JP2012198974A - Substrate for suspension, suspension, suspension with head, hard disk drive, method for manufacturing substrate for suspension, and method for manufacturing suspension - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for suspension capable of improving workability of connecting the substrate for suspension to an actuator element with conductive adhesive.SOLUTION: A substrate 1 for suspension includes: an insulating layer 10; a metal support layer 11 provided on one surface of the insulating layer 10; and a wiring layer 12 that is provided on the other surface of the insulating layer 10, and has a plurality of wires 13, and wiring connecting section 16 electrically connected to the actuator element via the conductive adhesive. The metal support layer 11 is provided on a connection structure area 3 and has a frame body section including a metal support layer injection hole in which the conductive adhesive is injected. The outer edge of the frame body section of the metal support layer 11 is located inward the outer edge of the insulating layer 10. The substrate further includes an observation hole 30 that penetrates through the insulating layer 10 and allows a person to observe, from the outside, a state of the conductive adhesive when injecting the conductive adhesive in the metal support layer injection hole.

Description

  The present invention relates to a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a method for manufacturing a suspension substrate, and a method for manufacturing a suspension, and in particular, improves connection workability with an actuator element using a conductive adhesive. The present invention relates to a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a suspension substrate manufacturing method, and a suspension manufacturing method.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate includes a metal support layer and a wiring layer having a plurality of wirings stacked on the metal support layer with an insulating layer interposed therebetween. It is designed to write or read data.

  In such a hard disk drive, in order to move the magnetic head slider to a desired data track on the disk, a VCM actuator (for example, a voice coil motor) that rotates an actuator arm that supports the magnetic head slider is used as a servo control system. Is controlled by.

  By the way, in recent years, the track width has been reduced by increasing the density of the disk. For this reason, it may be difficult to accurately align the magnetic head slider to a desired track by the VCM actuator.

  In order to cope with this, a dual actuator type suspension is known in which a VCM actuator and a PZT microactuator (Dual Stage Actuator: DSA) cooperate to move a magnetic head slider to a desired track (for example, , See Patent Document 1). This PZT microactuator is constituted by a piezoelectric element such as a piezoelectric element made of PZT (lead zirconate titanate), and expands and contracts when a voltage is applied to move the magnetic head slider minutely. In such a dual actuator type suspension, the VCM actuator roughly adjusts the position of the magnetic head slider, and the PZT microactuator finely adjusts the position of the magnetic head slider. In this way, the magnetic head slider is aligned with a desired track quickly and accurately.

  In the suspension substrate shown in Patent Document 1, a through-hole is provided in the electrical insulating layer in the terminal portion for supplying power to the piezoelectric element, the wiring portion is exposed, and a ring-like shape is formed on the surface of the electrical insulating layer on the piezoelectric element side. The liquid stop member is provided, and by injecting a liquid conductive adhesive into the liquid stop member, the piezoelectric element is joined to the terminal portion, and the electrode on the suspension substrate side of the piezoelectric element is connected to the wiring portion. It is designed to be electrically connected. The electrode on the opposite side of the piezoelectric element from the suspension substrate is electrically connected to the base plate.

JP 2010-86649 A

  However, when the terminal portion of the suspension substrate and the piezoelectric element are joined using the conductive adhesive, the conductive adhesive is removed through a minute gap existing between the liquid stopper and the piezoelectric element. It is injected toward the inside of the liquid stopper. By the way, since the electrical insulating layer protrudes outward from the liquid stopper, it is difficult to see the outer edge of the liquid stopper from the outside. This makes it difficult to confirm the state of the conductive adhesive between the piezoelectric element and the liquid stopper, and there is a problem in the connection workability with the conductive adhesive. For this reason, it is difficult to inject an appropriate amount of the conductive adhesive, and depending on the injection amount, the conductive adhesive may largely protrude outward from the liquid stopper. Here, when the terminal portion is close to the base plate or the load beam, the conductive adhesive protruding from the liquid stopper member reaches these members, and as a result, the electrodes of the piezoelectric elements are short-circuited. There is a problem.

  Further, when the amount of the conductive adhesive injected is increased, the conductive adhesive spreads on the piezoelectric element, the vibration characteristics as a suspension deteriorates, and further, the amount of the conductive adhesive penetrating into the piezoelectric element increases. There is also a problem that the piezoelectric element deteriorates.

  The present invention has been made in consideration of the above points, and the suspension substrate, the suspension, the suspension with the head, the hard disk drive, and the suspension capable of improving the connection workability with the actuator element by the conductive adhesive. It is an object of the present invention to provide a method for manufacturing an industrial substrate and a method for manufacturing a suspension.

  The present invention relates to a suspension substrate having a connection structure region connectable to an actuator element via a conductive adhesive, an insulating layer, a metal support layer provided on the surface of the insulating layer on the actuator element side, and an insulating layer A wiring layer having a plurality of wirings and a wiring connecting portion electrically connected to the actuator element via a conductive adhesive, and the metal support layer has a connection structure region Provided with a frame portion including a metal support layer injection hole into which a conductive adhesive is injected, and the outer edge of the frame portion of the metal support layer is located inward from the outer edge of the insulating layer. The suspension substrate is provided with an observation hole through which the state of the conductive adhesive can be observed from the outside when the conductive adhesive is injected into the metal support layer injection hole. .

  In the suspension substrate described above, the frame portion of the metal support layer is provided with a frame cutout portion that communicates the metal support layer injection hole to the outside of the frame portion, and the observation hole is formed on the frame cutout portion. It is preferable that it is arranged outward.

  In the suspension substrate described above, the metal support layer includes a second frame body portion including a second metal support layer injection hole that communicates with the metal support layer injection hole of the frame body portion via the frame body cutout portion. Furthermore, it is preferable that the observation hole is disposed at a position corresponding to the second metal support layer injection hole.

  In the suspension substrate described above, it is preferable that a conductive connection portion that penetrates the insulating layer and connects the frame portion of the metal support layer and the wiring connection portion of the wiring layer is provided.

  The suspension substrate described above preferably further includes a protective layer covering the wiring layer, and the observation hole extends through the protective layer.

  Further, in the suspension substrate described above, a through hole is provided through the protective layer and exposing the wiring connection portion of the wiring layer, and gold plating is applied to the exposed portion of the wiring connection portion in this through hole. It is preferable.

  In the suspension substrate described above, the observation hole is preferably disposed at a position corresponding to the metal support layer injection hole of the frame body portion and extends through the wiring connection portion of the wiring layer.

  The suspension substrate described above preferably further includes a protective layer covering the wiring layer, and the observation hole extends through the protective layer.

  In the suspension substrate described above, the wiring connection portion of the wiring layer preferably extends inward of the observation hole from the insulating layer and the protective layer.

  Moreover, in the suspension substrate described above, it is preferable that the exposed portion of the wiring connection portion is subjected to gold plating.

  Further, in the suspension substrate described above, the second observation that allows the state of the conductive adhesive to be observed from the outside when the conductive adhesive is injected into the metal support layer injection hole through the insulating layer and the protective layer. A hole is provided, and a frame body notch for communicating the metal support layer injection hole to the outside of the frame body is provided in the frame of the metal support layer, and the second observation hole is located outside the frame notch. It is preferable that it is arrange | positioned in the direction.

  In the suspension substrate described above, it is preferable that the observation hole has a wiring layer observation hole penetrating the wiring connection portion of the wiring layer, and a plurality of wiring layer observation holes are provided.

  Further, in the suspension substrate described above, in the suspension substrate having a connection structure region connectable to the actuator element via the conductive adhesive, the insulating layer and the metal support provided on the surface of the insulating layer on the actuator element side A metal support layer comprising a layer, a wiring layer provided on the other surface of the insulating layer, and having a plurality of wirings and a wiring connection portion electrically connected to the actuator element via a conductive adhesive In addition, a metal support layer cutout portion is provided in the metal support layer to cut out a portion of the connection structure region, and when the conductive adhesive is injected into the wire connection portion between the wire connection portion and the actuator element, the conductive support layer is electrically conductive. It is preferable that an observation hole capable of observing the state of the adhesive from the outside is provided.

  In the suspension substrate described above, it is preferable that an observation hole extends in the insulating layer in the connection structure region.

  In the suspension substrate described above, the wiring connection portion of the wiring layer preferably extends inward of the observation hole from the insulating layer.

  Moreover, the suspension substrate described above preferably further includes a protective layer that covers the wiring layer, and the protective layer is provided with a protective layer cutout portion that cuts out a portion of the connection structure region of the protective layer.

  The suspension substrate described above preferably further includes a protective layer covering the wiring layer, the protective layer covers at least a part of the wiring connection portion, and the observation hole extends through the protective layer. .

  Further, in the suspension substrate described above, the insulating layer is provided with an insulating layer cutout portion that cuts out a portion of the connection structure region of the insulating layer, and the protective layer is provided with a protection cut out of the connection structure region portion of the protective layer. A layer notch is preferably provided.

  In the suspension substrate described above, it is preferable that the observation hole has a wiring layer observation hole penetrating the wiring connection portion of the wiring layer, and a plurality of wiring layer observation holes are provided.

  The present invention provides a base plate, the above-described suspension substrate attached to the base plate via a load beam, and the conductive adhesive in the connection structure region of the suspension substrate while being bonded to at least one of the base plate and the load beam. And an actuator element connected to each other through the suspension.

  The present invention provides a base plate, the above-described suspension substrate attached to the base plate via a load beam, and the conductive adhesive in the connection structure region of the suspension substrate while being bonded to at least one of the base plate and the load beam. And an actuator element connected to each other, wherein the conductive adhesive is injected to a portion of the protective layer in the observation hole.

  In the suspension described above, it is preferable that a portion of the observation hole where the conductive adhesive is exposed is covered with a covering member.

  The present invention relates to a suspension substrate having a connection structure region connectable to an actuator element via a conductive adhesive, an insulating layer, a metal support layer provided on the surface of the insulating layer on the actuator element side, and an insulating layer A wiring layer having a plurality of wirings and a wiring connection part provided in the connection structure region and electrically connected to the actuator element via a conductive adhesive, Provided is a suspension substrate characterized in that a wiring layer through-hole into which a conductive adhesive is injected is provided in a wiring connection portion.

  In the suspension substrate described above, it is preferable that the insulating layer is provided with an insulating layer through-hole that communicates with the wiring layer through-hole and into which a conductive adhesive is injected.

  In the suspension substrate described above, the metal support layer is preferably provided with a metal support layer through-hole that communicates with the wiring layer through-hole and the insulating layer through-hole and into which the conductive adhesive is injected.

  In the suspension substrate described above, it is preferable that the outer edge of the wiring layer through hole is located inward from the outer edge of the insulating layer through hole and the outer edge of the metal support layer through hole.

  In the suspension substrate described above, the metal support layer is provided in the connection structure region, and has a frame body portion that forms the metal support layer through-hole therein, and the outer edge of the frame body portion is the outer edge of the insulating layer. It is preferable to be located outward.

  Further, in the suspension substrate described above, it is preferable that the frame body portion is provided with a communication cutout portion that communicates the metal support layer through hole to the outside of the frame body portion.

  In the suspension substrate described above, it is preferable that the insulating layer is provided with a second communication cutout portion that corresponds to the communication cutout portion and communicates the insulating layer through hole to the outside of the insulation layer.

  In the suspension substrate described above, the surface of the insulating layer on the actuator element side is preferably exposed in the connection structure region.

  In the suspension substrate described above, it is preferable that the outer edge of the wiring layer through hole is located inward from the outer edge of the insulating layer through hole.

  In the suspension substrate described above, the surface of the insulating layer opposite to the actuator element is preferably exposed in the connection structure region.

  Further, the suspension substrate described above further includes a protective layer provided in the insulating layer and covering each wiring of the wiring layer. In the connection structure region, the protective layer is provided with a protective layer through hole communicating with the wiring layer through hole. It is preferable that

  In the suspension substrate described above, it is preferable that the entire wiring connection portion is exposed.

  As another solution, the present invention provides a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive, provided on the insulating layer and the surface of the insulating layer on the actuator element side. A metal support layer, a plurality of wires provided on the other surface of the insulating layer, and a wiring connection portion provided in the connection structure region and electrically connected to the actuator element via a conductive adhesive. An insulating layer through-hole penetrating the insulating layer is provided in the insulating layer, the wiring connecting portion enters the insulating layer through-hole, and the surface of the wiring connecting portion on the actuator element side is The suspension is characterized in that a roughened surface of the wiring connection portion is provided with a plating layer having a roughened surface corresponding to the roughening of the wiring connection portion. Providing substrate for To.

  In the suspension substrate according to the other solution described above, the insulating layer is preferably provided with an insulating layer opening that opens to the actuator element side and communicates with the metal support layer through hole.

  The present invention provides a base plate, the above-described suspension substrate attached to the base plate via a load beam, and the conductive adhesive in the connection structure region of the suspension substrate while being bonded to at least one of the base plate and the load beam. And an actuator element connected to each other through the suspension.

  In the suspension described above, it is preferable that the conductive adhesive protrudes from the wiring layer through hole.

  In the suspension described above, it is preferable that a portion of the conductive adhesive protruding from the wiring layer through hole is covered with a covering member.

  The present invention provides a suspension with a head including the above-described suspension and a slider mounted on the suspension.

  The present invention provides a hard disk drive having the above-described suspension with a head.

  The present invention relates to a method for manufacturing a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive, and has an insulating layer and conductivity provided on the surface of the insulating layer on the actuator element side. A step of preparing a laminate having a metal support layer and a wiring layer provided on the other surface of the insulating layer; and a plurality of wirings and an actuator element electrically connected to the actuator element via a conductive adhesive. A step of forming a wiring connection portion to be connected; a step of forming a metal support layer injection hole into which a conductive adhesive is injected in the metal support layer; and a metal support layer penetrating the insulating layer in the insulating layer. A step of forming an insulating layer observation hole capable of observing the state of the conductive adhesive from the outside when injecting the conductive adhesive into the injection hole, and the outer edge of the metal support layer inward from the outer edge of the insulating layer. To position Together provide a step of forming a frame portion including the formed metal support layer injection hole, a manufacturing method of a substrate for suspension, characterized in that it comprises a.

  In the above-described suspension board manufacturing method, when forming a plurality of wirings and wiring connection portions in the wiring layer, wiring connection is made at a position corresponding to the metal support layer injection hole of the frame body portion of the wiring connection portions. A wiring layer observation hole penetrating through the portion is formed, and when the insulating layer observation hole is formed in the insulating layer, the insulating layer observation hole is disposed at a position where the metal support layer injection hole and the wiring layer observation hole communicate with each other. Is preferred.

  The above-described suspension substrate manufacturing method further includes a step of forming a protective layer covering the wiring layer, and when forming the protective layer, a protective layer observation hole penetrating the protective layer is formed, and the protective layer observation hole is formed. It is preferable that the insulating layer observation holes communicate with each other.

  The present invention relates to a method for manufacturing a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive, and has an insulating layer and conductivity provided on the surface of the insulating layer on the actuator element side. A step of preparing a laminate having a metal support layer and a wiring layer provided on the other surface of the insulating layer; and a plurality of wirings and an actuator element electrically connected to the actuator element via a conductive adhesive. Forming a wiring connection portion, and forming a wiring connection portion on the metal support layer, and forming a metal support layer cutout portion in the metal support layer by cutting out a portion of the connection structure region. In this case, when the conductive adhesive is injected between the wiring connection portion and the actuator element, the suspension layer is characterized in that a wiring layer observation hole is formed through which the state of the conductive adhesive can be observed from the outside. To provide a method for manufacturing a down substrate.

  In the above method for manufacturing a suspension substrate, it is preferable that the insulating layer further includes a step of forming an insulating layer observation hole that penetrates the insulating layer and communicates with the wiring layer observation hole.

  The suspension board manufacturing method described above further includes a step of forming a protective layer that covers the wiring layer. When forming the protective layer, the protective layer covers at least a part of the wiring connection portion. Further, it is preferable that a protective layer observation hole that penetrates the protective layer and communicates with the insulating layer observation hole is formed.

  The present invention relates to a suspension manufacturing method including an actuator element and a suspension substrate including a connection structure region connectable to the actuator element via a conductive adhesive. The suspension substrate is manufactured by the above-described suspension substrate manufacturing method. A step of attaching the suspension substrate to the base plate via the load beam, a step of bonding the actuator element to at least one of the base plate and the load beam using an adhesive, A step of injecting a conductive adhesive into the metal support layer injection hole to connect the actuator element to the connection structure region, and connecting the actuator element to the connection structure region through the observation hole of the suspension substrate While checking the state of the conductive adhesive, Conductive adhesive into the hole to provide a manufacturing method of a suspension characterized in that it is injected.

  The present invention relates to a suspension manufacturing method including an actuator element and a suspension substrate including a connection structure region connectable to the actuator element via a conductive adhesive. The suspension substrate is manufactured by the above-described suspension substrate manufacturing method. A step of attaching the suspension substrate to the base plate via the load beam, a step of bonding the actuator element to at least one of the base plate and the load beam using an adhesive, and a conductive adhesive. A step of connecting the actuator element to the connection structure region using the insulating layer observation hole, the wiring layer observation hole, and the protective layer observation hole of the suspension substrate when connecting the actuator element to the connection structure region. While checking the state of the conductive adhesive. Conductive adhesive to the layer observation hole to provide a manufacturing method of a suspension characterized in that it is injected.

  The present invention relates to a suspension manufacturing method including an actuator element and a suspension substrate including a connection structure region connectable to the actuator element via a conductive adhesive. A metal support layer provided on the surface, a wiring connection provided on the other surface of the insulating layer, a plurality of wires, and a wiring connection provided in the connection structure region and electrically connected to the actuator element via a conductive adhesive A suspension layer provided with a wiring layer through-hole into which a conductive adhesive is injected at a wiring connection portion, and a base plate via a load beam. The step of attaching the suspension substrate and the actuator element are made of at least one of the base plate and the load beam using an adhesive. And connecting the actuator element to the connection structure region by injecting a conductive adhesive into the wiring layer through-hole provided in the wiring connection portion, and connecting the actuator element to the connection structure region. In this step, the conductive adhesive is injected until it protrudes from the wiring layer through hole.

  According to the present invention, when the conductive adhesive is injected into the metal support layer injection hole, the state of the conductive adhesive can be observed from the outside through the observation hole provided in the insulating layer. Thereby, the connection workability of the suspension substrate and the actuator element by the conductive adhesive can be improved, and the amount of the conductive adhesive injected can be adjusted to an appropriate amount. For this reason, it is possible to prevent the conductive adhesive from protruding greatly from the frame body and reach other metal structures existing around the connection structure region, and prevent a short circuit between the electrodes of the actuator element. can do. Further, it is possible to prevent deterioration of the vibration characteristics as the suspension and deterioration of the actuator element.

  According to the present invention, the wiring layer through hole into which the conductive adhesive is injected is provided in the wiring connection portion connected to the actuator element via the conductive adhesive. As a result, the contact area between the conductive adhesive and the wiring connection portion can be increased, and the conduction resistance between the conductive adhesive and the wiring connection portion can be reduced. In addition, the conductive adhesive can be injected into the wiring layer through-hole, so that the anchor effect can be exhibited and the adhesiveness between the conductive adhesive and the wiring connection portion can be improved. For this reason, electroconductivity and adhesiveness with the electroconductive adhesive agent for connecting an actuator element can be improved.

FIG. 1 is a plan view showing an example of a suspension substrate according to the first embodiment of the present invention. FIG. 2A is a back view showing a connection structure region in the suspension substrate according to the first embodiment of the present invention. FIG.2 (b) is a figure which shows the cross section. FIG. 3 is a plan view showing an example of a suspension according to the first embodiment of the present invention. FIG. 4 is a perspective view showing an example of a piezo element in the suspension according to the first embodiment of the present invention. FIG. 5 is a back view showing an example of a suspension in the first embodiment of the present invention. FIG. 6 is a view showing a cross section of a connection structure region in the suspension according to the first embodiment of the present invention. FIG. 7 is a plan view showing an example of a suspension with a head according to the first embodiment of the present invention. FIG. 8 is a perspective view showing an example of the hard disk drive according to the first embodiment of the present invention. FIGS. 9A to 9F are views showing a method for manufacturing a suspension substrate in the first embodiment of the present invention. FIG. 10 is a flowchart of the suspension manufacturing method according to the first embodiment of the present invention. FIG. 11 is a diagram showing a modification of the cross section of the connection structure region in the suspension substrate according to the first embodiment of the present invention. FIG. 12 is a diagram showing another modification of the cross section of the connection structure region in the suspension substrate according to the first embodiment of the present invention. FIG. 13A is a rear view showing a connection structure region in the suspension substrate according to the second embodiment of the present invention. FIG. 13B is a diagram showing a cross section thereof. FIG. 14 is a view showing a cross section of a connection structure region in a suspension according to a second embodiment of the present invention. FIG. 15A is a back view showing a connection structure region in the suspension substrate according to the third embodiment of the present invention. FIG.15 (b) is a figure which shows the cross section. FIG. 16 is a diagram showing a cross section of a connection structure region in a suspension according to a third embodiment of the present invention. FIG. 17 is a diagram showing a cross section of a connection structure region in a suspension according to a fourth embodiment of the present invention. FIG. 18 is a view showing a modification of the cross section of the connection structure region in the suspension according to the fourth embodiment of the present invention. FIG. 19 is a back view showing a connection structure region in a suspension substrate according to a fifth embodiment of the present invention. FIG. 20 is a diagram showing a cross section of a connection structure region in a suspension according to a fifth embodiment of the present invention. FIG. 21A is a diagram showing a modification of the cross section of the connection structure region in the suspension according to the fifth embodiment of the present invention. FIG. 21B is a diagram showing another modification of the connection structure region. FIGS. 22A to 22C are plan views showing connection structure regions in a suspension board according to a sixth embodiment of the present invention. FIG. 23 is a plan view showing an example of a suspension substrate according to the seventh embodiment of the present invention. FIG. 24 is a plan view showing a connection structure region in the suspension substrate according to the seventh embodiment of the present invention. 25 is a view showing a cross section taken along line AA of FIG. FIG. 26 is a plan view showing an example of a suspension according to a seventh embodiment of the present invention. FIG. 27 is a perspective view showing an example of a piezoelectric element in a suspension according to a seventh embodiment of the present invention. FIG. 28 is a diagram showing a cross section of a connection structure region in a suspension according to a seventh embodiment of the present invention. FIG. 29 is a plan view showing an example of a suspension with a head according to a seventh embodiment of the present invention. 30 (a) to 30 (e) are views showing a method for manufacturing a suspension substrate in the seventh embodiment of the present invention. FIG. 31 is a view showing a modification of the cross section of the connection structure region in the suspension according to the seventh embodiment of the present invention. FIG. 32 is a view showing a modification of the cross section of the connection structure region in the suspension substrate according to the seventh embodiment of the present invention. FIG. 33 is a view showing another modification of the cross section of the connection structure region in the suspension substrate according to the seventh embodiment of the present invention. FIG. 34 (a) is a diagram showing another modification of the cross section of the connection structure region in the suspension substrate according to the seventh embodiment of the present invention, and FIG. 34 (b) is shown in FIG. 34 (a). The figure which shows the cross section of the connection structure area | region in the suspension using the board | substrate for suspensions. FIGS. 35A to 35C are plan views showing connection structure regions in the suspension board manufacturing method according to the eighth embodiment of the present invention. FIGS. FIG. 36 is a plan view showing a connection structure region in the suspension substrate according to the ninth embodiment of the present invention. FIG. 37 is a view showing a cross section taken along line B-B in FIG. 36. FIG. 38 is a diagram showing a cross section of a connection structure region in a suspension according to a ninth embodiment of the present invention. FIG. 39 is a diagram showing a cross section of the connection structure region in the suspension substrate according to the tenth embodiment of the present invention. FIGS. 40A to 40H are views showing a method for manufacturing a suspension substrate in the tenth embodiment of the present invention. FIG. 41 is a diagram showing a modification of the cross section of the connection structure region in the suspension substrate according to the tenth embodiment of the present invention. FIG. 42 is a diagram showing a cross section of a connection structure region in a suspension according to an eleventh embodiment of the present invention. FIG. 43 is a plan view showing a modification of the suspension substrate in the embodiment of the present invention.

First Embodiment A suspension substrate, a suspension, a suspension with a head, and a hard disk drive according to a first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the suspension substrate 1 includes a substrate body region 2 in which wirings 13 to be described later extend and a connection structure region 3 that can be connected to a piezoelectric element (actuator element, see FIG. 3) 44 to be described later. Have. Among these, the substrate body region 2 is provided with a head terminal 5 connected to a slider 52 (see FIG. 7) described later and an external device connection terminal 6 connected to an external device (not shown). A wiring 13 described later is connected between the external device connection terminal 6 and the external device connection terminal 6.

As shown in FIG. 1 and FIGS. 2A and 2B, the suspension substrate 1 includes a metal support provided on the insulating layer 10 and the surface (one surface) of the insulating layer 10 on the piezoelectric element 44 side. A layer 11 and a wiring layer 12 having a plurality of wirings 13 provided on the other surface of the insulating layer 10 are provided.
Among these, the wiring layer 12 has the wiring connection part 16 which is arrange | positioned in the connection structure area | region 3 and is electrically connected to the piezo element 44 via a conductive adhesive (for example, silver paste). The wiring connection portion 16 is made of the same material as each wiring 13. In addition, one of the plurality of wirings 13 extends from the external device connection terminal 6 to the connection structure region 3 and is electrically connected to the piezo element 44 via the wiring connection portion 16.

  Although not shown, a seed layer made of nickel (Ni), chromium (Cr), or copper (Cu) and having a thickness of about 300 nm is interposed between the insulating layer 10 and the wiring layer 12. As a result, the adhesion between the insulating layer 10 and the wiring layer 12 can be improved.

  As shown in FIGS. 1 and 2 (a) and 2 (b), the metal support layer 11 is provided in the connection structure region 3 and includes a metal support layer injection hole 32 into which a conductive adhesive is injected. 17. The frame body portion 17 is formed in a ring shape, and the outer edge 17 a of the frame body portion 17 is located inward from the outer edge 10 a of the insulating layer 10. Further, the frame body portion 17 is provided with a frame body notch portion 18 that allows the metal support layer injection hole 32 to communicate with the outside of the frame body portion 17. The frame portion 17 of the metal support layer 11 is separated from the portion of the metal support layer 11 in the substrate body region 2.

  An insulating layer injection hole 33 penetrating the insulating layer 10 is provided at a position corresponding to the metal support layer injection hole 32 of the insulating layer 10. In this way, the wiring connection portion 16 of the wiring layer 12 is exposed to the metal support layer 11 side.

  In the insulating layer injection hole 33, the wiring connection portion 16 of the wiring layer 12 is exposed to the metal support layer 11 side, and nickel (Ni) plating and gold (Au) plating are sequentially applied to the exposed portion. Thus, the injection hole plating layer 15 is formed. This prevents the exposed portion of the wiring connection portion 16 of the wiring layer 12 from being corroded. The thickness of the injection hole plating layer 15 is preferably 0.1 μm to 4.0 μm.

  As shown in FIG. 2B, a protective layer 20 that covers the wiring layer 12 is provided on the insulating layer 10. In FIG. 1, the protective layer 20 is omitted for the sake of clarity.

  When the conductive adhesive is injected into the metal support layer injection hole 32 so as to extend through the insulating layer 10 and the protective layer 20, the piezoelectric element 44 and the frame body portion 17 of the metal support layer 11 An observation hole 30 is provided through which the state of the conductive adhesive can be observed from the outside. As shown in FIG. 2A, the observation hole 30 is disposed outside the frame body cutout portion 18 provided in the frame body portion 17. The observation hole 30 is formed in a crescent shape that is concentric with the ring-shaped frame body portion 17, and is formed in the insulating layer observation hole 30 a formed in the insulating layer 10 and the protective layer 20. The protective layer observation hole 30b communicates with the insulating layer observation hole 30a.

  In addition, as shown in FIG. 1, two jig holes 25 are provided in the substrate body region 2 so as to penetrate the metal support layer 11 and the insulating layer 10 and perform alignment with a load beam 43 described later. ing.

  Next, each component will be described in detail.

  The material of the insulating layer 10 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of the insulating layer 10 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 10 is preferably 5 μm to 30 μm, particularly 8 μm to 10 μm. As a result, it is possible to ensure the insulation performance between the metal support layer 11 and each wiring 13 and to prevent the rigidity of the suspension substrate 1 as a whole from being lost.

  Each wiring 13 is configured as a conductor for transmitting an electrical signal, and the material of each wiring 13 is not particularly limited as long as it has a desired conductivity, but copper (Cu) Is preferably used. In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 13 is, for example, 1 μm to 18 μm, particularly 9 μm to 12 μm. As a result, it is possible to ensure the transmission characteristics of each wiring 13 and to prevent the flexibility of the suspension substrate 1 as a whole from being lost. The wiring connection portion 16 is made of the same material and the same thickness as the wirings 13.

  The material of the metal support layer 11 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. The thickness of the metal support layer 11 is preferably 10 μm to 30 μm, more preferably 15 μm to 20 μm. As a result, the conductivity, rigidity, and elasticity of the metal support layer 11 can be ensured.

  As a material of the protective layer 20, it is preferable to use a resin material such as polyimide. The material of the protective layer 20 can be a photosensitive material or a non-photosensitive material.

  Next, the suspension 41 in the present embodiment will be described with reference to FIGS. The suspension 41 shown in FIG. 3 is attached to the base plate 42, the load beam 43 that holds the metal support layer 11 of the suspension substrate 1, the suspension substrate 1, the base plate 42, and the load beam 43. And a piezo element 44 connected to the connection structure region 3 of the suspension substrate 1. In the present embodiment, the piezo element 44 is joined to the base plate 42. The base plate 42 and the load beam 43 are made of stainless steel. Of these, the base plate 42 has an opening 42a for accommodating the piezo element 44 and a pair of flexible portions 42b.

  The piezo element 44 is configured as a piezoelectric element that expands and contracts when a voltage is applied. As shown in FIG. 4, the piezo element 44 includes a first electrode 44a and a second electrode 44b that are separated from each other, a single shared electrode 44c that faces the first electrode 44a and the second electrode 44b, and a first electrode 44a. A first piezoelectric material portion 44d interposed between the second electrode 44b and the shared electrode 44c, and a second piezoelectric material portion 44e interposed between the second electrode 44b and the shared electrode 44c. Of these, the first piezoelectric material portion 44d is deformed according to the voltage applied between the first electrode 44a and the shared electrode 44c, and the second piezoelectric material portion 44e is formed between the second electrode 44b and the shared electrode 44c. It is deformed according to the voltage applied between them. The first piezoelectric material portion 44d and the second piezoelectric material portion 44e are made of, for example, piezoelectric ceramics such as PZT (lead zirconate titanate), and are formed to have polarization directions different from each other by 180 °. When one of the first electrode 44a, the second electrode 44b, and the shared electrode 44c is grounded and a predetermined voltage is applied to the other, one of the first piezoelectric material portion 44d and the second piezoelectric material portion 44e contracts. At the same time, the other extends. Accordingly, the piezo element 44 is distorted into a substantially trapezoidal shape as a whole, and the slider 52 is moved via the load beam 43.

  As shown in FIGS. 3 and 5, the piezo element 44 is accommodated in the opening 42a of the base plate 42 and joined to the base plate 42 by a non-conductive adhesive.

  As shown in FIG. 5, the first electrode 44a and the second electrode 44b on one side of the piezo element 44 (on the side opposite to the suspension substrate 1) are connected via a first conductive adhesive portion 45 made of a conductive adhesive. The base plate 42 is electrically connected to each other.

  On the other hand, the shared electrode 44c on the other side of the piezo element 44 (on the suspension substrate 1 side) is joined and electrically connected to the connection structure region 3 using a conductive adhesive. That is, as shown in FIG. 6, a second conductive adhesive portion 48 made of a conductive adhesive is formed in the insulating layer injection hole 33 and the metal support layer injection hole 32 in the connection structure region 3, and the piezo element 44 is It is joined to the connection structure region 3 via the second conductive adhesive portion 48, and the shared electrode 44 c of the piezo element 44 is connected to the wiring connection portion 16 of the wiring layer 12 via the second conductive adhesive portion 48. Electrically connected. Further, the second conductive adhesive portion 48 extends into a minute gap formed between the frame body portion 17 of the metal support layer 11 and the piezo element 44, and the frame body notch portion provided in the frame body portion 17. 18 extends below the observation hole 30.

  The load beam 43 is provided with a beam jig hole 47 corresponding to each jig hole 25 of the suspension substrate 1, and is loaded on the metal support layer 11 in the substrate body region 2 of the suspension substrate 1. When the beam 43 is mounted, the suspension substrate 1 and the load beam 43 can be aligned.

  Next, referring to FIG. 7, the suspension with head 51 in the present embodiment will be described. A suspension 51 with a head shown in FIG. 7 includes the suspension 41 described above and a slider 52 connected to the head terminal 5 of the suspension substrate 1.

  Next, the hard disk drive 61 in the present embodiment will be described with reference to FIG. A hard disk drive 61 shown in FIG. 8 is provided with a case 62, a disk 63 that is rotatably attached to the case 62, stores data, a spindle motor 64 that rotates the disk 63, and a desired flying height on the disk 63. And a suspension 51 with a head including a slider 52 for writing and reading data to and from the disk 63. Of these, the suspension with head 51 is movably attached to the case 62, and the voice coil motor 65 for moving the slider 52 of the suspension with head 51 along the disk 63 is attached to the case 62. . The head suspension 51 is attached to the voice coil motor 65 via an arm 66.

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the suspension substrate 1 according to the present embodiment will be described. Here, as an example, a method of manufacturing the suspension substrate 1 (in particular, the connection structure region 3) by the subtractive method will be described.

  First, a laminated body 35 having an insulating layer 10, a metal support layer 11 provided on one surface of the insulating layer 10, and a wiring layer 12 provided on the other surface of the insulating layer 10 is prepared (FIG. 9). (See (a)).

  In this case, first, the metal support layer 11 is prepared, and the insulating layer 10 is formed on the metal support layer 11 by a coating method using non-photosensitive polyimide. Subsequently, nickel, chromium, and copper are sequentially coated on the insulating layer 10 by a sputtering method to form a seed layer (not shown). Thereafter, the wiring layer 12 is formed by copper plating using the seed layer as a conductive medium. In this way, a stacked body 35 having the insulating layer 10, the metal support layer 11, and the wiring layer 12 is obtained.

  Next, a plurality of wirings 13 and wiring connection portions 16 are formed in the wiring layer 12, and a metal support layer injection hole 32 and a frame notch portion 18 are formed in the metal support layer 11 (FIG. 9). (See (b)). In this case, first, a patterned resist (not shown) is formed on the upper surface of the wiring layer 12 and the lower surface of the metal support layer 11 by a photofabrication method using a dry film. Here, in the wiring layer 12, a plurality of wirings 13 and wiring connection portions 16 are formed, and a patterned resist is formed so that the metal support layer injection holes 32 and the frame notches 18 are formed in the metal support layer 11. It is formed. Next, portions of the wiring layer 12 and the metal support layer 11 exposed from the resist are etched. Here, the method of etching the wiring layer 12 and the metal support layer 11 is not particularly limited, but it is preferable to perform wet etching. In particular, the etching solution is preferably selected as appropriate according to the type of material of the metal support layer 11. For example, when the metal support layer 11 is made of stainless steel, an iron chloride-based etching solution such as an aqueous ferric chloride solution is used. A liquid can be used. After the etching is performed, the resist is peeled off.

  Next, a protective layer 20 is provided on the insulating layer 10 to cover each wiring 13 and the wiring connection portion 16 of the wiring layer 12, and a protective layer observation hole 30b is formed in the protective layer 20 (FIG. 9C). reference). In this case, first, non-photosensitive polyimide is coated on the insulating layer 10 using a die coater. Subsequently, the coated non-photosensitive polyimide is dried to form the protective layer 20. Next, a patterned resist (not shown) is formed on the formed protective layer 20 so as to form the protective layer observation hole 30b. Subsequently, the protective layer 20 is developed and etched, and the etched protective layer 20 is cured to obtain the protective layer 20 having a desired shape. Thereafter, the resist is peeled off.

  Next, in the insulating layer 10, an insulating layer observation hole 30a and an insulating layer injection hole 33 penetrating the insulating layer 10 are formed, and the outer shape is processed into a desired shape (see FIG. 9D). In this case, first, a patterned resist is formed on the insulating layer 10, and a portion of the insulating layer 10 exposed from the resist is etched, so that the insulating layer 10 has an insulating layer observation hole 30 a and an insulating layer injection hole 33. Is formed, and the insulating layer 10 is trimmed. Here, the method of etching the insulating layer 10 is not particularly limited, but it is preferable to perform wet etching. In particular, the etching solution is preferably selected as appropriate according to the type of material of the insulating layer 10. For example, when the insulating layer 10 is made of a polyimide resin, an alkaline etching solution such as an organic alkali etching solution is used. be able to. After the etching is performed, the resist is peeled off.

  Next, gold plating is performed on a portion of the wiring connection portion 16 of the wiring layer 12 exposed in the insulating layer injection hole 33 (see FIG. 9E). That is, the exposed portion of the wiring connection portion 16 is subjected to acid cleaning, nickel plating and gold plating are sequentially performed by an electrolytic plating method, and the injection hole plating layer 15 having a thickness of 0.1 μm to 4.0 μm. Is formed. In this case, the head terminal 5 connected to the slider 52 and the external device connection terminal 6 are similarly plated. In addition, as a method for performing plating, a jig plating method may be used instead of the electrolytic plating method. Further, the type of plating is not limited to nickel plating and gold plating, but may be silver (Ag) plating or copper (Cu) plating.

Thereafter, the frame portion 17 is formed in the metal support layer 11, and the outer shape of the metal support layer 11 is processed into a desired shape (see FIG. 9F). In this case, first, a patterned resist (not shown) is formed on the lower surface of the metal support layer 11 using a dry film.
Here, in the metal support layer 11, a patterned resist is formed so as to form the frame body portion 17. Next, a portion of the metal support layer 11 exposed from the resist is etched with an iron chloride-based etchant or the like to form the frame body portion 17 and the metal support layer 11 is trimmed. In this case, the frame body portion 17 is separated from the portion of the metal support layer 11 in the substrate main body region 2. Thereafter, the resist is peeled off.

  In this way, the suspension substrate 1 is obtained.

  Next, a suspension manufacturing method according to the present embodiment will be described with reference to FIG.

  First, the base plate 42 and the load beam 43 are prepared, and the suspension substrate 1 is prepared as described above.

  Next, as shown in FIG. 10, the suspension substrate 1 is attached to the base plate 42 via the load beam 43 by welding. In this case, first, the load beam 43 is fixed to the base plate 42 by welding. Subsequently, the load beam 43 is provided by the beam jig hole 47 provided in the load beam 43 and the jig hole 25 provided in the suspension substrate 1. The alignment of the beam 43 and the suspension substrate 1 is performed. Thereafter, the load beam 43 and the suspension substrate 1 are joined and fixed together by welding.

  Next, the piezo element 44 is aligned with the suspension substrate 1 and accommodated in the opening 42a of the base plate 42, and is bonded to the base plate 42 using an adhesive, and the connection structure region of the suspension substrate 1 3 is connected. That is, the piezo element 44 is joined to the base plate 42 using a non-conductive adhesive, and a first conductive adhesive portion 45 made of a conductive adhesive is formed, so that the first electrode 44a of the piezo element 44 and The second electrodes 44b are electrically connected to the base plate 42 via the first conductive adhesive portions 45, respectively.

  Further, the shared electrode 44c of the piezo element 44 is joined and electrically connected to the connection structure region 3 of the suspension substrate 1 using a conductive adhesive. In this case, the conductive adhesive is injected into the insulating layer injection hole 33 and the metal support layer injection hole 32 from the gap between the frame portion 17 of the metal support layer 11 and the shared electrode 44c of the piezo element 44, and the second The conductive bonding portion 48 is formed. In this way, the piezo element 44 is joined to the connection structure region 3 of the suspension substrate 1, and the shared electrode 44 c of the piezo element 44 is electrically connected to the wiring connection portion 16 of the wiring layer 12. At this time, the conductive adhesive is also filled in the gap between the metal support layer 11 and the piezo element 44 (see FIG. 6).

  When injecting the conductive adhesive, as shown in FIG. 6, the state of the conductive adhesive between the piezo element 44 and the frame body portion 17 is changed through the observation hole 30 provided in the suspension substrate 1. Can be confirmed. Thus, the conductive adhesive can be injected while observing the state in which the conductive adhesive protrudes from the frame notch 18 provided in the frame 17 of the metal support layer 11. For this reason, the injection amount of the conductive adhesive can be adjusted to an appropriate amount, and the conductive adhesive can be prevented from greatly protruding from the frame body portion 17.

  In this way, the suspension 41 including the piezo element 44 connected to the connection structure region 3 of the suspension substrate 1 is obtained.

  A slider 52 is connected to the head terminal 5 of the suspension 41 to obtain a suspension 51 with a head shown in FIG. Further, the suspension 51 with the head is attached to the case 62 of the hard disk drive 61 to obtain the hard disk drive 61 shown in FIG.

  When data is written and read in the hard disk drive 61 shown in FIG. 8, the slider 52 of the suspension 51 with the head is moved along the disk 63 by the voice coil motor 65, and the disk 63 rotated by the spindle motor 64 is moved. Keep close to the desired flying height. As a result, data is exchanged between the slider 52 and the disk 63. During this time, an electrical signal is transmitted through each wiring 13 extending between the head terminal 5 of the suspension substrate 1 and the external device connection terminal 6.

  When moving the slider 52, the voice coil motor 65 roughly adjusts the position of the slider 52, and the piezo element 44 finely adjusts the position of the slider 52. That is, by applying a predetermined voltage to the first electrode 44 a and the second electrode 44 b of the piezo element 44 on the connection structure region 3 side of the suspension substrate 1, one piezoelectric material portion of the piezo element 44 becomes the load beam 43. And the other piezoelectric material portion expands. In this case, the flexible portion 42b of the base plate 42 is elastically deformed, and the slider 52 located on the distal end side of the load beam 43 can move in the sway direction (turning direction). In this way, the slider 52 can be quickly and accurately aligned with a desired track of the disk 63.

  As described above, according to the present embodiment, when the conductive adhesive is injected into the metal support layer injection hole 32, the conductive adhesive between the piezo element 44 and the frame body portion 17 of the metal support layer 11 is removed. The state can be observed from the outside through the observation hole 30 provided in the insulating layer 10. Thereby, the connection workability of the suspension substrate 1 and the piezo element 44 by the conductive adhesive can be improved, and the amount of the conductive adhesive injected can be adjusted to an appropriate amount. For this reason, it is possible to prevent the conductive adhesive from greatly protruding from the frame body portion 17 and reaching other metal structures (for example, the base plate 42) existing around the connection structure region 3. As a result, the first electrode 44a and the second electrode 44b of the piezo element 44 and the shared electrode 44c can be prevented from being short-circuited by the conductive adhesive.

  In addition, according to the present embodiment, the amount of conductive adhesive injected through the observation hole 30 can be adjusted to an appropriate amount, so that the amount of conductive adhesive spreading on the piezo element 44 is suppressed. Can do. Further, since the conductive adhesive protrudes outward from the frame body portion 17 through the frame body cutout portion 18 provided in the frame body portion 17, the conductive adhesive is restricted in the protruding direction, and the conductive adhesive The adhesive can be protruded in a desired direction. For this reason, it is possible to prevent the vibration characteristics of the suspension 41 from deteriorating.

  Furthermore, according to the present embodiment, as described above, since the amount of the conductive adhesive spreading on the piezo element 44 can be suppressed, the conductive adhesion to the piezoelectric material portions 44d and 44e of the piezo element 44 is possible. The amount of penetration of the agent can be suppressed, and deterioration of the materials constituting the piezoelectric material portions 44d and 44e can be prevented.

  In this embodiment, the example in which the suspension substrate 1 is manufactured by the subtractive method has been described. However, the suspension substrate 1 may be manufactured by the additive method.

  In the present embodiment, the example in which the piezo element 44 is bonded to the base plate 42 has been described. However, the present invention is not limited to this, and the piezo element 44 may be bonded only to the load beam 43 at an arbitrary position, or may be bonded to both the base plate 42 and the load beam 43. Anyway. Furthermore, a slider holding plate (not shown) that holds the slider 52 is provided at the tip of the load beam 43, and the piezo element 44 is joined between the load beam 43 and the slider holding plate. good.

  Further, in the present embodiment, as shown in FIG. 11, a conductive connection portion (via that connects the frame body portion 17 of the metal support layer 11 and the wiring connection portion 16 of the wiring layer 12 through the insulating layer 10. ) 70 may be provided. In this case, when forming the plurality of wirings 13 and the wiring connection portions 16 in the wiring layer 12, the wiring layer conductive connection holes 71 penetrating the wiring connection portions 16 are formed, and when forming the protective layer 20, the protective layer 20 is When the insulating layer observation hole 30a is formed in the insulating layer 10, the insulating layer conductive connection hole 73 penetrating the insulating layer 10 is formed, the wiring layer conductive connection hole 71, and the protective layer conductive connection hole 72 are formed. Nickel plating is applied to the layer conductive connection holes 72 and the insulating layer conductive connection holes 73 to form the conductive connection portions 70. Nickel plating is performed by an electrolytic plating method, and a standard nickel sulfamate plating bath is used as a plating bath, and electrolytic immersion plating (0.2 A, 14 minutes) is performed. Thus, the wiring connection portion 16 can be connected to the frame body portion 17 via the conductive connection portion 70. In this case, the wiring connection part 16 can be electrically connected to the piezo element 44 via the frame body part 17 and the conductive connection part 70, and the reliability of the electrical connection with the piezo element 44 is improved. Can do. Note that nickel plating and gold plating may be interposed between the conductive connection portion 70 and the wiring connection portion 16.

  Further, in the present embodiment, as shown in FIG. 12, an inspection through hole 74 that penetrates the protective layer 20 and exposes the wiring connection portion 16 of the wiring layer 12 may be provided. In this case, in the through hole 74 for inspection, it is preferable that the exposed portion of the wiring connection portion 16 is sequentially subjected to nickel plating and gold plating to form the inspection plating layer 75. Such a plating layer 75 for inspection forms a through hole 74 for inspection when the protective layer observation hole 30b is formed in the protective layer 20, and a portion of the wiring connection portion 16 exposed in the through hole 74 for inspection. In addition, it can be formed in the same manner as the injection hole injection hole plating layer 15. In this way, by exposing the wiring connection portion 16 outward on the protective layer 20 side, by using a continuity tester (not shown) such as a probe, A continuity test with the piezo element 44 can be performed. Further, in this case, since the exposed portion of the wiring connection portion 16 is gold-plated, the upper surface of the wiring connection portion 16 even when the tip of the continuity tester is pressed against the upper surface of the wiring connection portion 16. Can be prevented from being deformed, and corrosion of the exposed portion of the wiring connection portion 16 of the wiring layer 12 can be prevented.

Second Embodiment Next, referring to FIGS. 13 and 14, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a method for manufacturing a suspension substrate, and a suspension manufacturing method according to a second embodiment of the present invention are described. A method will be described.

  In the second embodiment shown in FIG. 13 and FIG. 14, the metal support layer has a second metal support layer injection hole that communicates with the metal support layer injection hole of the frame portion through the frame cutout portion. The second embodiment is mainly different from the first embodiment shown in FIGS. 1 to 10 in that the second frame body portion is further included. 13 and 14, the same parts as those of the first embodiment shown in FIGS. 1 to 10 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 13A and 13B, the metal support layer 11 has a second metal support layer injection communicated with the metal support layer injection hole 32 of the frame body portion 17 through the frame body cutout portion 18. The second frame body portion 80 including the hole 81 is provided. The second frame body portion 80 is connected to the frame body portion 17 and is formed in a ring shape like the frame body portion 17, and the outer edge 80 a of the second frame body portion 80 is connected to the outer edge of the insulating layer 10. It is located inward from 10a. The second frame body portion 80 can be formed when the frame body portion 17 and the frame body cutout portion 18 are formed.

  The observation hole 30 is disposed at a position corresponding to the second metal support layer injection hole 81 and communicates with the second metal support layer injection hole 81. The observation hole 30 is formed in a circular shape concentrically with the ring-shaped second frame body portion 80. The observation hole 30 includes an insulating layer observation hole 30a formed in the insulating layer 10 and a protective layer observation hole 30b formed in the protective layer 20 and communicating with the insulating layer observation hole 30a.

  In this embodiment, when the conductive adhesive is injected into the insulating layer injection hole 33 and the metal support layer injection hole 32, as shown in FIG. 14, through the observation hole 30 provided in the suspension substrate 1, The state of the conductive adhesive between the piezo element 44 and the frame body portion 17 can be confirmed. As a result, the conductive adhesive is seen while the conductive adhesive protrudes into the second metal support layer injection hole 81 through the frame notch 18 provided in the frame 17 of the metal support layer 11. Can be injected. For this reason, the injection amount of the conductive adhesive can be adjusted to an appropriate amount, and the conductive adhesive can be prevented from greatly protruding from the frame body portion 17.

  As described above, according to the present embodiment, when the conductive adhesive is injected into the metal support layer injection hole 32, the conductive adhesive between the piezo element 44 and the frame body portion 17 of the metal support layer 11 is removed. The state can be observed from the outside through the observation hole 30 provided in the insulating layer 10. Thereby, the connection workability of the suspension substrate 1 and the piezo element 44 by the conductive adhesive can be improved, and the amount of the conductive adhesive injected can be adjusted to an appropriate amount. In addition, the conductive adhesive that protrudes through the frame notch portion 18 provided in the frame body portion 17 is retained in the second metal support layer injection hole 81. For this reason, it is possible to prevent the conductive adhesive from greatly protruding from the frame body portion 17 and reaching other metal structures (for example, the base plate 42) existing around the connection structure region 3. As a result, the first electrode 44a and the second electrode 44b of the piezo element 44 and the shared electrode 44c can be prevented from being short-circuited by the conductive adhesive.

  In addition, according to the present embodiment, the amount of conductive adhesive injected through the observation hole 30 can be adjusted to an appropriate amount, so that the amount of conductive adhesive spreading on the piezo element 44 is suppressed. Can do. In addition, the conductive adhesive that protrudes through the frame notch portion 18 provided in the frame body portion 17 is retained in the second metal support layer injection hole 81. For this reason, it is possible to prevent the vibration characteristics of the suspension 41 from deteriorating.

  Furthermore, according to the present embodiment, as described above, since the amount of the conductive adhesive spreading on the piezo element 44 can be suppressed, the conductive adhesion to the piezoelectric material portions 44d and 44e of the piezo element 44 is possible. The amount of penetration of the agent can be suppressed, and deterioration of the materials constituting the piezoelectric material portions 44d and 44e can be prevented.

Third Embodiment Next, referring to FIGS. 15 and 16, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a method for manufacturing a suspension substrate, and a suspension manufacturing method according to a third embodiment of the present invention are described. A method will be described.

  In the third embodiment shown in FIGS. 15 and 16, the observation hole is disposed at a position corresponding to the metal support layer injection hole and extends through the wiring connection portion of the wiring layer. The main difference is that the other configuration is substantially the same as that of the first embodiment shown in FIGS. 15 and 16, the same parts as those of the first embodiment shown in FIGS. 1 to 10 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the present embodiment shown in FIGS. 15A and 15B, the insulating layer injection hole 33 and the insulating layer observation hole 30a are also used, and the protective layer observation hole 30b is located at a position corresponding to the insulating layer injection hole 33. Is provided. A wiring layer observation hole 82 penetrating the wiring connection portion 16 is formed at a position corresponding to the insulating layer injection hole 33 in the wiring connection portion 16 of the wiring layer 12. That is, the observation hole 30 in the present embodiment is composed of the insulating layer observation hole 30a (insulating layer injection hole 33), the wiring layer observation hole 82, and the protective layer observation hole 30b that are in communication with each other, and the metal support layer injection It is disposed at a position corresponding to the hole 32 and extends through the wiring connection portion 16 and the protective layer 20 of the wiring layer 12. In the present embodiment, the frame body portion 17 is not provided with the frame body cutout portion 18 (see FIG. 2). Further, the wiring layer observation hole 82 can be formed when the plurality of wirings 13 and the wiring connection portions 16 are formed in the wiring layer 12.

  The wiring connection portion 16 of the wiring layer 12 extends inward of the observation hole 30. In other words, the insulating layer observation hole 30a, the wiring layer observation hole 82, and the protective layer observation hole 30b are formed in a circular shape, and the diameter of the wiring layer observation hole 82 is equal to the insulating layer observation hole 30a and the protective layer observation hole. It is smaller than the diameter of 30b.

In the observation hole 30, the exposed portion of the wiring connection portion 16 of the wiring layer 12 is sequentially subjected to nickel plating and gold plating to form an observation hole plating layer 83. Such an observation hole plating layer 83 can be formed in the same manner as the injection hole plating layer 15 (see FIG. 2).
In this manner, the exposed portion of the wiring connection portion 16 is subjected to gold plating, thereby preventing the exposed portion of the wiring connection portion 16 of the wiring layer 12 from being corroded.

  In the present embodiment, while the conductive adhesive is injected into the insulating layer injection hole (insulating layer observation hole 30a) 33 and the metal support layer injection hole 32, as shown in FIG. The state of the conductive adhesive between the piezo element 44 and the frame body portion 17 can be confirmed through the observation hole 30. That is, the conductive adhesive injected into the metal support layer injection hole 32 through the observation hole 30 shown in FIG. 16 is filled into the insulation layer injection hole 33 (insulation layer observation hole 30a), and the wiring layer observation hole 82 is filled. You can confirm that you have reached it. Thereafter, by stopping the injection of the conductive adhesive, the injection amount of the conductive adhesive can be adjusted to an appropriate amount, and the conductive adhesive can be prevented from greatly protruding from the frame body portion 17.

  As described above, according to the present embodiment, when the conductive adhesive is injected into the metal support layer injection hole 32, the conductive adhesive between the piezo element 44 and the frame body portion 17 of the metal support layer 11 is removed. The state can be observed from the outside through the observation hole 30 provided through the insulating layer 10, the wiring connection portion 16 of the wiring layer 12, and the protective layer 20. Thus, the injection of the conductive adhesive can be stopped after the conductive adhesive reaches the wiring connection portion 16, and the injection amount of the conductive adhesive can be adjusted to an appropriate amount. For this reason, it is possible to prevent the conductive adhesive from greatly protruding from the frame body part 17 and reaching other metal structures (for example, the base plate 42) existing around the connection structure region 3. As a result, the first electrode 44a and the second electrode 44b of the piezo element 44 and the shared electrode 44c can be prevented from being short-circuited by the conductive adhesive.

  In addition, according to the present embodiment, the amount of conductive adhesive injected through the observation hole 30 can be adjusted to an appropriate amount, so that the amount of conductive adhesive spreading on the piezo element 44 is suppressed. Can do. For this reason, it is possible to prevent the vibration characteristics of the suspension 41 from deteriorating.

  Further, according to the present embodiment, as described above, the amount of the conductive adhesive spreading on the piezo element 44 can be suppressed, so that the conductive adhesion to the piezoelectric material portions 44d and 44e of the piezo element 44 is achieved. The amount of penetration of the agent can be suppressed, and deterioration of the materials constituting the piezoelectric material portions 44d and 44e can be prevented.

Fourth Embodiment Next, referring to FIG. 17, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a suspension substrate manufacturing method, and a suspension manufacturing method according to a fourth embodiment of the present invention will be described. To do.

  In the fourth embodiment shown in FIG. 17, the conductive adhesive is mainly different in that it is injected up to the protective layer in the observation hole, and other configurations are shown in FIG. 15 and FIG. This is substantially the same as the third embodiment. In FIG. 17, the same parts as those of the third embodiment shown in FIGS. 15 and 16 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 17, the conductive adhesive in the present embodiment is injected up to the portion of the protective layer 20 in the observation hole 30 (protective layer observation hole 30b). That is, the second conductive adhesive portion 48 made of a conductive adhesive extends from the piezoelectric element 44 through the insulating layer observation hole 30a and the wiring layer observation hole 82 to the protective layer observation hole 30b. The portion where the connection portion 16 is exposed is connected to the second conductive bonding portion 48 over the entire area. In such a second conductive adhesive portion 48, the conductive adhesive injected into the metal support layer injection hole 32 through the observation hole 30 shown in FIG. 17 is applied to the insulating layer injection hole 33 (insulation layer observation hole 30a). It can be confirmed that the protective layer observation hole 30b has been filled and has passed through the wiring layer observation hole 82. Thus, the conductive adhesive can be reliably injected up to the protective layer observation hole 30b. Thereafter, by stopping the injection of the conductive adhesive, the injection amount of the conductive adhesive can be adjusted to an appropriate amount, and the conductive adhesive can be prevented from greatly protruding from the frame body portion 17.

  As shown in FIG. 17, the portion where the conductive adhesive is exposed in the protective layer observation hole 30 b is covered with a covering member (scattering prevention member) 90. The covering member 90 can be formed by, for example, applying an epoxy resin to a portion where the second conductive adhesive portion 48 is exposed in the protective layer observation hole 30b. Such a covering member 90 is also provided in the first conductive bonding portion 45 (see FIG. 5) that electrically connects one of the first electrode 44a and the second electrode 44b of the piezo element 44 to the base plate 42. ing.

  As described above, according to the present embodiment, the conductive adhesive is injected through the observation hole 30 provided through the insulating layer 10, the wiring connection portion 16 of the wiring layer 12, and the protective layer 20. It can be confirmed from the outside. Thus, the injection of the conductive adhesive can be stopped after the conductive adhesive reaches the protective layer observation hole 30b, and the injection amount of the conductive adhesive can be adjusted to an appropriate amount. For this reason, it is possible to prevent the conductive adhesive from greatly protruding from the frame body part 17 and reaching other metal structures (for example, the base plate 42) existing around the connection structure region 3. As a result, the first electrode 44a and the second electrode 44b of the piezo element 44 and the shared electrode 44c can be prevented from being short-circuited by the conductive adhesive.

  In addition, according to the present embodiment, the amount of conductive adhesive injected through the observation hole 30 can be adjusted to an appropriate amount, so that the amount of conductive adhesive spreading on the piezo element 44 is suppressed. Can do. For this reason, it is possible to prevent the vibration characteristics of the suspension 41 from deteriorating.

  Further, according to the present embodiment, as described above, the amount of the conductive adhesive spreading on the piezo element 44 can be suppressed, so that the conductive adhesion to the piezoelectric material portions 44d and 44e of the piezo element 44 is achieved. The amount of penetration of the agent can be suppressed, and deterioration of the materials constituting the piezoelectric material portions 44d and 44e can be prevented.

  Further, according to the present embodiment, since the second conductive adhesive portion 48 extends to the protective layer observation hole 30b, the second conductive adhesive portion 48 and the wiring connection portion 16 of the wiring layer 12 are provided. The bonding area can be increased and the connection resistance can be reduced. In particular, the diameter of the wiring layer observation hole 82 is smaller than the diameter of the insulating layer observation hole 30 a and the diameter of the protective layer observation hole 30 b, and the wiring connection portion 16 is inward of the observation hole 30 from the insulating layer 10 and the protective layer 20. Since it extends, the adhesion area between the second conductive adhesion portion 48 and the wiring connection portion 16 can be further increased. Thereby, the reliability of the electrical connection between the wiring connection portion 16 and the piezo element 44 can be improved.

  Further, according to the present embodiment, the second conductive adhesive portion 48 reaches the protective layer observation hole 30 having a diameter larger than that of the wiring layer through hole 82. Therefore, while the conductive adhesive is being injected, the conductive adhesive beyond the wiring layer through hole 82 is blocked by the protective layer observation hole 30b, and the conductive adhesive is removed from the protective layer 20 outward. It can be prevented from flowing out (upward in FIG. 17).

  Furthermore, according to the present embodiment, the second conductive adhesive portion 48 in the protective layer observation hole 30 b is covered with the covering member 90. Thereby, particles such as silver can be prevented from scattering from the surface of the second conductive adhesive portion 48 made of silver paste.

  In the present embodiment, as in the third embodiment, an example in which the frame body portion 17 is not provided with the frame body cutout portion 18 (see FIG. 2) has been described. However, the present invention is not limited to this. As shown in FIG. 18, a frame body notch portion 18 is provided in the frame body portion 17, and the insulating layer 10 and the protective layer 20 are provided outside the frame body notch portion 18. And a second observation hole 91 through which the state of the conductive adhesive can be observed from the outside when the conductive adhesive is injected into the metal support layer injection hole 32 is provided outside the frame notch 18. You may make it arrange | position to the direction. In this case, the second observation hole 91 is preferably formed in the same manner as the observation hole 30 (see FIG. 2 and the like) in the first embodiment.

  That is, when forming the frame body portion 17 in the metal support layer 11, the frame body portion 17 is formed with the frame body cutout portion 18 that communicates the metal support layer injection hole 32 to the outside of the frame body portion 17. When the insulating layer observation hole 30a is formed at 10, the second state is such that the state of the conductive adhesive can be observed from the outside when the conductive adhesive is injected into the metal support layer injection hole 32 through the insulating layer 10. The insulating layer observation hole 91a is formed outside the frame notch 18, and when the protective layer 20 is formed, a second protective layer observation hole 91b communicating with the second insulating layer observation hole 91a is formed. You may make it do. As a result, the second observation hole 91 constituted by the second insulating layer observation hole 91a and the second protective layer observation hole 91b can be obtained.

  In the modification shown in FIG. 18, the state of the conductive adhesive between the piezo element 44 and the frame portion 17 of the metal support layer 11 can be observed also from the second observation hole 91, The connection workability of the substrate 1 and the piezo element 44 with the conductive adhesive can be improved, and the injection amount of the conductive adhesive can be adjusted to an appropriate amount. In this case, since the conductive adhesive protrudes outside the frame body portion 17 through the frame body cutout portion 18 provided in the frame body portion 17, the direction in which the conductive adhesive protrudes is regulated. The conductive adhesive can be protruded in a desired direction. Furthermore, as described above, since the amount of the conductive adhesive spreading on the piezo element 44 can be suppressed, the amount of the conductive adhesive penetrating into the piezoelectric material portions 44d and 44e of the piezo element 44 can be suppressed. It is possible to prevent the materials constituting the piezoelectric material portions 44d and 44e from deteriorating.

  Further, although not shown, the second frame body portion 80 is connected to the frame body portion 17 in the same manner as the second embodiment, and the second metal support layer injection hole 81 of the second frame body portion 80 is connected. May be communicated with the metal support layer injection hole 32 of the frame portion 17 through the frame cutout portion 18.

Fifth Embodiment Next, referring to FIGS. 19 and 20, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a method for manufacturing a suspension substrate, and a suspension manufacturing method according to a fifth embodiment of the present invention are described. A method will be described.

  The fifth embodiment shown in FIGS. 19 and 20 is mainly different in that the connection structure region of the metal support layer is cut away, and other configurations are shown in FIGS. 15 and 16. This is substantially the same as the third embodiment. 19 and 20, the same parts as those of the third embodiment shown in FIGS. 15 and 16 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 19 and 20, the metal support layer 11 is provided with a metal support layer cutout portion 95 that cuts out a portion of the connection structure region 3 in the metal support layer 11. In this way, the surface of the insulating layer 10 on the piezoelectric element 44 side is exposed in the connection structure region 3. Such a metal support layer notch 95 is formed by etching and removing a portion of the metal support layer 11 in the connection structure region 3 in the step of forming the wiring connection portion 16 (see FIG. 9B). can get. In this case, the flexibility of the connection structure region 3 can be improved. As shown in FIG. 19, the metal support layer cutout portion 95 is sufficient if at least the connection structure region 3 corresponding to the wiring connection portion 16 is cut out, and includes the periphery of the connection structure region 3. It may be cut out. Further, the shape of the metal support layer cutout portion 95 may be circular in a plan view, or may be an arbitrary shape such as a rectangular shape.

  When injecting a conductive adhesive into the wiring connection portion 16 between the wiring connection portion 16 and the piezo element 44, the observation hole 30 that can observe the state of the conductive adhesive from the outside, that is, the wiring layer observation hole 82 is provided. Is provided. In the connection structure region 3, the insulating layer 10 is provided with an insulating layer observation hole 30 a that communicates with the wiring layer observation hole 82, and the observation hole 30 is formed to extend to the insulating layer 10.

  The wiring connection portion 16 of the wiring layer 12 extends inward of the observation hole 30 from the insulating layer 10 and the protective layer 20. As a result, the adhesion area between the second conductive adhesion portion 48 and the wiring connection portion 16 can be further increased.

  In the present embodiment, the protective layer 20 covers at least a part of the wiring connection portion 16. The observation hole 30 extends through the protective layer 20. That is, the protective layer 20 is provided with a protective layer observation hole 30 b that penetrates the protective layer 20 and communicates with the insulating layer observation hole 30 a and the wiring layer observation hole 82.

  As shown in FIG. 20, the conductive adhesive in the present embodiment is injected up to the portion of the protective layer 20 in the observation hole 30 (protective layer observation hole 30 b).

  As described above, according to the present embodiment, when the conductive adhesive is injected between the wiring connection portion 16 and the piezo element 44, the state of the conductive adhesive is changed to the wiring of the insulating layer 10 and the wiring layer 12. It can be observed from the outside through the observation hole 30 provided through the connection portion 16 and the protective layer 20. Thus, the injection of the conductive adhesive can be stopped after the conductive adhesive reaches the wiring connection portion 16, and the injection amount of the conductive adhesive can be adjusted to an appropriate amount. For this reason, it is possible to prevent the conductive adhesive from greatly protruding from the frame body part 17 and reaching other metal structures (for example, the base plate 42) existing around the connection structure region 3. As a result, the first electrode 44a and the second electrode 44b of the piezo element 44 and the shared electrode 44c can be prevented from being short-circuited by the conductive adhesive. Further, the amount of the conductive adhesive spreading on the piezo element 44 can be suppressed, and the vibration characteristics as the suspension 41 can be prevented from deteriorating. Furthermore, the penetration amount of the conductive adhesive into the piezoelectric material portions 44d and 44e of the piezo element 44 can be suppressed, and deterioration of the material constituting the piezoelectric material portions 44d and 44e can be prevented.

  In the present embodiment, as shown in FIG. 21A, the protective layer 20 is provided with a protective layer cutout portion 96 that cuts out the portion of the connection structure region 3 in the protective layer 20, so that the connection structure region 3, the surface opposite to the piezoelectric element 44 (that is, the surface on the side of the protective layer 20 other than the wiring connection portion 16) may be exposed together with the surface of the insulating layer 10 on the piezoelectric element 44 side. In this case, the metal support layer 11 and the protective layer 20 are not formed in the connection structure region 3. Such a suspension substrate 1 is obtained by etching and removing a portion of the protective layer 20 in the connection structure region 3 in the step of forming the protective layer 20 (see FIG. 9C). In this case, the flexibility of the connection structure region 3 can be further improved. In addition, the shape of the protective layer notch 96 can be an arbitrary shape like the metal support layer notch 95.

  Or as another form, as shown in FIG.21 (b), the insulating layer 10 is provided with the insulating layer notch 97 which notches the part of the connection structure area | region 3 among the insulating layers 10, A protective layer cutout portion 96 that cuts out a portion of the connection structure region 3 in the protective layer 20 may be provided, and the entire wiring connection portion 16 may be exposed. In this case, the metal support layer 11, the insulating layer 10, and the protective layer 20 are not formed in the connection structure region 3. In such a suspension substrate 1, in the step of forming the protective layer 20 (see FIG. 9C), the portion of the protective layer 20 in the connection structure region 3 is removed by etching. Of these, it is obtained by etching away the portion in the connection structure region 3. In this case, since the wiring connection portion 16 can be exposed throughout, the contact area between the conductive adhesive and the wiring connection portion 16 can be further increased. The conduction resistance between the two can be further reduced. In this case, the flexibility of the connection structure region 3 can be further improved. Note that the shape of the insulating layer notch 97 can be any shape, similar to the metal support layer notch 95.

Sixth Embodiment Next, referring to FIG. 22, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a suspension substrate manufacturing method, and a suspension manufacturing method according to a sixth embodiment of the present invention will be described. .

  The sixth embodiment shown in FIG. 22 is mainly different in that a plurality of wiring layer observation holes are formed, and other configurations are substantially the same as those of the third embodiment shown in FIGS. 15 and 16. It is. In FIG. 22, the same parts as those of the third embodiment shown in FIGS. 15 and 16 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 22, a plurality of wiring layer observation holes 82 may be provided in the wiring connection portion 16. That is, the wiring connection portion 16 may be provided with three wiring layer observation holes 82 as shown in FIG. 22A, or with four wiring layer observation holes 82 as shown in FIG. Alternatively, as shown in FIG. 22C, five wiring layer observation holes 82 may be provided. The number of wiring layer observation holes 82 provided in the wiring connection portion 16 is not limited to 3 to 5, and can be arbitrary.

  Thus, according to the present embodiment, the conductive adhesive can be injected into the plurality of wiring layer observation holes 82. As a result, the contact area between the conductive adhesive and the wiring connection portion 16 can be further increased, and the conduction resistance between the conductive adhesive and the wiring connection portion 16 can be reduced. In addition, the anchor effect of the conductive adhesive can be further exhibited, and the adhesiveness between the conductive adhesive and the wiring connection portion 16 can be further improved. For this reason, the conductivity and adhesiveness with the conductive adhesive for connecting the piezo element 44 can be further improved.

Seventh Embodiment Next, referring to FIGS. 23 to 30, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a method of manufacturing a suspension substrate, and a suspension substrate according to a seventh embodiment of the present invention will be described. A manufacturing method will be described.

  In the seventh embodiment shown in FIGS. 23 to 30, the suspension substrate has a pair of connection structure regions arranged on both sides of the substrate body region so that the suspension substrate can be connected to the pair of piezoelectric elements. The other differences are substantially the same as those of the first embodiment shown in FIGS. 1 to 10. 23 to 30, the same parts as those of the first embodiment shown in FIGS. 1 to 10 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 23, the suspension substrate 1 can be connected to the substrate main body region 2 where the plurality of wirings 13 extend and a pair of piezo elements (actuator element, see FIG. 27) 44 through a conductive adhesive. Connection structure region 3. Among these, the substrate body region 2 is provided with a head terminal 5 connected to a slider 52 (see FIG. 29) described later and an external device connection terminal 6 connected to an external device (not shown). And the external device connection terminal 6 are connected by a wiring 13. Further, the pair of connection structure regions 3 are arranged on both sides of the substrate body region 2 and are connected to the substrate body region 2 via the connection region 4.

  As shown in FIGS. 23 and 25, the suspension substrate 1 includes an insulating layer 10, a metal support layer 11 provided on the surface (one surface) of the insulating layer 10 on the piezoelectric element 144 side, and the insulating layer 10. And a wiring layer 12 having a plurality of wirings 13 provided on the other surface. Among these, the wiring layer 12 has a wiring connection portion 16 provided in each connection structure region 3 and electrically connected to the piezo element 144 via a conductive adhesive (for example, silver paste). Each wiring connection portion 16 is formed of the same material as each wiring 13. A pair of corresponding wires 13 among the plurality of wires 13 extend from the external device connection terminal 6 to the connection structure region 3 via the connection region 4 and are electrically connected to the piezo element 144 via the wire connection portion 16. It has come to be. Although not shown, a seed layer made of nickel (Ni), chromium (Cr), and copper (Cu) and having a thickness of about 300 nm is interposed between the insulating layer 10 and the wiring layer 12, so The adhesion between the layer 10 and the wiring layer 12 is improved.

  As shown in FIGS. 24 and 25, the wiring connection portion 16 located in the connection structure region 3 is provided with a wiring layer through hole 133 into which a conductive adhesive is injected. In the present embodiment, only one wiring layer through-hole 133 is provided in the central portion of the wiring connecting portion 16 and is a circular hole.

  The insulating layer 10 is provided with an insulating layer through hole 132 that communicates with the wiring layer through hole 133, and the metal support layer 11 has a metal support layer through hole that communicates with the wiring layer through hole 133 and the insulating layer through hole 132. A hole 131 is provided, and a conductive adhesive is injected into the insulating layer through hole 132 and the metal support layer through hole 131. The outer edge 133a of the wiring layer through-hole 133 is located inward from the outer edge 132a of the insulating layer through-hole 132, the outer edge 131a of the metal support layer through-hole 131, and the outer edge 134a of the protective layer through-hole 134. A part of is exposed. In the present embodiment, the outer edge 132a of the insulating layer through-hole 132 is located inward from the outer edge 131a of the metal support layer through-hole 131, and supports the wiring connection portion 16 and the wiring connection portion 16. Deformation is prevented.

  As shown in FIGS. 24 and 25, the metal support layer 11 has a frame portion 17 provided in each connection structure region 3 and forming a metal support layer through hole 131 therein. In the connection region 4, the metal support layer 11 is removed by etching, and each frame portion 17 is separated from the metal support layer 11 in the substrate body region 2 and is electrically insulated. Further, the outer edge 17 a of each frame body portion 17 is located outward from the outer edge 10 a of the insulating layer 10 in the connection structure region 3. In the present embodiment, each frame body portion 17 and the portion of the insulating layer 10 in the connection structure region are formed in a ring shape, and the outer diameter of each frame body portion 17 is that of the insulating layer 10. It is larger than the outer diameter of the part.

  As shown in FIG. 25, a protective layer 20 that covers each wiring 13 of the wiring layer 12 is provided on the insulating layer 10. In the connection structure region 3, the protective layer 20 is provided with a protective layer through hole 134 that communicates with the wiring layer through hole 133. In FIGS. 23 and 24, the protective layer 20 is omitted for the sake of clarity.

  Nickel (Ni) plating and gold (Au) plating are sequentially applied to the exposed portion of the wiring connection portion 16 to form a plating layer 115. This prevents the exposed portion of the wiring layer 16 from being corroded. The thickness of the plating layer 115 is preferably 0.5 μm to 4.0 μm.

  Next, each component will be described in detail.

  The material of the insulating layer 10 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of the insulating layer 10 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 10 is preferably 5 μm to 30 μm, particularly 8 μm to 10 μm. As a result, it is possible to ensure the insulation performance between the metal support layer 11 and each wiring 13 and to prevent the rigidity of the suspension substrate 1 as a whole from being lost.

  Each wiring 13 is configured as a conductor for transmitting an electrical signal, and the material of each wiring 13 is not particularly limited as long as it has a desired conductivity, but copper (Cu) Is preferably used. In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 13 is, for example, 1 μm to 18 μm, particularly 9 μm to 12 μm. As a result, it is possible to ensure the transmission characteristics of each wiring 13 and to prevent the flexibility of the suspension substrate 1 as a whole from being lost. The wiring connection portion 16 is made of the same material and the same thickness as the wirings 13.

  The material of the metal support layer 11 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. The thickness of the metal support layer 11 is preferably larger than the thickness of the wiring 13. Moreover, the thickness of the metal support layer 11 can be 10 micrometers-30 micrometers as an example, and can be 15 micrometers-20 micrometers especially. As a result, the conductivity, rigidity, and elasticity of the metal support layer 11 can be ensured.

  As a material of the protective layer 20, it is preferable to use a resin material such as polyimide. The material of the protective layer 20 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 20 is preferably 2 μm to 30 μm.

  Next, the suspension 41 in the present embodiment will be described with reference to FIGS. A suspension 41 shown in FIG. 26 is attached to the base plate 42, the load beam 43 that holds the metal support layer 11 of the suspension substrate 1, the suspension substrate 1, the base plate 42, and the load beam 43. And a piezo element 144 connected to the connection structure region 3 of the suspension substrate 1. In the present embodiment, the piezo element 144 is joined to the base plate 42. The base plate 42 and the load beam 43 are made of stainless steel.

  The piezo element 144 is configured as a piezoelectric element that expands and contracts when a voltage is applied. As shown in FIG. 27, each piezoelectric element 144 is interposed between a pair of electrodes 144a facing each other and a pair of electrodes 144a, and a piezoelectric material portion 144b made of piezoelectric ceramics such as PZT (lead zirconate titanate), for example. And have. The piezoelectric material portions 144b of the pair of piezo elements 144 are formed to have polarization directions different from each other by 180 °. When a predetermined voltage is applied, one piezo element 144 contracts and the other piezo element 144 144 extends. Such piezo elements 144 are preferably arranged symmetrically with respect to the longitudinal axis passing through the center of the slider 52, although not shown. In this way, the influence of expansion and contraction of each piezo element 144 can be equalized with respect to the displacement of the slider 52 in the sway direction, the displacement of the slider 52 in the sway direction can be easily adjusted, and the actuator It functions as an element. In the present embodiment, since the connection structure region 3 connected to the piezo element 144 is disposed on both sides of the substrate body region 2, the expansion and contraction of the piezo element 144 is effectively converted into the displacement of the slider 52. It can be used now.

  Such a piezo element 144 is joined to the base plate 42 by a non-conductive adhesive. Although not shown, one electrode 144a of the piezo element 144 (on the side opposite to the suspension substrate 1) is electrically connected to the base plate 42 using a conductive adhesive.

  On the other hand, the electrode 144a on the other side (the suspension substrate 1 side) of the piezo element 144 is joined and electrically connected to the connection structure region 3 using a conductive adhesive. That is, as shown in FIG. 28, a conductive adhesive is injected into the metal support layer through-hole 131, the insulating layer through-hole 132, and the wiring layer through-hole 133 in the connection structure region 3 to form a conductive adhesive portion 148. The piezoelectric element 144 is joined to the connection structure region 3 via the conductive adhesive portion 148, and the electrode 144a of the piezoelectric element 144 is electrically connected to the wiring connection portion 16 via the conductive adhesive portion 148. It is connected. The injected conductive adhesive protrudes from the wiring layer through-hole 133, and the conductive adhesive portion 148 extends into the protective layer through-hole 134.

  Next, the suspension with head 51 in the present embodiment will be described with reference to FIG. A suspension 51 with a head shown in FIG. 29 has the above-described suspension 41 and a slider 52 connected to the head terminal 5 of the suspension substrate 1. Note that the hard disk drive 61 in the present embodiment is the same as that shown in FIG.

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the suspension substrate 1 according to the present embodiment will be described. Here, as an example, a method of manufacturing the suspension substrate 1 by the subtractive method will be described with reference to FIG. 30 showing a cross section of the connection structure region 3.

  First, a laminated body 35 having an insulating layer 10, a metal support layer 11 provided on the surface of the insulating layer 10 on the piezoelectric element 144 side, and a wiring layer 12 provided on the other surface of the insulating layer 10 is prepared. (See FIG. 30 (a)). In this case, first, the metal support layer 11 is prepared, and the insulating layer 10 is formed on the metal support layer 11 by a coating method using non-photosensitive polyimide. Subsequently, nickel, chromium, and copper are sequentially coated on the insulating layer 10 by a sputtering method to form a seed layer (not shown). Thereafter, the wiring layer 12 is formed by copper plating using the seed layer as a conductive medium. In this way, a laminated body 35 having the insulating layer 10, the metal support layer 11, and the wiring layer 12 is obtained.

  Subsequently, a plurality of wirings 13 and wiring connection portions 16 are formed in the wiring layer 12, and wiring layer through holes 133 are formed in the wiring connection portions 16, and the metal support layer through holes 131 are formed in the metal support layer 11. It is formed (see FIG. 30B). In this case, first, a patterned resist (not shown) is formed on the upper surface of the wiring layer 12 and the lower surface of the metal support layer 11 by a photofabrication method using a dry film. Next, portions of the wiring layer 12 and the metal support layer 11 exposed from the resist are etched. Here, the method of etching the wiring layer 12 and the metal support layer 11 is not particularly limited, but it is preferable to perform wet etching. In particular, the etching solution is preferably selected as appropriate according to the type of material of the metal support layer 11. For example, when the metal support layer 11 is made of stainless steel, an iron chloride-based etching solution such as an aqueous ferric chloride solution is used. A liquid can be used. After the etching is performed, the resist is removed.

  Next, a protective layer 20 is formed on the insulating layer 10 to cover each wiring 13 and the wiring connection portion 16 of the wiring layer 12, and a protective layer through hole 134 is formed in the protective layer 20 (FIG. 30). (See (c)). In this case, non-photosensitive polyimide is coated on the insulating layer 10 using a die coater, and dried to form the protective layer 20. Subsequently, a patterned resist (not shown) is formed on the formed protective layer 20, and the exposed portion of the protective layer 20 is etched to cure the protective layer 20. In this way, the protective layer through hole 134 is obtained, and thereby, the surface of the wiring connection portion 16 opposite to the piezoelectric element 144 is exposed. Thereafter, the resist is removed.

  Thereafter, in the insulating layer 10, an insulating layer through-hole 132 that penetrates the insulating layer 10 is formed (see FIG. 30D). In this case, first, a patterned resist (not shown) is formed, and the exposed portion of the insulating layer 10 is etched to form the insulating layer through-hole 132 and the outer shape of the insulating layer 10 is processed. In this way, the insulating layer through-hole 132 is obtained, whereby the surface of the wiring connection portion 16 on the side of the piezo element 144 is exposed. Here, the method of etching the insulating layer 10 is not particularly limited, but it is preferable to perform wet etching. In particular, the etching solution is preferably selected as appropriate according to the type of material of the insulating layer 10. For example, when the insulating layer 10 is made of a polyimide resin, an alkaline etching solution such as an organic alkali etching solution is used. be able to. After the etching is performed, the resist is removed.

  Next, the exposed portion of the wiring connection portion 16 is plated to form a plating layer 115 (see FIG. 30E). That is, the exposed portion of the wiring connection portion 16 is subjected to acid cleaning, and nickel plating and gold plating are sequentially performed by an electrolytic plating method to form a plating layer 115 having a thickness of 0.5 μm to 4.0 μm. Is done. In this case, the head terminal 5 connected to the slider 52 and the external device connection terminal 6 are similarly plated. Note that the type of plating is not limited to nickel plating and gold plating, but may be silver (Ag) plating or palladium (Pd) plating.

  After the plating layer 115 is formed, the metal support layer 11 is trimmed to form the frame body portion 17 (see FIG. 30E). In this case, first, a patterned resist (not shown) is formed on the lower surface of the metal support layer 11 using a dry film. Next, for example, a portion of the metal support layer 11 exposed from the resist is etched with an iron chloride-based etchant, whereby the frame body portion 17 is formed and the metal support layer 11 is externally processed. The frame body portion 17 is formed such that an outer edge 17 a thereof is located outward from the outer edge 10 a of the insulating layer 10, and is separated from a portion of the metal support layer 11 in the substrate body region 2. Thereafter, the resist is removed, and the suspension substrate 1 according to the present embodiment is obtained.

  Next, a method for manufacturing a suspension using the thus obtained suspension substrate 1 will be described with reference to FIG.

  First, the base plate 42 and the load beam 43 are prepared, and the suspension substrate 1 is prepared as described above.

  Next, the suspension substrate 1 is attached to the base plate 42 by welding via the load beam 43 (see FIG. 26). In this case, a beam jig hole (not shown) provided in the load beam 43 and a jig hole (not shown) provided in the suspension substrate 1 are used to connect the load beam 43 and the suspension substrate 1. Alignment is performed and fixed by welding.

  Subsequently, the piezo element 144 is bonded to the base plate 42 using a non-conductive adhesive, and one electrode 144a of the piezo element 144 is electrically connected to the base plate 42 using a conductive adhesive. The

  Also, a conductive adhesive is injected into the metal support layer through hole 131, the insulating layer through hole 132, and the wiring layer through hole 133 from the gap between the frame portion 17 of the metal support layer 11 and the electrode 144a of the piezo element 144. Thus, the conductive adhesive portion 148 (see FIG. 28) is formed. In this case, the conductive adhesive is injected so as to protrude from the wiring layer through hole 133, and the conductive adhesive portion 148 extends into the protective layer through hole 134. In this way, the other electrode 144a of the piezo element 144 is joined and electrically connected to the connection structure region 3 of the suspension substrate 1 via the conductive adhesive portion 148.

  In this way, the suspension 41 including the piezoelectric element 144 connected to the connection structure region 3 of the suspension substrate 1 is obtained.

  A slider 52 is connected to the head terminal 5 of the suspension 41 to obtain a suspension with head 51 shown in FIG. Further, the suspension 51 with the head is attached to the case 62 of the hard disk drive 61 to obtain the hard disk drive 61 shown in FIG.

  When moving the slider 52, the voice coil motor 65 roughly adjusts the position of the slider 52, and the piezo element 144 finely adjusts the position of the slider 52. That is, by applying a predetermined voltage to the electrode 144a of the piezo element 144 on the pair of connection structure regions 3 side of the suspension substrate 1, one piezo element 144 contracts in the longitudinal direction and the other piezo element 144 Elongates (see FIG. 24). In this case, the base plate 42 and a part of the load beam 43 are elastically deformed, and the slider 52 positioned on the tip side of the load beam 43 can move in the sway direction (turning direction). In this way, the slider 52 can be quickly and accurately aligned with a desired track of the disk 63.

  As described above, according to the present embodiment, the wiring layer through hole 133 into which the conductive adhesive is injected is provided in the wiring connection portion 16 connected to the piezo element 144 via the conductive adhesive. As a result, the conductive adhesive can be injected into the wiring layer through-hole 133 to increase the contact area between the conductive adhesive and the wiring connection portion 16. The conduction resistance between the two can be reduced. Further, since the conductive adhesive is injected into the wiring layer through-hole 133, the anchor effect of the conductive adhesive can be exhibited, and the adhesiveness between the conductive adhesive and the wiring connection portion 16 can be improved. In particular, the conductive adhesive can be protruded from the wiring layer through-hole 133 so that the conductive adhesive can be brought into contact with the surface of the wiring connection portion 16 on the protective layer 20 side. The contact area between them can be further increased, and the anchor effect can be further exhibited. For this reason, the electrical conductivity and adhesiveness with the conductive adhesive for connecting the piezo element 144 can be improved.

  By the way, silver paste is mainly used as the conductive adhesive for joining the terminal portion of the suspension substrate and the piezoelectric element for the following reasons. That is, silver or gold is generally used as the electrode of the piezoelectric element, but such a metal is soluble in tin contained in solder. For this reason, when the soldering operation time becomes long, the silver or gold of the electrode dissolves in the solder, and the electrode of the piezoelectric element disappears. In order to prevent the electrode from disappearing, it is possible to include several percent of gold or silver in the solder, but it is difficult to completely prevent the electrode from disappearing. In this case, depolarization may be caused by a temperature rise during the soldering operation. From such a viewpoint, a silver paste that is not soluble in tin and has a low adhesion temperature is used. Silver paste requires not only adhesiveness but also a low glass transition temperature to prevent depolarization and to displace the slider effectively against piezoelectric element shrinkage. A low elastic modulus is required. Therefore, it is considered effective to increase the content of the silver filler in order to improve the conductivity of the silver paste. However, when the content of the silver filler is increased, the glass transition temperature of the silver paste increases. There's a problem. Further, it is considered effective to refine the silver filler in order to improve the adhesiveness of the silver paste. However, when the silver filler is refined, there is a problem that the elastic modulus of the silver paste increases. For this reason, it is difficult to improve the conductivity and adhesion between the silver paste and the terminal portion of the suspension substrate. However, according to the present embodiment, as described above, the wiring layer through hole 133 into which the conductive adhesive is injected is provided in the wiring connection portion 16 connected to the piezo element 144 via the conductive adhesive. Therefore, the conductivity and adhesiveness with the conductive adhesive for connecting the piezo element 144 can be improved.

  In addition, according to the present embodiment, the pair of connection structure regions 3 are provided on both sides of the substrate body region 2, and the outer edges 17 a of the frame portions 17 of the metal support layer 11 are connected to the insulating layer 10. The region 3 is located outward from the outer edge 10a of the portion. Thereby, when injecting the conductive adhesive, the conductive adhesive protruding outward from the frame body portion 17 can be easily confirmed. For this reason, the injection amount of the conductive adhesive can be adjusted to an appropriate amount, and the conductive adhesive greatly protrudes from the frame body portion 17 and other metal structures existing around the connection structure region 3 (for example, The base plate 42) can be prevented from reaching. As a result, it is possible to prevent the piezo element 144 from being short-circuited to the base plate 42 or the like via the conductive adhesive.

  Furthermore, according to the present embodiment, since the amount of the conductive adhesive spreading on the piezo element 144 can be suppressed as described above, the amount of the conductive adhesive penetrating into the electrode 144a of the piezo element 144 is reduced. Can be suppressed, and deterioration of the material constituting the piezoelectric material portion 144b can be prevented.

  In this embodiment, the example in which the suspension substrate 1 is manufactured by the subtractive method has been described. However, the suspension substrate 1 may be manufactured by the additive method.

  In the present embodiment, the example in which the piezo element 144 is joined to the base plate 42 has been described. However, the present invention is not limited to this, and the piezo element 144 may be bonded only to the load beam 43 at an arbitrary position, or may be bonded to both the base plate 42 and the load beam 43. Anyway. Furthermore, a slider holding plate (not shown) that holds the slider 52 is provided at the tip of the load beam 43 so that the piezo element 144 is joined between the load beam 43 and the slider holding plate. good.

  In the present embodiment, as shown in FIG. 28, the conductive adhesive injected into the wiring layer through-hole 133 protrudes from the wiring layer through-hole 133 and the conductive adhesive portion 148 passes through the protective layer. The example extending into the hole 134 has been described. However, the present invention is not limited to this. As shown in FIG. 31, the amount of the conductive adhesive protruding from the wiring layer through-hole 133 is increased, so that the conductive adhesive portion 148 becomes a protective layer through-hole 134. The outer edge 134a may be reached. Thereby, the contact area between the conductive adhesive and the wiring connection portion 16 can be further increased, and the conduction resistance between the conductive adhesive and the wiring connection portion 16 can be further reduced. . Further, in this case, the protective layer 20 in the connection structure region 3 can function as a liquid stopper for the conductive adhesive, and the amount of the conductive adhesive injected can be adjusted to an appropriate amount and protected. It is possible to prevent the conductive adhesive from protruding from the layer 20 to the periphery of the connection structure region 3.

  In the present embodiment, as shown in FIG. 32, in the connection structure region 3, the surface of the insulating layer 10 on the piezoelectric element 144 side may be exposed. In this case, the metal support layer 11 is not formed in the connection structure region 3. Such a suspension substrate 1 is obtained by etching and removing a portion of the metal support layer 11 in the connection structure region 3 in the step of externally processing the metal support layer 11 (see FIG. 30E). It is done. In this case, the flexibility of the connection structure region 3 can be improved.

  Alternatively, as shown in FIG. 33, in the connection structure region 3, the surface on the piezoelectric element 144 side of the insulating layer 10 and the surface opposite to the piezoelectric element 144 (that is, the protective layer 20 other than the wiring connection portion 16 Side surface) may be exposed. In this case, the metal support layer 11 and the protective layer 20 are not formed in the connection structure region 3. In such a suspension substrate 1, in the step of forming the protective layer 20 (see FIG. 30C), the portion of the protective layer 20 in the connection structure region 3 is removed by etching to remove the metal support layer 11 from the outer shape. In the processing step (see FIG. 30E), the metal support layer 11 is obtained by etching away the portion in the connection structure region 3. In this case, the flexibility of the connection structure region 3 can be further improved.

  Furthermore, as another form, as shown to Fig.34 (a), the whole wiring connection part 16 may be exposed. In this case, the metal support layer 11, the insulating layer 10, and the protective layer 20 are not formed in the connection structure region 3. In such a suspension substrate 1, in the step of forming the protective layer 20 (see FIG. 30C), the portion of the protective layer 20 in the connection structure region 3 is removed by etching to remove the metal support layer 11 from the outer shape. In the processing step (see FIG. 30E), the metal support layer 11 is removed by etching in the connection structure region 3 and then the insulating layer 10 is removed by etching in the connection structure region 3. Is obtained. In this case, since the wiring connection portion 16 can be exposed throughout, the contact area between the conductive adhesive and the wiring connection portion 16 can be further increased. The conduction resistance between the two can be further reduced. For example, as shown in FIG. 34B, the wiring connection portion 16 can be covered with a conductive adhesive, and the contact area between the conductive adhesive and the wiring connection portion 16 can be further increased. In this case, the flexibility of the connection structure region 3 can be further improved.

Eighth Embodiment Next, referring to FIG. 35, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a suspension substrate manufacturing method, and a suspension manufacturing method according to an eighth embodiment of the present invention will be described. .

  The eighth embodiment shown in FIG. 35 is mainly different in that a plurality of wiring layer through holes are provided in the wiring connection portion, and the other configuration is the seventh embodiment shown in FIGS. The form is substantially the same. In FIG. 35, the same parts as those of the seventh embodiment shown in FIGS. 23 to 30 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 35, a plurality of wiring layer through holes 133 may be provided in the wiring connection portion 16. That is, the wiring connection portion 16 may be provided with three wiring layer through-holes 133 as shown in FIG. 35A, and as shown in FIG. 35B, four wiring layer through-holes 133 are provided. Alternatively, as shown in FIG. 35C, five wiring layer through holes 133 may be provided. The number of wiring layer through-holes 133 provided in the wiring connection portion 16 is not limited to 3 to 5, and can be arbitrarily set.

  Thus, according to the present embodiment, the conductive adhesive can be injected into the plurality of wiring layer through holes 133. As a result, the contact area between the conductive adhesive and the wiring connection portion 16 can be further increased, and the conduction resistance between the conductive adhesive and the wiring connection portion 16 can be reduced. In addition, the anchor effect of the conductive adhesive can be further exhibited, and the adhesiveness between the conductive adhesive and the wiring connection portion 16 can be further improved. For this reason, the electrical conductivity and adhesiveness with the conductive adhesive for connecting the piezo element 144 can be further improved.

Ninth Embodiment Next, referring to FIGS. 36 to 38, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a suspension substrate manufacturing method, and a suspension manufacturing method according to a ninth embodiment of the present invention are described. Will be described.

  In the ninth embodiment shown in FIGS. 36 to 38, in the connection structure region, the metal support layer is provided with a communication cutout and the insulating layer is provided with a second communication cutout. Otherwise, the other configuration is substantially the same as that of the seventh embodiment shown in FIGS. 36 to 38, the same parts as those in the seventh embodiment shown in FIGS. 23 to 30 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 36 and 37, each frame body portion 17 of the metal support layer 11 is provided with a communication cutout portion 171 that allows the metal support layer through hole 131 to communicate with the outside of the frame body portion 17. The insulating layer 10 is provided with a second communication notch 172 that communicates the insulating layer through-hole 132 to the outside of the insulating layer 10 in the connection structure region 3 so as to correspond to the communication notch 171.

  In the suspension 41 in the present embodiment, as shown in FIG. 38, the conductive adhesive is not limited to the metal support layer through-hole 131, the insulating layer through-hole 132, and the wiring layer through-hole 133, but the communication notch 171 and The conductive adhesive portion 148 is formed by being injected also into the second communication cutout portion 172.

  In the step of forming the frame body portion 17 (see FIG. 30F), the suspension substrate 1 shown in FIGS. 36 to 38 has the communication notch portion 171 formed in the frame body portion 17 by etching. Then, the second communication notch 172 is formed so as to correspond to the communication notch 171 in the same manner as the etching of the insulating layer 10 described above.

  As described above, according to the present embodiment, the conductive adhesive injected into the metal support layer through-hole 131 and the insulating layer through-hole 132 passes through the communication notch 171 and the second communication notch 172, and is connected. The structure region 3 can protrude outward. For this reason, the protruding direction of the conductive adhesive can be restricted, the conductive adhesive can be protruded in a desired direction, and the vibration characteristics of the suspension 41 can be prevented from deteriorating.

  Further, according to the present embodiment, since the second communication notch 172 is provided in the insulating layer 10 in the connection structure region 3, the piezoelectric element of the wiring connection 16 in the second communication notch 172. The surface on the 144 side can be exposed. As a result, the contact area between the conductive adhesive and the wiring connection portion 16 can be further increased, and the conduction resistance between the conductive adhesive and the wiring connection portion 16 can be further reduced.

Tenth Embodiment Next, referring to FIGS. 39 and 40, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a suspension substrate manufacturing method, and a suspension manufacturing method according to a tenth embodiment of the present invention are described. Will be described.

  The tenth embodiment shown in FIGS. 39 and 40 is mainly different in that the surface of the plating layer on the actuator element side is roughened, and other configurations are the same as those shown in FIGS. This is substantially the same as the seventh embodiment. 39 and 40, the same parts as those in the seventh embodiment shown in FIGS. 23 to 30 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 39, the wiring connection portion 16 enters the insulating layer through hole 132 that penetrates the insulating layer 10. Here, the insulating layer through-hole 132 is formed in a conical shape, and the wiring connection portion 16 is formed so as to enter the entire insulating layer through-hole 132. Thus, in this embodiment, the conductive adhesive is injected into the metal support layer through-hole 131 and the wiring layer through-hole 133.

  The surface of the wiring connection portion 16 on the piezoelectric element 144 side is roughened, and the roughened surface of the wiring connection portion 16 is roughened so as to correspond to the roughening of the wiring connection portion 16. A plating layer 115 having a different surface is provided. Here, in the form shown in FIG. 39, it is preferable that unevenness with a depth of 1 μm to 3 μm is formed on the roughened surface.

  The insulating layer 10 has an insulating layer opening 181 that opens to the piezoelectric element 144 side and communicates with the metal support layer through-hole 131. The insulating layer opening 181 is formed by half-etching the insulating layer 10 as will be described later. The insulating layer opening 181 has a depth approximately half the thickness of the insulating layer 10 and has a metal support layer through-hole 131. It has a hole diameter larger than the hole diameter.

  The suspension substrate 1 shown in FIG. 39 can be manufactured as follows.

  First, the metal support layer 11 is prepared (see FIG. 40A).

  Subsequently, the insulating layer 10 is formed on the metal support layer 11, and the insulating layer through-hole 132 penetrating the insulating layer 10 is formed. In this case, first, the insulating layer 10 is formed on the metal support layer 11 (see FIG. 40B). Subsequently, a patterned resist (not shown) is formed on the insulating layer 10, and a portion of the insulating layer 10 exposed from the resist is etched to form an insulating layer through-hole 132 (FIG. 40 (FIG. c)). At this time, in the insulating layer through-hole 132, the metal support layer 11 has a height (for example, 1 μm to 3 μm) smaller than the thickness of the insulating layer 10, and is on the piezoelectric element 144 side of the wiring connection portion 16. A roughening forming portion 180 for roughening the surface is formed. For example, the roughened forming portion 180 may be formed in a plurality of island shapes in a plan view, or may be formed in a lattice shape, and the planar shape is not limited. Such a roughened surface forming portion 180 can be formed by, for example, exposing, developing, and imidizing the insulating layer 10 formed using photosensitive polyimide using a halftone mask.

  Next, a plurality of wirings 13 and an insulating layer through-hole 132 enter the insulating layer 10 through a seed layer (not shown), and are electrically connected to the piezo element 144 through a conductive adhesive. A wiring layer 12 having a wiring connection portion 16 is formed (see FIG. 40D). At this time, a part of the wiring connection portion 16 is formed on the roughening forming portion 180.

  After the wiring layer 12 is formed, a protective layer 20 is formed on the insulating layer 10 so as to cover each wiring 13 and the wiring connection portion 16 (see FIG. 40E). Subsequently, in the metal support layer 11, a metal support layer through-hole 131 that penetrates the metal support layer 11 and into which a conductive adhesive is injected is formed (see FIG. 40F).

  Next, the insulating layer opening 181 is formed in the insulating layer 10 and the roughening forming portion 180 is removed (see FIG. 40G). In this case, the insulating layer 10 is half-etched from the metal support layer through-hole 131 by using the metal support layer 11 as a resist and an alkaline etching solution such as an organic alkali etching solution. Thereby, the hole diameter of the insulating layer opening 181 can be made larger (or equivalent) than the hole diameter of the metal support layer through hole 131. In this way, the insulating layer opening 181 is formed, the rough surface forming portion 180 is removed, and the surface on the piezoelectric element 144 side of the wiring connecting portion 16 is roughened.

  Thereafter, as shown in FIG. 40H, a plating layer 115 is formed on the surface of the wiring connection portion 16 on the piezoelectric element 144 side. In this case, a roughened plating layer 115 corresponding to the roughening of the wiring connection portion 16 is formed on the wiring connection portion 16. Thereafter, the metal support layer 11 is trimmed to form the frame body portion 17.

  As described above, according to this embodiment, the surface of the plating layer 115 is roughened by roughening the surface of the wiring connection portion 16 on the side of the piezoelectric element 144, and the conductive adhesive and the plating layer 115 are thus roughened. The contact area with can be further increased. Further, depending on the degree of roughening of the wiring connecting portion 16, that is, the fineness of the roughened forming portion 180, the silver filler of the silver paste constituting the conductive adhesive is allowed to enter the minute unevenness of the surface. Can do. Thereby, the conduction resistance between the conductive adhesive and the plating layer can be reduced. For this reason, the conductivity with the conductive adhesive for connecting the piezo element 144 can be further improved.

  Further, according to the present embodiment, the resin of the silver paste can enter the minute irregularities on the surface of the roughened plating layer. For this reason, the adhesion area between the conductive adhesive and the plating layer 115 can be further increased, and the anchor effect of the conductive adhesive can be further exhibited. For this reason, the adhesiveness with the conductive adhesive for connecting the piezo element 144 can be further improved.

  In the form shown in FIG. 39, the wiring connection part 16 is provided with a wiring layer through hole 133, and the protective layer 20 is provided with a protective layer through hole 134. However, as shown in FIG. 41, the wiring layer through hole 133 and the protective layer through hole 134 may not be provided. Even in this case, since the surface of the plating layer 115 is roughened, the contact area between the conductive adhesive and the plating layer 115 is increased, and the conduction resistance between the conductive adhesive and the plating layer 115 is increased. The conductivity with the conductive adhesive for connecting the piezo element 144 can be improved.

Eleventh Embodiment Next, referring to FIG. 42, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, a suspension substrate manufacturing method, and a suspension manufacturing method according to an eleventh embodiment of the present invention will be described. .

  The eleventh embodiment shown in FIG. 42 is mainly different in that the portion of the conductive adhesive protruding from the wiring layer through hole is covered with a covering member. This is substantially the same as the seventh embodiment shown in FIG. 42, the same parts as those of the seventh embodiment shown in FIGS. 23 to 30 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 42, a portion of the protective layer through-hole 134 where the conductive adhesive is exposed is covered with a covering member (scattering prevention member) 90. The covering member 90 can be formed by, for example, applying an epoxy resin to a portion where the conductive adhesive portion 148 is exposed in the protective layer through-hole 134. Note that such a covering member 90 is also provided in a conductive adhesive portion (not shown) that electrically connects the electrode 144a on the opposite side of the suspension element 1 of the piezo element 144 to the base plate 42. Is preferred.

  Thus, according to the present embodiment, the conductive adhesive portion 148 in the protective layer through-hole 134 is covered with the covering member 90. Thereby, particles such as silver filler can be prevented from scattering from the surface of the conductive adhesive portion 148 made of silver paste.

  Although the embodiments of the present invention have been described in detail, the suspension substrate, the suspension, the suspension with a head, the hard disk drive, the suspension substrate manufacturing method, and the suspension manufacturing method according to the present invention are described above. The present invention is not limited to these, and various modifications can be made without departing from the spirit of the present invention. Of course, these embodiments can be appropriately combined within the scope of the gist of the present invention.

  In the seventh to eleventh embodiments described above, the suspension substrate 1 is a pair disposed on both sides of the substrate body region 2 so as to be connected to the pair of piezo elements 144. The example having the connection structure region 3 has been described. However, the present invention is not limited to this, and the suspension has a single connection structure region 3 so that it can be connected to an integrated piezo element (not shown) having a function equivalent to that of the pair of piezo elements 144. The present invention may be applied to the substrate 1. For example, as shown in FIG. 43, the present invention can be applied to the suspension substrate 1 in which the connection structure region 3 is provided on one side of the substrate body region 2 via the connection region 4. Alternatively, although not shown, the present invention also applies to the suspension substrate 1 in which the single connection structure region 3 is provided integrally with the substrate body region 2 without forming the connection region 4 as shown in FIG. Can be applied.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Board | substrate body area | region 3 Connection structure area | region 5 Head terminal 6 External apparatus connection terminal 10 Insulating layer 10a Outer edge 11 Metal support layer 12 Wiring layer 13 Wiring 15 Injection hole plating layer 16 Wiring connection part 17 Frame body part 17a Outer edge 18 Frame body notch 20 Protective layer 25 Jig hole 30 Observation hole 30a Insulating layer observation hole 30b Protective layer observation hole 32 Metal support layer injection hole 33 Insulating layer injection hole 35 Laminate 41 Suspension 42 Base plate 42a Opening 42b Flexible part 43 Load beam 44 Piezo element 44a First electrode 44b Second electrode 44c Shared electrode 44d First piezoelectric material portion 44e Second piezoelectric material portion 45 First conductive adhesive portion 47 Beam jig hole 48 Second conductive adhesive portion 51 With head Suspension 52 Magnetic head slider 61 Hard disk drive 62 Case 63 Disk 64 Spindle motor 65 Voice coil motor 66 Arm 70 Conductive connection portion 71 Wiring layer conductive connection hole 72 Protective layer conductive connection hole 73 Insulating layer conductive connection hole 74 Inspection through hole 75 Inspection plating layer 80 Second frame body portion 80a Outer edge 81 Second metal support layer injection hole 82 Wiring layer observation hole 83 Observation hole plating layer 90 Cover member 91 Second observation hole 91a Insulating layer observation hole 91b Protective layer observation hole 95 Metal support layer notch part 96 Protective layer notch part 97 Insulation Layer notch 115 Plating layer 131 Metal support layer through hole 131a Outer edge 132 Insulating layer through hole 132a Outer edge 133 Wiring layer through hole 133a Outer edge 134 Protective layer through hole 134a Outer edge 144 Piezo element 144a Electrode 144b Piezoelectric material part 148 Conductive adhesive part 171 Communication cutout portion 172 Second communication cutout portion 180 Roughening forming portion 181 Insulating layer opening portion

Claims (48)

In a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive,
An insulating layer;
A metal support layer provided on the surface of the insulating layer on the actuator element side;
A wiring layer provided on the other surface of the insulating layer, and having a plurality of wirings and a wiring connection portion electrically connected to the actuator element via a conductive adhesive;
The metal support layer is provided in the connection structure region and has a frame body portion including a metal support layer injection hole into which the conductive adhesive is injected,
The outer edge of the frame part of the metal support layer is located inward from the outer edge of the insulating layer,
A suspension substrate, characterized in that an observation hole is provided through which the state of the conductive adhesive can be observed from the outside when the conductive adhesive is injected into the metal support layer injection hole through the insulating layer. The frame part of the metal support layer is provided with a frame notch that communicates the metal support layer injection hole to the outside of the frame part,
The suspension board according to claim 1, wherein the observation hole is disposed outside the frame notch. The metal support layer further includes a second frame body portion including a second metal support layer injection hole communicated with the metal support layer injection hole of the frame body portion via the frame body notch portion,
The suspension substrate according to claim 2, wherein the observation hole is disposed at a position corresponding to the second metal support layer injection hole.   The suspension connection according to any one of claims 1 to 3, further comprising a conductive connection portion that penetrates the insulating layer and connects the frame portion of the metal support layer and the wiring connection portion of the wiring layer. substrate. A protective layer covering the wiring layer;
The suspension substrate according to claim 1, wherein the observation hole extends through the protective layer. A through hole that penetrates the protective layer and exposes the wiring connection portion of the wiring layer is provided,
6. The suspension substrate according to claim 5, wherein a gold plating is applied to an exposed portion of the wiring connection portion in the through hole.   2. The suspension substrate according to claim 1, wherein the observation hole is disposed at a position corresponding to the metal support layer injection hole of the frame body portion and extends through the wiring connection portion of the wiring layer. . A protective layer covering the wiring layer;
The suspension substrate according to claim 7, wherein the observation hole extends through the protective layer.   The suspension substrate according to claim 8, wherein the wiring connection portion of the wiring layer extends inward of the observation hole from the insulating layer and the protective layer.   The suspension substrate according to claim 8 or 9, wherein the exposed portion of the wiring connection portion is gold-plated. A second observation hole is provided through which the state of the conductive adhesive can be observed from the outside when the conductive adhesive is injected into the metal support layer injection hole through the insulating layer and the protective layer;
The frame part of the metal support layer is provided with a frame notch that communicates the metal support layer injection hole to the outside of the frame part,
The suspension substrate according to claim 10, wherein the second observation hole is disposed outside the frame notch. The observation hole has a wiring layer observation hole that penetrates the wiring connection portion of the wiring layer,
The suspension substrate according to claim 8, wherein a plurality of wiring layer observation holes are provided. In a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive,
An insulating layer;
A metal support layer provided on the surface of the insulating layer on the actuator element side;
A wiring layer provided on the other surface of the insulating layer, and having a plurality of wirings and a wiring connection portion electrically connected to the actuator element via a conductive adhesive;
The metal support layer is provided with a metal support layer cutout portion that cuts out a portion of the connection structure region of the metal support layer,
Suspension characterized in that an observation hole is provided in the wiring connecting portion so that the state of the conductive adhesive can be observed from the outside when the conductive adhesive is injected between the wiring connecting portion and the actuator element. Substrate.   The suspension substrate according to claim 13, wherein an observation hole extends in the insulating layer in the connection structure region.   The suspension substrate according to claim 14, wherein the wiring connection portion of the wiring layer extends inward of the observation hole from the insulating layer. A protective layer covering the wiring layer;
The suspension substrate according to claim 14 or 15, wherein the protective layer is provided with a protective layer cutout portion that cuts out a portion of the connection structure region of the protective layer. A protective layer covering the wiring layer;
The protective layer covers at least a part of the wiring connection portion,
The suspension substrate according to claim 14, wherein the observation hole extends through the protective layer. The insulating layer is provided with an insulating layer cutout portion that cuts out a portion of the connection structure region of the insulating layer,
The suspension substrate according to claim 13, wherein the protective layer is provided with a protective layer notch for notching a portion of the connection structure region of the protective layer. The observation hole has a wiring layer observation hole that penetrates the wiring connection portion of the wiring layer,
19. The suspension substrate according to claim 13, wherein a plurality of wiring layer observation holes are provided. A base plate;
The suspension substrate according to any one of claims 1 to 19, which is attached to the base plate via a load beam;
A suspension comprising: an actuator element bonded to at least one of a base plate and a load beam and connected to a connection structure region of a suspension substrate via a conductive adhesive. A base plate;
The suspension substrate according to any one of claims 8 to 12 or 17, which is attached to a base plate via a load beam;
An actuator element bonded to at least one of the base plate and the load beam and connected to a connection structure region of the suspension substrate via a conductive adhesive,
The suspension is characterized in that the conductive adhesive is injected up to the protective layer in the observation hole.   The suspension according to claim 21, wherein a portion of the observation hole where the conductive adhesive is exposed is covered with a covering member. In a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive,
An insulating layer;
A metal support layer provided on the surface of the insulating layer on the actuator element side;
A wiring layer provided on the other surface of the insulating layer, and having a plurality of wirings, and a wiring connecting portion provided in the connection structure region and electrically connected to the actuator element via a conductive adhesive; Prepared,
A suspension substrate, wherein a wiring layer through-hole into which a conductive adhesive is injected is provided in a wiring connection portion.   24. The suspension board according to claim 23, wherein the insulating layer is provided with an insulating layer through-hole that communicates with the wiring layer through-hole and into which a conductive adhesive is injected.   25. The suspension substrate according to claim 24, wherein the metal support layer is provided with a metal support layer through-hole that communicates with the wiring layer through-hole and the insulating layer through-hole and into which a conductive adhesive is injected. .   26. The suspension board according to claim 25, wherein an outer edge of the wiring layer through hole is located inward from an outer edge of the insulating layer through hole and an outer edge of the metal support layer through hole. The metal support layer is provided in the connection structure region, and has a frame part that forms the metal support layer through-hole inside,
27. The suspension substrate according to claim 25 or 26, wherein an outer edge of the frame body portion is located outward from an outer edge of the insulating layer.   28. The suspension substrate according to claim 27, wherein the frame body portion is provided with a communication cutout portion that allows the metal support layer through hole to communicate with the outside of the frame body portion.   29. The suspension substrate according to claim 28, wherein the insulating layer is provided with a second communication cutout portion corresponding to the communication cutout portion and communicating the insulating layer through hole to the outside of the insulation layer.   The suspension substrate according to claim 24, wherein the surface of the insulating layer on the actuator element side is exposed in the connection structure region.   The suspension board according to claim 30, wherein the outer edge of the wiring layer through hole is located inward from the outer edge of the insulating layer through hole.   32. The suspension substrate according to claim 30, wherein a surface of the insulating layer opposite to the actuator element is exposed in the connection structure region. A protective layer provided on the insulating layer and covering each wiring of the wiring layer;
32. The suspension substrate according to claim 24, wherein a protective layer through-hole communicating with the wiring layer through-hole is provided in the protective layer in the connection structure region.   24. The suspension board according to claim 23, wherein the whole wiring connection portion is exposed. A base plate;
The suspension substrate according to any one of claims 23 to 34, which is attached to the base plate via a load beam;
A suspension comprising: an actuator element bonded to at least one of a base plate and a load beam and connected to a connection structure region of a suspension substrate via a conductive adhesive.   36. The suspension according to claim 35, wherein the conductive adhesive protrudes from the wiring layer through hole.   37. The suspension according to claim 36, wherein a portion of the conductive adhesive protruding from the wiring layer through hole is covered with a covering member. A suspension according to any one of claims 20 to 22 or 35 to 37;
And a slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 38. In a method for manufacturing a suspension substrate having a connection structure region connectable to an actuator element via a conductive adhesive,
Preparing a laminate having an insulating layer, a conductive metal support layer provided on the surface of the insulating layer on the actuator element side, and a wiring layer provided on the other surface of the insulating layer;
Forming a plurality of wirings and a wiring connection part electrically connected to the actuator element via a conductive adhesive in the wiring layer;
Forming a metal support layer injection hole into which a conductive adhesive is injected in the metal support layer;
Forming an insulating layer observation hole through which the state of the conductive adhesive can be observed from the outside when the conductive adhesive is injected into the metal support layer injection hole through the insulating layer in the insulating layer;
And a step of forming a frame body portion including the formed metal support layer injection hole while the outer edge is positioned inward from the outer edge of the insulating layer in the metal support layer. Production method. When forming a plurality of wirings and wiring connection parts in the wiring layer, a wiring layer observation hole penetrating the wiring connection part is formed at a position corresponding to the metal support layer injection hole of the frame body part in the wiring connection part,
The suspension substrate according to claim 40, wherein when the insulating layer observation hole is formed in the insulating layer, the insulating layer observation hole is disposed at a position where the metal support layer injection hole and the wiring layer observation hole communicate with each other. Manufacturing method. A step of forming a protective layer covering the wiring layer;
When forming the protective layer, a protective layer observation hole penetrating the protective layer is formed,
The method for manufacturing a suspension substrate according to claim 41, wherein the insulating layer observation hole communicates with the protective layer observation hole. In a method for manufacturing a suspension substrate having a connection structure region connectable to an actuator element via a conductive adhesive,
Preparing a laminate having an insulating layer, a conductive metal support layer provided on the surface of the insulating layer on the actuator element side, and a wiring layer provided on the other surface of the insulating layer;
Forming a plurality of wirings and a wiring connection part electrically connected to the actuator element via a conductive adhesive in the wiring layer;
Forming, in the metal support layer, a metal support layer cutout portion that cuts out a portion of the connection structure region of the metal support layer, and
When forming a wiring connection portion, when a conductive adhesive is injected between the wiring connection portion and the actuator element, a wiring layer observation hole is formed that allows the state of the conductive adhesive to be observed from the outside. A method for manufacturing a suspension substrate.   44. The method for manufacturing a suspension substrate according to claim 43, further comprising the step of forming an insulating layer observation hole penetrating the insulating layer and communicating with the wiring layer observation hole in the insulating layer. A step of forming a protective layer covering the wiring layer;
When forming the protective layer, a protective layer observation hole that penetrates the protective layer and communicates with the insulating layer observation hole is formed in the protective layer so that the protective layer covers at least a part of the wiring connection portion. 45. A method of manufacturing a suspension substrate according to claim 44. In a manufacturing method of a suspension having an actuator element and a suspension substrate including a connection structure region connectable to the actuator element via a conductive adhesive,
A step of preparing a suspension substrate by the method for manufacturing a suspension substrate according to any one of claims 40 to 45;
Attaching the suspension substrate to the base plate via the load beam;
Bonding the actuator element to at least one of the base plate and the load beam using an adhesive;
Injecting a conductive adhesive into the metal support layer injection hole of the frame body and connecting the actuator element to the connection structure region,
When the actuator element is connected to the connection structure region, the conductive adhesive is injected into the metal support layer injection hole while confirming the state of the conductive adhesive through the observation hole of the suspension substrate. A suspension manufacturing method. In a manufacturing method of a suspension having an actuator element and a suspension substrate including a connection structure region connectable to the actuator element via a conductive adhesive,
Preparing a suspension substrate by the method for manufacturing a suspension substrate according to claim 42 or 45;
Attaching the suspension substrate to the base plate via the load beam;
Bonding the actuator element to at least one of the base plate and the load beam using an adhesive;
Using a conductive adhesive, connecting the actuator element to the connection structure region, and
When connecting the actuator element to the connection structure area, the conductive element is conducted to the protective layer observation hole while confirming the state of the conductive adhesive through the insulating layer observation hole, wiring layer observation hole and protective layer observation hole of the suspension substrate. A suspension manufacturing method characterized by injecting an adhesive. In a method for manufacturing a suspension comprising an actuator element, and a suspension substrate including a connection structure region connectable to the actuator element via a conductive adhesive,
An insulating layer, a metal support layer provided on the surface of the insulating layer on the actuator element side, provided on the other surface of the insulating layer, provided with a plurality of wirings and a connection structure region, and a conductive adhesive on the actuator element A suspension substrate having a wiring layer having a wiring connection portion electrically connected to the wiring connection portion and provided with a wiring layer through-hole into which a conductive adhesive is injected in the wiring connection portion. And a process of
Attaching the suspension substrate to the base plate via the load beam;
Bonding the actuator element to at least one of the base plate and the load beam using an adhesive;
A step of injecting a conductive adhesive into a wiring layer through-hole provided in the wiring connection portion and connecting the actuator element to the connection structure region, and
In the step of connecting the actuator element to the connection structure region, the conductive adhesive is injected until it protrudes from the wiring layer through hole.

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