JP2012203202A - Electrooptical device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrooptical device capable of cooling the device while suppressing a display defect, and to provide an electronic apparatus.SOLUTION: An electrooptical device includes an electrooptical panel 100 formed by an electrooptical substance 50 sandwiched between a first substrate 10 and a second substrate 20; and a first parting member 61 disposed on the first substrate 10 on a side of the electrooptical substance 50, having thermal conductivity higher than that of the first substrate 10 and light-shielding an outer region of a display region. The first substrate 10 is formed to be larger in plan view than the second substrate 20. At least a part of the first parting member 61 is exposed from the second substrate 20 in plan view.

Description

  The present invention relates to an electro-optical device and an electronic apparatus.

  As an electro-optical device, an electro-optical panel (for example, a liquid crystal panel) configured by sandwiching an electro-optical material (for example, a liquid crystal) between a pair of substrates, and light incident on a display region for displaying an image are limited (display) 2. Description of the Related Art An electro-optical device that includes a parting member (which defines a region) is known. For example, in the electro-optical device disclosed in Patent Document 1, the parting member has an annular shape in plan view that partitions the outer region of the display region, and is arranged near the electro-optical material.

JP 2010-256655 A

  When the electro-optical device of Patent Document 1 is applied to an application in which a large amount of light is irradiated, such as a light bulb of a projector, for example, the parting member is heated by the irradiated light, and the heat generated by the parting member is electrically May be transmitted to optical materials. When heat is transmitted to the electro-optic material, the electro-optic material may be deteriorated and display defects such as a reduction in contrast ratio may occur.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an electro-optical device and an electronic apparatus capable of cooling the device while suppressing display defects.

  In order to solve the above problems, an electro-optical device according to the present invention includes an electro-optical panel in which an electro-optical material is sandwiched between a first substrate and a second substrate, and the electro-optical material of the first substrate. A first parting member disposed on a side and having a thermal conductivity higher than that of the first substrate and shielding an outer region of the display region in a plan view, wherein the first substrate has a size in the plan view. It is formed larger than the second substrate, and at least a part of the first parting member is exposed from the second substrate in a plan view.

  According to this configuration, even when applied to an application in which a large amount of light is applied to the electro-optical device, the heat accumulated in the first parting member is generated by the first parting member exposed to the outside. It is possible to dissipate heat away from the electro-optic material. For this reason, it is possible to suppress deterioration of the electro-optical material due to heat generated due to the irradiated light. Therefore, it is possible to provide an electro-optical device that can cool the device while suppressing display defects.

  In this electro-optical device, the first parting member includes an annular light-shielding portion that divides the outer region of the display region, and a heat transfer member that has a higher thermal conductivity than the light-shielding portion connected to the light-shielding portion. And at least a part of the heat transfer member may be exposed from the second substrate in plan view.

  According to this configuration, the heat accumulated in the light shielding portion can be radiated at a portion far from the electro-optic material by the heat transfer member exposed to the outside. For this reason, it is possible to suppress deterioration of the electro-optical material due to heat generated due to the irradiated light.

  The electro-optical device includes a dust-proof member disposed on a side opposite to the electro-optical material side of the first substrate, and a portion of the first substrate on the dust-proof member side is less than the first substrate. A second parting member having a high thermal conductivity and shielding the outer region of the display region is disposed, and at least a part of the second parting member is formed larger than the second substrate of the first substrate in plan view. It may be stretched to the part where it is made.

  According to this configuration, the heat accumulated in the second parting member is transmitted to a portion far from the electro-optic material. Therefore, the heat accumulated in the second parting member can be radiated away from the electro-optic material.

  In this electro-optical device, it is desirable that at least a part of the second parting member is exposed from the same plane as the side end surface of the first substrate.

  According to this configuration, the heat accumulated in the second parting member can be dissipated away from the electro-optical material by the second parting member exposed to the outside.

  The electro-optical device includes a holding member that holds the electro-optical panel and has a surface made of metal, and at least a part of the first parting member is in direct contact with the holding member, or Preferably, the holding member is connected via a first connecting member having a higher thermal conductivity than the first parting member.

  According to this configuration, the heat accumulated in the first parting member can be radiated through the holding member having a surface area larger than that of the electro-optical panel. For this reason, the heat accumulated in the first parting member can be efficiently radiated.

  In this electro-optical device, the first connecting member may be formed of an elastic member, and the electro-optical panel may be held by the holding member in a state where the first connecting member is elastically deformed.

  According to this configuration, the first parting member and the holding member are firmly connected. Therefore, the heat accumulated in the first parting member can be reliably radiated.

  In this electro-optical device, the holding member is formed with a protrusion that protrudes toward the first parting member and has a metal surface, and the electro-optical panel is a resin member between the holding member and the electro-optical panel. Is preferably fixed to the holding member, and the protruding portion penetrates the resin member and is in contact with the first parting member.

  According to this configuration, even when the electro-optical panel is fixed to the holding member by the resin member, the protruding portion penetrates the resin member, so that the first parting member and the protruding portion formed on the holding member are Connected securely. Therefore, the heat accumulated in the first parting member can be reliably radiated.

  The electro-optical device of the present invention is disposed on an opposite side of the electro-optical material side of the first substrate from an electro-optical panel having an electro-optical material sandwiched between a first substrate and a second substrate. A third parting member having a higher thermal conductivity than the first substrate and shielding a region outside the display region in plan view, wherein the first substrate has a size in plan view of the second substrate. And at least a part of the third parting member is extended to a portion of the first substrate that is larger than the second substrate in plan view.

  According to this configuration, even when applied to an application in which a large amount of light is applied to the electro-optical device, the heat accumulated in the third parting member is in a portion far from the electro-optical material. Communicated. For this reason, it is possible to suppress deterioration of the electro-optical material due to heat generated due to the irradiated light. Therefore, it is possible to provide an electro-optical device that can cool the device while suppressing display defects.

  In this electro-optical device, it is preferable that at least a part of the third parting member is exposed from the same plane as the side end surface of the first substrate.

  According to this configuration, the heat accumulated in the third parting member can be radiated away from the electro-optical material by the third parting member exposed to the outside.

  The electro-optical device includes a holding member that holds the electro-optical panel and whose surface is made of metal, and at least a part of the third parting member is in direct contact with the holding member, or It is preferable that the holding member is connected via a second connecting member having a higher thermal conductivity than the third parting member.

  According to this configuration, the heat accumulated in the third parting member can be radiated through the holding member having a larger surface area than the electro-optical panel. For this reason, the heat accumulated in the third parting member can be efficiently radiated.

  The electro-optical device includes a dust-proof member disposed on a side opposite to the electro-optical material side of the first substrate, and a portion of the dust-proof member opposite to the first substrate side includes the dust-proof member. A fourth parting member having a higher thermal conductivity than the dust-proof substrate and shielding the outer region of the display region is disposed, and at least a part of the fourth parting member is more than the second substrate of the first substrate in plan view. Also, it may be stretched up to a large part.

  According to this configuration, the heat accumulated in the fourth parting member is transmitted to a portion far from the electro-optic material. Therefore, the heat accumulated in the fourth parting member can be dissipated away from the electro-optic material.

  In this electro-optical device, it is desirable that at least a part of the fourth parting member is exposed from the same plane as the side end surface of the dustproof member.

  According to this configuration, the heat accumulated in the fourth parting member can be dissipated away from the electro-optical material by the fourth parting member exposed to the outside.

  According to another aspect of the invention, an electronic apparatus includes the electro-optical device.

  According to this electronic apparatus, since the above-described electro-optical device is provided, it is possible to provide a highly reliable electronic apparatus capable of displaying a high-quality image.

1 is a plan view of an electro-optical panel according to a first embodiment of the present invention. It is sectional drawing cut | disconnected along the AA line of FIG. 1 is an exploded perspective view of an electro-optical device according to a first embodiment of the invention. 2 is a perspective view of the electro-optical panel. FIG. 2 is a perspective view of the electro-optical device. FIG. 2 is a cross-sectional view of the electro-optical device. FIG. It is a top view of the electro-optical panel which concerns on 2nd Embodiment of this invention. It is sectional drawing cut | disconnected along the BB line of FIG. FIG. 6 is a cross-sectional view of an electro-optical device according to a third embodiment of the invention. FIG. 6 is a cross-sectional view of an electro-optical device according to a fourth embodiment of the invention. FIG. 10 is a cross-sectional view of an electro-optical device according to a fifth embodiment of the invention. It is the schematic of the projector which is an example of an electronic device.

  Embodiments of the present invention will be described below with reference to the drawings. This embodiment shows one aspect of the present invention, and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, an actual structure and a scale, a number, and the like in each structure are different.

(First embodiment)
FIG. 1 is a plan view of an electro-optical panel in the electro-optical device according to the first embodiment of the invention.
FIG. 2 is a cross-sectional view taken along line AA in FIG.

  In the following embodiments, the electro-optical device will be described by taking a light transmission type liquid crystal device as an example. Therefore, the electro-optical panel included in the electro-optical device will be described using a liquid crystal panel as an example. Of the pair of substrates disposed opposite to each other in the liquid crystal panel, one substrate (first substrate) is an element substrate (hereinafter referred to as a TFT array substrate), and the other substrate (second substrate) is a TFT. An explanation will be given by taking a counter substrate facing the array substrate as an example.

  As shown in FIGS. 1 and 2, the liquid crystal panel 100 is configured by interposing a liquid crystal 50, which is an electro-optical material, between a TFT array substrate 10 and a counter substrate 20 disposed to face the TFT array substrate 10. The The TFT array substrate 10 and the counter substrate 20 that are arranged to face each other are bonded together by a sealing material 52. As a substrate used for the TFT array substrate 10 and the counter substrate 20, for example, a glass substrate (thermal conductivity: about 1 W / m · K) or a quartz substrate (thermal conductivity: about 1.38 to 1.47 W / m · K). Etc. are used.

  A display area 10 h of the TFT array substrate 10 that constitutes the display area 40 of the liquid crystal panel 100 is formed in an area in contact with the liquid crystal 50 of the TFT array substrate 10. In the display region 10h on the surface 10f side, pixel electrodes 9a that constitute pixels and apply a driving voltage to the liquid crystal 50 together with the counter electrode 21 are arranged in a matrix.

  A counter electrode 21 that applies a driving voltage to the liquid crystal 50 together with the pixel electrode 9 a is provided in a region in contact with the liquid crystal 50 on the surface 20 f side of the counter substrate 20. In the region facing the display region 10 h of the counter electrode 21, the display region 20 h of the counter substrate 20 constituting the display region 40 of the liquid crystal panel 100 is configured.

  On the pixel electrode 9a of the TFT array substrate 10, an alignment film 16 subjected to a rubbing process is provided. An alignment film 26 that has been subjected to a rubbing process is also provided on the counter electrode 21 formed over the entire surface of the counter substrate 20. Each alignment film 16, 26 is made of a transparent organic film such as a polyimide film, for example.

  In the display area 10h of the TFT array substrate 10, a plurality of scanning lines (not shown) and a plurality of data lines (not shown) are wired so as to intersect each other. The pixel electrodes 9a are arranged in a matrix in the area partitioned by the scanning lines and the data lines. A thin film transistor (TFT) (not shown) is provided corresponding to each intersection of the scanning line and the data line. A pixel electrode 9a is connected to each TFT.

  The TFT is turned on by the ON signal of the scanning line, whereby the image signal supplied to the data line is supplied to the pixel electrode 9a. A voltage between the pixel electrode 9 a and the counter electrode 21 provided on the counter substrate 20 is applied to the liquid crystal 50.

  On the liquid crystal 50 side of the counter substrate 20, a parting member 63 that shields the peripheral area (outer area) of the display area 40 of the liquid crystal panel 100 is provided.

  The liquid crystal 50 is sealed in a space between the TFT array substrate 10 and the counter substrate 20. The liquid crystal 50 is injected by a known liquid crystal injection method. In this case, the sealing material 52 is applied in a state where a part of one side of the sealing material 52 is missing.

  The portion where the sealing material 52 is missing constitutes a liquid crystal injection port 108 that is a notch for injecting the liquid crystal 50 into a region surrounded by the sealing material 52. The liquid crystal injection port 108 is sealed with a sealing material 109 after the liquid crystal is injected.

  An external connection terminal 102 for connecting the data line driving circuit 101 and an external circuit is provided along one side of the TFT array substrate 10 in a region outside the sealing material 52. The data line driving circuit 101 is a driver that drives an image signal by supplying an image signal to a data line (not shown) of the TFT array substrate 10 at a predetermined timing. Note that the external connection terminal 102 may be provided on the counter substrate 20.

  One end of a flexible printed circuit (hereinafter referred to as FPC) 112 that electrically connects the liquid crystal panel 100 to an electronic device such as a projector is connected to the external connection terminal 102. By connecting the other end of the FPC 112 to an electronic device such as a projector, the liquid crystal panel 100 and the electronic device are electrically connected.

  Scanning line drive circuits 103 and 104 are provided along two sides adjacent to one side of the TFT array substrate 10 provided with the external connection terminals 102. The scanning line driving circuits 103 and 104 are drivers that drive the gate electrodes by supplying scanning signals to scanning lines and gate electrodes (not shown) of the TFT array substrate 10 at a predetermined timing. The scanning line driving circuits 103 and 104 are formed on the TFT array substrate 10 at a position facing the parting member 63 inside the sealing material 52.

  In addition, on the TFT array substrate 10, the wiring 105 connecting the data line driving circuit 101, the scanning line driving circuits 103 and 104, the external connection terminal 102, and the vertical conduction terminal 107 faces the three sides of the parting member 63. Is provided.

  The vertical conduction terminals 107 are formed on the four TFT array substrates 10 at the corners of the sealing material 52. A vertical conduction member 106 having a lower end in contact with the vertical conduction terminal 107 and an upper end in contact with the counter electrode 21 is provided between the TFT array substrate 10 and the counter substrate 20. Electrical conduction is established between the TFT array substrate 10 and the counter substrate 20 by the vertical conduction member 106.

  Further, the rear surface 10r of the TFT array substrate 10 constituting the liquid crystal panel 100 is provided with a dust-proof glass 30 (dust-proof member, thermal conductivity: approximately the same size as at least the display area 10h of the TFT array substrate 10 in a plan view). 1 W / m · K) is attached.

  Similarly, dust-proof glass 31 (thermal conductivity: about 1 W / m · K) having the same size as that of the counter substrate 20 is attached to the back surface 20r of the counter substrate 20 constituting the liquid crystal panel 100. Has been. The dustproof glasses 30 and 31 prevent dust and the like from adhering to the display areas 10h and 20h of the back surfaces 10r and 20r of the TFT array substrate 10 and the counter substrate 20, respectively.

  On the liquid crystal 50 side of the TFT array substrate 10, a parting member having a higher thermal conductivity than the TFT array substrate 10 and shielding the peripheral region of the display region 40 of the liquid crystal panel 100 (as a frame defining the display region 40). A (first parting member) 61 is provided. At least a part of the parting member 61 is exposed from the counter substrate 20 in plan view.

  A parting member (fourth parting member) 62 having a higher thermal conductivity than that of the dustproof glass 30 and shielding the peripheral area of the display region 40 is provided on the opposite side of the dustproof glass 30 to the TFT array substrate 10 side. Is formed. The surface of the parting member 62 (surface opposite to the dust-proof glass 30 side) is exposed to the outside. At least a part of the parting member 62 is extended to a portion formed larger than the counter substrate 20 of the TFT array substrate 10 in plan view (see FIG. 6). At least a part of the parting member 62 is exposed from the same plane as the side end face of the dust-proof glass 30.

  A parting member 64 that has a higher thermal conductivity than the dust-proof glass 31 and shields the peripheral area of the display area 40 is formed on the opposite side of the dust-proof glass 31 from the counter substrate 20 side. The surface of the parting member 64 (surface opposite to the dustproof glass 31 side) is exposed to the outside.

  As a material for forming the parting members 61, 62, 64, for example, a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K) can be used. Further, an ITO film (indium tin oxide, thermal conductivity: about 8.18 W / m · K) may be laminated on the Al film. The parting member 61 only needs to be formed of a member having a thermal conductivity higher than that of the TFT array substrate 10 and having a light shielding property. Moreover, the parting member 62 should just be comprised by the member which has heat conductivity higher than the dust-proof member 30, and has light-shielding property. Moreover, the parting member 64 should just be comprised by the member which has heat conductivity higher than the dust-proof member 31, and has light-shielding property. In the present embodiment, Al is used as a material for forming the parting members 61, 62, 64.

  FIG. 3 is an exploded perspective view of the liquid crystal device 1. FIG. 4 is a perspective view of the liquid crystal panel 100. FIG. 5 is a perspective view of the liquid crystal device 1. FIG. 6 is a cross-sectional view of the liquid crystal device 1.

  As shown in FIG. 3, the liquid crystal device 1 includes a liquid crystal panel 100, dustproof glasses 30 and 31, a holding member 200, and a hook member 300.

  The holding member 200 is a frame-shaped member that accommodates the liquid crystal panel 100 and the dustproof glasses 30 and 31 and has a substantially rectangular planar shape. The holding member 200 is formed with an accommodating portion 210 configured with a stepped hole in which the liquid crystal panel 100 is accommodated. The holding member 200 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). Note that at least the surface of the holding member 200 may be made of metal.

  The accommodating part 210 is formed with an opening 201 through which the display area 40 of the liquid crystal panel 100 is exposed when the liquid crystal panel 100 is accommodated in the accommodating part 210. The opening 201 is formed in the same size as the display area 40 in a plan view.

  In the accommodating part 210 of the holding member 200, the liquid crystal panel 100 is accommodated, for example, from the counter substrate 20 side. The accommodating part 210 includes a first holding part 220.

  The first holding unit 220 is formed to be slightly larger than the counter substrate 20 in a plan view. The first holding unit 220 is formed to have substantially the same depth as the two thicknesses of the counter substrate 20 and the dustproof glass 31. The first holding part 220 is formed having a bottom part 202 and a side wall 203.

  When the liquid crystal panel 100 is accommodated in the accommodating portion 210, the bottom 202 has a portion other than the display area 40 on the back surface 31 r of the dust-proof glass 31 via an adhesive (resin member) 80 such as a thermosetting resin. Placed.

  The bottom portion 202 is formed with a protruding portion 90 that protrudes toward the exposed portion of the parting member 64. The protrusion 90 penetrates the adhesive 80 and is in contact with the parting member 64. The protrusion 90 serves as a path for guiding heat accumulated in the parting member 64 to the holding member 200 when light enters the liquid crystal device 1. The protrusion 90 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). In addition, the protrusion part 90 should just be the surface comprised with the metal at least.

  The storage unit 210 includes a second holding unit 230 that is larger than the first holding unit 220 in a plan view. The second holding unit 230 is formed to be slightly larger than the TFT array substrate 10 in a plan view. The second holding unit 230 is formed to a depth that is slightly larger than the thickness of the TFT array substrate 10 and the dust-proof glass 30 (see FIG. 6). The second holding part 230 is formed to have a bottom part 204 and a side wall 205.

  When the liquid crystal panel 100 is accommodated in the accommodating portion 210, a part of the TFT array substrate 10 is placed on the bottom portion 204 via an adhesive.

  The bottom portion 204 is formed with a protruding portion 91 that protrudes toward the exposed portion of the parting member 61. The protrusion 91 penetrates the adhesive 80 and contacts the parting member 61. The protrusion 91 serves as a path for guiding heat accumulated in the parting member 61 to the holding member 200 when light enters the liquid crystal device 1. The protruding portion 91 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). In addition, the protrusion part 91 should just be the surface comprised by the metal at least.

  Further, a locking projection 250 is formed on each of the opposing sides 200 i and 200 t of the holding member 200. A locking hole 310 h of a locking member 310 formed in the hook member 300 is locked to the locking projection 250.

  The hook member 300 is formed from a frame-like thin plate member having a substantially rectangular planar shape. The hook member 300 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). Note that at least the surface of the hook member 300 may be made of metal.

  A locking member 310 having a locking hole 310 h is formed on each of the opposing sides 300 i and 300 t of the hook member 300. The locking member 310 is a portion that is locked to the locking projection 250 of the holding member 200 after the hook member 300 is fitted to the holding member 200 (see FIG. 5).

  In the approximate center of the hook member 300, an opening 320 having a smaller size in plan view than the dustproof glass 30 is formed. The hook member 300 is a member for pressing the dust-proof glass 30 toward the liquid crystal panel 100.

  A protrusion 92 that protrudes toward the parting member 62 is formed around the opening 320 of the hook member 300. The protrusion 92 is in direct contact with the parting member 62. The protrusion 92 serves as a path for guiding heat accumulated in the parting member 62 to the hook member 300 when light enters the liquid crystal device 1. The protrusion 92 is made of a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K). In addition, the protrusion part 92 should just be the surface comprised by the metal at least.

Next, a manufacturing method of the liquid crystal device configured as described above will be described.
First, as shown in FIG. 3, for example, a thermosetting adhesive 80 is applied to the housing portion 210 of the holding member 200. Thereafter, the liquid crystal panel 100 is inserted into the housing portion 210 from the back surface 20r side (parting member 64 side) of the counter substrate 20.

  Since the protruding portion 90 that protrudes toward the parting member 64 is formed on the bottom portion 202 of the first holding portion 220, the protruding portion 90 penetrates the adhesive 80 and is formed on the back surface 20 r of the counter substrate 20. The formed parting member 64 is contacted.

  Since the bottom portion 204 of the second holding portion 230 is formed with a protruding portion 91 that protrudes toward the exposed portion of the parting member 61, the protruding portion 91 penetrates the adhesive 80, and the TFT array substrate 10. It contacts the parting member 61 formed on the surface 10f.

  Next, the adhesive 80 is cured. Specifically, heat is applied to the holding member 200 to cure the thermosetting adhesives between the liquid crystal panel 100 and the holding member 200 and between the dust-proof glasses 30 and 31 and the holding member 200.

  Next, the hook member 300 is fitted to the holding member 200 from above the dust-proof glass 30 (above the parting member 61). Specifically, the locking holes 310h of the locking members 310 of the hook member 300 are locked to the locking protrusions 250 of the holding member 200, respectively.

  Since a protrusion 91 protruding toward the parting member 62 is formed around the opening 320 of the hook member 300, the protrusion 91 comes into contact with the parting member 62 formed on the back surface 10 r of the TFT array substrate 10. .

  Through the above steps, the parting member 64 is brought into direct contact with the protrusion 90 of the holding member 200. The parting member 61 is in direct contact with the protrusion 91 of the holding member 200. Further, the parting member 62 is in direct contact with the protrusion 92 of the hook member 300.

  As a result, as shown in FIG. 5, the liquid crystal device 1 according to the present embodiment is manufactured. Thereafter, the liquid crystal device 1 is electrically connected to an electronic device such as a projector by the FPC 112.

  According to the liquid crystal device 1 of the present embodiment, even when the liquid crystal device 1 is applied to an application in which a large amount of light is irradiated to the liquid crystal device 1, the liquid crystal device 1 is accumulated in the parting member 61 by the parting member 61 exposed to the outside. Heat can be dissipated at a portion far from the liquid crystal 50. For this reason, it can suppress that the liquid crystal 50 deteriorates with the heat | fever which originates in the irradiated light. Therefore, it is possible to provide the liquid crystal device 1 that can cool the device while suppressing display defects.

  In addition, according to this configuration, even when the liquid crystal panel 100 is fixed to the holding member 200 with the adhesive 80, the protruding portion 91 penetrates the adhesive 80, so the parting member 61 and the holding member 200 are formed. The projected portion 91 is firmly connected. Therefore, the heat accumulated in the parting member 61 can be reliably radiated.

  Further, according to this configuration, the heat accumulated in the parting member 62 is transmitted to a portion far from the liquid crystal 50. Therefore, the heat accumulated in the parting member 62 can be dissipated away from the liquid crystal 50.

  Further, according to this configuration, the heat accumulated in the parting member 62 can be dissipated away from the liquid crystal 50 by the parting member 62 exposed to the outside.

  In the present embodiment, the parting member 61 is disposed at the portion of the TFT array substrate 10 on the liquid crystal 50 side, and the parting member 62 is different from the TFT array substrate 10 side of the dustproof member 30. The parting member 63 is disposed on the liquid crystal side part of the counter substrate 20, and the parting member 64 is disposed on the part of the dust-proof glass 31 opposite to the counter substrate 20 side. However, it is not limited to this. For example, only the parting member 61 may be formed on the TFT array substrate 10 side, and only the parting member 63 may be formed on the counter substrate 20 side. That is, it is only necessary that the parting member is disposed at least on the liquid crystal 50 side portion of the TFT array substrate 10 and on the liquid crystal 50 side portion of the counter substrate 20.

  In the present embodiment, the holding member 200 is formed with a projection 90 that contacts the parting member 64 and a projection 91 that contacts the parting member 61, and the hook member 300 is formed with a projection 92 that contacts the parting member 62. However, it is not limited to this. For example, bumps (for example, gold bumps, a structure in which the inner resin is used as a core and the surface is covered with gold, the thermal conductivity of gold (Au): about 320 W / m · K) that contacts the holding member 200 with the parting members 61 and 64 Or a bump (for example, a gold bump) that contacts the parting member 62 may be formed on the hook member 300.

  In the present embodiment, the protrusion 90 formed on the holding member 200 and the parting member 64 are in direct contact with each other, and the protrusion 91 formed on the holding member 200 and the parting member 61 are in direct contact with each other. Although the protrusion 92 and the parting member 62 formed in 300 are in direct contact, the present invention is not limited to this. For example, even if the holding member 200 and the parting members 61 and 64 are in contact with each other using a brazing material (for example, thermal conductivity of silver brazing or silver (Ag): about 420 W / m · K) instead of the protrusions. Alternatively, the hook member 300 and the parting member 62 may be in contact with each other.

  Moreover, in this embodiment, although the liquid crystal device 1 demonstrated and demonstrated as an example the structure containing the holding member 200 and the hook member 300 which hold | maintain the liquid crystal panel 100 and dustproof glass 30,31, it is not restricted to this. For example, the liquid crystal device may include a liquid crystal panel and dust-proof glass without including the holding member 200 and the hook member 300. Further, the liquid crystal device may include only a liquid crystal panel without including dust-proof glass.

  Further, the liquid crystal panel is not limited to the above-described illustrated examples, and various modifications can be made without departing from the scope of the present invention. For example, the liquid crystal panel described above has been described by taking an active matrix type liquid crystal display module using an active element (active element) such as a TFT (thin film transistor) as an example. However, the present invention is not limited to this, and a TFD (thin film diode) is used. An active matrix type liquid crystal display module using an active element such as an active element may also be used.

  Furthermore, in the present embodiment, the electro-optical device has been described by taking a liquid crystal device as an example. , Plasma display devices, field emission display (FED) devices, surface-conduction electron-emitter display (SED) devices, LED (light-emitting diode) display devices, electrophoretic display devices, devices using thin cathode ray tubes or liquid crystal shutters, etc. It can also be applied to various electro-optical devices.

  The electro-optical device may be a display device that forms elements on a semiconductor substrate, for example, LCOS (Liquid Crystal On Silicon). In LCOS, a single crystal silicon substrate is used as an element substrate, and a transistor is formed on a single crystal silicon substrate as a switching element used for a pixel or a peripheral circuit. In addition, a reflective pixel electrode is used for the pixel, and each element of the pixel is formed below the pixel electrode.

  In addition, the electro-optical device has a display device in which a pair of electrodes are formed on the same layer of a substrate on one side, for example, IPS (In-Plane Switching), or a pair of electrodes on one substrate via an insulating film. It may be a display device FFS (Fringe Field Switching) formed.

(Second Embodiment)
FIG. 7 is a plan view of a liquid crystal panel 100A according to the second embodiment of the present invention. 8 is a cross-sectional view taken along line BB in FIG.
As shown in FIG. 7, the liquid crystal panel 100A of the present embodiment is different from the liquid crystal panel 100 according to the first embodiment described above in that a parting member 260 is provided instead of the parting member 61 according to the first embodiment. ing. Since the other points are the same as the above-described configuration, the same elements as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 7 and 8, the liquid crystal panel 100 </ b> A is configured by interposing a liquid crystal 50 between a TFT array substrate 10 and a counter substrate 20 disposed to face the TFT array substrate 10. The TFT array substrate 10 and the counter substrate 20 that are arranged to face each other are bonded together by a sealing material 52.

  On the liquid crystal 50 side of the TFT array substrate 10, a parting member (first parting member) 260 having a higher thermal conductivity than the TFT array substrate 10 and shielding the peripheral region of the display region 40 of the liquid crystal panel 100 is provided. Yes. The parting member 260 includes an annular light shielding part 261 that partitions the peripheral area of the display area 40, and a heat transfer member 270 having a higher thermal conductivity than the light shielding part 261 connected to the light shielding part 261. Yes. The light shielding unit 261 is a pixel capacitance line used as a peripheral wiring, for example. At least a part of the heat transfer member 270 is exposed from the counter substrate 20 in plan view.

  A pixel capacitor electrode 281 and a pixel source line 282 that are used as peripheral wirings are disposed in a portion overlapping the light shielding portion 261 in plan view. The pixel capacitor electrode 281 and the pixel source line 282 are made of a metal material such as Al, for example.

  The heat transfer member 270 includes a heat dissipation layer 271 that releases heat accumulated in the light shielding portion 261 to the outside, contact portions 272 and 273, and a heat transfer layer 274. The contact part 272 connects the light shielding part 261 and the heat transfer layer 274. The contact portion 273 connects the heat transfer layer 274 and the heat dissipation layer 271. The heat accumulated in the light shielding part 261 is transmitted to the heat radiation layer 271 via the contact part 272, the heat transfer layer 274, and the contact part 273, and is released to the outside from the heat radiation layer 271.

  As a material for forming the light shielding part 261, the contact part 272, the heat transfer layer 274, the contact part 273, and the heat dissipation layer 271, a metal material such as Al (aluminum, thermal conductivity: about 236 W / m · K) is used. be able to. For the heat dissipation layer 271, an ITO film (indium tin oxide, thermal conductivity: about 8.18 W / m · K) may be stacked on the Al film.

  In addition, the light shielding part 261 should just be comprised by the member which has heat conductivity higher than the TFT array substrate 10 and has light-shielding property. Further, the contact part 272, the heat transfer layer 274, the contact part 273, and the heat dissipation layer 271 may be configured by a member having a higher thermal conductivity than at least the light shielding part 261. In the present embodiment, Al is used as a material for forming the light shielding part 261, the contact part 272, the heat transfer layer 274, the contact part 273, and the heat dissipation layer 271.

  In addition, about the formation material of the contact part 272, the heat-transfer layer 274, the contact part 273, and the thermal radiation layer 271, as a material whose heat conductivity is higher than the light-shielding part 261 (thermal conductivity: about 236 W / m * K), For example, Au (gold, thermal conductivity: about 320 W / m · K), Ag (silver, thermal conductivity: about 420 W / m · K), Cu (copper, thermal conductivity: about 398 W / m · K), etc. Metal materials can also be used.

  According to the liquid crystal panel 100 </ b> A of the present embodiment, the heat accumulated in the light shielding portion 261 can be radiated at a portion far away from the liquid crystal 50 by the heat radiation layer 271 exposed to the outside. For this reason, it can suppress that the liquid crystal 50 deteriorates with the heat | fever which originates in the irradiated light.

(Third embodiment)
FIG. 9 is a cross-sectional view of the liquid crystal device 2 according to the third embodiment of the present invention.
As shown in FIG. 9, in the liquid crystal device 2 of the present embodiment, the parting member (second parting member) 62A is disposed on the portion of the TFT array substrate 10 on the dust-proof glass 30 side, and the parting member 64A is opposed. The first embodiment described above in that it is disposed at a portion of the substrate 20 on the dust-proof glass 31 side and that at least a part of the parting members 62A and 64A is connected to the holding member 200 via the connection member 93. This is different from the liquid crystal device 1 according to FIG. Since the other points are the same as the above-described configuration, the same elements as those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  A parting member (second parting member) 62A having a higher thermal conductivity than the TFT array substrate 10 and shielding the peripheral area of the display region 40 is formed on the portion of the TFT array substrate 10 on the dust-proof glass 30 side. Yes. At least a part of the parting member 62A is extended to a portion formed larger than the counter substrate 20 of the TFT array substrate 10 in plan view. At least a part of the parting member 62A is exposed from the same plane as the side end face of the TFT array substrate 10.

  A parting member 64 </ b> A that shields the peripheral area of the display area 40 having a higher thermal conductivity than that of the counter substrate 20 is formed on a part of the counter substrate 20 on the dust-proof glass 31 side. At least a part of the parting member 64 </ b> A is exposed from the same plane as the side end surface of the counter substrate 20.

  The exposed portions of the parting members 62A and 64A are connected to the holding member 200 via a connection member 93 having a higher thermal conductivity than the parting members 62A and 64A. The connection member 93 is made of a material such as solder (thermal conductivity: about 21 to 66 W / m · K), for example. The method for connecting the exposed portions of the parting members 62A and 64A and the holding member 200 is, for example, by previously opening a hole 200h in the holding member 200 and injecting solder from the hole 200h to expose the parting members 62A and 64A. There is a method of soldering the portion and the holding member 200.

  According to the liquid crystal device 2 of the present embodiment, the heat accumulated in the parting member 62 </ b> A is transmitted to a portion far from the liquid crystal 50. Therefore, the heat accumulated in the parting member 62A can be dissipated away from the liquid crystal 50.

  Further, according to this configuration, the heat accumulated in the parting member 62A can be radiated away from the liquid crystal 50 by the parting member 62A exposed to the outside.

  Further, according to this configuration, the heat accumulated in the parting member 62 </ b> A can be radiated through the holding member 200 having a larger surface area than the liquid crystal panel 100. For this reason, the heat accumulated in the parting member 62A can be efficiently radiated.

(Fourth embodiment)
FIG. 10 is a cross-sectional view of the liquid crystal device 3 according to the fourth embodiment of the present invention.
As shown in FIG. 10, in the liquid crystal device 3 of the present embodiment, the parting member (first parting member) 61B is disposed on the portion of the TFT array substrate 10 on the dust-proof glass 30 side, and the parting member 63B is opposed. Instead of the point disposed on the dust-proof glass 31 side of the substrate 20, at least a part of the parting members 61 </ b> B and 63 </ b> B is connected to the holding member 200 via the connection member 93, and the protrusions 90 and 92. This is different from the liquid crystal device 1 according to the first embodiment described above in that a connection member 94 made of an elastic member is provided. That is, in the liquid crystal device 3 of this embodiment, the parting member is not disposed on the liquid crystal 50 side of the TFT array substrate 10 and the liquid crystal 50 side of the counter substrate 20. Since the other points are the same as the above-described configuration, the same elements as those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  A parting member (third parting member) 61B having a higher thermal conductivity than the TFT array substrate 10 and shielding the peripheral region of the display region 40 is formed on the portion of the TFT array substrate 10 on the dustproof glass 30 side. Yes. At least a part of the parting member 61B is extended to a portion formed larger than the counter substrate 20 of the TFT array substrate 10 in plan view. At least a part of the parting member 61B is exposed from the same plane as the side end face of the TFT array substrate 10.

  A parting member 63 </ b> B that shields the peripheral area of the display area 40, which has a higher thermal conductivity than the counter substrate 20, is formed on the dust-proof glass 31 side of the counter substrate 20. At least a part of the parting member 63B is exposed from the same plane as the side end surface of the counter substrate 20.

  The exposed portions of the parting members 61B and 63B are connected to the holding member 200 via a connection member 93 having a higher thermal conductivity than the parting members 61B and 63B. The connection member 93 is made of a material such as solder (thermal conductivity: about 21 to 66 W / m · K), for example. As for the method of connecting the exposed parts of the parting members 61B and 63B and the holding member 200, for example, a hole 200h is previously formed in the holding member 200, and solder is injected from the hole 200h to expose the parting members 61B and 63B. There is a method of soldering the portion and the holding member 200.

  The parting member 62B is connected to the hook member 300 via the connecting member 94. The parting member 64B is connected to the holding member 200 via the connecting member 94. The connecting member 94 is an elastic member. For example, a U-shaped spring member can be used as the connecting member 94. The liquid crystal panel 100 and the dustproof glasses 30 and 31 are held by the holding member 200 and the hook member 300 in a state where the connecting member 94 is elastically deformed.

  According to the liquid crystal device 3 of the present embodiment, the parting member 64B and the holding member 200 are firmly connected. Therefore, the heat accumulated in the parting member 64B can be reliably radiated.

  Further, according to this configuration, the heat accumulated in the parting member 61 </ b> B is transmitted to a portion far from the liquid crystal 50. For this reason, it can suppress that the liquid crystal 50 deteriorates with the heat | fever which originates in the irradiated light.

  Further, according to this configuration, the heat accumulated in the parting member 61B can be radiated away from the liquid crystal 50 by the parting member 61B exposed to the outside.

  Further, according to this configuration, the heat accumulated in the parting member 61 </ b> B can be radiated through the holding member 200 having a larger surface area than the liquid crystal panel 100. For this reason, the heat accumulated in the parting member 61B can be efficiently radiated.

(Fifth embodiment)
FIG. 11 is a cross-sectional view of the liquid crystal device 4 according to the fifth embodiment of the present invention.
As shown in FIG. 11, the liquid crystal device 4 of the present embodiment has the liquid crystal according to the first embodiment described above in that the exposed portions of the parting members 61C, 62C, 63C, and 64C are directly connected to the holding member 200. Different from the device 1. Since the other points are the same as the above-described configuration, the same elements as those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  A parting member 61C having a thermal conductivity higher than that of the TFT array substrate is formed on a portion of the TFT array substrate 10 on the liquid crystal 50 side. The parting member 61 </ b> C is formed larger in plan view than the TFT array substrate 10. A portion of the parting member 61 </ b> C formed larger than the TFT array substrate 10 is in direct contact with the holding member 200.

  A parting member 62C having a thermal conductivity higher than that of the dust-proof glass 30 is formed on a part of the dust-proof glass 30 opposite to the TFT array substrate 10. The parting member 62 </ b> C is formed larger in size in plan view than the dust-proof glass 30. A portion of the parting member 62 </ b> C formed larger than the dust-proof glass 30 is in direct contact with the holding member 200.

  A parting member 63C having a thermal conductivity higher than that of the counter substrate 20 is formed on a portion of the counter substrate 20 on the liquid crystal 50 side. The parting member 63 </ b> C is formed larger in size in plan view than the counter substrate 20. A part of the parting member 63 </ b> C formed larger than the counter substrate 20 is in direct contact with the holding member 200.

  A parting member 64 </ b> C having a higher thermal conductivity than that of the dust-proof glass 31 is formed on a part of the dust-proof glass 31 opposite to the side of the counter substrate 20. The parting member 64 </ b> C is formed larger in size in plan view than the dust-proof glass 31. A part of the parting member 64 </ b> C that is formed larger than the dust-proof glass 31 is in direct contact with the holding member 200.

  According to the liquid crystal device 4 of the present embodiment, the heat accumulated in the parting member 61 </ b> C can be radiated through the holding member 200 having a larger surface area than the liquid crystal panel 100. For this reason, the heat accumulated in the parting member 61C can be efficiently radiated.

(Electronics)
FIG. 12 is a schematic configuration diagram of a projector 1000 that is an example of an electronic apparatus. The projector 1000 is configured as a projector using three liquid crystal modules including the liquid crystal device 1 as RGB light valves 1100R, 1100G, and 1100B, respectively.

  In this projector 1000, when light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, light components corresponding to the three primary colors R, G, and B are emitted by three mirrors 1106 and two dichroic mirrors 1108. The light is separated into R, G, and B (light separating means) and led to the corresponding light valves 1100R, 1100G, and 1100B (liquid crystal device 1, liquid crystal light valve), respectively. At this time, since the optical component B has a long optical path, the light component B is guided through a relay lens system 1121 including an incident lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss.

  The light components R, G, and B corresponding to the three primary colors modulated by the light valves 1100R, 1100G, and 1100B are incident on the dichroic prism 1112 (light combining unit) from three directions and are combined again, and then the projection lens. A color image is projected on the screen 1120 via 1114.

  According to the projector 1000, since the liquid crystal device 1 of the present invention is used as the light valves 1100R, 1100G, and 1100B, it is possible to provide a highly reliable projector 1000 that can display a high-quality image. .

  In addition to the projector 1000, the electronic device includes a personal computer (PC) compatible with multimedia, an engineering workstation (EWS), a pager, a mobile phone, a word processor, a TV, a viewfinder type, or a monitor direct view type. Video tape recorders, electronic notebooks, electronic desk calculators, car navigation devices, POS terminals, touch panels, and the like.

1, 2, 3, 4 ... Liquid crystal device (electro-optical device), 10 ... TFT array substrate (first substrate), 20 ... Counter substrate (second substrate), 30, 31 ... Dust-proof glass (dust-proof member), 50 ... Liquid crystal (electro-optical material), 61, 61A, 61B, 61C, 62, 62A, 62B, 62C, 63, 63A, 63B, 63C, 64, 64A, 64B, 64C, 260 ... parting member, 80 ... adhesive (resin) Member), 90, 91, 92 ... projection, 93, 94 ... connection member, 100, 100A ... liquid crystal panel (electro-optical panel), 200 ... holding member, 261 ... light shielding part, 270 ... heat transfer member, 1000 ... projector (Electronics)

Claims (13)

An electro-optic panel comprising an electro-optic material sandwiched between a first substrate and a second substrate;
A first parting member disposed on the electro-optic material side of the first substrate and having a higher thermal conductivity than the first substrate and shielding an outer region of the display region in a plan view;
The first substrate is formed to have a larger size in plan view than the second substrate,
An electro-optical device, wherein at least a part of the first parting member is exposed from the second substrate in plan view. The first parting member is:
A light-shielding portion having an annular shape in plan view that partitions an outer region of the display region;
A heat transfer member having a higher thermal conductivity than the light shielding part connected to the light shielding part,
The electro-optical device according to claim 1, wherein at least a part of the heat transfer member is exposed from the second substrate in a plan view. A dust-proof member disposed on a side opposite to the electro-optical material side of the first substrate;
In the portion of the first substrate on the dust-proof member side, a second parting member that has a higher thermal conductivity than the first substrate and shields the outer region of the display region is disposed,
3. The electricity according to claim 1, wherein at least a part of the second parting member is extended to a portion of the first substrate that is formed larger than the second substrate in a plan view. Optical device.   The electro-optical device according to claim 3, wherein at least a part of the second parting member is exposed from the same plane as a side end surface of the first substrate. A holding member that holds the electro-optic panel and whose surface is made of metal,
At least a part of the first parting member is in direct contact with the holding member, or is connected to the holding member via a first connection member having a higher thermal conductivity than the first parting member. The electro-optical device according to claim 1, wherein The first connecting member is formed of an elastic member;
The electro-optical device according to claim 5, wherein the electro-optical panel is held by the holding member in a state where the first connecting member is elastically deformed. The holding member is formed with a protrusion that protrudes toward the first parting member and has a metal surface.
The electro-optical panel is filled with a resin member between the holding member and fixed to the holding member,
The electro-optical device according to claim 5, wherein the protruding portion penetrates through the resin member and contacts the first parting member. An electro-optic panel comprising an electro-optic material sandwiched between a first substrate and a second substrate;
A third parting member disposed on a side opposite to the electro-optic material side of the first substrate and having a higher thermal conductivity than the first substrate and shielding a region outside the display region in plan view; Including
The first substrate is formed to have a larger size in plan view than the second substrate,
An electro-optical device, wherein at least a part of the third parting member is extended to a portion of the first substrate that is formed larger than the second substrate in plan view.   The electro-optical device according to claim 8, wherein at least a part of the third parting member is exposed from the same plane as a side end surface of the first substrate. A holding member that holds the electro-optic panel and whose surface is made of metal,
At least a part of the third parting member is in direct contact with the holding member, or is connected to the holding member via a second connection member having a higher thermal conductivity than the third parting member. 10. The electro-optical device according to claim 8, wherein the electro-optical device is provided. A dust-proof member disposed on a side opposite to the electro-optical material side of the first substrate;
A fourth parting member that shields the outer region of the display region, which has a higher thermal conductivity than the dust-proof substrate, is disposed on a portion of the dust-proof member opposite to the first substrate side,
The at least part of the fourth parting member is stretched to a portion of the first substrate that is formed larger than the second substrate in plan view. The electro-optical device according to Item.   The electro-optical device according to claim 11, wherein at least a part of the fourth parting member is exposed from the same plane as a side end surface of the dust-proof member.   An electronic apparatus comprising the electro-optical device according to claim 1.

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