JP2012227207A - Multilayer electronic component and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer electronic component in which the diameter of an interlayer connection conductor can be reduced.SOLUTION: In at least one layer 12 out of a plurality of insulation layers 11-13 composed of a ceramic material and laminated on one another, a first taper hole 14p communicating with a first aperture 13p formed in one principal surface 12p and extending toward the other principal surface 12q while reducing the cross-sectional area, and a second taper hole 14q communicating with a second aperture 13q formed in the other principal surface 12q and extending toward the one principal surface 12p while reducing the cross-sectional area are formed so as to be connected at an intermediate position between the principal surfaces 12p, 12q. An interlayer connection conductor 10 is formed of a conductive material filling a through hole 14 that is formed by connecting the first and second taper holes 14p, 14q.

Description

  The present invention relates to a laminated electronic component and a manufacturing method thereof, and more particularly to a laminated electronic component in which an insulating layer is laminated and a manufacturing method thereof.

  A laminated electronic component in which an insulating layer is laminated is produced by laminating and firing ceramic green sheets. By forming a through hole in the ceramic green sheet and filling the through hole with a conductive paste, an interlayer connection conductor that penetrates the insulating layer can be formed inside the laminated electronic component.

  For example, as shown in the cross-sectional view of the main part in FIG. 8, the ceramic green sheet 102 supported by the carrier film 101 is irradiated with a laser beam 107 to form a through hole 108 (see, for example, Patent Document 1).

JP-A-6-304774

  When the output of the laser beam irradiated to the ceramic green sheet is reduced in order to reduce the diameter of the interlayer connection conductor, the through hole formed in the ceramic green sheet becomes a tapered shape (conical shape). That is, the through hole has the largest diameter (incident diameter) of the opening formed on the main surface of the ceramic green sheet on the laser beam incident side, and the diameter of the opening (emitted diameter) formed on the main surface on the laser beam emitting side. Is minimized. That is, the opening formed in the main surface on the laser beam emission side is the minimum cross section in the plane perpendicular to the stacking direction of the insulating layers.

  If the emission diameter becomes too small, the opening on the emission side is not formed due to processing variations, or the emission side is disconnected due to shrinkage of the conductive paste during firing, resulting in poor connection. Therefore, the diameter of the interlayer connection conductor can be reduced only to a certain extent. However, in order to achieve miniaturization of laminated electronic components, the diameter of the interlayer connection conductor is reduced without reducing the minimum cross section in the plane perpendicular to the lamination direction of the insulating layer, and stable connection is maintained. There is a need.

  In view of such circumstances, the present invention intends to provide a multilayer electronic component capable of further reducing the diameter of the interlayer connection conductor without reducing the minimum cross section in the plane perpendicular to the lamination direction of the insulating layers.

  In order to solve the above problems, the present invention provides an interlayer connection conductor configured as follows.

  The multilayer electronic component includes: (a) a plurality of insulating layers made of ceramic materials, and (b) at least one insulating layer penetrating between a pair of opposing principal surfaces of the insulating layer. And an interlayer connection conductor formed on the substrate. The at least one insulating layer communicates with a first opening formed on one of the main surfaces of the insulating layer and faces the other of the main surfaces of the insulating layer in the stacking direction of the insulating layers. A first taper hole extending while reducing a cross-sectional area in a vertical plane, and a second opening formed in the other of the main surfaces of the insulating layer, and the first surface of the main surface of the insulating layer. To the other side, the second tapered hole extending while reducing the cross-sectional area in the plane perpendicular to the stacking direction of the insulating layer is connected at an intermediate position between the main surfaces of the insulating layer. It is formed. The interlayer connection conductor is formed of a conductive material filled in a through hole formed by connecting the first tapered hole and the second tapered hole.

  In the above configuration, the first tapered hole extends from the first opening with a reduced cross-sectional area, and the second tapered hole extends from the second opening with a reduced cross-sectional area. The through hole formed by connecting the tapered hole and the second tapered hole has a cross-sectional area at an intermediate position smaller than that of the first opening and smaller than that of the second opening. Therefore, the interlayer connection conductor formed of the conductive material filled in the through hole includes a tapered first portion formed in the first tapered hole and a tapered second portion formed in the second tapered hole. The part is connected in the opposite direction, and becomes a constricted shape at the intermediate position.

  According to the above configuration, since both end surfaces to which the interlayer connection conductor is connected can be made substantially the same, the diameter of the interlayer connection conductor can be made smaller while ensuring connection reliability.

  In addition, the openings (first opening and second opening) formed in both main surfaces of the insulating layer are of the same size, and the interlayer connection conductor is composed of only one tapered portion. Since the minimum cross section of the through hole in the plane perpendicular to the stacking direction of the insulating layer can be increased, it is easy to fill the through hole with a conductive material and form an interlayer connection conductor.

  Preferably, the shapes of the first tapered hole and the second tapered hole are different from each other.

  The first taper hole and the second taper hole are, for example, the size of the first opening through which the first taper hole communicates and the second opening through which the second taper hole communicates, and the cone angle (inner circumference). The angle of the surface inclination) and the dimension in the stacking direction in which the insulating layers are stacked are different.

  In this case, the first taper hole and the second taper hole are formed by changing the output of the laser beam, and damage to the insulating layer by laser processing can be reduced.

  Preferably, the center of the first opening of the first tapered hole and the center of the second opening of the second tapered hole are shifted from each other when viewed in the stacking direction of the insulating layer. Yes.

  In this case, the first taper hole and the second taper hole are larger than the case where the center of the first opening of the first taper hole and the center of the second opening of the second taper hole coincide with each other. Can be increased in the minimum cross section in a plane perpendicular to the laminating direction of the insulating layer of the through hole. Thereby, the connection reliability of an interlayer connection conductor can be improved.

  Preferably, the interlayer connection conductors are respectively formed in the insulating layers adjacent to each other, and the interlayer connection conductors are connected so as to be continuous in the stacking direction in which the insulating layers are stacked.

  In this case, by setting the both ends of the interlayer connection conductor to the same size, the small-diameter interlayer connection conductor can be easily connected across a plurality of layers. In addition, since the difference between the maximum diameter and the minimum diameter of the interlayer connection conductor can be reduced, the continuity of the signal transmission line is improved and the signal transmission characteristics are improved.

  The present invention also provides a method for manufacturing a laminated electronic component configured as follows.

  The method for manufacturing an electronic component includes (i) a first step of forming an unfired laminate in which ceramic green sheets are laminated, and (ii) a second step of firing the unfired laminate. . In the first step, (a) at least one ceramic green sheet before forming the unfired laminated body is irradiated with a laser beam on both of a pair of main surfaces facing each other, whereby the main A first tapered hole in which a cross-sectional area of a surface perpendicular to the stacking direction of the insulating layer decreases from one of the surfaces to the other of the main surface; and from the other of the main surfaces to the one of the main surfaces A second tapered hole having a reduced cross-sectional area in a plane perpendicular to the stacking direction of the insulating layer is formed so as to be connected to each other at an intermediate position between the main surfaces, and (b) the first An interlayer connection conductor is formed by filling a through hole formed by connecting one tapered hole and the second tapered hole with a conductive material.

  In the interlayer connection conductor formed by the above method, the tapered first portion formed in the first tapered hole and the tapered second portion formed in the second tapered hole are connected in opposite directions. The shape is constricted at the intermediate position.

  According to the above method, since both end surfaces to which the interlayer connection conductor is connected can be made substantially the same, the minimum cross section in the plane perpendicular to the stacking direction of the insulating layer is reduced while ensuring connection reliability. Without this, the diameter of the interlayer connection conductor can be further reduced.

  Also, the openings (first opening and second opening) formed on both main surfaces of the ceramic green sheet are made to have the same size, and the interlayer connection conductor is composed of only one tapered portion. Since the minimum cross section of the surface of the through hole perpendicular to the stacking direction of the insulating layer can be increased, it is easy to fill the through hole with a conductive material and form an interlayer connection conductor.

  Preferably, in the first step, when forming the first tapered hole and the second tapered hole in the ceramic green sheet, at least of the first tapered hole and the second tapered hole. One is irradiated with an output laser beam capable of forming a through-hole penetrating between the main surfaces of the ceramic green sheet.

  In this case, it is possible to change the laser beam output when forming the first tapered hole and the second tapered hole, and to reduce damage to the ceramic green sheet by laser processing. Further, the connection reliability can be improved by increasing the minimum cross section in the plane perpendicular to the stacking direction of the insulating layers of the interlayer connection conductor.

  According to the present invention, the diameter of the interlayer connection conductor can be further reduced without reducing the minimum cross section in the plane perpendicular to the stacking direction of the insulating layers.

It is principal part sectional drawing of a laminated electronic component. Example 1 It is principal part sectional drawing of a laminated electronic component. (Comparative Example 1) It is principal part sectional drawing which shows the manufacturing process of a multilayer electronic component. Example 1 It is principal part sectional drawing of a laminated electronic component. (Modification 1) It is principal part sectional drawing of a laminated electronic component. (Modification 2) It is principal part sectional drawing of a laminated electronic component. (Example 2) It is principal part sectional drawing of a laminated electronic component. (Comparative Example 2) It is principal part sectional drawing which shows the manufacturing process of a multilayer electronic component. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  Example 1 A laminated electronic component of Example 1 will be described with reference to FIGS.

  FIG. 1 is a cross-sectional view of a main part of the multilayer electronic component of the first embodiment. As shown in FIG. 1, the laminated electronic component is made of a ceramic material, and includes a plurality of insulating layers 11, 12, and 13 stacked on each other, and an interlayer connection conductor 10 is formed on at least one insulating layer 12. . Interlayer connection conductor 10 is formed to penetrate between a pair of main surfaces 12p and 12q facing each other of insulating layer 12. One end face 11p of the interlayer connection conductor 10 is connected to an in-plane connection conductor 20p formed between the insulating layers 11 and 12 adjacent to each other. The other end face 11q of the interlayer connection conductor 10 is connected to an in-plane connection conductor 20q formed between the insulating layers 12 and 13 adjacent to each other.

  Specifically, the insulating layer 12 is formed with a first tapered hole 14p and a second tapered hole 14q. The first tapered hole 14p communicates with the first opening 13p formed in one main surface 12p of the insulating layer 12, and is perpendicular to the stacking direction of the insulating layers toward the other main surface 12q of the insulating layer 12. The cross-sectional area on the smooth surface extends while decreasing. The second tapered hole 14q communicates with the second opening 13q formed in the other main surface 12q of the insulating layer 12, and is perpendicular to the stacking direction of the insulating layer toward the one main surface 12p of the insulating layer 12. The cross-sectional area on the smooth surface extends while decreasing. The first tapered hole 14p and the second tapered hole 14q are connected at an intermediate position between the main surfaces 12p and 12q of the insulating layer 12. Here, the intermediate position is any position between the main surfaces 12p and 12q of the insulating layer 12.

  The interlayer connection conductor 10 is formed of a conductive material filled in the through hole 14 formed by connecting the first tapered hole 14p and the second tapered hole 14q. The interlayer connection conductor 10 has a shape in which a first portion 10p and a second portion 10q, which are formed in a tapered shape, are connected in opposite directions and are bundled at an intermediate position.

  Next, a method for manufacturing a laminated electronic component will be described with reference to FIG. FIG. 3 is a cross-sectional view of the main part showing the manufacturing process of the laminated electronic component.

  (1) First, a ceramic green sheet on which interlayer connection conductors and / or in-plane connection conductors are formed is prepared. If necessary, a ceramic green sheet in which neither an interlayer connection conductor nor an in-plane connection conductor is formed is also prepared.

  For example, as shown in FIG. 3, a ceramic green sheet 12 that is an unfired insulating layer 12 in which an interlayer connection conductor 10 and an in-plane connection conductor 20p are formed is prepared.

  That is, as shown in FIG. 3A, a first tapered hole 14 p is formed in the ceramic green sheet 12 by irradiating a laser beam from one main surface 12 p side of the ceramic green sheet 12.

  Next, as shown in FIG. 3B, the second tapered hole 14q is formed so as to be connected to the first tapered hole 14p by irradiating a laser beam from the other main surface 12q side of the ceramic green sheet 12. Form.

  Next, as shown in FIG. 3C, the through hole 14 formed by connecting the first tapered hole 14p and the second tapered hole 14q is filled with a conductive paste, and the unsintered interlayer connection conductor 10 is filled. Form. The conductive paste is a mixture of metal particles made of Ag, Cu or the like and an organic substance such as a resin.

  Next, as shown in FIG. 3D, a conductive paste is applied on one main surface 12p of the ceramic green sheet 12 by a method such as screen printing to form an unsintered in-plane connection conductor 20p. To do. Here, the filling of the conductive paste into the through hole 14 and the application of the conductive paste onto one main surface 12p of the ceramic green sheet 12 are performed separately, but they may be performed simultaneously.

  (2) Next, the prepared ceramic green sheets are laminated and pressure-bonded to produce an unfired laminate.

  (3) Next, the unfired laminate is fired. A ceramic green sheet sintered by firing forms a plurality of insulating layers made of ceramic materials and laminated with each other, and an interlayer connection conductor and an in-plane connection conductor are formed by conductive paste sintered by firing.

  (4) If necessary, external electrode plating or electronic component mounting is performed to complete a laminated electronic component.

  At least one of the first taper hole 14p and the second taper hole 14q formed in the ceramic green sheet 12 may be formed in a shape penetrating between the main surfaces 12p and 12q of the ceramic green sheet 12.

  For example, as shown by a broken line in FIG. 1, the first tapered hole 14p has an output laser capable of forming a through hole having the tip 11k reaching the other main surface 12q and penetrating between the main surfaces 12p and 12q. It is formed by irradiating a beam. At this time, it is not necessary to actually form a through hole, and an output laser beam that does not form a through hole may be irradiated.

  In this case, when the first tapered hole 14p and the second tapered hole 14q are formed, the output of the laser beam can be changed to reduce damage to the insulating layer 12 due to laser processing. Further, the confinement of the interlayer connection conductor 10 can be made thick, and the minimum cross section in the plane perpendicular to the laminating direction of the insulating layer of the interlayer connection conductor 10 can be increased to improve connection reliability and signal transmission characteristics.

  FIG. 2 is a cross-sectional view of a main part of the multilayer electronic component of Comparative Example 1. In the comparative example 1 shown in FIG. 2, the insulating layer 12x is formed with only one tapered hole 14x penetrating between the main surfaces 12m and 12n of the insulating layer 12x, and by the conductive material filled in the tapered hole 14x, Interlayer connection conductor 10x is formed. The interlayer connection conductor 10x includes only one tapered portion, and one end face 11m of the interlayer connection conductor 10x is relatively large and the other end face 11n is relatively small. One end face 11m of the interlayer connection conductor 10x is connected to an in-plane connection conductor 20m formed between the insulating layers 11 and 12x adjacent to each other. The other end face 11n of the interlayer connection conductor 10x is connected to an in-plane connection conductor 20n formed between the insulating layers 12x and 13 adjacent to each other.

  In Comparative Example 1 shown in FIG. 2, when the diameter of the tapered hole 14x is reduced, the minimum cross section in the plane perpendicular to the stacking direction of the insulating layer is reduced, and the opening 13n is formed in the other main surface 12n of the insulating layer 12 due to processing variations. Is not formed, or the unfired interlayer connection conductor 10x shrinks during firing, and the connection between the other end surface 11n of the interlayer connection conductor 10x and the in-plane connection conductor 20n is disconnected, resulting in a connection failure. . Therefore, the diameter of the interlayer connection conductor 10x needs to be a size that does not cause a connection failure in the minimum cross section in the plane perpendicular to the stacking direction of the insulating layers, and cannot be reduced.

  On the other hand, in the multilayer electronic component of Example 1 shown in FIG. 1, both end faces 11p, 11q of the interlayer connection conductor 10 connected to the in-plane connection conductors 20p, 20q are equally large. It is possible to reduce the diameter of the interlayer connection conductor 10 without reducing the minimum cross section in the plane perpendicular to the stacking direction of the insulating layers while ensuring the above.

  Further, in the multilayer electronic component of Example 1 shown in FIG. 1, both the openings 13p and 13q formed in the main surfaces 12p and 12q of the insulating layer 12 are substantially the same, as in Comparative Example 1 of FIG. Compared with the case where one opening 13m formed in the main surfaces 12m and 12n of the insulating layer 12 is relatively large and the other opening 13n is relatively small, the surface of the through hole 14 is perpendicular to the stacking direction of the insulating layers. Since the minimum cross section can be increased, it becomes easy to fill the through holes 14 formed in the insulating layer 12 with a conductive paste, and the diameter of the interlayer connection conductor 10 can be reduced without reducing the minimum cross section. Is easy.

  <Modification 1> FIG. 4 is a cross-sectional view of a main part of a multilayer electronic component of Modification 1.

  As shown in FIG. 4, the multilayer electronic component of Modification 1 includes a first tapered hole 14r that communicates with a first opening 13r formed in one main surface 12r of the insulating layer 12a, and the other of the insulating layer 12a. A second tapered hole 14 s communicating with the second opening 13 s formed in the main surface 12 s is formed so as to be connected to each other. In a through hole 14a formed by connecting the first tapered hole 14r and the second tapered hole 14s, an interlayer connection conductor 10a having a first portion 10r and a second portion 10s is formed. The end faces 11r and 11s of the interlayer connection conductor 10a are connected to in-plane connection conductors 20r and 20s formed between the insulating layers 11, 12a and 12a and 13 adjacent to each other.

  As shown in FIG. 4, the first tapered hole 14r and the second tapered hole 14s formed in the insulating layer 12a have different shapes. That is, the first opening 13r in which the end surface 11r of the interlayer connection conductor 10a is formed is relatively large, and the second opening 13s in which the end surface 11s of the interlayer connection conductor 10a is formed is relatively small. In addition, the first tapered hole 14r and the second tapered hole 14s in which the first portion 10r and the second portion 10s of the interlayer connection conductor 10a are formed have a cone angle (an angle of inclination of the inner peripheral surface) and an insulation. The dimensions of the layers 11, 12a, and 13 in the stacking direction are different from each other. Therefore, in the interlayer connection conductor 10a, the shapes of the first portion 10r and the second portion 10s are different from each other.

  The multilayer electronic component of Modification 1 is insulated by laser processing by changing the output of the laser beam when forming the first tapered hole 14r and the output of the laser beam when forming the second tapered hole 14s. Damage to the layer 12a can be reduced.

  <Modification 2> FIG. 5 is a cross-sectional view of a main part of a multilayer electronic component of Modification 2.

  As shown in FIG. 5, the multilayer electronic component of Modification 2 includes a first tapered hole 14u communicating with a first opening 13u formed on one main surface 12u of the insulating layer 12b, and the other of the insulating layer 12b. A second tapered hole 14v communicating with the second opening 13v formed in the main surface 12v is formed so as to be connected to each other. An interlayer connection conductor 10b having a first portion 10u and a second portion 10v is formed in a through hole 14b formed by connecting the first tapered hole 14u and the second tapered hole 14v. The end faces 11u, 11v of the interlayer connection conductor 10b are connected to in-plane connection conductors 20u, 20v formed between the insulating layers 11, 12b; 12b, 13 adjacent to each other.

  In the multilayer electronic component of Modification 2, the center 16u of the first opening 13u in the first tapered hole 14u and the center 16v of the second opening 13v in the second tapered hole 14v are seen through in the stacking direction of the insulating layers. If they are out of alignment, they do not match. Therefore, the through hole 14b formed by connecting the first taper hole 14u and the second taper hole 14v has an insulating layer between the center of the opening of the first taper hole and the center of the opening of the second taper hole. The minimum cross section in the plane perpendicular to the stacking direction of the insulating layers can be made larger than in the case where it is seen in the case of seeing through in the stacking direction.

  In the multilayer electronic component of Modification 2, the center layer 16u of the first taper hole 14u and the center 16v of the second taper hole 14v are displaced, so that the insulating layer of the interlayer connection conductor 10b formed in the through hole 14b is stacked. The minimum cross section in the plane perpendicular to the direction is increased, and the connection reliability and signal transmission characteristics are improved.

  Example 2 A laminated electronic component of Example 2 will be described with reference to FIGS. 6 and 7.

  FIG. 6 is a cross-sectional view of a principal part of the multilayer electronic component of the second embodiment. As shown in FIG. 6, interlayer connection conductors 18 a to 18 d are respectively formed in the insulating layers 16 a to 16 d adjacent to each other, and the interlayer connection conductors 18 a to 18 d are stacked in which insulating layers 15, 16 a to 16 d, 17 are stacked. They are connected so as to be continuous in the direction (vertical direction in FIG. 6). Among the connected interlayer connection conductors 18a to 18d, the interlayer connection conductors 18a and 18d at both ends are connected to the in-plane connection conductors 22a and 22b formed between the insulating layers 15, 16a and 16d and 17 adjacent to each other. ing.

  Each of the interlayer connection conductors 18a to 18d has the same configuration as that of the first embodiment, the tapered first portion and the second portion are connected in opposite directions, have large diameters at both ends, and are constricted at an intermediate position. .

  FIG. 7 is a cross-sectional view of the main part of the multilayer electronic component of Comparative Example 2. As shown in FIG. 7, in the multilayer electronic component of Comparative Example 2, the interlayer connection conductors 18p to 18s formed on the insulating layers 16p to 16s adjacent to each other are aligned in the same direction from only one tapered portion. Are connected to each other. Therefore, when the interlayer connection conductors 18p to 18s have a small diameter, adjacent interlayer connection conductors 18p, 18q; 18q, 18r; portions where the 18r, 18s are connected to each other, or the interlayer connection conductor 18s and the in-plane connection conductor 22b are connected. Since the cross-sectional area of the portion to be formed becomes small, connection cannot be ensured due to processing variations and shrinkage of the conductive paste during firing, resulting in poor connection. For this reason, the diameter of the interlayer connection conductors 18p to 18s needs to be a size that does not cause a connection failure in the minimum cross section in the plane perpendicular to the stacking direction of the insulating layers, and cannot be reduced.

  On the other hand, in the multilayer electronic component of Example 2 shown in FIG. 6, the end surfaces of the respective interlayer connection conductors 18a to 18d are made to have the same size, so that the minimum in the plane perpendicular to the stacking direction of the insulating layers. The connection reliability can be ensured by reducing the diameter of the interlayer connection conductors 18a to 18d without reducing the cross section, and the small-diameter interlayer connection conductors 18a to 18d can be easily connected across the plurality of layers 16a to 16d. Can do.

  Further, in the multilayer electronic component of Example 2 shown in FIG. 6, the difference between the maximum diameter and the minimum diameter of each interlayer connection conductor 18a to 18d is reduced, so that the continuity of the signal transmission line is improved and the signal transmission characteristics are improved. To do.

  <Summary> As described above, forming the taper hole from both sides of the main surface of the ceramic green sheet and forming the interlayer connection conductor by filling the taper hole with a conductive material, while ensuring connection reliability, The diameter of the interlayer connection conductor can be further reduced without reducing the minimum cross section in the plane perpendicular to the stacking direction of the insulating layers.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

10, 10a, 10b, 10x Interlayer connection conductor 11 Insulating layer 11k Tip 11m, 11n, 11p-11s, 11u, 11v End surface 12, 12a, 12b, 12x Insulating layer 12m, 12n, 12p-12s, 12u, 12v Main surface 13 Insulating layer 13m, 13n, 13p-13s, 13u, 13v Opening 14, 14a, 14b Through hole 14p-14s, 14u, 14v, 14x Taper hole 15 Insulating layer 16a-16d, 16p-16s Insulating layer 16u, 16v Center 17 Insulating Layer 18a-18d, 18p-18s Interlayer connection conductor 20m, 20n, 20p-20s, 20u, 20v, 22a, 22b In-plane connection conductor

Claims (6)

A plurality of insulating layers made of ceramic material and laminated together;
An interlayer connection conductor formed in at least one of the insulating layers so as to penetrate between a pair of opposed principal surfaces of the insulating layer;
In laminated electronic components equipped with
The at least one insulating layer communicates with a first opening formed on one of the main surfaces of the insulating layer and faces the other of the main surfaces of the insulating layer in the stacking direction of the insulating layers. A first taper hole extending while reducing a cross-sectional area in a vertical plane, and a second opening formed in the other of the main surfaces of the insulating layer, and the first surface of the main surface of the insulating layer. To the other side, the second tapered hole extending while reducing the cross-sectional area in the plane perpendicular to the stacking direction of the insulating layer is connected at an intermediate position between the main surfaces of the insulating layer. Formed,
The multilayer electronic component, wherein the interlayer connection conductor is formed of a conductive material filled in a through hole formed by connecting the first tapered hole and the second tapered hole.   The multilayer electronic component according to claim 1, wherein shapes of the first tapered hole and the second tapered hole are different from each other.   The center of the first opening of the first tapered hole and the center of the second opening of the second tapered hole are shifted from each other when seen through in the stacking direction of the insulating layer. The multilayer electronic component according to claim 1, wherein the multilayer electronic component is characterized by the following.   The interlayer connection conductor is formed in each of the insulating layers adjacent to each other, and the interlayer connection conductors are connected so as to be continuous in a stacking direction in which the insulating layers are stacked. 4. The laminated electronic component according to any one of 1 to 3. A first step of forming a green laminate in which ceramic green sheets are laminated;
A second step of firing the unfired laminate;
With
In the first step,
About at least one ceramic green sheet before forming the unfired laminate, by irradiating both of a pair of main surfaces facing each other with a laser beam, from one of the main surfaces to the other of the main surfaces A first tapered hole in which a cross-sectional area in a plane perpendicular to the stacking direction of the insulating layer decreases, and a stacking direction of the insulating layer from the other of the main surfaces toward the one of the main surfaces Forming a second tapered hole having a reduced cross-sectional area in a vertical plane so as to be connected to each other at an intermediate position between the main surfaces;
A method for manufacturing a multilayer electronic component, comprising forming an interlayer connection conductor by filling a through hole formed by connecting the first tapered hole and the second tapered hole with a conductive material.   In the first step, when forming the first tapered hole and the second tapered hole in the ceramic green sheet, at least one of the first tapered hole and the second tapered hole is: 6. The method of manufacturing a multilayer electronic component according to claim 5, wherein a laser beam having an output capable of forming a through-hole penetrating between the main surfaces of the ceramic green sheet is irradiated.

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