JP4648885B2 - Injection molding machine and control method of injection molding machine - Google Patents

Injection molding machine and control method of injection molding machine Download PDF

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Publication number
JP4648885B2
JP4648885B2 JP2006252523A JP2006252523A JP4648885B2 JP 4648885 B2 JP4648885 B2 JP 4648885B2 JP 2006252523 A JP2006252523 A JP 2006252523A JP 2006252523 A JP2006252523 A JP 2006252523A JP 4648885 B2 JP4648885 B2 JP 4648885B2
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voltage
mold
molding machine
injection molding
pressure detector
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JP2008073874A (en
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大輔 丸尾
直弘 吉田
真博 早川
元基 田中
興人 西尾
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住友重機械工業株式会社
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061Force sensors associated with industrial machines or actuators
    • G01L5/0076Force sensors associated with manufacturing machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20Accessories: Details
    • B22D17/32Controlling equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/7626Measuring, controlling or regulating the ejection or removal of moulded articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/77Measuring, controlling or regulating of velocity or pressure of moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/47Means for plasticising or homogenising the moulding material or forcing it into the mould using screws
    • B29C45/50Axially movable screw
    • B29C45/5008Drive means therefor
    • B29C2045/5032Drive means therefor using means for detecting injection or back pressures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76003Measured parameter
    • B29C2945/76006Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76003Measured parameter
    • B29C2945/76013Force
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76177Location of measurement
    • B29C2945/7618Injection unit
    • B29C2945/76214Injection unit drive means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76177Location of measurement
    • B29C2945/76224Closure or clamping unit
    • B29C2945/76227Closure or clamping unit mould platen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76177Location of measurement
    • B29C2945/76224Closure or clamping unit
    • B29C2945/76234Closure or clamping unit tie-bars
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76177Location of measurement
    • B29C2945/7624Ejection unit
    • B29C2945/76244Ejection unit ejectors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76344Phase or stage of measurement
    • B29C2945/76367Metering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76344Phase or stage of measurement
    • B29C2945/76381Injection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76344Phase or stage of measurement
    • B29C2945/76384Holding, dwelling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76451Measurement means
    • B29C2945/76454Electrical, e.g. thermocouples
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76451Measurement means
    • B29C2945/76481Strain gauges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76498Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76568Position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76655Location of control
    • B29C2945/76658Injection unit
    • B29C2945/76692Injection unit drive means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76655Location of control
    • B29C2945/76702Closure or clamping device
    • B29C2945/76709Closure or clamping device clamping or closing drive means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76655Location of control
    • B29C2945/76719Ejection unit
    • B29C2945/76722Ejection unit ejectors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76822Phase or stage of control
    • B29C2945/76846Metering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76822Phase or stage of control
    • B29C2945/76859Injection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76822Phase or stage of control
    • B29C2945/76862Holding, dwelling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
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    • B29C2945/76822Phase or stage of control
    • B29C2945/76869Mould clamping, compression of the cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76822Phase or stage of control
    • B29C2945/76896Ejection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/47Means for plasticising or homogenising the moulding material or forcing it into the mould using screws
    • B29C45/50Axially movable screw
    • B29C45/5008Drive means therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/7653Measuring, controlling or regulating mould clamping forces

Description

  The present invention relates to an injection molding machine and an injection molding machine control method, and more specifically, to an injection molding machine equipped with a pressure detector such as a load cell and a pressure detector such as a load cell provided in the injection molding machine. The present invention relates to a voltage input method.

  In an injection molding machine including an injection device, a mold device, and a mold clamping device, the resin is heated and melted in a heating cylinder of the injection device. The molten resin is injected at a high pressure and filled in the cavity of the mold apparatus. The resin is cooled and solidified in the cavity of the mold apparatus to form a molded product.

  The mold apparatus includes a fixed mold and a movable mold. By closing and moving the movable mold along the tie bar with respect to the fixed mold by the mold clamping device, mold closing, mold clamping and mold opening are performed.

  When mold clamping of the mold apparatus is completed and the injection apparatus is advanced, the nozzle of the heating cylinder is pressed against the sprue bush provided on the back surface of the fixed mold through the nozzle passage hole formed in the fixed platen. .

  Subsequently, the resin melted by the injection device is pressurized by the screw in the heating cylinder and injected from the nozzle. The injected molten resin passes through the sprue bush and the sprue and is filled into a cavity formed between the fixed mold and the movable mold.

  The screw drive mechanism of the injection device is provided with a pressure detector for detecting the pressure of the molten resin applied to the screw (reaction force of the molten resin).

  Further, the tie bar of the mold clamping device is provided with a mold clamping force sensor as a pressure detector for measuring the mold clamping force of the movable mold and the fixed mold.

  The movable platen of the mold clamping device is provided with an ejector device for releasing the molded product from the mold after the mold is opened, and a pressure detector for measuring the ejecting force generated by the ejector driving unit. ing.

  As the above-described pressure detector or mold clamping force sensor, a load cell for converting the voltage of the strain gauge bridge circuit into pressure is generally used. Specifically, the applied load (pressure) is measured from the potential difference (change in output voltage) of the bridge circuit caused by a change in resistance of the strain gauge constituting the bridge circuit attached to the load cell body. .

In addition, the back pressure control in the measuring process is performed based on the information from the first sensor, and a spring member that resists the retreating force of the screw is disposed, and the spring member is plastically deformed when the maximum retraction force of the screw is generated in the measuring process. A back pressure detection device for an injection molding machine has been proposed in which a stopper for preventing is applied and control in an injection / pressure holding process is performed based on information from a second sensor (see, for example, Patent Document 1).
Japanese Patent No. 3313366

However, since the voltage applied to the strain gauge of the load cell is not so high, it is susceptible to disturbances such as noise from peripheral devices such as motors. Thus, the variation or fluctuation occurs in the output of the load cell, the resolution with respect to the load, i.e., SN ratio (Signal to Noise ratio: Signal - Noise Ratio) is low, an accurate output is obtained et Lena Ikoto.

  For example, in the pressure-holding / metering process, etc., although high accuracy is required for detection of the pressure of the molten resin applied to the screw, if it is affected by such disturbances as noise, It may be difficult to grasp the output of a simple load cell.

  On the other hand, in an injection molding machine, a constant voltage is always applied to a strain gauge, though it is not always necessary to measure the acting load (pressure) constantly with high accuracy. Therefore, if the voltage applied to the strain gauge is increased in order to reduce the influence of disturbance such as noise, and such voltage is constantly applied, the strain gauge generates heat and becomes high temperature, which may cause a detection error.

  Therefore, the present invention has been made in view of the above points, and an injection molding machine provided with a pressure detector capable of detecting a working load (pressure) with high accuracy as required, and It is an object of the present invention to provide a method for controlling the injection molding machine.

  According to an aspect of the present invention, there is provided an injection molding machine including a pressure detector, wherein the pressure detector is a strain detector that detects strain when a voltage is input, and is input to the pressure detector. An injection molding machine is provided in which the voltage value is varied during one molding cycle.

  The pressure detector may include a variable amplifier, and a ratio between the voltage input to the pressure detector and a voltage output from the pressure detector may be calculated by the variable amplifier.

  The pressure detector detects a mold clamping force of the mold clamping device, and the voltage input to the pressure detector is at least when the mold clamping device is in a mold open limit state or before performing a mold clamping operation. Furthermore, it may have the highest value, or may have the lowest value at least during the mold opening operation or the mold closing operation.

  The pressure detector detects an injection pressure of the injection device, and the voltage input to the pressure detector may have the highest value in the measurement process, from the completion of the measurement process to the start of the injection process. It is good also as having the lowest value in between.

  The pressure detector detects an ejecting force of an ejecting device, and the voltage input to the pressure detector may have the highest value during the ejecting operation, and after the ejecting operation is finished, the next molding cycle is performed. It may have the lowest value until the ejection operation starts at.

  According to another aspect of the present invention, there is provided a method for controlling an injection molding machine, wherein the pressure detector provided in the injection molding machine is a strain detector that detects strain when voltage is input, and the pressure There is provided a method for controlling an injection molding machine, wherein the value of the voltage input to the detector is changed during one molding cycle.

  The pressure detector detects a mold clamping force of the mold clamping device, and the voltage input to the pressure detector is at least when the mold clamping device is in a mold open limit state or before performing a mold clamping operation. The voltage value may be changed so as to have the highest value and to have the lowest value at least during the mold opening operation or the mold closing operation.

  The pressure detector detects an injection pressure of an injection device so that the voltage input to the pressure detector has the highest value in the weighing process, and between the completion of the weighing process and the start of the injection process. The voltage value may be changed so as to have the lowest value.

  The pressure detector detects an ejecting force of an ejecting device so that the voltage input to the pressure detector has a highest value during an ejecting operation, and the voltage input to the pressure detector is ejected. The voltage value may be changed so as to have the lowest value from the end of the operation to the start of the ejection operation in the next molding cycle.

  ADVANTAGE OF THE INVENTION According to this invention, the injection molding machine provided with the pressure detector which can detect the acting load (pressure) with high precision as needed, and the control method of the said injection molding machine can be provided. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, an outline of an injection molding machine to which the present invention is applied will be described with reference to FIG.

  Here, FIG. 1 is a diagram showing a schematic configuration of a screw type electric injection molding machine as an example of an injection molding machine to which the present invention is applied.

  The electric injection molding machine 1 shown in FIG. 1 includes a frame 10, an injection device 20 and a mold clamping device 50 arranged on the frame 10.

  The injection device 20 includes a heating cylinder 21, and the heating cylinder 21 is provided with a hopper 22. A heater 21 a for heating the heating cylinder 21 is provided on the outer periphery of the heating cylinder 21. A screw 23 is provided in the heating cylinder 21 so as to be movable forward and backward and rotatable. The rear end of the screw 23 is rotatably supported by the movable support portion 24.

  A measuring motor 25 such as a servo motor is attached to the movable support portion 24 as a drive portion. The rotation of the metering motor 25 is transmitted to the screw 23 of the driven part via a timing belt 26 attached to the output shaft 31.

  A rotation detector 32 is connected to the rear end of the output shaft 31. The rotation detector 32 detects the rotation speed or the rotation amount of the metering motor 25 to detect the rotation speed of the screw 23.

  The injection device 20 has a ball screw shaft 27 parallel to the screw 23. The ball screw shaft 27 is screwed with the ball screw nut 90 to constitute a motion direction conversion mechanism that converts rotational motion into linear motion.

  When the injection motor 29 that is a drive unit is driven and the ball screw shaft 27 is rotated via the timing belt 28, the movable support 24 and the support 30 fixed to the ball screw nut 90 move forward and backward. As a result, the screw 23 which is a driven part can be moved back and forth.

  The position detector 34 connected to the rear end of the output shaft 33 of the injection motor 29 detects the position of the screw 23 indicating the drive state of the screw 23 by detecting the rotation speed or rotation amount of the injection motor 29.

  Also, a resin pressure detection load cell 35 as a pressure detection device for detecting the pressure (reaction force) of the molten resin applied to the screw 23 is provided between the movable support portion 24 and the support 30. .

  The injection device 20 includes a plasticizing movement device 40 as a drive mechanism that drives the injection device 20 and applies a nozzle touch pressure. The plasticizing movement device 40 includes a plasticizing movement driving unit 91 and an injection device guide unit 92. The injection device guide portion 92 is engaged with the movable support portion 24, the support 30, and the front flange 93 that constitute the injection device 20.

  Therefore, the injection apparatus 20 including the heating cylinder 21 can be moved horizontally on the frame 10 of the injection molding machine along the injection apparatus guide section 92 while the plasticizing movement driving section 91 is driven. By driving the plasticizing moving device 40 described above, the injection device 20 is moved forward at a predetermined timing to bring the nozzle of the heating cylinder 21 into contact with the fixed mold 53 and perform nozzle touch.

  The heating cylinder 21 is supported by the front flange 93. At the rear end of the front flange 93, a contact portion 5 that functions as a restricting means for restricting the forward or backward movement of the screw 23 is provided.

  When the screw 23 is in the most advanced state, the contact portion 5 performs forward movement on the apparatus side so that the tip portion of the screw 23 does not contact and damage a nozzle portion (not shown) provided in front of the heating cylinder 21. It is also a stopper for regulating. Therefore, in the stroke advance limit of the screw 23, the contact portion 5 comes into contact with the movable support portion 24.

  At this time, the reaction force of the total axial force applied by the injection motor 29 is detected by the resin pressure detection load cell 35. In this case, the characteristics of the mechanism unit alone of the injection device can be grasped by the contact portion 5 and the movable support portion 24 contacting each other. The contact portion 5 is not necessarily provided at the rear end of the front flange 93, and the rear end of the heating cylinder 21 may be used as the contact portion 5.

  As another form of the restricting means, the forward end of the screw 23 is restricted by closing the tip of the heating cylinder 21, and the reaction force is detected with the load plate 11 functioning as the restricting means. Good. The advancement of the screw 21 is restricted while the resin is filled in the heating cylinder 21.

  Accordingly, the resin pressure applied to the resin in the heating cylinder 21 by the injection motor 29, that is, the reaction force of the total axial force is detected by the resin pressure detection load cell 35 which is the above-described pressure detector.

  In this case, not only the characteristics of the mechanism part carrier of the injection apparatus 20 but also the characteristics of the entire injection apparatus 20 including the influence of the plasticizing part such as the screw 23 and the heating cylinder 21 such as the breakage of the screw 23 can be grasped. . Furthermore, by using the characteristics of the mechanism carrier detected by the contact portion 5 and the characteristics of the entire injection device 20 detected by the load plate 11, the characteristics of the plasticized carrier can be calculated.

  The weighing motor 25, the rotation detector 32, the injection motor 29, the position detector 34, and the resin pressure detection load cell 35 are connected to the control device 45. Detection signals output from the rotation detector 32, the position detector 34, and the load cell 35 are sent to the control device 45. The control device 45 controls the operations of the metering motor 25 and the injection motor 29 based on the detection signal.

  In addition, the control apparatus 45 may be provided independently and may be provided as a part of control part which manages control of the whole injection molding machine.

  The mold clamping device 50 includes a fixed platen 54 as a fixed mold support device fixed to the frame 10, and a base plate disposed so as to be movable with respect to the frame 10 with a predetermined distance between the fixed platen 54. And a toggle support 56 as shown in FIG. The toggle support 56 functions as a toggle type mold clamping device support device.

  A plurality of (for example, four) tie bars 55 as guide means extend between the fixed platen 54 and the toggle support 56.

  The movable platen 52 is disposed so as to face the fixed platen 54 and functions as a movable mold support device disposed so as to be capable of moving back and forth (moving in the horizontal direction in the drawing) along the tie bar 55. Thus, the movable platen 52 moves along the tie bar 55, and mold closing, mold clamping and mold opening are performed.

  The mold apparatus 70 includes a fixed mold 53 and a movable mold 51.

  The fixed mold 53 is attached to a mold mounting surface of the fixed platen 54 that faces the movable platen 52. On the other hand, the movable mold 51 is attached to a mold mounting surface of the movable platen 52 that faces the fixed platen 54.

  An ejector device is provided at the rear end (left end in the figure) of the movable platen 52. The ejector motor 80 of the ejector device is provided on the rear upper side of the movable platen 52. When the belt 81 is wound around the output shaft of the motor 80 and the ejector motor 80 is driven, the rotational drive of the motor 80 is transmitted to the belt 81. Is done.

  Then, the ball screw shaft 82 rotates through the belt 81, the nut 83 advances and retreats, and the ejector plate 84 to which the nut 83 is fixed advances and retreats along the guide pin 85. When the ejector plate 84 moves forward, the ejector rod 86 pushes a protruding plate (not shown) in the movable mold 51 to release the molded product.

  At the rear end portion of the ejector rod 86, an eject force detecting load cell 87 as a pressure detecting device for detecting the ejecting force by the ejector rod 86 is provided.

  A toggle mechanism 57 as a toggle type mold clamping device is attached between the movable platen 52 and the toggle support 56. A mold clamping motor 46 as a mold clamping drive source for operating the toggle mechanism 57 is disposed at the rear end of the toggle support 56.

  The mold clamping motor 46 includes a motion direction conversion device (not shown) including a ball screw mechanism that converts a rotational motion into a reciprocating motion, and moves the ball screw shaft 59 forward and backward (moves in the left-right direction in the figure), thereby moving a toggle mechanism 57. Can be activated.

  The mold clamping motor 46 is preferably a servo motor, and includes a mold opening / closing position sensor 47 as an encoder for detecting the rotation speed.

  The toggle mechanism 57 can be actuated by driving the mold clamping motor 46, which is a drive unit, to move the cross head 60 back and forth. In this case, when the cross head 60 is moved forward (moved in the right direction in the figure), the movable platen 52 that is the driven portion is moved forward to perform mold closing. Then, a mold clamping force obtained by multiplying the propulsive force of the mold clamping motor 46 by the toggle magnification is generated, and the mold clamping is performed by the mold clamping force.

  A mold thickness motor 41 as a mold clamping position adjusting drive source is disposed at an upper portion of the rear end of the toggle support 56.

  The mold thickness motor 41 is preferably a servo motor, and includes a mold clamping position sensor 42 as an encoder that detects the number of rotations.

  In the present embodiment, a mold clamping force sensor 48 is provided as a pressure detector in one of the tie bars 55. The mold clamping force sensor 48 is a sensor that detects distortion (mainly elongation) of the tie bar 55. The tie bar 55 is applied with a tensile force corresponding to the mold clamping force at the time of mold clamping, and extends slightly in proportion to the mold clamping force.

  Therefore, by detecting the extension amount of the tie bar 55 by the mold clamping force sensor 48, the mold clamping force actually applied to the mold apparatus 70 can be grasped. When the fixed mold 53 and the movable mold 51 are brought into contact with each other, a reaction force of all axial forces given by the mold clamping motor 46 which is a driving unit is detected by a mold clamping sensor 48 which is a pressure detector. That is, since the forward movement of the movable platen 52 is regulated by the fixed mold 53, the fixed mold 53 functions as a regulating means.

  The ejection force detection load cell 87, the mold clamping force sensor 48, the mold opening / closing position sensor 42, the mold clamping motor 46, and the mold thickness motor 41 described above are connected to the control device 45, and the eject force detection load cell 87, the mold clamping force sensor. The detection signals output from 48 and the mold opening / closing position sensor 42 are sent to the control device 45. The control device 45 controls the operations of the ejector motor 80, the mold clamping motor 46, and the mold thickness motor 41 based on the detection signal.

  Next, the operation | movement at the time of shaping | molding of the injection molding machine provided with this structure is demonstrated.

  When the mold clamping motor 46 is driven in the forward direction, the ball screw shaft 59 rotates in the forward direction and moves forward (moves in the right direction in FIG. 1). Along with this, when the cross head 60 moves forward and the toggle mechanism 57 is actuated, the movable platen 52 moves forward.

  When the movable mold 51 attached to the movable platen 52 comes into contact with the fixed mold 53, the mold clamping process is started. In the mold clamping process, a mold clamping force is generated in the mold apparatus 70 by the toggle mechanism 57 by further driving the mold clamping motor 46 in the forward direction.

  When the screw 23 is rotated in the heating cylinder 21, the resin pellets which are molding materials supplied from the hopper 22 are melted by the heater 21 a provided in the heating cylinder 21. The molten resin is stored at the tip of the screw 23, injected from the nozzle at the tip of the heating cylinder 21, and filled into the cavity space formed in the mold apparatus 70.

  When performing mold opening, the mold clamping motor 46 is driven in the reverse direction, and the ball screw shaft 59 rotates in the reverse direction. Along with this, when the cross head 60 moves backward and the toggle mechanism 57 is operated, the movable platen 52 moves backward.

  When the mold opening process is completed, the ejector motor 80 is driven, the ejector device attached to the movable platen 52 is operated, and the molded product in the movable mold 51 is ejected from the movable mold 51.

  Next, circuit configurations of the pressure detector according to the embodiment of the present invention, that is, the resin pressure detection load cell 35, the ejection force detection load cell 87, and the mold clamping force sensor 48 will be described with reference to FIG. . Here, FIG. 2 is a schematic diagram showing a circuit configuration of the pressure detector according to the embodiment of the present invention.

  Referring to FIG. 2, the pressure detector according to the embodiment of the present invention is a strain detector that detects strain by inputting a voltage, and a strain gauge is used as the pressure detector. The strain gauge is a detection circuit that detects a change in resistance value using a bridge circuit.

  The strain gauge is configured by combining a plurality of resistance wires to form a bridge circuit, and a difference between an output voltage from a predetermined position of the bridge circuit and an input voltage is amplified by an amplifier as a voltage signal, and the control device 45 (see FIG. 1). ).

  Usually, the circuit is configured such that the reference voltage of the input voltage is the ground potential (0 volt). The bridge circuit outputs 0 volt when there is no change in each resistance line (that is, there is no change in the resistance value). When there is a change in one or two of the resistance wires (that is, when the resistance value changes due to expansion or contraction of the resistance wire), the resistance value in the bridge circuit is unbalanced and proportional to the change in resistance value Is output.

  A voltage input to the bridge circuit is variable based on a command from the control device 45 (see FIG. 1), and a necessary voltage is input to the bridge circuit at a predetermined timing.

  The amplifier of this example is a variable amplifier, and the ratio (output voltage / input voltage) between the output voltage from the bridge circuit and the input voltage to the bridge circuit is calculated. Therefore, even when the voltage is low, it can be measured, and even if the input voltage changes, the resistance change of the bridge circuit can be detected based on the calculation result.

  Here, as shown in FIG. 2, the variable amplifier may be a variable amplifier having a single amplifying function for variably amplifying an input voltage and outputting it, and a bridge circuit and a control device. A variable amplifier that connects a plurality of amplification functions via a switch and switches the switch according to the input voltage may be used.

  For example, when a load of 10,000 N is applied and the input voltage is 1 V, and there is an output of 1 mV from the bridge circuit, the output voltage to the controller 45 is multiplied by 1000 by the variable amplifier. Amplified to 1V. With such a load detection circuit, if the input voltage at high voltage is 10 V, the output from the bridge circuit is 10 mV under the same weighting of 10,000 N acting. For this reason, the variable amplifier is amplified 100 times in consideration of the increase in input voltage. As a result, the output voltage to the control device 45 becomes 1V, and the detection value of the load detector can be evaluated in the same manner as in the normal state.

Furthermore, when noise of 1 mV, for example, acts on the load detection circuit, the output of the bridge circuit is detected as 2 mV obtained by adding 1 mV to the noise (1 mV) under the condition of a normal input voltage (1 V). . As a result, the output value to the control device 45 becomes 2V. This was paired, under conditions of input voltage of 10V at a high voltage, the output of the bridge circuit is detected as 11mV as noise component (1 mV) is applied to 10 mV, the output value to the control device 45 1.1V It becomes. Therefore, detection accuracy can be improved. Therefore, the SN ratio (detection value to noise ratio) of about 50% can be reduced to about 10%.

  Next, in order to detect the load (pressure) acting as necessary with high accuracy, that is, to increase the accuracy of the pressure detector output even with a small load relative to the capacity of the pressure detector. How to set the input voltage to the pressure detector having such a bridge circuit and a variable amplifier will be described with reference to FIGS.

  Here, FIG. 3 shows the molding process (time) indicated by using the set value of the mold clamping force necessary for advancing and retracting the movable platen 52 for detecting the mold clamping force in the mold clamping device 50 and the input to the bridge circuit. FIG. 4 is a graph showing the relationship between the voltage and the acting load (pressure), and FIG. 4 shows the molding process (time) and the bridge circuit in the resin pressure detection load cell 35 for detecting the resin pressure in the injection device 20. FIG. 5 is a graph showing the relationship between the input voltage and the acting load (pressure). FIG. 5 is a diagram illustrating the molding process (time) in the ejecting force detection load cell 87 for detecting the ejecting force in the ejector device and the bridge circuit. It is a graph which shows the relationship between an input voltage and the load (pressure) which is acting.

  In the present embodiment, as described above, the input voltage to the bridge circuit of the mold clamping force sensor 48, the resin pressure detection load cell 35, and the ejection force detection load cell 87 is made variable.

  When the acting load (pressure) is detected with high accuracy, the input voltage is set to a high voltage. If the voltage is high, the influence of disturbances such as noise from peripheral devices such as motors can be kept low, and an accurate output can be obtained by increasing the SN ratio.

  On the other hand, when high accuracy is not required for the detection, the input voltage is set to a low voltage. Therefore, it is possible to avoid a state in which a high voltage is constantly applied, and it is possible to prevent a detection error from being generated due to heat generated by the strain gauge.

  Thus, in the present embodiment, the value of the input voltage is changed according to the required level of detection accuracy.

  First, FIG. 1 and FIG. 3 will be referred to.

  3A shows the relationship between the molding process (time t) and the set input voltage (V) to the bridge circuit of the mold clamping force sensor 48 that detects the mold clamping force of the mold clamping device 50. FIG. (B) shows the relationship between the molding process (time t) and the set clamping force (F).

  In the mold clamping device 50, the movable platen 52 is moved backward from the state where the parting surface of the movable mold 51 is in contact with the parting surface of the fixed mold 53, and the movable mold 51 is separated from the fixed mold 53. When performing the mold opening operation, the mold clamping force is not set when the movable platen 52 is in the rearmost position (leftmost in FIG. 1) in the movable range, that is, in the mold open limit state. .

When the mold is open, that is, when there is no load, the mold clamping force sensor 48 is adjusted to the origin, so that the high voltage V H is applied to the bridge circuit of the mold clamping sensor 48. Entered.

  When the resistance wire constituting the bridge circuit is used for a long period of time, the resistance value gradually changes due to a change with time. When there is a change in resistance value due to such a change over time, the output voltage from the bridge circuit whose output voltage was initially set to 0 volt is not 0 volt, and is a voltage proportional to the change in resistance value over time. (For example, 10 millivolts) is output. This change in output voltage is referred to as drift.

  That is, initially, the output voltage was set to 0 volts in a state where no distortion occurred in the tie bar 55 (no load), but the output voltage drifted even when there was no load after a certain time, for example, 10 volts. It becomes millivolt. Therefore, a voltage obtained by always adding 10 millivolts to the voltage generated from the distortion (elongation) of the actual tie bar 55 is output.

  The distortion (elongation) of the tie bar 55 is a value obtained by converting this output voltage. If there is a drift in the output voltage, the distortion (elongation) differs from the actual distortion (elongation) by the amount of voltage drift, and the distortion is detected. An error will occur.

  Therefore, by subtracting (or adding) the drift amount of the output voltage at the time of no load described above from the actual output voltage value, the drift voltage value is canceled and corrected (origin adjustment).

  Such correction (origin adjustment) includes soft reset and hard reset. Soft reset is an analog / digital conversion circuit that digitally converts the output voltage output from the bridge circuit via the amplifier (AMP), resulting in voltage drift with respect to the digital value of the output voltage obtained by digital conversion. This is a correction method that cancels out by adding or subtracting corresponding digital values. The soft reset is a method for correcting the data representing the output voltage by processing the software. On the other hand, hard reset is a correction method in which a reference voltage supplied to a comparison amplifier that generates an output voltage is changed by an amount corresponding to the drift voltage and the voltage drift is offset by hardware (circuit). .

In performing such correction (origin adjustment), it is necessary to detect the output with high accuracy, and the high voltage V H is input to the bridge circuit of the mold clamping force sensor 48.

  Subsequently, the mold clamping device 50 performs a mold closing operation. “Mold closing” means that the movable mold 51 is movable from the state where the movable mold 51 is separated from the fixed mold 53 to the state where the parting surface of the movable mold 51 contacts the parting surface of the fixed mold 53. This means that the mold 51 is brought close to the fixed mold 53.

In this state, the first mold clamping force is set as the mold clamping force. On the other hand, the voltage input to the bridge circuit of the mold clamping force sensor 48 is changed from the high voltage V H to the low voltage VL . This is because when the mold clamping force is in this state, high accuracy is not required, and it is possible to prevent the strain gauge from generating heat and causing a detection error.

Near the end of the mold closing operation, a mold clamping force lower than the first mold clamping force is set. In this state, if the force applied to the mold clamping device 50 is larger than necessary, the movable mold 51 and the fixed mold 53 may collide suddenly and the molds 51 and 53 may be damaged. This is because it is necessary to prevent and protect the movable mold 51 and the fixed mold 53. Therefore, it is necessary to detect the generated clamping force with high accuracy, and the voltage input to the bridge circuit of the clamping force sensor 48 can be changed from the low voltage V L to the high voltage V H and is variable. A ratio corresponding to the input voltage is calculated by the amplifier.

Subsequently, the mold clamping device 50 performs a mold clamping operation. By "clamping" from the state parting face of the movable mold 51 is come in contact with the parting surface of the stationary mold 53, further force on the movable mold 51 acts, the fixed mold 53 It is pressed by the movable mold 51.

In this state, a second mold clamping force larger than the first mold clamping force described above is set as the mold clamping force. Meanwhile, the voltage input to the bridge circuit of the mold clamping force sensor 48 is changed to the medium voltage V M from the high voltage V H. This is because in this state, it is necessary to detect the mold clamping force with a certain degree of accuracy, but the problem of breakage of the molds 51 and 53 is unlikely to occur. Therefore, high precision is not necessarily required for the detection.

  Subsequently, the mold clamping device 50 performs a mold opening operation. As described above, “mold opening” means that the movable platen 52 is moved backward from the state in which the parting surface of the movable mold 51 is in contact with the parting surface of the fixed mold 53 to fix the movable mold 51. It means separating from the mold 53.

In this state, as in the case of type closing operation described above, as a mold clamping force, the first mold clamping force is set. Meanwhile, the voltage input to the bridge circuit of the mold clamping force sensor 48 is changed from the medium-voltage V M to the low voltage V L. This is because when the mold clamping force is in this state, high accuracy is not required, and it is possible to prevent the strain gauge from generating heat and causing a detection error.

When the mold opening operation is near the end and the mold opening limit is reached, as described above, the mold clamping force is not set, and the origin adjustment is performed on the mold clamping force sensor 48, so that the high voltage V H Is input to the bridge circuit of the mold clamping force sensor 48.

As described above, the bridge circuit of the mold clamping force sensor 48 disposed as a pressure detector for detecting the mold clamping force on the tie bar 55 of the mold clamping apparatus 50 is in the state of the mold open limit and before the end of the mold closing operation. before the start of the mold clamping operation there is input a high voltage in the voltage V H accurate detection is made, during the mold clamping operation, the medium voltage V M is input, also mold closing and mold opening During operation, the low voltage VL is input, and the strain gauge is prevented from generating heat and being heated to a detection error.

  Reference is now made to FIGS.

  FIG. 4A shows a molding process (time t) and setting of the resin pressure detection load cell 35 for detecting the resin pressure applied to the resin in the heating cylinder 21 by the injection motor 29 in the injection apparatus 20 to the bridge circuit. The relationship with the input voltage (V) is shown, and FIG. 3B shows the relationship between the molding process (time t) and the set resin pressure (F).

  After the above-described mold opening process, the ejector device attached to the movable platen 52 operates, and the molded product molded in the previous cycle is ejected from the movable mold 51.

Since the injection device is not driven during this process, the low voltage VL is input to the bridge circuit in the resin pressure detection load cell 35. Therefore, it is possible to prevent detection errors from occurring due to the strain gauge generating heat and becoming high temperature.

  Next, in the injection process, the screw 23 moves forward, the resin stored in front of the screw 23 is injected from the injection nozzle, and the molten resin is filled into cavities formed in the molds 51 and 53. The resin pressure at the tip of the screw 23 at this time is detected by the resin pressure detection load cell 35 as an injection pressure.

In this injection process, the voltage input to the bridge circuit of the resin pressure detection load cell 35 is changed to the medium voltage VM1 higher than the low voltage VL . At the end of the injection process, the forward movement of the screw is switched from speed control to pressure control (V (speed) / P (pressure) switching).

  After the V / P switching, the process proceeds to a pressure holding process, and the resin in the cavities formed in the molds 51 and 53 is held at a set pressure smaller than that in the injection process and cooled.

In this pressure holding process, since the resin pressure is controlled by a feedback control loop, it is necessary to detect the resin pressure with higher accuracy than in the injection process, and the voltage input to the bridge circuit of the resin pressure detection load cell 35. It is changed to the voltage V M2 in higher than medium voltage V M1 in the injection process.

  Next, the process proceeds to the weighing process. In the weighing process, the screw 23 arranged in the heating cylinder 21 is rotated by the weighing motor 25. Resin is supplied from the hopper 22 to the rear part of the screw 23 in the heating cylinder 21. By rotating the screw 23, a certain amount is fed into the tip of the heating cylinder 21 while melting the supplied resin. During this time, the screw 23 moves backward while receiving the pressure (back pressure) of the molten resin accumulated at the tip of the heating cylinder 21.

In this metering process, the back pressure of the molten resin is different from the resin pressure generated by the positive advance of the screw 23 by driving of the drive device during the injection process, and the screw 23 is caused by the molten resin accumulated in front of the screw 23. Is the reaction force when passively retreating. For this reason, it becomes a value smaller than the resin pressure during the injection process. In addition, since it affects the density of the molten resin, it is necessary to detect the resin pressure with higher accuracy than in the case of the injection process. Therefore, the voltage input to the bridge circuit for the load cell 35 out resin pressure is changed to a high voltage V H than medium voltage V M1 in the pressure-holding step.

When the metering process is completed, after the above-described mold opening process, the ejector device attached to the movable platen 52 is operated, and the molded product in the movable mold 51 is ejected from the movable mold 51. As described above, at this time, the resin pressure is not set and is in a no-load state. In the resin pressure detection load cell 35, the low voltage VL is input to the bridge circuit. Therefore, it is possible to prevent detection errors from occurring due to the strain gauge generating heat and becoming high temperature.

In this manner, the bridge circuit of the resin pressure detection load cell 35 disposed as a pressure detector that detects the resin pressure applied to the resin in the heating cylinder 21 by the injection motor 29 in the injection device 20 includes a metering process. is inputted high voltage V H accurate detection is made, as in the injection process and the pressure holding process, the input medium voltage V M, also during up injection process starts after metering process completes, the low voltage V L is input, and the strain gauge is prevented from generating heat and being heated to a detection error.

  Reference is now made to FIGS.

  FIG. 5A shows a molding process (time t), a set input voltage (V) to the bridge circuit of the load cell 87 for detecting the ejecting force as a pressure detecting device for detecting the ejecting force by the ejector rod 86 of the ejector device. FIG. 5B shows the relationship between the molding process (time t) and the set ejection force (F).

  The ejector apparatus performs an ejecting operation for ejecting the cooled and solidified product from the molds 51 and 53 after the molds 51 and 53 are opened in parallel with the weighing process by the injection apparatus 20. In this example, the product ejecting operation is performed three times by the ejector rod 86, and the set ejecting force shows a high value three times during the ejecting operation.

Since the ejecting force detection load cell 87 detects the ejecting force by the ejector rod 86, the high voltage V H is inputted to the bridge circuit of the ejecting force detecting load cell 87 during the ejecting operation so that the high voltage V H is inputted. Accurate detection is performed.

On the other hand, when the ejecting operation is finished and the molded product is discharged, the molds 51 and 53 are closed, and the mold clamping process / injection process is performed. After the injection process is completed, the mold opening process is performed. From the start of the mold closing process to the completion of the mold opening process, that is, from the end of the ejecting operation to the start of the ejecting operation in the next molding cycle, the ejecting force is not set and is in an unloaded state. The low voltage VL is input to the bridge circuit of the load cell 87 for detecting the ejecting force. Therefore, it is possible to prevent detection errors from occurring due to the strain gauge generating heat and becoming high temperature.

As described above, the high voltage V H is input to the bridge circuit of the load cell 87 for detecting the ejecting force as a pressure detecting device for detecting the ejecting force by the ejector rod 86 of the ejector device. After the mold closing process is started and until the mold opening process is completed, that is, from the end of the ejecting operation to the start of the ejecting operation in the next molding cycle, the low voltage VL is input, the strain gauge generates heat, and the temperature is high. This prevents the detection error from occurring.

  As described above, according to the embodiment of the present invention, the input voltage to the bridge circuit of the pressure detector, such as the mold clamping force sensor 48, the resin pressure detection load cell 35, and the eject force detection load cell 87, can be varied. Thus, the value of the input voltage is changed according to the required level of detection accuracy.

  When detecting the applied load (pressure) with high accuracy, the input voltage is set to a high voltage, the influence of disturbances such as noise from peripheral devices such as motors is kept low, and the S / N ratio is increased to ensure accuracy. Output can be obtained. When high accuracy is not required for the detection, the input voltage is set to a low voltage to avoid a state in which the high voltage is constantly applied, and the strain gauge generates heat and prevents a detection error from occurring due to high temperature. ing.

  The present invention is not limited to a specific embodiment, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims.

  In the above-described embodiment, the structure in which the mold clamping force of the mold apparatus 70 is detected by the mold clamping force sensor 48 has been described as an example, but the present invention is not limited to this structure. For example, the present invention can be applied to the structure shown in FIG.

  Here, FIG. 6 is a diagram showing a schematic configuration of another example of a mold clamping device of an injection molding machine to which the present invention is applied. In addition, the same code | symbol is attached | subjected to the same location as the location shown in FIG. 1, and the description is abbreviate | omitted.

  Referring to FIG. 6, in this example, the movable mold 51 is attached to the movable mold mounting plate 150. A mold clamping force detection load cell 151 is provided between the movable mold mounting plate 150 and the movable platen 52. The mold clamping force detection load cell 151 detects the mold clamping force actually applied to the mold apparatus 70 in the same manner as the mold clamping force sensor 48 shown in FIG. The present invention can also be applied to such a mold clamping force detection load cell 151.

  Regarding the above description, the following items are further disclosed.

(Appendix 1)
An injection molding machine equipped with a pressure detector,
The pressure detector is a strain detector that detects strain when a voltage is input thereto,
An injection molding machine characterized in that the value of the voltage input to the pressure detector is changed during one molding cycle.

(Appendix 2)
An injection molding machine according to appendix 1,
The pressure detector includes a variable amplifier,
An injection molding machine, wherein a ratio between the voltage input to the pressure detector and a voltage output from the pressure detector is calculated by the variable amplifier.

(Appendix 3)
An injection molding machine according to appendix 1 or 2,
The pressure detector detects a clamping force of the clamping device;
The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has a highest value at least when the mold clamping device is in a mold open limit state or before performing a mold clamping operation.

(Appendix 4)
An injection molding machine according to appendix 1 or 2,
The pressure detector detects a clamping force of the clamping device;
The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has a lowest value at least during a mold opening operation or a mold closing operation.

(Appendix 5)
An injection molding machine according to appendix 1 or 2,
The pressure detector detects an injection pressure of the injection device;
The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has a highest value in a measuring step.

(Appendix 6)
An injection molding machine according to appendix 1 or 2,
The pressure detector detects an injection pressure of the injection device;
The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has the lowest value from the completion of the weighing process to the start of the injection process.

(Appendix 7)
An injection molding machine according to appendix 1 or 2,
The pressure detector detects the ejecting force of the ejecting device,
The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has a highest value during an ejecting operation.

(Appendix 8)
An injection molding machine according to appendix 1 or 2,
The pressure detector detects the ejecting force of the ejecting device,
The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has the lowest value from the end of the ejection operation to the start of the ejection operation in the next molding cycle.

(Appendix 9)
A method for controlling an injection molding machine,
The pressure detector provided in the injection molding machine is a strain detector that detects strain when voltage is input,
A method for controlling an injection molding machine, wherein the value of the voltage input to the pressure detector is changed during one molding cycle.

(Appendix 10)
A method for controlling an injection molding machine according to appendix 9, wherein
The pressure detector detects a clamping force of the clamping device;
The voltage value is changed so that the voltage input to the pressure detector has a highest value at least when the mold clamping device is in a mold open limit state or before performing a mold clamping operation. Control method of injection molding machine.

(Appendix 11)
A method for controlling an injection molding machine according to appendix 9 or 10,
The pressure detector detects a clamping force of the clamping device;
The method of controlling an injection molding machine, wherein the voltage value is changed so that the voltage input to the pressure detector has a lowest value at least during a mold opening operation or a mold closing operation.

(Appendix 12)
A method for controlling an injection molding machine according to appendix 9 or 10,
The pressure detector detects an injection pressure of the injection device;
The method of controlling an injection molding machine, wherein the voltage value is changed so that the voltage input to the pressure detector has a highest value in a measuring step.

(Appendix 13)
A method for controlling an injection molding machine according to appendix 9 or 10,
The pressure detector detects an injection pressure of the injection device;
The method of controlling an injection molding machine, wherein the voltage value is changed so that the voltage input to the pressure detector has the lowest value between the completion of the metering process and the start of the injection process.

(Appendix 14)
A method for controlling an injection molding machine according to appendix 9 or 10,
The pressure detector detects the ejecting force of the ejecting device,
The method of controlling an injection molding machine, wherein the voltage value is changed so that the voltage input to the pressure detector has a highest value during an ejecting operation.

(Appendix 15)
A method for controlling an injection molding machine according to appendix 9 or 10,
The pressure detector detects the ejecting force of the ejecting device,
An injection molding machine characterized in that the value of the voltage is changed so that the voltage input to the pressure detector has the lowest value between the end of the ejection operation and the start of the ejection operation in the next molding cycle. Control method.

It is a figure showing a schematic structure of a screw type electric injection molding machine as an example of an injection molding machine to which the present invention is applied. It is the schematic diagram which showed the circuit structure of the pressure detector concerning embodiment of this invention. Molding process (time) indicated by using the set value of the mold clamping force required to move the movable platen that detects the mold clamping force in the mold clamping device, the input voltage to the bridge circuit and the applied load (pressure) ). It is a graph which shows the relationship between the molding process (time), the input voltage to a bridge circuit, and the acting load (pressure) in the load cell for resin pressure detection which detects the resin pressure in an injection device. It is a graph which shows the relationship between the shaping | molding process (time), the input voltage to a bridge circuit, and the acting load (pressure) in the load cell for an eject force detection which detects the eject force in an ejector apparatus. It is a figure which shows schematic structure of the other example of the mold clamping apparatus of the injection molding machine to which this invention is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Injection molding machine 20 Injection device 35 Resin pressure detection load cell 48 Mold clamping force sensor 50 Mold clamping device 55 Tie bar 84 Ejector plate 87 Ejection force detection load cell 151 Mold clamping force detection load cell

Claims (9)

  1. An injection molding machine equipped with a pressure detector,
    The pressure detector is a strain detector that detects strain when a voltage is input thereto,
    The value of the voltage input to the pressure detector is changed during one molding cycle in accordance with the required detection accuracy .
  2. An injection molding machine according to claim 1,
    The pressure detector includes a variable amplifier,
    An injection molding machine, wherein a ratio between the voltage input to the pressure detector and a voltage output from the pressure detector is calculated by the variable amplifier.
  3. The injection molding machine according to claim 1 or 2,
    The pressure detector detects a clamping force of the clamping device;
    The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has a highest value at least when the mold clamping device is in a mold open limit state or before performing a mold clamping operation.
  4. The injection molding machine according to claim 1 or 2,
    The pressure detector detects an injection pressure of the injection device;
    The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has a highest value in a measuring step.
  5. The injection molding machine according to claim 1 or 2,
    The pressure detector detects an injection pressure of the injection device;
    The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has the lowest value from the completion of the weighing process to the start of the injection process.
  6. The injection molding machine according to claim 1 or 2,
    The pressure detector detects the ejecting force of the ejecting device,
    The injection molding machine according to claim 1, wherein the voltage input to the pressure detector has a highest value during an ejecting operation.
  7. A method for controlling an injection molding machine,
    The pressure detector provided in the injection molding machine is a strain detector that detects strain when voltage is input,
    A method for controlling an injection molding machine, wherein the voltage value input to the pressure detector is changed in one molding cycle in accordance with a required detection accuracy .
  8. A control method for an injection molding machine according to claim 7,
    The pressure detector detects a clamping force of the clamping device;
    The voltage value is changed so that the voltage input to the pressure detector has a highest value at least when the mold clamping device is in a mold open limit state or before performing a mold clamping operation. Control method of injection molding machine.
  9. A method for controlling an injection molding machine according to claim 7 or 8,
    The pressure detector detects an injection pressure of the injection device;
    The method of controlling an injection molding machine, wherein the voltage value is changed so that the voltage input to the pressure detector has a highest value in a measuring step.
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JP2006252523A JP4648885B2 (en) 2006-09-19 2006-09-19 Injection molding machine and control method of injection molding machine
TW096133356A TW200900219A (en) 2006-09-19 2007-09-07 Injection molding machine and method of controlling injection molding machine
CN2007800014905A CN101360599B (en) 2006-09-19 2007-09-14 Injection molding machine and method of controlling injection molding machine
DE112007002154.3T DE112007002154B4 (en) 2006-09-19 2007-09-14 Injection molding machine and control method of the injection molding machine
PCT/JP2007/067935 WO2008035630A1 (en) 2006-09-19 2007-09-14 Injection molding machine and method of controlling injection molding machine
US12/085,952 US20090243131A1 (en) 2006-09-19 2007-09-14 Injection Molding Machine and Control Method of the Injection Molding Machine
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JP2008073874A (en) 2008-04-03
WO2008035630A1 (en) 2008-03-27
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CN101360599B (en) 2012-05-23
US20090243131A1 (en) 2009-10-01

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