JP2012206503A5

JP2012206503A5 -

Info

Publication number: JP2012206503A5
Application number: JP2012016515A
Authority: JP
Filing date: 2012-01-30
Publication date: 2014-12-04
Anticipated expiration: 2032-01-30

Description

ここで、「半硬化」とは、未硬化状態と硬化状態との間にある状態を意味する。半硬化状態の熱硬化性樹脂は、ある程度の流動性を有する。具体的には、熱硬化性樹脂を加熱して、経時変化による粘度カーブを測定したとき、飽和した粘度から最低粘度の差分を百分率表示し、飽和した粘度に対して１０〜９０％の粘度である状態を、半硬化ということができる。なお、硬化状態は、熱硬化性樹脂が脱型により流動ないし変形しない状態であり、前記の測定により、飽和した粘度に対して９０％を超える粘度である状態を、硬化状態ということができる。 Here, “semi-cured” means a state between an uncured state and a cured state. The semi-cured thermosetting resin has a certain degree of fluidity. Specifically, when the thermosetting resin is heated and the viscosity curve due to aging is measured, the difference between the saturated viscosity and the minimum viscosity is displayed as a percentage, and the viscosity is 10 to 90% of the saturated viscosity. A certain state can be called semi-cured. The cured state is a state in which the thermosetting resin does not flow or deform due to demolding, and a state in which the viscosity exceeds 90% with respect to the saturated viscosity can be referred to as a cured state.

また、熱硬化性樹脂のガラス転移温度（以下、Ｔｇと省略する）から硬化状態を確認する方法を用いても良い。すなわち、硬化の進行にともなうＴｇの上昇が飽和したときのＴｇと、Ｔｇの最小値（未硬化の熱硬化性樹脂のＴｇ）とを予め測定しておき、飽和したＴｇからＴｇの最小値の差分を百分率表示し、飽和したＴｇに対して１０〜９０％のＴｇである状態を、半硬化ということができる。飽和したＴｇに対して９０％を超えるＴｇである状態を、硬化状態ということができる。熱硬化性樹脂の加熱温度及び加熱時間とＴｇとの相関関係を予め測定しておき、この相関関係に基づいて、成形条件からおおよそのＴｇを内挿することができる。ＴｇはＤＳＣを用いた方法で測定することができる。 Moreover, you may use the method of confirming a hardening state from the glass transition temperature (henceforth Tg) of a thermosetting resin . That is, the Tg when the increase in Tg with the progress of curing is saturated and the minimum value of Tg (Tg of uncured thermosetting resin) are measured in advance, and the minimum value of Tg is determined from the saturated Tg. A state in which the difference is displayed as a percentage and the Tg is 10 to 90% with respect to the saturated Tg can be referred to as semi-curing. A state where the Tg is more than 90% with respect to the saturated Tg can be referred to as a cured state. The correlation between the heating temperature and heating time of the thermosetting resin and Tg is measured in advance, and based on this correlation, an approximate Tg can be interpolated from the molding conditions. Tg can be measured by a method using DSC.

さらには、熱硬化性樹脂のＤＳＣで測定される発熱量から硬化状態を確認する方法を用いても良い。すなわち、未硬化の熱硬化性樹脂の発熱量を予め測定しておき、加熱後の熱硬化性樹脂の発熱量の割合から残存反応率が硬化状態を見積もることができる。この残存反応率が１０〜９０％である状態を、半硬化ということができる。１０％未満である状態を、硬化状態ということができる。 Furthermore, you may use the method of confirming a hardening state from the emitted-heat amount measured by DSC of a thermosetting resin . That is, the calorific value of the uncured thermosetting resin is measured in advance, and the remaining reaction rate can be estimated from the ratio of the calorific value of the thermosetting resin after heating. A state in which the residual reaction rate is 10 to 90% can be referred to as semi-curing. A state of less than 10% can be referred to as a cured state.

Claims

The manufacturing method of an electronic device housing | casing provided with the process of using the metal complex manufactured by the method in any one of Claims 1-19.