JP2012199414A - Manufacturing method of light emitting device and the light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which realizes uniform luminescent colors without causing the deterioration of the yield in the manufacturing of the light emitting device and color unevenness.SOLUTION: In a manufacturing method of a light emitting device, a resin is injected between a substrate on which an LED element is mounted and a mold and vacuum drawing is conducted to form a resin layer sealing the LED element on the substrate. The manufacturing method of the light emitting device includes: a step where the LED element is mounted on the substrate; a step where light blocking protruding parts are formed around the LED element on the substrate where the LED element is mounted; and a step where the resin is injected between the substrate and the mold and compression molding is conducted with the mold contacted with the protruding parts.

Description

  The present invention relates to a method for manufacturing a light emitting device using an LED element, and more particularly, to a method for forming a resin layer for sealing an LED element using a compression molding method.

  In light emitting devices using LED elements, in order to obtain a desired light emission color, for example, white light emission, a light emitting device in which an LED element and a wavelength conversion material such as a phosphor are combined is frequently used. The wavelength conversion material is usually provided so as to cover the LED element by being dispersed in the sealing resin of the LED element. Conventionally, a light emitting device is manufactured by forming a recess (horn) on a substrate on which an LED element is mounted, mounting an LED on the bottom thereof, and filling the recess with a phosphor-containing resin.

  However, in this light emitting device, there is a problem that uneven color occurs because the light path length when the light emitted from the LED element passes through the phosphor layer is different between directly above and around the LED element. For example, in the case of a light emitting device in which a blue LED and a phosphor are combined, the light is blue immediately above the LED element and the surrounding is yellow, which is a phosphor color.

  On the other hand, there is a method of providing a phosphor resin layer in a hemispherical shape on the LED element by injecting and curing the phosphor-containing resin between the mold and the LED element (Patent Documents 1 to 3). A compression molding method (compression mold) is widely used for resin molding. By making the phosphor resin layer hemispherical, the problem of color unevenness due to the optical path length difference is considerably reduced.

JP 2006-148147 A JP 2008-211205 A JP 2010-125647 A

  However, a new problem arises when the resin layer is manufactured by the compression molding method. In general, in the compression molding method, in order to remove bubbles contained in the phosphor-containing resin, it is necessary to evacuate by putting a thin releasable sheet between the mold and the substrate on which the LED element is mounted. is there. For this reason, a thin layer of phosphor-containing resin is formed between the substrate and the sheet, and the phosphor-containing resin layer is molded in this state, and a thin resin layer is formed on the LED mounting surface of the substrate. The phosphor contained in the thin resin layer also emits light by the LED element, but this light emission is different from the hemispherical resin layer and causes uneven color. For example, the light emitted from the hemispherical resin layer is almost uniform white light, while the surrounding is yellower than the hemispherical portion.

  As a method for solving this problem, there is a manufacturing method in which after the resin layer is formed, the thin film-like resin layer around the hemispherical resin layer is removed by sandblasting or peeled off by a tape mask. However, in these methods, there is a possibility that the hemispherical resin layer is damaged by sandblasting, or the hemispherical resin layer is also peeled off when the tape is peeled off, and the manufacturing yield of the light emitting device is greatly reduced.

  The present invention solves the above problem of color unevenness without causing a decrease in yield in the manufacture of a light emitting device in which a hemispherical resin layer covering the LED element is formed, and realizes a uniform emission color without color unevenness. It is an object to provide a light-emitting device that can be used.

  In the method for manufacturing a light emitting device, a light-shielding protrusion that separates a convex (hemispherical) resin layer covering an LED element and a thin resin layer inevitably formed around the LED element during compression molding A portion is provided to prevent light from the LED element from entering the thin resin layer from the convex resin layer. The protrusion functions as a part of the reflector in the manufactured light emitting device, and makes the light emitted from the convex resin layer more uniform.

That is, in the method for manufacturing a light emitting device of the present invention, a resin layer for sealing the LED element is formed on the substrate by injecting a resin between the substrate on which the LED element is mounted and the mold and evacuating the resin. A method of manufacturing a light-emitting device to be formed, the step of mounting an LED element on a substrate, the step of forming a light-shielding protrusion around the LED element of the substrate on which the LED element is mounted, and the substrate And injecting a resin between the mold and the mold, bringing the mold into contact with the protrusion, and forming the resin layer by compression molding.
In the light emitting device manufacturing method of the present invention, either the step of mounting the LED element on the substrate or the step of forming the light-shielding protrusion may be preceded.

  In the method for manufacturing a light emitting device according to the present invention, preferably, the step of mounting the LED element on the substrate includes a step of forming a reflector around a region on the substrate where the LED element is mounted to form a laminated substrate, The step of forming the protrusion forms the protrusion on the reflector.

  The light-emitting device of the present invention includes a substrate, one or more LED elements mounted on the substrate, a reflector provided around the LED element on the substrate, and a convex resin that covers the LED elements. A thin film-like resin layer covering the reflector, and the convex resin layer and the thin-film resin layer are separated by a light-shielding protrusion formed on the reflector, The resin layer is not present on the protruding portion.

  According to the present invention, the lens-shaped resin layer and the thin-film resin layer can be reliably separated by pressing the protrusions to the mold during compression molding. Further, light is prevented from entering the thin film resin layer through the convex resin layer from the LED element and thereby the thin film resin layer is prevented from emitting light, and uniform light emission can be obtained.

It is a figure which shows one Embodiment of the light-emitting device manufactured by the manufacturing method of the light-emitting device of this invention, (a) is sectional drawing, (b) is a top view. 2A and 2B illustrate light emission by the light-emitting device of FIG. 1. It is a figure which shows other embodiment of the light-emitting device of this invention, (a) is sectional drawing, (b) is a top view. (A)-(e) is a figure which shows 1st embodiment of the manufacturing method of the light-emitting device of this invention. (A)-(e) is a figure which shows 2nd embodiment of the manufacturing method of the light-emitting device of this invention. (A)-(d) is a figure which shows 3rd embodiment of the manufacturing method of the light-emitting device of this invention. It is a figure which shows the ring-shaped base material used with the manufacturing method of 3rd embodiment, (a) is a top view, (b) is a side view. (A)-(d) is a figure explaining the Example and comparative example of the manufacturing method of the light-emitting device of this invention, and its effect.

  Embodiments of a light emitting device manufacturing method and a light emitting device manufactured thereby will be described below.

  First, the structure of the light emitting device will be described with reference to FIG. The light emitting device 10 shown in FIG. 1 mainly includes a substrate 11, an LED element 12 mounted on the substrate 11, a reflector 13 provided around the LED element 12 on the substrate 11, and compression molding. The resin layer 14 formed on the LED element 12 and the reflector 13 by the method, and the protrusion 15 that separates the resin layer 141 that covers the LED element 12 and the resin layer 142 that covers the reflector 13 out of the resin layer 14. .

The substrate 11 is a plate-like member made of a ceramic material such as Al ₂ O ₃ or AlN, glass epoxy, or a metal material such as Cu or Al. The thickness is not limited, but is usually about 0.4 to 1 mm. When there is a reflector 13 described later, the total thickness with the reflector is about 0.5 to 1.5 mm. Although not shown, an electrode for electrical connection between the LED element 12 and an external power source is formed on the LED element mounting surface of the substrate 11 or the back surface thereof. Further, when the substrate 11 is made of a metal material, a slit and an insulating part for insulating the positive electrode and the negative electrode are formed.

  The LED element 12 is a face-up element in which two electrode terminal portions are formed on the upper surface, a flip element in which two electrode terminal portions are formed on the lower surface, and an MB (metal) in which two electrode terminal portions are formed on the upper and lower surfaces. A known LED element such as a bond element can be used. FIG. 1 shows a face-up element. The effect of the present invention can be greatly obtained particularly in an element such as a face-up element or a flip element in which an element substrate is light-transmitting and emits light from a side surface. The size of the LED element is not particularly limited, and it can be used from a relatively small element having a length × width of about 0.5 mm × 0.3 mm and a thickness of about 0.12 mm to a large element having a side of 1 mm or more.

  The reflector 13 is not essential in the present invention, but by providing the reflector 13, the resin layer 141 reflects light emitted from the side surface of the LED element 13 at the interface between the resin layer 141 covering the LED element 12 and the reflector 13. By reflecting the light inward, more light can be emitted upward from the resin layer 141, and the phenomenon of blue light emission immediately above the LED element, which is called blue-out, can be reduced. The reflector 13 functions as a structure that compensates for the height of the protrusion 15 when forming the protrusion 15 described later, and can easily form the protrusion 15 that is a fine structure.

  As the material of the reflector 13, the same material as that of the substrate 11 can be used, and the reflector 13 can be formed by stacking on the substrate 11 a plate cut into a shape (usually circular) surrounding the LED element 13. it can.

  The resin layer 14 is formed by a compression molding method using a mold, and a hemispherical lens-shaped resin layer 141 formed on the LED element 12 and a thin-film-like resin layer 142 spreading around the resin layer 141. It consists of. The thin resin layer 141 is not a layer necessary for the function of the light-emitting device, but is a layer inevitably formed when compression molding, and the thickness thereof is defined by the height of the protrusion 15 described later. .

  The resin layer 14 includes a wavelength conversion material such as a resin and a phosphor, and an additive such as a filler as necessary. The resin is not particularly limited as long as it is a resin suitable for the compression molding method, and a silicone resin, a hybrid resin of epoxy and silicone, an epoxy resin, a urethane resin, and the like can be used. Silicone resin is optimal from the viewpoint of reliability. In order to obtain high luminance, it is preferable to use a resin having a high refractive index. However, since a high refractive index resin generally deteriorates quickly due to light, a low refractive index resin is used for applications that require high reliability. It is preferable to use it. The refractive index of the resin can be adjusted by selecting the type of resin and the content of the filler to be added.

The wavelength conversion material is a material that absorbs light emitted from the LED element and emits light having a wavelength different from the absorbed light, and is a nitride or oxynitride phosphor depending on the light emission and desired emission color of the LED , YAG phosphor, BAM phosphor (aluminate blue phosphor), SiAlON phosphor and the like are appropriately selected. For example, a YAG phosphor such as Y ₃ Al ₅ O ₁₂ : Ce ³⁺ as a yellow light-emitting phosphor and Y ₃ (Al, Ga) ₅ O ₁₂ : Ce ³⁺ as a green light-emitting phosphor emits red light. As the phosphor, a nitride phosphor such as CaAlSiN ₃ : Eu or an oxynitride phosphor can be used.

  The filler is used as a diffusing material for adjusting the viscosity of the sealing resin in the manufacturing process or for reducing color unevenness. The content of the phosphor and the filler is not particularly limited, but is preferably 5 to 80% by weight, more preferably 10 to 40% by weight, based on the weight ratio of the total content of the phosphor and the filler with respect to the resin.

  When the resin layer 14 is formed by compression molding, the protrusion 15 abuts on the mold and seals the LED element 12, and the thin resin layer 142 spreads outside the convex resin layer 141. It has a function to separate. Accordingly, light that enters the resin layer 142 from the side surface of the resin layer 141 is blocked, and light emission having a color different from that of the resin layer 141 in the resin layer 142, that is, color unevenness is prevented. The protrusion 15 has a function of reflecting light at the interface with the resin layer 141 and extending the reflector 13 in the vertical direction.

  The material and size of the protrusion 15 is selected to shield light and withstand the pressure during compression molding. As a material, the same material as the substrate 11 and the reflector 13 or a resin containing a white filler can be used. When the same material as the substrate 11 or the like, specifically, a highly rigid material such as ceramic, metal, or glass epoxy, is used, it can be pressed against the mold with a relatively thin protrusion 15 thickness. High light shielding can be realized. In addition, in the case of using a resin containing a white filler, in order to obtain sufficient light shielding properties, it is necessary to increase the thickness of the protrusion 15 compared to ceramic or the like, but it is elastic against pressure during compression molding. Since it is deformed, the adhesiveness to the mold is good, and a thin resin layer is not formed on the protrusion 15, and the resin layer 141 and the resin layer 142 can be reliably separated.

  The width of the protrusion 15 (size in the direction parallel to the substrate surface; hereinafter the same) is set to 0. 0 in the case of a rigid material such as ceramic in order to shield light between the resin layer 141 and the resin layer 142. It is preferable that it is 1 mm or more. If the width is 0.1 mm or more, there is almost no change in light shielding properties even if it is wide, but if it is too wide, the mold molding pressure will increase and warping will occur on the substrate. Since there is a possibility that the protrusion formed on the region without warping may be destroyed, the thickness is preferably 1.0 mm or less. When a plurality of light emitting devices are manufactured by compression molding at the same time, if the width is 0.5 mm, the protrusion and the mold can be brought into close contact with each other even when the substrate 11 is warped within an allowable range. Moreover, when the projection part 15 consists of white filler containing resin, it is preferable that it is 0.2 mm or more.

  The height of the protrusion 15 (the size in the direction perpendicular to the substrate surface; hereinafter the same) is preferably 0.05 mm or more regardless of the material in consideration of processing accuracy. However, in order to prevent the light emitted from the side surface of the resin layer 141 from entering the resin layer 142 beyond the protrusion 15, the sum of the height of the protrusion 15 and the height of the reflector 13 is the same as the thickness of the LED element 12. Or higher. When the thickness of the LED element 12 is, for example, 0.12 mm, the total of the height of the protrusion 15 and the height of the reflector 13 is preferably 0.12 mm or more. If there is no reflector 13 and the height of the projection 15 having a narrow width (about 0.1 mm in width) is made higher than the thickness of the LED element 12, there is a possibility that the strength against pressure during compression molding cannot be maintained. However, in the light emitting device of this embodiment, the reflector 13 is formed, and the protrusion 15 is formed thereon, so that the height of the protrusion 15 can be suppressed to a height that can withstand pressure, and Light emitted from the side surface of the LED element 12 can be prevented from passing through the resin layer 141 and entering the resin layer 142 beyond the protrusion 15.

  The method of forming the protrusion 15 differs depending on the material constituting the protrusion 15, (1) a method of stacking on the substrate 11 using the same material as the substrate 11, and (2) a method of forming with a resin containing a white filler (3) A method of adhering a white reflector serving as the protrusion 15 can be employed.

  FIG. 2 shows a state of light emission by the light emitting device having the above structure. As shown in the drawing, when the LED element 12 is an element that also emits light from the side surface, the light is emitted from the upper surface and the side surface of the LED element 12. Since the light emitted from the upper surface propagates in the hemispherical resin layer 141, light of uniform color without color unevenness due to the difference in optical path length is emitted from the resin layer 141. The light emitted from the side surface is reflected at the interface between the reflector 13 and the protrusion 15 and returns to the resin layer 141 to be diffused and emitted from the upper surface. In addition, since the resin layer 141 and the thin resin layer 142 on the upper surface of the reflector 13 are separated by the protrusion 15, no light is incident on the resin layer 142, and light emission from the resin layer 142 (resin There is no yellow light compared to the light from the layer 141, and the light emitting device as a whole can emit light with no color unevenness.

  Although FIG. 1 shows a light emitting device using a single LED element, the present invention can be similarly applied to a light emitting device using a plurality of LED elements.

  FIG. 3 shows an embodiment of a light emitting device 100 using a plurality of LED elements. The light emitting device 100 is obtained by two-dimensionally arranging LED elements similar to the light emitting device 10 of the embodiment of FIG. In the figure, a device in which 10 (vertical 2 × horizontal 5) LED elements are arranged is shown, but the number of elements and the arrangement method are not limited to those shown in the figure, and are arbitrary. That is, it can take various forms such as LED elements arranged in a line or the same number of elements arranged vertically and horizontally.

Since individual elements constituting the light emitting device are the same as those in the embodiment of FIG. First, the interval between the LED elements varies depending on the size of the LED elements and the type of the light emitting device, and is arbitrary.
The width of the protrusion 15 is preferably 0.1 mm or more and 1.0 mm or less, as in the embodiment of FIG. 1, regardless of the size of the resin layer 141 that seals the LED element and the interval between the LED elements. However, in the light emitting device 100 in which a plurality of LED elements are arranged, it is preferable that the width is wider than 0.5 mm in consideration of the warpage of the substrate 11. In other words, it is important that the protrusions are pressed against the mold during compression molding, but when the substrate is warped, the protrusions around the LED elements arranged in a plurality cannot be in close contact with those that are in close contact with the mold. However, when the width of the protrusion is made large to some extent, it is difficult to be affected by the warp of the substrate, and the pressure contact with the mold becomes possible.

  As in the embodiment of FIG. 1, the protrusion 15 is formed by (1) a method of laminating on the substrate 11 using the same material as the substrate 11, (2) a method of forming with a resin containing a white filler, (3) A method of adhering a white reflector serving as the protrusion 15 can be adopted.

  The light-emitting device of FIG. 3 is suitable as a planar light source or a linear light source, and can be used as a TV backlight or a fluorescent lamp LED light source.

  Next, a method for manufacturing the light emitting device described above will be described. The method for manufacturing the light emitting device of the present invention employs different methods depending on the material constituting the protrusion. Each embodiment will be described below.

<First embodiment>
The procedure of the manufacturing method of this embodiment is shown in FIGS. First, as shown in (a), a base material for the reflector 13 and a base material for the protrusion 15 are laminated in this order on a package substrate 11 on which a wiring pattern (not shown) for mounting the LED element is formed. Thus, the laminated substrate 17 is produced. The base material for the reflector 13 is a plate material made of the same material as the package substrate 11, having the same outer shape as the package substrate 11, and having the center cut into the reflector shape. The base material for the protrusion 15 is a ring-shaped substrate having the same inner diameter as the central opening of the reflector 13, and has a width of 0.1 mm or more and a height of 0.05 mm or more.

  In the laminating method, when the material of each element constituting the laminated substrate 17 is ceramic, the green sheet before firing having substantially the same outer shape as that of the reflector 13 and the protrusion 15 described above is stacked on the substrate 11 and fired. The method can be adopted. In this case, the green sheet needs to be processed into a slightly larger size in consideration of the slight reduction of the green sheet during firing. In the case where the substrate 11 is a metal, a metal plate as a base material is bonded by diffusion bonding to produce a laminated substrate 17. In the case of a resin substrate such as a glass epoxy substrate, the laminated substrate 17 is manufactured by bonding with an adhesive.

  Next, the LED element 12 is mounted on the package substrate 11 after lamination. When the LED element 12 is a face-up element as shown in the figure, the LED element 12 is first die-bonded to the substrate 11, and the upper electrode is wire-bonded using Au wire or the like to be electrically connected (FIG. 4 ( b)). When the LED element 12 is a flip element or MB element, bonding using Au bumps is possible instead of wire bonding.

  Subsequently, the resin is compression-molded using the mold 20 to form the resin layer 14 (FIGS. 4C and 4D). The mold 20 has a plurality of recesses for forming a resin layer 141 that seals the LED element. In the compression molding, first, the release film 30 is placed on the mold 20, and the laminated substrate 17 after mounting the LED elements is aligned so that the LED elements 12 are overlapped at the positions of the recesses, and then the mold is interposed via the release film 30. The liquid resin 140 is poured into the recess of the mold 20. The gap between the mold 20 and the laminated substrate 17 (gap at the end) is evacuated to several hundred μm, and the liquid resin is placed in the mold 20 and between the mold 20 (release film 30) and the laminated substrate 17. Are uniformly filled and air bubbles are removed. Next, the mold 20 is brought into pressure contact with the laminated substrate 17 to compress the resin. At this time, the protrusion 15 of the multilayer substrate 19 and the flat portion around the recess of the mold 20 abut (strictly, the protrusion 15 and the release film 30 disposed on the mold 20 abut) The resin layer 141 formed by the resin portion surrounded by the projection 15, that is, the concave portion of the mold, and the resin portion formed in the form of a thin film around it, that is, the resin layer 142 are completely separated by the projection 15.

  Thereafter, the mold 20 and the release film 30 are separated from the resin layer 14 to complete the light emitting device 10 (FIG. 4E).

  According to the method for manufacturing the light emitting device of the present embodiment, the projection 15 is pressed against the mold 20 during the compression molding, and is brought into close contact with each other, so that the lens-shaped resin layer 141 and the thin-film resin layer 142 are securely connected. Therefore, in the completed light-emitting device, light leakage from the resin layer 141 to the resin layer 142 and light emission from the resin layer 142 due to the light leakage can be prevented, and uniform light emission can be obtained. Can do.

  Further, according to the method for manufacturing the light emitting device of the present embodiment, since the projection 15 is made of the same light-shielding rigid material as the package substrate 11, the thickness of the projection 15 is reduced and the mold 20 is in close contact with the mold 20. In addition, in the completed light emitting device, a high light blocking property against light from the side surface of the resin layer 141 can be obtained.

  4 shows a method of manufacturing the light emitting device 10 having a single LED element shown in FIG. 1, the light emitting device 100 having a plurality of LED elements as shown in FIG. 3 also corresponds to the number of LED elements as a reflector. Produced in the same manner as in the case of a single LED element, except that a base material having a number of openings is prepared and the protrusion 15 is formed by stacking ring-shaped substrates corresponding to each LED element. Can do.

<Second embodiment>
This embodiment is different from the manufacturing method of the first embodiment in that the protrusion provided around the LED element is formed of a white filler-containing resin. A description will be given centering on differences from the first embodiment. The procedure of the manufacturing method of this embodiment is shown in FIGS.

In the present embodiment, the reflector 13 is laminated on the package substrate 11 on which the wiring pattern is formed, thereby producing a laminated substrate 19 (FIG. 5A). Next, the edge part of the opening of the reflector 13 is coated with a white filler-containing resin by a dispensing method to form a dam material (projection) 15 (FIG. 5B). As the resin constituting the dam material, a silicone resin, an epoxy resin, a hybrid resin, or the like can be used, but a silicone resin is most preferable from the viewpoint of having appropriate elasticity and long-term reliability. As the white filler, TiO ₂ , Al ₂ O ₃ , AlN, SiO ₂ , ZnO or the like can be used, and the content is preferably 1 to 40% by weight with respect to the resin.

  The size of the dam material is 0.2 mm or more in width and 0.05 mm or more in height. After the dam material is cured, the LED element 12 is mounted on the substrate 11 (FIG. 5C). After that, the resin is filled and molded by compression molding using the mold 20 to complete the light emitting device as in the first embodiment (FIGS. 5D and 5E). In this embodiment, since the protrusion 15 is made of an elastic white filler-containing resin, even if the thickness of the substrate 11 varies greatly during compression molding, the dam material bends to cause this variation. Is absorbed, and good adhesion to the mold can be achieved. As a result, it is possible to reliably prevent the resin from entering the upper end of the protruding portion 15 to form a resin thin film, and to securely connect the lens-shaped resin layer 141 on the LED element and the peripheral thin-film resin layer 142. Can be separated.

  Also in the present embodiment, light leakage from the resin layer 141 to the resin layer 142 and light emission from the resin layer 142 due to the leakage are prevented, and a light emitting device that emits uniform color can be manufactured. Further, by using an elastic dam material, a relatively wide area can be reliably adhered to the mold, and the resin layer 141 and the resin layer 142 are separated from each other at the time of compression molding, and the resin layer 141 after completion. Therefore, light shielding from the resin layer 142 to the resin layer 142 can be ensured.

<Third embodiment>
This embodiment is different from the manufacturing methods of the first and second embodiments in that the protrusions provided around the LED elements are formed by a white reflector. The manufacturing process of this embodiment is shown in FIGS. 6A to 6D, and the protrusion base material used in the manufacturing process is shown in FIG. FIG. 7A is a top view of the substrate, and FIG. 7B is a side view.

  Also in this embodiment, the production of the laminated substrate 19 by laminating the reflector 13 on the package substrate 11 is the same as in the second embodiment. However, as the protrusion 15, the reflector opening as shown in FIG. A ring-shaped white reflecting plate 150 having an inner diameter matched to the above is used, and this white reflecting plate is bonded onto the reflector 13 with an adhesive. The material of the white reflecting plate may be different from the material of the substrate 11 or the reflector 13, and a ceramic plate, a white filler-containing resin plate, or the like can be used. As the adhesive, an epoxy adhesive or a silicone adhesive can be used. The thickness (width) of the ring portion of the ring-shaped white reflector is 0.1 mm or more, and the height of the ring is 0.05 mm or more. The diameter of the ring is the same as the diameter of the opening of the reflector 13, and the ring is joined to the reflector 13 so as to overlap the edge of the opening.

  Thereafter, mounting the LED element 12 on the substrate 11 and forming the resin layers 141 and 142 by compression molding are the same as in the first and second embodiments.

  According to the manufacturing method of the present embodiment, the same light emitting device as that of the first embodiment can be manufactured more easily. Further, in the first embodiment, when using a ceramic laminate for the production of the multilayer substrate, it is necessary to process the green sheet considering that the green sheet is slightly reduced during firing. In the manufacturing method according to the embodiment, a pre-molded plate material is used, so that there is dimensional stability, and processing or the like in consideration of dimensional change becomes unnecessary.

The second and third embodiments described above can be applied not only to the light emitting device having a single LED element shown in FIG. 1 but also to the light emitting device having a plurality of LED elements as shown in FIG. .
Moreover, in 1st-3rd embodiment, although the case where the process of mounting a LED element was implemented after implementing the process of creating the light-shielding projection part 15 was shown, the projection part 15 is mounted after mounting the LED element. It is also possible to create it.

  In order to demonstrate the effect of the present invention, a light emitting device having a structure shown in FIGS. 8A to 8D was manufactured by a compression molding method, and the occurrence of uneven color was evaluated. In FIG. 8, (a) is the same structure (example) as the light emitting device shown in FIG. 1, and the substrate 11, the reflector 13 and the protrusion 15 are all made of ceramic and manufactured by the manufacturing method of the first embodiment. It is a thing. The reflector 13 had a thickness of 0.15 mm, the protrusion 15 had a width of 0.1 mm, and a height (thickness) of 0.05 mm. (B) is manufactured in the same manner using the same material as the light emitting device shown in (a) except that the protrusion 15 of (a) is not provided (Comparative Example 1). (C) shows a case where a resin layer is formed by compression molding without forming a reflector and a protrusion after mounting an LED element on the substrate 11 (Comparative Example 2), (d) is (c) and In the same manner, the thin resin layer around the lens-shaped resin layer was scraped off by sandblasting (Comparative Example 3).

  In any light-emitting device, the LED element is a face-up type element having a size of 0.3 mm × 0.5 mm and a thickness of 0.12 mm (a semiconductor layer made of a GaN-based material is formed on a transparent substrate made of sapphire). Was used. The convex portions of the resin layer were 0.85 mm in height and 1.5 mm in diameter in Example 1 and Comparative Example 1, and 0.75 mm in height and 1.5 mm in diameter in Comparative Examples 2 and 3.

  The LED element of each light emitting device of the example and the comparative example was supplied with power to emit light, and the color was observed from above. A case where almost no color unevenness was observed was marked with ◯, and a case where the surrounding yellow light and / or blue light emission just above the element was clearly recognized was marked with x. The results are shown in Table 1.

  As can be seen from the results shown in Table 1, the light emitting devices of the examples all exhibited light emission with a uniform color while suppressing uneven color. Further, in the light emitting device of Comparative Example 3, the unevenness of color was improved in the same manner as in the example by scraping the thin film resin layer after manufacturing the light emitting device, but when the resin was peeled off, the convex resin layer (lens portion) ) Also caused problems such as partial peeling.

  According to the present invention, a light emitting device with high yield and no color unevenness is provided.

DESCRIPTION OF SYMBOLS 11 ... Board | substrate, 12 ... LED element, 13 ... Reflector, 14 ... Resin layer, 141 ... Convex resin layer, 142 ... Thin resin layer, 15 ... Protrusion part, 17, 19 ... laminated substrate, 20 ... mold.

Claims (7)

A method of manufacturing a light-emitting device that forms a resin layer that seals the LED element on the substrate by injecting a resin and vacuuming between a substrate on which the LED element is mounted and a mold,
Mounting the LED element on the substrate;
Forming a light-shielding protrusion around the LED element on the substrate on which the LED element is mounted;
Injecting a resin between the substrate and the mold, bringing the mold into contact with the protrusion and forming the resin layer by compression molding;
A method for manufacturing a light-emitting device, comprising: A method of manufacturing a light emitting device according to claim 1,
The step of mounting the LED element on the substrate includes a step of forming a reflector around a region where the LED element of the substrate is mounted to produce a laminated substrate,
The step of forming the protrusion includes forming the protrusion on the reflector. A method of manufacturing a light emitting device according to claim 1 or 2,
The method for manufacturing a light-emitting device, wherein the protrusion is made of the same material as the substrate or the reflector. A method for manufacturing a light emitting device according to claim 3,
The step of forming the protrusion includes a step of bonding a ring-shaped member on the substrate or the laminated substrate. A method of manufacturing a light emitting device according to claim 1 or 2,
The protrusion is made of a material that is elastically deformed by pressure during compression molding. A method for manufacturing a light emitting device according to claim 5,
The protrusion is made of a silicone resin containing a white filler. A substrate, one or more LED elements mounted on the substrate, a reflector provided around the LED element, a convex resin layer covering the LED element, and a thin film covering the reflector A resin layer,
The light emission characterized in that the convex resin layer and the thin resin layer are separated from each other by a light-shielding protrusion formed on the reflector, and no resin layer is present on the protrusion. apparatus.

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