JP6717352B2 - Sensor - Google Patents

Description

The present invention relates to sensors.

As a configuration of a rotary encoder, a configuration is known in which a substrate provided with a light emitting element that emits light and a substrate provided with a light receiving element that detects light emitted from the light emitting element are housed in a housing of the rotary encoder. (For example, patent document 1).

JP 2001-027551 A

A sensor that detects a displacement due to a rotation operation or a rotation operation like a rotary encoder is provided with a shaft that transmits the rotation operation or the rotation operation. The shaft is axially supported by the housing of the sensor via a bearing.

From the viewpoint of reducing blurring of the rotating shaft of the shaft and preventing the shaft from falling off, it is desirable that the shaft and the bearing and the housing of the bearing and the sensor be firmly fixed. However, when fixing by press-fitting, the outer dimensions of the member (the shaft for the bearing and the bearing for the sensor housing) and the inner dimensions of the inserted member (the bearing for the shaft and the sensor housing for the bearing) are inserted when press-fitting. It is necessary to make the dimensional relationship with and strict, and it is difficult to manufacture. In particular, the smaller the size of the sensor, the more difficult it becomes to control the dimensions for press fitting.

The present invention aims to provide a sensor that is easier to manufacture.

MEANS TO SOLVE THE PROBLEM This invention for achieving the said objective is a sensor which detects the displacement of the rotation angle of the said shaft by rotation or rotation of a shaft, Comprising: The bearing which supports the said shaft, and the bearing to which the said bearing is fixed. A housing having a hole is provided, and an inner peripheral surface of the shaft and the bearing, an outer peripheral surface of the bearing, and an inner peripheral surface of a bearing hole of the housing are fixed with an adhesive.

Therefore, the tolerance for the dimensional error between the components fixed by adhesion is increased, which facilitates the manufacture of the sensor.

In the sensor of the present invention, a groove is formed on the outer peripheral surface of the shaft that abuts the inner peripheral surface of the bearing.

Therefore, it is possible to prevent the adhesive from protruding from the bonding surface between the bearing and the shaft. Therefore, the amount of the adhesive can be adjusted with a margin, which facilitates the work related to the bonding.

In the sensor of the present invention, a groove is formed on the inner peripheral surface of the bearing hole.

Therefore, it is possible to prevent the adhesive from protruding from the bonding surface between the bearing and the bearing hole. Therefore, the amount of the adhesive can be adjusted with a margin, which facilitates the work related to the bonding.

In the sensor of the present invention, there is a groove formed on the inner peripheral surface of the bearing hole at the deepest portion in the entrance direction of the bearing with respect to the bearing hole.

Therefore, it is possible to prevent the adhesive agent extruded to the innermost portion from protruding from the bonding surface between the bearing and the bearing hole. Therefore, the amount of the adhesive can be adjusted with a margin, which facilitates the work related to the bonding.

In the sensor of the present invention, a generation unit that generates a predetermined detection target, a detection unit that detects the detection target generated by the generation unit, a substrate on which the generation unit and the detection unit are provided, and the generation unit. A member that rotates or rotates in a detection area between the detection unit and affects the detection target, the housing houses the substrate and the member, and one end side of the shaft is The member extends into the housing, and the member is provided on the one end side.

Therefore, the displacement of the rotation angle of the shaft can be detected by the change in the detection result of the detection unit caused by the rotation or rotation of the member.

In the sensor of the present invention, the substrate has a first portion provided with the generation unit and a second portion provided with the detection unit, which are integrated.

Accordingly, the sensor can be easily manufactured because the generator and the detector can be positioned by a simple operation such as bending the substrate.

The sensor of the present invention makes the sensor easier to manufacture.

FIG. 1 is a configuration diagram of a sensor according to an embodiment of the present invention. FIG. 2 is an external perspective view of the sensor. FIG. 3 is an explanatory diagram illustrating an example of the arrangement of the generation unit, the optical scale, and the detection unit. FIG. 4 is a block diagram of the optical encoder. FIG. 5 is an explanatory diagram showing an example of the pattern of the optical scale. FIG. 6 is a perspective view showing an example of the substrate. FIG. 7 is a plan view showing an example of a substrate before being bent. FIG. 8 is a diagram showing an example of a correspondence relationship between the circuit arrangement on the surface on which the generation unit and the detection unit are provided and the configuration provided on the back surface thereof. FIG. 9 is a diagram showing an example of the ground pattern of the substrate. FIG. 10 is a perspective view showing an example of the body of the stator and the configuration provided on the body. FIG. 11 is a perspective view showing an example of the structure provided in the chassis of the stator. FIG. 12 is a diagram illustrating an example of the positional relationship between the generation unit and the detection unit. FIG. 13 is a diagram illustrating an example of the positional relationship between the generation unit and the detection unit. FIG. 14 is a plan view showing an example of a board before circuit mounting. FIG. 15 is a diagram showing an example of assembly of a stator for providing an optical scale in the detected area. FIG. 16 is a diagram showing an example of assembly of a stator for providing an optical scale in the detected area. FIG. 17 is an explanatory diagram illustrating an example of the detection unit. FIG. 18 is a diagram showing an example of mounting the bearing on the body. FIG. 19 is a diagram showing an example of attachment of a shaft to a bearing fixed to a body. FIG. 20 is an explanatory diagram for describing an example of the first light receiving unit of the detection unit. FIG. 21 is an explanatory diagram illustrating an example of the third light receiving unit of the detection unit. FIG. 22 is an explanatory diagram for explaining the separation of polarization components by the optical scale. FIG. 23 is an explanatory diagram for explaining the separation of polarization components by the optical scale. FIG. 24 is an explanatory diagram for explaining the separation of polarization components by the optical scale. FIG. 25 is a functional block diagram of the optical encoder. FIG. 26 is an explanatory diagram for explaining the rotation angle of the optical scale and the light intensity change of the polarization component of each light receiving unit. FIG. 27 is an explanatory diagram for explaining the relationship between the rotation angle of the optical scale and the Lissajous angle. FIG. 28 is a diagram for explaining the generation unit. FIG. 29 is a diagram showing an example of the relationship between the generation range of light from the generation unit and the positions of the detection unit and the shaft. FIG. 30 is a flow chart showing an example of the flow of steps involved in manufacturing a sensor. FIG. 31 is a diagram illustrating another arrangement example of the plurality of light receiving elements included in the detection unit.

Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the embodiments below. Further, the constituent elements described below include those that can be easily conceived by those skilled in the art and those that are substantially the same. Furthermore, the components described below can be combined as appropriate.

FIG. 1 is a configuration diagram of a sensor 31 according to an embodiment of the present invention. FIG. 2 is an external perspective view of the sensor 31. FIG. 1 is a schematic sectional view of FIG. FIG. 3 is an explanatory diagram illustrating an example of the arrangement of the generation unit 41, the optical scale 11, and the detection unit 35. FIG. 4 is a block diagram of the optical encoder 2. FIG. 5 is an explanatory diagram showing an example of the pattern of the optical scale 11. The sensor 31 includes a generation unit 41 that generates a detection target that is an electromagnetic wave (for example, light), a detection unit 35 that detects a detection target that is generated by the generation unit 41 with a detection target region sandwiched between the generation unit 41, and the detection unit 35. And a substrate 50 on which is provided. In the present embodiment, the sensor 31 further includes a shaft 12 connected to a rotating machine such as a motor, and an operating body (optical scale 11) attached to an end of the shaft 12 and rotatably provided in a detection area. It has a rotor 10 and a stator 20. The detected area is a space between the generation unit 41 and the detection unit 35. The generation unit 41 in this embodiment has a light emitting element that emits light. The detection unit 35 in the present embodiment is a light receiving element that receives the light emitted from the generation unit 41 that is a light emitting element. More specifically, the detection unit 35 of the present embodiment includes a first light receiving unit PD1 having a polarizing layer PP1, a second light receiving unit PD2 having a polarizing layer PP2, and a third light receiving unit PD3 having a polarizing layer PP3. , Four light receiving elements of the fourth light receiving portion PD4 having the polarizing layer PP4. In FIG. 3, in order to show that the incident light 73 from the light source light 71 emitted from the generation unit 41 to each light receiving unit (first light receiving unit PD1 to fourth light receiving unit PD4) passes through each polarizing layer PP1 to PP4. Although the polarization layers PP1 to PP4 and the first light receiving unit PD1 to the fourth light receiving unit PD4 are illustrated as being separated from each other, they are actually in contact with each other.

FIG. 6 is a perspective view showing an example of the substrate 50. FIG. 7 is a plan view showing an example of the substrate 50 before being bent. FIG. 8 is a diagram showing an example of a correspondence relationship between the circuit arrangement on the surface on which the generation unit 41 and the detection unit 35 are provided and the configuration provided on the back surface thereof. FIG. 9 is a diagram showing an example of the ground pattern of the substrate 50. FIG. 10 is a perspective view showing an example of a body 21 of the stator 20 and a configuration provided on the body 21. FIG. 11 is a perspective view showing an example of a configuration provided in the chassis 22 of the stator 20. 12 and 13 are diagrams illustrating an example of the positional relationship between the generation unit 41 and the detection unit 35. FIG. 14 is a plan view showing an example of a board before circuit mounting. 15 and 16 are views showing an example of assembling the stator 20 for providing the optical scale 11 in the detected area. FIG. 17 is an explanatory diagram illustrating an example of the detection unit 35. The substrate 50 is integrated with a first portion 51 provided with the generation unit 41 and a second portion 52 provided with the detection unit 35. For example, as shown in FIGS. 6 and 7, the substrate 50 is one substrate including a semi-arcuate first portion 51 and a circular second portion 52. The substrate 50 is, for example, a flexible printed circuit (FPC), and various circuits including the generating unit 41 and the detecting unit 35 (for example, the IC circuit 60 shown in FIG. 6) are mounted on the substrate 50. More specifically, the FPC uses an insulator, which is, for example, a polyimide film or a photo solder resist film as a base film, forms an adhesive layer and a conductor layer on the base film, and forms a terminal portion (soldering portion of the conductor layer in the conductor layer. It is a flexible wiring board in which a portion other than (including) is covered with an insulator. The conductor layer is an electric conductor such as copper, and is provided with a signal line, a power line, a ground pattern 80, and the like, which are connected to components such as various circuits by the pattern of the conductor layer. The specific structure of the flexible substrate that can be used in the present invention is not limited to this, and can be appropriately changed. Various circuits except the detection unit 35 and the generation unit 41, such as the IC circuit 60, constitute, for example, a preamplifier AMP, a differential operation circuit DS, a filter circuit NR, and a multiplication circuit AP shown in FIG. 25 described later. Hereinafter, the surface of the substrate 50 on which the generation unit 41 and the detection unit 35 are provided may be referred to as a front surface 50A, and the opposite surface may be referred to as a back surface 50B (see FIG. 8). Further, of the surface 50A of the substrate 50, the surface 51A of the first portion 51 and the surface 52A of the second portion may be described separately. Further, of the back surface 50B of the substrate 50, the back surface 51B of the first portion 51 and the back surface 52B of the second portion 52 may be described separately.

The substrate 50 has an electronic component on the back side of at least one of the face on which the electronic component including the generating unit 41 is provided in the first portion 51 and the face on which the electronic component including the detecting unit 35 is provided in the second portion 52. A plate-shaped support member that keeps the surface on which is provided flat is attached. Specifically, as shown in FIG. 7, for example, in addition to the photodiodes (the first light receiving portion PD1 to the fourth light receiving portion PD4) forming the light receiving element, the same surface (front surface 52A) as the light receiving element in the second portion 52 is formed. ) Is provided inside the mounting range of the IC circuit 60 on the back surface 52B thereof. The component 61 is another circuit provided on the same surface (front surface 52A) as the light receiving element in the second portion 52, and specifically includes, for example, circuit components such as an IC chip, a resistor, and a capacitor. The IC circuit 60 is, for example, an integrated circuit in which a QFN (Quad flat no lead package) type package is adopted. As described above, the support member of the second portion 52 in the present embodiment is a package of the integrated circuit (IC circuit 60), and one or more electronic components (for example, the electronic components provided in the second portion 52 to which the package is attached (for example, The detection unit 35 and the component 61) are provided on the backside of the substrate 50, where the package exists. The method of packaging the integrated circuit is not limited to the QFN method, and a support member capable of keeping a surface opposite to the surface on which the integrated circuit is provided (for example, the surface 52A of the second portion 52) a flat surface. It suffices to have a support structure portion that can function as. In the present embodiment, components 61 such as IC chips, resistors, and capacitors, which are other circuits provided on the surface 52A of the second portion 52, are package circuits connected to wiring by soldering, wire bonding, etc. However, the present invention is not limited to this, and either one of them may be used, or a part or all of the circuit may adopt another method. May be

Further, as shown in FIG. 8, in the first portion 51 of the present embodiment, a support substrate 65 is provided on the back side of the surface on which the light emitting element (see FIG. 28) in which the light emitting device 41U is packaged is provided. The support substrate 65 is, for example, a semi-arcuate plate-shaped member corresponding to the anti-arcuate shape of the first portion 51. More specifically, the first portion 51 and the support substrate 65 have a donut-shaped (arc-shaped) plate surface in which a circular hole having a diameter smaller than the diameter of the disk is provided at the center of the disk surface. It has a semi-arcuate plate surface corresponding to one of the two divided along the diameter. The support substrate 65 is made of, for example, a resin having an insulating property. As described above, the support member of the first portion 51 in the present embodiment is a plate-like member having an insulating property formed in conformity with the shape of the first portion 51. The support substrate 65 in the present embodiment is merely an example of a support member that is not a circuit, and the support substrate 65 is not limited to this and can be appropriately changed.

The substrate 50 has a connecting portion 53 that connects the first portion 51 and the second portion 52. Specifically, for example, as shown in FIG. 6 and FIG. 7, the connecting portion 53 is formed between the first portion 51 and the second portion 52, and the outer peripheral portion of the arc of the first portion 51 and the second portion 52. It is provided so as to connect to the outer peripheral portion of the arc.

The connection unit 53 has a wiring connected to the generation unit 41 (or the detection unit 35). In the present embodiment, the connection unit 53 includes a signal line and a power line connected to the generation unit 41. Specifically, the wiring of the connection portion 53 is provided as, for example, a signal line and a power line mounted on the FPC. Although no circuit is provided in the connecting portion 53 in the present embodiment, a component such as a circuit may be provided in the connecting portion 53.

As shown in FIGS. 6 and 7, the connection portion 53 of the present embodiment has a connection portion 53 between the first portion 51 and the second portion 52 as compared with the first portion 51 and the second portion 52. Has a small width in the direction orthogonal to the extending direction and along the plate surface of the substrate 50.

The board 50 includes a harness section 54 including wirings connected to the generation section 41 and the detection section 35. Specifically, for example, as shown in FIGS. 6 and 7, the harness portion 54 is provided so as to extend from the first portion 51 to the opposite side of the connecting portion 53. The harness section 54 includes a signal line and a power line connected to various circuits provided on the generator 41, the detector 35, and the board 50. Specifically, the wiring of the harness portion 54 is provided as, for example, a signal line and a power line mounted on the FPC. In the present embodiment, the wiring of the generator 41 is provided in the first portion 51, the connecting portion 53, and the harness portion 54. The wiring of the detection unit 35 is provided in the second portion 52 and the harness portion 54.

Further, the harness portion 54 may be connected to the connector CNT as shown in FIG. 1, for example. The connector CNT is an interface that connects the sensor 31 to another device (for example, the arithmetic device 3). The sensor 31 is connected to the arithmetic unit 3 via the connector CNT. That is, the harness portion 54 functions as a wiring that connects various circuits provided on the substrate 50 to another device (for example, the arithmetic device 3). The harness portion 54 may be provided with a component such as a circuit. The connector CNT can be omitted. In that case, the tip of the harness portion 54 is provided as a terminal to be inserted into, for example, a connector (not shown) provided on the device side to which the sensor 31 is connected.

The substrate 50 is provided such that the first portion 51 and the second portion 52 are parallel to each other. Specifically, as shown in FIGS. 1 and 6, the substrate 50 is bent and bent in a shape (a U-shape) in which the generating section 41 and the detecting section 35 face each other. In the present embodiment, the substrate 50 has the bent surface 55A provided between the connecting portion 53 and the first portion 51 and the surface 55A provided inside between the connecting portion 53 and the second portion 52 such that the surface 50A is located inside. Can be bent at a right angle. That is, the substrate 50 is bent such that the first portion 51 and the second portion 52 are at right angles to the connecting portion 53, and the first portion 51 and the second portion 52 are located at positions facing each other. As a result, the first portion 51 and the second portion 52 are provided in parallel, and the generation unit 41 and the detection unit 35 face each other. In this way, the substrate 50 has the bent portions 55a and 55b that are bent between the first portion 51 and the second portion 52 so that the generation portion 41 and the detection portion 35 face each other. Further, in the present embodiment, the bent portions 55a and 55b are provided between the connecting portion 53 and the first portion 51 and between the connecting portion 53 and the second portion 52.

The surface of the first portion 51 on which the generation unit 41 is provided and the surface of the second portion 52 on the side where the detection unit 35 is provided are the same surface (front surface 50A) of the substrate 50. Since the surface on which the generation unit 41 is provided and the surface on which the detection unit 35 is provided face each other, the positional relationship between the generation unit 41 and the detection unit 35 is as shown in FIG. The detection target (for example, light) generated by the generation unit 41 has a positional relationship that can be detected by the detection unit 35. In addition, the space between the generation unit 41 and the detection unit 35 that face each other becomes the detected region.

As described above, the substrate 50 is integrated with the first portion 51 provided with the generation portion 41, the second portion 52 provided with the detection portion 35, and the connection portion 53 connecting the first portion 51 and the second portion 52. , A surface on which the generation portion 41 of the first portion 51 is provided (front surface 51A) and a surface on which the detection portion 35 of the second portion 52 is provided (surface 52A), which are bent at two bent portions 55a and 55b at a right angle. And are provided in parallel and face each other. Here, as shown in FIG. 7, the first axis LA that is the bending axis at the bent portion 55a and the second axis LB that is the bending axis at the bent portion 55b are parallel. When the substrate 50 is bent, the folding axis is opposed to one (for example, the first portion 51 or the second portion 52) opposite to the other (for example, the connection portion) that faces the bending portion (for example, the bent portions 55a and 55b) of the substrate 50 that is bent. The axis that serves as the operation center axis of the bending operation of the portion 53). The first axis LA and the second axis LB in the present embodiment are located at positions overlapping with two bending lines formed as folds in the bent portions 55a and 55b of the substrate 50, respectively.

The substrate 50 has a ground pattern provided in a range including the first portion 51, the second portion 52, and the bent portions 55a and 55b. The ground patterns 81 and 82 of the bent portions 55a and 55b of the ground pattern 80 are thinner than the ground pattern 83 of the first portion 51 and the ground pattern 84 of the second portion 52. In the present embodiment, the ground pattern 80 is provided in the range including the connecting portion 53. The ground patterns 81 and 82 of the bent portions 55a and 55b of the ground pattern 80 are thinner than the ground pattern 85 of the connection portion 53. Specifically, the substrate 50 has a rolled copper foil or the like as the ground pattern 80. The ground pattern 80 is electrically connected to various electronic components provided on the substrate 50, such as the generator 41, the detector 35, the IC circuit 60, and the like. The potential of the ground pattern 80 functions as a reference for the potential of these electronic components. The ground pattern 80 is covered except for the terminal portions (including soldering portions) to which these electronic circuits are connected. For example, as shown in FIG. 9, in the ground patterns 81 and 82 of the bent portions 55a and 55b of the ground pattern 80, the maximum width in the direction along the bending axes LA and LB is the ground pattern 83 of the first portion 51, The width is smaller than the maximum width of the ground pattern 84 included in the second portion 52 and the ground pattern 85 included in the connecting portion 53.

The ground pattern 80 of this embodiment has a uniform thickness. That is, the thickness of the ground patterns 81 to 85 in each of the bent portions 55a and 55b, the first portion 51, the second portion 52, and the connection portion 53 is the same. Further, the ground pattern 80 of the present embodiment has a one-piece structure that is continuous from the first portion 51 to the harness portion 54 without interruption. The specific configuration regarding the thickness and structure of the ground pattern 80 is an example, and the present invention is not limited to this, and can be appropriately changed. For example, when the thickness of the ground pattern 80 is changed, the thickness of the ground patterns 81 and 82 of the bent portions 55a and 55b is made thinner than the thickness of the ground patterns of other portions, so that the bent portions 55a and 55b are bent. Can be made easier.

In addition, the distance between the first axis LA and the first point that is the generation center point of the detection target of the generation unit 41 on the plane before bending of the substrate 50, and the center of the detection region of the detection target by the detection unit 35 or the detection unit. The distance between the second axis LB, which is one of the centers of arrangement of the plurality of detection regions included in 35, and the second axis LB is equal. Specifically, as shown in FIG. 7, the detection unit 35 has the distance W1 between the light emission point 41S of the generation unit 41 and the bending line in the bent portion 55a, that is, the first axis LA, as shown in FIG. Distance between the center S0 of arrangement of the first light receiving portion PD1, the second light receiving portion PD2, the third light receiving portion PD3, and the fourth light receiving portion PD4, which are four light receiving elements, and the bending line in the bending portion 55b, that is, the second axis LB. W2 is equal. Here, the light emission point 41S of the generation unit 41 is the first point in this embodiment, and the disposition center S0 is the second point in this embodiment.

In addition, the first point and the second point are on the same straight line along the substrate 50 before bending, and the straight line intersects the first axis LA and the second axis LB at a right angle. It exists on the same straight line orthogonal to the first axis LA and the second axis LB. Specifically, as shown in FIG. 7, the light emission point 41S of the generation unit 41 and the arrangement center S0 are orthogonal to the two bending lines in the bent portions 55a and 55b, that is, the first axis LA and the second axis LB. Exists on the straight line L1 which is the same straight line.

Further, each of the four light receiving elements is arranged at a different position on a predetermined plane, the distance from each of the four light receiving elements to one point on the predetermined plane is all equal, and each of the one point and the four light receiving elements is The four line segments connecting the center of the light receiving region form a right angle with each other. Specifically, the first light receiving unit PD1, the second light receiving unit PD2, the third light receiving unit PD3, and the fourth light receiving unit PD4, which are the four light receiving elements included in the detection unit 35, are the surface of the second portion 52 of the substrate 50. They are arranged equidistant from one point (arrangement center S0) on 52A. Further, on the surface 52A, the first light receiving portion PD1 and the third light receiving portion PD3 are arranged at point symmetry positions with the placement center S0 interposed therebetween, and the second light receiving portion PD2 and the fourth light receiving portion PD4 are placed at the placement center S0. It is arranged in a point-symmetrical position with a pinch in between. Further, in the present embodiment, the shapes and areas of the light receiving regions of the first light receiving unit PD1, the second light receiving unit PD2, the third light receiving unit PD3, and the fourth light receiving unit PD4 are all the same. In addition, in the detection unit 35, the center of the light receiving region of the first light receiving unit PD1 and the center of the light receiving region of the third light receiving unit PD3 are arranged at a distance of 2 W with the arrangement center S0 as the midpoint, and the second light receiving unit is located. The center of the light receiving area of the PD 2 and the center of the light receiving area of the fourth light receiving portion PD4 are arranged with a distance of 2 W between the arrangement center S0 and the middle point. In other words, the distances between the centers of the light receiving regions of the four light receiving elements of the first light receiving unit PD1 to the fourth light receiving unit PD4 and the disposition center S0 are all the distance W and are equal. In the present embodiment, the distance W between the center of the light receiving area of the first light receiving portion PD1, the second light receiving portion PD2, the third light receiving portion PD3, and the fourth light receiving portion PD4 and the arrangement center S0 is the first light receiving portion PD1. , Width w of the second light receiving portion PD2, the third light receiving portion PD3, and the fourth light receiving portion PD4. Further, the virtual axis passing through the center of the light receiving area of the first light receiving section PD1, the arrangement center S0 and the center of the light receiving area of the third light receiving section PD3 is defined as the x-axis, and the center of the light receiving area of the second light receiving section PD2 and the arrangement center. When the virtual axis passing through the center of S0 and the light receiving region of the fourth light receiving unit PD4 is the y axis, the x axis and the y axis are orthogonal to each other on the surface 52A of the second portion 52. That is, on the surface 52A of the second portion 52, the angle θ1 formed by the center of the light receiving region of the first light receiving unit PD1 and the center of the light receiving region of the second light receiving unit PD2 is 90°. Similarly, an angle θ2 formed by the center of the light receiving area of the second light receiving portion PD2 and the center of the light receiving area of the third light receiving portion PD3, the center of the light receiving area of the third light receiving portion PD3, and the light receiving area of the fourth light receiving portion PD4. The angle θ3 formed by the center of the light receiving area of the fourth light receiving portion PD4 and the angle θ4 formed by the center of the light receiving area of the first light receiving portion PD1 are 90°. As described above, the first light receiving unit PD1, the second light receiving unit PD2, the third light receiving unit PD3, and the fourth light receiving unit PD4 are 90° on the same circumference with the arrangement center S0 being the center of the circle on the surface 52A. It is arranged equally. The xy plane defined by the x-axis and the y-axis is orthogonal to the z-axis that connects the light emission point 41S of the generation unit 41 and the arrangement center S0. That is, when the surface 52A is looked down from the generating unit 41 side along the z-axis direction, the emission point 41S overlaps the arrangement center S0. That is, a straight line L2 (see FIG. 13) that is a normal line of a predetermined plane (for example, the surface 52A of the second portion 52) passing through one point (arrangement center S0) passes through the center of the light emission point 41S of the generation unit 41. .. As a result, the first light receiving unit PD1, the second light receiving unit PD2, the third light receiving unit PD3, and the fourth light receiving unit PD4 are arranged at the same distance from the light emission point 41S of the light emitting unit 41.

The detection unit 35 detects a change in the detection target (for example, an electromagnetic wave such as light) caused by a change in the physical quantity in the detection area. The change in the physical quantity is due to, for example, the rotation of the moving body existing in the detection area. Specifically, for example, as shown in FIGS. 1 to 3, the optical scale 11 of the rotor 10 is provided in the detected area. The sensor 31 is a sensor that outputs according to a change in the detection result of the detection target due to the rotation of the optical scale 11 as the operating body. That is, the sensor 31 functions as a rotary encoder that detects the angular position of the rotating body on the rotor 10. In the present embodiment, the sensor 31 detects the rotation angle of the rotating body connected to the rotor 10, but the sensor 31 is not limited to the rotation angle of the rotating body and rotates within a range of less than 360°. The rotation angle of the rotating body can also be detected.

One of the first portion 51 and the second portion 52 is smaller than the other. Specifically, for example, as shown in FIGS. 6 and 7, the diameter of the arc-shaped first portion 51 in this embodiment is substantially the same as the diameter of the circular second portion 52. However, the first portion 51 has a semicircular arc shape in which a semicircular cutout portion 51a is provided on the inner peripheral side of the semicircular FPC. Therefore, the area of the first portion 51 occupying the substrate 50 is smaller than the area of the second portion 52. The cutout portion 51a is provided so that the shaft 11 and the substrate 50 are not in contact with each other.

The rotor 10 has an optical scale 11 which is a disk-shaped (or polygonal-shaped) member shown in FIG. The optical scale 11 is made of, for example, silicon, glass, a polymer material, or the like. The optical scale 11 shown in FIG. 5 has a signal track T1 on one plate surface. A shaft 12 is attached to the rotor 10 on the other plate surface with respect to the plate surface on which the optical scale 11 is attached. Even if the optical scale 11 is inclined, it does not affect the function of polarization separation when the inclination angle is small. The optical scale 11 in the present embodiment functions as a member that influences light by operating in the detected region, which is a space between the generation unit 41 and the detection unit 35. The optical scale 11, which is the operating body in the present embodiment, is a disk-shaped member that is rotatably supported via a shaft, but this is an example and the present invention is not limited to this, and the shape and the like can be changed as appropriate. Is.

The stator 20 is made of a light-shielding member that surrounds the bearings 26 a and 26 b, the shaft 12, the optical scale 11 attached to the end of the shaft 12, and the detection unit 35. Therefore, external optical noise can be suppressed inside the stator 20. The stator 20 in this embodiment functions as a housing that houses the substrate 50 and the member (optical scale 11). The housing has a first member to which a part of the substrate 50 is fixed and a second member that operably supports the member. Specifically, the stator 20 includes a body 21 that functions as a second member, a chassis 22 that functions as a first member, and a cover 23. The body 21 is a housing that rotatably supports the shaft 12 via bearings 26a and 26b. When the shaft 12 is rotated by rotation from a rotating machine such as a motor, the optical scale 11 is rotated about the rotation center Zr in conjunction with the shaft 12. The body 21 has an opening 21a for attaching the chassis 22 provided with the substrate 50 to the body 21. The substrate 50 is fixed to the chassis 22 so as to come into contact with at least a part of the surface (rear surface) of the second portion 52 of the substrate 50 opposite to the side on which the detection unit 35 is provided. Specifically, as described above, the back surface 50B of the substrate 50 is provided with the IC circuit 60 as a component forming the sensor 31. For example, as shown in FIG. 11, the chassis 22 has a shape that covers the IC circuit 60 on the back surface from the outside and contacts the circular outer peripheral portion of the second portion 52. The connecting portion 53 of the substrate 50 bent in a U-shape is positioned so as to be erected from the second portion 52 supported by the chassis 22 by being fixed to the chassis 22. Thus, in the present embodiment, the substrate 50 is fixed to the chassis 22 by fixing the second portion 52 to the chassis 22. The cover 23 is a member that forms a part of the cylindrical outer peripheral surface of the stator 20. The cover 23 is provided on the opening 21a side of the body 21, that is, on the opposite side of the notch 21b from which the harness portion 54 extends from the chassis 22. When the body 21 and the chassis 22 are assembled together, the cover 23 is assembled so as to cover the opening 21a, so that the body 21, the chassis 22 and the cover 23 form a cylindrical stator 20. Shields the inside from external optical noise. In this way, the chassis 22 and the cover 23 function as a lid of the body 21 that is the housing.

In addition, the surface of the first portion 51 opposite to the detection area is bonded to the second member (for example, the body 21). Specifically, the surface (back surface 51B) of the first portion 51 on the opposite side of the detected region is bonded to the second member via a plate-shaped member (for example, the support substrate 65). More specifically, in the support substrate 65 of the present embodiment, adhesive tape is attached to both the surface that contacts the first portion 51 and the opposite surface. The tape is a so-called double-sided tape, and both sides have adhesiveness. That is, one surface of the support substrate 65 is adhered to the back surface (back surface 51B) of the first portion 51 via the tape. In addition, the support substrate 65 has one surface adhered to the first portion 51 and the other surface having an adhesive property. The other surface is a surface from which the shaft 12 extends from the body 21, and is adhered to a surface existing on the chassis 22 side (hereinafter, referred to as an adhesive surface 21c) via a tape. As described above, one of the first portion 51 and the second portion 52 (the second portion 52 in the present embodiment) is fixed to the first member (chassis 22) and the other of the first portion 51 and the second portion 52. The surface of the (first portion 51 in this embodiment) opposite to the detected region is bonded to the body 21. Further, the plate-like member (for example, the support substrate 65) has one surface adhered to the other surface (rear surface 51B) opposite to the detected area (the back surface 51B) and the other surface adhered to the body 21. A plate interposed between the other surface of the first portion 51 or the second portion 52 (for example, the first portion 51) opposite to the detection area (for example, the back surface 51B) and the second member (for example, the body 21). The member (for example, the support substrate 65) preferably has higher rigidity than the substrate 50.

In the present embodiment, the surface of the first portion 51 on the opposite side of the detection area is bonded to the second member via the support substrate 65, but this is an example of a specific bonding method. It is not limited to. For example, the back surface 51B of the first portion 51 may be bonded to the bonding surface 21c with an adhesive or a tape (double-sided tape or the like). Specifically, for example, an adhesive is applied in a dot shape near the outer circumference or the inner circumference of the support substrate 65, and the support substrate 65 and the back surface 51B of the first portion 51 and the support substrate 65 and the bonding surface 21c are attached to each other. The spot may be fixed. Further, a tape may be additionally used as a reinforcement until the adhesive solidifies in spot fixing.

Also in the case of using an adhesive, the adhesive is applied to the surface of the second member (for example, the body 21) or the other side of the first portion 51 or the second portion 52 opposite to the detection area, and the second member and the other are attached. Since the surface on the opposite side of the other detected region can be bonded to the second member only by bringing them into contact with each other, the assembly of the sensor 31 becomes easier.

When the shaft 12 of the rotor 10 described above rotates, as shown in FIG. 3, the optical scale 11 moves relatively to the detection unit 35 in the R direction, for example. As a result, the signal track T1 of the optical scale 11 moves relatively to the detector 35. In the optical scale 11, the in-plane polarization direction Pm of the polarizer is oriented in a predetermined direction, and the polarization direction Pm is changed by rotation. The detection unit 35 can receive the incident light (transmitted light) 73 that the light source light 71 of the generation unit 41 transmits and enters the optical scale 11, and can read the signal track T1 of the optical scale 11 illustrated in FIG. ..

FIG. 18 is a diagram showing an example of attachment of the bearings 26 a and 26 b to the body 21. The outer peripheral surface of the bearing and the inner peripheral surface of the bearing hole 21d of the housing are fixed with an adhesive. Specifically, the body 21 that is one member that forms the housing 20 has a bearing hole 21d in which the bearings 26a and 26b are fixed. The bearing hole 21d has a diameter equal to or larger than the outer diameters of the bearings 26a and 26b. In the present embodiment, the bearings 26a and 26b are provided so as to be able to enter the inside of the bearing hole 21d from the outside of the body 21 (the upper side of FIGS. 1 and 18). The clearance between the outer diameters of the bearings 26a and 26b and the inner peripheral diameter of the bearing hole 21d is set to be narrow enough to fix the bearings 26a and 26b to the bearing hole 21d by bonding with an adhesive. Has been. Further, a through hole 21e for extending one end side of the shaft 12 is provided at the bottom of the bearing hole 21d. The diameter of the through hole 21e is smaller than the diameter of the bearings 26a and 26b, and the bearings 26a and 26b do not enter the through hole 21e.

When mounting the bearings 26a and 26b on the body 21, as shown in FIG. 18, the bearings 26a and 26b are inserted into the bearing hole 21d in the order of the bearings 26b and 26a. A spacer 29 may be provided between the bearing 26a and the bearing 26b. The spacer 29 seals the bearing hole 21d.

In the present embodiment, the bearings 26a and 26b enter the bearing hole 21d in a state where the adhesive is applied to the outer peripheral surfaces of the bearings 26a and 26b that are in contact with the inner peripheral surface of the cylindrical bearing hole 21d. Each of the components provided inside the bearing hole 21d enters the bearing hole 21d in the order of the bearing 26b, the spacer 29, and the bearing 26a, and receives pressure from the entrance side of the bearing hole 21d until the adhesive hardens. The position with respect to the hole 21d is maintained.

A groove is formed on the inner peripheral surface of the bearing hole 21d. Specifically, the inner peripheral surface of the bearing hole 21d has three grooves as shown in, for example, FIG. Of the three grooves, the groove closest to the bottom (the machining relief groove 92) is located at the innermost portion in the entrance direction of the bearings 26a and 26b into the bearing hole 21d. Further, the other two grooves (adhesive agent collecting grooves 91a, 91b) are provided at positions corresponding to intermediate positions of the bearings 26a, 26b, respectively. The intermediate position between the bearings 26a and 26b is a position at which the thickness of the bearings 26a and 26b in the approach direction is divided into two. That is, the other two grooves are provided assuming the positions of the bearings 26a and 26b in the state where they are attached and fixed to the body 21. By bonding the inner peripheral surface of the bearing hole 21d and the outer peripheral surface of the bearings 26a and 26b, the outer rings of the bearings 26a and 26b are fixed to the body 21. The three grooves are circular grooves provided along the circumference of the bearing hole 21d and form a recess on the inner peripheral surface of the bearing hole 21d. Although only the adhesive reservoir groove 91a is shown in FIG. 18, the adhesive reservoir groove 91b and the machining relief groove 92 are circles provided along the circumference of the bearing hole 21d, like the adhesive reservoir groove 91a. It is a groove.

Fixing by adhesion makes the sensor 31 easier to manufacture because the tolerance for error in component dimensions is higher than that by press fitting. However, if the amount of adhesive applied is too large, excess adhesive may stick out of the adhesive surface. For example, if the protruding adhesive leaches out between the inner and outer races of the bearings 26a and 26b, the leached adhesive may hinder the rotation of the shaft 12 that is axially supported by the bearings 26a and 26b. As the sensor 31 becomes smaller, the adhesive surface also tends to be proportionately smaller. The smaller the adhesive surface, the more difficult it is to properly control the amount of adhesive that is appropriate for the adhesive surface. This is because the smaller the adhesive surface is, the smaller the amount of the appropriate adhesive becomes, so that the deviation of the amount of the small amount of adhesive has a greater influence.

In this embodiment, as described above, the groove is formed on the inner peripheral surface of the bearing hole 21d. Therefore, even if the amount of the adhesive applied to the circumferential outer peripheral surfaces of the bearings 26a and 26b is slightly higher than the appropriate amount of the adhesive, excess adhesive is applied to at least one of the three grooves. When the agent flows in, it is possible to prevent the adhesive from protruding from the adhesive surface.

FIG. 19 is a diagram showing an example of how the shaft 12 is attached to the bearings 26 a and 26 b fixed to the body 21. The shaft 12 and the inner peripheral surfaces of the bearings 26a and 26b are fixed with an adhesive. Specifically, the shaft 12 has an adhesive portion 12a having an outer peripheral surface adhered to the inner peripheral surfaces of the bearings 26a and 26b, and extending portions 12b and 12c extending inside and outside the housing 20 with the adhesive portion 12a interposed therebetween. Have and. The clearance between the inner diameters of the bearings 26a and 26b and the adhesive portion 12a is so narrow that the adhesive portion 12a can be fixed to the inner rings of the bearings 26a and 26b by adhesion using an adhesive. .. The extension portion 12b on the side (one end side) of rendering inside the housing 20 extends into the housing. On the one end side, a member (for example, the optical scale 11) that rotates or rotates in the detection area between the generation unit 41 and the detection unit 35 and affects the detection target is provided. The extension portion 12c on the side (the other end side) of rendering on the outside of the housing 20 is connected to a rotating machine such as a motor.

Grooves are formed on the outer peripheral surface of the shaft 12 that is bonded to the inner peripheral surfaces of the bearings 26a and 26b. Specifically, the adhesive portion 12a of the shaft 12 has three grooves, as shown in FIG. Of the three grooves, the groove closest to the other end side (processing relief groove 94) is located at the boundary with the extending portion 12c on the other end side. In the present embodiment, the diameter of the extension portion 12c on the other end side is larger than the diameter of the adhesion portion 12a, and there is a step between the adhesion portion 12a and the extension portion 12c on the other end side. The groove closest to the other end side is provided at the position of the step. Further, the other two grooves (adhesive agent collecting grooves 93a, 93b) respectively have a positional relationship in which a step between the adhesive portion 12a and the extending portion 12c on the other end side is in contact with the inner ring of the bearing 26a so that the shaft 12 and the bearing 26a are in contact with each other. , 26b are provided at a position corresponding to an intermediate position between the bearings 26a, 26b in a state where they are bonded. The three grooves formed on the shaft 12 are formed as depressions on the cylindrical outer peripheral surface of the adhesive portion 12a.

As for the adhesion between the shaft 12 and the inner rings of the bearings 26a and 26b, if the amount of the applied adhesive is too large, the excess adhesive will adhere to the bonding surface, as in the case of the outer ring of the bearings 26a and 26b and the bearing hole 21d. It may stick out. In this embodiment, as described above, the groove is formed on the outer peripheral surface of the adhesive portion 12a of the shaft 12. Therefore, even if the amount of the adhesive applied to the outer peripheral surface of the adhesive portion 12a is slightly larger than the appropriate amount of the adhesive, at least one of the three grooves provided in the adhesive portion 12a has an excess amount. The inflow of the adhesive can prevent the adhesive from protruding from the adhesive surface.

The shaft 12 is adhesively fixed to the inner rings of the bearings 26a and 26b, and the outer ring of the bearings 26a and 26b is adhesively fixed to the bearing hole 21d, so that the shaft 12 is rotatable with respect to the body 12 via the bearings 26a and 26b. Will be pivotally supported by. The shaft 12 of the present embodiment is a columnar member having different diameters at the adhesive portion 12a and the end portion, but it does not necessarily have to be columnar. The outer shape of the bonding portion 12a may be any shape as long as it can be fixed to the inner rings of the bearings 26a and 26b by bonding.

Any adhesive may be used as long as it has a viscosity that can be applied to the outer races of the bearings 26a and 26b and the outer peripheral surface of the adhesive portion 12a of the shaft 12. For example, an anaerobic adhesive that is generally used for bonding the fitting portions can be adopted as the adhesive in the present embodiment.

The optical encoder 2 includes the sensor 31 and the arithmetic device 3 described above, and as shown in FIG. 4, the sensor 31 and the arithmetic device 3 are connected to each other. The arithmetic unit 3 is connected to a control unit 5 of a rotating machine such as a motor.

In the optical encoder 2, the detector 35 detects the incident light 73 that the light source light 71 passes through and enters the optical scale 11. The arithmetic unit 3 calculates the relative position between the rotor 10 of the sensor 31 and the detection unit 35 from the detection signal of the detection unit 35, and outputs the information of the relative position as a control signal to the control unit 5 of the rotating machine such as a motor. ..

The arithmetic unit 3 is a computer such as a personal computer (PC), and has an input interface 4a, an output interface 4b, a CPU (Central Processing Unit) 4c, a ROM (Read Only Memory) 4d, and a RAM (Random Access Memory). ) 4e and internal storage device 4f. The input interface 4a, the output interface 4b, the CPU 4c, the ROM 4d, the RAM 4e and the internal storage device 4f are connected by an internal bus. The arithmetic unit 3 may be composed of a dedicated processing circuit.

The input interface 4a receives the input signal from the detection unit 35 of the sensor 31 and outputs it to the CPU 4c. The output interface 4b receives the control signal from the CPU 4c and outputs it to the control unit 5.

The ROM 4d stores programs such as a BIOS (Basic Input Output System). The internal storage device 4f is, for example, an HDD (Hard Disk Drive), a flash memory, or the like, and stores an operating system program and an application program. The CPU 4c realizes various functions by executing the programs stored in the ROM 4d and the internal storage device 4f while using the RAM 4e as a work area.

The internal storage device 4f stores a database in which the polarization direction Pm of the optical scale 11 and the output of the detection unit 35 are associated with each other. Alternatively, the value of the distance D (see FIG. 13) between the light emission point 41S of the generation unit 41 and the arrangement center S0 (detection unit 35) and the position information of the optical scale 11 are associated with each other in the internal storage device 4f. The attached database is stored.

In the signal track T1 shown in FIG. 5, an array of thin metal wires (wires) called a wire grid pattern is formed on the optical scale 11 shown in FIG. In the optical scale 11, adjacent metal thin wires g are linearly arranged in parallel as signal tracks T1. Therefore, the optical scale 11 has the same polarization axis regardless of the position where the light source light 71 is emitted, and the in-plane polarization direction of the polarizer is oriented in one direction.

Further, the optical scale 11 having the metal fine lines g called a wire grid pattern can have higher heat resistance than a light-induced polarizing plate. Further, since the optical scale 11 has a line pattern that does not locally intersect with each other, the optical scale 11 can be highly accurate and have few errors. Further, since the optical scale 11 can be stably manufactured by collective exposure or nanoimprint technology, the optical scale 11 with high accuracy and few errors can be obtained. The optical scale 11 may be a light-induced polarizing plate.

The plurality of thin metal wires g are arranged without intersecting each other. Between the adjacent thin metal wires g is a transmissive region d through which all or part of the light source light 71 can pass. When the width of the metal thin wire g and the interval between the adjacent metal thin wires g, that is, the width of the metal thin wire g and the width of the transmission region d are sufficiently smaller than the wavelength of the light source light 71 of the generation unit 41, the optical scale 11 uses the light source light The incident light 73 of 71 can be polarized and separated. Therefore, the optical scale 11 has a polarizer having a uniform in-plane polarization direction Pm. In the optical scale 11, in the rotating circumferential direction, the polarization axis of the incident light 73 entering the detection unit 35 changes according to the rotation of the optical scale 11. In the present embodiment, the change of the polarization axis is repeated twice with respect to one rotation of the optical scale 11.

The optical scale 11 does not need to make fine the segments having different polarization directions. Since the optical scale 11 has the uniform polarization direction Pm, there is no boundary between regions having different polarization directions Pm, and it is possible to suppress the disturbance of the polarization state of the incident light 73 due to this boundary. The optical encoder 2 of the present embodiment can reduce the possibility of causing erroneous detection or noise.

FIG. 20 is an explanatory diagram for describing an example of the first light receiving unit PD1 of the detection unit 35. FIG. 21 is an explanatory diagram for explaining an example of the third light receiving unit PD3 of the detection unit 35. The generator 41 is, for example, a light emitting diode. As shown in FIG. 3, the light source light 71 emitted from the generation unit 41 passes through the above-described optical scale 11 and serves as incident light 73 through the polarization layer PP1, the polarization layer PP2, the polarization layer PP3, and the polarization layer PP4. The light is transmitted and is incident on the first light receiving portion PD1, the second light receiving portion PD2, the third light receiving portion PD3, and the fourth light receiving portion PD4. When viewed in a plan view from the z-axis direction, each of the first light receiving unit PD1, the second light receiving unit PD2, the third light receiving unit PD3, and the fourth light receiving unit PD4 is arranged around the generating unit 41. The distances from the first light receiving portion PD1, the second light receiving portion PD2, the third light receiving portion PD3, and the fourth light receiving portion PD4 to the arrangement center S0 are equal. With this structure, it is possible to reduce the calculation load of the CPU 4c that is the calculation means.

As shown in FIG. 20, the first light receiving unit PD1 includes a silicon substrate 34, a light receiving unit 37, and a first polarizing layer 39a. Further, as shown in FIG. 21, the third light receiving unit PD3 includes a silicon substrate 34, a light receiving unit 37, and a second polarizing layer 39b. For example, the silicon substrate 34 is an n-type semiconductor, the light receiving portion 37 is a p-type semiconductor, and the silicon substrate 34 and the light receiving portion 37 can form a photodiode formed by a PN junction. The first polarization layer 39a and the second polarization layer 39b can be formed by a light-induced polarization layer or a wire grid pattern in which metal wires are arranged in parallel. The first polarizing layer 39a splits the incident light 73 incident on the optical scale 11 shown in FIG. 3 from the light source light 71 into the first polarization direction, and the second polarizing layer 39b divides the incident light 73 into the second polarization. Separate in directions. The polarization axis of the first separated light and the polarization axis of the second separated light are preferably different from each other by 90°. With this configuration, the CPU 4c of the calculation device 3 can easily calculate the polarization angle.

Similarly, with reference to FIGS. 20 and 21, the second light receiving unit PD2 includes the silicon substrate 34, the light receiving unit 37, and the first polarizing layer 39a. Further, as shown in FIG. 21, the fourth light receiving portion PD4 includes a silicon substrate 34, a light receiving portion 37, and a second polarizing layer 39b. For example, the silicon substrate 34 is an n-type semiconductor, the light receiving portion 37 is a p-type semiconductor, and the silicon substrate 34 and the light receiving portion 37 can form a photodiode formed by a PN junction. The first polarization layer 39a and the second polarization layer 39b can be formed by a light-induced polarization layer or a wire grid pattern in which metal wires are arranged in parallel. The first polarizing layer 39a splits the incident light 73 incident on the optical scale 11 shown in FIG. 3 from the light source light 71 into the first polarization direction, and the second polarizing layer 39b divides the incident light 73 into the second polarization. Separate in directions. The polarization axis of the first separated light and the polarization axis of the second separated light are preferably different from each other by 90°. With this configuration, the CPU 4c of the calculation device 3 can easily calculate the polarization angle.

The first light receiving unit PD1, the second light receiving unit PD2, the third light receiving unit PD3, and the fourth light receiving unit PD4 receive the incident light 73 via the polarization layers PP1, PP2, PP3, and PP4 that separate the incident light 73 into different polarization directions. .. Therefore, the polarization axis separated by the polarization layer PP1 and the polarization axis separated by the polarization layer PP2 are preferably different from each other by 45°. The polarization axis separated by the polarization layer PP2 and the polarization axis separated by the polarization layer PP3 are preferably different from each other by 45°. The polarization axis separated by the polarization layer PP3 and the polarization axis separated by the polarization layer PP4 are preferably different from each other by 45°. The polarization axis separated by the polarization layer PP4 and the polarization axis separated by the polarization layer PP1 are preferably different from each other by 45°. With this configuration, the CPU 4c of the calculation device 3 can easily calculate the polarization angle.

22, FIG. 23, and FIG. 24 are explanatory diagrams for explaining the separation of the polarization component by the optical scale 11. As shown in FIG. 22, the incident light polarized in the polarization direction Pm by the signal track T1 of the optical scale 11 is incident. In FIG. 22, the sensing range includes a foreign matter D1 and a foreign matter D2. The polarization direction Pm of the incident light can be expressed by the light intensity PI(−) of the component in the first polarization direction and the light intensity PI(+) of the component in the second polarization direction described above. As described above, the first polarization direction and the second polarization direction are preferably different from each other by 90°, and are, for example, +45° component and −45° component with respect to the reference direction. .. 22, FIG. 23, and FIG. 24, the axial direction of the wire grid is shown parallel to the paper surface. However, if the tilt angle is small even if the wire grids are tilted at the same angle with respect to the paper surface, The separation function is not affected. That is, even if the optical scale 11 is tilted with respect to the rotation axis, it functions as a polarization separation element.

As shown in FIG. 23, the first light receiving unit PD1 detects the incident light through the first polarization layer 39a that separates the incident light into the first polarization direction, and therefore the light intensity PI(− of the component in the first polarization direction). ) Is detected. As shown in FIG. 24, the third light receiving unit PD3 detects the incident light via the second polarization layer 39b that separates the incident light into the second polarization direction. Therefore, the light intensity PI(+) of the component in the second polarization direction is detected. ) Is detected. Similarly, as shown in FIG. 23, the second light receiving unit PD2 detects the incident light through the first polarization layer 39a that separates the incident light into the first polarization direction, so that the light intensity of the component in the first polarization direction is detected. Detect PI(-). As shown in FIG. 24, the fourth light receiving unit PD4 detects the incident light via the second polarization layer 39b that separates the incident light into the second polarization direction, and therefore the light intensity PI(+ of the component in the second polarization direction). ) Is detected.

FIG. 25 is a functional block diagram of the optical encoder 2. FIG. 26 is an explanatory diagram for explaining the rotation angle of the optical scale 11 and the light intensity change of the polarization component of each light receiving unit. As shown in FIG. 25, the generation unit 41 emits light based on the reference signal and irradiates the optical scale 11 with the light source light 71. The incident light 73 that is transmitted light is received by the detection unit 35. The differential operation circuit DS performs a differential operation process using the detection signal output from the detection unit 35 and amplified by the preamplifier AMP. The preamplifier AMP can be omitted depending on the magnitude of the output of the detection unit 35.

The differential operation circuit DS detects the light intensity PI(−) of the first polarization direction component (first separated light) and the second polarization direction component (second separated light), which are the detection signals of the detection unit 35. ) Light intensity PI(+) of The respective outputs of the first light receiving unit PD1, the second light receiving unit PD2, the third light receiving unit PD3, and the fourth light receiving unit PD4 corresponding to the light intensity PI(−) and the light intensity PI(+) are, for example, 26, the light intensities I1, I2, I3, and I4 are out of phase according to the rotation of the optical scale 11.

The differential operation circuit DS calculates the optical intensity PI(-) of the component in the first polarization direction and the optical intensity PI(+) of the component in the second polarization direction from the optical intensities PI(+) according to the equations (1) and (2). The differential signal Vc and the differential signal Vs depending on the rotation of the scale 11 are calculated. The differential signal Vc is a signal corresponding to a so-called cosine component, and the differential signal Vs is a signal corresponding to a so-called sine component.
Vc=(I1-I3)/(I1+I3)...(1)
Vs=(I2-I4)/(I2+I4)...(2)

In this way, the differential operation circuit DS calculates the sum [I1+I3] of the light intensities and the difference [I1−I3] of the light intensities based on the light intensities I1 and I3, and the difference in the light intensities [I1 The differential signal Vc is calculated by dividing −I3] by the sum of the light intensities [I1+I3]. Further, the differential operation circuit DS calculates the sum [I2+I4] of the light intensities and the difference [I2-I4] of the light intensities based on the light intensities I2 and I4, and the difference in the light intensities [I2-I4]. ] Is divided by the sum [I2+I4] of the light intensities to calculate the differential signal Vs. The differential signals Vc and Vs calculated by the equations (1) and (2) do not include parameters affected by the light intensity of the light source light 71, and the output of the sensor 31 is the same as that of the detection unit 35 and the optical signal. It is possible to reduce the influence of the distance from the scale 11 and the variation of the light intensity of the generation unit 41. The differential signals Vc and Vs are functions of the rotation angle β of the polarization axis of the optical scale 11 (hereinafter referred to as polarization angle), which is the rotation angle of the optical scale 11. However, when the automatic power control (APC) that controls the light amount of the light source provided in the generation unit 41 is provided, the above division is not necessary.

As shown in FIG. 25, the differential signals Vc and Vs are input to the filter circuit NR and noise is removed. Next, the multiplier circuit AP can calculate the Lissajous pattern shown in FIG. 27 from the differential signals Vc and Vs to specify the absolute angle of the rotation angle of the rotor 10 rotated from the initial position. Since the differential signals Vc and Vs are differential signals that are out of phase with each other by λ/4, a Lissajous pattern in which the horizontal axis represents the cosine curve of the differential signal Vc and the vertical axis represents the sine curve of the differential signal Vs. By calculation, the Lissajous angle is determined according to the rotation angle. For example, the Lissajous pattern shown in FIG. 27 makes two revolutions when the rotor 10 makes one revolution. The arithmetic unit 3 has a function of storing whether the rotational position of the optical scale 11 is in the range of 0° or more and less than 180° or in the range of 180° or more and less than 360°. Thereby, the optical encoder 2 can be an absolute encoder capable of calculating the absolute position of the rotor 10.

FIG. 28 is a diagram for explaining the generation unit 41. The generating unit 41 shown in FIG. 28 is a light emitting element in which a light emitting device 41U such as a light emitting diode is packaged. The light emitting device 41U may have other configurations. Specifically, for example, a laser light source such as a vertical cavity surface emitting laser or a filament may be used. The generation unit 41 includes a base substrate 41F, a through conductive layer 41H embedded in the through hole SH, an external electrode 41P electrically connected to the through conductive layer 41H, and a light emitting device 41U mounted on the base substrate 41F. A bonding wire 41W that electrically connects the light emitting device 41U and the through conductive layer 41H, a sealing resin 41M that protects the light emitting device 41U, and a light shielding film 41R are provided.

The light-shielding film 41R of the generation unit 41 has a function of diaphragming the light source light 71 that narrows the light source light 71 emitted by the light emitting device 41U to the range of the emission surface 41T. The exit surface 41T has no lens surface, and the light distribution of the light source light 71 shows a light distribution distribution of a predetermined angle 2θo with respect to the cross section of the exit surface 41T. The angle 2θo of the light distribution depends on the generator 41. The angle 2θo is, for example, 30°, but the angle can be made larger or smaller than this.

The sensor 31 can use the generation unit 41 having no lens. The SN ratio can be improved by bringing the light emission point 41S of the generation unit 41 closer to the disposition center S0 (detection unit 35). The distance W to each of the first light receiving portion PD1, the second light receiving portion PD2, the third light receiving portion PD3, and the fourth light receiving portion PD4 can be arranged within a range in which the influence of the light diffused by the generating portion 41 can be reduced to receive light. Become. Therefore, the measurement accuracy of the sensor 31 and the optical encoder 2 is improved. Of course, the generating unit 41 with a lens may be used.

FIG. 29 is a diagram showing an example of the relationship between the emission range of light from the generation unit 41 and the positions of the detection unit 35 and the shaft 12. In the present embodiment, the detection target generated by the generation unit 41 and detected by the detection unit 35 is light. The emission angle (the above-mentioned angle 2θo) of the light source light 71 of the generation unit 41 can be arbitrarily set by design. Therefore, as shown in FIG. 29, it is possible to include the entire light receiving region by the detection unit 35 within the range of the emission angle of the light source light 71 but not include the connection unit 53 and the shaft 12. However, it is difficult to completely contain the light source light 71 using the light emitting diode as a light source in the emission range to make the light leakage zero. Further, when the reflected light after emission is further considered, it is difficult to completely prevent all the light other than the direct light source light 71 (for example, irregularly reflected light) from being completely incident on the detection unit 35. Therefore, in the present embodiment, for the purpose of reducing the reflected light, the surface of the substrate 50 on which the light emitting element and the light receiving element are provided is subjected to light antireflection treatment. Specifically, a coating process for applying an antireflection material such as a black paint having a light-absorbing property to at least the surface (front surface 50A) of the plate surface of the substrate 50 on which the generation portion 41 and the detection portion 35 are provided, etc. Can be adopted as a light antireflection treatment.

Further, in consideration of the possibility that light is reflected on the outer peripheral surface of the shaft 12, the shaft 12 may be subjected to antireflection treatment. In this case, the sensor 31 rotatably supports the scale (the optical scale 11) that affects the light by rotating in the detected area that is the space between the generation unit 41 and the detection unit 35. The sensor is provided with the rotation support portion (the body 21 of the stator 20) having the shaft 12, and the shaft 12 is subjected to light reflection prevention processing. Specifically, for example, plating treatment of a black oxide film on the outer peripheral surface of the metal shaft 12 or the above-mentioned coating treatment can be adopted as the light reflection preventing treatment. With the same idea, the inner peripheral surface of the stator 20 accommodating the optical scale 11 and the substrate 50 may be subjected to antireflection treatment.

Next, a method of manufacturing the sensor 31 will be described with reference to the flowchart of FIG. FIG. 30 is a flow chart showing an example of the flow of steps involved in manufacturing the sensor 31. The following is a description of the work process mainly performed by the manufacturing worker or the manufacturing machine operated by the manufacturing worker. First, the substrate 50 in which the first portion 51 provided with the generation unit 41 and the second portion 52 provided with the detection unit 35 are integrated is formed (step S1). Specifically, as shown in FIG. 14, for example, a semi-arcuate first portion 51, a circular second portion 52, and a connecting portion 53 that connects the first portion 51 and the second portion 52, An FPC having a harness portion 54 extending from the first portion 51 to the opposite side of the connecting portion 53 and bending portions 55a and 55b for bending the substrate 50 is formed. In this step, signal lines, power lines, the ground pattern 80, and the like connected to various circuits mounted on the substrate 50 in a later step are formed on the FPC. Here, for example, as shown in FIG. 9, the ground patterns 81 and 82 of the bent portions 55a and 55b of the ground pattern 80 are at least the ground pattern 83 of the first portion 51 and the ground pattern 84 of the second portion 52. Make thin. As described above, in the method for manufacturing the sensor 31 (optical sensor) according to the present embodiment, the first portion 51 provided with the generation unit 41, the second portion 52 provided with the detection unit 35, the generation unit 41 and the detection unit. 35 is provided in a range including the bent portions 55a and 55b that are bent between the first portion 51 and the second portion 52 so as to face each other, and the first portion 51, the second portion 52, and the bent portions 55a and 55b. The step of forming the substrate 50 having the ground pattern 80 is included. Further, antireflection treatment is applied to the surface of the FPC. At this time, the terminal portion to which the wirings of various circuits including the generation unit 41 and the detection unit 35 are connected later is not subjected to the antireflection treatment.

Next, various components are attached to the board 50. Specifically, for example, first, the support substrate 65 is attached to the back surface 51B of the first portion 51 (step S2). Next, various steps for providing the IC circuit 60 on the back surface 52B of the second portion 52 are performed. More specifically, solder printing for mounting the IC circuit 60 on the back surface 52B of the second portion 52 (step S3), mounting the IC circuit 60 on the back surface 52B of the second portion 52 (step S4), and step S4. By performing reflow by heating on the back surface 52B side of the second portion 52 after mounting by the processing (step S5), visual inspection of soldering on the back surface 52B of the second portion 52 (step S6), etc. The IC circuit 60 is provided on the back surface 52B. As described above, in the method of manufacturing the sensor 31 (optical sensor) according to the present embodiment, the surface (front surface 51A) on which the electronic component including the generation unit 41 is provided in the first portion 51 and the detection unit 35 in the second portion 52 are provided. A plate-shaped support member (IC circuit 60, support) that keeps the surface (front surface 51A, 52A) on which the electronic component is provided flat on the surface (rear surface 51B, 52B) on the back side of the surface (front surface 52A) on which the electronic component is included. The step of attaching the substrate 65) is included.

Next, various processes for mounting components on the surface 50A of the substrate 50 are performed. More specifically, solder printing for mounting the generation unit 41 and a part of the component 61 on the surface 51A of the first portion 51 and mounting the detection unit 35 on the surface 52A of the second portion 52 (step S7), Mounting various circuits on the surface 50A including the generation unit 41 and the detection unit 35 (step S8), reflow by heating on the surface 50A side after mounting by the process of step S8 (step S9), visual inspection of soldering on the surface 50A By going through (step S10) and the like, a component to be connected by wiring by soldering is attached to the front surface 50A. Then, the substrate 50 is washed (step S11). After cleaning the substrate 50, a paste (eg, Ag paste) for attaching a bare chip, which is a part of the component 61, is applied to the front surface 50A (step S12), a bare chip is mounted (step S13), and thermosetting (step S14). The bare chip is fixed by. Then, the bare chip and the wiring of the substrate 50 are connected by wire bonding (step S15). After wire bonding, a resin (UV curable resin) that is cured by ultraviolet rays is applied to the surface 50A side of the substrate 50 (step S16), and a sealing substrate (for example, a glass substrate) is applied to the surface 50A side to which the UV curable resin is applied. Is mounted (step S17), and a UV curing process for irradiating ultraviolet rays to cure the UV curable resin is performed (step S18). As described above, the method of manufacturing the sensor 31 (optical sensor) according to the present embodiment includes the step of providing the generating portion 41 in the first portion 51 and providing the detecting portion 35 in the second portion 52. Here, when the surface (back surface 50B) of the substrate 50 on which the plate-shaped member (for example, the support substrate 65) is provided is one surface, the generation unit 41 and the detection unit 35 are the other surface (front surface 50A). It is provided on the side. Further, one or more electronic components (for example, the detection unit 35 and the component 61) provided on the front surface 52A of the second portion 52 are provided within the range where the package of the IC circuit 60 exists on the back surface 52B.

The wire bonding is, for example, Au wire bonding using a gold wire, but this is an example and the invention is not limited to this and can be appropriately changed. Further, instead of wire bonding, TAB (Tape Automated Bonding) may be adopted, or the bare chip may be used as a flip chip for soldering to the wiring of the substrate.

Next, the generation unit 41 and the detection unit 35 are opposed to each other. Specifically, for example, the surface of the first portion 51 on which the generation portion 41 is provided (front surface 51A) and the surface of the second portion 52 on which the detection portion 35 is provided (front surface 52A) are provided in parallel and face each other. Thus, the substrate 50 is bent at the bent portions 55a and 55b (step S19). As described above, in the method for manufacturing the sensor 31 (optical sensor) according to the present embodiment, the substrate 50, which is a flexible substrate (FPC), and the surface (front surface 51A) on which the generation portion 41 of the first portion 51 is provided, The step of bending the substrate 50 by the bent portions 55a and 55b is included so that the surface (front surface 52A) of the second portion 52 on which the detection portion 35 is provided faces.

As shown in the example of steps S7 to S14 described above, in the method of manufacturing the sensor 31 (optical sensor) according to the present embodiment, the generation portion 41 is provided in the first portion 51 and the detection portion is provided in the second portion 52. 35 is included. Each of the first light receiving unit PD1 to the fourth light receiving unit PD4 forming the detection unit 35 is arranged at a different position on a predetermined plane (for example, the front surface 52A), and four light receiving elements for one point on the predetermined plane are provided. It is preferable that the four distances (distance W) from each of the two are equal and that the four line segments connecting one point and the center of the light receiving region of each of the four light receiving elements form a right angle with each other. Further, after the substrate 50 is bent, it is desirable that a straight line L2 that is a normal line of a predetermined plane (front surface 52A) passing through one point (arrangement center S0) passes through the center of the light emission point 41S of the generation unit 41. The generation unit 41 and the detection unit 35 are preferably provided in consideration of these. Specifically, the first condition that the first axis LA that is the bending axis of the bent portion 55a and the second axis LB that is the bending axis of the bent portion 55b are parallel are satisfied. The distance (distance W1) between the first point LA (emission point 41S), which is the generation center point of the detection target of the generation unit 41 on the plane before the substrate 50 is bent, and the detection unit 35. The distance (distance W2) between the second axis LB and the second point which is either the center of the detection area of the detection target or the arrangement center of the plurality of detection areas of the detection unit 35 (the distance W2) is equal. The second condition of doing is satisfied. In addition, the first point and the second point are arranged on the same straight line (for example, the straight line L1) that intersects (or crosses over) at a right angle with respect to the first axis LA and the second axis LB on the board 50 before bending. The third condition is satisfied. In order to satisfy these first condition, second condition and third condition, the wiring of the generation unit 41 and the detection unit 35 is provided at the time of forming the substrate 50, the first axis LA and the second axis LB are determined, and the generation unit The placement of the mounting unit 41 and the detection unit 35 is determined.

Next, a housing (for example, the stator 20) is formed (step S20). Specifically, a second member (for example, an optical scale 11) that operably supports a member (for example, the optical scale 11) that influences light by operating in a detected region that is a space between the generation unit 41 and the detection unit 35. A housing having a body 21) and a first member (for example, the chassis 22) to which a part of the substrate 50 is fixed is formed. In the present embodiment, the cover 23 is further formed as one configuration of the stator 20 that is the housing that houses the substrate 50 and the optical scale 11, but this is an example of the specific configuration of the housing and is not limited thereto. Not something that can be done. For example, the cover 23 may be integral with the chassis 22. Further, the shaft 12 provided on the body 21, which is the second member, may be a shaft having an outer peripheral surface subjected to antireflection treatment. Further, the inner peripheral surface of the stator 20 that houses the substrate 50 and the optical scale 11 may be subjected to antireflection treatment.

In step S20, the bearing hole 21d and the groove of the shaft 12 are formed, the bearings 26a and 26b and the like are bonded to the bearing hole 21d of the body 21, the shaft 12 is bonded to the bearings 26a and 26b, and the member on one end side of the shaft 12 is bonded. Steps such as fixing (for example, the optical scale 11) are included. Specifically, for example, three grooves are formed on each of the inner peripheral surface of the bearing hole 21d and the outer peripheral surface of the adhesive portion 12a of the shaft 12. After that, an adhesive is applied to the circumferential outer peripheral surfaces of the bearings 26a and 26b. As shown in the example of FIG. 18, the bearings 26a and 26b coated with the adhesive are attached to the bearing holes 21d of the body 21 and fixed by adhesion. Further, an adhesive is applied to the outer peripheral surface of the adhesive portion 12a of the shaft 12. The shaft 12 coated with the adhesive is attached and fixed to the bearings 26a and 26b as shown in the example of FIG. After that, a member (for example, the optical scale 11) is fixed to the extending portion 12b on one end side of the shaft 12. The method of fixing the member to the shaft 12 is arbitrary. For example, it may be adhered or fixed by screwing.

Then, the process (step S21) relating to the assembly of the sensor 31 is performed. Hereinafter, steps involved in assembling the sensor 31 will be described. In manufacturing the sensor 31, the substrate 50 and the moving body are relatively moved so that the moving body (for example, the optical scale 11) enters the region (detected region) between the generation unit 41 and the detection unit 35. Specifically, in the manufacture of the sensor 31, for example, as shown in FIGS. 15 and 16, the substrate 50 and the operating body are arranged so that the operating body enters the region (detected region) from the side opposite to the connecting portion 53. Move relative to. In the board 50, the connecting portion 53 is located on the opposite side of the harness portion 54 with the second portion 52 interposed therebetween. Therefore, in the present embodiment, the board 50 is arranged so that the operating body enters the detected area from the harness portion 54 side. And the moving body will be moved relative to each other.

More specifically, with reference to a predetermined plane (for example, the surface 52A of the second portion 52), the plate portions of the first portion 51 and the second portion 52 of the bent substrate 50 and the optical scale 11 are the predetermined plane. To follow. In this state, by moving at least one of the substrate 50 and the stator 20 having the optical scale 11 in the direction along the predetermined plane, the optical scale 11 is provided in the detection area. For example, at the position where the optical scale 11 is provided on the cylindrical outer peripheral surface of the stator 20, an opening (for example, an opening 21a) into which the substrate 50 can be inserted is provided in a direction along the plate surface of the optical scale 11. The optical scale 11 is provided in the detection area by the substrate 50 entering the opening. In this case, the board 50 enters by being inserted into the opening 21a from the harness portion 54 side. Further, the semicircular arc-shaped first portion 51 enters the side of the optical scale 11 where the shaft 12 exists, and the circular second portion 52 enters the side of the optical scale 11 where the shaft 12 does not exist.

In this embodiment, the first portion 51 and the second portion 52 are parallel to each other. Therefore, the manufacturing of the sensor 31 according to the present embodiment including the step of moving at least one of the substrate 50 and the stator 20 having the optical scale 11 in a direction along the predetermined plane with the surface 52A of the second portion 52 as the predetermined plane. In the method, the relative movement direction between the substrate 50 and the operating body is along the first portion 51 and the second portion 52.

Explaining an assembly process in manufacturing the sensor 31 using an example, first, the substrate 50 is mounted on the first member (chassis 22) which is one of a plurality of members forming the housing (stator 20) of the sensor 31. Install. After that, by bringing the first member and the second member (body 21), which is one of the plurality of members forming the housing and supporting the moving body, close to each other, the housing is assembled and the moving body is generated. The substrate 50 and the operating body are moved relative to each other so as to enter the area between the detector 41 and the detector 41. Specifically, as shown in FIG. 11, the second portion 52 of the substrate 50 is fixed to the chassis 22. Then, as shown in FIG. 15, the chassis 22 to which the second portion 52 is fixed and the body 21 on which the rotor 10 is rotatably provided are substantially the same as the first portion 51 and the second portion 52 and the optical scale 11. The optical scales 11 are parallel to each other, and the optical scale 11 is positioned in the detected area between the first portion 51 and the second portion 52. That is, the first portion 51, the second portion 52, and the optical scale 11 have a positional relationship along a predetermined plane. In this positional relationship, the body 21 and the chassis 22 are assembled by bringing the body 21 and the chassis 22 into close contact with each other along a predetermined plane so that the chassis 22 enters from the opening 21a of the body 21. As a result, the optical scale 11 is provided in the detected area. Here, when the body 21 and the chassis 22 are brought close to each other due to the positional relationship in which the optical scale 11 is located in the detection area between the first portion 51 and the second portion 52, the optical scale 11 is adhered to the back surface 51B of the first portion 51. It is desirable not to bring the support substrate 65 thus formed into contact with the adhesive surface 21c of the body 21. Then, when the body 21 and the chassis 22 are brought into contact with each other to assemble the body 21 and the chassis 22, the chassis 22 is pushed up so as to be close to the adhesive surface 21c, so that the support substrate 65 and the adhesive surface 21c are brought into contact with each other. Let it adhere. According to such an assembling method, the plate-shaped member (support substrate 65) has one surface bonded to the other surface (for example, the back surface 51B) opposite to the detection area of the other (for example, the first portion 51). The surface is bonded to the second member (for example, the body 21). Various specific design items such as the length of the connection portion 53, the extension length of the shaft 12 on the adhesive surface 21c side, and the thickness of the support substrate 65 are set so that such an assembly of the body 21 and the chassis 22 can be realized. It is desirable to be done.

Further, since the body 21 and the chassis 22 are assembled, the shaft 12 and the substrate 50 do not come into contact with each other because of the notch 51a. Therefore, it is possible to prevent the rotation of the shaft 12 from being hindered by the contact with the substrate 50. As described above, in the method of manufacturing the sensor 31 according to the present embodiment, the notch (so that the shaft 12 and the substrate 50 are not in contact with each other in a state where the operating body has entered the region between the generation unit 41 and the detection unit 35 ( The notch 51a) is provided in the first portion 51.

After the assembly of the body 21 and the chassis 22, the harness portion 54 extends from the cutout portion 21b provided on the opposite side of the opening 21a of the body 21. After that, when the cover 23 is separate from the chassis 22, the cover 23 is attached so as to cover the opening 21 a of the body 21. That is, in the method of manufacturing the sensor 31 according to the present embodiment, after the first member (chassis 22) and the second member (body 21) are assembled, the entrance (opening 21a) of the substrate 50 of the second member is covered. Cover with a member (cover 23). 14 to 17, some circuits such as the detection unit 35 are not shown, but in reality, various circuits including the detection unit 35 are already mounted.

When the connector CNT is already mounted on the board 50, for example, at the stage of aligning the body 21 and the chassis 22 before the relative movement of the body 21 and the chassis 22, the tip end side of the harness portion 54 is already attached to the body 21. The positional relationship may be such that it is exposed to the outside. This prevents the connector CNT from passing through the notch portion 21b and being caught when the body 21 and the chassis 22 move relative to each other so that the moving body enters the area between the generating portion 41 and the detecting portion 35. , Can be assembled well. Further, the connector CNT can be provided on the substrate 50 before the assembly of the housing (stator 20). Of course, the connector CNT may be provided after assembling the housing.

As described above, the housing of the sensor 31 includes the first member (chassis 22) to which the substrate 50 is attached and the second member (body 21) on which the operating body is provided. The second member and the first member Are assembled by relatively moving and abutting along a predetermined direction, and the predetermined direction is a direction in which the operating body can enter the area (detection area) between the generation section 41 and the detection section 35. is there.

As described above, according to the present embodiment, the inner peripheral surface of the shaft and the bearing, the outer peripheral surface of the bearing, and the inner peripheral surface of the bearing hole 21d of the housing are fixed with an adhesive. For this reason, the tolerance for the dimensional error between the components fixed by adhesion is increased, which facilitates the manufacture of the sensor.

In addition, since the grooves (adhesive agent collecting grooves 91a and 91b, the machining clearance groove 94) are formed on the outer peripheral surface of the shaft that is bonded to the inner peripheral surface of the bearing, the adhesive is applied from the bonding surface between the bearing and the shaft. It is possible to suppress the protrusion. Therefore, the amount of the adhesive can be adjusted with a margin, which facilitates the work related to the bonding.

Further, since the grooves (adhesive agent collecting grooves 93a, 93b, machining relief groove 92) are formed on the inner peripheral surface of the bearing hole 21d, it is possible to suppress the adhesive from protruding from the adhesive surface between the bearing and the bearing hole 21d. can do. Therefore, the amount of the adhesive can be adjusted with a margin, which facilitates the work related to the bonding.

In addition, since the groove (machining clearance groove 92) formed on the inner peripheral surface of the bearing hole 21d exists at the innermost portion of the bearing hole 21d in the approach direction of the bearing, the adhesive agent extruded to the innermost portion can be removed. It is possible to suppress the protrusion from the bonding surface between the bearing and the bearing hole 21d. Therefore, the amount of the adhesive can be adjusted with a margin, which facilitates the work related to the bonding.

Further, since the first portion 51 provided with the generation unit 41 and the second portion 52 provided with the detection unit 35 are present in the substrate 50, the generation unit 41 and the detection unit 35 can be connected by a simple work such as bending the substrate 50. Positioning can be performed. As described above, according to this embodiment, the positioning of the generation unit 41 and the detection unit 35 becomes easier. Further, since such easy positioning can be performed, the manufacturing process related to the positioning can be simplified. Therefore, according to the present embodiment, the manufacture of the sensor becomes easier. The ground patterns 81 and 82 of the bent portion of the ground pattern 80 are thinner than the ground pattern 83 of the first portion 51, the ground pattern 84 of the second portion 52, and the ground pattern 85 of the connecting portion 53. Therefore, regarding the conditions such as elasticity and rigidity of the substrate 50, the bent portions 55a and 55b can be the portions that can be bent more easily than the other portions. Therefore, the sensor can be manufactured more easily.

Moreover, the space between the first portion 51 and the second portion 52 can be more easily provided by the connecting portion 53. Therefore, the detection area between the generation unit 41 and the detection unit 35 can be provided more easily.

In addition, since the substrate 50 and the operating body are relatively moved so that the operating body enters the area between the generating unit 41 and the detecting unit 35, the substrate 50 in which the first portion 51 and the second portion 52 are integrated. By the generation unit 41 and the detection unit 35 provided in the, it is possible to manufacture the sensor 31 capable of sensing the operation of the operating body. Further, by allowing the operating body to enter the region (detected region) from the side opposite to the connecting portion 53, it is possible to achieve both positioning and manufacturing ease and the merit of having the connecting portion 53. You can

Further, since the first portion 51 and the second portion 52 are provided so as to be parallel to each other, the positional relationship between the generation unit 41 provided in the first portion 51 and the detection unit 35 provided in the second portion 52 is improved. It can be adjusted based on the relationship between the first portion 51 and the second portion 52 provided in parallel. Therefore, when the generation unit 41 has directivity, position adjustment for accommodating the detection unit 35 in the generation region of the detection target by the generation unit 41 and position angle when the generation unit 41 and the detection unit 35 are provided on the substrate 50. Design becomes easier. Further, by making the relative movement direction between the substrate 50 and the operating body along the first portion 51 and the second portion 52, it is possible to more easily determine the reference of the relative movement direction, and at the time of relative movement, the substrate is moved. It is possible to make it difficult for 50 to contact the operating body. Therefore, the moving body can more easily enter the area (detection area).

Further, by providing a notch (for example, the notch 51a) for making the shaft 12 and the substrate 50 not in contact with each other in a state where the operating body enters the region between the generation unit 41 and the detection unit 35, the substrate 50 is provided. Can be prevented from coming into contact with the shaft 12 and hindering the movement of the shaft 12.

In addition, the first member (for example, the chassis 22) and the second member (for example, the body 21) are brought close to each other to assemble the housing, and the operating body enters the area between the generation unit 41 and the detection unit 35. By relatively moving the substrate 50 and the operating body, the operating body can simultaneously enter the area between the generating unit 41 and the detecting unit 35 in one step of assembling the housing. Further, the adjustment of the positional relationship between the operating body and the ray of radiation between the generation unit 41 and the detection unit 35 can be determined by the positional relationship between the first member and the second member in the assembly of the housing. Therefore, according to the sensor 31 of the present embodiment, manufacturing becomes easier.

Further, after the first member and the second member are assembled, by covering the entrance (for example, the opening 21a) of the substrate of the second member with the cover member (for example, the cover 23), the generation unit 41 and the detection unit. 35 and the operating body can be sealed in the housing. Therefore, according to the present embodiment, the sensor 31 can perform sensing related to the motion of the motion body with higher accuracy.

Further, since the connecting portion 53 has the wiring connected to the generating portion 41, the wiring connecting to the generating portion 41 and the connecting portion 53 can be integrated. Therefore, the board 50 having the connecting portion 53 and the wiring can be made more compact.

In addition, since the width of the connecting portion 53 is smaller than that of the first portion 51 and the second portion 52, the width of the substrate 50 including the first portion 51 and the second portion 52 sandwiching the connecting portion 53 is uniform. The area of the substrate 50 can be made smaller than that of the above case. Therefore, the substrate 50 can be made lighter.

In addition, since the substrate 50 is bent at two places, the detection area can be provided between the generation unit 41 and the detection unit 35 by bending the substrate 50. In addition, it is possible to clarify the bent portion.

Moreover, since the first portion 51 is smaller than the second portion 52, the weight of the first portion 51 can be further reduced. Therefore, requirements such as strength required for the connecting portion 53 can be made easier.

In addition, since the substrate 50 is bent in a shape (for example, a U-shape) in which the generation unit 41 and the detection unit 35 are opposed to each other, a part of the substrate 50 is formed on a plane (for example, a plane portion of the chassis 22) in the stator 20. (For example, the second portion 52 and the like) can be provided, which makes it easier to handle when the sensor 31 is provided in the housing.

In addition, since the substrate 50 is a flexible substrate, the components including the generation unit 41 and the detection unit 35 are mounted on the substrate 50 with the first portion 51 and the second portion 52 on the same plane, and then the generation unit 41 and the detection unit 35 are detected. A series of operations of processing the substrate 50 to provide a detection area between the substrate and the portion 35 can be performed more easily.

Further, since the board 50 includes the harness section 54 including the wirings connected to the generation unit 41 and the detection unit 35, the wirings connected to the configuration of the sensor 31 including the generation unit 41 and the detection unit 35 are arranged on the board 50. Can be provided. That is, by providing the harness portion 54, it is not necessary to individually draw the wiring from a component (circuit or the like) that requires wiring. Therefore, it is not necessary to separately handle the substrate 50 and the wiring, and the sensor 31 can be handled more easily.

Further, the detection unit 35 detects the change in the detection target caused by the change in the physical quantity in the detection area, and thus the target object causing the change in the physical quantity can be the target of sensing by the sensor 31.

Further, since the detection target is an electromagnetic wave (for example, the light emitted by the generation unit 41), it is possible to detect a change in the detection area due to a change in the electromagnetic wave.

Further, since the change of the physical quantity is caused by the rotation of the moving body (for example, the optical scale 11) existing in the detection area, the rotational motion of the moving body can be the target of sensing by the sensor 31.

In addition, one of the first portion 51 and the second portion 52 (for example, the second portion 52) is fixed to the first member (for example, the chassis 22), and the other surface (for example, the first portion 51) on the opposite side of the detection region. Is bonded to the second member (for example, the body 21). That is, in assembling the sensor 31, one may be fixed to the first member and the other surface of the other side of the detected region may be bonded to the second member, so that the assembly of the sensor 31 becomes easier.

In addition, since it is possible to bond the surface opposite to the other detection area and the second member only by providing a plate-shaped member (for example, the support substrate 65) having adhesiveness on both sides, the sensor 31 can be assembled more easily. It will be easier.

In addition, before assembling the housing (for example, the stator 20), a plate-shaped member (for example, the support substrate 65) is attached to the surface on the opposite side of the other detection area, whereby the plate-shaped member and the substrate 50 are integrated. Since the other surface and the second member can be adhered in this state, the assembly of the sensor becomes easier.

In addition, each of the four light receiving elements is arranged at a different position on a predetermined plane (for example, the surface 52A), and a distance (distance W from each of the four light receiving elements to one point (arrangement center S0) on the predetermined plane). ) Are all equal, and four line segments connecting one point and the centers of the light receiving areas of the four light receiving elements form right angles (θ1 to θ4) with each other and are normal to a predetermined plane passing through one point (for example, a straight line). Since L2) passes through the light emission point 41S of the generation unit 41, it is possible to equalize the distances of the four light receiving elements with respect to the light emitting element. Therefore, it is possible to reduce variations in output due to detection of light by the light receiving element. Thus, according to the present embodiment, the output of the light receiving element can be made more stable.

Further, since a supporting member for keeping the opposite surface (for example, the front surfaces 51A and 52A) flat on the back surface (for example, the back surfaces 51B and 52B) of the FPC is attached to the electronic component and the FPC provided on the FPC. It is possible to further reduce the stress on the connection part. Therefore, it is possible to further reduce defects related to the connection portion between the FPC and the electronic component provided on the FPC. Therefore, the reliability of the normal operation of the sensor 31 can be further increased. Further, since it is possible to reduce the stress on the connection portion, it is possible to reduce the difficulty of mounting the electronic component on the FPC, and to more easily provide the electronic component on the surface opposite to the supporting member. You can

Further, the package of the integrated circuit (for example, the IC circuit 60) provided on the back surface (for example, the back surface 52B) can be utilized as a support member for the electronic component provided on the opposite surface (for example, the front surface 52A). In addition, since the integrated circuit is also one of the circuits forming the sensor 31, it is possible to realize more efficient use of the substrate area by providing the circuits on both sides of the FPC. The area can be reduced more easily. Therefore, the miniaturization of the sensor 31 due to high integration of the circuit can be realized more easily.

Further, by providing a plate-like member having an insulating property formed in conformity with the shape of the first portion 51 like the support substrate 65, the entire surface (for example, the surface 51A) on which the electronic component is provided by the support member is provided. Can be supported positively.

Further, the surface of the first portion 51 on which the generation portion 41 is provided (for example, the front surface 51A) and the surface of the second portion 52 on which the detection portion 35 is provided (for example, the front surface 52A) are provided in parallel and face each other. The first axis LA and the second axis LB are parallel to each other, and the distance W1 between the first point (for example, the emission point 41S) and the first axis LA and the distance W2 between the second point (for example, the arrangement center S0) and the second axis LB. Are equal to each other, and the first point and the second point are on the same straight line (for example, the straight line L1) that intersects (or three-dimensionally intersects) at right angles to the first axis and the second axis in the substrate 50 before bending, The first point and the second point lie on the same straight line (for example, the straight line L2) orthogonal to the bent first portion 51 and second portion 52. For this reason, since the generation unit 41 and the detection unit 35 can face each other with higher accuracy, the output of the detection unit 35 can be more stable.

Further, by performing a reflection process on the surface (front surface 50A) of the substrate 50 on which the generation unit 41 and the detection unit 35 are provided, it is possible to reduce reflection of light emitted from the generation unit 41 by the substrate. Therefore, the output of the detection unit 35 due to the detection of the reflected light can be reduced, so that the output of the detection unit 35 can be more stable.

Further, by performing the antireflection treatment on the shaft 12, it is possible to reduce the reflection of the light emitted from the generation unit 41 by the shaft 12. Therefore, the output of the detection unit 35 due to the detection of the reflected light can be reduced, so that the output of the detection unit 35 can be more stable.

Further, since the sensor 31 functions as a rotary encoder, it is possible to detect an angular position such as a turning angle of a turning body connected to the sensor 31.

FIG. 31 is a diagram illustrating another arrangement example of the plurality of light receiving elements included in the detection unit 35. As shown in FIG. 31, in the detection unit 35, the first light receiving unit PD1 to the fourth light receiving unit PD4 each having the square polarization layers PP1 to PP4 have a square arrangement region 35A around the arrangement center S0. It may be arranged at the four corners of. Also in this case, the four light receiving elements are arranged at equal distances from the arrangement center S0, and the four line segments connecting the arrangement center S0 and the centers of the light receiving regions of the four light receiving elements form a right angle with each other. can do. The distance between the arrangement center S0 and each of the four light receiving elements is arbitrary, but by setting a shorter distance, light is emitted to each of the four light receiving elements in a state in which the light source light 71 of the generation unit 41 is less attenuated. It can be detected. Further, the four light receiving elements may be individually provided in the second portion 52, or the detection portion 35 as a package in which the positional relationship between the four light receiving elements and the arrangement center S0 is fixed in advance is provided in the second portion 52. It may be provided. By adopting such a package, it becomes easier to adjust the arrangement of the four light receiving elements.

The first portion 51 and the second portion 52 do not have to be parallel. The relationship between the first portion 51 and the second portion 52 is such that a detection area can be provided between the generation unit 41 and the detection unit 35, and a detection target generated by the generation unit 41 provided in the first portion 51. May be detected by the detection unit 35 provided in the second portion 52, and the detailed arrangement of the first portion 51 and the second portion 52 may be appropriately changed.

The relationship between the first portion 51 and the second portion 52 may be reversed. That is, the first portion 51 may be fixed to the first member, and the surface (back surface 52B) of the second portion 52 opposite to the other detected region may be bonded to the second member. However, in this case, for example, the shape of the second portion 52 becomes the same as the shape of the first portion 51 in the present embodiment, and the configuration of the substrate 50 and the circuit (for example, the component 61) provided on the substrate 50 is different from that of the housing (For example, the stator 20) is taken into consideration in consideration of interference with the configuration. Further, a cutout portion such as the cutout portion 51a for preventing the substrate 50 and the shaft 12 from coming into contact with each other is provided according to the range in which the shaft 12 extends. For example, when the shaft 12 extends so as to penetrate the optical scale 11 and is located at a position straddling both the first portion 51 and the second portion 52, the cutout portion is formed of the first portion 51 and the second portion 52. It is provided in both.

The connecting portion 53 does not have to include wiring. In this case, the connecting portion 53 supports, for example, the first portion 51 or the second portion 52 which is not fixed to the chassis 22. Further, it is not essential that the one is smaller than the other. The first portion 51 and the second portion 52 may have the same size, or the side supported by the connecting portion 53 may be large. In addition, the stator 20 and the like may have a support portion for supporting at least one of the connection portion 53 and the first portion 51 in the present embodiment. Further, a configuration (for example, an adhesive, a tape, a locking portion such as a protrusion, etc.) for fixing at least one of the connection portion 53 and the first portion 51 in the present embodiment may be provided on the support portion.

The substrate 50 is not limited to the flexible substrate. In the substrate of the present invention, a detection area can be provided between the generation unit 41 and the detection unit 35, and the detection target generated by the generation unit 41 provided in the first portion 51 is provided in the second portion 52. Any substrate can be used as long as it can be detected by the detector 35 and the first portion 51 and the second portion 52 are integrated. For example, a substrate that is made of a material whose processing portion can be bent by a treatment such as heating is adopted, and the portion between the first portion and the second portion (for example, a connection portion) is subjected to the treatment and then bent. The first portion and the second portion may be opposed to each other. Alternatively, a substrate having both a portion that is difficult to deform and a portion that is easily deformed, such as a rigid flexible substrate, may be adopted. In this case, by using the portion that is difficult to deform as the first portion and the second portion and the portion that is easily deformed as the portion between the first portion and the second portion (for example, the connecting portion), The second portion can be opposed.

The harness portion 54 may be omitted as appropriate. Further, the number of extending portions functioning as a harness portion may be two or more. Further, the extending direction of the extending portion functioning as the harness portion is arbitrary, and is not particularly limited by the positional relationship with the other configuration of the board 50 such as the connecting portion 53.

Regarding the relative movement between the operating body and the substrate 50, either one may move so as to approach the other, or both may move so as to approach each other. Specifically, for example, the proximity of the first member (chassis 22) and the second member (body 21) in the assembly of the sensor 31 described above is such that when one (for example, the body 21) is fixed, the other ( For example, the chassis 22) may move, the relationship between fixed and moving may be reversed, or both may move.

The specific pattern of the signal track T1 of the optical scale 11 and the pattern of the polarizing layers PP1 to PP4 provided in the detection unit 35 can be changed as appropriate. Such a pattern is determined in consideration of the relationship between the pattern (for example, the optical scale 11) that is provided in the detection area and generates polarized light, and the pattern (for example, the polarizing layer) that allows light to pass therethrough at the time of detection.

The configuration provided in the detected region is not limited to the optical scale 11 that produces polarized light. For example, instead of the optical scale 11, a plate-shaped member provided with a hole or a transmissive portion that selectively transmits or transmits light according to the rotation angle of the rotor 10 may be provided. In this case, the change in the rotation angle of the rotor 10 appears as a change in the position or timing at which light is detected by the detection unit. The detection unit may not include the polarization layers PP1 to PP4. By outputting a signal indicating the position where light is detected from the sensor, the angular position of the rotating machine connected to the shaft 12 can be detected. Further, in this case, the detection unit does not need to have four light receiving elements. For example, it may be one light receiving element or a plurality of light receiving elements. When the number of light receiving elements is one, the distance between the center of the detection area (the center of the light receiving area) to be detected by one light receiving element and the second axis LB is regarded as the above distance W2, and then the distance W2 It is desirable to make W1 equal. Further, when there are a plurality of light receiving elements, the distance between the center of arrangement of the plurality of detection areas of the detection unit formed by the plurality of light receiving elements and the second axis LB is regarded as the above distance W2, and then the distance W2 is obtained. And the distance W1 are preferably equal.

The light emitting element included in the generation unit 41 that emits light is not limited to the light emitting diode. Further, the light emitting element may be a point light source or a surface light source. When the light emitting element is a surface light source, the center of the light generation area in the surface light source is set as a point corresponding to the light emission point 41S in the above embodiment, and the light emission surface of the light emitting element passes through the center of the light emission surface. A straight line can be defined along the direction in which the element and the light receiving element face each other. The straight line thus defined can be regarded as a straight line equivalent to the straight line L2 shown in FIG. 13, and the arrangement of each of the four light receiving elements can be determined in the same manner as in the above embodiment. That is, each of the four light receiving elements is arranged equidistant from the straight line at different positions on a predetermined plane orthogonal to the straight line, and the intersection of the straight line and the predetermined plane and the four light receiving elements are arranged. The arrangement of each of the four light receiving elements can be determined such that the four line segments connecting the centers of the respective light receiving regions form a right angle with each other. Further, the center of the emission surface 41T may be adopted as a point in place of the emission point 41S of the light.

Further, in the above-described embodiment, for both the first portion 51 and the second portion 52, a component (IC circuit 60 and support that functions as a support member that keeps the surfaces (front surfaces 51A, 52A) on which electronic components are provided flat. Although the substrate 65) is attached, it is not always necessary to provide both. It can be appropriately changed according to the arrangement of components provided in the FPC used as the substrate 50 of the present invention, and only one of the first portion 51 and the second portion 52 may be used. Moreover, you may provide a supporting member in the connection part 53 grade.

Further, the electromagnetic wave as the detection target is not limited to the light from the light emitting diode or the laser light. The electromagnetic waves to be detected may be invisible light such as infrared rays or ultraviolet rays, X-rays, or the like. Further, the detection target may be a magnetic force. In this case, the generation unit generates a magnetic field due to the magnetic force. The detection unit performs sensing by detecting a change in magnetic force caused by a change in physical quantity in the detection area (for example, passage of an object). Since the detection target is a magnetic force, it is possible to detect a change in the detection area due to a change in the magnetic force. In addition to electromagnetic waves and magnetic forces, the detection target may be sound waves including ultrasonic waves, ions such as plasma, cathode rays (electron rays), and the like. The detection target may be any object that changes due to a change in the physical quantity of the configuration provided in the detection area.

The change in the physical quantity may be caused by the linear movement of the linear moving body existing in the detection area. In this case, the linear motion of the linear motion body can be the target of sensing by the sensor. The sensor can also function as a linear encoder. Specifically, the linear encoder is configured such that the detection unit detects a change in the detection target caused by a configuration (for example, a scale or the like) that directly moves in the detection area relative to the first portion 51 and the second portion 52. The sensor functioning as performs sensing for the linear motion of the configuration. Therefore, according to the present invention, it is possible to detect the presence/absence of motion of the linear motion body connected to the encoder and the motion position. When the operating body is the rotating body (the optical scale 11 attached to the end of the shaft 12) as in the above-described embodiment, the portion near the shaft 12 does not enter the region (detected region). It is a part of the moving body that enters the area. On the other hand, when the moving body is a linear moving body, it goes without saying that at least a part of the moving body enters the region. Further, depending on the range of movement that can occur in the linear motion body, the entire motion body may enter the area (for example, pass through the inside and outside of the area). As described above, the operating body may be a member that operates at least partially in the region between the generating unit and the detecting unit.

The sensor 31 in the above-described embodiment has two bearings 26a and 26b, but this is an example of a specific form of the sensor and is not limited to this. The number of bearings that the sensor has is arbitrary. Further, the spacer 29 can be omitted. Further, the relationship between the diameter of the adhesive portion 12a of the shaft 12 and the diameters of the extending portions 12b and 12c is merely an example, and the present invention is not limited to this, and can be appropriately changed.

Three grooves are provided in each of the inner peripheral surface of the bearing hole 21d and the outer peripheral surface of the adhesive portion 12a of the shaft 12 in the above-described embodiment, but this is an example and the present invention is not limited to this. The number and arrangement of the grooves can be changed as appropriate. The adhesive may be applied to the inner peripheral surface of the bearing and the inner peripheral surface of the bearing hole. Further, the groove may be formed on the inner peripheral surface or the outer peripheral surface of the bearing.

Further, other actions and effects which are brought about by the modes described in the embodiments of the present invention including the modified examples are obvious from the description of the present specification, or can be appropriately conceived by those skilled in the art, according to the present invention. It is understood that it will be brought.

2 optical encoder 3 arithmetic unit 5 control unit 10 rotor 11 optical scale 12 shaft 20 stator 21 body 21d bearing hole 22 chassis 23 cover 31 sensor 35 detection unit 41 generation unit 50 substrate 51 first portion 52 second portion 53 connection portion 54 Harnesses 55a, 55b Bent 60 IC circuit 65 Support boards 80-85 Ground patterns 91a, 91b, 93a, 93b Adhesive reservoir grooves 92, 94 Machining escape grooves

Claims (3)

A sensor for detecting displacement of a rotation angle of the shaft due to rotation or rotation of the shaft,
Two bearings that support the shaft,
A housing having a bearing hole in which the bearing is fixed,
The bearing hole is provided so that a spacer disposed between the two bearings and the two bearings can enter from one side of the housing,
Three grooves are formed on the inner peripheral surface of the bearing hole,
One of the three grooves of the bearing hole is located along the outer peripheral edge of the bottom portion of the bearing hole, which is located at the deepest portion in the entrance direction of the bearing with respect to the bearing hole and is in contact with one of the two bearings. And the other two are provided at an intermediate position in the approach direction of each of the two bearings arranged in the bearing hole,
The one of the three grooves of the bearing hole is surrounded by the bottom portion having a diameter smaller than the outer diameter of the bearing, the inner peripheral surface of the bearing hole, and one of the two bearings,
The shaft and the inner peripheral surface of the bearing, the outer peripheral surface of the bearing and the inner peripheral surface of the bearing hole of the housing are fixed with an adhesive ,
Three grooves are formed on the outer peripheral surface of the small diameter portion of the shaft that enters the inner hole of the inner ring of the bearing,
One of the three grooves of the shaft extends to the one side of the housing more than the other of the small diameter portion and the two bearings fixed to the bearing hole, and is larger than the inner diameter of the inner ring. A sensor that is surrounded by the diameter portion and the other inner peripheral surface of the two bearings, and the other two are provided at the intermediate position of each of the two bearings . A generating unit that generates a predetermined detection target,
A detection unit that detects the detection target generated by the generation unit,
A substrate on which the generator and the detector are provided,
A member that rotates or rotates in a detection region between the generation unit and the detection unit to affect the detection target,
The housing houses the board and the member,
One end side of the shaft extends into the housing,
Wherein one end side sensor according to claim 1, wherein the member is provided. The sensor according to claim 2 , wherein the substrate has a first portion provided with the generation unit and a second portion provided with the detection unit, which are integrated.

Images