston rod 32. Outside. Therefore, by adjusting the air pressure inside the cylinder main body 31, the piston rod 32 and the piston 33 can be raised and lowered together, and the pressing force applied to the bracket 2 can be adjusted. In addition, the motor 34 is connected to a piston rod 32 of the cylinder 30. That is, the gear 35 of the shaft portion of the motor 34 meshes with the gear 37 provided on the top of the piston rod 32 via the bearing 36. The top end of the cylindrical inner rod 39 is fixed to a support 38 provided on the upper surface of the gear 37. Therefore, when the motor 34 is driven, the rotation is effected by the gears 35, 37 and the support
C:\ProgramFUes\Patent\310561.ptd 第 9 頁C: \ ProgramFUes \ Patent \ 310561.ptd page 9
449^3 Q 五、發明說明（6) 撐件38傳導至内桿39使内桿3 9以預定的速度在活塞桿3 2内 旋轉。 支架2之結構可在旋轉狀態下，夾固住工件，例如，晶圓 W，使工件位於研磨板1之研磨墊片1〇上，支架2係連接至活 塞桿3 2之底端。 第3圖係該支架結構之剖視圖。 支架2具有一殼體2 0, 一支架基板21，及扣環22。 在殼體20之中央設有可旋轉的連結構件2 Ga ^連結構 件20a之底端與活塞桿32相連接。再者，在殼體2〇内位於連 結構件20a之底端具有内齒輪2〇b。内齒輪20b係與外歯輪 39a嚙合，外齒輪39a係設置在穿過連結構件2〇a之中心孔的 内桿39之底端上。 因此，當馬達34驅動内桿39旋轉時，馬達34之旋轉力藉 内齒輪39b及外齒輪39a之嚙合作用傳導至殼體2〇。 支架基板21以螺絲21a固定於殼體2〇之下表面。 扣環22設置在支架基板21之外周之底邊。 詳言之，與扣環22同樣寬度之凹槽21〇係切割在支架基 板21之外周之下表面上。扣環2 2之頂部嵌入於凹槽2 lc 中。在此狀態下，扣環2 2以螺絲2 1 b固定於支架基板21。再 者’〇形環21d係嵌合在扣環22與支架基板21之間以保持氣 密的狀態。 流體通道6係設置在支架2内。 詳言之，淺槽60係切割在殼體2〇 口 61形成於各槽60之中央。再者， 之下表面。流體入口/ 多數個通孔62形成於449 ^ 3 Q V. Description of the invention (6) The supporting member 38 is transmitted to the inner rod 39 so that the inner rod 39 is rotated within the piston rod 32 at a predetermined speed. The structure of the bracket 2 can hold a workpiece, such as wafer W, in a rotating state, so that the workpiece is located on the polishing pad 10 of the polishing plate 1, and the bracket 2 is connected to the bottom end of the piston rod 32. Figure 3 is a sectional view of the support structure. The bracket 2 has a housing 20, a bracket substrate 21, and a buckle ring 22. At the center of the housing 20, a bottom end of a rotatable connecting member 2Ga connecting structure 20a is connected to the piston rod 32. Further, an internal gear 20b is located at the bottom end of the connecting member 20a in the housing 20. The internal gear 20b is meshed with the outer pinion 39a, and the external gear 39a is provided on the bottom end of the inner rod 39 passing through the center hole of the connecting member 20a. Therefore, when the motor 34 drives the inner lever 39 to rotate, the rotational force of the motor 34 is transmitted to the housing 20 by the meshing action of the internal gear 39b and the external gear 39a. The bracket substrate 21 is fixed to the lower surface of the casing 20 with screws 21a. The buckle 22 is disposed on the bottom edge of the outer periphery of the holder substrate 21. In detail, a groove 21 of the same width as the buckle 22 is cut on the lower surface of the outer periphery of the support base plate 21. The top of the buckle 2 2 is embedded in the groove 2 lc. In this state, the buckle 22 is fixed to the holder substrate 21 with screws 2 1 b. Further, the 'o-ring 21d is fitted between the buckle 22 and the holder substrate 21 so as to maintain an airtight state. The fluid channel 6 is disposed in the bracket 2. In detail, the shallow groove 60 is formed at the center of each groove 60 by cutting at the mouth 20 of the housing. Furthermore, the lower surface. Fluid inlet / multiple through holes 62 are formed in
449530 五、發明說明（7) 支架基板21内。各通孔62與流體入口 /出口η經由槽6〇相 連通’其底端之開口係通至支架基板21之下表面即晶圓^ 的支持表面。流體通道6包括槽60、流髋入口 /出口 61、以 及通孔62。再者，〇形環2 le嵌合在槽60的外側，俾保持殼體 20與支架基板21之間的氣密狀態並阻止流體從槽6〇之内 部遣漏至外部。 如第1圖及第2圖所示之氣體泵4係供應預定氣壓之氣 體至流想通道6之裝置，具有引導氣體用之氣體軟管4〇。 再者’水泵5係提供預定壓力之水蒸氣或水霧之裝置並 供應該水蒸氣或水霧至流體通道6,具有引導水蒸氣或水 用之水管50。 氣體軟管40及水軟管50同時連接至混合容器45。來自 氣艘系4之乳體及來自水泵5之水蒸氣或水霧在該混合办 45内混合。 0各器 混合容器45具有連接至混合容器45之内部的軟管 45a。該管45a，如第2圖所示，係貫穿内桿39而延伸至\ 通道6之流體入口 /出口 61之底端，如第3圖所示。 州 因此，當喷灑來自氣體泵4及水泵5之預設壓力之氣 及水蒸乱或水霧時，先於混合容器45内混合，再通過软營敢 45a至流體通道6再從通孔62之開口流出至晶圓背之番 處。 f面 接著，將說明該氣壓式磨光裝置之實施例之操作 該氣壓式磨光裝置以如下所述之方式操作時即是進當 明之氣壓式磨光方法。 發449530 V. Description of the invention (7) Inside the support substrate 21. Each of the through holes 62 communicates with the fluid inlet / outlet η through the groove 60, and the opening at the bottom end is connected to the lower surface of the holder substrate 21, that is, the supporting surface of the wafer ^. The fluid passage 6 includes a groove 60, a flow hip inlet / outlet 61, and a through hole 62. Furthermore, the o-ring 2le is fitted on the outside of the groove 60, and maintains the airtight state between the housing 20 and the holder substrate 21 and prevents fluid from leaking from the inside of the groove 60 to the outside. The gas pump 4 shown in Figs. 1 and 2 is a device for supplying a gas having a predetermined pressure to the flow channel 6, and has a gas hose 40 for guiding the gas. Furthermore, the 'water pump 5 is a device for supplying water vapor or water mist of a predetermined pressure and supplies the water vapor or water mist to the fluid passage 6, and has a water pipe 50 for guiding the water vapor or water. The gas hose 40 and the water hose 50 are connected to the mixing container 45 at the same time. The milk body from the air ship system 4 and the water vapor or water mist from the water pump 5 are mixed in the mixing office 45. Each of the mixing containers 45 has a hose 45a connected to the inside of the mixing container 45. The tube 45a, as shown in FIG. 2, extends through the inner rod 39 to the bottom end of the fluid inlet / outlet 61 of the channel 6, as shown in FIG. Therefore, when spraying gas and water vapor or water mist with a preset pressure from the gas pump 4 and the water pump 5, first mix in the mixing container 45, then pass through the soft camp 45a to the fluid channel 6 and then from the through hole The opening of 62 flows out to the back of the wafer. f-Face Next, the operation of the embodiment of the pneumatic polishing device will be described. When the pneumatic polishing device is operated in the following manner, it will be a known pneumatic polishing method. hair
4495 3 Ο 五、發明說明（8) 在第1圖及第2圖中，藉與驅動主馬達11使研磨板1旋 轉，並以旋轉驅動機構3之圓筒30推壓支架2所持住之晶圓评 及驅動馬達34使支架2以預設速度旋轉，即可將晶圓w之背 面研磨板1之磨光墊片1〇予以磨光（第1步驟）。 同時，驅動氣體泵4及水泵5，預設壓力之氣體a將流過 氣管40進入混合容器45及預設壓力之水蒸氣或水霧3將流 過水管50進入混合室45。如此，氣體A及水蒸氣或水霧s將 於混合容器45内混合，再通過軟管45 a傳送至支架2之流體 通道6之流體入口 /出口 61。 當氣體A及水蒸氣或水霧S傳輸至流體入口 /出口 61，如 第4圖所示，其流過殼體2〇之下表面之槽進入支架基板21 之名數個通孔6 2，然後，從該等通孔6 2之開口流出至晶圓W 之背面處。 如此，晶圓W之背面以氣體a均勻施壓，因而增進晶圓评 之表面之磨光精確度。晶圓w之背面係以水蒸氣或水霧s潤 濕（第二步驟）。 晶圓在此狀態下加以磨光。在磨光時，研漿（未圖示） 供應至研磨板1，而增進晶圓之磨光效率。然而，如第5圖 所不’部份研聚有時從支架之扣環22與晶圓w之外周邊緣之 間的間隙乃參入’並沉殿在晶圓W之背面之外周w a ^因此， 當研漿因氣體A之乾燥作用而沉澱於Sh周“時即使以清洗 的方式也無法消除澱積在外周“上的磨料c。然而於本實 施例中’如刖述之說明，在晶圓评之整個背面係以水蒸氣或 水霧s潤濕，因此，沉澱於背面之外周ffa之研漿將不會乾4495 3 Ο 5. Description of the invention (8) In the first and second figures, the grinding plate 1 is rotated by driving the main motor 11 and the cylinder 30 held by the rotation driving mechanism 3 is pressed against the crystal held by the bracket 2 The circular evaluation and driving motor 34 rotates the holder 2 at a preset speed, so that the polishing pad 10 of the polishing plate 1 on the back surface of the wafer w can be polished (step 1). At the same time, the gas pump 4 and the water pump 5 are driven, and the gas a with a predetermined pressure will flow through the gas pipe 40 into the mixing container 45 and the water vapor or water mist 3 with the preset pressure will flow through the water pipe 50 into the mixing chamber 45. In this way, the gas A and water vapor or water mist s are mixed in the mixing container 45, and then transmitted to the fluid inlet / outlet 61 of the fluid passage 6 of the stent 2 through the hose 45a. When the gas A and water vapor or water mist S are transmitted to the fluid inlet / outlet 61, as shown in FIG. 4, they flow through the grooves on the lower surface of the housing 20 and enter the through holes 6 2 of the support substrate 21. Then, it flows out from the openings of the through holes 62 to the back surface of the wafer W. In this way, the back surface of the wafer W is evenly pressed by the gas a, thereby improving the polishing accuracy of the surface of the wafer evaluation. The back surface of the wafer w is moistened with water vapor or water mist s (second step). The wafer is polished in this state. During polishing, a polishing slurry (not shown) is supplied to the polishing plate 1 to improve the polishing efficiency of the wafer. However, as shown in FIG. 5, 'part of the research and gathering is sometimes entered from the gap between the buckle 22 of the holder and the outer peripheral edge of the wafer w', and sinks to the outer periphery wa of the back of the wafer W When the slurry is precipitated on the Sh periphery due to the drying effect of the gas A, the abrasive c deposited on the outer periphery cannot be eliminated even by cleaning. However, in this embodiment, as described in the description, the entire back surface of the wafer is wetted with water vapor or water mist. Therefore, the slurry deposited on the periphery of the back surface will not dry.
C:\ProgramFiles\Patent\310561.ptd 第 12 頁 449530 五、發明說明（9) 涸0 如此，根據本發明之氣壓式磨光裝置之實施例，由於晶 圓ff之整個背面後以水蒸氣或水霧S潤濕因此沉澱在背面之 外周Wa之研漿將不會乾涸，當磨光操作結束時，該搬積的研 漿能輕易的經由清洗晶圓W而清除掉。如此一來，即製成高 品質的無研漿磨料或其他沉澱物的晶圆ff。 須注意前文所述之實施例非用以限定本發明之可實施 範圍，任何運用本發明所完成之等效改變及修飾，均仍為本 發明之申請專利範圍所涵蓋。 舉例說明，在前述之實施例中，本發明係供應氣體A及 水蒸氣或水霧S至流體通道6，但也可不供應水蒸氣或水霧 S，而改成供應液態水，即，水本身、與氣體a —起供應。 總結本發明之有利的功效，如前文之詳細說明，由於本 發明係配置成從支架之支持表面開啟流體通道以供應氣體 及水至工件之背面處，然後所供應的水與氣體將從工件之 背表面之外周一起流出至支架之外部。因此，工件之背面 將以水潤濕，使得進入工件之背面之外周之研衆將不會乾 涸，故而這種有利的功效可防止由於在研菜中之磨料之凝 結而產生之沉澱，而能提供具有高品質之工件。 ΙΗΚΙ Η C:\ProgramFiles\Paterit\310561.ptd 第 13 頁C: \ ProgramFiles \ Patent \ 310561.ptd Page 12 449530 V. Description of the invention (9) 涸 0 Thus, according to the embodiment of the pneumatic polishing device of the present invention, since the entire back surface of the wafer ff is filled with water vapor or The water mist S wets and therefore the slurry deposited on the outer periphery Wa will not dry out. When the polishing operation is finished, the deposited slurry can be easily removed by cleaning the wafer W. In this way, high-quality wafers without slurry or other deposits are made. It should be noted that the embodiments described above are not intended to limit the implementable scope of the present invention, and any equivalent changes and modifications made by using the present invention are still covered by the scope of patent application of the present invention. For example, in the foregoing embodiment, the present invention supplies gas A and water vapor or water mist S to the fluid passage 6, but it is also possible to supply liquid water instead of water vapor or water mist S, that is, the water itself , And gas a together. Summarizing the advantageous effects of the present invention, as described in detail above, since the present invention is configured to open a fluid channel from the support surface of the bracket to supply gas and water to the back of the workpiece, the supplied water and gas will then be supplied from the workpiece. The outer surface of the back surface flows out to the outside of the stent together. Therefore, the back surface of the workpiece will be wetted with water, so that the researchers who enter the periphery of the back surface of the workpiece will not dry out. Therefore, this advantageous effect can prevent the precipitation caused by the condensation of the abrasive in the dish, and can Provide high-quality workpieces. ΙΗΚΙ Η C: \ ProgramFiles \ Paterit \ 310561.ptd page 13
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18341498A JP2000000754A (en) | 1998-06-15 | 1998-06-15 | Air pressure type polishing method and device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW449530B true TW449530B (en) | 2001-08-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088106338A TW449530B (en) | 1998-06-15 | 1999-04-21 | Air pressure type polishing method and apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2000000754A (en) |
| KR (1) | KR20000005668A (en) |
| TW (1) | TW449530B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100457053B1 (en) * | 2002-07-30 | 2004-11-10 | 삼성전자주식회사 | Apparatus for cleaning a wafer |
| JP2010042459A (en) * | 2008-08-11 | 2010-02-25 | Tokyo Seimitsu Co Ltd | Device and method for polishing wafer |
| JP2017112255A (en) * | 2015-12-17 | 2017-06-22 | 株式会社ディスコ | Transport device |
-
1998
- 1998-06-15 JP JP18341498A patent/JP2000000754A/en active Pending
-
1999
- 1999-04-21 TW TW088106338A patent/TW449530B/en active
- 1999-05-17 KR KR1019990017546A patent/KR20000005668A/en not_active Application Discontinuation
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| Publication number | Publication date |
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| KR20000005668A (en) | 2000-01-25 |
| JP2000000754A (en) | 2000-01-07 |
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