JP2012237612A - Pressure sensor - Google Patents

Pressure sensor Download PDF

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JP2012237612A
JP2012237612A JP2011105795A JP2011105795A JP2012237612A JP 2012237612 A JP2012237612 A JP 2012237612A JP 2011105795 A JP2011105795 A JP 2011105795A JP 2011105795 A JP2011105795 A JP 2011105795A JP 2012237612 A JP2012237612 A JP 2012237612A
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lead pin
pressure detection
output lead
pressure
detection element
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JP5833835B2 (en
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Osamu Takatsuki
修 高月
Tsunehisa Aoyama
倫久 青山
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Fujikoki Corp
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Fujikoki Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a pressure sensor that allows airtightness of a pressure detection unit to be maintained while allowing improvement in structural vulnerability around an output lead pin.SOLUTION: A pressure sensor 1 comprises: a pressure detection unit 2 having a pressure detection element 21; an output lead pin 33 connected to the pressure detection element and protruding to the outside of the pressure detection unit; and a wiring board 31 having the output lead pin fixed electrically in a connectable manner to an external output lead wire 32. An adjustment lead pin 36 (36B, 36C) connected to the pressure detection element and protruding to the outside of the pressure detection unit is fixed to the wiring board. Since not only the output lead pin but also the adjustment lead pin used for voltage correction and the like is fixed to the wiring board, the strength of the entire structure of the output lead pin, the wiring board and the adjustment lead pin is increased, thereby allowing improvement in structural vulnerability around the output lead pin.

Description

本発明は、圧力センサに関し、特に、圧力検出素子を収容した受圧空間に液体を封入した液封入式の圧力センサに関する。   The present invention relates to a pressure sensor, and more particularly to a liquid-filled pressure sensor in which a liquid is sealed in a pressure-receiving space that houses a pressure detection element.

従来、圧力検出素子が収容された受圧空間内に液体を封入し、圧力検出室に外部から加えられた圧力を液体を介して圧力検出素子に伝えることで、圧力検出素子から外部圧力に応じた電圧信号を出力する圧力センサが種々提案されている。   Conventionally, a liquid is enclosed in a pressure receiving space in which a pressure detection element is accommodated, and pressure applied from the outside to the pressure detection chamber is transmitted to the pressure detection element via the liquid, so that the pressure detection element responds to the external pressure. Various pressure sensors that output voltage signals have been proposed.

上記液封入式圧力センサの一例として、特許文献1には、バリアダイアフラムを介して伝達された圧力をセンサチップ(圧力検出素子)によって検出し、検出した圧力を電圧に変換し、円盤状の位置決めガラス(ベース)に同心円上に配置された複数の電極ピン(リードピン)を介して外部に出力する圧力センサが記載されている。   As an example of the liquid-filled pressure sensor, Patent Document 1 discloses that a pressure transmitted through a barrier diaphragm is detected by a sensor chip (pressure detection element), and the detected pressure is converted into a voltage, so that a disk-shaped positioning is performed. A pressure sensor that outputs to the outside via a plurality of electrode pins (lead pins) arranged concentrically on glass (base) is described.

また、圧力センサの圧力検出素子から出力された電圧は、製造時や部品のばらつきによりそのまま外部出力とすることはできず、圧力センサの特性に応じた補正が必須となる。電圧補正は、特許文献2に記載のように、一般には、予め補正情報をリードオンリーメモリへ記憶させ、圧力計測時に記憶した情報を読み出して電圧を補正することにより行われる。   In addition, the voltage output from the pressure detection element of the pressure sensor cannot be used as an external output as it is due to manufacturing or component variations, and correction according to the characteristics of the pressure sensor is essential. As described in Patent Document 2, the voltage correction is generally performed by storing correction information in a read-only memory in advance and reading the information stored at the time of pressure measurement to correct the voltage.

この場合、リードピンは、出力用の他、上記電圧補正用(以下、「調整用」という)のものも配設される。出力用リードピンは、配線基板に半田付けされ、圧力検出素子からの電圧信号を配線基板を介して、例えば当該圧力センサの中心から引き出される外部出力用リード線へ伝達するが、調整用リードピンは、専ら製造の際に補正情報を記憶する場合にのみ用いられ、外部出力用リード線と接続されない。また、出力用リードピンと調整用リードピンは、圧力検出素子の構造や上記調整作業のし易さを考慮し、各グループ毎に区分して配設されるのが通常である。   In this case, the lead pin is provided for the voltage correction (hereinafter referred to as “for adjustment”) in addition to the output. The output lead pin is soldered to the wiring board, and the voltage signal from the pressure detection element is transmitted through the wiring board to, for example, the external output lead wire drawn from the center of the pressure sensor. Used exclusively when storing correction information during manufacturing, and is not connected to an external output lead wire. Further, the output lead pins and the adjustment lead pins are usually arranged separately for each group in consideration of the structure of the pressure detection element and the ease of the adjustment work.

特開2001−41838号公報JP 2001-41838 A 特開昭62−175631号公報JP-A-62-175631

しかし、上記従来の圧力センサにおいては、出力用リードピンとリード線の軸心がずれているため、圧力センサの製造時等に出力用リードピンがリード線方向に引っ張られると、大きく変形するおそれがあった。また、リードピンは、貫通孔との間をハーメチックシールによって封止されるが、上記引っ張りによって、ハーメチックシールそのものが破壊されるおそれもあった。   However, in the conventional pressure sensor described above, the axis of the output lead pin and the lead wire are misaligned, and therefore, if the output lead pin is pulled in the lead wire direction during manufacture of the pressure sensor, there is a risk of significant deformation. It was. Moreover, although the lead pin is sealed between the through-holes by a hermetic seal, there is a possibility that the hermetic seal itself is broken by the pulling.

そこで、本発明は、上記課題を解決するためになされたものであって、圧力検出部の気密性を維持すると共に、出力用リードピン周りの構造上の脆弱性を改善した圧力センサを提供することを目的とする。   Accordingly, the present invention has been made to solve the above-described problems, and provides a pressure sensor that maintains the airtightness of the pressure detection unit and improves the structural vulnerability around the output lead pin. With the goal.

上記目的を達成するため、本発明は、圧力検出素子を有する圧力検出部と、該圧力検出素子に接続され、前記圧力検出部の外部に突出する出力用リードピンと、該出力用リードピンが外部出力用リード線に電気的に接続可能に固定される配線基板とを備える圧力センサにおいて、前記圧力検出素子に接続され、前記圧力検出部の外部に突出する調整用リードピンを前記配線基板に固定したことを特徴とする。   In order to achieve the above object, the present invention provides a pressure detection unit having a pressure detection element, an output lead pin connected to the pressure detection element and projecting outside the pressure detection unit, and the output lead pin is an external output In a pressure sensor comprising a wiring board fixed to be electrically connectable to a lead wire for use, an adjustment lead pin connected to the pressure detection element and protruding outside the pressure detection part is fixed to the wiring board. It is characterized by.

そして、本発明によれば、出力用リードピンだけでなく、電圧補正用等として用いられる調整用リードピンも合わせて配線基板へ固定したため、出力用リードピン、配線基板及び調整用リードピンの全体構造の強度が高まり、リード線方向の引っ張りにより生じるリードピンの変形を防止することができる。   According to the present invention, not only the output lead pin but also the adjustment lead pin used for voltage correction or the like is also fixed to the wiring board, so that the strength of the overall structure of the output lead pin, the wiring board and the adjustment lead pin is increased. It is possible to prevent deformation of the lead pin caused by pulling in the lead wire direction.

上記圧力センサにおいて、前記出力用リードピン及び前記調整用リードピンを、前記圧力検出素子が固定された部材を貫通して前記圧力検出部の外部に突出し、該出力用リードピン及び調整用リードピンの貫通部をハーメチックシールによって封止することができる。これによって、圧力検出部の気密性を維持するとともに、ハーメチックシールそのものが破壊されることを防止することができる。   In the pressure sensor, the output lead pin and the adjustment lead pin pass through a member to which the pressure detection element is fixed and project outside the pressure detection unit, and the output lead pin and the adjustment lead pin penetration part. It can be sealed with a hermetic seal. As a result, the hermeticity of the pressure detector can be maintained and the hermetic seal itself can be prevented from being broken.

さらに上記圧力センサにおいて、前記出力用リードピン及び前記調整用リードピンは、略円環状に配列され、該円環の中心に対して各々反対側に位置することができる。このような各リードピンの配列により、リードピンの変形やハーメチックシールの破壊がさらに効果的に防止される。   Furthermore, in the pressure sensor, the output lead pin and the adjustment lead pin are arranged in a substantially annular shape, and can be positioned on opposite sides of the center of the annular shape. Such an arrangement of the lead pins further effectively prevents the deformation of the lead pins and the destruction of the hermetic seal.

以上のように、本発明によれば、圧力センサの圧力検出部の気密性を維持すると共に、出力用リードピン周りの構造上の脆弱性を改善することができる。   As described above, according to the present invention, the airtightness of the pressure detection portion of the pressure sensor can be maintained, and the structural vulnerability around the output lead pin can be improved.

本発明にかかる圧力センサの一実施の形態を示す図であって、(a)は縦断面図、(b)は(a)のA−A線矢視図であって、ケースを外した状態を示す。It is a figure which shows one Embodiment of the pressure sensor concerning this invention, Comprising: (a) is a longitudinal cross-sectional view, (b) is the AA arrow directional view of (a), Comprising: The state which removed the case Indicates.

次に、本発明を実施するための形態について、図面を参照しながら詳細に説明する。   Next, an embodiment for carrying out the present invention will be described in detail with reference to the drawings.

図1は、本発明にかかる圧力センサの一実施の形態を示し、この圧力センサ1は、内部に圧力検出素子21を有すると共に、流体流入部22が接続される圧力検出部2と、圧力検出部2を囲繞すると共に、圧力検出素子21に接続される配線基板(以下、「基板」という)31や外部出力用リード線32を収容するコネクタ接続部3とを備える。   FIG. 1 shows an embodiment of a pressure sensor according to the present invention. This pressure sensor 1 has a pressure detection element 21 inside, a pressure detection unit 2 to which a fluid inflow part 22 is connected, and a pressure detection. In addition to surrounding the portion 2, a wiring substrate (hereinafter referred to as “substrate”) 31 connected to the pressure detection element 21 and a connector connecting portion 3 that accommodates an external output lead wire 32 are provided.

圧力検出部2は、圧力検出素子21と、べース23と、べース23に対向して配置された受け部材24と、べース23と受け部材24とで挟持されたダイアフラム25とを備える。ベース23とダイアフラム25との間の受圧空間26には、液体(オイル)が封入される。圧力検出素子21は、受圧空間26の内部でベース23に固定される。受け部材24とダイアフラム25との間には圧力導入空間としての加圧空間27が形成され、加圧空間27には流体流入部22の内部空間が連通する。   The pressure detection unit 2 includes a pressure detection element 21, a base 23, a receiving member 24 disposed to face the base 23, and a diaphragm 25 sandwiched between the base 23 and the receiving member 24. Is provided. Liquid (oil) is sealed in the pressure receiving space 26 between the base 23 and the diaphragm 25. The pressure detection element 21 is fixed to the base 23 inside the pressure receiving space 26. A pressurizing space 27 as a pressure introducing space is formed between the receiving member 24 and the diaphragm 25, and the internal space of the fluid inflow portion 22 communicates with the pressurizing space 27.

ベース23は、蓋状に形成され、べース23の下面には圧力検出素子21が固定される。受け部材24は、上方が開口する皿状に形成され、中心部開口に流体流入部22がろう付け固定される。ダイアフラム25は、その外周縁部がベース23の鍔部と受け部材24の鍔部との間に挟み込まれ、これら3つの部材23〜25は、ダイアフラム25の外周縁部が露出する外周縁部分においてレーザー溶接等によって同時に溶接され、圧力検出部2として一体化される。受圧空間26は、べース23を貫通して形成された充填孔(不図示)から液体(オイル)が注入された後、べース23の上面において、充填孔がボール28によって封じられる。   The base 23 is formed in a lid shape, and the pressure detection element 21 is fixed to the lower surface of the base 23. The receiving member 24 is formed in a dish shape with an upper opening, and the fluid inflow portion 22 is brazed and fixed to the central opening. The diaphragm 25 is sandwiched between the flange portion of the base 23 and the flange portion of the receiving member 24, and these three members 23 to 25 are arranged at the outer periphery portion where the outer periphery portion of the diaphragm 25 is exposed. They are welded simultaneously by laser welding or the like and integrated as the pressure detection unit 2. In the pressure receiving space 26, after a liquid (oil) is injected from a filling hole (not shown) formed through the base 23, the filling hole is sealed by a ball 28 on the upper surface of the base 23.

圧力検出素子21は、例えば、ピエゾ素子であって、このピエゾ素子は、強誘電体の一種であって圧電素子とも呼ばれ、振動や圧力等の力が加わると電圧が発生し、逆に電圧が加えられると伸縮する。   The pressure detection element 21 is, for example, a piezo element. This piezo element is a kind of ferroelectric substance and is also called a piezoelectric element. When a force such as vibration or pressure is applied, a voltage is generated. When it is added, it expands and contracts.

圧力検出素子21は、ベース23に形成された貫通孔23aを挿通する出力用リードピン33(33A〜33C)及び調整用リードピン36(36A〜36E)にワイヤ29を介して電気的に接続される。出力用リードピン33は、圧力検出素子21で検出された圧力に応じた電圧信号を外部に出力するためのものであり、調整用リードピン36は、上述のように、製造時の電圧補正用等に用いられるものである。   The pressure detection element 21 is electrically connected to an output lead pin 33 (33A to 33C) and an adjustment lead pin 36 (36A to 36E) inserted through a through hole 23a formed in the base 23 via a wire 29. The output lead pin 33 is for outputting a voltage signal corresponding to the pressure detected by the pressure detection element 21 to the outside, and the adjustment lead pin 36 is used for voltage correction at the time of manufacture as described above. It is used.

また、出力用リードピン33(33A〜33C)、及び5本の調整用リードピン36のうちの2本(36B、36C)は、各々の上端部が基板31に固定される。基板31の表面には、出力用リードピン33A〜33Cを接続し固定するための、金属箔からなる3つの配線パターン50が形成されると共に、2本の調整用リードピン36B、36Cを固定するための2つの金属箔51が形成されている。   Further, the output lead pins 33 (33 </ b> A to 33 </ b> C) and two of the five adjustment lead pins 36 (36 </ b> B and 36 </ b> C) have their upper ends fixed to the substrate 31. Three wiring patterns 50 made of metal foil for connecting and fixing the output lead pins 33A to 33C are formed on the surface of the substrate 31, and for fixing the two adjustment lead pins 36B and 36C. Two metal foils 51 are formed.

3つの配線パターン50は、各出力用リードピン33A〜33Cと、コネクタ34を介して基板31に接続される3つの外部出力用リード線32の各々とを接続するために形成されている。   The three wiring patterns 50 are formed to connect the output lead pins 33 </ b> A to 33 </ b> C and each of the three external output lead wires 32 connected to the substrate 31 via the connector 34.

2つの金属箔51は、調整用リードピン36B、36Cの各々を基板31に固定するためだけに設けられており、各金属箔51に調整用リードピン36B、36Cの各々を接続しても、各リードピン36B、36Cは、他のリードピンと接続されたり、外部出力用リード線と接続されたりすることはなく、これらと電気的には遮断されている。   The two metal foils 51 are provided only for fixing the adjustment lead pins 36B and 36C to the substrate 31. Even if each of the adjustment lead pins 36B and 36C is connected to each metal foil 51, each lead pin is provided. 36B and 36C are not connected to other lead pins or external output lead wires, and are electrically disconnected from these.

図1に示されるように、出力用リードピン33A〜33C及び調整用リードピン36A〜36Eが、圧力検出素子21を中心として略円環上に配置されており、かつ外部出力用リード線32が圧力検出素子21の中心軸方向(当該圧力センサ1の中心軸方向)に引き出すようにされている場合、出力用リードピン33A〜33Cと外部出力用リード線32とは偏心しているから、単にこれらを基板31で接続しただけでは、外部出力用リード線32に引張力等が加えられたときに、出力用リードピン33A〜33Cに横方向の応力が加わってこれが変形し、また各リードピン33A〜33Cを取り囲む後述のハーメチックシール23bが破壊されるおそれがある。   As shown in FIG. 1, the output lead pins 33A to 33C and the adjustment lead pins 36A to 36E are arranged on a substantially annular shape with the pressure detection element 21 as the center, and the external output lead wire 32 has a pressure detection. When the element 21 is pulled out in the central axis direction (the central axis direction of the pressure sensor 1), the output lead pins 33A to 33C and the external output lead wire 32 are eccentric, so that they are simply extracted from the substrate 31. If a tensile force or the like is applied to the external output lead wire 32, a lateral stress is applied to the output lead pins 33A to 33C to deform them, and the lead pins 33A to 33C will be described later. The hermetic seal 23b may be destroyed.

しかし、本実施例のように、圧力検出素子21(換言すれば、上記の円環の中心)に対して各出力用リードピン33A〜33Cと反対側に位置する調整用リードピン(本実施例の場合は符号36B及び36C)を基板31に固定することにより、外部出力用リード線32に引張力等が加えられても、出力用リードピン33A〜33Cに横方向の応力が加わることがなく、この結果、各出力用リードピン33A〜33C(及び調整用リードピン36B、36C)を取り囲むハーメチックシール23bが破壊されるおそれがない。   However, as in this embodiment, adjustment lead pins (in the case of this embodiment) located on the opposite side of the output lead pins 33A to 33C with respect to the pressure detection element 21 (in other words, the center of the above-described ring). Are fixed to the substrate 31 so that even if a tensile force or the like is applied to the external output lead wire 32, no lateral stress is applied to the output lead pins 33A to 33C. The hermetic seal 23b surrounding each of the output lead pins 33A to 33C (and the adjustment lead pins 36B and 36C) is not broken.

このように、出力用リードピン33だけでなく、本来、基板31に固定する必要がない調整用リードピン36をも基板31に固定した点が本発明の特徴であり、これによって、出力用リードピン33、基板31及び調整用リードピン36(36B、36C)の全体構造の強度が高まり、出力用リードピン33の周りの構造上の脆弱性を改善することができる。   Thus, not only the output lead pin 33 but also the adjustment lead pin 36 that originally does not need to be fixed to the substrate 31 is fixed to the substrate 31, which is a feature of the present invention. The strength of the entire structure of the substrate 31 and the adjustment lead pins 36 (36B, 36C) is increased, and the structural vulnerability around the output lead pins 33 can be improved.

ベース23の貫通孔23aは、出力用リードピン33及び調整用リードピン36を挿通させた後、ハーメチックシール23bによって液体(オイル)漏れがないように封じられる。基板31には、コネクタ34が取り付けられ、圧力検出素子21からの電圧信号は、出力用リードピン33、基板31及びコネクタ34を介して外部出力用リード線32から外部へと取り出される。   The through hole 23a of the base 23 is sealed so as not to leak liquid (oil) by the hermetic seal 23b after the output lead pin 33 and the adjustment lead pin 36 are inserted. A connector 34 is attached to the substrate 31, and a voltage signal from the pressure detection element 21 is taken out from the external output lead wire 32 through the output lead pin 33, the substrate 31 and the connector 34.

コネクタ接続部3は、ベース23に外側から嵌合して受け部材24の側方を覆うように圧力検出部2を収容するカバー35を備える。カバー35は、基板31及びコネクタ34を覆うコネクタケースとしても機能する。このカバー35は、PPE等の合成樹脂製で形成され、コネクタ34を覆う上端部は、外部出力用リード線32を囲繞するように縮径され、圧力検出部2を収容する下端部側は、筒状スカート状に延びる大径状に形成される。   The connector connecting portion 3 includes a cover 35 that accommodates the pressure detecting portion 2 so as to be fitted to the base 23 from the outside and cover the side of the receiving member 24. The cover 35 also functions as a connector case that covers the substrate 31 and the connector 34. The cover 35 is made of a synthetic resin such as PPE, and the upper end portion that covers the connector 34 is reduced in diameter so as to surround the external output lead wire 32, and the lower end portion side that accommodates the pressure detection unit 2 is It is formed in a large diameter shape extending in a cylindrical skirt shape.

カバー35は、大径端部側において、その内周側にべース23の外径と略同径の環状段部35aが形成され、ベース23は、その外径角部である環状角部23cにおいて環状段部35aに嵌合座着するように載置される。   The cover 35 is formed with an annular step portion 35a having substantially the same diameter as the outer diameter of the base 23 on the inner peripheral side thereof on the large diameter end portion side, and the base 23 is an annular corner portion that is an outer diameter corner portion thereof. In 23c, it is mounted so as to be fitted and seated on the annular step portion 35a.

カバー35の内部空間は、カバー35に装入されたべース23で区切られ、空間41が形成される。出力用リードピン33と、調整用リードピン36と、基板31と、コネクタ34と、外部出力用リード線32とは、空間41に収容される。空間41には、カバー35や外部出力用リード線32との接着性及び弾性の大きいウレタン樹脂等の接着剤が充填され、その後、硬化される。この接着剤は、出力用リードピン33、調整用リードピン36、基板31、コネクタ34及び外部出力用リード線32が埋設状態になるように空間41に充填されるので、基板31やコネクタ34等の部品に対して封止機能を奏する。   The internal space of the cover 35 is partitioned by the base 23 inserted in the cover 35 to form a space 41. The output lead pin 33, the adjustment lead pin 36, the substrate 31, the connector 34, and the external output lead wire 32 are accommodated in the space 41. The space 41 is filled with an adhesive such as urethane resin having high adhesiveness and elasticity with the cover 35 and the external output lead wire 32, and then cured. Since this adhesive is filled in the space 41 so that the output lead pin 33, the adjustment lead pin 36, the substrate 31, the connector 34, and the external output lead wire 32 are embedded, components such as the substrate 31 and the connector 34 are provided. Provides a sealing function.

また、この接着剤の硬化にはある程度の時間を要するが、接着剤の硬化に至るまでの間に外部出力用リード線に引張力等が加えられても、前述のように、リードピンの変形やハーメチックシール23bの破壊が防止される。もちろん、接着剤の硬化後も上記変形や破壊の防止効果は達成される。   In addition, it takes a certain amount of time to cure this adhesive, but even if a tensile force is applied to the external output lead wire until the adhesive is cured, The hermetic seal 23b is prevented from being broken. Of course, even after the adhesive is cured, the effect of preventing deformation and destruction is achieved.

上記構成を有する圧力センサ1は、流体流入部22から流入した流体の圧力変化によって加圧空間27の圧力が変化し、ダイアフラム25を変形させる。ダイアフラム25の変形により受圧空間26の内部に封入されている液体(オイル)の圧力が変化し、その圧力変化が圧力検出素子21へ伝播する。圧力検出素子21により検出された圧力は、電圧に変換され、その際、圧力センサ1の特性に応じた所定の電圧補正がなされる。補正後の電圧信号は、出力用リードピン33、基板31及びコネクタ34を介して外部出力用リード線32へ伝送される。   The pressure sensor 1 having the above configuration changes the pressure of the pressurized space 27 due to a change in the pressure of the fluid flowing in from the fluid inflow portion 22 and deforms the diaphragm 25. Due to the deformation of the diaphragm 25, the pressure of the liquid (oil) sealed in the pressure receiving space 26 changes, and the pressure change propagates to the pressure detection element 21. The pressure detected by the pressure detection element 21 is converted into a voltage, and at that time, a predetermined voltage correction according to the characteristics of the pressure sensor 1 is performed. The corrected voltage signal is transmitted to the external output lead wire 32 via the output lead pin 33, the substrate 31 and the connector 34.

尚、上記実施の形態においては、5本の調整用リードピン36のうちの2本(36B、36C)を基板31に固定したが、調整用リードピン36B、36Cのいずれか一方のみを基板31に固定してもよく、5本の調整用リードピン36の3本以上を基板31に固定してもよい。   In the above embodiment, two of the five adjustment lead pins 36 (36B, 36C) are fixed to the substrate 31, but only one of the adjustment lead pins 36B, 36C is fixed to the substrate 31. Alternatively, three or more of the five adjustment lead pins 36 may be fixed to the substrate 31.

1 圧力センサ
2 圧力検出部
3 コネクタ接続部
21 圧力検出素子
22 流体流入部
23 べース
23a 貫通孔
23b ハーメチックシール
23c 環状角部
24 受け部材
25 ダイアフラム
26 受圧空間
27 加圧空間
28 ボール
29 ワイヤ
31 配線基板
32 外部出力用リード線
33(33A〜33C) 出力用リードピン
34 コネクタ
35 カバー
35a 環状段部
36(36A〜36E) 調整用リードピン
41 空間
50 配線パターン
51 金属箔
DESCRIPTION OF SYMBOLS 1 Pressure sensor 2 Pressure detection part 3 Connector connection part 21 Pressure detection element 22 Fluid inflow part 23 Base 23a Through-hole 23b Hermetic seal 23c Annular corner | angular part 24 Receiving member 25 Diaphragm 26 Pressure receiving space 27 Pressurizing space 28 Ball 29 Wire 31 Wiring board 32 External output lead wire 33 (33A to 33C) Output lead pin 34 Connector 35 Cover 35a Annular step 36 (36A to 36E) Adjustment lead pin 41 Space 50 Wiring pattern 51 Metal foil

Claims (3)

圧力検出素子を有する圧力検出部と、
該圧力検出素子に接続され、前記圧力検出部の外部に突出する出力用リードピンと、
該出力用リードピンが外部出力用リード線に電気的に接続可能に固定される配線基板とを備える圧力センサにおいて、
前記圧力検出素子に接続され、前記圧力検出部の外部に突出する調整用リードピンが前記配線基板に固定されることを特徴とする圧力センサ。
A pressure detection unit having a pressure detection element;
An output lead pin connected to the pressure detection element and projecting outside the pressure detection unit;
In the pressure sensor, the output lead pin includes a wiring substrate fixed to be electrically connectable to the external output lead wire,
An adjustment lead pin connected to the pressure detection element and protruding to the outside of the pressure detection unit is fixed to the wiring board.
前記出力用リードピン及び前記調整用リードピンは、前記圧力検出素子が固定された部材を貫通して前記圧力検出部の外部に突出し、該出力用リードピン及び調整用リードピンの貫通部は、ハーメチックシールによって封止されることを特徴とする請求項1に記載の圧力センサ。   The output lead pin and the adjustment lead pin pass through a member to which the pressure detection element is fixed and project outside the pressure detection unit, and the output lead pin and the adjustment lead pin penetration portion are sealed with a hermetic seal. The pressure sensor according to claim 1, wherein the pressure sensor is stopped. 前記出力用リードピン及び前記調整用リードピンは、略円環状に配列され、該円環の中心に対して各々反対側に位置していることを特徴とする請求項1又は2に記載の圧力センサ。   3. The pressure sensor according to claim 1, wherein the output lead pin and the adjustment lead pin are arranged in a substantially annular shape, and are positioned on opposite sides with respect to the center of the annular shape.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015206602A (en) * 2014-04-17 2015-11-19 株式会社不二工機 Pressure sensor

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5866246B2 (en) * 2012-04-20 2016-02-17 株式会社不二工機 Pressure sensor
JP2014102115A (en) * 2012-11-19 2014-06-05 Saginomiya Seisakusho Inc Pressure detection unit and method for manufacturing the same
JP6464012B2 (en) * 2015-03-31 2019-02-06 株式会社不二工機 Pressure sensor
JP2017146137A (en) * 2016-02-16 2017-08-24 株式会社不二工機 Pressure detection unit, pressure sensor using the same, and method for manufacturing pressure detection unit
CN110793706A (en) * 2019-09-21 2020-02-14 蚌埠市力业传感器有限公司 Pressure sensor manufacturing method
CN110763393A (en) * 2019-09-21 2020-02-07 蚌埠市力业传感器有限公司 Pressure sensor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09280989A (en) * 1996-04-17 1997-10-31 Nagano Keiki Seisakusho Ltd Gas pressure sensor for electrostatic capacity type
JPH11295174A (en) * 1998-04-09 1999-10-29 Fujikoki Corp Pressure sensor
JPH11316166A (en) * 1998-05-06 1999-11-16 Hitachi Ltd Semiconductor pressure sensor
JP2003315196A (en) * 2002-04-25 2003-11-06 Denso Corp Manufacturing method of pressure sensor, and measuring device for use in the manufacturing method
JP2005308503A (en) * 2004-04-20 2005-11-04 Toyoda Mach Works Ltd Semiconductor sensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4648885B2 (en) * 2006-09-19 2011-03-09 住友重機械工業株式会社 Injection molding machine and control method of injection molding machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09280989A (en) * 1996-04-17 1997-10-31 Nagano Keiki Seisakusho Ltd Gas pressure sensor for electrostatic capacity type
JPH11295174A (en) * 1998-04-09 1999-10-29 Fujikoki Corp Pressure sensor
JPH11316166A (en) * 1998-05-06 1999-11-16 Hitachi Ltd Semiconductor pressure sensor
JP2003315196A (en) * 2002-04-25 2003-11-06 Denso Corp Manufacturing method of pressure sensor, and measuring device for use in the manufacturing method
JP2005308503A (en) * 2004-04-20 2005-11-04 Toyoda Mach Works Ltd Semiconductor sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015206602A (en) * 2014-04-17 2015-11-19 株式会社不二工機 Pressure sensor

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