CN117506703B - Measuring device and polishing system - Google Patents
Measuring device and polishing system Download PDFInfo
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- CN117506703B CN117506703B CN202311637275.1A CN202311637275A CN117506703B CN 117506703 B CN117506703 B CN 117506703B CN 202311637275 A CN202311637275 A CN 202311637275A CN 117506703 B CN117506703 B CN 117506703B
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- 238000005498 polishing Methods 0.000 title claims abstract description 142
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 204
- 230000001680 brushing effect Effects 0.000 claims abstract description 71
- 238000005259 measurement Methods 0.000 claims description 34
- 239000012528 membrane Substances 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 7
- 230000001502 supplementing effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract description 9
- 239000002245 particle Substances 0.000 abstract description 4
- 238000007517 polishing process Methods 0.000 abstract description 2
- 230000002209 hydrophobic effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 239000002352 surface water Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to the technical field of grinding and polishing, and discloses a measuring device and a polishing system. The device specifically comprises a driving piece, a water absorption part, a film brushing part and a laser measuring assembly. The water absorbing part and the film brushing part are connected with the driving part through the connecting part; the water absorbing part is provided with a first state of being arranged in a hole of the upper polishing pad, and the film brushing part is provided with a second state of being arranged in the hole; when the connecting piece drives the water absorbing part to be in the first state, the film brushing part is positioned outside the hole, and the water absorbing part is used for absorbing processing water at the position, opposite to the hole, of the workpiece; when the connecting piece drives the film brushing part to be in the second state, the water absorbing part is positioned outside the hole, the film brushing part is used for covering a water film on the part, opposite to the hole, of the workpiece, and the connecting piece can enable the water absorbing part and the film brushing part to be positioned outside the hole; the laser beam emitted by the laser measuring component can pass through the hole to measure the thickness of the part of the workpiece covered with the water film. According to the invention, the online thickness detection in the workpiece polishing process can be realized, and the interference of grinding particles in the processing water on the detection precision is avoided.
Description
Technical Field
The invention relates to the technical field of grinding and polishing, in particular to a measuring device and a polishing system.
Background
Chemical-mechanical polishing (CMP), also known as Chemical-mechanical planarization (CMP) (Chemical-MECHANICAL PLANARIZATION, CMP), is mainly used in the field of semiconductor device fabrication, and is particularly used in integrated circuits (INTEGRATED CIRCUIT, ICs) and Ultra LARGE SCALE Integration (ULSI) circuits for planarizing wafers, or other substrate materials under process. The CMP equipment can also be used for high-precision grinding and polishing of hard and brittle materials such as germanium, sapphire, ceramics, glass and the like.
In the process of polishing a workpiece, knowing the thickness information of the workpiece in time is very important to judge the processing quality of the workpiece, and the traditional contact type thickness measuring method can not realize the online detection of the workpiece by using a measuring probe to contact with the surface of the workpiece so as to measure the thickness; in addition, there is also a method of measuring a non-contact thickness by irradiating a measurement surface of a workpiece with a laser beam, receiving reflected light from the front and back surfaces of the wafer, and analyzing an interference waveform.
The non-contact thickness measurement method of laser thickness measurement can realize on-line thickness measurement of a processed wafer workpiece, greatly improves the processing efficiency, and is widely applied to double-sided polishing of wafers.
However, in the case of irradiating a workpiece with a laser or the like to realize noncontact thickness measurement, if the measured area of the upper surface of the workpiece is a dry surface, the interference intensity of reflected light from the upper and lower surfaces of the workpiece is weak at the time of thickness measurement. It has been found that, if a water film of a certain thickness is formed on the measured surface of the workpiece, the interference intensity of the reflected light from the upper and lower surfaces of the workpiece is enhanced to facilitate measurement, and therefore, the prior art supplies the processing water at the same time when the laser thickness is measured. However, the processing water entering the measuring window region contains grinding particles and grinding dust generated by processing, and these particles interfere with interference of light when passing through the laser light, resulting in a decrease in measurement accuracy.
Disclosure of Invention
The invention aims to provide a measuring device and a polishing system, which are used for realizing the on-line detection of the laser thickness of a workpiece in the polishing process, avoiding the precision interference of grinding particles in processing water and grinding scraps generated by processing on the laser thickness detection, and improving the measuring precision.
To achieve the purpose, the invention adopts the following technical scheme:
a measuring device for detecting a thickness of a workpiece, comprising:
a driving member;
the water absorbing part is connected with the driving piece through a connecting piece;
The film brushing part is connected with the driving piece through the connecting piece;
the water absorbing part is provided with a first state of being arranged in a hole of the upper polishing pad, and the film brushing part is provided with a second state of being arranged in the hole;
When the connecting piece drives the water absorbing part to be in the first state, the film brushing part is positioned outside the hole, and the water absorbing part is used for absorbing processing water at the position of the workpiece opposite to the hole and impurities in the processing water;
When the connecting piece drives the film brushing part to be in the second state, the water absorbing part is positioned outside the hole, the film brushing part is used for covering a water film on the part, opposite to the hole, of the workpiece, and the connecting piece can drive the water absorbing part and the film brushing part to be positioned outside the hole;
And the laser measuring assembly is used for measuring the thickness of the part of the workpiece covered with the water film, wherein the laser beam emitted by the laser measuring assembly can penetrate through the hole when the water absorbing part and the film brushing part are arranged outside the hole.
As an alternative of the measuring device, the water absorbing part includes a first cover body and a water absorbing member connected to a bottom wall of the first cover body, and the water absorbing member has capillary holes thereon.
As an alternative of the measuring device, the membrane brushing part includes a second cover body and a water draining member connected to a bottom wall of the second cover body, the water draining member is connected to a water dripping assembly, and the water dripping assembly is used for supplementing water into the water draining member.
As an alternative of the measuring device, the drip assembly includes a water tank, a water supply pipe communicated with a water outlet end of the water tank, and the water supply pipe passes through the second cover or is pressed to the water drain along a surface of the second cover.
As an alternative scheme of measuring device, the connecting piece includes head rod and second connecting rod, the one end of head rod with the driving piece is connected, the other end of head rod with the portion of absorbing water is connected, the one end of second connecting rod with brush membrane portion is connected, the head rod with the second connecting rod is the contained angle setting.
As an alternative to a measuring device, the measuring device further includes a polishing portion connected to the driving member through the connecting member, the polishing portion having a third state disposed in the hole, and when the driving member drives the polishing portion to be disposed in the third state, both the water absorbing portion and the film brushing portion being disposed outside the hole; when the water absorbing part is in the first state or the film brushing part is in the second state, the polishing parts are all arranged outside the holes; the polishing part is used for plugging the hole so as to polish the workpiece.
The polishing system comprises a carrier, an upper polishing pad, a lower polishing pad and a driving assembly, and further comprises the measuring device according to any scheme; the workpiece can be arranged on the carrier, the circumferential outer wall of the carrier is in transmission connection with the driving assembly, the driving assembly can drive the carrier to rotate in a horizontal plane, and the upper polishing pad and the lower polishing pad are respectively positioned on the upper side and the lower side of the carrier.
As an alternative scheme of polishing system, polishing system still includes locating the last polishing dish of last polishing pad roof, go up the polishing dish and be equipped with the through-hole, the through-hole with the hole is relative, be equipped with the measurement window in the through-hole, the laser beam that laser measurement subassembly launched can penetrate in proper order the through-hole, measurement window and the hole.
The polishing system of claim, the upper polishing platen comprising a bottom platen coupled to the upper polishing pad and a top platen removably coupled to a top wall of the bottom platen.
The polishing system of claim, wherein a cavity structure is formed in the upper polishing disc, the cavity structure is formed by the first cavity of the top disc and the second cavity of the bottom disc being communicated together, the driving piece and the connecting piece are both arranged in the cavity structure, and the driving piece can drive the connecting piece to move or rotate so that the water absorbing part or the membrane brushing part is arranged in the hole or separated from the hole.
The beneficial effects are that:
In a first aspect of the present invention, an upper polishing pad overlies an upper surface of a workpiece, and polishing of the workpiece surface is achieved by relative movement between the workpiece and the upper polishing pad. The holes are formed in the upper polishing pad, so that laser beams emitted by the laser measuring assembly directly pass through the holes, and the on-line thickness measurement of a workpiece can be realized; further, the driving piece is respectively in driving connection with the water absorbing part and the film brushing part through the connecting piece, the driving piece can drive the connecting piece and drive the water absorbing part to be in a first state, namely the water absorbing part enters the hole, so that the processing water and impurities in the processing water at the position opposite to the hole of the workpiece are absorbed, at the moment, the film brushing part is positioned outside the hole, and after the water absorbing part is used for absorbing water; the driving piece makes the water absorption part break away from the hole through driving the connecting piece to further drive the brush membrane portion and get into the hole, brush membrane portion is used for covering the water film to work piece and hole relative position, promotes the interference intensity of the reflected light of laser beam, because be the pure water in the water film this moment, and has got rid of former processing water and the impurity in the processing water in the lump through the water absorption portion, thereby make this device can realize the online thickness measurement to the work piece, avoid simultaneously grinding granule in the processing water and the abrasive dust that processing produced effectively to the precision interference of laser thickness detection, promote measurement accuracy.
In a second aspect of the invention, a carrier is used to secure a workpiece; the drive assembly can drive the carrier to rotate to drive the work piece and rotate, two upper and lower surfaces of work piece can rotate for last polishing pad and lower polishing pad, realize the two-sided polishing of work piece, when needing to measure thickness, drive assembly stops rotating, carries out the clearance of work piece surface processing water that awaits measuring through the portion of absorbing water, carries out the formation of work piece surface water film that awaits measuring through the portion of brushing the membrane, further realizes thickness detection through laser measurement subassembly, and this system can realize the on-line thickness measurement to the work piece, need not to take off the work piece from the burnishing machine, is favorable to improving measurement efficiency and according to measuring result adjustment processing parameter.
Drawings
FIG. 1 is a schematic illustration in cross-section of a polishing system provided by an embodiment of the invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a schematic view showing a part of the structure of a measuring apparatus in a polished state or a measuring state according to an embodiment of the present invention;
FIG. 4 is a schematic view of a portion of a measuring device in a first state of a water absorbing portion according to an embodiment of the present invention;
FIG. 5 is a schematic view of a portion of a measuring device with a membrane brushing portion in a second state according to an embodiment of the present invention;
FIG. 6 is a schematic view showing a part of the structure of a measuring apparatus with a polishing section in a polished state according to an embodiment of the present invention;
FIG. 7 is a schematic view showing a part of a structure of a measuring apparatus with a polishing section according to an embodiment of the present invention when a water absorbing section is in a first state;
FIG. 8 is a schematic view showing a part of the structure of the measuring apparatus with a polishing section according to the embodiment of the present invention when the film brushing section is in the second state;
fig. 9 is a schematic view of a part of the structure of a measuring device with a polishing section in a measuring state according to an embodiment of the present invention.
In the figure:
100. A workpiece; 200. a top polishing pad; 210. a hole; 300. a carrier; 400. a lower polishing pad; 500. a drive assembly; 510. a gear ring; 520. a sun gear; 600. a polishing disk is arranged on the upper part; 610. a through hole; 611. a seal ring; 620. a measurement window; 630. a chassis; 631. a second chamber; 640. a top plate; 641. a first chamber; 650. a cavity structure; 700. a lower polishing disk; 800. a base;
1. A driving member; 2. a water absorbing part; 21. a first cover; 22. a water absorbing member; 3. brushing a film part; 31. a second cover; 32. a water-repellent member; 4. a connecting piece; 41. a first connecting rod; 42. a second connecting rod; 43. a third connecting rod; 51. a water tank; 52. a water supply pipe; 6. a polishing section; 7. and a laser measurement assembly.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
Referring to fig. 1 to 5, a first aspect of the present embodiment relates to a measuring apparatus (hereinafter referred to as "apparatus") that can be used for detecting the thickness of a workpiece 100, and specifically includes a driving member 1, a water absorbing portion 2, a film brushing portion 3, and a laser measuring assembly 7. The water absorbing part 2 is connected with the driving part 1 through a connecting piece 4; the film brushing part 3 is connected with the driving piece 1 through a connecting piece 4; the water absorbing part 2 has a first state of being placed in the hole 210 of the upper polishing pad 200, and the membrane brushing part 3 has a second state of being placed in the hole 210; when the connecting piece 4 drives the water absorbing part 2 to be in the first state, the film brushing part 3 is positioned outside the hole 210, and the water absorbing part 2 is used for absorbing processing water and impurities in the processing water at the position of the workpiece 100 opposite to the hole 210; when the connecting piece 4 drives the film brushing part 3 to be in the second state, the water absorbing part 2 is positioned outside the hole 210, the film brushing part 3 is used for covering a water film on the part, opposite to the hole 210, of the workpiece 100, and the connecting piece 4 can drive the water absorbing part 2 and the film brushing part 3 to be positioned outside the hole 210; when the water absorbing part 2 and the film brushing part 3 are both arranged outside the hole 210, the laser beam emitted by the laser measuring component 7 can pass through the hole 210 to measure the thickness of the part of the workpiece 100 covered with the water film.
In this embodiment, the workpiece 100 may be a wafer, silicon carbide, sapphire, or the like.
In this embodiment, the upper polishing pad 200 is disposed on the upper surface of the workpiece 100, and polishing of the surface of the workpiece 100 is achieved by the relative movement between the workpiece 100 and the upper polishing pad 200, and the hole 210 is formed in the upper polishing pad 200, so that the laser beam emitted by the laser measuring component 7 directly passes through the hole 210, and online measurement of the thickness of the workpiece 100 is achieved; further, the device further comprises a water absorbing part 2 and a film brushing part 3, wherein the driving piece 1 is respectively in driving connection with the water absorbing part 2 and the film brushing part 3 through the connecting piece 4, the driving piece 1 can drive the connecting piece 4 and drive the water absorbing part 2 to be in a first state, namely, the water absorbing part 2 enters the hole 210, so that the processing water and impurities in the processing water at the position opposite to the hole 210 of the workpiece 100 are absorbed, at the moment, the film brushing part 3 is positioned outside the hole 210, and after the water absorbing part 2 finishes water absorption; the driving piece 1 makes the water absorption part 2 break away from the hole 210 through driving the connecting piece 4 to further drive the brush film part 3 and get into the hole 210, brush film part 3 is used for covering the water film to the relative position of work piece 100 and hole 210, promotes the interference intensity of the reflected light of laser beam, because the constitution of water film is pure water this moment, and has got rid of former processing water and the impurity in the processing water together through water absorption part 2, this device can also effectively avoid the grinding granule in the processing water and the abrasive dust that processing produced to the precision interference of laser thickness detection when can realizing the online thickness measurement process of work piece 100, promotes measurement accuracy.
Optionally, the connecting piece 4 includes a first connecting rod 41 and a second connecting rod 42, one end of the first connecting rod 41 is connected with the driving piece 1, the other end of the first connecting rod 41 is connected with the water absorbing portion 2, one end of the second connecting rod 42 is connected with the film brushing portion 3, and the first connecting rod 41 and the second connecting rod 42 are arranged at an included angle.
In this embodiment, the ends of the first connecting rod 41 and the second connecting rod 42 connected with the driving member 1 may be directly connected with each other, so that the water absorbing portion 2 and the film brushing portion 3 are always disposed at an angle relative to the driving member 1 (or the rotation center), and the water absorbing portion 2 and the film brushing portion 3 are ensured not to be located in the hole 210 at the same time by using the same driving member 1, so that the structure is more compact.
In this embodiment, the driving member 1 may be a stepping motor which can be rotated and swung, the angle of the connecting member 4 is adjusted by the rotation, and the work efficiency of the water sucking part 2 and the film brushing part 3 is improved by the swing.
Referring to fig. 6-9, the measuring device further includes a polishing portion 6, the polishing portion 6 is connected to the driving member 1 through the connecting member 4, the polishing portion 6 has a third state disposed in the hole 210, and when the driving member 1 drives the polishing portion 6 to be disposed in the third state, the water absorbing portion 2 and the film brushing portion 3 are disposed outside the hole 210; when the water absorbing part 2 is in the first state or the film brushing part 3 is in the second state, the polishing parts 6 are all arranged outside the holes 210; the polishing section 6 is used to block the hole 210 to polish the workpiece 100.
In this embodiment, in order to facilitate on-line measurement of the thickness value of the workpiece 100 in the polished state, it is necessary to process the hole 210 in the upper polishing pad 200, and since there is a lack of polishing material at the hole 210, there is a difference in polishing surface quality between the area where the hole 210 passes on the surface of the workpiece 100 and other areas when polishing the workpiece 100 and the upper polishing pad 200, resulting in deterioration of polishing uniformity. In order to ensure the polishing uniformity of the workpiece 100, the polishing device is further provided with a polishing part 6, the material of the polishing part 6 is the same as the matrix material of the upper polishing pad 200, when the water absorbing part 2 and the film brushing part 3 are both arranged outside the hole 210, the polishing part 6 is arranged in the hole 210, so that the whole surface of the upper polishing pad 200 forms a complete polishing surface, the polishing quality of the workpiece 100 is better in a polishing operation state, the polishing uniformity is ensured, and when the thickness of the workpiece 100 needs to be measured, the polishing part 6 is arranged outside the hole 210.
In this embodiment, the polishing portion 6 is connected to the driving member 1 through the third connecting rod 43, and similarly, the third connecting rod 43 is disposed at an angle with the first connecting rod 41 and the second connecting rod 42, so as to ensure that the water absorbing portion 2, the film brushing portion 3 and the polishing portion 6 are not located in the hole 210 at the same time by using the same driving member 1, and the structure tends to be compact.
Further, the first connecting rod 41, the second connecting rod 42 and the third connecting rod 43 are of an integrated structure, so that the number of parts of the whole device can be reduced. In this embodiment, the first connecting rod 41, the second connecting rod 42 and the third connecting rod 43 are rod-shaped members, and in other embodiments, other shaped members with a certain structural strength may be used, and for example, the first connecting rod 41, the second connecting rod 42 and the third connecting rod 43 may be plate-shaped members, and the specific shape of this embodiment is not limited.
With continued reference to fig. 3 to 5, the water absorbing portion 2 may optionally include a first cover 21 and a water absorbing member 22 connected to a bottom wall of the first cover 21, where the water absorbing member 22 has capillary holes.
In this embodiment, the first cover 21 is used to connect with the connecting piece 4, and may be in a detachable connection form such as a clamping connection, a plugging connection or a screwing connection, or may directly form the first cover 21 and the connecting piece 4 into an integral structure, the bottom of the first cover 21 is provided with a water absorbing member 22, the water absorbing member 22 has a capillary structure for improving water absorption efficiency, the water absorbing member 22 may be made of soft cloth or soft hairs that extend vertically and are compactly arranged, and the cloth itself has a porous structure for facilitating water absorption; the closely arranged bristles form capillary holes for capillary action between adjacent gaps of the plurality of bristles.
Alternatively, the membrane brushing part 3 includes a second cover 31 and a drain member 32 connected to a bottom wall of the second cover 31, the drain member 32 being connected to a drip assembly for replenishing water into the drain member 32.
In this embodiment, the structure of the second cover 31 and the connection form with the connecting piece 4 may refer to the first cover 21, the bottom of the second cover 31 is provided with the hydrophobic member 32, the hydrophobic member 32 may be a brush structure, after the inside of the hydrophobic member 32 is soaked in pure water, a water film is left between the hydrophobic member 32 and the surface of the workpiece 100 and covers the surface of the workpiece 100, and further, a water dripping assembly is provided on the device, and the water dripping assembly may continuously or timely supplement water to the hydrophobic member 32 to supplement the water immersing amount loss of the hydrophobic member 32 due to the continuous forming of the water film when the workpiece 100 is measured for multiple on-line thicknesses, so that the water immersing amount of the hydrophobic member 32 is always kept to be a constant value.
Further, the drip assembly includes a water tank 51, a water supply pipe 52 communicating with the water outlet end of the water tank 51, and the water supply pipe 52 is pressed to the drain 32 through the second cover 31 or along the surface of the second cover 31.
In this embodiment, the water tank 51 is located at the top of the whole device, water in the water tank 51 is conveyed to the water drain member 32 through the water supply pipe 52 by gravity, an introduction hole for the water supply pipe 52 to pass through is formed in the second cover 31, and the water supply pipe 52 passes through the second cover 31 to be pressed against the water drain member 32; in other embodiments, the water supply pipe 52 may be attached to the outer wall of the second cover 31 and pressed against the drain member 32 along the surface of the outer wall of the second cover 31.
In the present embodiment, rotation of the water absorbing member 22 and the water draining member 32 can be achieved by providing the rotary motor in the first cover body 21 and the second cover body 31, ensuring water absorbing and film covering efficiency; in addition, the water absorbing portion 2 and the film brushing portion 3 may be connected to the driving member 1 through an intermediate transmission structure, and the specific intermediate transmission structure may be belt transmission, chain transmission or gear transmission, and the specific transmission form is not limited in this embodiment.
The second aspect of the present embodiment also relates to a polishing system (hereinafter referred to as "system") comprising the carrier 300, the upper polishing pad 200, the lower polishing pad 400, the drive assembly 500, and the measurement apparatus described above; the workpiece 100 can be arranged on the carrier 300, the circumferential outer wall of the carrier 300 is in transmission connection with the driving assembly 500, the driving assembly 500 can drive the carrier 300 to rotate in the horizontal plane, and the upper polishing pad 200 and the lower polishing pad 400 are respectively positioned on the upper side and the lower side of the carrier 300.
In this embodiment, the carrier 300 is provided with a positioning hole, and the workpiece 100 is fixed in the positioning hole; the driving component 500 is in transmission connection with the peripheral outer wall of the carrier 300, the driving component 500 can drive the carrier 300 to rotate, thereby driving the workpiece 100 to rotate, enabling the upper polishing pad 200 and the lower polishing pad 400 to be respectively positioned on the upper side and the lower side of the carrier 300, enabling the upper surface and the lower surface of the workpiece 100 to rotate relatively relative to the upper polishing pad 200 and the lower polishing pad 400, thereby realizing double-sided polishing of the workpiece 100, stopping polishing operation when the thickness of the workpiece 100 needs to be measured on line, cleaning surface processing water to be measured on the workpiece 100 through the water absorbing part 2, forming a surface water film to be measured on the workpiece 100 through the film brushing part 3, further realizing thickness detection through the laser measuring component 7, and ensuring that the whole system can measure the thickness of the workpiece 100 on line under the state of polishing operation.
In this embodiment, the driving assembly 500 includes a gear ring 510 and a sun gear 520, the sun gear 520 is located at the center of the gear ring 510, and the inner teeth of the gear ring 510 and the outer teeth of the sun gear 520 are engaged with the circumferential outer teeth of the carrier 300, so that the carrier 300 can be driven to perform revolution motion around the sun gear 520 and rotation motion around its own axis by the rotational motion of the gear ring 510 and the sun gear 520.
Further, the polishing system further comprises an upper polishing disc 600 disposed on the top wall of the upper polishing pad 200, the upper polishing disc 600 is provided with a through hole 610, the through hole 610 is opposite to the hole 210, a measurement window 620 is disposed in the through hole 610, and laser energy emitted by the laser measurement assembly 7 sequentially penetrates through the through hole 610, the measurement window 620 and the hole 210.
In this embodiment, the bottom wall of the upper polishing disk 600 is used for fixing the upper polishing pad 200, meanwhile, the laser measuring component 7 is disposed on the outer side above the top of the upper polishing disk 600, the upper polishing disk 600 is provided with a through hole 610 opposite to the hole 210, and the measuring window 620 in the through hole 610 can prevent the polishing liquid on the surface of the workpiece 100 from entering into the through hole 610, so as to ensure the accuracy of thickness measurement of the laser measuring component 7, and during measurement, the laser beam generated by the laser measuring component 7 can directly reach the surface to be measured of the workpiece 100 through the through hole 610.
In this embodiment, the through hole 610 and the hole 210 are circular holes with equal diameters; in the through hole 610, the measuring window 620 is connected with the inner wall of the through hole 610 and is disposed into the sealing ring 611, so that the tightness is further improved; in addition, a base 800 is provided at the bottom of the lower polishing pad 700, the base 800 is a supporting platform, the driving assembly 500 is disposed on the base 800, and the base 800 is used to provide support for other components of the entire system.
Optionally, the upper polishing pad 600 includes a bottom plate 630 coupled to the upper polishing pad 200 and a top plate 640 detachably coupled to a top wall of the bottom plate 630; the upper polishing disc 600 is provided with a cavity structure 650 inside, the cavity structure 650 is formed by communicating a first cavity 641 of the top disc 640 and a second cavity 631 of the bottom disc 630 together, the driving element 1 and the connecting element 4 are both arranged in the cavity structure 650, and the driving element 1 can drive the connecting element 4 to move or rotate, so that the water absorbing part 2 or the film brushing part 3 is arranged in the hole 210 or separated from the hole 210.
In this embodiment, the upper polishing disc 600 is a split structure, the bottom disc 630 and the top disc 640 are detachably connected, so that replacement is convenient, a cavity structure 650 is provided on the upper polishing disc 600, wherein the cavity structure 650 is used for accommodating the driving member 1 and the connecting member 4, and the water absorbing portion 2 and the film brushing portion 3 have enough movement space inside the cavity structure 650, so that the driving member 1 can drive the connecting member 4 and drive the water absorbing portion 2 and the film brushing portion 3 to move or rotate, thereby ensuring that the water absorbing portion 2 or the film brushing portion 3 is placed in the hole 210, and completing the operations of removing processing water and covering a water film before measurement; the detachable connection structure of the bottom plate 630 and the top plate 640 also facilitates the arrangement of the driving element 1, the connecting element 4, the water absorbing portion 2 and the membrane brushing portion 3 in the cavity structure 650. Specifically, the cavity structure 650 is formed by jointly communicating the first cavity 641 located on the top plate 640 and the second cavity 631 located on the bottom plate 630, the driving member 1 is fixed on the top plate 640, the connecting member 4 is connected with the driving end of the driving member 1 and is placed inside the cavity structure 650, the water supply pipe 52 passes through the top plate 640 and passes through the first cavity 641 and/or the second cavity 631, the second cavity 631 is communicated with the hole 210, in the polished state, the water absorbing member 22 of the water absorbing part 2 and the water draining member 32 of the membrane brushing part 3 are located inside the cavity structure 650 under the driving of the driving member 1, the hole 210 is kept in a vacant state or is blocked by the polishing part 6, when the thickness detection is needed, the water absorbing member 22 and the water draining member 32 alternately enter the hole 210, and are compressed when the water absorbing member 22 and the water draining member 32 are flexible bodies and extend into the hole 210 when the water absorbing member is displaced into the hole 210; chamfers are formed in the second cavity 631 of the chassis 630 at positions corresponding to the holes 210 along the circumferential direction, and the chamfers can facilitate the water absorbing member 22 of the water absorbing part 2 and the water draining member 32 of the film brushing part 3 to separate from and enter, so that the resistance in the conversion process is reduced.
In this embodiment, a plurality of metal elastic pieces are disposed at the position of the top plate 640 in the cavity structure 650 opposite to the hole 210, and the metal elastic pieces are crescent-shaped and circumferentially arranged along the hole 210 region, so that the metal elastic pieces not only can guide the driving member 1 to drive the first cover 21 of the water absorbing portion 2 or the second cover 31 of the film brushing portion 3 to smoothly enter the hole 210, but also can apply a certain pressure to the water absorbing portion 2 or the film brushing portion 3 which has entered the hole 210, thereby improving the water absorbing effect of the water absorbing portion 2 and the film covering effect of the film brushing portion 3.
The following is a schematic description of the polishing operation and thickness detection switching performed by the system with the polishing section 6 according to the present embodiment:
Referring to fig. 6, when the entire system performs polishing operation, the polishing portion 6 plugs the hole 210 under the driving of the driving member 1, so as to ensure that the entire upper polishing pad 200 is a complete polishing plane, ensure the polishing uniformity of the workpiece 100, and the driving assembly 500 drives the carrier 300 and the workpiece 100 thereon to rotate for performing rotational polishing; further, referring to fig. 7, when the thickness of the workpiece 100 needs to be measured, the driving assembly 500 is stopped, so that the workpiece 100 is kept stationary, the driving member 1 drives the connecting member 4 to rotate clockwise by a certain angle in the figure, so that the polishing portion 6 is disposed outside the hole 210, and the water absorbing member 22 of the water absorbing portion 2 is disposed in the hole 210, so as to absorb the processing water on the surface of the workpiece 100 to be measured; after the absorption is completed, please refer to fig. 8, the driving member 1 drives the connecting member 4 to rotate clockwise for a certain angle again, so that the water absorbing portion 2 is disposed outside the hole 210, and the water draining member 32 of the film brushing portion 3 is disposed in the hole 210, so as to cover the surface of the workpiece 100 to be measured with a water film, and during this time, the water tank 51 and the water supplying pipe 52 can be used for supplementing the water immersing amount of the water draining member 32, so as to ensure complete film covering; after the water film is covered, please refer to fig. 9, the driving member 1 drives the connecting member 4 to rotate anticlockwise by a certain angle, so that the film brushing portion 3 is also disposed outside the hole 210, at this time, the anticlockwise rotation angle needs to ensure that the polishing portion 6 and the water absorbing portion 2 are both located outside the hole 210, at this time, the laser beam emitted by the laser measuring assembly 7 sequentially passes through the through hole 610, the measuring window 620 and the hole 210 to reach the surface of the workpiece 100, and is reflected on the surface, so as to realize online measurement on the workpiece 100, and when the polishing operation needs to be continued, the driving member 1 drives the connecting member 4 to rotate anticlockwise by a certain angle again, so that the polishing portion 6 plugs the hole 210 again.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the invention. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (8)
1. Measuring device for detecting the thickness of a workpiece (100), characterized in that it comprises:
A driving member (1);
a water absorbing part (2), wherein the water absorbing part (2) is connected with the driving piece (1) through a connecting piece (4); the water absorbing part (2) comprises a first cover body (21) and a water absorbing piece (22) connected with the bottom wall of the first cover body (21), and capillary holes are formed in the water absorbing piece (22);
the film brushing part (3), wherein the film brushing part (3) is connected with the driving piece (1) through the connecting piece (4);
The water absorbing part (2) is provided with a first state of being arranged in a hole (210) of the upper polishing pad (200), and the film brushing part (3) is provided with a second state of being arranged in the hole (210);
When the connecting piece (4) drives the water absorbing part (2) to be in the first state, the film brushing part (3) is positioned outside the hole (210), and the water absorbing part (2) is used for absorbing processing water at the position of the workpiece (100) opposite to the hole (210) and impurities in the processing water;
When the connecting piece (4) drives the film brushing part (3) to be in the second state, the water absorbing part (2) is positioned outside the hole (210), the film brushing part (3) is used for covering a water film on the part, opposite to the hole (210), of the workpiece (100), and the connecting piece (4) can drive the water absorbing part (2) and the film brushing part (3) to be positioned outside the hole (210);
The laser measuring assembly (7) can penetrate through the hole (210) when the water absorbing part (2) and the film brushing part (3) are arranged outside the hole (210), and the thickness of the part, covered with the water film, of the workpiece (100) is measured;
the connecting piece (4) comprises a first connecting rod (41) and a second connecting rod (42), one end of the first connecting rod (41) is connected with the driving piece (1), the other end of the first connecting rod (41) is connected with the water absorbing part (2), one end of the second connecting rod (42) is connected with the membrane brushing part (3), and the first connecting rod (41) and the second connecting rod (42) are arranged in an included angle mode.
2. Measuring device according to claim 1, characterized in that the membrane brushing part (3) comprises a second cover body (31) and a water drain member (32) connected to the bottom wall of the second cover body (31), the water drain member (32) being connected to a drip assembly for supplementing water into the water drain member (32).
3. The measuring device according to claim 2, characterized in that the drip assembly comprises a water tank (51), a water supply pipe (52) communicating with the water outlet end of the water tank (51), the water supply pipe (52) being pressed to the drain (32) through the second cover (31) or along the surface of the second cover (31).
4. The measuring device according to claim 1, characterized in that it further comprises a polishing part (6), said polishing part (6) being connected to said driving member (1) by means of said connecting member (4), said polishing part (6) having a third state placed in said hole (210), said water absorbing part (2) and said membrane brushing part (3) being both placed outside said hole (210) when said driving member (1) drives said polishing part (6) to be placed in said third state; when the water absorbing part (2) is in the first state or the film brushing part (3) is in the second state, the polishing parts (6) are all arranged outside the holes (210); the polishing portion (6) is used for sealing the hole (210) to polish the workpiece (100).
5. A polishing system comprising a carrier (300), an upper polishing pad (200), a lower polishing pad (400), and a drive assembly (500), further comprising the measurement device of any one of claims 1-4; the workpiece (100) can be arranged on the carrier (300), the circumferential outer wall of the carrier (300) is in transmission connection with the driving assembly (500), the driving assembly (500) can drive the carrier (300) to rotate in a horizontal plane, and the upper polishing pad (200) and the lower polishing pad (400) are respectively positioned on the upper side and the lower side of the carrier (300).
6. The polishing system of claim 5, further comprising an upper polishing platen (600) disposed on a top wall of the upper polishing pad (200), wherein the upper polishing platen (600) is provided with a through hole (610), the through hole (610) is opposite to the hole (210), a measurement window (620) is disposed in the through hole (610), and a laser beam emitted by the laser measurement assembly (7) can sequentially penetrate the through hole (610), the measurement window (620), and the hole (210).
7. The polishing system of claim 6, wherein the upper polishing platen (600) comprises a bottom platen (630) coupled to the upper polishing pad (200) and a top platen (640) removably coupled to a top wall of the bottom platen (630).
8. The polishing system according to claim 7, wherein a cavity structure (650) is disposed inside the upper polishing platen (600), the cavity structure (650) is formed by the joint communication of the first cavity (641) of the top platen (640) and the second cavity (631) of the bottom platen (630), the driving member (1) and the connecting member (4) are both disposed in the cavity structure (650), and the driving member (1) can drive the connecting member (4) to move or rotate, so that the water absorbing portion (2) or the membrane brushing portion (3) is disposed in the hole (210) or is separated from the hole (210).
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| CN202311637275.1A CN117506703B (en) | 2023-12-01 | 2023-12-01 | Measuring device and polishing system |
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| CN202311637275.1A CN117506703B (en) | 2023-12-01 | 2023-12-01 | Measuring device and polishing system |
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Address after: East workshop on the first floor, No. 22, Aigehao Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province, 215100 Patentee after: Suzhou Bohongyuan Equipment Co.,Ltd. Country or region after: China Address before: East workshop on the first floor, No. 22, Aigehao Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province, 215100 Patentee before: SUZHOU BOHONGYUAN MACHINERY MANUFACTURING Co.,Ltd. Country or region before: China |