JP2012233790A - Device and method for inspecting photo-curable resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for inspecting photo-curable resin which simply detect a minute amount of the photo-curable resin with high sensitivity.SOLUTION: The device for inspecting photo-curable resin is used to inspect the photo-curable resin in an inspection object, and includes a pulse light source 1, and a streak camera 7. The pulse light source 1 radiates UV pulsed light to a printed circuit board 5. The streak camera 7 detects fluorescent light generated from a residual of a solder resist 53 at a UV radiated portion of the printed circuit board 5, at a time point delayed more than the pulse width of the UV light radiated by the pulse light source 1.

Description

  The present invention relates to a photocurable resin inspection apparatus and inspection method.

  An example of a product using a photo-curable resin is a printed wiring board. In the formation of this printed wiring board, for example, a conductor wiring is formed on a glass epoxy resin substrate by Cu (copper) plating or the like. Then, the surface of the conductor wiring other than the electrode terminal portion for soldering is covered with an insulating photocurable resin called a solder resist so as not to be soldered. At the time of component mounting, the exposed electrode terminal portion and the electrode portion of the electronic component are bonded to each other using solder.

  In general, the surface of the electrode terminal portion is subjected to Cu plating, Au (gold) plating, etc., the component electrode and the lead wire are subjected to Au plating, Sn (tin) plating, etc., and the electrode is made of SnAgCu solder or the like. Component electrodes and lead wires are electrically joined to the terminal portion.

  At the time of component mounting, heating for a predetermined time is performed at a temperature exceeding the melting point of the solder, and the above-described electrical joining is obtained. That is, for example, Cu of the electrode terminal and Sn in the solder form an intermetallic compound, whereby mechanical strength and electrical connection are obtained.

  However, if foreign matter adheres to the surface of the electrode terminal portion, the production of intermetallic compounds is hindered, and neither mechanical strength nor electrical connection can be obtained, resulting in malfunction. The most common foreign substance in this case is a solder resist that covers the wiring portion so that solder is not attached.

  The solder resist is a photocurable resin or a mixture of a photocurable resin and a thermosetting resin. As a solder resist pattern formation using a photocurable resin, a so-called photographic method is generally used, and a desired resist pattern is obtained by applying, exposing and developing the resist. In this case, the resist is uniformly applied to the entire surface including the electrode terminal portions used for soldering, and unnecessary portions of the resist are removed by exposure and development.

  However, the resist may be thermally cured before development, or the development may be insufficient, and thus the resist to be removed may remain on the surface of the electrode terminal portion. In that case, since the above-mentioned solder joint defect arises, it is necessary to detect such a printed wiring board as a defective product.

  A technique for inspecting a printed wiring board is disclosed in, for example, Japanese Patent Publication No. 63-19855 (see Patent Document 1). The technique described in this publication uses ultraviolet light or blue light as an inspection light source, and inspects a wiring pattern of a printed wiring board. Since the resin substrate other than the wiring pattern formed of copper emits fluorescence when irradiated with light from the inspection light source, pattern inspection is performed by imaging the fluorescent pattern.

  Further, a technique for detecting fluorescence generated by irradiating a measurement object with pulsed laser light is disclosed in, for example, Japanese Patent Application Laid-Open No. 2006-242595 (see Patent Document 2). In order to analyze the concentration of halides such as PCB (PolyChlorinated Biphenyl) in oil, the technique described in this publication irradiates the oil containing organic halides into oil droplets or mists and irradiates with pulsed laser light. The fluorescence generated by the irradiation is detected.

Japanese Patent Publication No. 63-19855 JP 2006-242595 A

  However, although the intensity of the ultraviolet light used as the light source is high, the intensity of the fluorescence emitted by the remaining solder resist is weak, and therefore, there is a problem that it is difficult to detect the fluorescence because it is disturbed by the strong ultraviolet light.

  This invention is made | formed in view of said subject, The objective is providing the inspection apparatus and inspection method of photocurable resin which can detect a trace amount photocurable resin highly sensitively and simply. is there.

  The inspection apparatus for photocurable resin of the present invention is an inspection apparatus for inspecting a photocurable resin in an inspection object, and includes a light source and a detection unit. The light source is for irradiating the inspection object with pulsed ultraviolet light. The detection unit is for detecting fluorescence generated from the photocurable resin of the ultraviolet light irradiation unit in the inspection object at a time later than the width of the pulse of the ultraviolet light irradiated from the light source.

  The inspection method for a photocurable resin of the present invention is an inspection method for inspecting a photocurable resin in an inspection object, and includes the following steps.

  First, pulsed ultraviolet light is irradiated to the inspection object. And the fluorescence which arises from the photocurable resin of the irradiation part of the ultraviolet light in a test object is detected in the time delayed rather than the width | variety of the pulse of the ultraviolet light irradiated from a light source.

  According to the photocurable resin inspection apparatus and inspection method of the present invention, the fluorescence generated from the photocurable resin of the ultraviolet light irradiation portion of the inspection object is delayed from the width of the ultraviolet light pulse irradiated from the light source. Detected at the time. In other words, even if the irradiation with ultraviolet light is interrupted, only the fluorescence can be detected separately from the irradiation light from the light source by utilizing the property of fluorescence that continues to emit light. Thereby, since fluorescence can be detected without being disturbed by strong ultraviolet light, it is possible to detect fluorescence by detecting fluorescence with high sensitivity and ease without attenuating irradiation light.

  As described above, according to the present invention, it is possible to obtain a photocurable resin inspection apparatus and inspection method capable of easily detecting a small amount of a photocurable resin with high sensitivity.

It is a figure which shows typically the structure of the test | inspection apparatus in Embodiment 1 of this invention. It is a partial expanded sectional view which shows roughly the structure of the printed wiring board which is an example of a measuring object. It is a partial expanded sectional view which shows a mode that the lead wire was joined to the printed wiring board shown in FIG. 2 with the solder. It is a figure for demonstrating measuring the fluorescence which arises from an irradiation part in the time delayed from the pulse width of ultraviolet light, Comprising: The figure (A) which shows ON / OFF of ultraviolet light, and fluorescence emission, non-emission FIG. It is a figure which shows typically the structure of the inspection apparatus in Embodiment 2 of this invention. It is a figure which shows typically the structure of the test | inspection apparatus in Embodiment 3 of this invention. It is a figure which shows typically the structure of the test | inspection apparatus in Embodiment 4 of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, the configuration of the inspection apparatus according to the present embodiment will be described with reference to FIG.

  Referring to FIG. 1, an inspection apparatus according to the present embodiment includes a pulse light source (light source) 1, a beam splitter 2, a signal trigger 3, a condenser lens 4, a camera lens 6, and a streak camera (detection unit). ) 7 mainly.

  The pulse light source 1 irradiates, for example, picosecond order pulsed ultraviolet light (flashing ultraviolet light), and is a picosecond pulse LED (Light Emitting Diode) or the like. The beam splitter 2 is arranged to separate the ultraviolet light emitted from the pulse light source 1 into excitation light and trigger light source. The condensing lens 4 is disposed so as to condense the excitation light onto an inspection location (irradiation portion) such as an electrode pad of the printed wiring board 5 which is an example of the inspection object. The camera lens 6 is disposed so as to collect the light emitted from the inspection location when the printed wiring board 5 is irradiated with pulsed light and introduce it to the streak camera 7. The signal trigger 3 is arranged to introduce a trigger light source into the streak camera 7. The streak camera 7 can perform time-resolved measurement on the order of picoseconds, for example, and can measure the amount of light after, for example, several hundred picoseconds after irradiation with pulsed light.

Next, the inspection method of this embodiment will be described with reference to FIGS.
With reference to FIG. 2, first, a printed wiring board 5 is prepared as an example of a measurement object. The printed wiring board 5 mainly includes a substrate 51, a conductor wiring 52, and a solder resist 53. The substrate 51 is made of a thermosetting resin, for example, glass epoxy resin. The conductor wiring 52 is formed on one surface 51a and the other surface 51b of the substrate 51 by Cu plating or the like. The solder resist 53 is an insulating resin such as an ultraviolet light curable resin, for example, an acrylic resin, and more specifically, a solder resist manufactured by solar ink: PSR-4000. The solder resist 53 covers the surfaces of the conductor wiring 52 and the substrate 51 except for the electrode terminal portions and through-hole lands for soldering the conductor wiring 52.

  In FIG. 2, a through-hole land 52b is shown, and this through-hole land 52b has a shape extending annularly around a through-hole 51A that penetrates the substrate 51, on one surface 51a and the other. Each is formed on the surface 51b. The through hole land 52b on the one surface 51a and the through hole land 52b on the other surface 51b are electrically connected by a cylindrical portion 52c of the conductor wiring 52 formed on the inner peripheral surface of the through hole 51A. A wiring portion 52a of the conductor wiring 52 is connected to the outer peripheral portion of the through-hole land 52b.

  As shown in FIG. 3, the lead portion 61 is joined to the through-hole land 52b by the solder 62 in a state where the lead portion 61 is inserted into the through-hole 51A. When this component is mounted, heating for a predetermined time is performed at a temperature exceeding the melting point of the solder, so that Cu in the through-hole land 52b and Sn in the solder 62 form an intermetallic compound. And electrical connection is obtained.

  However, if foreign matter such as solder resist adheres to the surface of the through-hole land 52 (for example, the region R1 in FIG. 2), the formation of intermetallic compounds is hindered, and mechanical strength and electrical connection can be obtained. Cannot be performed, resulting in malfunction. Therefore, it is inspected by using the inspection apparatus of the present embodiment whether or not there is a residue of the solder resist generated when the solder resist 53 is formed.

  Referring to FIG. 1, printed wiring board 5 shown in FIG. 2, which is an example of the inspection object, is set in the inspection apparatus of the present embodiment. In this state, pulsed ultraviolet light of picosecond order is emitted from the pulse light source 1 to the printed wiring board 5. For example, ultraviolet light having a wavelength of 250 nm to 420 nm is emitted from a 355 nm picosecond pulse laser. The excitation light and the trigger light source are separated by the beam splitter 2, and the excitation light is condensed by the condensing lens 4 at inspection points such as electrode pads and through-hole lands on the printed wiring board. The light emitted from the inspection location during the irradiation of the pulsed ultraviolet light is introduced into the streak camera 7 using the camera lens 6. On the other hand, the trigger light source separated by the beam splitter 2 is guided to the streak camera 7 through the signal trigger 3.

  Here, when there is a trace amount of residue of the solder resist 53 in the opening of the solder resist 53 such as the electrode terminal portion of the printed wiring board 5 or the through-hole land 52b, the residue of the solder resist 53 is excited by ultraviolet light. Emits fluorescence. Fluorescence continues to emit with a nanosecond order lifetime after UV excitation.

  As shown in FIG. 4 (A), even after the irradiation of the ultraviolet light to the inspection location is turned off, the fluorescence continues to be emitted for a time Td (delay time) as shown in FIG. 4 (B). . That is, since the fluorescence continues to be emitted at a time Td delayed from the pulse width of the ultraviolet light emitted from the pulse light source 1, the fluorescence at the time Td is detected by the streak camera 7. In FIGS. 4A and 4B, the pulse waveform is represented by a rectangle for convenience of explanation so that the time delayed from the pulse width of the ultraviolet light is easy to understand. However, the pulse waveform is other Lorentz waveform. It may be.

  Since the streak camera 7 can perform time-resolved measurement on the order of picoseconds, the streak camera 7 can measure the amount of light after several hundred picoseconds after irradiation with pulsed light. For this reason, if there is no residue of photosensitive resin such as a resist at the inspection location, only the metal electrode is present, so that no fluorescence is emitted, and no light is detected after several hundred picoseconds of pulsed light irradiation. On the other hand, if there is a photosensitive resin residue at the inspection location, it emits fluorescence, so that fluorescence is detected even after several hundred picoseconds after pulse light irradiation.

Next, the effect of this Embodiment is demonstrated.
According to the present embodiment, as described above, the fluorescence generated from the ultraviolet light irradiation portion in the printed wiring board 5 is detected at the time Td delayed from the pulse width of the ultraviolet light irradiated from the pulse light source 1. That is, even if the irradiation of ultraviolet light to the printed wiring board 5 is interrupted, only the fluorescence can be detected separately from the irradiation light from the pulsed light source 1 by utilizing the property of fluorescence that continues to emit light. Thereby, since only fluorescence can be detected without being disturbed by strong ultraviolet light, measurement can be performed with sufficient sensitivity without using attenuated irradiation light and using a highly sensitive light meter. Therefore, even a very small amount of resist residue that cannot be confirmed visually or using an optical microscope can be detected. Further, it is possible to easily detect a small amount of resist remaining with high sensitivity and capable of in-line inspection.

  As a result, it is possible to reliably detect a small amount of solder resist remaining in the terminal portion of the printed wiring board 5 in the inspection after the development of the solder resist 53 and the appearance inspection, and the quality of shipped products can be improved. In addition, when used for forming a wiring pattern on the printed wiring board 5 or as a development remaining inspection during the manufacture of a semiconductor device, it is possible to prevent manufacturing defects and reduce manufacturing costs.

(Embodiment 2)
Referring to FIG. 5, the configuration of the inspection apparatus of the present embodiment is different from the configuration of the first embodiment shown in FIG. 1 in that a spectroscope 8 is added. The spectroscope 8 is for splitting light from the inspection location and introducing it into the streak camera 7. With this spectroscope 8, only the light having the fluorescence wavelength peculiar to the photosensitive resin (photo-curable resin) can be time-resolved and measured.

  In addition, since the structure other than this of this Embodiment is as substantially the same as the structure of Embodiment 1 mentioned above, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  There are many types of organic substances that emit fluorescence. However, according to the present embodiment, it is possible to detect only the fluorescence specific to the resist by spectroscopic measurement with the spectroscope 8, and it is possible to detect even weak fluorescence with high accuracy by measuring the integrated light quantity. Can be detected. As a result, it is possible to detect the residue of the solder resist with higher accuracy than in the first embodiment. Further, erroneous detection due to stray light or return light of excitation light can be eliminated.

(Embodiment 3)
Referring to FIG. 6, the printed wiring board inspection apparatus according to the present embodiment performs detection using a so-called pump-probe method in a fluorescence time-resolved measurement technique. The inspection apparatus according to the present embodiment includes a titanium: sapphire laser (light source) 10, beam splitters 11 and 18, an optical crystal 12, mirrors 14 and 15, lenses 16, 21 and 23, a sapphire substrate 17, It mainly has spectroscopes 24 and 26 and detectors (detection units) 25 and 27.

The titanium: sapphire laser 10 oscillates sub-picosecond pulsed light having a wavelength of about 800 nm. The beam splitter 11 is arranged to separate the pulse light emitted from the titanium: sapphire laser 10 into the pump light 13 and the probe light 19. The pump light 13 requires ultraviolet light. Therefore, the optical crystal 12 is, for example, a BBO (β-BaB ₂ O ₄ ) crystal, and obtains ultraviolet pulse light by obtaining a second harmonic or a third harmonic from the pulsed light emitted from the titanium: sapphire laser 10. Is for.

  The two mirrors 14 and 15 are installed on an automatic stage (not shown) that can move in the direction indicated by the thick arrow, and are configured so that the optical path length can be changed by moving in the direction of the arrow. ing. The lens 16 is arranged so as to irradiate the inspection site of the printed wiring board 22 with the pump light 13.

  The sapphire substrate 17 is capable of generating white light (pulse light in the visible range of 400 nm to 800 nm) by condensing the probe light 19. The beam splitter 18 is for further separating the probe light made of white light to obtain the reference light 20. The lens 21 is arranged so as to irradiate the inspection portion of the printed wiring board 5 with probe light made of white light.

  The lens 23 is arranged to guide the white light irradiated to the printed wiring board 5 to the spectroscope 24. The spectroscope 24 is for separating white light. The detector 25 is for measuring the intensity of the light split by the spectroscope 24.

  The spectroscope 26 is for splitting the reference light 20. The detector 27 is for measuring the intensity of the light split by the spectroscope 26.

Next, a method for inspecting a printed wiring board according to the present embodiment will be described.
First, for example, a printed wiring board 5 as shown in FIG. 2 is prepared. This printed wiring board 5 is set in the inspection apparatus of the present embodiment as shown in FIG. In this state, sub-picosecond pulsed light (pulse width 200 ps or less) having a wavelength of about 800 nm is oscillated from the titanium: sapphire laser 10 to the printed wiring board 5 after the solder resist 53 (FIG. 2) is formed. Since the pump light 13 requires ultraviolet light, ultraviolet pulse light can be obtained by obtaining a second harmonic or a third harmonic using the optical crystal 12 (for example, a BBO crystal). After the optical path length is appropriately adjusted by the two mirrors 14 and 15, the pump light 13 is irradiated to the inspection portion of the printed wiring board 5 by the lens 16.

  On the other hand, the probe light 19 is separated using the beam splitter 11. For example, when the probe light 19 is condensed on the sapphire substrate 17, white light is generated. The white light becomes pulse light in the visible range of 400 nm to 800 nm (pulse width 200 ps or less), is irradiated onto the inspection portion of the printed wiring board 22 by the lens 21, and is guided to the spectroscope 24 through the lens 23. The light intensity of the white light separated by the spectroscope 24 is measured by the detector 25. If there is a resist residue, the fluorescence specific to the resist should be detected.

  The probe light is further separated by the beam splitter 18 to obtain the reference light 20, so that fluctuations in the light intensity of the probe light intensity can be canceled and more sensitive fluorescence detection is possible. become.

  Also in the present embodiment, as in the first embodiment, the fluorescence generated from the ultraviolet light irradiation portion on the printed wiring board 5 is detected at a time delayed from the pulse width of the pulsed light. In other words, even if the irradiation of ultraviolet light to the printed wiring board 5 is interrupted, only the fluorescence can be detected separately from the irradiation light from the titanium: sapphire laser 10 by utilizing the property of fluorescence that continues to emit light. Thereby, since only fluorescence can be detected without being disturbed by strong ultraviolet light, measurement can be performed with sufficient sensitivity without using attenuated irradiation light and using a highly sensitive light meter. Therefore, even a very small amount of resist residue can be detected.

  In order to separate fluorescence from white light, the spectroscopes 24 and 26 in FIG. 6 are matched to the fluorescence wavelength, and the difference between the photon counters of the detectors 25 and 27 is taken. A variable filter such as a neutral density (ND) filter is incorporated on the reference light 20 side, and adjustment is performed so that the difference between the detectors 25 and 27 becomes zero. The difference signal is amplified through a lock-in amplifier or the like, so that a slight change in fluorescence can be measured with high sensitivity. In this case, it is necessary to provide an optical delay circuit on the side of the reference light 20 so that the detectors 25 and 27 can measure the same time optically.

(Embodiment 4)
Referring to FIG. 7, the inspection apparatus according to the present embodiment detects an unplated portion in a through hole of an inspection object such as a printed wiring board. The inspection apparatus of the present embodiment mainly has a pulse light source (light source) 1, a lens 28, optical fibers 29 and 32, an objective lens 31, a spectrometer 8, and a streak camera (detection unit) 7. doing.

  The pulse light source 1 irradiates, for example, picosecond order pulsed ultraviolet light (flashing ultraviolet light), and is a picosecond pulse LED or the like. The lens 28 is for introducing ultraviolet light emitted from the pulse light source 1 into the optical fiber 29. The optical fiber 29 is for guiding ultraviolet light to the printed wiring board 5 and irradiating the through holes 51A of the printed wiring board 5 with each other. The objective lens 31 is for collecting the light passing through the through hole 51 </ b> A and introducing it into the optical fiber 32. The optical fiber 32 is for guiding light to the spectrometer 8. The spectroscope 8 is for splitting the light. The streak camera 7 can perform time-resolved measurement on the order of picoseconds, for example, and can measure the amount of light after, for example, several hundreds of picoseconds after pulse light irradiation.

Next, a method for inspecting a printed wiring board according to the present embodiment will be described.
First, for example, a printed wiring board 5 as shown in FIG. 2 is prepared. This printed wiring board 5 is set in the inspection apparatus of the present embodiment as shown in FIG. In this state, pulsed ultraviolet light of picosecond order is emitted from the pulse light source 1 to the through hole 51A of the printed wiring board 5 after the solder resist 53 (FIG. 2) is formed. The ultraviolet light is guided to the lens 28 and the optical fiber 29 and irradiated to the inspection location in the through hole 51 on the printed wiring board 5. The light emitted from the inspection location during the irradiation of the pulsed ultraviolet light is condensed using the objective lens 31 and introduced into the optical fiber 32. The light is introduced into the spectroscope 8 by the optical fiber 32 and separated and then time-resolved and measured by the streak camera 7.

  Here, as shown in FIG. 2, the inner peripheral surface of the through-hole 51A is usually provided with copper plating 52c. However, a region where the copper plating 52c is not yet deposited may be generated in the region R2 due to a process abnormality or the like. . If the plating is not yet applied, the connection reliability when the lead portions are connected as shown in FIG. 3 is lowered.

  The substrate 51 made of resin is exposed at the plating-unattached portion in the through hole 51A. For this reason, by using the inspection apparatus of the present embodiment to irradiate the through-hole 51A with pulsed ultraviolet light in the order of picoseconds, an unattached portion is caused by the ultraviolet light passing through the through-hole 51A while being reflected in multiple stages. The exposed resin is excited to generate fluorescence. Since this fluorescence continues to emit with a lifetime of nanosecond order after ultraviolet excitation even after the pulsed light irradiation is interrupted, by detecting this fluorescence, it is possible to detect unattached plating in the through hole 51A. Is possible.

  Since the streak camera 7 can perform time-resolved measurement on the order of picoseconds, the streak camera 7 can measure the amount of light after several hundred picoseconds after irradiation with pulsed light. For this reason, if there is no unplated portion at the inspection location, only the copper plating 52c exists, so that no fluorescence is emitted, and no light is detected after several hundred picoseconds of pulsed light irradiation. On the other hand, if there is an unplated portion at the inspection location, fluorescence is emitted, and therefore fluorescence is detected even after several hundred picoseconds after pulse light irradiation.

  Also in the present embodiment, as in the first embodiment, the fluorescence generated from the ultraviolet light irradiation portion on the printed wiring board 5 is detected at a time delayed from the pulse width of the pulsed light. That is, even if the irradiation of ultraviolet light to the printed wiring board 5 is interrupted, only the fluorescence can be detected separately from the irradiation light from the pulsed light source 1 by utilizing the property of fluorescence that continues to emit light. Thereby, since only fluorescence can be detected without being disturbed by strong ultraviolet light, measurement can be performed with sufficient sensitivity without using attenuated irradiation light and using a highly sensitive light meter. Therefore, even a very small amount of unplated portion can be detected.

  Further, partial unattachment of the plating in the through hole 51A is electrically conductive, so it is difficult to detect by electrical inspection. For this reason, there is currently no simple detection method such as electrical detection by disconnecting plating by applying heat before electrical inspection. According to the present embodiment, it is possible to optically detect a non-deposited portion, so that it is possible to detect non-plating with higher accuracy than in a conventional electrical inspection.

  In the first to third embodiments, the solder resist ink used for the printed wiring board 5 as the resin to be inspected has been described. However, the present invention is not limited to this, and the liquid used for dry film resist and semiconductor manufacturing is not limited thereto. It can be applied to any resin as long as it is a photocurable resin such as a resist.

  Moreover, in said Embodiment 1-4, although the detector which has a time-resolving function was demonstrated as a detection part for measuring the fluorescence of the ultraviolet light irradiation part in the time delayed from pulse width, The detection unit is not limited to this, and may be one that measures fluorescence by a wavelength resolving method.

  In addition, the detector with time resolution function is a device that measures the temporal change of the detected light quantity with an ultra-high-speed detector by entering extreme pulsed light with a half-value width of several hundred femtoseconds, and is a general streak on the order of picoseconds. It may be a camera (for example, Hamamatsu C5680). The time resolution needs to be on the order of picoseconds shorter than the pulse width, and the measurement unit may be a photon counter in addition to the streak camera as long as it has an optical delay circuit as shown in FIG.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1 pulse light source, 2 beam splitter, 3 signal trigger, 4 condenser lens, 5 printed wiring board, 6 camera lens, 7 streak camera, 8 spectrometer, 10 pulse laser, 11 beam splitter, 12 optical crystal, 13 pump light, 14 mirror, 15 mirror, 16 condenser lens, 17 sapphire substrate, 18 beam splitter, 19 probe light, 20 reference light, 21 lens, 23 lens, 24 spectrometer, 25 detector, 26 spectrometer, 27 detector, 28 Lens, 29 optical fiber, 30 through hole, 31 lens, 32 optical fiber.

Claims (5)

An inspection device for inspecting a photocurable resin in an inspection object,
A light source for irradiating the inspection object with pulsed ultraviolet light;
A detection unit for detecting fluorescence generated from the photocurable resin of the irradiation unit of the ultraviolet light in the inspection object at a time later than the width of the pulse of the ultraviolet light irradiated from the light source. In addition, a photo-curing resin inspection device.   The said detection part is a test | inspection apparatus of the photocurable resin of Claim 1 comprised so that it may have a time-resolving function.   The photocurable resin inspection apparatus according to claim 1, further comprising a spectroscope for spectrally dividing the light from the irradiation unit including the fluorescence before introducing the light into the detection unit. The inspection object includes a resin member having a through hole, and a metal layer formed on the inner surface of the through hole,
The said detection part is comprised so that the said fluorescence which arises from the said resin member exposed from the said metal layer in the said through-hole by irradiation of the said ultraviolet light which passed the said through-hole can be detected. The inspection apparatus of the photocurable resin in any one. An inspection method for inspecting a photocurable resin in an inspection object,
Irradiating the inspection object with pulsed ultraviolet light; and
And a step of detecting fluorescence generated from the photocurable resin of the ultraviolet light irradiation portion in the inspection object at a time delayed from a width of the pulse of the ultraviolet light irradiated from the light source. Inspection method for functional resin.

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