JP2012235036A - Thick copper foil printed wiring board for mounting heating component and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To promptly transfer heat of a mounted heating component to a heat radiation component to radiate the heat in a multilayer printed wiring board.SOLUTION: Thick copper foil layers for heat radiation 6a, 6b are laminated on a multilayer interconnection printed wiring board 10, and lands 11, on which a heating component 1 and a heat sink 9 are mounted, are formed so as to be separated from lands for other devices and circuits. A plating layer 4 is formed on an inner wall of a through hole 3 formed in each land 11 to be connected with the thick copper foil layers for heat radiation exposed on an inner wall surface of the through hole. A copper heat conductive paste 5 fills the through holes and plating 2 is performed on surfaces of the copper heat conductive paste 5 to form a heat transmission layer, transmitting heat to the heating component 1 and the heat sink 9, on the lands 11.

Description

The present invention relates to a thick copper foil printed wiring board that effectively dissipates heat generated from an electronic component having a high calorific value in a printed wiring board on which high-density mounting is performed, and a method for manufacturing the same.

With recent improvements in operating speed and mounting density of electronic components such as semiconductor devices, the amount of heat generated by these components has also increased significantly. For this reason, in a printed wiring board on which these electronic components are mounted, the function of these electronic components is degraded or impaired unless these heat generation is promptly dissipated and cooled. It has been demanded.
While these heat release and heat sinks installed as cooling means have improved capabilities, on the other hand, heat dissipation and cooling from the heat-generating electronic components mounted on the printed wiring board mounted at high density There is a need to build an effective heat conduction path to the means.
For this reason, in order to efficiently dissipate the heat generated from such electronic components from the multilayer printed wiring board, various contrivances have been made on the printed wiring board. For example, as shown in Japanese Patent Application Laid-Open No. 2003-101177 (Patent Document 1), a thick copper foil wiring board in which an insulating film is formed on a metal plate made of aluminum, copper, a galvanized steel plate, or the like is disclosed. No. 140063 <Patent Document 2> A glass epoxy multilayer board directly attached with a copper plate, or Japanese Patent Application Laid-Open No. 2004-179291 (Patent Document 3) There are things that use.

However, in recent years, with the demand for high-capacity and high-density mounting of electronic components, the thickness of the multilayer wiring board has been reduced, and the minimum drill hole diameter for via hole formation is from about 0.5 mm to 0.2 mm. The wiring density of the multilayer wiring board has been increased, starting to shift to a certain size. Since conventional methods using metal plates and metal core substrates cannot reduce the thickness of multilayer wiring boards, it has begun to consider the use of thick copper foil multilayer wiring boards for mounting micro devices. . However, in the case of a thick copper foil multilayer wiring board, the adjacent device is adversely affected by the heat generated from the high heat generation electronic components because the foil is formed by plating and the thickness of the foil is thinner than the metal core board. There was a problem that it was easy. In particular, if the amount of heat generated per unit area increases, the heat load on the thick copper foil circuit increases and the adjacent electronic components are also affected by heat, so the wiring density of the multilayer wiring board and the mounted devices must be increased. I could not.
For example, in the case of using the metal core wiring board disclosed in Japanese Patent Application Laid-Open No. 2003-101177, as illustrated in FIG. 2, the heat generated from the highly heat-generating electronic component travels through the bonding wire through the through hole directly below the bonding pad to the metal core. It is transmitted to the wiring board. However, since the through hole is filled with an insulating member, the heat immediately below the bonding pad moves along the conductive layer on the side wall of the through hole. Similarly, heat from the side wall of the through hole is indirectly transmitted to the metal substrate through the insulating member, and cannot be directly transferred to the metal core wiring substrate. On the other hand, since the metal core wiring board itself has sufficient heat dissipation characteristics, no special contrivance has been made for heat dissipation from the metal core wiring board.
Further, in the case of using a core substrate such as aluminum disclosed in Japanese Patent Application Laid-Open No. 2004-179291, as illustrated in FIG. 1, the heat generated from the highly heat-generating electronic component is transmitted through the side wall of the bottomed through hole, and anodized. It is transmitted to the core substrate such as aluminum through the film. Since the core substrate has a thickness of about 0.5 to 2.0 mm, the heat accumulated on the anodized film can be absorbed into the core substrate with a margin, and the thermal expansion coefficient of the anodized film is It does not matter if it is different from that of aluminum metal. Therefore, no special contrivance has been made for heat dissipation from the metal core substrate.
However, in the case of a thick copper foil multilayer wiring board, the thickness of the foil is several hundred μm or less, which is thinner than the metal core board, etc., so that heat transfer and absorption can be performed well between the anodized film and the aluminum metal. Can not. Therefore, when the calorific value per unit area increases, especially when accompanied by repeated thermal shock, the anodic oxide film of several tens of microns is cracked or the metal plating is peeled off. Due to this heat generation problem, the devices could not be mounted at high density.
Further, in a multilayer wiring board using a thermosetting silver paste inside a through hole disclosed in Japanese Patent Application Laid-Open No. 2004-140063, as illustrated in FIG. The heat is dissipated by being transferred to the copper plate on the opposite side via the silver paste conductor inside the hole. However, since the copper plate on the back surface needs a certain area for heat dissipation, there is a drawback that the density of other devices on the back surface cannot be increased on the printed wiring board. In addition, since heat generated from the highly heat-generating electronic component is dissipated to the back surface through the silver paste filling hole, there is a problem that the arrangement space and integration degree of devices mounted on the back surface are limited.

Therefore, it is also conceivable to use a metal core substrate such as copper instead of the aluminum core substrate disclosed in Japanese Patent Application Laid-Open No. 2004-179291. However, since copper has a higher specific gravity than aluminum, it becomes heavier and there is a difficulty in holding means for mounting. Further, due to the temperature rise accompanying heat dissipation, the metal core layer and the intermediate resin layer are subjected to compression / shrinkage stress due to the difference in thermal expansion coefficient. When this thermal stress strain is repeated and accumulated, there is a drawback that conduction failure occurs due to cracks or the like even with repeated thermal shock at a relatively low temperature. Therefore, when attempting to reduce the thickness of copper, there is a problem in that the amount of heat dissipation via the copper layer is reduced, and heat is dissipated directly when the heat generating electronic component is used, and adjacent devices are subject to thermal degradation. Therefore, until now, when high heat-generating electronic components are used, the density of devices cannot be increased, and the printed wiring board has to be thickened to some extent using a metal plate or a core substrate.

On the other hand, a device has been proposed in which a laminated circuit layer is used as a route circuit for heat dissipation by utilizing the structure of a multilayer wiring board.
Japanese Patent Laid-Open No. 2006-49412 (Patent Document 4) forms a large number of heat radiating through holes that reach the back of the substrate directly below the heat generating electronic component, and dissipates heat from the heat generating component from the surface of the substrate through this conductive layer. In addition, it is described that the heat is transmitted to the casing on the outer edge of the substrate for heat dissipation. For this heat transfer, a large and small number of through-holes are formed directly under the heat-generating component and in the vicinity of the outer edge of the board to improve and adjust the thermal conductivity according to the number and hole diameter, and increase the heat dissipation route to increase the heat dissipation effect. We are going to improve.
However, these heat-dissipating through-holes transfer heat between circuit conductive layers inside and outside the substrate with the same structure as through-holes for connection between stacked circuits. This is not enough, and the circuit layers inside and outside of the board will rise in temperature, and not only will there be no room for other devices to be mounted in the periphery, but the amount of heat that reaches the housing on the outer edge of the board due to restrictions on the circuit layer. It is difficult to increase the size, and the problem cannot be achieved in terms of both the heat dissipation effect for the electronic component having a large calorific value and the achievement of high-density mounting.

JP 2003-101177 A JP 2004-140063 A JP 2004-179291 A JP 2006-49412 A

The present invention has been made to solve the above-described problems, and uses a thick copper foil printed wiring board instead of a metal core, and has a high device density for high heat generation electronic components as in the case of a normal multilayer wiring board. A copper foil printed wiring board is provided. In addition, the present invention separates and separates the heat dissipation route for highly heat-generating electronic components from the heat dissipation route for other devices, thereby providing a thickness with high dielectric breakdown resistance and migration resistance against repeated low temperature thermal shocks and voltage fluctuations. A copper foil printed wiring board is provided.
On the other hand, the manufacturing method of this invention provides the method of improving the adhesive strength of thick copper foil board | substrates, such as copper, and the plating deposit in a through-hole hole. Moreover, the manufacturing method of this invention provides the manufacturing method of the thick copper foil printed wiring board which is durable to a low temperature repeated thermal shock.

The configuration of the thick copper foil printed wiring board for mounting the heat generating component of the present invention for solving the above-described problems is as follows.
(1) A thick copper foil wiring board for mounting a heat generating component on the surface layer of the wiring board and dissipating the heat from the end of the wiring board through the internal heat radiating thick copper foil layer. Separated from surrounding lands for parts and heat dissipation parts, has independent heat generation parts and lands for mounting heat dissipation parts, and the lands are connected to one or more plated through holes, and each of the plated through holes The inside is filled with a heat conductive resin body, and the plated layer on the side wall surface of the plated through hole is connected to the thick copper foil layer for heat radiation exposed on the through hole side wall surface to constitute a heat radiating substrate that conducts heat, The land group close to the heat-generating component is not connected to the thick copper foil layer, but is connected to a surface layer circuit or a circuit formed on an intermediate copper foil layer stacked above and below the thick copper foil layer. Make up the board Thick copper foil printed wiring board for mounting heat generating parts.

Moreover, the embodiment of the thick copper foil printed wiring board for mounting the heat generating component of the present invention is as follows.
(2) The thick copper foil print according to (1), wherein the land including the surface of the heat conductive layer filling the through hole is formed with a heat conductive plating layer for connecting the heat generating component and the heat radiating component by plating. Wiring board.
(3) The thick copper foil printed wiring board according to (1), wherein a plating layer is formed on a land including the surface of the heat conductive layer filling the through hole on the back side of the board.
(4) The thick copper foil printed wiring board according to (1), wherein the plating layer is copper plating by electroless or electrolytic method.
(5) The thick copper foil printed wiring board according to (1), wherein the resin paste is a heat conductive copper resin paste.

On the other hand, the manufacturing method of the thick copper foil printed wiring board for mounting a heat-generating component for solving the above-described problems is as follows.
(6) A method of manufacturing a thick copper foil printed wiring board for mounting a heat generating component,
A: preparing a printed wiring board in which a copper foil layer for heat dissipation is laminated in the board;
B: a step of patterning and forming a heat-generating component and a land for mounting a heat-dissipating component separated from other device lands and circuit patterns on the conductive layer on the multilayer printed-wiring substrate; and C: a heat-generating component of the multilayer printed-wiring substrate and A step of forming a through-hole reaching the heat-dissipating copper foil layer by drilling in a land portion on which a heat-dissipating component is mounted;
D: a step of forming a plating deposition layer on the side wall surface of the through hole and connecting to the heat radiating copper foil layer exposed on the side wall surface;
E: filling the through hole with a heat conductive resin;
F: a method of manufacturing a thick copper foil printed wiring board for mounting a heat-generating component, comprising the step of plating a land surface including a surface of a heat conductive resin filling the through-hole,
(7) In addition to the above steps,
G: A method for producing a thick copper foil printed wiring board for mounting a heat-generating component, comprising a step of heat-treating the plating deposition layer after plating the through hole of D,
(8) Further, H: Thickness for mounting a heat-generating component, characterized in that it further includes a step of obtaining a thermally conductive resin body obtained by thermally decomposing the thermally conductive resin filled in the through-hole in the step E. It is a manufacturing method of a copper foil printed wiring board.

Moreover, the embodiment of the manufacturing method of the thick copper foil printed wiring board for heat-emitting components mounting of this invention is as follows.
(9) The through-hole plating and / or the plating of the heat conductive plating layer is a copper plating. The thick copper foil printed wiring board for mounting a heat-generating component according to any one of (6) to (8), Production method.
(10) The method for producing a thick copper foil printed wiring board for mounting a heat-generating component according to any one of (6) to (8), wherein the heat conductive resin is a heat conductive copper resin paste.

In the multilayer printed circuit board of the present invention, by constructing a heat conduction path having a large heat capacity from the heat generating component to the heat radiating component, the heat influence from the heat generating component is suppressed to the minimum, and the heat durability of the multilayer printed circuit board is achieved. Improve device packaging density,
In addition, by heat-treating the plated layer on the side wall of the through-hole, the through-hole plated conductive layer is improved in durability against repeated thermal shocks. A high aspect ratio can be achieved, and further device high-density mounting and thinner and lighter substrates are possible.

FIG. 1 is a schematic diagram of an embodiment of the present invention.

The characteristic part of the present invention is that a thick copper foil printed wiring board for mounting a heat generating component is plated on the inner wall of the through hole formed in the land for mounting the heat generating component on the surface of the substrate and the inside is heated. It is filled with a conductive resin body, and further, a thermal conductive plating layer is formed on the land including the resin surface ”. In the method of manufacturing a thick copper foil printed wiring board, the above“ D: “Step of heat-treating the plated layer” or “E: Step of thermally decomposing thermally conductive resin to form resin body”.
Plating inside the through hole is difficult to obtain normal plating deposits because of poor circulation of the plating solution, whether it is electroless plating or electrolytic plating. In particular, the higher the density of the substrate, the smaller the hole diameter becomes 0.5 mm or less and the aspect ratio becomes larger, so that it becomes difficult to obtain a normal plating deposit. Therefore, attempts have been made to obtain uniform precipitates by shaking the printed wiring board in the plating solution or applying pulse plating, but it is normal compared to the plated circuit layer on the surface of the printed wiring board. No plating deposit can be obtained.
The present invention is also characterized in that a gas component taken into the plating deposit is diffused by heat-treating the insufficient plating deposit in advance. However, in appearance, it is a property that is not different from that at the time of plating finish even when observed with a microscope. Heat generated when using heat-generating components mounted on a printed circuit board is transmitted to the plated deposit layer on the side wall of the through-hole, directly to the thick copper foil layer, and by a heat sink provided on the other end of the thick copper foil layer. Heat is dissipated continuously. At this time, since the thermal expansion coefficient of the plated metal layer and the thermal expansion coefficient of the insulating layer of the printed wiring board are different, the plated deposit layer on the side wall of the through hole is subjected to strain stress. Since heat treatment is performed to dissipate gas components at a temperature higher than the temperature due to heat from the heat-generating component, adhesion to the substrate is improved, and cracks and plating layers are not affected by repeated thermal shocks. It can follow well without cutting. In particular, if the inside of the plated through hole is filled with a thermally conductive resin body, the thermally conductive resin body repeatedly expands and contracts in the radial direction with respect to the plated deposition layer inside the through hole having a high aspect ratio. Since the layers have a sandwich structure backed up by these layers, distortion is less likely to occur due to the difference in thermal expansion coefficient, and a more stable result can be obtained with respect to many repeated thermal shocks.
In addition, if a heat conductive plating layer is formed on the heat generating component mounting side surface land portion including the through hole, the heat generated from the heat generating component is directly passed through the plating deposit layer on the through hole side wall through the heat conductive plating layer. It is possible to transfer heat to the substrate and quickly move the heat, and it is possible to avoid the heat load from being concentrated on the plating deposition layer on the side wall of the through hole. If a plurality of through-holes are provided for one portion of the heat conductive plating layer, the heat transfer is dispersed, so that the temperature does not rise abnormally even with a high aspect ratio through-hole. When multiple heat-dissipating copper foil layers are provided, the lower thick copper foil layer is used as the heat-dissipating layer from the high-heat-generating component in order to avoid thermal effects from the high-heat-generating component. Use the upper thick copper foil layer as the heat dissipation layer of the adjacent dense device.

The structure of a thick copper foil printed wiring board for mounting a heat-generating component according to the present invention will be described below with reference to the drawings.
FIG. 1 schematically shows an embodiment of the present invention. In FIG. 1, 1 is a heat generating component, 2 is a heat conductive plating layer, 3 is a through hole, 4 is a plating layer of a through hole, 5 is a copper-containing resin body, 6a and 6b are heat-dissipating thick copper foil layers, and 7 is heat dissipation. Through holes, 8 is a printed circuit (layer), 9 is a heat sink, and 10 is a printed circuit board.

  The heat generated from the heat generating component 1 is a pad-on-hole (a single pad-on-hole is schematically illustrated in FIG. 1) of a plurality of thermally conductive plating layers 2 and a highly heat-conductive copper-containing resin body. Go to 5. Most of the heat transferred into the through hole 3 is absorbed by the upper thick copper foil layer 6a, and the remaining heat is absorbed by the lower thick copper foil layer 6b. The absorbed heat is transmitted laterally in the thick copper foil layers 6a and 6b. Since the thick copper foil layers 6a and 6b have high thermal conductivity, heat is not dissipated so much to the resin layers in contact with the thick copper foil layers 6a and 6b on both sides, but is transferred to the other end side of the thick copper foil layers 6a and 6b. It reaches the heat dissipation through hole 7. The heat dissipation through hole 7 may have the same structure as the through hole 3. Alternatively, a set screw of the heat sink 9 may be embedded in the heat dissipation through hole 7 and fixed to the printed wiring board 10. In either embodiment, the heat reaches the heat sink 9 through the heat dissipation through hole 7 and is completely dissipated. Note that the surface of the through hole 3 opposite to the heat-generating component 1 can also be used as a pad-on-hole of the heat conductive plating layer 2 and used as a ground layer.

  In the present invention, the hole diameter of the through hole 3 is preferably in the range of 0.1 mm to 1.0 mm. This is because if the thickness is larger than 1.0 mm, the resin paste may shrink too much when the filled resin paste is baked, and the resin body 5 may crack. This is because if the thickness is smaller than 0.1 mm, it is difficult for the plating solution to enter the through hole 3 and plating becomes difficult. More preferably, the range of 0.3 mm to 0.8 mm is desirable from the viewpoint of workability.

In the present invention, the thickness of the thick copper foil layers 6a and 6b may be 50 μm or more, but is practically in the range of 100 to 300 μm. This is because if the thickness is too thick like a copper core substrate, the weight becomes too heavy, which is inconvenient to handle, and if it is thin, heat transfer is insufficient. More preferably, it is the range of 175-210 micrometers.
The thick copper foil layer 6a is preferably set as close as possible to the surface layer. On the contrary to the above example, the thick copper foil layer 6b is used for discharging the heat generated from the heat-generating component 1, and the thick copper foil layer 6a is used for other purposes. It can also be used as a heat generation preventing layer for the device component group. In any case, the heat generated from the heat generating component 1 needs to be discharged to the thick copper foil layer as quickly as possible. The thick copper foil layer for discharging the heat generated from the heat generating component 1 is preferably within a range of 1: 1 to 1:10 from the substrate surface with respect to the hole diameter of the through hole 3. If the ratio is less than 1: 1, the heat dissipated from the thick copper foil layer 6a reaches the adjacent land group, which may cause malfunction of the device. On the other hand, if the ratio exceeds 1:10, it takes too much time for the heat generated from the heat-generating component 1 to reach the thick copper foil 6a, so that it is dissipated through the resin layer above the thick copper foil layer 6a. This is because there is a possibility that heat may reach the adjacent lands. Two or more thick copper foil layers may be used in order to reliably absorb the heat generated from the heat generating portion 1. In this case, the excessive thick copper foil layer 6b can be used as a ground layer.

In the present invention, a paste for through holes or a paste for bottomed via fill can be used as the resin paste. This is because when through-hole plating with a high aspect ratio is performed, the fluidity of the plating solution is inadequate, and even if the plating deposits are unstablely deposited, they are compatible with the filled resin paste. The resin paste includes a non-conductive paste and a conductive paste. In consideration of thermal conductivity, a conductive paste using silver or copper is preferable. As the metal paste, conductive copper paste, for example, trade name “DD paste AE1244” (non-plated via conductive copper paste) manufactured by Tatsuta System Electronics Co., Ltd. is preferable from the viewpoint of cost effectiveness.

In the present invention, electroplating or electroless plating can be used for through-hole plating. The plating thickness is required to be 10 μm or more. This is because the heat generated from the heat-generating component 1 reaches the thick copper foil layer 6a as quickly as possible and does not accumulate heat in the resin layer above the thick copper foil layer 6a. As the type of plating, copper or silver is preferable, and copper plating is preferable from the viewpoint of cost effectiveness. Copper sulfate electrolytic baths or electroless baths are common. Since any plating can form a plating layer directly bonded to the end face of the thick copper foil layer exposed on the side wall of the through hole of the wiring board, the heat transferred to the through hole (3) is directly applied to the thick copper foil. It can be transmitted to the layer (6a), and the thermal conductivity is greatly improved as compared with the case where an oxide film layer is interposed like the above-described aluminum core substrate. The upper limit of the plating thickness does not need to exceed 100 μm for economic efficiency. The range of 20 to 80 μm is preferable.

Embodiments of a thick copper foil printed wiring board for mounting a heat generating component according to the present invention will be described below.
Three laminates (200 mm long, 250 mm wide, 2 mm thick) made of 6 layers of glass epoxy resin having 2 thick copper foil layers (each 175 μm) in the inner layer were produced by a conventional multilayer board production method. This copper surface layer was etched by leaving 16 heat dissipating surfaces (lands) for mounting the heat generating component 1 2 mm long and 2 mm wide. If necessary, a fine pattern can be formed. Thereafter, four through holes were drilled on the heat radiation surface with a drill having a diameter of 0.3 mm. The through-holes were plated for 2 hours in a sulfuric acid electrolytic copper plating bath (sulfuric acid 400 g / l, copper 40 g / l) to obtain through-hole plating with an average film thickness of 50 μm.

These laminated bodies were filled with a copper resin paste (“AE1244” manufactured by Tatsuta System Electronics Co., Ltd.) at eight heat dissipating surfaces after through-hole plating and heat-treated at 135 ° C. for 45 minutes in the air.

One of the laminates was plated for 60 minutes in the above-described sulfuric acid electrolytic copper plating bath to form a thermally conductive plating layer having an average film thickness of 20 μm on the plated portions at the four through-hole entrances.
The temperature of this laminated printed wiring board was measured using a power driver board. The measurement was carried out under the condition that 50 W resistance and 8 W were applied as a heat source until the saturation temperature was reached from the source initial temperature of 22 ° C., and a saturation temperature of 41.6 ° C. was measured after 40 minutes.

The saturation temperature of 41.6 ° C. is a value within the range of 43 ° C. to 2 ° C. in a simulation using a printed wiring board in which a 1 mm thick aluminum substrate is attached to a general 1.6 mm thick laminate. Settled. This indicates that it has a thermal conductivity equivalent to that of a conventional aluminum base substrate.
Therefore, a desired heat sink can be provided at any location away from the heat dissipation through hole as in the case of a conventional aluminum base substrate, and device components can be mounted close to the heat dissipation component and integrated at high density. became.

In the above embodiment, the case where the heat-generating component has a plurality of plated through holes connected to a plurality of heat-dissipating copper foil layers has been described, but a bonding wire is connected to a heat-generating component such as a high-intensity light emitting diode. Even when the end of the bonding wire is connected to a land, pad, etc. on the wiring board, heat generating parts and heat radiating parts are not directly mounted on the multilayer printed wiring board, or even if the heat generation amount is relatively small, Further, even when the heat dissipation copper foil layer is singular and is connected to a single plated through hole, the present invention can be applied in the same manner as in the above embodiment.

  The present invention has a large amount of heat generated by electronic components in which large balls, grid arrays, etc. are mounted in one place, power supply modules that consume high power, and high-intensity light emitting diodes. Suitable for electronic parts.

1 Heat-generating component 2 Thermal conductive plating layer (thermal conductive solid surface)
3 Through Hole 4 Through Hole Plating Layer 5 Thermal Conductive Resin Body 6 Heat Dissipating Thick Copper Foil Layer 7 Heat Dissipating Through Hole 8 Printed Wiring Circuit (Layer)
9 Heat sink (heat dissipation component)
10 Multilayer printed circuit board 11 Land for mounting heat-generating components (heat dissipating components)

Claims (7)

In a multilayer printed wiring board that dissipates heat by transferring heat from a heat generating component mounted on the board to a heat radiating component mounted on the same board, a heat radiating copper foil layer that is independent of the conductive layer for circuit wiring is laminated in the printed wiring board And
A land for mounting the heat-generating component and the heat-dissipating component on the printed wiring board is provided separately and independently from other device lands and circuit layers,
Forming a through-hole reaching the heat-dissipating copper foil layer from the land and forming a plating layer connected to the copper foil layer exposed on the inner wall surface;
Fill the through hole with a heat conductive resin,
A thick copper foil printed wiring board for mounting a heat generating component, wherein a heat conductive plating layer serving as a heat conductive surface to the heat generating component and the heat radiating component is formed on the land surface including the resin layer surface. 2. The thick copper foil printed wiring board according to claim 1, wherein the through hole reaches the back surface of the multilayer wiring board, and the front and back surfaces of the multilayer wiring board are formed in the same manner. The thick copper foil printed wiring board according to claim 1, wherein the heat conductive plating layer is electroless or electrolytic copper plating. The thick copper foil printed wiring board according to any one of claims 1 to 3, wherein the resin paste is a heat conductive copper resin paste. A method of manufacturing a multilayer printed wiring board for mounting a heat generating component,
A: preparing a printed wiring board in which a copper foil layer for heat dissipation is laminated in the board;
B: A conductive layer on the multilayer printed wiring board is formed by patterning a land for mounting a heat generating component and a heat radiating component separated from other device lands and circuit patterns, and C: a heat generating component and a heat radiating component of the multilayer printed wiring board. Forming a through hole reaching the heat dissipation copper foil layer by perforating the land portion on the surface,
D: a step of forming a plating deposition layer on the side wall surface of the through hole and connecting to the heat radiating copper foil layer exposed on the side wall surface;
E: filling the through hole with a heat conductive resin;
F: A method of manufacturing a thick copper foil printed wiring board for mounting a heat-generating component, comprising the step of plating on a land surface including the surface of the thermally conductive resin filled with the through hole. 6. The method for producing a thick copper foil printed wiring board for mounting a heat-generating component according to claim 5, wherein: G: plating the through-hole of D and then heat-treating the plating deposit layer. The thick copper foil print for mounting a heat-generating component according to claim 5 or 6, wherein the heat conductive resin body is obtained by thermally decomposing and curing the resin filled in the through hole in the step E. A method for manufacturing a wiring board.

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