JP2012225669A - Position information detection sensor, manufacturing method for position information detection sensor, encoder, motor device, and robot device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a position information detection sensor capable of size reduction, a manufacturing method for a position information detection sensor, an encoder, a motor device, and a robot device.SOLUTION: A position information detection sensor includes a first chip on which a light detection part for detecting light via an optical pattern is mounted, and a second chip which is bonded to the first chip in a state that a surface of the second chip faces a surface of the first chip and on which a magnetic field detection part for detecting the magnetic field of a magnetic pattern is mounted.

Description

  The present invention relates to a position information detection sensor, a method for manufacturing a position information detection sensor, an encoder, a motor device, and a robot device.

  An encoder is known as a device that detects rotational speed and position information of a rotating body such as a rotating shaft of a motor (for example, Patent Document 1). For example, the encoder is used by being attached to a rotating shaft of a motor. As a specific configuration of the encoder, for example, a rotating part on which a predetermined light reflection pattern and a magnetic pattern are formed is rotated integrally with a rotation shaft, and the reflected light is read by irradiating light on the light reflection pattern, for example, By detecting the change of the pattern, the rotation information of the rotating shaft of the motor can be detected.

  The encoder having the above-described configuration includes the rotating unit and a main body having a detecting unit that detects a change in reflected light or a magnetic pattern, for example. As a sensor for reading light through the light reflection pattern, for example, a light emitting / receiving sensor having a light emitting part and a light receiving part is used. A magnetic sensor is used as a sensor for detecting a change in the magnetic pattern.

JP 2004-20548 A

  However, the light emitting / receiving sensor and the magnetic sensor are formed as independent components, and are mounted at different positions on the main body. For this reason, it is necessary to secure a space for mounting the light emitting / receiving sensor and the magnetic sensor in the main body, which has been a problem in miniaturizing the main body.

  In view of the circumstances as described above, an object of the present invention is to provide a position information detection sensor, a method for manufacturing the position information detection sensor, an encoder, a motor device, and a robot device that can be miniaturized.

  According to the first aspect of the present invention, the first chip on which the light detection unit for detecting light via the optical pattern is mounted and the first chip are bonded with the surfaces facing each other. There is provided a position information detection sensor including a second chip on which a magnetic field detection unit for detecting a magnetic field by a magnetic pattern is mounted.

  According to the second aspect of the present invention, the light detection unit forming step of mounting the light detection unit for detecting light via the optical pattern on the first chip, and the second magnetic field detection unit for detecting the magnetic field by the magnetic pattern are provided. There is provided a method for manufacturing a position information detection sensor, comprising: a magnetic field detection unit forming step mounted on a chip; and a bonding step of bonding a first chip and a second chip with their surfaces facing each other.

  According to the third aspect of the present invention, a rotating unit fixed to a rotor to be measured and formed with an optical pattern and a magnetic pattern, a detecting unit for detecting a magnetic field by the light and the magnetic pattern via the optical pattern, And an encoder in which the position information detection sensor according to the first aspect of the present invention is used as a detection unit.

  According to the fourth aspect of the present invention, a rotor, a drive unit that rotates the rotor, and an encoder that is fixed to the rotor and detects position information of the rotor are provided. A motor apparatus is provided in which an encoder according to the third aspect is used.

  According to a fifth aspect of the present invention, there is provided a robot apparatus comprising a rotating member and a motor device for rotating the rotating member, wherein the motor device according to the fourth aspect of the present invention is used as the motor device. The

  According to the aspect of the present invention, it is possible to provide a position information detection sensor that can be miniaturized, a method for manufacturing the position information detection sensor, an encoder, a motor device, and a robot device.

The top view which shows the structure of the position information detection sensor which concerns on 1st embodiment of this invention. Sectional drawing which shows the structure of the positional information detection sensor which concerns on this embodiment. The block diagram which shows the processing system of the positional information detection sensor which concerns on this embodiment. The figure which shows the manufacture process of the positional information detection sensor which concerns on this embodiment. The figure which shows the manufacture process of the positional information detection sensor which concerns on this embodiment. The figure which shows the manufacture process of the positional information detection sensor which concerns on this embodiment. The figure which shows the manufacture process of the positional information detection sensor which concerns on this embodiment. The top view which shows the structure of the position information detection sensor which concerns on 2nd embodiment of this invention. The side view which shows the structure of the position information detection sensor which concerns on this embodiment. The top view which shows the structure of the position information detection sensor which concerns on 3rd embodiment of this invention. The side view which shows the structure of the position information detection sensor which concerns on this embodiment. The figure which shows the structure of the motor apparatus and encoder which concern on 4th embodiment of this invention. The figure which shows the structure of a part of encoder based on this embodiment. The figure which shows the structure of the robot apparatus which concerns on 5th embodiment of this invention. The figure which shows the other structural example of the positional infomation detection sensor which concerns on this invention. The figure which shows the other structural example of the positional infomation detection sensor which concerns on this invention.

[First embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing a configuration of a position information detection sensor 100 according to the present embodiment.
As illustrated in FIG. 1, the position information detection sensor 100 includes a first chip 50 on which the light detection unit 40 is mounted and a second chip 70 on which the magnetic field detection unit 60 is mounted.

  The first chip 50 and the second chip 70 are each formed in a plate shape having a rectangular outer shape. The first chip 50 and the second chip 70 are bonded together with the first surface 50f and the first surface 70f facing each other (chip-on-chip bonding: see FIG. 2 and the like). A plurality of, for example, two second chips 70 are provided. The two second chips 70 are joined to different regions of the first surface 50 f of the first chip 50. In the present embodiment, the first chip 50 and the second chip 70 are chip-on-chip bonded by flip chip mounting.

  The light detection unit 40 is mounted on the first surface 50 f of the first chip 50. Therefore, the second chip 70 is bonded to the mounting surface of the first chip 50 on which the light detection unit 40 is mounted. The light detection unit 40 detects light via a predetermined optical pattern. Examples of the optical pattern include an origin pattern, an incremental pattern, an absolute pattern, and the like. The magnetic field detector 60 mounted on the second chip 70 detects a magnetic field based on a predetermined magnetic pattern.

  Hereinafter, in the description of each drawing, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A direction parallel to one side of the first chip 50 is defined as an X direction, a direction orthogonal to the one side is defined as a Y direction, and a thickness direction of the first chip 50 is defined as a Z direction.

  The first chip 50 includes a base material 51, a processing circuit 52, an electrode 53, a light emitting unit 54, and a first connection terminal 55. The base material 51 is formed using a semiconductor material such as silicon, for example, and is formed in a rectangular plate shape as viewed in the Z direction. The processing circuit 52 is formed inside the base material 51. The processing circuit 52 processes information detected by the light detection unit 40 and the magnetic field detection unit 60.

  The electrode 53 inputs and outputs signals between the first chip 50 and the outside (for example, an external controller). A plurality of electrodes 53 are arranged along the + X side and the −X side of the first chip 50. The electrode 53 includes a first electrode 53 a connected to the processing circuit 52, the light emitting unit 54, the light detection unit 40, and the like, and a second electrode 53 b connected to the magnetic field detection unit 60. The first electrode 53a and the second electrode 53b are arranged in a line in the Y direction. The first electrode 53a and the second electrode 53b are electrically connected to an external electrode via a lead wire indicated by a one-dot chain line in the drawing.

  The light emitting unit 54 emits light that irradiates the light pattern. The light emitting unit 54 is disposed at the center of the first chip 50 as viewed in the Z direction. The light emitting unit 54 includes a light emitting element 54a, a connection unit 54b, and a cathode electrode 54c, and an anode electrode (not shown). The light emitting element 54a is formed so as to emit laser light in one direction or a plurality of directions. The connection portion 54b and the cathode electrode 54c are connected by, for example, a lead wire.

  The light detection unit 40 receives light via the light pattern. The light detection unit 40 includes a first light receiving unit 41 and a second light receiving unit 42. The first light receiving unit 41 detects an incremental pattern among the light patterns. The first light receiving unit 41 is disposed on the + Y side of the light emitting unit 54 and the light detecting unit 40. The second light receiving unit 42 detects an absolute pattern among the light patterns. The second light receiving unit 42 is disposed on the −Y side of the light emitting unit 54 and the light detecting unit 40. Therefore, the first light receiving unit 41 and the second light receiving unit 42 are arranged with the light emitting unit 54 and the light detecting unit 40 sandwiched in the Y direction.

  Each of the first light receiving unit 41 and the second light receiving unit 42 includes a plurality of light receiving elements 43. As the light receiving element 43, for example, a photodiode or the like is used. The light receiving element 43 is arranged along the −Y side and the + Y side of the substrate 51. The light receiving element 43 is formed in a shape corresponding to the shape of the light pattern. About the number of the light receiving elements 43, it can change suitably according to the structure of an optical pattern.

  The second chip 70 has a base material 71 and second connection terminals 75. A plurality of second connection terminals 75 are provided on the first surface 71 a of the base material 71. Each of the plurality of second connection terminals 75 is disposed so as to overlap each of the first connection terminals 55. The first connection terminal 55 and the second connection terminal 75 are connected between the first chip 50 and the second chip 70 via a conductive film such as an anisotropic conductive material.

  The magnetic field detection unit 60 includes a first detection unit 61 formed on one second chip 70A of the two second chips 70, and a second detection unit 62 formed on the other second chip 70B. The second chip 70 is disposed on the −X side with respect to the central portion of the first chip 50. The second chip 70 </ b> B is disposed on the + X side with respect to the central portion of the first chip 50. Therefore, the first detection unit 61 and the second detection unit 62 mounted on the second chips 70 and 60B are arranged at positions sandwiching the central part of the first chip 50.

  Note that the first detection unit 61 and the second detection unit 62 may be arranged at the center of the first chip 50 or at the end of the first chip 50. The first detection unit 61 and the second detection unit 62 in the present embodiment are unidirectional in which at least two of the first light receiving unit 41, the second light receiving unit 42, and the light emitting unit 54 are arranged side by side on the chip substrate. Or at least two of the first light receiving unit 41, the second light receiving unit 42, and the light emitting unit 54 are arranged along one direction arranged side by side on the chip substrate. It is also possible (such as FIG. 10 described later).

  The first detection unit 61 and the second detection unit 62 have a magnetic thin film 63. The magnetic thin film 63 has two orthogonal repeating patterns formed by, for example, metal wiring. The magnetic thin film 63 is connected to the second electrode 53 b by a wiring 64. The second connection terminal 75 is connected to the second electrode 53b via the first connection terminal 55 on the first chip 50 side.

FIG. 2 is a diagram illustrating a configuration when the configuration along the C1-C5 (C1-C2-C3-C4-C5) cross section in FIG. 1 is developed in the left-right direction.
As shown in FIG. 2, the insulating layer 57, the light receiving element 43, the protective layer 56, and the electrode 53 are sequentially stacked on the first surface 51 a on the + Z side of the base material 51 in the first chip 50.

The insulating layer 57 is formed using, for example, SiO ₂ . The light receiving element 43 is formed on the insulating layer 57 and is covered with the protective layer 56. The protective layer 56 is formed using, for example, SiN or SiO ₂ . On the protective layer 56, a first electrode 53a and a second electrode 53b are formed. The first electrode 53a is connected to the light receiving element 43 via a wiring (not shown).

  A shield layer 77, an insulating layer 78, a magnetic thin film 63, a protective layer 79, and a second connection terminal 75 are sequentially stacked on the first surface 71 a of the base 71 of the second chip 70. The shield layer 77 is formed using a metal such as aluminum. The shield layer 77 has a function of shielding at least a part of a magnetic field other than the magnetic field by the predetermined magnetic pattern and reducing noise of an electric signal output from the magnetic thin film 63.

  The insulating layer 78 is formed using, for example, SiO2. The protective layer 79 is formed using, for example, SiN or SiO2. The magnetic thin film 63 is formed on the insulating layer 78 and is covered with a protective layer 79. A second connection terminal 75 is formed on the protective layer 79. The second connection terminal 75 is connected to the first connection terminal 55 via the conductive adhesive 80. Further, the conductive adhesive 80 has a function of fixing the first chip 50 and the second chip 70.

FIG. 3 is a block diagram showing a control circuit CC which is an example of the circuit configuration of the first chip 50.
As shown in FIG. 3, the first chip 50 includes an amplifier 44 and a comparator 46 connected to the light receiving element 43 of the first light receiving unit 41 that detects an incremental pattern, and a second light receiving unit 42 that detects an absolute pattern. An amplifier 45 and a comparator 47 connected to the light receiving element 43 are formed. The comparator 46 receives the detection signal detected by the first light receiving unit 41 and amplified by the amplifier 44. Then, the comparator 46 generates a binarized incremental signal INC and transmits the incremental signal INC to the processing circuit 52. The comparator 47 receives the detection signal detected by the second light receiving unit 42 and amplified by the amplifier 45. Then, the comparator 47 generates an absolute signal ABS that is binarized by one rotation signal in the second light receiving unit 42 and transmits the absolute signal ABS to the processing circuit 52.

  The first chip 50 is provided with a comparator 66 connected to the magnetic thin film 63 of the first detector 61 and the second detector 62. The comparator 66 is connected to the processing circuit 52. The comparator 66 receives the detection signals (MAn, MAp, MBn, MBp) detected by the magnetic field detection unit 60. Then, the comparator 66 generates binarized multi-rotation signals MA and MB, and transmits the multi-rotation signals MA and MB to the processing circuit 52.

  The processing circuit 52 generates multi-rotation information MT based on the multi-rotation signals MA and MB received from the comparator 66, and based on the interpolation incremental signal INC received from the comparator 46 and the absolute signal ABS received from the comparator 47. One rotation information ST is generated. For example, the processing circuit 52 outputs position information including the multi-rotation information MT and the single-rotation information ST to the external controller CONT in a serial manner in response to a request from the external controller CONT. The processing circuit 52 is connected to the first electrode 53a. For example, the position information is output to the external controller CONT via the first electrode 53a. Note that the control circuit CC in the present embodiment is configured to include the amplifiers 44 and 45, the comparators 46 and 47, the comparator 66, and the processing circuit 52, but may be configured not to include the processing circuit 52, for example. Further, the single rotation information ST in the present embodiment is absolute position information, but may be relative position information.

Next, with reference to FIGS. 4-7, the manufacturing method of the positional information detection sensor 100 comprised as mentioned above is demonstrated.
4-7 is a figure which shows the manufacturing process of the positional information detection sensor 100. FIG.
First, the 1st chip | tip 50 with which the photon detection part 40 was mounted is formed (photodetection part formation process). As shown in FIG. 4, an insulating layer 57 is formed on the first surface 51a of the base material 51 on which the processing circuit 52, the amplifiers 44 and 45, and the comparators 46, 47 and 66 are formed. In addition, you may perform the process of forming said processing circuit 52, amplifier 44 and 45, and comparators 46, 47, and 66 in the base material 51 (control circuit formation process). After forming the insulating layer 57, the light receiving element 43 and a wiring (not shown) are patterned on the insulating layer 57 by using, for example, a sputtering method, a photolithography method, or an etching method. After forming the light receiving element 43 and a wiring (not shown), a protective layer 56 is formed on the insulating layer 57 including the light receiving element 43 (protective layer forming step).

  After the protective layer 56 is formed, the first electrode 53a, the second electrode 53b, the first connection terminal 55, and the wiring 64 are patterned on the protective layer 56 as shown in FIG. Thus, since the wiring layer on the surface of the first chip 50 is formed in the same process, the first chip 50 is efficiently manufactured.

  Next, the 2nd chip | tip 70 with which the magnetic field detection part 60 was mounted is formed (magnetic field detection part formation process). The two second chips 70 used in the present embodiment are formed in the same process. Hereinafter, the manufacturing process of one second chip 70 will be described as a representative. As shown in FIG. 6, a shield layer 77 is formed on the first surface 71a of the substrate 71 (shield layer forming step). After forming the shield layer 77, an insulating layer 78 is formed on the shield layer 77. After the insulating layer 78 is formed, the magnetic thin film 63 is formed on the insulating layer 78 by using, for example, a sputtering method, a photolithography method, or an etching method (magnetic field detection unit forming step). After forming the magnetic thin film 63, a protective layer 79 is formed on the insulating layer 78 including the magnetic thin film 63 (protective layer forming step). After forming the protective layer 79, the second connection terminal 75 is formed on the protective layer 79.

  Next, as shown in FIG. 7, the second chip 70 on which the magnetic field detection unit 60 is mounted is bonded to the first chip 50 on which the light detection unit 40 is mounted (bonding step). In this step, the solidified conductive adhesive 80 is sandwiched between the first connection terminal 55 of the first chip 50 and the second connection terminal 75 of the second chip 70, and the conductive adhesive is bonded by a thermocompression bonding method or the like. The first connection terminal 55 and the second connection terminal 75 are bonded by the conductive adhesive 80 by dissolving 80. Thereby, the first connection terminal 55 and the second connection terminal 75 are electrically connected, and the first chip 50 and the second chip 70 are fixed. Through the above steps, the position information detection sensor 100 is formed.

  As described above, according to the present embodiment, the surfaces of the first chip 50 on which the light detection unit 40 that detects light via the optical pattern is mounted and the first chip 50 face each other. Since it is provided with the second chip 70 that is bonded in a state and mounted with the magnetic field detection unit 60 that detects the magnetic field by the magnetic pattern, the size can be reduced as compared with the case where both are mounted at different positions.

  Further, according to the present embodiment, since the first chip 50 and the second chip 70 can be mounted on a chip-on-chip in the manufacturing process, the manufacturing cost can be reduced. Further, according to the present embodiment, a plurality of functions such as an amplifier (eg, amplifiers 44 and 45) and a comparator (eg, comparators 46, 47 and 66) can be built in the first chip 50 or the second chip 70. Improves noise resistance performance.

  For example, the position information detection sensor 100 according to the present embodiment has a plurality of functions such as an amplifier (eg, amplifiers 44 and 45) and a comparator (eg, comparators 46, 47, and 66) having the first chip 50 or the second chip 70. Since the length of the line connecting each other can be shortened by incorporating in the circuit, the line connecting the magnetic field detection unit 60 and the comparator 66, the amplifier (eg, the amplifiers 44 and 45) and the comparator (eg, the comparators 46 and 47) are provided. The connecting line, the line connecting the light detection unit 40 and the amplifier (eg, the amplifiers 44 and 45), and the like can be formed with a minute line in consideration of downsizing and backup.

[Second Embodiment]
Next, a second embodiment of the present invention will be described.
FIG. 8 is a plan view showing a configuration of the position information detection sensor 200 according to the present embodiment. FIG. 9 is a side view showing the configuration of the position information detection sensor 200.
As shown in FIGS. 8 and 9, in the present embodiment, the second chip 70 is chip-on-chip bonded to the first chip 50 using a wire 90. About another structure, it is substantially the same as the position information detection sensor 100 which concerns on 1st embodiment. In the present embodiment, the first chip 50 and the second chip 70 are chip-on-chip bonded by bare chip mounting.

  The second chip 70 is provided with second connection terminals 75 at four corners on the surface on the + Z side in the drawing. The first connection terminals 55 are provided on the first chip 50 one by one at positions shifted from the four corners of the second chip 70. The first connection terminal 55 and the second connection terminal 75 arranged at positions corresponding to the respective corners of the second chip 70 are connected to each other through the wire 90. The first connection terminal 55 is connected to, for example, the second electrode 53b through the wiring 64. In the present embodiment, the second chip 70 is bonded to the first surface 50f, which is the mounting surface on which the light detection unit 40 is mounted, of the first chip 50.

  Thus, according to the present embodiment, in the configuration in which the first chip 50 and the second chip 70 are joined using the wire 90, the first chip 50 and the second chip 70 are respectively placed at different positions. The size can be reduced as compared with the case of mounting.

[Third embodiment]
Next, a second embodiment of the present invention will be described.
FIG. 10 is a plan view showing the configuration of the position information detection sensor 300 according to this embodiment. FIG. 11 is a side view showing the configuration of the position information detection sensor 300.
As shown in FIGS. 10 and 11, in the present embodiment, the first chip 50 is chip-on-chip bonded to the first surface 70 f that is the mounting surface on which the magnetic field detection unit 60 is mounted in the second chip 70. It has become. As an example, in the present embodiment, the first chip 50 and the second chip 70 are chip-on-chip bonded by bare chip mounting.

  A light detection unit 40 is mounted on the first chip 50. The first chip 50 is provided with a processing circuit 52, a light emitting unit 54, and a first connection terminal 55. About the processing circuit 52 and the light emission part 54, it has the structure substantially the same as 1st embodiment. One first connection terminal 55 is provided at each of the four corners of the + Z side surface of the first chip 50. The first connection terminal 55 is connected to the light receiving element 43 of the light detection unit 40 through a wiring (not shown).

  A magnetic field detection unit 60 is mounted on the second chip 70. The second chip 70 is provided with an electrode 73 and a second connection terminal 75. The electrode 73 inputs and outputs a signal between the second chip 70 and the outside (for example, an external controller). A plurality of electrodes 73 are arranged along the + X side and the −X side of the second chip 70. The electrode 73 includes a first electrode 73 a connected to the first chip 50 and a second electrode 73 b connected to the magnetic field detection unit 60. The first electrode 73a and the second electrode 73b are arranged in a line in the Y direction. The first electrode 73a and the second electrode 73b are electrically connected to an external electrode via a lead wire indicated by a one-dot chain line in the drawing.

  The second connection terminals 75 are provided one by one at positions shifted from the four corners of the first chip 50. These second connection terminals 75 and the first connection terminals 55 arranged at positions corresponding to the respective corners of the first chip 50 are connected via wires 90, respectively. The second connection terminal 75 is connected to the second electrode 73b through the wiring 64, for example.

  Thus, according to the present embodiment, in the configuration in which the first chip 50 is joined to the first surface 70f that is the mounting surface on which the magnetic field detection unit 60 is mounted in the second chip 70, the first chip 50 and Compared to the case where the second chip 70 and the second chip 70 are mounted at different positions, the size can be reduced.

[Fourth embodiment]
Next, a fourth embodiment of the present invention will be described.
FIG. 12 is a diagram illustrating a configuration of the encoder and the motor device according to the present embodiment.
As shown in FIG. 12, the motor device MTR includes a rotation shaft SF, a drive unit BD that rotates the rotation shaft SF, and an encoder EC that detects rotation information of the rotation shaft SF. In FIG. 12, the central axis direction of the rotation axis SF is set as the Z direction.

  The encoder EC has a rotating part R and a detecting part D. The rotating part R is fixed to the rotating shaft SF of the motor device MTR and rotates integrally with the rotating shaft SF. The rotating portion R is formed in a disk shape using, for example, SUS. By using a material having high rigidity such as SUS as a constituent material of the rotating portion R, the rotating portion R having excellent deformation resistance and the like is formed. Of course, other materials may be used as the constituent material of the rotating portion R. The rotating part R has a mounting part 320, a pattern forming part 321 and a concave part 323.

  The attachment portion 320 is provided on the lower surface Rb of the rotating portion R. An insertion hole 320a is formed on the lower surface side of the mounting portion 320 in the center portion in plan view. The rotation hole SF of the motor device MTR is inserted into the insertion hole 320a. The attachment portion 320 has a fixing mechanism (not shown) that fixes the rotation shaft SF and the attachment portion 320 in a state where the rotation shaft SF is inserted into the insertion hole 320a.

  The pattern forming portion 321 is provided in an annular shape on the peripheral edge portion of the upper surface Ra of the rotating portion R. A light reflecting pattern 324 is formed on the pattern forming portion 321. The light reflection pattern 324 is formed in an annular shape along the outer periphery of the rotating portion R, for example.

  For example, the light reflection pattern 324 includes an incremental pattern 324a and an absolute pattern 324b. The incremental pattern 324a is formed outside the light reflecting pattern 324 in the radial direction of the rotating portion R. The absolute pattern 324b is formed on the inside of the light reflecting pattern 324 in the radial direction of the rotating portion R.

  The concave portion 323 is formed on the upper surface Ra side opposite to the attachment portion 320. The magnet member M is accommodated in the recess 323.

  The magnet member M is a permanent magnet formed in an annular shape along the rotation direction of the rotating portion R. The magnet member M is arrange | positioned at the peripheral part of the rotation part R, for example. A predetermined magnetic pattern 334 is formed on the magnet member M. As the magnetic pattern 334 of the magnet member M, for example, a magnetic field in which a half region of the ring is magnetized to the N pole and the other half region of the ring is magnetized to the S pole when viewed in the axial direction of the rotation axis SF. Examples include patterns. The magnet member M is accommodated in the recess 323 of the rotating part R. The magnet member M is fixed to the rotating part R through, for example, an adhesive (not shown). Therefore, the magnet member M is integrally formed with the rotating part R.

  The detection unit D includes a housing 341, a sensor SR, and a bias magnet 342. The sensor SR detects light via the light reflection pattern 324 and a magnetic field generated by the magnetic pattern 334 of the magnet member M. As the sensor SR, for example, the position information detection sensor 100 described in the first embodiment, the position information detection sensor 200 described in the second embodiment, or the like is used.

  The bias magnet 342 is a magnet that forms a combined magnetic field with the magnetic field of the magnet member M. Examples of the material constituting the bias magnet 342 include a rare-earth magnet having a large magnetic force such as samarium / cobalt.

  The magnetic thin film 63 provided in the first detection unit 61 and the second detection unit 62 in the magnetic field detection unit 60 of the sensor SR functions as a magnetoresistive element with the bias magnet 342. That is, when the direction of the magnetic field is close to the direction perpendicular to the direction of the current flowing in the repetitive pattern of the magnetic thin film 63, the electric resistance is lowered. The magnetic thin film 63 converts the direction of the magnetic field into an electric signal by using the decrease in electric resistance.

  Next, the positional relationship between the first detection unit 61 and the second detection unit 62 and the rotation axis SF will be described. FIG. 13 is a diagram illustrating a configuration of the detection unit D. In FIG. 13, the XYZ directions are set so that the arrangement of the sensors SR matches the arrangement of the position information detection sensors 100 in the first embodiment. In order to explain the positional relationship between the first detection unit 61 and the second detection unit 62 and the rotation axis SF, FIG. 13 shows the position of the rotation axis SF.

  As shown in FIG. 13, a reference line segment SG0 extending in parallel to the Y direction from the central axis C of the rotation axis SF to the sensor SR side is set to 0 ° when viewed from the center axis direction (Z direction view) of the rotation axis SF. An angle formed by the reference line segment SG0 and the first line segment SG1 extending from the central axis C toward the first detection unit 61 in the Z direction view is θ1, and the reference line segment SG0 and the center in the Z direction view are the center. Assuming that the angle formed by the second line segment SG2 extending from the axis C toward the second detection unit 62 is θ2, the first detection unit 61 and the second detection unit 62 have 0 ° <θ1 <90 °, and , 0 ° <θ2 <90 °. In the present embodiment, as an example, the first detection unit 61 and the second detection unit 62 are arranged so that θ1 + θ2 = 90 °. Note that the end of the reference line segment SG0 is not limited to the central axis C of the rotation axis SF, and may be at another position (eg, the central axis of the light reflection pattern 324).

The length of the first line segment SG1 that is the distance from the central axis C to the first detection unit 61 is L1, and the length of the second line segment SG2 that is the distance from the central axis C to the second detection unit 62 is Is L2, the angle formed by the first line segment SG1 and the second line segment SG2 is θ3, and the distance between the first detection unit 61 and the second detection unit 62 is L3, the first detection unit 61 and The second detection unit 62
(L3) ² = (L1) ² + (L2) ² −2 · L1 · L2 · cos θ3
(0 ° <θ3 <180 °)
It is arranged to satisfy.

When L1 = L2, the first detection unit 61 and the second detection unit 62 are arranged on the circumference of the same circle with the central axis C as the center. In this case, if the radius of the circle is R and the length of the arc defined by the angle θ3 is Ra, the first detector 61 and the second detector 62 are
Ra = 2πR × (θ3 / 360 °)
(0 ° <θ3 <180 °)
It is arranged to satisfy.

  As described above, the encoder EC according to the present embodiment is fixed to the rotation shaft SF of the motor device MTR, and the rotating part R in which the light reflection pattern 324 and the magnetic pattern 334 are formed, and the light that passes through the light reflection pattern 324. And the detection unit D that detects the magnetic field by the magnetic pattern 334, and the position information detection sensor 100 or 200 described in the above embodiment is used as the detection unit D. Therefore, the encoder EC is small and has high detection reliability. And a motor device MTR having high rotational characteristics can be provided.

[Fifth embodiment]
Next, a fifth embodiment of the present invention will be described.
FIG. 14 is a diagram illustrating a configuration of a part (tip of a finger portion of a hand robot) of a robot apparatus RBT including the motor apparatus MTR described in the fourth embodiment as an example. The motor device MTR described in the above embodiment may be used as a drive unit that drives the arm unit of the robot device RBT.

  As shown in FIG. 14, the robot apparatus RBT includes a terminal node portion 101, a middle node portion 102, and a joint portion 103, and the terminal node portion 101 and the middle node portion 102 are connected via the joint portion 103. It has become. The joint portion 103 is provided with a shaft support portion 103a and a shaft portion 103b. The shaft support portion 103 a is fixed to the middle joint portion 102. The shaft portion 103b is supported in a state of being fixed by the shaft support portion 103a.

  The end node portion 101 includes a connecting portion 101a and a gear 101b. The shaft portion 103b of the joint portion 103 is penetrated through the connecting portion 101a, and the end node portion 101 is rotatable with the shaft portion 103b as a rotation axis. The gear 101b is a bevel gear fixed to the connecting portion 101a. The connecting portion 101a rotates integrally with the gear 101b.

  The middle joint portion 102 includes a housing 102a and a motor device MTR. As the motor device MTR, the motor device MTR described in the above embodiment can be used. The motor device MTR is provided in the housing 102a. A rotating shaft member 104a is attached to the motor device MTR. A gear 104b is provided at the tip of the rotating shaft member 104a. The gear 104b is a bevel gear fixed to the rotating shaft member 104a. The gear 104b is in mesh with the gear 101b. Note that a configuration in which a gear is directly formed on the rotating shaft member 104a may be employed.

  In the robot apparatus RBT configured as described above, the rotating shaft member 104a rotates by driving the motor apparatus MTR, and the gear 104b rotates integrally with the rotating shaft member 104a. The rotation of the gear 104b is transmitted to the gear 101b meshed with the gear 104b, and the gear 101b rotates. As the gear 101b rotates, the connecting portion 101a also rotates, whereby the end node portion 101 rotates about the shaft portion 103b.

  As described above, according to the present embodiment, by mounting the motor device MTR having a small size and high rotational characteristics, the robot device RBT that is lightweight and has high mobility is provided.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
In the first embodiment and the second embodiment, the configuration in which the second chip 70 is bonded to the first surface 50f that is the mounting surface on which the light detection unit 40 is mounted in the first chip 50 is taken as an example. Although explained, it is not limited to this.

  For example, as shown in FIG. 15, the second chip 70 is mounted on the second surface 50 g opposite to the first surface 50 f that is the mounting surface on which the light detection unit 40 is mounted in the first chip 50. It does not matter. FIG. 15 shows a configuration in which the second chip 70 is bonded to the first chip 50 via the conductive adhesive 80. However, the present invention is not limited to this, and the second chip 70 is connected via a wire or the like. The chip 70 may be configured to be bonded to the first chip 50.

  In the third embodiment, the configuration in which the first chip 50 is bonded to the first surface 70f that is the mounting surface on which the magnetic field detection unit 60 is mounted in the second chip 70 has been described as an example. It is not limited to this.

  For example, as shown in FIG. 16, the first chip 50 is mounted on the second surface 70 g opposite to the first surface 70 f which is the mounting surface on which the magnetic field detection unit 60 is mounted in the second chip 70. It does not matter. FIG. 16 shows a configuration in which the first chip 50 is bonded to the second chip 70 via the wire 90, but the present invention is not limited to this, and the first chip 50 is connected via a conductive adhesive or the like. The chip 50 may be configured to be bonded to the second chip 70.

  Moreover, in the said embodiment, although the light reflection type structure by which the light emission part 54 and the light detection part 40 are provided in the 1st chip | tip 50 was mentioned as an example, it demonstrated and it was not restricted to this. For example, the light emitting unit 54 may not be provided on the first chip 50. The position information detection sensor having such a configuration can be used by being attached to an encoder having a light transmission type pattern as an optical pattern, for example.

  In the above embodiment, the single rotation information is detected by the light detection unit 40 and the multiple rotation information is detected by the magnetic field detection unit 60. However, the present invention is not limited to this. The configuration may be such that rotation information is detected, and the magnetic field detection unit 60 detects one rotation information. Moreover, although the 1st detection part 61 and the 2nd detection part 62 in the said embodiment are comprised by MR sensor, you may be comprised by sensors, such as a GIG sensor, a GMR sensor, and a Hall element.

    SF ... Rotating shaft EC ... Encoder R ... Rotating unit D ... Detecting unit SR ... Sensor RBT ... Robot device MTR ... Motor device 40 ... Light detecting unit 41 ... First light receiving unit 42 ... Second light receiving unit 43 ... Light receiving element 70 (70A) 70B) ... second chip 50f ... first surface 50g ... second surface 60 ... magnetic field detector 70 ... second chip 61 ... first detector 62 ... second detector 63 ... magnetic thin film 70f ... first surface 70g ... Second surface 90 ... Wire 100, 200, 300 ... Position information detection sensor

Claims (26)

A first chip on which a light detection unit for detecting light via an optical pattern is mounted;
A position information detection sensor comprising: a second chip mounted with a magnetic field detection unit that is bonded to the first chip in a state where the surfaces thereof are opposed to each other and detects a magnetic field by a magnetic pattern. The position information detection sensor according to claim 1, further comprising a control circuit that is provided on the first chip or the second chip and processes a detection result by the light detection unit and a detection result by the magnetic field detection unit. The position information detection sensor according to claim 2, wherein the control circuit outputs position information including one-rotation information and multi-rotation information. The light detection unit is formed on one surface of the first chip,
The position information detection sensor according to any one of claims 1 to 3, wherein the second chip is bonded to the one surface of the first chip. A pair of the second chips are joined to the first chip,
The position information detection sensor according to any one of claims 1 to 4. The position information detection sensor according to any one of claims 1 to 5, wherein a pair of the second chips are disposed at positions sandwiching the light detection unit. The optical pattern and the magnetic pattern are provided so as to rotate integrally with a rotor to be measured,
In the central axis direction view of the rotor, a reference line segment extending from the central axis toward the light detection unit is set to 0 °,
An angle formed by the reference line segment and a first line segment extending from the central axis toward one of the pair of second chips in the direction of the central axis of the rotor is θ1,
When the angle formed by the reference line segment and the second line segment extending from the central axis toward the other of the pair of second chips in the central axis direction view of the rotor is θ2,
The pair of second chips is
0 ° <θ1 <90 ° and 0 ° <θ2 <90 °
The position information detection sensor according to claim 5, wherein the position information detection sensor is arranged so as to satisfy the above. The pair of second tips are arranged on a concentric circle,
An angle formed by a straight line extending from the center point of the concentric circle toward one of the pair of second chips and a straight line extending from the center point of the concentric circle toward the other of the pair of second chips is θ3,
The distance from the center point of the concentric circle to one of the pair of second chips is L1,
The distance from the center point of the concentric circle to the other of the pair of second chips is L2,
When the distance between the pair of second chips is L3,
The pair of second chips is
(L3) ² = (L1) ² + (L2) ² −2 · L1 · L2 · cos θ3
(0 ° <θ3 <180 °)
The position information detection sensor according to claim 5, wherein the position information detection sensor is arranged so as to satisfy The pair of second chips are arranged on the circumference of the same circle,
An angle formed by a straight line extending from the center point of the circle toward one of the pair of second chips and a straight line extending from the center point of the circle toward the other of the pair of second chips is θ3,
Let R be the radius of the circle,
If the length of the arc defined by the angle θ3 is Ra,
The pair of second chips is
Ra = 2πR × (θ3 / 360 °) (0 ° <θ3 <180 °)
The position information detection sensor according to claim 5, wherein the position information detection sensor is arranged so as to satisfy The position information detection sensor according to any one of claims 1 to 9, further comprising: a light emitting unit that is provided on the first chip and emits the light toward the optical pattern. The position information detection sensor according to any one of claims 1 to 10, wherein the first chip and the second chip are connected via a wire member. The position information detection sensor according to any one of claims 1 to 11, wherein the first chip and the second chip are connected via a conductive adhesive. A light detection part forming step of mounting a light detection part for detecting light via the optical pattern on the first chip;
A magnetic field detector forming step of mounting a magnetic field detector for detecting a magnetic field by a magnetic pattern on the second chip;
And a joining step of joining the first chip and the second chip with the surfaces facing each other. The position information detection sensor according to claim 13, further comprising: a control circuit forming step of forming a control circuit for processing a detection result by the light detection unit and a detection result by the magnetic field detection unit on the first chip or the second chip. Production method. The light detection portion forming step includes forming the light detection portion on one surface of the first chip,
The method for manufacturing a position information detection sensor according to claim 13, wherein the joining step includes joining the second chip to the one surface of the first chip. The bonding step includes bonding a pair of the second chips to the first chip.
The manufacturing method of the positional information detection sensor as described in any one of Claims 13-15. The position information detection sensor manufacturing method according to any one of claims 13 to 16, wherein the magnetic field detection unit forming step includes forming a pair of the second chips at a position sandwiching the light detection unit. Method. The optical pattern and the magnetic pattern are provided so as to rotate integrally with a rotor to be measured,
In the central axis direction view of the rotor, a reference line segment extending from the central axis toward the light detection unit is set to 0 °,
An angle formed by the reference line segment and a first line segment extending from the central axis toward one of the pair of second chips in the direction of the central axis of the rotor is θ1,
When the angle formed by the reference line segment and the second line segment extending from the central axis toward the other of the pair of second chips in the central axis direction view of the rotor is θ2,
The magnetic field detector forming step includes
0 ° <θ1 <90 ° and 0 ° <θ2 <90 °
The manufacturing method of the positional information detection sensor according to claim 16 or 17, comprising disposing a pair of the second chips so as to satisfy. The pair of second tips are arranged on a concentric circle,
An angle formed by a straight line extending from the center point of the concentric circle toward one of the pair of second chips and a straight line extending from the center point of the concentric circle toward the other of the pair of second chips is θ3,
The distance from the center point of the concentric circle to one of the pair of second chips is L1,
The distance from the center point of the concentric circle to the other of the pair of second chips is L2,
When the distance between the pair of second chips is L3,
The magnetic field detector forming step includes
(L3) ² = (L1) ² + (L2) ² −2 · L1 · L2 · cos θ3
(0 ° <θ3 <180 °)
The method for manufacturing a position information detection sensor according to any one of claims 16 to 18, further comprising disposing a pair of the second chips so as to satisfy the condition. The pair of second chips are arranged on the circumference of the same circle,
An angle formed by a straight line extending from the center point of the circle toward one of the pair of second chips and a straight line extending from the center point of the circle toward the other of the pair of second chips is θ3,
Let R be the radius of the circle,
If the length of the arc defined by the angle θ3 is Ra,
The magnetic field detector forming step includes
Ra = 2πR × (θ3 / 360 °) (0 ° <θ3 <180 °)
The method for manufacturing a position information detection sensor according to any one of claims 16 to 18, further comprising disposing a pair of the second chips so as to satisfy the condition. The light emission part formation process which forms the light emission part which inject | emits the said light toward the said optical pattern in said 1st chip | tip. The position information detection sensor of any one of Claims 13-20 provided with the following. Production method. The position information detection sensor according to any one of claims 13 to 21, wherein the joining step includes connecting the first chip and the second chip via a linear member. Manufacturing method. The position information detection according to any one of claims 13 to 21, wherein the joining step includes connecting the first chip and the second chip via a conductive adhesive. Sensor manufacturing method. A rotating part fixed to the rotor to be measured and formed with an optical pattern and a magnetic pattern;
A detection unit for detecting light via the optical pattern and a magnetic field by the magnetic pattern,
The position information detection sensor as described in any one of Claims 1-12 is used as said detection part. Encoder. A rotor,
A drive unit for rotating the rotor;
An encoder fixed to the rotor and detecting position information of the rotor;
The motor device in which the encoder according to claim 24 is used as the encoder. A rotating member;
A motor device for rotating the rotating member,
The motor apparatus according to claim 25, wherein the motor apparatus is a robot apparatus.

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