WO2014136175A1 - Heat-dissipating substrate and method for producing same - Google Patents

Heat-dissipating substrate and method for producing same Download PDF

Info

Publication number
WO2014136175A1
WO2014136175A1 PCT/JP2013/055833 JP2013055833W WO2014136175A1 WO 2014136175 A1 WO2014136175 A1 WO 2014136175A1 JP 2013055833 W JP2013055833 W JP 2013055833W WO 2014136175 A1 WO2014136175 A1 WO 2014136175A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
heat
plating
substrate
radiator
Prior art date
Application number
PCT/JP2013/055833
Other languages
French (fr)
Japanese (ja)
Inventor
秀吉 瀧井
典明 種子
浩平 芝田
高木　剛
啓司 原田
Original Assignee
株式会社メイコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to PCT/JP2013/055833 priority Critical patent/WO2014136175A1/en
Publication of WO2014136175A1 publication Critical patent/WO2014136175A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the present invention relates to a heat dissipation board used for, for example, an electric control device for a vehicle, a household device, an LED component, or an industrial device, and a manufacturing method thereof.
  • heat generating component includes switching elements such as an IGBT (Insulated Gate Bipolar Transistor) and an IPM (Intelligent Power Module).
  • IGBT Insulated Gate Bipolar Transistor
  • IPM Intelligent Power Module
  • Patent Document 1 for heat radiation, a heat transfer member is inserted into a substrate, and this is connected to a component, and heat generated from the component is externally transmitted through the heat transfer member (for example, columnar copper). The heat is dissipated.
  • this heat transfer member is mounted by being press-fitted into a through hole provided in the substrate. When the heat transfer member is press-fitted in this manner, stress is generated along with the press-fitting, and there is a possibility that damage (for example, a crack or the like) may be caused in the through hole or its periphery.
  • the present invention has been made in consideration of the above prior art, and an object of the present invention is to provide a heat dissipation board capable of ensuring heat dissipation characteristics without damaging the board, and a method for manufacturing the same.
  • an insulating layer made of an insulating resin material, a conductive layer made of a conductive material, a substrate body made of the insulating layer and the conductive layer, and a through-hole penetrating the substrate body,
  • a heat dissipating body made of a heat transfer material accommodated in the through hole, and a plating part formed by performing a plating process in a state where the heat dissipating element is disposed in the through hole. Is provided between the heat radiating body and the through hole, holds the heat radiating body in the through hole, and covers the entire surface of the heat radiating body.
  • an outer diameter of the heat radiating body is smaller than an inner diameter of the through hole, and a thickness of the heat radiating body is equal to or less than a thickness of the substrate body.
  • the plating part has a main body covering region covering the surface of the substrate body and a heat dissipating member covering region covering the surface of the heat dissipating body, and the outer surface of the heat dissipating member covering region is outside the main body covering region. It is formed flush with the surface.
  • the substrate body forming step of forming the substrate body by laminating the insulating layer and the conductive layer, the through hole forming step of forming the through hole in the substrate body, and the substrate body A first plating step of forming a plating film on the surface of the substrate body and the inner wall surface of the through hole by performing a plating process; and disposing the heat radiator in the through hole, and the heat radiator on the plating film In a non-contact state, the surface of the substrate body, the entire surface of the radiator, and a second plating step of forming the plating portion by plating treatment between the radiator and the through hole. Also provided is a method for manufacturing a heat dissipation board.
  • the radiator is held with respect to the through hole by the plating portion. For this reason, since it is not necessary to press-fit the heat radiating body into the through hole, the heat radiation characteristics can be ensured without damaging the substrate.
  • a heat dissipation board 1 includes a substrate body 2 and a heat dissipation body 3.
  • the substrate body 2 has a plate shape and is formed by laminating an insulating layer 4 and a conductive layer 5.
  • the insulating layer 4 is made of an insulating resin material, for example, a prepreg.
  • the conductive layer 5 is made of a conductive material, for example, copper. As long as the insulating layer 4 and the conductive layer 5 are stacked on the substrate body 2, the number of stacked layers can be selected as appropriate. For example, in FIG. 1, four conductive layers 5 are interposed, and three insulating layers 4 are interposed between the conductive layers 5.
  • a through hole 6 is formed in the substrate body 2.
  • the through hole 6 is drilled using, for example, a drill or a laser.
  • the surface of the substrate body 2 and the inner wall surface of the through hole 6 are plated to form the plating film 7. Since the plating film 7 covers the entire surface of the substrate body 2 and the through-hole 6, the substrate body 2 and the through-hole 6 are substantially the same even when covered with the plating film 7 as the outer shape. Therefore, the surface of the substrate body 2 and the inner wall surface of the through hole 6 may be referred to even when the plating film 7 is interposed on the surface of the substrate body 2 or the inner wall surface of the through hole 6.
  • the heat radiator 3 is accommodated in the through hole 6.
  • the radiator 3 is made of a metal material having heat conductivity such as copper.
  • a plated portion 8 is interposed between the radiator 3 and the through hole 6.
  • the plated portion 8 is formed by plating in a state in which the heat radiating body 3 is disposed in the through hole 6. Therefore, the plating part 8 is also formed on the surfaces of the substrate body 2 and the radiator 3 other than between the radiator 3 and the through hole 6.
  • the plated part 8 covers the entire surface of the radiator 3. Since the plating part 8 is also in contact with the inner wall surface of the through-hole 6 (more precisely, it is also in contact with the inner wall surface of the through-hole 6 via the plating film 7), the heat radiator 3 passes through the plating part 8.
  • the substrate body 2 is securely held.
  • the plated portion 8 covers both surfaces of the heat radiating body 3 (the substrate surface of the heat radiating substrate 1), so that the holding is ensured. Furthermore, the heat radiating body 3 can be protected also when the heat radiating
  • the outer diameter A of the radiator 3 is smaller than the inner diameter B of the through hole 6 (the through hole formed by the plating film 7 in the example of FIG. 1).
  • the heat radiator 3 is accommodated in the through-hole 6 without being press-fitted into the through-hole 6 (through-hole formed by the plating film 7 in the example of FIG. 1). Therefore, the heat dissipation characteristics can be ensured without damaging the substrate body 2.
  • the thickness C of the radiator 3 is equal to or less than the thickness D of the substrate body 2 (thickness including the plating film 7 in the example of FIG. 1). Thereby, it can prevent that the thermal radiation body 3 protrudes from the surface of the board
  • the radiator 3 may have a circular cylindrical shape in plan view or a rectangular prism shape. Alternatively, other shapes may be used. Any shape can be adopted as long as the outermost edge of the radiator 3 is not in contact with the through hole 6.
  • the plating unit 8 has a main body covering region 9 that covers the surface of the substrate main body 2 and a radiator covering region 10 that covers the surface of the radiator 3.
  • the outer surface of the radiator covering region 10 is formed flush with the outer surface of the body covering region 9. ing.
  • a step is formed between the main body covering region 9 and the radiator covering region 10, and the radiator covering region 10 is placed on the substrate main body 2 side (lower side) from the main body covering region 9 through this step. ).
  • the plating portion 8 is appropriately processed so as not to affect the formed pattern.
  • a preferred component mounting form is, for example, in which a component is disposed immediately above the radiator 3, and the component and the radiator 3 are in contact with a heat-conductive resin or heat transfer sheet. At this time, more preferably, the conductive layer 5 is in contact with another radiating component for grounding, that is, grounded. Preferably, the radiator 3 is grounded.
  • a substrate body forming process is first performed.
  • the substrate body 2 is formed by laminating the insulating layer 4 and the conductive layer 5.
  • four conductive layers 5 and three insulating layers 4 are alternately stacked.
  • a through hole forming step is performed.
  • the through hole 6 is formed in the substrate body 2.
  • the through hole 6 is drilled using a drill, a laser, or the like as described above.
  • a first plating step is performed.
  • a plating process is performed on the substrate body 2 in which the through holes 6 are formed. Since this plating process is performed on the entire surface of the substrate body 2, the plating film 7 deposited by the plating process is formed on both surfaces of the substrate body 2 and the inner wall surface of the through hole 6.
  • the second plating step is performed.
  • the plating process is performed in a state where the radiator 3 is disposed in the through hole. That is, the substrate body 2 is immersed in the plating tank with the radiator 3 held in the through hole 6 of the substrate body 2.
  • the radiator 3 is not contacted with the plating film 7, for example. Therefore, the plating portion 8 made of the plating metal to be deposited is formed on the surface (both sides) of the substrate body 2 and the entire surface of the heat radiating body 3. Since the plated portion 8 is formed on the entire surface of the heat radiator 3, the plated portion 8 is naturally formed between the heat radiator 3 and the through hole 6. Thereby, the heat dissipation substrate 1 as shown in FIG. 1 is manufactured.
  • the radiator 3 is fixed and held on the substrate body 2 by the plating portion 8. Since this holding is performed by the metal plating portion 8, it does not affect the heat dissipation characteristics of the heat radiator 3.
  • the radiator 3 may come out of the through hole 6 (plating film 7) due to liquid flow or gravity.
  • the receiving plates 11 and 12 may be arranged above or below the substrate body 2 or both.
  • the backing plate 11 is formed in a mesh shape or a porous shape, and has a shape that does not hinder the flow of the plating solution.
  • the receiving plate 11 further includes a through-hole 13 having a diameter narrower than the outer edge of the radiator 3 in plan view. By providing this through hole 13, plating can be favorably deposited on the radiator 3.
  • a receiving plate 12 formed in a mesh shape or a porous shape is further arranged. By arranging such receiving plates 11 and 12, it is possible to prevent the radiator 3 from coming out of the through hole 6 during the plating process. Note that only one of the receiving plates 11 and 12 can be used.

Abstract

This heat-dissipating substrate (1) comprises: an insulating layer (4) made of an insulating resin material; an electroconductive layer (5) made of an electroconductive material; a substrate body (2) including said insulating layer (4) and said electroconductive layer (5); a through hole (6) that penetrates said substrate body (2); a heat-dissipating body (3) that is made of a heat-transferring material and that is housed inside said through hole (6); and a plating part (8) formed by executing a plating treatment in a state where said heat-dissipating body (3) is arranged inside said through hole (6). The plating part (8) is interposed between said heat-dissipating body (3) and said through hole (6), holds said heat-dissipating body (3) inside said through hole (6), and covers the entire surface of said heat-dissipating body (3).

Description

放熱基板及びその製造方法Heat dissipation board and manufacturing method thereof
　本発明は、例えば車両の電気的制御機器や家庭用機器やＬＥＤ部品又は産業用機器に使用される放熱基板及びその製造方法に関する。 The present invention relates to a heat dissipation board used for, for example, an electric control device for a vehicle, a household device, an LED component, or an industrial device, and a manufacturing method thereof.
　プリント基板に実装される電子部品においては、半導体素子のように発熱する部品があり、これを効果的に冷却する必要がある。発熱部品としては例えばＩＧＢＴ(Insulated Gate Bipolar Transistor)やＩＰＭ(Intelligent Power Module)等のスイッチング素子がある。このスイッチング素子から発生する熱を基板の背面側（部品搭載面とは反対側）に伝導し、背面側にてヒートシンク等を用いて冷却する技術が知られている（例えば特許文献１参照）。 There are electronic components mounted on a printed circuit board that generate heat, such as semiconductor elements, and it is necessary to effectively cool them. Examples of the heat generating component include switching elements such as an IGBT (Insulated Gate Bipolar Transistor) and an IPM (Intelligent Power Module). A technique is known in which heat generated from the switching element is conducted to the back side of the substrate (opposite to the component mounting surface) and cooled using a heat sink or the like on the back side (see, for example, Patent Document 1).
特開２００９-１７０４９３号公報JP 2009-170493 A
　特許文献１に代表されるように、放熱のためには基板に伝熱部材を挿通し、これを部品と接続して部品から発生する熱を伝熱部材（例えば柱状の銅）を介して外部に放熱している。しかしながら、この伝熱部材は基板に設けた貫通孔に対して圧入することにより装着される。このように伝熱部材を圧入すると、圧入に伴って応力が生じ、貫通孔やその周辺に損傷（例えばクラック等）を与えるおそれがある。 As represented by Patent Document 1, for heat radiation, a heat transfer member is inserted into a substrate, and this is connected to a component, and heat generated from the component is externally transmitted through the heat transfer member (for example, columnar copper). The heat is dissipated. However, this heat transfer member is mounted by being press-fitted into a through hole provided in the substrate. When the heat transfer member is press-fitted in this manner, stress is generated along with the press-fitting, and there is a possibility that damage (for example, a crack or the like) may be caused in the through hole or its periphery.
　本発明は、上記従来技術を考慮したものであり、基板に対して損傷を与えることなく放熱特性を確保することができる放熱基板及びその製造方法を提供することを目的とする。 The present invention has been made in consideration of the above prior art, and an object of the present invention is to provide a heat dissipation board capable of ensuring heat dissipation characteristics without damaging the board, and a method for manufacturing the same.
　前記目的を達成するため、本発明では、絶縁樹脂材料からなる絶縁層と、導電材料からなる導電層と、前記絶縁層及び前記導電層からなる基板本体と、該基板本体を貫通する貫通孔と、該貫通孔内に収容されている伝熱材料からなる放熱体と、前記放熱体が前記貫通孔内に配された状態でめっき処理を施して形成されためっき部とを備え、前記めっき部は、前記放熱体と前記貫通孔との間に介在されて前記放熱体を前記貫通孔内に保持し、且つ前記放熱体の全表面を覆っていることを特徴とする放熱基板を提供する。 In order to achieve the object, in the present invention, an insulating layer made of an insulating resin material, a conductive layer made of a conductive material, a substrate body made of the insulating layer and the conductive layer, and a through-hole penetrating the substrate body, A heat dissipating body made of a heat transfer material accommodated in the through hole, and a plating part formed by performing a plating process in a state where the heat dissipating element is disposed in the through hole. Is provided between the heat radiating body and the through hole, holds the heat radiating body in the through hole, and covers the entire surface of the heat radiating body.
　好ましくは、前記放熱体の外径は前記貫通孔の内径より小さく、前記放熱体の厚みは前記基板本体の厚み以下である。 Preferably, an outer diameter of the heat radiating body is smaller than an inner diameter of the through hole, and a thickness of the heat radiating body is equal to or less than a thickness of the substrate body.
　好ましくは、前記めっき部は前記基板本体の表面を覆う本体被覆領域と前記放熱体の表面を覆う放熱体被覆領域とを有し、前記放熱体被覆領域の外表面は、前記本体被覆領域の外表面と面一に形成されている。 Preferably, the plating part has a main body covering region covering the surface of the substrate body and a heat dissipating member covering region covering the surface of the heat dissipating body, and the outer surface of the heat dissipating member covering region is outside the main body covering region. It is formed flush with the surface.
　また、本発明では、前記絶縁層と前記導電層とを積層して前記基板本体を形成する基板本体形成工程と、前記基板本体に前記貫通孔を形成する貫通孔形成工程と、前記基板本体にめっき処理を施して前記基板本体の表面及び前記貫通孔の内壁面にめっき膜を形成する第１のめっき工程と、前記貫通孔内に前記放熱体を配し、前記放熱体が前記めっき膜に非接触の状態で、前記基板本体の表面、前記放熱体の全表面、及び前記放熱体と前記貫通孔との間に前記めっき部をめっき処理にて形成する第２のめっき工程とを備えたことを特徴とする放熱基板の製造方法も提供する。 In the present invention, the substrate body forming step of forming the substrate body by laminating the insulating layer and the conductive layer, the through hole forming step of forming the through hole in the substrate body, and the substrate body A first plating step of forming a plating film on the surface of the substrate body and the inner wall surface of the through hole by performing a plating process; and disposing the heat radiator in the through hole, and the heat radiator on the plating film In a non-contact state, the surface of the substrate body, the entire surface of the radiator, and a second plating step of forming the plating portion by plating treatment between the radiator and the through hole. Also provided is a method for manufacturing a heat dissipation board.
　本発明によれば、貫通孔に対する放熱体の保持をめっき部によって行う。このため、放熱体を貫通孔に圧入する必要がなくなるので基板に対して損傷を与えることなく放熱特性を確保することができる。 According to the present invention, the radiator is held with respect to the through hole by the plating portion. For this reason, since it is not necessary to press-fit the heat radiating body into the through hole, the heat radiation characteristics can be ensured without damaging the substrate.
本発明に係る放熱基板の概略図である。It is the schematic of the heat sink which concerns on this invention. 本発明に係る放熱基板の製造方法を順番に説明する概略図である。It is the schematic explaining the manufacturing method of the heat sink which concerns on this invention in order. 本発明に係る放熱基板の製造方法を順番に説明する概略図である。It is the schematic explaining the manufacturing method of the heat sink which concerns on this invention in order. 本発明に係る放熱基板の製造方法を順番に説明する概略図である。It is the schematic explaining the manufacturing method of the heat sink which concerns on this invention in order. 本発明に係る放熱基板の製造方法を順番に説明する概略図である。It is the schematic explaining the manufacturing method of the heat sink which concerns on this invention in order.
　図１に示すように、本発明に係る放熱基板１は、基板本体２と放熱体３とを備えている。基板本体２は板形状であり、絶縁層４と導電層５とが積層されて形成されている。絶縁層４は絶縁樹脂材料からなり、例えばプリプレグである。導電層５は導電材料からなり、例えば銅である。基板本体２はこの絶縁層４と導電層５とを積層していれば、その積層枚数は適宜選択可能である。例えば、図１では導電層５を４枚、この導電層５の間に絶縁層４を３枚介在させている。 As shown in FIG. 1, a heat dissipation board 1 according to the present invention includes a substrate body 2 and a heat dissipation body 3. The substrate body 2 has a plate shape and is formed by laminating an insulating layer 4 and a conductive layer 5. The insulating layer 4 is made of an insulating resin material, for example, a prepreg. The conductive layer 5 is made of a conductive material, for example, copper. As long as the insulating layer 4 and the conductive layer 5 are stacked on the substrate body 2, the number of stacked layers can be selected as appropriate. For example, in FIG. 1, four conductive layers 5 are interposed, and three insulating layers 4 are interposed between the conductive layers 5.
　基板本体２には貫通孔６が形成されている。貫通孔６は例えばドリルやレーザ等を用いて穿設される。貫通孔６が設けられた状態で、基板本体２の表面及び貫通孔６の内壁面にはめっき処理が施され、めっき膜７が形成される。めっき膜７は基板本体２及び貫通孔６の全面を覆うため、外形としてはめっき膜７で覆われても基板本体２及び貫通孔６は略同一である。したがって、基板本体２の表面や貫通孔６の内壁面に対してめっき膜７が介在した状態でも基板本体２の表面、貫通孔６の内壁面と称する場合がある。 A through hole 6 is formed in the substrate body 2. The through hole 6 is drilled using, for example, a drill or a laser. In the state where the through hole 6 is provided, the surface of the substrate body 2 and the inner wall surface of the through hole 6 are plated to form the plating film 7. Since the plating film 7 covers the entire surface of the substrate body 2 and the through-hole 6, the substrate body 2 and the through-hole 6 are substantially the same even when covered with the plating film 7 as the outer shape. Therefore, the surface of the substrate body 2 and the inner wall surface of the through hole 6 may be referred to even when the plating film 7 is interposed on the surface of the substrate body 2 or the inner wall surface of the through hole 6.
　貫通孔６内には放熱体３が収容されている。放熱体３は例えば銅等の伝熱性を有する金属材料にて形成されている。放熱体３と貫通孔６との間にはめっき部８が介在している。このめっき部８は、放熱体３が貫通孔６内に配された状態でめっき処理されて形成されたものである。したがって、放熱体３と貫通孔６との間以外に、基板本体２及び放熱体３の表面にもめっき部８は形成されている。このめっき部８によって放熱体３の全表面は覆われている。めっき部８は貫通孔６の内壁面にも接している（正確にはめっき膜７を介して貫通孔６の内壁面にも接している）ことから、放熱体３はめっき部８を介して基板本体２に確実に保持されることになる。このめっき部８が放熱体３の両面（放熱基板１の基板面）も覆うことにより、保持が確実なものとなる。さらに、放熱基板１を搬送するときなども放熱体３の保護を図ることができる。 The heat radiator 3 is accommodated in the through hole 6. The radiator 3 is made of a metal material having heat conductivity such as copper. A plated portion 8 is interposed between the radiator 3 and the through hole 6. The plated portion 8 is formed by plating in a state in which the heat radiating body 3 is disposed in the through hole 6. Therefore, the plating part 8 is also formed on the surfaces of the substrate body 2 and the radiator 3 other than between the radiator 3 and the through hole 6. The plated part 8 covers the entire surface of the radiator 3. Since the plating part 8 is also in contact with the inner wall surface of the through-hole 6 (more precisely, it is also in contact with the inner wall surface of the through-hole 6 via the plating film 7), the heat radiator 3 passes through the plating part 8. The substrate body 2 is securely held. The plated portion 8 covers both surfaces of the heat radiating body 3 (the substrate surface of the heat radiating substrate 1), so that the holding is ensured. Furthermore, the heat radiating body 3 can be protected also when the heat radiating board 1 is transported.
　なお、放熱体３の外径Ａは貫通孔６（図１の例ではめっき膜７で形成された貫通孔）の内径Ｂよりも小さい。これにより、放熱体３は貫通孔６（図１の例ではめっき膜７で形成された貫通孔）に圧入されることなく貫通孔６内に収容される。したがって、基板本体２に対して損傷を与えることなく放熱特性を確保することができる。さらに、放熱体３の厚みＣは基板本体２の厚み（図１の例ではめっき膜７を含む厚み）Ｄ以下である。これにより、放熱体３が基板本体２の表面から突出することを防止でき、放熱基板１の平滑性が保たれる。なお、放熱体３は平面視が円の円柱状であってもよいし、矩形の角柱状であってもよい。あるいは、その他の形状であってもよい。放熱体３の最外縁が貫通孔６に非接触であればどのような形状でも採用可能である。 In addition, the outer diameter A of the radiator 3 is smaller than the inner diameter B of the through hole 6 (the through hole formed by the plating film 7 in the example of FIG. 1). Thereby, the heat radiator 3 is accommodated in the through-hole 6 without being press-fitted into the through-hole 6 (through-hole formed by the plating film 7 in the example of FIG. 1). Therefore, the heat dissipation characteristics can be ensured without damaging the substrate body 2. Furthermore, the thickness C of the radiator 3 is equal to or less than the thickness D of the substrate body 2 (thickness including the plating film 7 in the example of FIG. 1). Thereby, it can prevent that the thermal radiation body 3 protrudes from the surface of the board | substrate body 2, and the smoothness of the thermal radiation board | substrate 1 is maintained. The radiator 3 may have a circular cylindrical shape in plan view or a rectangular prism shape. Alternatively, other shapes may be used. Any shape can be adopted as long as the outermost edge of the radiator 3 is not in contact with the through hole 6.
　また、めっき部８は基板本体２の表面を覆う本体被覆領域９と放熱体３の表面を覆う放熱体被覆領域１０とを有している。上述したように、放熱体３の厚みＣが基板本体２の厚みＤ以下であることと相俟って、放熱体被覆領域１０の外表面は本体被覆領域９の外表面と面一に形成されている。このように放熱体３を収容してめっき部８を形成しても放熱体被覆領域１０が突出することを防止できる。なお、図示はしないが本体被覆領域９と放熱体被覆領域１０との間には段差を形成し、この段差を介して放熱体被覆領域１０を本体被覆領域９よりも基板本体２側（下側）に形成してもよい。 The plating unit 8 has a main body covering region 9 that covers the surface of the substrate main body 2 and a radiator covering region 10 that covers the surface of the radiator 3. As described above, in combination with the thickness C of the radiator 3 being equal to or less than the thickness D of the substrate body 2, the outer surface of the radiator covering region 10 is formed flush with the outer surface of the body covering region 9. ing. Thus, even if the radiator 3 is accommodated and the plated portion 8 is formed, the radiator covering region 10 can be prevented from protruding. Although not shown, a step is formed between the main body covering region 9 and the radiator covering region 10, and the radiator covering region 10 is placed on the substrate main body 2 side (lower side) from the main body covering region 9 through this step. ).
　なお、放熱基板１に対して電気又は電子的な部品を搭載した場合には、形成されるパターンに影響を与えないように適宜めっき部８は加工される。好ましい部品の搭載形態は、例えば放熱体３の直上に部品が配され、部品と放熱体３とは伝熱性を有する樹脂又は伝熱シートで接触しているものである。このとき、さらに好ましくは、導電層５が接地用、すなわち接地された他の放熱部品と接触している。また好ましくは、放熱体３が接地されている。 In addition, when an electrical or electronic component is mounted on the heat dissipation substrate 1, the plating portion 8 is appropriately processed so as not to affect the formed pattern. A preferred component mounting form is, for example, in which a component is disposed immediately above the radiator 3, and the component and the radiator 3 are in contact with a heat-conductive resin or heat transfer sheet. At this time, more preferably, the conductive layer 5 is in contact with another radiating component for grounding, that is, grounded. Preferably, the radiator 3 is grounded.
　次に放熱基板１の製造方法について説明する。
　図２に示すように、まず基板本体形成工程を行う。この工程では、絶縁層４と導電層５とを積層して基板本体２を形成する。図２の例では、導電層５を４枚、絶縁層４を３枚交互に積層している。次に図３に示すように、貫通孔形成工程を行う。この工程では、基板本体２に貫通孔６を形成する。この貫通孔６は上述したようにドリルやレーザ等を用いて穿設される。 Next, a method for manufacturing the heat dissipation substrate 1 will be described.
As shown in FIG. 2, a substrate body forming process is first performed. In this step, the substrate body 2 is formed by laminating the insulating layer 4 and the conductive layer 5. In the example of FIG. 2, four conductive layers 5 and three insulating layers 4 are alternately stacked. Next, as shown in FIG. 3, a through hole forming step is performed. In this step, the through hole 6 is formed in the substrate body 2. The through hole 6 is drilled using a drill, a laser, or the like as described above.
　次に図４に示すように、第１のめっき工程を行う。この工程では、貫通孔６が形成された基板本体２に対してめっき処理を施す。このめっき処理は基板本体２の全表面に対して施されるため、めっき処理によって析出するめっき膜７は、基板本体２の両面と貫通孔６の内壁面に形成される。 Next, as shown in FIG. 4, a first plating step is performed. In this step, a plating process is performed on the substrate body 2 in which the through holes 6 are formed. Since this plating process is performed on the entire surface of the substrate body 2, the plating film 7 deposited by the plating process is formed on both surfaces of the substrate body 2 and the inner wall surface of the through hole 6.
　そして、図５に示すように、第２のめっき工程を行う。この工程では、放熱体３を貫通孔内に配した状態でめっき処理を施す。すなわち、基板本体２は、放熱体３を基板本体２の貫通孔６内に保持した状態でめっき槽内に浸漬される。このめっき処理の際、放熱体３はめっき膜７に対して例えば非接触とされる。したがって析出するめっき金属からなるめっき部８は、基板本体２の表面（両面）及び放熱体３の全表面に形成される。放熱体３の全表面にめっき部８が形成することから、当然に放熱体３と貫通孔６との間にもめっき部８が形成されることになる。これにより、図１で示すような放熱基板１が製造される。放熱体３はめっき部８により基板本体２に固定保持される。この保持は金属のめっき部８によりなされるために放熱体３による放熱特性に影響を与えることはない。 Then, as shown in FIG. 5, the second plating step is performed. In this step, the plating process is performed in a state where the radiator 3 is disposed in the through hole. That is, the substrate body 2 is immersed in the plating tank with the radiator 3 held in the through hole 6 of the substrate body 2. During the plating process, the radiator 3 is not contacted with the plating film 7, for example. Therefore, the plating portion 8 made of the plating metal to be deposited is formed on the surface (both sides) of the substrate body 2 and the entire surface of the heat radiating body 3. Since the plated portion 8 is formed on the entire surface of the heat radiator 3, the plated portion 8 is naturally formed between the heat radiator 3 and the through hole 6. Thereby, the heat dissipation substrate 1 as shown in FIG. 1 is manufactured. The radiator 3 is fixed and held on the substrate body 2 by the plating portion 8. Since this holding is performed by the metal plating portion 8, it does not affect the heat dissipation characteristics of the heat radiator 3.
　第２のめっき工程の際、液流や重力により放熱体３が貫通孔６（めっき膜７）から出てしまうことがある。これを防止するため、受け板１１、１２を基板本体２の上方又は下方、若しくはその両方に配してもよい。受け板１１はメッシュ状あるいは多孔形状に形成され、めっき液の流通が阻害されないような形状を有している。受け板１１は、平面視にて放熱体３の外縁より狭い径の貫通孔１３をさらに備えている。この貫通孔１３を設けることにより、放熱体３に対してめっきを良好に析出させることができる。受け板１１の下方には、さらにメッシュ状あるいは多孔形状に形成された受け板１２が配されている。このような受け板１１、１２を配することで、放熱体３がめっき処理中に貫通孔６から出てしまうことが防止される。なお、受け板１１及び１２はいずれか１枚のみ用いることも可能である。 During the second plating step, the radiator 3 may come out of the through hole 6 (plating film 7) due to liquid flow or gravity. In order to prevent this, the receiving plates 11 and 12 may be arranged above or below the substrate body 2 or both. The backing plate 11 is formed in a mesh shape or a porous shape, and has a shape that does not hinder the flow of the plating solution. The receiving plate 11 further includes a through-hole 13 having a diameter narrower than the outer edge of the radiator 3 in plan view. By providing this through hole 13, plating can be favorably deposited on the radiator 3. Below the receiving plate 11, a receiving plate 12 formed in a mesh shape or a porous shape is further arranged. By arranging such receiving plates 11 and 12, it is possible to prevent the radiator 3 from coming out of the through hole 6 during the plating process. Note that only one of the receiving plates 11 and 12 can be used.
１：放熱基板、２：基板本体、３：放熱体、４：絶縁層、５：導電層、６：貫通孔、７：めっき膜、８：めっき部、９：本体被覆領域、１０：放熱体被覆領域、１１：受け板、１２：受け板、１３：貫通孔 1: heat radiating substrate, 2: substrate main body, 3: heat radiating body, 4: insulating layer, 5: conductive layer, 6: through-hole, 7: plated film, 8: plated portion, 9: body covering region, 10: heat radiating body Covering area, 11: backing plate, 12: backing plate, 13: through hole

Claims (4)

  1. 　絶縁樹脂材料からなる絶縁層と、
    　導電材料からなる導電層と、
    　前記絶縁層及び前記導電層からなる基板本体と、
    　該基板本体を貫通する貫通孔と、
    　該貫通孔内に収容されている伝熱材料からなる放熱体と、
    　前記放熱体が前記貫通孔内に配された状態でめっき処理を施して形成されためっき部と
    を備え、
    　前記めっき部は、前記放熱体と前記貫通孔との間に介在されて前記放熱体を前記貫通孔内に保持し、且つ前記放熱体の全表面を覆っていることを特徴とする放熱基板。     An insulating layer made of an insulating resin material;
    A conductive layer made of a conductive material;
    A substrate body comprising the insulating layer and the conductive layer;
    A through hole penetrating the substrate body;
    A radiator made of a heat transfer material housed in the through hole;
    A plating portion formed by performing a plating process in a state in which the radiator is disposed in the through hole,
    The heat dissipating board, wherein the plating portion is interposed between the heat dissipating body and the through hole, holds the heat dissipating body in the through hole, and covers the entire surface of the heat dissipating body.
  2. 　前記放熱体の外径は前記貫通孔の内径より小さく、前記放熱体の厚みは前記基板本体の厚み以下であることを特徴とする請求項１に記載の放熱基板。 The heat dissipation board according to claim 1, wherein an outer diameter of the heat dissipation body is smaller than an inner diameter of the through hole, and a thickness of the heat dissipation body is equal to or less than a thickness of the substrate body.
  3. 　前記めっき部は前記基板本体の表面を覆う本体被覆領域と前記放熱体の表面を覆う放熱体被覆領域とを有し、
    　前記放熱体被覆領域の外表面は、前記本体被覆領域の外表面と面一に形成されていることを特徴とする請求項２に記載の放熱基板。     The plating section has a main body covering region that covers the surface of the substrate main body and a radiator covering region that covers the surface of the radiator.
    The heat dissipation substrate according to claim 2, wherein an outer surface of the heat dissipating body covering region is formed flush with an outer surface of the main body covering region.
  4. 　前記絶縁層と前記導電層とを積層して前記基板本体を形成する基板本体形成工程と、
    　前記基板本体に前記貫通孔を形成する貫通孔形成工程と、
    　前記基板本体にめっき処理を施して前記基板本体の表面及び前記貫通孔の内壁面にめっき膜を形成する第１のめっき工程と、
    　前記貫通孔内に前記放熱体を配し、前記放熱体が前記めっき膜に非接触の状態で、前記基板本体の表面、前記放熱体の全表面、及び前記放熱体と前記貫通孔との間に前記めっき部をめっき処理にて形成する第２のめっき工程と
    を備えたことを特徴とする請求項１に記載の放熱基板の製造方法。     A substrate body forming step of forming the substrate body by laminating the insulating layer and the conductive layer;
    A through hole forming step of forming the through hole in the substrate body;
    A first plating step of plating the substrate body to form a plating film on the surface of the substrate body and the inner wall surface of the through hole;
    The heat dissipating body is disposed in the through hole, and the heat dissipating body is not in contact with the plating film, and the surface of the substrate body, the entire surface of the heat dissipating body, and between the heat dissipating body and the through hole. The method for manufacturing a heat dissipation substrate according to claim 1, further comprising: a second plating step for forming the plating portion by plating.
PCT/JP2013/055833 2013-03-04 2013-03-04 Heat-dissipating substrate and method for producing same WO2014136175A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/055833 WO2014136175A1 (en) 2013-03-04 2013-03-04 Heat-dissipating substrate and method for producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/055833 WO2014136175A1 (en) 2013-03-04 2013-03-04 Heat-dissipating substrate and method for producing same

Publications (1)

Publication Number Publication Date
WO2014136175A1 true WO2014136175A1 (en) 2014-09-12

Family

ID=51490744

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/055833 WO2014136175A1 (en) 2013-03-04 2013-03-04 Heat-dissipating substrate and method for producing same

Country Status (1)

Country Link
WO (1) WO2014136175A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015133373A (en) * 2014-01-10 2015-07-23 株式会社デンソー Circuit board and electronic device
CN108184308A (en) * 2018-01-16 2018-06-19 生益电子股份有限公司 The manufacturing method and PCB of a kind of PCB
JPWO2017119248A1 (en) * 2016-01-07 2018-10-04 株式会社村田製作所 Multilayer substrate, electronic device, and method for manufacturing multilayer substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697331A (en) * 1992-07-15 1994-04-08 Motorola Inc Pad-array semiconductor provided with heat conductor and its manufacture
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2010219280A (en) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The Electronic substrate
JP2011210795A (en) * 2010-03-29 2011-10-20 Sumitomo Bakelite Co Ltd Laminated board, method of manufacturing the same, printed-wiring board, and semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697331A (en) * 1992-07-15 1994-04-08 Motorola Inc Pad-array semiconductor provided with heat conductor and its manufacture
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2010219280A (en) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The Electronic substrate
JP2011210795A (en) * 2010-03-29 2011-10-20 Sumitomo Bakelite Co Ltd Laminated board, method of manufacturing the same, printed-wiring board, and semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015133373A (en) * 2014-01-10 2015-07-23 株式会社デンソー Circuit board and electronic device
JPWO2017119248A1 (en) * 2016-01-07 2018-10-04 株式会社村田製作所 Multilayer substrate, electronic device, and method for manufacturing multilayer substrate
CN108184308A (en) * 2018-01-16 2018-06-19 生益电子股份有限公司 The manufacturing method and PCB of a kind of PCB
CN108184308B (en) * 2018-01-16 2020-06-26 生益电子股份有限公司 PCB manufacturing method and PCB

Similar Documents

Publication Publication Date Title
TWI501716B (en) Method of fabricating heat dissipating board
CN105472865B (en) Circuit board including heat transfer structure
JP2010263003A (en) Heat-conducting structure of printed board
JP2012244172A (en) Systems for circuit board heat transfer and method of assembling the same
JP6169694B2 (en) Heat dissipation board and manufacturing method thereof
CN108990254B (en) Printed circuit board with built-in longitudinal heat dissipation ceramic block and circuit assembly with same
JP6249931B2 (en) Circuit board, circuit board heat dissipation structure, and circuit board manufacturing method
JP5191925B2 (en) Laminated circuit board with heat dissipation pattern and heat dissipation pattern forming method
WO2014136175A1 (en) Heat-dissipating substrate and method for producing same
TW201630496A (en) Printed circuit board with heat radiation structure and method manufacturing same
JP2012230937A (en) Circuit board
JP6381488B2 (en) Circuit board
JP6587796B2 (en) Circuit module
JP2006019660A (en) Circuit board for surface mounting of power element
WO2015098502A1 (en) Electronic device
KR20100125082A (en) Metal core pcb
JP6311081B2 (en) Substrate and substrate manufacturing method
KR20150052496A (en) Method for forming via fill of circuit board
KR20110057712A (en) Heat dissipating circuit board and method for manufacturing the same
JP2018063992A (en) Electronic circuit device
KR102351183B1 (en) Heat radiating type printed circuit board and manufacturing method thereof
JP2014179523A (en) Substrate unit
JP2022097774A (en) Printed board
JP2013089851A (en) Multilayer circuit board
JP2009026943A (en) Semiconductor device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13876892

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13876892

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP