JP2012208346A - Electrooptical device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrooptical device capable of cooling the device while suppressing a display defect, and to provide an electronic apparatus.SOLUTION: An electrooptical device includes an electrooptical panel 100 formed by an electrooptical substance 50 sandwiched between a first substrate 10 and a second substrate 20; a dustproof member 30 disposed on the first substrate 10 on a side opposite to the electrooptical substance 50; and a heat transfer member 61 disposed on the dustproof member 30 on a side opposite to the first substrate 10 and having thermal conductivity higher than that of the dustproof member 30. At least a part of the heat transfer member 61 is exposed outside.

Description

  The present invention relates to an electro-optical device and an electronic apparatus.

  The electro-optical device includes an electro-optical panel (for example, a liquid crystal panel) configured by sandwiching an electro-optical material (for example, liquid crystal) between a pair of substrates, and a mounting frame for mounting the electro-optical panel. Electro-optical devices are known. In such an electro-optical device, there is a technique of providing a dust-proof member on the exposed surface of the substrate for the purpose of preventing adhesion of dust or the like to the display area (exposed surface of the substrate) of the electro-optical device.

  By the way, when applying such an electro-optical device to an application in which a large amount of light such as a projector light valve is irradiated, the entire substrate is heated by the irradiated light, and the electro-optical material is deteriorated. Display defects such as a decrease in contrast ratio may occur. In addition, the deterioration of the electro-optical material is promoted as the heating is increased, and the life of the apparatus is shortened.

  For example, in the electro-optical device disclosed in Patent Document 1, the electro-optical material is cooled by providing a heat dissipation layer on at least one inner surface side of the pair of substrates. Yes.

JP 2003-248213 A

  In the electro-optical device of Patent Document 1, since the heat dissipation layer is in contact with the electro-optical material, heat may be diffused into the electro-optical material, which may cause display defects.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an electro-optical device and an electronic apparatus capable of cooling the device while suppressing display defects.

  In order to solve the above problems, an electro-optical device according to the present invention includes an electro-optical panel in which an electro-optical material is sandwiched between a first substrate and a second substrate, and the electro-optical material of the first substrate. A dust-proof member disposed on the opposite side to the side, and a heat-transfer member having a higher thermal conductivity than the dust-proof member, disposed on a portion of the dust-proof member opposite to the first substrate side. And at least a part of the heat transfer member is exposed to the outside.

  The electro-optical device of the present invention is disposed on an opposite side of the electro-optical material side of the first substrate from an electro-optical panel having an electro-optical material sandwiched between a first substrate and a second substrate. A dust-proof member, and a heat transfer member having a higher thermal conductivity than the first substrate, disposed on a portion of the first substrate on the dust-proof member side, wherein the first substrate has a plan view. The size is larger than the dust-proof member, and at least a part of the heat transfer member is exposed from the dust-proof member in a plan view.

  The electro-optical device of the present invention is disposed on an opposite side of the electro-optical material side of the first substrate from an electro-optical panel having an electro-optical material sandwiched between a first substrate and a second substrate. A dust-preventing member, and a heat transfer member having a higher thermal conductivity than the dust-preventing member, which is disposed on the first substrate side of the dust-preventing member, and the dust-preventing member has a size in plan view Is larger than the first substrate, and at least a part of the heat transfer member is exposed from the first substrate in plan view.

  According to these configurations, the heat accumulated in the entire substrate is radiated by the heat transfer member exposed to the outside even when applied to an application in which a large amount of light is irradiated to the electro-optical device. be able to. For this reason, it is possible to suppress deterioration of the electro-optical material due to heat generated due to the irradiated light. In addition, since the heat transfer member is not formed on the inner surfaces of the pair of substrates, it is possible to prevent heat from diffusing into the electro-optical material. Therefore, it is possible to provide an electro-optical device that can cool the device while suppressing display defects.

  In this electro-optical device, it is preferable that the heat transfer member is made of a light transmissive material.

  According to this structure, a heat-transfer member can be arrange | positioned including not only a non-display area | region but a display area. For example, the heat transfer member can be disposed so as to cover the entire surface of the dust-proof member or the first substrate. Therefore, the heat accumulated on the entire substrate can be efficiently radiated.

  In this electro-optical device, the electro-optical panel includes a holding member that holds the electro-optical panel and the dust-proof member, and the exposed portion of the heat transfer member is in direct contact with the holding member. Alternatively, it may be connected to the holding member via a connection member having a higher thermal conductivity than the heat transfer member.

  According to this configuration, heat accumulated in the entire substrate can be radiated through the holding member having a larger surface area than the electro-optical panel and the dustproof member. Therefore, the heat accumulated on the entire substrate can be efficiently radiated.

  In this electro-optical device, the connection member may be formed of an elastic member, and the electro-optical panel and the dustproof member may be held by the holding member in a state where the connection member is elastically deformed.

  According to this configuration, the exposed portion of the heat transfer member and the holding member are firmly connected. Therefore, the heat accumulated on the entire substrate can be reliably radiated.

  In this electro-optical device, the holding member is formed with a protrusion that protrudes toward the heat transfer member and has a metal surface, and the electro-optical panel and the dust-proof member include the holding member and It is desirable that the resin member is filled in between and fixed to the holding member, and the protruding portion penetrates the resin member and is in contact with the heat transfer member.

  According to this configuration, even when the electro-optical panel and the dust-proof member are fixed to the holding member by the resin member, since the protruding portion penetrates the resin member, the exposed portion of the heat transfer member and the holding member The formed protrusion is firmly connected. Therefore, the heat accumulated on the entire substrate can be reliably radiated.

  According to another aspect of the invention, an electronic apparatus includes the electro-optical device.

  According to this electronic apparatus, since the above-described electro-optical device is provided, it is possible to provide a highly reliable electronic apparatus capable of displaying a high-quality image.

1 is a plan view of an electro-optical panel according to a first embodiment of the present invention. It is sectional drawing cut | disconnected along the II-II line | wire of FIG. 1 is an exploded perspective view of an electro-optical device according to a first embodiment of the invention. 2 is a perspective view of the electro-optical panel. FIG. 2 is a perspective view of the electro-optical device. FIG. 2 is a cross-sectional view of the electro-optical device. FIG. FIG. 6 is a cross-sectional view of an electro-optical device according to a second embodiment of the invention. FIG. 6 is a cross-sectional view of an electro-optical device according to a third embodiment of the invention. FIG. 6 is a cross-sectional view of an electro-optical device according to a fourth embodiment of the invention. It is the schematic of the projector which is an example of an electronic device.

  Embodiments of the present invention will be described below with reference to the drawings. This embodiment shows one aspect of the present invention, and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, an actual structure and a scale, a number, and the like in each structure are different.

(First embodiment)
FIG. 1 is a plan view of an electro-optical panel in the electro-optical device according to the first embodiment of the invention.
2 is a cross-sectional view taken along line II-II in FIG.

  In the following embodiments, the electro-optical device will be described by taking a light transmission type liquid crystal device as an example. Therefore, the electro-optical panel included in the electro-optical device will be described using a liquid crystal panel as an example. Of the pair of substrates disposed opposite to each other in the liquid crystal panel, one substrate (first substrate) is an element substrate (hereinafter referred to as a TFT array substrate), and the other substrate (second substrate) is a TFT. An explanation will be given by taking a counter substrate facing the array substrate as an example.

  As shown in FIGS. 1 and 2, the liquid crystal panel 100 is configured by interposing a liquid crystal 50, which is an electro-optical material, between a TFT array substrate 10 and a counter substrate 20 disposed to face the TFT array substrate 10. The The TFT array substrate 10 and the counter substrate 20 that are arranged to face each other are bonded together by a sealing material 52. As a substrate used for the TFT array substrate 10 and the counter substrate 20, for example, a glass substrate (thermal conductivity: about 1 W / m · K) or a quartz substrate (thermal conductivity: about 1.38 to 1.47 W / m · K). Etc. are used.

  A display area 10 h of the TFT array substrate 10 that constitutes the display area 40 of the liquid crystal panel 100 is formed in an area in contact with the liquid crystal 50 of the TFT array substrate 10. In the display region 10h on the surface 10f side, pixel electrodes 9a that constitute pixels and apply a driving voltage to the liquid crystal 50 together with the counter electrode 21 are arranged in a matrix.

  A counter electrode 21 that applies a driving voltage to the liquid crystal 50 together with the pixel electrode 9 a is provided in a region in contact with the liquid crystal 50 on the surface 20 f side of the counter substrate 20. In the region facing the display region 10 h of the counter electrode 21, the display region 20 h of the counter substrate 20 constituting the display region 40 of the liquid crystal panel 100 is configured.

  On the pixel electrode 9a of the TFT array substrate 10, an alignment film 16 subjected to a rubbing process is provided. An alignment film 26 that has been subjected to a rubbing process is also provided on the counter electrode 21 formed over the entire surface of the counter substrate 20. Each alignment film 16, 26 is made of a transparent organic film such as a polyimide film, for example.

  In the display area 10h of the TFT array substrate 10, a plurality of scanning lines (not shown) and a plurality of data lines (not shown) are wired so as to intersect each other. The pixel electrodes 9a are arranged in a matrix in the area partitioned by the scanning lines and the data lines. A thin film transistor (TFT) (not shown) is provided corresponding to each intersection of the scanning line and the data line. A pixel electrode 9a is connected to each TFT.

  The TFT is turned on by the ON signal of the scanning line, whereby the image signal supplied to the data line is supplied to the pixel electrode 9a. A voltage between the pixel electrode 9 a and the counter electrode 21 provided on the counter substrate 20 is applied to the liquid crystal 50.

  The counter substrate 20 is provided with a light shielding film 53 as a frame that defines the display area 40 of the liquid crystal panel 100.

  The liquid crystal 50 is sealed in a space between the TFT array substrate 10 and the counter substrate 20. The liquid crystal 50 is injected by a known liquid crystal injection method. In this case, the sealing material 52 is applied in a state where a part of one side of the sealing material 52 is missing.

  The portion where the sealing material 52 is missing constitutes a liquid crystal injection port 108 that is a notch for injecting the liquid crystal 50 into a region surrounded by the sealing material 52. The liquid crystal injection port 108 is sealed with a sealing material 109 after the liquid crystal is injected.

  An external connection terminal 102 for connecting the data line driving circuit 101 and an external circuit is provided along one side of the TFT array substrate 10 in a region outside the sealing material 52. The data line driving circuit 101 is a driver that drives an image signal by supplying an image signal to a data line (not shown) of the TFT array substrate 10 at a predetermined timing. Note that the external connection terminal 102 may be provided on the counter substrate 20.

  One end of a flexible printed circuit (hereinafter referred to as FPC) 112 that electrically connects the liquid crystal panel 100 to an electronic device such as a projector is connected to the external connection terminal 102. By connecting the other end of the FPC 112 to an electronic device such as a projector, the liquid crystal panel 100 and the electronic device are electrically connected.

  Scanning line drive circuits 103 and 104 are provided along two sides adjacent to one side of the TFT array substrate 10 provided with the external connection terminals 102. The scanning line driving circuits 103 and 104 are drivers that drive the gate electrodes by supplying scanning signals to scanning lines and gate electrodes (not shown) of the TFT array substrate 10 at a predetermined timing. The scanning line driving circuits 103 and 104 are formed on the TFT array substrate 10 at a position facing the light shielding film 53 inside the sealing material 52.

  On the TFT array substrate 10, the wiring 105 connecting the data line driving circuit 101, the scanning line driving circuits 103 and 104, the external connection terminal 102, and the vertical conduction terminal 107 faces the three sides of the light shielding film 53. Is provided.

  The vertical conduction terminals 107 are formed on the four TFT array substrates 10 at the corners of the sealing material 52. A vertical conduction member 106 having a lower end in contact with the vertical conduction terminal 107 and an upper end in contact with the counter electrode 21 is provided between the TFT array substrate 10 and the counter substrate 20. Electrical conduction is established between the TFT array substrate 10 and the counter substrate 20 by the vertical conduction member 106.

  Further, the back surface 10r of the TFT array substrate 10 constituting the liquid crystal panel 100 has the same size as at least the display area 10h of the TFT array substrate 10 in a plan view (that is, in a state viewed in plan view from the TFT array substrate 10). Dust-proof glass 30 (dust-proof member, thermal conductivity: about 1 W / m · K) is attached.

  Similarly, dust-proof glass 31 (thermal conductivity: about 1 W / m · K) having the same size as that of the counter substrate 20 is attached to the back surface 20r of the counter substrate 20 constituting the liquid crystal panel 100. Has been. The dustproof glasses 30 and 31 prevent dust and the like from adhering to the display areas 10h and 20h of the back surfaces 10r and 20r of the TFT array substrate 10 and the counter substrate 20, respectively.

  A heat transfer member 61 having a thermal conductivity higher than that of the dustproof glass 30 is formed on a part of the dustproof glass 30 opposite to the TFT array substrate 10 side. The surface of the heat transfer member 61 (the surface opposite to the dust-proof glass 30 side) is exposed to the outside.

  A heat transfer member 62 having a thermal conductivity higher than that of the TFT array substrate 10 is formed on a portion of the TFT array substrate 10 opposite to the liquid crystal 50 side. The side end surface of the heat transfer member 62 is exposed to the outside.

  A heat transfer member 63 having a higher thermal conductivity than the dustproof glass 30 is formed on the dustproof glass 30 on the TFT array substrate 10 side. The side end surface of the heat transfer member 63 is exposed to the outside.

  A heat transfer member 71 having a thermal conductivity higher than that of the dustproof glass 31 is formed on a portion of the dustproof glass 31 opposite to the counter substrate 20 side. The surface of the heat transfer member 71 (the surface opposite to the dustproof glass 31 side) is exposed to the outside.

  A heat transfer member 72 having a thermal conductivity higher than that of the counter substrate 20 is formed on a portion of the counter substrate 20 opposite to the liquid crystal 50 side. The side end surface of the heat transfer member 72 is exposed to the outside.

  A heat transfer member 73 having a thermal conductivity higher than that of the dustproof glass 31 is formed on a part of the dustproof glass 31 on the counter substrate 20 side. The side end surface of the heat transfer member 73 is exposed to the outside.

As a material for forming these heat transfer members 61, 62, 63, 71, 72, 73, for example, ITO (indium tin oxide, thermal conductivity: about 8.18 W / m · K), AL ₂ O ₃ (alumina, Thermal conductivity: about 21 W / m · K), quartz (thermal conductivity: about 9.3 W / m · K), sapphire (thermal conductivity: about 42 W / m · K), or the like can be used. In the present embodiment, ITO, which is a light transmissive material, is used as a material for forming the heat transfer members 61, 62, 63, 71, 72, 73.

  These heat transfer members 61, 62, 63, 71, 72, 73 are, for example, heat transfer wirings, and form a path for releasing heat accumulated in the entire substrate to the outside. As a material for forming the heat transfer members 61, 62, 63, 71, 72, 73, the heat transfer wiring including the display surface area 40 of the liquid crystal panel 100 is arranged by using ITO, which is a light transmissive material. be able to. The heat transfer wiring may be arranged in the non-display area.

  FIG. 3 is an exploded perspective view of the liquid crystal device 1. FIG. 4 is a perspective view of the liquid crystal panel 100. FIG. 5 is a perspective view of the liquid crystal device 1. FIG. 6 is a cross-sectional view of the liquid crystal device 1.

  As shown in FIG. 3, the liquid crystal device 1 includes a liquid crystal panel 100, dustproof glasses 30 and 31, heat transfer members 61, 62, 63, 71, 72, 73, a holding member 200, and a hook member 300. The main part is composed.

  The holding member 200 is a frame-shaped member that accommodates the liquid crystal panel 100 and the dustproof glasses 30 and 31 and has a substantially rectangular planar shape. The holding member 200 is formed with an accommodating portion 210 configured with a stepped hole in which the liquid crystal panel 100 is accommodated. The holding member 200 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). Note that at least the surface of the holding member 200 may be made of metal.

  The accommodating part 210 is formed with an opening 201 through which the display area 40 of the liquid crystal panel 100 is exposed when the liquid crystal panel 100 is accommodated in the accommodating part 210. The opening 201 is formed in the same size as the display area 40 in a plan view.

  In the accommodating part 210 of the holding member 200, the liquid crystal panel 100 is accommodated, for example, from the counter substrate 20 side. The accommodating part 210 includes a first holding part 220.

  The first holding unit 220 is formed to be slightly larger than the counter substrate 20 in a plan view. The first holding part 220 is formed to have substantially the same depth as the five thicknesses of the counter substrate 20, the dustproof glass 31, the heat transfer member 71, the heat transfer member 72, and the heat transfer member 73. The first holding part 220 is formed having a bottom part 202 and a side wall 203.

  When the liquid crystal panel 100 is accommodated in the accommodating portion 210, the bottom 202 has a portion other than the display area 40 on the back surface 31 r of the dust-proof glass 31 via an adhesive (resin member) 80 such as a thermosetting resin. Placed.

  The bottom portion 202 is formed with a protrusion 90 that protrudes toward the heat transfer member 71. The protrusion 90 is in contact with the heat transfer member 71 through the adhesive 80. The protrusion 90 serves as a path for guiding heat generated in the entire substrate when light enters the liquid crystal device 1 from the heat transfer member 71 to the holding member 200. The protrusion 90 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). In addition, the protrusion part 90 should just be the surface comprised with the metal at least.

  The storage unit 210 includes a second holding unit 230 that is larger than the first holding unit 220 in a plan view. The second holding unit 230 is formed to be slightly larger than the TFT array substrate 10 in a plan view. The second holding part 230 is formed to a depth slightly larger than the thickness of the five elements of the TFT array substrate 10, the dustproof glass 30, the heat transfer member 61, the heat transfer member 62, and the heat transfer member 63 (see FIG. 6). The second holding part 230 is formed to have a bottom part 204 and a side wall 205.

  When the liquid crystal panel 100 is accommodated in the accommodating portion 210, a part of the TFT array substrate 10 is placed on the bottom portion 204 via an adhesive.

  Further, a locking projection 250 is formed on each of the opposing sides 200 i and 200 t of the holding member 200. A locking hole 310 h of a locking member 310 formed in the hook member 300 is locked to the locking projection 250.

  The hook member 300 is formed from a frame-like thin plate member having a substantially rectangular planar shape. The hook member 300 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). Note that at least the surface of the hook member 300 may be made of metal.

  A locking member 310 having a locking hole 310 h is formed on each of the opposing sides 300 i and 300 t of the hook member 300. The locking member 310 is a portion that is locked to the locking projection 250 of the holding member 200 after the hook member 300 is fitted to the holding member 200 (see FIG. 5).

  In the approximate center of the hook member 300, an opening 320 having a smaller size in plan view than the dustproof glass 30 is formed. The hook member 300 is a member for pressing the dust-proof glass 30 toward the liquid crystal panel 100.

  A protrusion 91 that protrudes toward the heat transfer member 61 is formed around the opening 320 of the hook member 300. The protrusion 91 is in direct contact with the heat transfer member 61. The protrusion 91 serves as a path for guiding heat generated in the entire substrate when light enters the liquid crystal device 1 from the heat transfer member 61 to the hook member 300. The protruding portion 91 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). In addition, the protrusion part 91 should just be the surface comprised by the metal at least.

Next, a manufacturing method of the liquid crystal device configured as described above will be described.
First, as shown in FIG. 3, for example, a thermosetting adhesive 80 is applied to the housing portion 210 of the holding member 200. Thereafter, the liquid crystal panel 100 is inserted into the housing portion 210 from the back surface 20r side (heat transfer member 71 side) of the counter substrate 20.

  Since the projection 202 that protrudes toward the heat transfer member 71 is formed on the bottom 202 of the first holding unit 220, the projection 90 penetrates the adhesive 80 and is formed on the back surface 20 r of the counter substrate 20. It contacts the heat transfer member 71 formed.

  Next, the adhesive 80 is cured. Specifically, heat is applied to the holding member 200, between the liquid crystal panel 100 and the holding member 200, between the dust-proof glass 30, 31 and the holding member 200, and the heat transfer members 61, 62, 63, 71, Each thermosetting adhesive between 72 and 73 and the holding member 200 is cured.

  Next, the hook member 300 is fitted to the holding member 200 from above the dust-proof glass 30 (above the heat transfer member 61). Specifically, the locking holes 310h of the locking members 310 of the hook member 300 are locked to the locking protrusions 250 of the holding member 200, respectively.

  Since a protrusion 91 protruding toward the heat transfer member 61 is formed around the opening 320 of the hook member 300, the protrusion 91 is formed on the heat transfer member 61 formed on the back surface 10 r of the TFT array substrate 10. Contact.

  Through the above steps, the exposed portion of the heat transfer member 71 is directly connected to the protrusion 90 of the holding member 200. The exposed portion of the heat transfer member 61 is directly connected to the protrusion 91 of the hook member 300.

  As a result, as shown in FIG. 5, the liquid crystal device 1 according to the present embodiment is manufactured. Thereafter, the liquid crystal device 1 is electrically connected to an electronic device such as a projector by the FPC 112.

  According to the liquid crystal device 1 of the present embodiment, the heat transfer members 61, 62, 63, 71, exposed to the outside, even when applied to applications where a large amount of light is irradiated to the liquid crystal device 1. 72 and 73 can dissipate heat accumulated in the entire substrate. For this reason, it can suppress that the liquid crystal 50 deteriorates with the heat | fever which originates in the irradiated light. In addition, since the heat transfer member is not formed on the inner surfaces of the pair of substrates, heat can be prevented from diffusing into the liquid crystal. Therefore, it is possible to provide the liquid crystal device 1 that can cool the device while suppressing display defects.

  Moreover, according to this structure, since the heat-transfer members 61, 62, 63, 71, 72, and 73 are formed of a light-transmitting material, the heat-transfer members 61, 62, 63, 71, 72, and 73 are formed. Can be arranged including the display area 40 as well as the non-display area. For example, the heat transfer members 61, 62, 63, 71, 72, 73 can be disposed so as to cover the entire surfaces of the dustproof glasses 30, 31, the TFT array substrate 10, and the counter substrate 20. Therefore, the heat accumulated on the entire substrate can be efficiently radiated.

  Further, according to this configuration, the heat accumulated in the entire substrate can be dissipated through the holding member 200 having a larger surface area than the liquid crystal panel 100 and the dust-proof glasses 30 and 31. Therefore, the heat accumulated on the entire substrate can be efficiently radiated.

  Further, according to this configuration, even when the liquid crystal panel 100 and the dustproof glasses 30 and 31 are fixed to the holding member 200 by the resin member 80, the protrusion 90 penetrates the resin member 80. The exposed portion of the member 71 (heat transfer member 61) and the protrusion 90 formed on the holding member 200 (the protrusion 91 formed on the hook member 300) are firmly connected. Therefore, the heat accumulated on the entire substrate can be reliably radiated.

  In this embodiment, the heat transfer member 61 is formed on the opposite side of the dust-proof glass 30 from the TFT array substrate 10 side, and the heat transfer member 62 is arranged on the TFT array substrate 10 in the present embodiment. The heat transfer member 63 is formed on the portion of the dust-proof glass 30 on the TFT array substrate 10 side, and the heat transfer member 71 is on the side of the counter substrate 20 of the dust-proof glass 31. The heat transfer member 72 is formed on the portion of the counter substrate 20 opposite to the liquid crystal 50 side, and the heat transfer member 73 is formed on the portion of the dust-proof glass 31 on the counter substrate 20 side. The three heat transfer members 61, 62, 63 are formed on the TFT array substrate 10 side of the liquid crystal device 1, and the three heat transfer members 71, 72, 73 are formed on the counter substrate 20 side. However, it is not limited to this. For example, only the heat transfer member 61 may be formed on the TFT array substrate 10 side, and only the heat transfer member 71 may be formed on the counter substrate 20 side. That is, it is only necessary that the heat transfer member is arranged at least in a portion excluding the space between the TFT array substrate 10 and the counter substrate 20 (at least one inner surface side of the pair of substrates).

  In this embodiment, the holding member 200 is formed with the protrusion 90 that contacts the heat transfer member 71, and the hook member 300 is formed with the protrusion 91 that contacts the heat transfer member 61. Absent. For example, a bump (for example, a gold bump, a structure in which an inner resin is used as a core and the surface is covered with gold, and a thermal conductivity of gold (Au): about 320 W / m · K) is in contact with the heat transfer member 71 on the holding member 200. A bump (for example, a gold bump) that contacts the heat transfer member 61 may be formed on the hook member 300.

  In the present embodiment, the protrusion 90 formed on the holding member 200 and the heat transfer member 71 are in direct contact, and the protrusion 91 formed on the hook member 300 and the heat transfer member 61 are in direct contact. However, it is not limited to this. For example, the holding member 200 and the heat transfer member 71 may be in contact with each other using a brazing material (for example, thermal conductivity of silver brazing or silver (Ag): about 420 W / m · K), or the hook member 300. And the heat transfer member 61 may be in contact with each other.

  Moreover, in this embodiment, although the liquid crystal device 1 demonstrated and demonstrated as an example the structure containing the holding member 200 and the hook member 300 which hold | maintain the liquid crystal panel 100 and dustproof glass 30,31, it is not restricted to this. For example, the liquid crystal device may include a liquid crystal panel and dust-proof glass without including the holding member 200 and the hook member 300.

  Further, the liquid crystal panel is not limited to the above-described illustrated examples, and various modifications can be made without departing from the scope of the present invention. For example, the liquid crystal panel described above has been described by taking an active matrix type liquid crystal display module using an active element (active element) such as a TFT (thin film transistor) as an example. However, the present invention is not limited to this, and a TFD (thin film diode) is used. An active matrix type liquid crystal display module using an active element such as an active element may also be used.

  Furthermore, in the present embodiment, the electro-optical device has been described by taking a liquid crystal device as an example, but the present invention is not limited to this, and an electroluminescence device, in particular, an organic electroluminescence device, an inorganic electroluminescence device, etc. , Plasma display devices, field emission display (FED) devices, surface-conduction electron-emitter display (SED) devices, LED (light-emitting diode) display devices, electrophoretic display devices, devices using thin cathode ray tubes or liquid crystal shutters, etc. It can also be applied to various electro-optical devices.

  The electro-optical device may be a display device that forms elements on a semiconductor substrate, for example, LCOS (Liquid Crystal On Silicon). In LCOS, a single crystal silicon substrate is used as an element substrate, and a transistor is formed on a single crystal silicon substrate as a switching element used for a pixel or a peripheral circuit. In addition, a reflective pixel electrode is used for the pixel, and each element of the pixel is formed below the pixel electrode.

  In addition, the electro-optical device has a display device in which a pair of electrodes are formed on the same layer of a substrate on one side, for example, IPS (In-Plane Switching), or a pair of electrodes on one substrate via an insulating film. It may be a display device FFS (Fringe Field Switching) formed.

(Second Embodiment)
FIG. 7 is a cross-sectional view of the liquid crystal device 2 according to the second embodiment of the present invention.
As shown in FIG. 7, the liquid crystal device 2 of the present embodiment has a point that the size of the TFT array substrate 10A is larger than that of the dust-proof glass 30A in plan view, and the size of the counter substrate 20A is larger than that of the dust-proof glass 31A in plan view. It differs from the liquid crystal device 1 according to the first embodiment described above in that the exposed portions of the heat transfer members 62A, 63A, 72A, and 73A are connected to the holding member 200 via the connection member 92. . Since the other points are the same as the above-described configuration, the same elements as those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The liquid crystal device 2 includes a liquid crystal panel 100A, dustproof glasses 30A and 31A, heat transfer members 61A, 62A, 63A, 71A, 72A, and 73A, a holding member 200, and a hook member 300. .

  The TFT array substrate 10A has a larger size in plan view than the dustproof glass 30A. A heat transfer member 61A having a thermal conductivity higher than that of the dustproof glass 30A is formed on a portion of the dustproof glass 30A opposite to the TFT array substrate 10A. The surface of the heat transfer member 61A (the surface opposite to the dustproof glass 30A side) is exposed to the outside.

  A heat transfer member 62A having a higher thermal conductivity than that of the TFT array substrate 10A is formed on the opposite side of the TFT array substrate 10A from the liquid crystal 50 side. A side end portion of the heat transfer member 62A (a portion of the heat transfer member 62A formed in a portion formed larger than the dustproof glass 30A of the TFT array substrate 10A) is exposed from the dustproof glass 30A.

  A heat transfer member 63A having a higher thermal conductivity than that of the dustproof glass 30A is formed on the portion of the dustproof glass 30A on the TFT array substrate 10A side. The side end surface of the heat transfer member 63A is exposed to the outside.

  The counter substrate 20A is formed to have a larger size in plan view than the dust-proof glass 31A. A heat transfer member 71A having a thermal conductivity higher than that of the dustproof glass 31A is formed on a part of the dustproof glass 31A opposite to the side of the counter substrate 20A. The surface of the heat transfer member 71A (the surface opposite to the dust-proof glass 31A) is exposed to the outside.

  A heat transfer member 72A having a thermal conductivity higher than that of the counter substrate 20A is formed on a portion of the counter substrate 20A opposite to the liquid crystal 50 side. A side end portion of the heat transfer member 72A (a portion of the heat transfer member 72A formed in a portion formed larger than the dustproof glass 31A of the counter substrate 20A) is exposed from the dustproof glass 31A.

  A heat transfer member 73A having a higher thermal conductivity than the dust-proof glass 31A is formed on a part of the dust-proof glass 31A on the side of the counter substrate 20A. The side end surface of the heat transfer member 73A is exposed to the outside.

  The exposed portions of the heat transfer members 62A, 63A, 72A, and 73A are connected to the holding member 200 via the connection member 92 that has a higher thermal conductivity than the heat transfer members 62A, 63A, 72A, and 73A. The connection member 92 is made of a material such as solder (thermal conductivity: about 21 to 66 W / m · K), for example. As for the method of connecting the exposed portions of the heat transfer members 62A, 63A, 72A, 73A and the holding member 200, for example, a hole 200h is previously formed in the holding member 200, and solder is injected from the hole 200h to heat transfer member. There is a method of soldering the exposed portions of 62A, 63A, 72A, 73A and the holding member 200.

  According to the liquid crystal device 2 of the present embodiment, the heat accumulated on the entire substrate can be radiated through the holding member 200 having a surface area larger than that of the liquid crystal panel 100A and the dustproof glasses 30A and 31A. Therefore, the heat accumulated on the entire substrate can be efficiently radiated.

(Third embodiment)
FIG. 8 is a cross-sectional view of the liquid crystal device 3 according to the third embodiment of the present invention.
As shown in FIG. 8, the liquid crystal device 3 of the present embodiment has a point that the size of the dustproof glass 30B is larger than that of the TFT array substrate 10B in plan view, and the size of the dustproof glass 31B is larger than that of the counter substrate 20B in plan view. A large point, a point where the exposed portions of the heat transfer members 62B, 63B, 72B, 73B are connected to the holding member 200 via the connection member 92, and a connection member constituted by an elastic member instead of the protrusions 90, 91 93 is different from the liquid crystal device 1 according to the first embodiment described above in that 93 is provided. Since the other points are the same as the above-described configuration, the same elements as those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The liquid crystal device 3 includes a liquid crystal panel 100B, dustproof glasses 30B and 31B, heat transfer members 61B, 62B, 63B, 71B, 72B, and 73B, a holding member 200, and a hook member 300. .

  The dustproof glass 30B is formed to have a larger size in plan view than the TFT array substrate 10B. A heat transfer member 61B having a thermal conductivity higher than that of the dust-proof glass 30B is formed on a portion of the dust-proof glass 30B opposite to the TFT array substrate 10B. The surface of the heat transfer member 61B (the surface opposite to the dustproof glass 30B) is exposed to the outside.

  A heat transfer member 62B having a higher thermal conductivity than that of the TFT array substrate 10B is formed on the opposite side of the TFT array substrate 10B from the liquid crystal 50 side. The side end surface of the heat transfer member 62B is exposed to the outside.

  A heat transfer member 63B having a higher thermal conductivity than the dustproof glass 30B is formed on the portion of the dustproof glass 30B on the TFT array substrate 10B side. A side end portion of the heat transfer member 63B (a portion of the heat transfer member 63B formed in a portion of the dust-proof glass 30B formed larger than the TFT array substrate 10B) is exposed from the TFT array substrate 10B.

  The dustproof glass 31B is formed to have a larger size in plan view than the counter substrate 20B. A heat transfer member 71B having a thermal conductivity higher than that of the dustproof glass 31B is formed on a portion of the dustproof glass 31B opposite to the counter substrate 20B. The surface of the heat transfer member 71B (the surface opposite to the dustproof glass 31B) is exposed to the outside.

  A heat transfer member 72B having a thermal conductivity higher than that of the counter substrate 20B is formed on a portion of the counter substrate 20B opposite to the liquid crystal 50 side. The side end surface of the heat transfer member 72B is exposed to the outside.

  A heat transfer member 73B having a higher thermal conductivity than that of the dustproof glass 31B is formed on a portion of the dustproof glass 31B on the counter substrate 20B side. A side end portion of the heat transfer member 73B (a portion of the heat transfer member 73B formed in a portion formed larger than the counter substrate 20B of the dustproof glass 31B) is exposed from the counter substrate 20B.

  The exposed portion of the heat transfer member 61 </ b> B is connected to the hook member 300 via the connection member 93. The exposed part of the heat transfer member 71 </ b> B is connected to the holding member 200 via the connection member 93. The connection member 93 is an elastic member. For example, a U-shaped spring member can be used as the connection member 93. The liquid crystal panel 100B and the dustproof glasses 30B and 31B are held by the hook member 300 in a state where the connecting member 93 is elastically deformed.

  The exposed portions of the heat transfer members 62B, 63B, 72B, and 73B are connected to the holding member 200 via a connection member 92 that has a higher thermal conductivity than the heat transfer members 62B, 63B, 72B, and 73B. The connection member 92 is made of a material such as solder (thermal conductivity: about 21 to 66 W / m · K), for example. As for the method of connecting the exposed portions of the heat transfer members 62B, 63B, 72B, 73B and the holding member 200, for example, a hole 200h is previously formed in the holding member 200, and solder is injected from the hole 200h to heat transfer member. There is a method in which the exposed portions of 62B, 63B, 72B, and 73B and the holding member 200 are soldered.

  According to the liquid crystal device 3 of the present embodiment, the exposed portion of the heat transfer member 61B and the hook member 300 are firmly connected by the connecting member 93 formed of an elastic member, and the exposed portion of the heat transfer member 71B. The holding member 200 is firmly connected. Therefore, the heat accumulated on the entire substrate can be reliably radiated.

(Fourth embodiment)
FIG. 9 is a cross-sectional view of the liquid crystal device 4 according to the fourth embodiment of the present invention.
As shown in FIG. 9, the liquid crystal device 4 of the present embodiment has the above-described first configuration in that the exposed portions of the heat transfer members 61C, 62C, 63C, 71C, 72C, and 73C are directly connected to the holding member 200. This is different from the liquid crystal device 1 according to the embodiment. Since the other points are the same as the above-described configuration, the same elements as those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The liquid crystal device 4 includes a liquid crystal panel 100, dust-proof glasses 30, 31, heat transfer members 61C, 62C, 63C, 71C, 72C, 73C, a holding member 200, and a hook member 300. .

  A heat transfer member 61 </ b> C having a higher thermal conductivity than the dust-proof glass 30 is formed on the part of the dust-proof glass 30 opposite to the TFT array substrate 10. The surface of the heat transfer member 61C (the surface opposite to the dustproof glass 30 side) is exposed to the outside.

  A heat transfer member 62C having a thermal conductivity higher than that of the TFT array substrate 10 is formed on the opposite side of the TFT array substrate 10 from the liquid crystal 50 side.

  A heat transfer member 63 </ b> C having a higher thermal conductivity than that of the dust-proof glass 30 is formed on the portion of the dust-proof glass 30 on the TFT array substrate 10 side.

  The heat transfer members 61 </ b> C, 62 </ b> C, and 63 </ b> C are formed so as to be larger in plan view than the TFT array substrate 10. The portions of the heat transfer members 61C, 62C, and 63C that are formed larger than the TFT array substrate 10 are directly connected to the holding member 200.

  A heat transfer member 71 </ b> C having a higher thermal conductivity than that of the dust-proof glass 31 is formed on the part of the dust-proof glass 31 opposite to the side of the counter substrate 20. The surface of the heat transfer member 71C (the surface opposite to the dustproof glass 31) is exposed to the outside.

  A heat transfer member 72 </ b> C having a higher thermal conductivity than that of the counter substrate 20 is formed on a portion of the counter substrate 20 opposite to the liquid crystal 50 side.

  A heat transfer member 73 </ b> C having a higher thermal conductivity than that of the dustproof glass 31 is formed on a part of the dustproof glass 31 on the counter substrate 20 side.

  The heat transfer members 71 </ b> C, 72 </ b> C, and 73 </ b> C are formed so as to be larger in plan view than the counter substrate 20. The portions of the heat transfer members 71C, 72C, and 73C that are formed larger than the counter substrate 20 are in direct contact with the holding member 200.

  According to the liquid crystal device 4 of the present embodiment, heat accumulated in the entire substrate can be dissipated through the holding member 200 having a larger surface area than the liquid crystal panel 100 and the dust-proof glasses 30 and 31. Therefore, the heat accumulated on the entire substrate can be efficiently radiated.

(Electronics)
FIG. 10 is a schematic configuration diagram of a projector 1000 that is an example of an electronic apparatus. The projector 1000 is configured as a projector using three liquid crystal modules including the liquid crystal device 1 as RGB light valves 1100R, 1100G, and 1100B, respectively.

  In this projector 1000, when light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, light components corresponding to the three primary colors R, G, and B are emitted by three mirrors 1106 and two dichroic mirrors 1108. The light is separated into R, G, and B (light separating means) and led to the corresponding light valves 1100R, 1100G, and 1100B (liquid crystal device 1, liquid crystal light valve), respectively. At this time, since the optical component B has a long optical path, the light component B is guided through a relay lens system 1121 including an incident lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss.

  Then, the light components R, G, and B corresponding to the three primary colors modulated by the light valves 1100R, 1100G, and 1100B are incident on the dichroic prism 1112 (light combining means) from three directions and are combined again, and then the projection lens. A color image is projected on the screen 1120 via 1114.

  According to the projector 1000, since the liquid crystal device 1 of the present invention is used as the light valves 1100R, 1100G, and 1100B, it is possible to provide a highly reliable projector 1000 that can display a high-quality image. .

  In addition to the projector 1000, the electronic device includes a personal computer (PC) compatible with multimedia, an engineering workstation (EWS), a pager, a mobile phone, a word processor, a TV, a viewfinder type, or a monitor direct view type. Video tape recorders, electronic notebooks, electronic desk calculators, car navigation devices, POS terminals, touch panels, and the like.

1, 2, 3, 4 ... Liquid crystal device (electro-optical device), 10, 10A, 10B ... TFT array substrate (first substrate), 20, 20A, 20B ... Counter substrate (second substrate), 30, 30A, 30B , 31, 31A, 31B ... dustproof glass (dustproof member), 50 ... liquid crystal (electro-optic material), 61, 62, 63, 61A, 62A, 63A, 61B, 62B, 63B, 61C, 62C, 63C, 71, 72 73, 71A, 72A, 73A, 71B, 72B, 73B, 71C, 72C, 73C ... Heat transfer member, 80 ... Adhesive (resin member), 90, 91 ... Projection, 92, 93 ... Connection member, 100 ... Liquid crystal panel (electro-optical panel), 200 ... holding member, 1000 ... projector (electronic device)

Claims (8)

An electro-optic panel comprising an electro-optic material sandwiched between a first substrate and a second substrate;
A dust-proof member disposed on a side opposite to the electro-optical material side of the first substrate;
A heat transfer member having a higher thermal conductivity than the dustproof member, disposed on a portion of the dustproof member opposite to the first substrate,
An electro-optical device, wherein at least a part of the heat transfer member is exposed to the outside. An electro-optic panel comprising an electro-optic material sandwiched between a first substrate and a second substrate;
A dust-proof member disposed on a side opposite to the electro-optical material side of the first substrate;
A heat transfer member disposed on a portion of the first substrate on the dust-proof member side and having a higher thermal conductivity than the first substrate;
The first substrate is formed to have a larger size in plan view than the dustproof member,
An electro-optical device, wherein at least a part of the heat transfer member is exposed from the dust-proof member in a plan view. An electro-optic panel comprising an electro-optic material sandwiched between a first substrate and a second substrate;
A dust-proof member disposed on a side opposite to the electro-optical material side of the first substrate;
A heat transfer member having a higher thermal conductivity than the dustproof member, disposed on the first substrate side of the dustproof member,
The dustproof member is formed larger in plan view than the first substrate,
An electro-optical device, wherein at least part of the heat transfer member is exposed from the first substrate in a plan view.   The electro-optical device according to claim 1, wherein the heat transfer member is made of a light transmissive material. A holding member that holds the electro-optical panel and the dust-proof member, and that has a surface made of metal,
The exposed portion of the heat transfer member is in direct contact with the holding member, or is connected to the holding member via a connection member having a higher thermal conductivity than the heat transfer member. The electro-optical device according to claim 1. The connecting member is made of an elastic member,
The electro-optical device according to claim 5, wherein the electro-optical panel and the dust-proof member are held by the holding member in a state where the connection member is elastically deformed. The holding member is formed with a protrusion that protrudes toward the heat transfer member and has a metal surface.
The electro-optical panel and the dustproof member are fixed to the holding member by being filled with a resin member between the holding member,
The electro-optical device according to claim 5, wherein the protruding portion penetrates the resin member and is in contact with the heat transfer member.   An electronic apparatus comprising the electro-optical device according to claim 1.

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