JP2012226880A - Induction heating cooker - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an induction heating cooker equipped with an infrared sensor which is sensitive to temperature fluctuation and able to measure a temperature of a heating object on a top plate with high accuracy.SOLUTION: An induction heating cooker comprises: a top plate loading a heating object; an electromagnetic coil provided below the top plate for heating the heating object by electromagnetic induction heating; and an infrared sensor 1 provided below the top plate at a distance from the top plate. The infrared sensor comprises: an insulating film 2; a first heat sensitive element 3A and a second heat sensitive element 3B provided on one surface of the insulating film at a distance from each other; a first conductive wiring film and a second conductive wiring film which are formed on the one surface of the insulating film and connected to the first heat sensitive element and the second heat sensitive element, respectively; and an infrared reflective film 6 formed on the other surface of the insulating film so as to face the second heat sensitive element.

Description

  The present invention relates to an induction heating cooker capable of heating an object to be heated such as a pan on a top plate by electromagnetic induction heating (IH) and detecting a pan bottom temperature.

  Conventionally, as an induction heating cooker that can heat an object to be heated such as a pan on a top plate by electromagnetic induction heating and detect the pan bottom temperature, for example, Patent Document 1 includes a box-shaped main body case with an open top. A heating plate that covers the top opening of the main body case, a heating coil unit that is disposed below the top plate in the main body case, and that has a heating coil and a heating coil holding member that holds the heating coil; There has been proposed an electromagnetic induction heating cooker that includes an infrared sensor unit that detects infrared rays radiated from the heated object, and in which the infrared sensor unit is disposed below the heating coil unit. The infrared sensor unit of the electromagnetic induction heating cooker includes an infrared sensor having a thermopile and a lens, and outputs an infrared detection signal radiated from an object to be heated as a voltage. In addition, this electromagnetic induction cooking device employs a structure in which cooling air hits the infrared sensor unit in order to cool the infrared sensor unit.

  In addition to the thermopile, as a temperature sensor for an object to be heated, Patent Document 2 discloses an infrared sensor that measures the temperature of a heating fixing roller or the like used in a fixing device of a copying machine, although not for an electromagnetic induction heating cooker. , A resin film installed on the holder, an infrared detection thermal element provided on the resin film for detecting infrared rays through the light guide of the holder, and a temperature of the holder provided on the resin film in a light-shielded state An infrared sensor having a temperature-compensating thermal element is proposed. In this infrared sensor, an infrared absorption film is formed on the inner side surface of the light guide section, and an infrared absorption material such as carbon black is included in the resin film to enhance infrared absorption. Further, in this infrared sensor, a heat sensitive element is built in a holding body which is a casing formed in a substantially block shape from a metal material having a high thermal conductivity such as aluminum and a low thermal emissivity.

JP 2010-287533 A JP 2002-156284 A

The following problems remain in the conventional technology.
That is, there has been a problem that a detection error occurs because the temperature around the infrared sensor changes rapidly due to the temperature rise of the electromagnetic coil (heating coil). For this reason, the structure and apparatus, such as cooling an infrared sensor like the induction heating cooker described in Patent Document 1, are required, and the structure becomes complicated and expensive, and cannot be heated rapidly. There was an inconvenience.
In addition, in the induction heating cooker described in Patent Document 1, a thermopile is used for the infrared sensor, but the thermopile is difficult to detect temperature with high accuracy because the element is sealed with gas and is insensitive to ambient temperature fluctuations. Met. Furthermore, when an infrared sensor for temperature detection that receives infrared rays from the object to be heated on the top plate and an infrared sensor for temperature compensation that detects only the ambient temperature are installed separately, materials on the detection side and the compensation side, Since the structure and the installation state are different, there is a problem that a difference in heat capacity is generated and a temperature distribution is generated, so that high-precision temperature measurement cannot be performed.
For example, when the infrared temperature sensor described in Patent Document 2 is used, the infrared temperature sensor has a structure in which an infrared absorbing material such as carbon black is contained in the resin film and one of the thermal elements is shielded for temperature compensation. Although employed, the resin film containing the infrared absorbing material has a high thermal conductivity, and there is a disadvantage that a temperature difference hardly occurs between the thermal sensing elements for infrared detection and temperature compensation. Also, in order to increase the temperature difference between these thermal elements, it is necessary to increase the distance between the thermal elements, which increases the overall shape and makes it difficult to reduce the size. Furthermore, since it is necessary to provide the case itself with a structure that shields the temperature-compensating thermal element, the cost is increased.
In addition, the heat-sensitive element has a structure that shields infrared rays with a housing, but the shielding part absorbs infrared rays only by shielding the infrared rays, and the temperature of the shielding part changes. There was an inconvenience of being incomplete as a reference.

  The present invention has been made in view of the above-described problems, and provides an induction heating cooker including an infrared sensor that is sensitive to temperature fluctuations and can measure the temperature of an object to be heated on a top plate with high accuracy. For the purpose.

  The present invention employs the following configuration in order to solve the above problems. That is, the induction heating cooker according to the first aspect of the present invention includes a top plate on which an object to be heated is placed, an electromagnetic coil that is installed below the top plate and heats the object to be heated by electromagnetic induction heating, and the top plate An induction heating cooker including an infrared sensor that is disposed below the top plate and that detects infrared rays emitted from an object to be heated via the top plate, the infrared sensor having an insulating property A film, a first heat sensitive element and a second heat sensitive element provided on one surface of the insulating film, and a first heat sensitive element formed on one surface of the insulating film; The conductive first wiring film connected and the conductive second wiring film connected to the second thermal element, and the other surface of the insulating film facing the second thermal element. In Characterized in that it includes a vignetting infrared reflective film.

  In this induction heating cooker, the infrared sensor is insulative facing the first and second heat sensitive elements provided on one side of the insulating film and spaced apart from each other, and the second heat sensitive element. Since the infrared reflective film provided on the other surface of the film is provided, there is a temperature distribution generated in the first thermal element for detection and the second thermal element for compensation arranged on the insulating film. Get smaller. For this reason, both heat sensitive elements on the insulating film are simultaneously affected and sensitively affected by the temperature fluctuation due to heat from the electromagnetic coil, so that the radiant heat from the pan bottom (object to be heated) can be accurately detected. it can. Therefore, even if the amount of heat received by the infrared sensor is large, the temperature of the bottom of the pan (the object to be heated) can be detected in a non-contact manner, and there is no need for a space or support structure for heat isolation from the electromagnetic coil. The support structure of the infrared sensor is simplified and a cooling device is not required. Further, even with a simplified support structure, temperature detection can be performed with high accuracy. Furthermore, it can be installed inside in a small space, and the overall size and cost can be reduced.

The induction heating cooker according to a second aspect of the present invention is the induction heating cooker according to the first aspect, wherein the first wiring film is arranged up to the periphery of the first thermal element and has a larger area than the second wiring film. It is characterized by being.
That is, since the first wiring film of the infrared sensor is arranged up to the periphery of the first thermosensitive element and has a larger area than the second wiring film, from the portion of the insulating film that absorbs infrared rays In addition to improving the heat collection, the heat capacity is close to the portion of the insulating film where the infrared reflective film is formed, so that the fluctuation error can be reduced. For this reason, both the heat sensitive elements on the insulating film are simultaneously affected and sensitively affected by ambient temperature fluctuations, so that the radiant heat from the object to be heated via the top plate can be accurately detected. The area and shape of the first wiring film are preferably set so that the heat capacity is substantially equal to the portion of the insulating film where the infrared reflective film is formed.

An induction heating cooker of a third invention is the induction heating cooker according to the first or second invention, wherein the insulating film is formed of a polyimide substrate, the infrared reflecting film, the first wiring film, and the second wiring film. Is formed of copper foil.
That is, in this induction heating cooker, the insulating film is formed of a polyimide substrate, and the infrared reflecting film, the first wiring film, and the second wiring film are formed of copper foil. A typical double-sided flexible substrate can be used, and the cost can be reduced.

In an induction heating cooker according to a fourth invention, in any one of the first to third inventions, the infrared reflective film is composed of the copper foil and a gold plating film laminated on the copper foil. It is characterized by that.
That is, in this induction heating cooker, since the infrared reflective film is composed of a copper foil and a gold plating film laminated on the copper foil, the gold plating film functions as an antioxidant film for the copper foil. Infrared reflectance can be improved.

The induction heating cooker according to a fifth aspect of the present invention is characterized in that, in any one of the first to fourth aspects, the first thermal element and the second thermal element are thermistor elements.
In other words, in this induction heating cooker, the first and second thermosensitive elements are thermistor elements, so that there is less characteristic deterioration at high temperatures and high heat resistance compared to the infrared sensor of the photodiode. It can be installed close to a hot top plate or the like. In addition, because it can be installed close to the top plate, etc., it becomes difficult for others to enter the infrared field of view of the infrared sensor, and interference from infrared rays from the outside can be suppressed, so more accurate temperature measurement Is possible. When the infrared sensor is used away from the top plate, an optical mechanism such as a lens for focusing is required, but in the case of the present invention, the optical mechanism can be installed close to the top plate. This eliminates the need for the component cost.

The present invention has the following effects.
That is, according to the induction heating cooker according to the present invention, the infrared sensor is provided on the one surface of the insulating film so as to be spaced apart from each other, and the second heat sensitive element. Because it has an infrared reflective film provided on the other surface of the insulating film facing the element, the temperature of the pan bottom (to-be-heated object) is non-contacted with high accuracy even if the amount of heat received by the infrared sensor is large. In addition, a simple support structure can be used, and downsizing and cost reduction are possible.
Therefore, the temperature of the pan bottom (object to be heated) is controlled with high accuracy, enabling stable cooking and reducing the overall size and cost.

In one Embodiment of the induction heating cooking appliance which concerns on this invention, it is schematic sectional drawing which shows an induction heating cooking appliance. In this embodiment, it is a perspective view which shows an infrared sensor. In this embodiment, it is a perspective view which shows the sensor main body of the state which removed the housing | casing. In this embodiment, it is sectional drawing which shows an infrared sensor. In 1st Embodiment, it is a bottom view which shows the insulating film before a thermal element is adhere | attached. In 1st Embodiment, it is a top view which shows the insulating film before a thermal element is adhere | attached. It is a block diagram which shows the apparatus for performing the performance comparison of the infrared sensor used for this invention. In the infrared sensor used for this invention, it is a graph which shows the change of the absorption film temperature with respect to the temperature change of a Peltier device, and a reflecting film temperature. In the infrared temperature sensor of patent document 2, it is a graph which shows the change of the absorption film temperature and the reflection film temperature with respect to the temperature change of a Peltier device. In the infrared sensor used for this invention, it is a graph which shows the temperature of an infrared sensor, the measured temperature of a desk, and the calculated temperature of a desk. In the infrared temperature sensor of patent document 2, it is a graph which shows the change of the temperature of an infrared temperature sensor, the measured temperature of a desk, and reflective film temperature.

  Hereinafter, an embodiment of an induction heating cooker according to the present invention will be described with reference to FIGS. In each drawing used for the following description, the scale is appropriately changed in order to make each member recognizable or easily recognizable.

  As shown in FIG. 1, the induction heating cooker 10 according to the present embodiment includes a top plate 12 on which an object to be heated N is placed, and an object to be heated N that is installed below the top plate 12 by electromagnetic induction heating. An electromagnetic coil 13 that is spaced apart from the top plate 12 below the top plate 12 to detect infrared rays radiated from the heated object N via the top plate 12, and the electromagnetic coil 13 and infrared rays. A control unit C electrically connected to the sensor 1 and a main body case 14 in which these are installed are provided.

The top plate 12 is formed of crystallized glass or the like and has high heat resistance, and is attached to the upper part of the main body case 14.
The lower surface of the top plate 12 is provided with an infrared shielding layer (not shown) that covers the lower surface and is partially opened as an infrared transmission window (not shown).
The infrared shielding layer is an infrared shielding sheet such as a sprayed material of crystallized glass containing carbon black attached to the lower surface of the top plate 12. The infrared shielding layer may be formed by coating the lower surface of the top plate 12 with a paint having an infrared shielding effect other than the infrared shielding sheet. Further, the infrared transmission window is formed by providing an opening in the infrared shielding layer and exposing the top plate 12 only in a portion located directly above the infrared sensor 1.

The heated object N is a pan or the like formed of a magnetic material (iron or the like) or a non-magnetic material (aluminum or the like).
The electromagnetic coil 13 is arranged in an annular shape or a spiral shape below the top plate 12 and in the main body case 14, and generates a high-frequency magnetic field when electric power is supplied by an alternating current to generate an object to be heated on the top plate 12. N is induction-heated.

  The control unit C is connected to the electromagnetic coil 13 and supplies an electric power to the electromagnetic coil 13. The controller C is connected to the infrared sensor 1 and outputs from the first and second thermal elements 3A and 3B. And a sensor circuit (not shown) for calculating the temperature of the object N to be heated, and having a function of controlling the power supplied to the electromagnetic coil 13 based on the temperature of the object N to be obtained. Yes.

  The sensor circuit computes the difference (output difference) between the infrared rays detected by the first thermal element 3A and the second thermal element 3B, and uses the second thermal element 3B as a reference for the first thermal element. It has a function of calculating the temperature detected at 3A.

  The infrared sensor 1 is mounted on the substrate 15 and installed at the center of the electromagnetic coil 3. A heat insulating cylinder member 16 is installed on the substrate 15 around the infrared sensor 1. As the heat insulating cylinder member 16, for example, a resin member having an aluminum film formed on the inner surface is employed. The heat insulating cylinder member 16 has a windshield function for blocking the air flow from the outer periphery and has a heat insulating function for making it difficult to transfer the surrounding heat to the inside by a highly heat insulating resin material.

  As shown in FIGS. 2 to 6, the infrared sensor 1 includes an insulating film 2, a first thermal element 3 </ b> A and a first thermosensitive element 3 </ b> A provided on one surface (lower surface) of the insulating film 2 so as to be spaced apart from each other. Two heat sensitive elements 3B and a pair of first wiring film 4A and second heat sensitive element 3B, which are conductive metal films formed on one surface of insulating film 2 and connected to first heat sensitive element 3A. A pair of second wiring films 4B, which are connected conductive metal films, an infrared reflecting film 6 provided on the other surface of the insulating film 2 so as to face the second thermal element 3B, and an insulating film 2 and a housing 7 that supports the insulating film 2 and accommodates the first thermal element 3A and the second thermal element 3B in an internal accommodating portion 7a.

  As shown in FIG. 5, the first wiring film 4A is arranged up to the periphery of the first thermal element 3A and has a larger area than the second wiring film 4B. These first wiring films 4 </ b> A are provided with a first thermosensitive element 3 </ b> A at the center of a pair, and the outer shape of the first wiring film 4 </ b> A is set to be substantially the same as the infrared reflecting film 6. That is, the area and shape of the first wiring film 4A are substantially the same as those of the infrared reflection film 6, and the heat capacity is set to be substantially equal to the portion of the insulating film 2 where the infrared reflection film 6 is formed.

The pair of first wiring films 4A is connected to the first adhesive electrode 5A formed on the insulating film 2 at one end thereof and to the other end portion on the insulating film 2 respectively. The first terminal electrode 7 </ b> A formed on is connected.
Further, the pair of second wiring films 4B are formed in a linear shape, and one end portion thereof is connected to the second adhesive electrode 5B formed on the insulating film 2, and the other end portion. A second terminal electrode 7B formed on the insulating film 2 is connected to each other.
Note that the terminal electrodes 3a of the first heat sensitive element 3A and the second heat sensitive element 3B are bonded to the first adhesive electrode 5A and the second adhesive electrode 5B, respectively, with a conductive adhesive such as solder.

  The insulating film 2 is formed of a polyimide resin sheet, and the infrared reflection film 6, the first wiring film 4A, and the second wiring film 4B are formed of copper foil. That is, these are both surfaces in which the float electrode of copper foil used as the infrared reflecting film 6, the first wiring film 4A and the second wiring film 4B is patterned on both surfaces of the polyimide substrate used as the insulating film 2. It is made of a flexible substrate.

  Further, as shown in FIG. 6, the infrared reflection film 6 is arranged in a square shape directly above the second heat sensitive element 3B, and is composed of a copper foil and a gold plating film laminated on the copper foil. Has been. A polyimide resin cover is provided on the lower surface of the insulating film 2 to cover the entire lower surface including the first wiring film 4A and the second wiring film 4B except for the first terminal electrode 7A and the second terminal electrode 7B. A ray is formed.

  The infrared reflecting film 6 is formed of a material having an infrared emissivity higher than that of the insulating film 2 and is formed by applying a gold plating film on the copper foil as described above. In addition to the gold plating film, for example, a mirror-deposited aluminum vapor deposition film or an aluminum foil may be used. The infrared reflecting film 6 is formed to cover the second thermal element 3B with a size larger than that of the second thermal element 3B.

  The first heat sensitive element 3A and the second heat sensitive element 3B are chip thermistors in which terminal electrodes 3a are formed at both ends. As this thermistor, there are thermistors of NTC type, PTC type, CTR type and the like. In this embodiment, for example, NTC type thermistors are employed as the first thermal element 3A and the second thermal element 3B. This thermistor is formed of a thermistor material such as a Mn—Co—Cu-based material or a Mn—Co—Fe-based material. The first thermal element 3A and the second thermal element 3B are mounted on the insulating film 2 by bonding the terminal electrodes 3a onto the corresponding first adhesive electrode 5A or the second adhesive electrode 5B. Has been.

  The casing 7 is made of a resin such as PPS (polyphenylene sulfide resin), and houses the first and second thermal elements 3A and 3B as shown in FIG. Also, a storage portion 7a, which is a space covered with air having low thermal conductivity, is provided inside.

  A bottom surface reflecting film 9 that reflects infrared rays is formed on the bottom surface of the housing 7 facing the insulating film 2. As the bottom reflective film 9, a film similar to the infrared reflective film 6 can be adopted. Thus, by directly reflecting and blocking the radiant heat radiated from the bottom surface in the housing 7 by the bottom reflective film 9, the influence on the opposing insulating film 2 and the thermal elements 3A and 3B can be suppressed. .

  As shown in FIG. 2, the casing 7 is provided on the side surface, and the upper end is connected to the second terminal electrode 7B of the first wiring film 4A or the second wiring film 4B and extends to the bottom. The plurality of side surface electrode portions 10a and a plurality of mounting external terminals 10b that are connected to the lower end of the side surface electrode portion 10a at the lower portion of the side surface and are connected to the external substrate 15 are provided. That is, the infrared sensor 1 of the present embodiment is a surface mount type. The side electrode part 10a and the mounting external terminal 10b are made of, for example, a tin-plated copper alloy.

  As described above, in the induction heating cooker 10 of the present embodiment, the infrared sensor 1 includes the first thermal element 3A and the second thermal element 3B that are provided on one surface of the insulating film 2 so as to be separated from each other. Since it has the infrared reflective film 6 provided on the other surface of the insulating film 2 so as to face the second heat sensitive element 3B, the first heat sensitive elements for detection arranged on the insulating film 2 with each other. The temperature distribution generated in 3A and the compensation second thermosensitive element 3B is reduced. For this reason, both the heat sensitive elements on the insulating film 2 are simultaneously affected and sensitively affected by the temperature fluctuation due to the heat from the electromagnetic coil 13, so that the radiant heat from the pan bottom (the heated object N) is detected with high accuracy. can do.

  Therefore, even if the amount of heat received by the infrared sensor 1 is large, it is possible to detect the temperature of the pan bottom (object to be heated N) with high accuracy in a non-contact manner, and it is necessary to have a space and a support structure for heat isolation from the electromagnetic coil 13 The support structure of the infrared sensor 1 is simplified, and a cooling device is not required. Further, even with a simplified support structure, temperature detection can be performed with high accuracy. Furthermore, it can be installed inside in a small space, and the overall size and cost can be reduced.

  Further, since the first wiring film 4A of the infrared sensor 1 is arranged even around the first thermal element 3A and has a larger area than the second wiring film 4B, the infrared film of the insulating film 2 is formed. In addition to improving the heat collection from the portion that absorbs heat, the heat capacity is close to the portion of the insulating film 2 where the infrared reflecting film 6 is formed, so that the fluctuation error can be reduced. For this reason, both the heat sensitive elements on the insulating film 2 are simultaneously affected and sensitively affected by ambient temperature fluctuations, so that the radiant heat from the heated object N via the top plate 12 can be detected with high accuracy. Can do. Further, the first wiring film 4A having a large area blocks the infrared rays that pass through the insulating film 2 and irradiate the casing 7, and blocks the radiant heat radiated from the casing 7 to the insulating film 2. The thermal effect of can be suppressed.

For the infrared sensor 1 used in the induction heating cooker of the present invention, an experiment was performed in comparison with the conventional infrared temperature sensor of Patent Document 2.
In this experiment, in order to make it easy to compare the sensor performance, as shown in FIG. 7, not the top plate of the induction heating cooker, but the desk D with the black body tape T applied as the measurement object, The infrared sensor 1 was installed at an interval above, and a Peltier element P was placed on the infrared sensor 1, and the temperature of the desk D was measured while heating and cooling the infrared sensor 1 directly. In addition, another temperature sensor (not shown) was directly attached to the desk D, and the temperature (actual value) of the desk D was measured.

First, when the infrared sensor 1 is heated by the Peltier element P, the absorption film temperature (temperature at the first thermal element 3A) and the reflection film temperature (temperature at the second thermal element 3B) in the infrared sensor 1 used in the present invention. FIG. 8 shows a temporal change between the temperature) and the temperature of the Peltier element P. Moreover, each temperature in the said conventional infrared temperature sensor similarly installed and measured as a comparison is shown in FIG.
As can be seen from FIGS. 8 and 9, the conventional infrared sensor described above has a large time change (inclination difference) between the absorption film temperature and the reflection film temperature, whereas the infrared sensor used in the present invention. In 1, the time change of the temperature difference between the absorption film temperature and the reflection film temperature is small.

  Next, when the Peltier element P is heated to 48 ° C. from a state where the Peltier element P is not operated (the temperature of the desk D is 22 ° C.), and then cooled to 4 ° C., the temperature of the infrared sensor 1 used in the present invention ( The time change between the “sensor” in the figure), the measured temperature of the desk D (the desk (actually measured) in the figure), and the calculated temperature of the desk D measured by the infrared sensor 1 (the desk (calculated) in the figure). As shown in FIG. Moreover, each temperature in the said conventional infrared temperature sensor similarly installed and measured as a comparison is shown in FIG.

  As can be seen from FIGS. 10 and 11, in the above-described conventional infrared temperature sensor, when the temperature of the infrared temperature sensor greatly changes due to the Peltier element P, the calculated temperature of the desk D measured by the infrared temperature sensor becomes the actually measured temperature of the desk D. On the other hand, in the infrared sensor 1 used in the present invention, the calculated temperature of the desk D measured by the infrared sensor 1 is almost the same as the measured temperature of the desk D. Therefore, the infrared sensor 1 used in the present invention can accurately estimate the temperature of the measurement object as compared with the conventional infrared sensor even if its own temperature changes.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above embodiment, the first heat-sensitive element detects heat conducted from the insulating film that directly absorbs infrared rays. However, the first heat-sensitive element directly absorbs infrared rays on the insulating film immediately above the first heat-sensitive element. A film may be formed. In this case, the infrared absorption effect in the first thermal element is further improved, and a better temperature difference between the first thermal element and the second thermal element can be obtained. That is, the infrared ray absorbing film absorbs infrared rays due to radiation from the object to be heated, and the temperature of the first heat-sensitive element immediately below is obtained by heat conduction through the insulating film from the infrared ray absorbing film that has absorbed infrared rays and generated heat. May be changed.

This infrared absorbing film is formed of a material having an infrared absorption rate higher than that of the insulating film. For example, a film containing an infrared absorbing material such as carbon black or an infrared absorbing glass film (borosilicate containing 71% silicon dioxide). A material formed of a glass film or the like can be used. In particular, the infrared absorbing film is preferably an antimony-doped tin oxide (ATO) film. This ATO film has better infrared absorption and light resistance than carbon black or the like. In addition, since the ATO film is cured with ultraviolet rays, it has a high adhesive strength and is less likely to be peeled off than carbon black or the like.
In addition, it is preferable to form this infrared rays absorption film so that this may be covered with a larger size than a 1st thermal element.

Moreover, although the 1st thermal element and the 2nd thermal element of a chip | tip thermistor are employ | adopted, you may employ | adopt the 1st thermal element and the 2nd thermal element which were formed with the thin film thermistor.
As described above, the thermosensitive element is preferably a thin film thermistor or a chip thermistor, but a pyroelectric element or the like can also be employed in addition to the thermistor element.

  DESCRIPTION OF SYMBOLS 1 ... Infrared sensor, 2 ... Insulating film, 3A ... 1st thermosensitive element, 3B ... 2nd thermosensitive element, 4A ... 1st wiring film, 4B ... 2nd wiring film, 6 ... Infrared reflective film, 10 ... Induction heating cooker, 12 ... Top plate, 13 ... Electromagnetic coil, C ... Control unit, N ... Substance to be heated

Claims (5)

A top plate on which the object to be heated is placed; an electromagnetic coil that is installed at a lower portion of the top plate to heat the object to be heated by electromagnetic induction heating; and is installed below the top plate and separated from the top plate. An induction heating cooker including an infrared sensor that detects infrared rays emitted from an object to be heated through a top plate,
The infrared sensor is formed on an insulating film, a first thermal element and a second thermal element provided on one surface of the insulating film and spaced from each other, and one surface of the insulating film. A conductive first wiring film connected to the first thermal element, a conductive second wiring film connected to the second thermal element, and the second thermal element facing the second thermal element. An induction heating cooker comprising an infrared reflecting film provided on the other surface of the insulating film. The induction heating cooker according to claim 1,
The induction heating cooker characterized in that the first wiring film is arranged up to the periphery of the first thermal element and has a larger area than the second wiring film. In the induction heating cooker according to claim 1 or 2,
The insulating film is formed of a polyimide substrate;
The induction heating cooker, wherein the infrared reflection film, the first wiring film, and the second wiring film are formed of copper foil. In the induction heating cooker according to any one of claims 1 to 3,
The said infrared reflective film is comprised with the said copper foil and the gold plating film laminated | stacked on this copper foil, The induction heating cooking appliance characterized by the above-mentioned. In the induction heating cooker according to any one of claims 1 to 4,
The induction heating cooker, wherein the first heat sensitive element and the second heat sensitive element are thermistor elements.