JP2013182642A - Substrate for suspension, suspension, suspension with head, hard disk drive and manufacturing method for substrate for suspension - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for suspension that is capable of improving reliability of electrical connection with an actuator element.SOLUTION: A substrate for suspension 1 according to the invention comprises an insulation layer 10, a metal support layer 11 and a wiring layer 12. Among these layers, the wiring layer 12 includes: multiple lines 13; and a wiring connection part 16 that is connected to the corresponding line 13 and is electrically connected to an actuator element 44 through a conductive adhesive. A connection structure region 3 includes a metal support layer through-hole 32 and an insulation layer through-hole 33, and is at least partially provided with an injection hole 31 where the conductive adhesive is injected. The metal support layer 11 includes a frame body part 17 that forms the metal support layer through-hole 32. The frame body part 17 includes an opposing face 17c that is arranged on a surface opposite to the insulation layer 10 and is opposed to the actuator element 44, and the opposing surface 17c of the frame body part 17 is provided with a groove 18.

Description

  The present invention relates to a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate, and in particular, a suspension substrate and a suspension capable of improving the reliability of electrical connection with an actuator element. The present invention relates to a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate includes a metal support layer and a wiring layer having a plurality of wirings stacked on the metal support layer with an insulating layer interposed therebetween. To write or read data.

  In such a hard disk drive, in order to move the magnetic head slider to a desired data track on the disk, a VCM actuator (for example, a voice coil motor) that rotates an actuator arm that supports the magnetic head slider is used as a servo control system. Is controlled by.

  By the way, in recent years, the track width has been reduced by increasing the density of the disk. For this reason, it may be difficult to accurately align the magnetic head slider to a desired track by the VCM actuator.

  In order to cope with this, a dual actuator type suspension is known in which a VCM actuator and a PZT microactuator (Dual Stage Actuator: DSA) cooperate to move a magnetic head slider to a desired track (for example, , See Patent Document 1). This PZT microactuator is constituted by a piezoelectric element such as a piezoelectric element made of PZT (lead zirconate titanate), and expands and contracts when a voltage is applied to move the magnetic head slider minutely. In such a dual actuator type suspension, the VCM actuator roughly adjusts the position of the magnetic head slider, and the PZT microactuator finely adjusts the position of the magnetic head slider. In this way, the magnetic head slider is aligned with a desired track quickly and accurately.

  In the suspension substrate shown in Patent Document 1, a through-hole is provided in the electrical insulating layer in the terminal portion for supplying power to the piezoelectric element, the wiring portion is exposed, and a ring-like shape is formed on the surface of the electrical insulating layer on the piezoelectric element side. The liquid stop member is provided. By injecting a liquid conductive adhesive into the liquid stop member, the conductive adhesive is joined to the wiring part and the piezoelectric element, and the electrode on the suspension substrate side of the piezoelectric element is electrically connected to the wiring part. It has come to be. In this case, the conductive adhesive is also bonded to the liquid stopper, ensuring the bonding reliability between the conductive adhesive and the suspension substrate, and the electrical connection between the suspension substrate and the piezoelectric element. Secure connection reliability.

JP 2010-165406 A

  However, the bonding area between the conductive adhesive and the liquid stopper is limited due to space constraints. Accordingly, there is a problem that it is difficult to improve the bonding strength between the conductive adhesive and the liquid stop member in order to improve the reliability of the electrical connection between the piezoelectric element and the suspension substrate.

  The present invention has been made in consideration of the above points, and can be used for a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension that can improve the reliability of electrical connection with an actuator element. An object is to provide a method for manufacturing a substrate.

  As a first solution, the present invention provides a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive, an insulating layer, and a metal provided on one surface of the insulating layer. A wiring layer provided on the other surface of the support layer and the insulating layer, the wiring layer provided in the connection structure region, connected to the corresponding wiring, and connected to the actuator element; A wiring connection portion electrically connected via a conductive adhesive, and a metal support layer through-hole penetrating the metal support layer in the connection structure region, and the insulating layer An insulating layer through-hole penetrating through, exposing the surface of the wiring connection portion on the actuator element side, and provided with an injection hole into which the conductive adhesive is injected at least partially, The holding layer includes a frame body portion that forms the metal support layer through-hole, and the frame body portion includes a facing surface that is disposed on a surface opposite to the insulating layer and faces the actuator element. A suspension substrate is provided, wherein a groove is provided on the facing surface of the frame body.

  In the suspension substrate according to the first solving means described above, it is preferable that the groove extends from the inner peripheral surface defining the metal support layer through hole to the outer peripheral surface.

  In the suspension substrate according to the first solving means described above, it is preferable that the plurality of grooves are formed radially on the facing surface of the frame body portion.

  In the suspension substrate according to the first solving means described above, it is preferable that the plurality of grooves are formed in a spiral shape on the facing surface of the frame body portion.

  In the suspension substrate according to the first solving means described above, it is preferable that the groove is formed in a ring shape on the facing surface of the frame body portion.

  In the suspension substrate according to the first solving means described above, it is preferable that the inner surface of the groove is rougher than the opposing surface of the frame body portion.

  In the suspension substrate according to the first solving means described above, it is preferable that the outer peripheral surface of the frame body portion is formed so as to spread from the surface on the insulating layer side toward the opposing surface.

  As a second solution, the present invention provides a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive, an insulating layer, and a metal provided on one surface of the insulating layer. A wiring layer provided on the other surface of the support layer and the insulating layer, the wiring layer provided in the connection structure region, connected to the corresponding wiring, and connected to the actuator element; A wiring connection portion electrically connected via a conductive adhesive, and a metal support layer through-hole penetrating the metal support layer in the connection structure region, and the insulating layer An insulating layer through-hole penetrating through, exposing the surface of the wiring connection portion on the actuator element side, and provided with an injection hole into which the conductive adhesive is injected at least partially, The holding layer includes a frame body portion that forms the metal support layer through-hole, and the frame body portion includes a facing surface that is disposed on a surface opposite to the insulating layer and faces the actuator element. The suspension substrate is characterized in that the outer peripheral surface of the frame body portion is formed so as to expand from the surface on the insulating layer side toward the opposing surface.

  The present invention is a base plate, the above-described suspension substrate attached to the base plate via a load beam, and joined to at least one of the base plate and the load beam, and the connection structure region of the suspension substrate. And the actuator element connected via the conductive adhesive.

  The present invention provides a suspension with a head comprising the above-described suspension and a head slider mounted on the suspension.

  The present invention provides a hard disk drive having the above-described suspension with a head.

  As a third solution, the present invention provides a method for manufacturing a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive, and the insulating layer is provided on one surface of the insulating layer. A step of preparing a laminated body having a formed metal support layer and a wiring layer provided on the other surface of the insulating layer, a plurality of wirings in the wiring layer, and provided in the connection structure region. A wiring connection portion that is connected to the wiring and electrically connected to the actuator element via a conductive adhesive, and the metal support layer is provided in the connection structure region. A step of forming a metal support layer through-hole penetrating the metal support layer, a step of forming a groove on a surface of the metal support layer opposite to the insulating layer, and the insulating layer, the insulating layer A step of forming an insulating layer through-hole penetrating; and in the metal support layer, a frame body portion for forming the metal support layer through-hole, the actuator element being disposed on a surface opposite to the insulating layer, Forming the frame body portion including a facing surface facing the actuator, and provided in the connection structure region by the metal support layer through-hole and the insulating layer through-hole, and the actuator of the wiring connection portion The suspension is characterized in that an element-side surface is exposed, an injection hole into which at least a part of the conductive adhesive is injected is formed, and the groove is disposed on the facing surface of the frame body portion. Provided is a method for manufacturing an industrial substrate.

  In the method for manufacturing a suspension substrate according to the third solution described above, the groove is preferably formed by half etching.

  In the method for manufacturing a suspension substrate according to the third solution described above, it is preferable that the step of forming the metal support layer through hole and the step of forming the groove are performed simultaneously.

  In the method for manufacturing a suspension substrate according to the third solving means described above, it is preferable that the step of forming the groove and the step of forming the frame body portion are performed simultaneously.

  In the suspension substrate manufacturing method according to the third solving means described above, in the step of forming the frame body portion, the outer peripheral surface of the frame body portion is directed from the surface on the insulating layer side toward the opposing surface. It is preferably formed in a divergent shape.

  Further, in the suspension substrate manufacturing method according to the third solving means described above, in the step of forming the frame body portion, the frame body portion is formed so as to extend outward from the facing surface of the frame body portion. As described above, it is preferable that the frame body forming resist is formed and the metal support layer is etched.

  As a fourth solution, the present invention provides a method for manufacturing a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive, and is provided on one surface of the insulating layer and the insulating layer. A step of preparing a laminated body having a formed metal support layer and a wiring layer provided on the other surface of the insulating layer, a plurality of wirings in the wiring layer, and provided in the connection structure region. A wiring connection portion that is connected to the wiring and electrically connected to the actuator element via a conductive adhesive, and the metal support layer is provided in the connection structure region. A step of forming a metal support layer through hole penetrating the metal support layer, a step of forming an insulating layer through hole penetrating the insulating layer in the insulating layer, and the metal support layer, A step of forming a frame body portion that forms a metal support layer through-hole, the frame body portion being disposed on a surface opposite to the insulating layer and including a facing surface facing the actuator element; Provided in the connection structure region by the metal support layer through-hole and the insulating layer through-hole, exposing a surface of the wiring connection portion on the actuator element side, and at least a part of the conductive adhesive In the step of forming the frame body portion, the outer peripheral surface of the frame body portion is formed so as to expand from the surface on the insulating layer side toward the opposing surface. A method for manufacturing a substrate is provided.

  In the suspension substrate manufacturing method according to the fourth solving means described above, in the step of forming the frame body portion, the frame body portion is formed to extend outward from the facing surface of the frame body portion. As described above, it is preferable that the frame body forming resist is formed and the metal support layer is etched.

  According to the present invention, the reliability of electrical connection with an actuator element can be improved.

FIG. 1 is a plan view showing an example of a suspension substrate according to the first embodiment of the present invention. FIG. 2 is a back view showing a connection structure region in the suspension substrate according to the first embodiment of the present invention. 3 is a view showing a cross section (cross section taken along line AA) of the connection structure region of FIG. FIG. 4 is a view showing a cross section of the groove of FIG. FIG. 5 is a plan view showing an example of a suspension according to the first embodiment of the present invention. FIG. 6 is a perspective view showing an example of a piezo element in the suspension according to the first embodiment of the present invention. FIG. 7 is a diagram showing a cross section of a connection structure region connected to the piezoelectric element in the suspension according to the first embodiment of the present invention. FIG. 8 is a plan view showing an example of the suspension with a head according to the first embodiment of the present invention. FIG. 9 is a perspective view showing an example of the hard disk drive according to the first embodiment of the present invention. FIGS. 10A to 10H are views showing a method for manufacturing a suspension substrate in the first embodiment of the present invention. FIG. 11 is a diagram illustrating a modified example of the back surface of the connection structure region. FIG. 12 is a diagram illustrating another modification of the back surface of the connection structure region. FIG. 13 is a plan view showing a modification of the suspension substrate. FIG. 14 is a diagram showing a cross section of the connection structure region in the suspension board according to the second embodiment of the present invention. 15 (a) to 15 (c) are diagrams showing a method for manufacturing a suspension substrate in the second embodiment of the present invention.

  A method of manufacturing a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension substrate according to an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

(First embodiment)
A method for manufacturing a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension substrate according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the suspension substrate 1 includes a substrate body region 2 and a connection structure region 3 that can be connected to a pair of piezo elements (actuator element, see FIG. 5) via a conductive adhesive. Have. Among these, the board body region 2 includes a head terminal 5 connected to a head slider 52 (see FIG. 8), which will be described later, and an external equipment connection terminal 6 connected to an FPC board (external equipment, see FIG. 8) 71. The head terminal 5 and the external device connection terminal 6 are connected by a wiring 13. Further, the pair of connection structure regions 3 are arranged on both sides of the substrate body region 2 and are connected to the substrate body region 2 via the connection region 4.

  As shown in FIGS. 1 and 3, the suspension substrate 1 includes an insulating layer 10, a metal support layer 11 provided on one surface of the insulating layer 10 (the surface on the side of the piezo element 44 to be connected), And a wiring layer 12 provided on the other surface of the insulating layer 10 and having a plurality of wirings 13. Although not shown, a seed layer made of nickel (Ni), chromium (Cr), and copper (Cu) and having a thickness of about 300 nm is interposed between the insulating layer 10 and the wiring layer 12, so The adhesion between the layer 10 and the wiring layer 12 is improved.

  The wiring layer 12 has a wiring connection portion 16 provided in each connection structure region 3. Each wiring connection portion 16 is connected to the corresponding wiring 13 and is electrically connected to the piezo element 44 via a conductive adhesive (for example, silver paste). That is, the wiring 13 connected to the wiring connection portion 16 extends from the external device connection terminal 6 to the connection structure region 3 via the substrate body region 2 and the connection region 4, and to the piezo element 44 via the wiring connection portion 16. It is designed to be electrically connected.

  As shown in FIGS. 2 and 3, the metal support layer 11 includes a metal support layer through-hole 32 provided in the connection structure region 3 and penetrating the metal support layer 11 and into which a conductive adhesive is injected. It has a body part 17. The frame body portion 17 is formed in a circular ring shape in plan view, and has an inner peripheral surface 17a that defines the metal support layer through-hole 32 and an outer peripheral surface 17b. Note that the shape of the frame body portion 17 is not limited to a circular ring shape, and may be any shape as long as it is formed in a frame shape such as an elliptical ring shape.

  The frame body portion 17 includes a facing surface 17 c that is disposed on the surface opposite to the insulating layer 10 and faces the piezo element 44. The inner peripheral surface 17a and the outer peripheral surface 17b of the frame body portion 17 are inclined with respect to the insulating layer 10 because the frame body portion 17 is formed by etching. That is, the inner peripheral surface 17a of the frame body portion 17 is formed so as to expand from the surface on the insulating layer 10 side (the surface 17d on the insulating layer side) toward the opposing surface 17c, and the metal support layer through hole 32 has a truncated cone shape. It is formed in a shape. Further, the outer peripheral surface 17b of the frame body portion 17 is formed in a diverging shape from the facing surface 17c toward the surface 17d on the insulating layer side, and the frame body portion 17 is in a direction opposite to the metal support layer through-hole 32. It is formed in the shape of a truncated cone that has a divergent shape. The inner peripheral surface 17a and the outer peripheral surface 17b of the frame body portion 17 are not limited to being inclined with respect to the insulating layer 10, and the inner peripheral surface 17a and the outer peripheral surface 17b of the frame body portion 17 are insulated. It may be formed to be perpendicular to the layer 10. Further, the metal support layer 11 is not formed in the connection region 4, and the connection region 4 is configured by the insulating layer 10, the wiring layer 12, and the protective layer 20. As a result, the frame portion 17 in the connection structure region 3 is separated from the portion of the metal support layer 11 in the substrate body region 2.

  As shown in FIGS. 2 and 3, a plurality of grooves 18 are provided on the facing surface 17 c of the frame body portion 17. In the present embodiment, the plurality of grooves 18 extend radially from the inner peripheral surface 17a of the frame body portion 17 to the outer peripheral surface 17b. Such a groove | channel 18 is formed by half etching, and has a U-shaped cross section, as shown in FIG. However, the cross-sectional shape of the groove 18 is not limited to the U-shape, and any shape can be used as long as the conductive adhesive can be filled. In addition, since each groove 18 is formed by half etching, the inner surface 18 a of each groove 18 is rougher than the opposing surface 17 c of the frame body portion 17. The surface roughness (Ra, JIS B 0601-2001) of the facing surface 17c of the frame body portion 17 is generally about 11 μm, whereas the surface roughness (Ra) of the inner surface 18a of the groove 18 is, for example, It is preferable that the thickness is about 22 μm. In addition, you may roughen the opposing surface 17c other than the groove | channel 18 among the frame parts 17 by another surface treatment method (For example, acid treatment using perwater, a sulfuric acid, hydrochloric acid etc.). Thereby, the joint strength between the conductive adhesive and the frame body portion 17 can be improved. In this case, for example, it is preferable that the facing surface 17 c is not rougher than the inner surface 18 a of the groove 18, that is, the surface roughness of the facing surface 17 c is smaller than the surface roughness of the inner surface 18 a of the groove 18. Such roughening is not limited to the facing surface 17c, but may be performed on the inner peripheral surface 17a and further on the outer peripheral surface 17b of the frame body portion 17.

  As shown in FIGS. 2 and 3, the insulating layer 10 is provided with an insulating layer through-hole 33 that penetrates the insulating layer 10 and communicates with the metal support layer through-hole 32 and into which a conductive adhesive is injected. ing. With this insulating layer through-hole 33, the wiring connection portion 16 of the wiring layer 12 is exposed to the metal support layer 11 side. That is, the metal support layer through-hole 32 and the insulating layer through-hole 33 constitute the injection hole 31 that exposes the surface of the wiring connection portion 16 on the piezoelectric element 44 side. In the present embodiment, a conductive adhesive is injected into the metal support layer through hole 32 and the insulating layer through hole 33 of the injection hole 31.

  As shown in FIG. 3, nickel (Ni) plating and gold (Au) plating are sequentially applied to a portion of the wiring connection portion 16 exposed in the insulating layer through-hole 33 to form a plating layer 15. . This prevents the exposed portion of the wiring connection portion 16 from being corroded. The thickness of the plating layer 15 is preferably 0.1 μm to 4.0 μm.

  Further, a protective layer 20 is provided on the insulating layer 10 to cover the wiring connection portion 16 of the wiring layer 12. Such a protective layer 20 is formed so as to cover each wiring 13 of the wiring layer 12 in the substrate body region 2 and the connection region 4. In FIG. 1, the protective layer 20 is omitted for the sake of clarity.

  Next, each component will be described in detail.

  The material of the insulating layer 10 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of the insulating layer 10 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 10 is preferably 5 μm to 30 μm, particularly 8 μm to 10 μm. As a result, it is possible to ensure the insulation performance between the metal support layer 11 and each wiring 13 and to prevent the rigidity of the suspension substrate 1 as a whole from being lost.

  Each wiring 13 is configured as a conductor for transmitting an electrical signal, and the material of each wiring 13 is not particularly limited as long as it has a desired conductivity, but copper (Cu) Is preferably used. In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 13 is, for example, 1 μm to 18 μm, particularly 9 μm to 12 μm. As a result, it is possible to ensure the transmission characteristics of each wiring 13 and to prevent the flexibility of the suspension substrate 1 as a whole from being lost. In addition, the wiring connection part 16 is formed with the same material and the same thickness as each wiring 13.

  The material of the metal support layer 11 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. The thickness of the metal support layer 11 is preferably larger than the thickness of the wiring 13. Moreover, the thickness of the metal support layer 11 can be 10 micrometers-30 micrometers as an example, and can be 15 micrometers-20 micrometers especially. As a result, the conductivity, rigidity, and elasticity of the metal support layer 11 can be ensured.

  As a material of the protective layer 20, it is preferable to use a resin material such as polyimide. The material of the protective layer 20 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 20 is preferably 2 μm to 30 μm.

  Next, the suspension 41 in the present embodiment will be described with reference to FIGS. The suspension 41 shown in FIG. 5 is attached to the base plate 42, the base plate 42, the load beam 43 that holds the metal support layer 11 of the suspension substrate 1, the above-described suspension substrate 1, the base plate 42, and the load beam 43. And a piezo element 44 connected to the connection structure region 3 of the suspension substrate 1. In the present embodiment, the piezo element 44 is joined to the base plate 42. The base plate 42 and the load beam 43 are made of stainless steel.

  The piezo element 44 is configured as a piezoelectric element that expands and contracts when a voltage is applied. As shown in FIG. 6, each piezo element 44 is interposed between a pair of electrodes 44a facing each other and a pair of electrodes 44a, and is formed of a piezoelectric material such as PZT (lead zirconate titanate). Part 44b. The piezoelectric material portions 44b of the pair of piezo elements 44 are formed to have polarization directions different from each other by 180 °. When a predetermined voltage is applied, one piezo element 44 contracts and the other piezo element 44 44 extends. Such piezo elements 44 are preferably arranged symmetrically with respect to the longitudinal axis passing through the center of the head slider 52. In this way, the expansion and contraction of each piezo element 44 can be made uniform with respect to the displacement of the head slider 52 in the sway direction, and the displacement of the head slider 52 in the sway direction can be easily adjusted. It is designed to function as an actuator element. In the present embodiment, since the connection structure region 3 connected to the piezo element 44 is disposed on both sides of the substrate body region 2, the expansion and contraction of the piezo element 44 can be effectively performed by the displacement of the head slider 52. It can be used for.

  Such a piezo element 44 is joined to the base plate 42 by a non-conductive adhesive. Although not shown, one electrode 44a (opposite to the suspension substrate 1) of the piezo element 44 is electrically connected to the base plate 42 using a conductive adhesive.

  On the other hand, the electrode 44a on the other side (the suspension substrate 1 side) of the piezo element 44 is joined and electrically connected to the connection structure region 3 using a conductive adhesive. That is, as shown in FIG. 7, a conductive adhesive is injected into the metal support layer through-hole 32 and the insulating layer through-hole 33 of the injection hole 31 in the connection structure region 3 to form a conductive adhesive portion 48, and the piezo is formed. The element 44 is bonded to the connection structure region 3 via the conductive adhesive portion 48, and the electrode 44 a of the piezo element 44 is electrically connected to the wiring connection portion 16 via the conductive adhesive portion 48. ing. The conductive adhesive portion 48 extends outward of the frame body portion 17 through a minute gap formed between the frame body portion 17 of the metal support layer 11 and the piezoelectric element 44, and the frame body portion 17. It extends also to the groove 18 provided in the opposing surface 17c.

  Next, the suspension with head 51 in the present embodiment will be described with reference to FIG. A suspension 51 with a head shown in FIG. 8 has the above-described suspension 41 and a head slider 52 connected to the head terminal 5 of the suspension substrate 1.

  Next, the hard disk drive 61 in the present embodiment will be described with reference to FIG. The hard disk drive 61 shown in FIG. 9 has a case 62, a disk 63 that is rotatably attached to the case 62, stores data, a spindle motor 64 that rotates the disk 63, and a desired flying height on the disk 63. And a suspension 51 with a head including a head slider 52 that writes and reads data to and from the disk 63. Among them, the suspension with head 51 is attached to the case 62 so as to be movable, and the voice coil motor 65 for moving the head slider 52 of the suspension with head 51 along the disk 63 is attached to the case 62. Yes. The suspension 51 with a head is attached to the voice coil motor 65 via an arm 66 and attached to an FPC board 71 (see FIG. 8) connected to a control unit (not shown) that controls the hard disk drive 61. ing. In this way, an electrical signal is transmitted between the control unit and the head slider 52 via the suspension board 1 and the FPC board 71.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, a method for manufacturing the suspension substrate 1 will be described. Here, as an example, a method of manufacturing the suspension substrate 1 by the subtractive method will be described with reference to FIG. 10 showing a cross section of the connection structure region 3. In FIG. 10, the cross-sectional shape of the groove 18 as shown in FIG. 4 is shown in the frame body portion 17 for the sake of clarity. The suspension substrate 1 is not limited to the subtractive method, and may be manufactured by an additive method. In this case, a part of the wiring connection portion 16 is formed in the insulating layer through hole 33. That is, the wiring layer 12 is formed on the insulating layer 10 on which the insulating layer through-hole 32 has been formed in advance, and at this time, a part of the wiring connection portion 16 is formed in the insulating layer through-hole 33 and the other one is formed. The portion is formed on the insulating layer 10. In this case, the conductive adhesive is not injected into the insulating layer through hole 33 but is injected into the metal support layer through hole 32. That is, the conductive adhesive is injected into a part of the injection hole 31 (metal support layer through hole 32) constituted by the metal support layer through hole 32 and the insulating layer through hole 33.

  First, the insulating layer 10, the metal support layer 11 provided on one surface of the insulating layer 10 (the surface on the side of the piezo element 44 to be connected), the wiring layer 12 provided on the other surface of the insulating layer 10, and Are prepared (see FIG. 10A). In this case, first, the metal support layer 11 is prepared, and the insulating layer 10 is formed on the metal support layer 11 by a coating method using non-photosensitive polyimide. Subsequently, nickel, chromium and copper are sequentially coated on the insulating layer 10 by a sputtering method to form a seed layer (not shown). Thereafter, the wiring layer 12 is formed by copper plating using the seed layer as a conductive medium. In this way, a laminated body 35 having the insulating layer 10, the metal support layer 11, and the wiring layer 12 is obtained.

  Subsequently, a plurality of wirings 13 and wiring connection portions 16 are formed in the wiring layer 12, and a metal support layer through hole 32 is formed in the metal support layer 11. At the same time, a plurality of grooves 18 are formed by half etching on the surface of the metal support layer 11 opposite to the insulating layer 10 (position corresponding to the facing surface 17c of the frame body portion 17).

  In this case, as shown in FIG. 10B, first, a patterned first resist 81 is formed on the lower surface of the metal support layer 11 by a photofabrication technique. The first resist 81 has a groove forming opening 81 a having a small width for forming the groove 18, and an injection hole forming opening 81 b for forming the metal support layer through-hole 32. Further, a second resist 82 for forming the wiring connection portion 16 is formed in the wiring layer 12 in the same manner as the first resist 81.

  Next, portions of the metal support layer 11 exposed from the openings 81a and 81b of the first resist 81 are etched, and portions of the wiring layer 12 exposed from the openings of the second resist 82 are etched. In this way, the metal support layer through hole 32, the groove 18 and the wiring connection portion 16 are formed (see FIG. 10C). At this time, since the groove forming opening 81a of the first resist 81 is formed with a very small width, the entry of the etching solution is suppressed. Thus, the groove 18 is obtained by half-etching the metal support layer 11. Here, the method of etching the wiring layer 12 and the metal support layer 11 is not particularly limited, but it is preferable to perform wet etching. In particular, the etching solution is preferably selected as appropriate according to the type of material of the metal support layer 11. For example, when the metal support layer 11 is made of stainless steel, a chloride such as ferric chloride aqueous solution is used. An iron-based etchant can be used.

  After the etching is performed, the first resist 81 and the second resist 82 are removed (see FIG. 10D). Here, when the portion corresponding to the facing surface 17c other than the groove 18 of the frame portion 17 is roughened, the portion corresponding to the facing surface 17c after the first resist 81 and the second resist 82 are removed. (And inner peripheral surface 17a) may be roughened by acid treatment or the like, for example. Such roughening includes a step of removing the first resist 81 and the second resist 82 (see FIG. 10D) and a step of forming a protective layer 20 described later (see FIG. 10E). Although it may be performed in between, if the part corresponding to the opposing surface 17c is exposed or the opposing surface 17c is formed, it can also be performed between each process demonstrated below. In addition, when roughening the outer peripheral surface 17b of the frame part 17, it can carry out after the process (refer FIG.10 (h)) in which the frame part 17 mentioned later is formed.

  After the metal support layer through-hole 32, the groove 18 and the wiring connection portion 16 are formed in this way, a protective layer having a desired shape covering the wiring 13 and the wiring connection portion 16 of the wiring layer 12 is formed on the insulating layer 10. 20 is formed (see FIG. 10E). In this case, non-photosensitive polyimide is coated on the insulating layer 10 using a die coater, and dried to form the protective layer 20. Subsequently, a patterned resist (not shown) is formed on the formed protective layer 20, and the exposed portion of the protective layer 20 is etched to cure the protective layer 20. In this way, the protective layer 20 having a desired shape is obtained. Thereafter, the resist is removed.

  After the protective layer 20 is obtained, the insulating layer through-hole 33 is formed in the insulating layer 10 and the insulating layer 10 is trimmed into a desired shape (see FIG. 10F). In this case, first, a patterned resist (not shown) is formed, and the exposed portion of the insulating layer 10 is etched to form the insulating layer through-hole 33 and the insulating layer 10 is trimmed. In this way, the insulating layer through-hole 33 is obtained, and the injection hole 31 constituted by the metal support layer through-hole 32 and the insulating layer through-hole 33 is formed, whereby the piezo element 44 of the wiring connection portion 16 is formed. The side surface is exposed. Here, the method of etching the insulating layer 10 is not particularly limited, but it is preferable to perform wet etching. In particular, the etching solution is preferably selected as appropriate according to the type of material of the insulating layer 10. For example, when the insulating layer 10 is formed of a polyimide resin, an alkaline etching solution such as an organic alkaline etching solution is used. Can be used. After the etching is performed, the resist is removed.

  Next, the exposed portion of the wiring connection portion 16 is plated to form a plating layer 15 (see FIG. 10G). That is, the exposed portion of the wiring connection portion 16 is subjected to acid cleaning, and nickel plating and gold plating are sequentially performed by an electrolytic plating method to form a plating layer 15 having a thickness of 0.5 μm to 4.0 μm. Is done. In this case, the plating is similarly applied to the head terminal 5 connected to the head slider 52 and the external device connection terminal 6 (both see FIG. 1). Note that the type of plating is not limited to nickel plating and gold plating, but may be silver (Ag) plating or palladium (Pd) plating.

  After the plating layer 15 is formed, the metal support layer 11 is trimmed to form the frame body portion 17 including the metal support layer through-holes 32 (see FIG. 10H). In this case, first, a patterned resist (not shown) is formed on the lower surface of the metal support layer 11 using a dry film. Next, for example, a portion of the metal support layer 11 exposed from the resist is etched with an iron chloride-based etchant to form the frame body portion 17 and the metal support layer 11 is processed into a desired shape. . The frame body portion 17 is separated from the portion of the metal support layer 11 in the substrate main body region 2. Thereafter, the resist is removed, and the suspension substrate 1 according to the present embodiment is obtained.

  Next, a suspension manufacturing method using the suspension substrate 1 thus obtained will be described.

  First, as shown in FIG. 5, the base plate 42 and the load beam 43 are prepared, and the suspension substrate 1 is prepared as described above.

  Subsequently, the suspension substrate 1 is attached to the base plate 42 via the load beam 43 by welding.

  Subsequently, the piezo element 44 is bonded to the base plate 42 using a non-conductive adhesive, and one electrode 44a of the piezo element 44 is electrically connected to the base plate 42 using a conductive adhesive. The

  Also, conductive adhesive is injected into the metal support layer through hole 32 and the insulating layer through hole 33 of the injection hole 31 from the gap between the frame portion 17 of the metal support layer 11 and the electrode 44 a of the piezo element 44. A conductive adhesive portion 48 (see FIG. 7) is formed. At this time, the conductive adhesive is filled by a capillary phenomenon in a minute gap formed between the frame body portion 17 and the piezo element 44 and flows out of the frame body portion 17, and at the same time, the frame body portion 17. The groove 18 formed in the opposite surface 17c is also filled. In this way, the other electrode 44a of the piezo element 44 is joined and electrically connected to the connection structure region 3 of the suspension substrate 1 via the conductive adhesive portion 48, and the suspension 41 shown in FIG. Is obtained.

  A head slider 52 is connected to the head terminal 5 of the suspension 41 to obtain the suspension with head 51 shown in FIG. Further, the suspension 51 with the head is attached to the arm 66, and the FPC board 71 is attached to the external device connection terminal 6 of the suspension board 1 to obtain the hard disk drive 61 shown in FIG.

  When data is written and read in the hard disk drive 61 shown in FIG. 9, the head slider 52 of the suspension 51 with the head is moved along the disk 63 by the voice coil motor 65 and is rotated by the spindle motor 64. Keep close to the desired flying height. As a result, data is exchanged between the head slider 52 and the disk 63. During this time, an electrical signal is transmitted between the control unit (not shown) connected to the FPC board 71 and the head slider 52 via the suspension board 1 and the FPC board 71. Such an electric signal is transmitted between the head terminal 5 (see FIG. 1) and the external device connection terminal 6 through each wiring 13 in the suspension board 1.

  When moving the head slider 52, the voice coil motor 65 roughly adjusts the position of the head slider 52, and the piezo element 44 finely adjusts the position of the head slider 52. That is, when a predetermined voltage is applied to the electrodes 44a of the piezo elements 44 on the pair of connection structure regions 3 side of the suspension substrate 1, one piezo element 44 contracts in the longitudinal direction and the other piezo element 44 Elongates (see FIG. 5). In this case, a part of the base plate 42 and the load beam 43 is elastically deformed, and the head slider 52 located on the tip side of the load beam 43 can move in the sway direction (turning direction). In this way, the head slider 52 can be quickly and accurately aligned with a desired track of the disk 63.

  As described above, according to the present embodiment, the groove 18 is provided in the facing surface 17 c of the frame body portion 17. Thus, the groove 18 can be filled with the conductive adhesive that connects the connection structure region 3 of the suspension substrate 1 and the piezo element 44. For this reason, it is possible to increase the bonding area between the conductive adhesive and the frame body portion 17 and improve the bonding strength. In addition, the conductive adhesive is filled in the groove 18 provided on the facing surface 17c of the frame body portion 17, whereby an anchor effect is generated in the conductive adhesive portion 48 formed of the conductive adhesive. Furthermore, since the inner surface 18 a of the groove 18 is rougher than the opposing surface 17 c of the frame body portion 17, the bonding strength between the conductive adhesive and the frame body portion 17 can be further improved. As a result, the bonding strength between the conductive adhesive and the frame body portion 17 can be improved, and the reliability of electrical connection between the piezo element 44 and the suspension substrate 1 can be improved.

  Further, according to the present embodiment, each groove 18 extends from the inner peripheral surface 17 a that defines the metal support layer through-hole 32 to the outer peripheral surface 17 b. Thus, when the conductive adhesive is injected into the metal support layer through-hole 32 and the insulating layer through-hole 33, the air in the metal support layer through-hole 32 and the insulating layer through-hole 33 is framed through the grooves 18. It can escape to the outside of the body part 17. In particular, since the plurality of grooves 18 are formed radially, the air in the metal support layer through holes 32 and the insulating layer through holes 33 can be efficiently released to the outside of the frame body portion 17. For this reason, the bonding strength between the conductive adhesive and the frame body portion 17 can be improved, and the reliability of electrical connection between the piezo element 44 and the suspension substrate 1 can be improved.

  Moreover, according to this Embodiment, the frame part 17 is formed in circular ring shape. As a result, the conductive adhesive is filled in the metal support layer through-hole 32 and the insulating layer through-hole 33, and the entire area of the opposing surface 17c of the frame body portion 17 and the frame body portion 17 side of the piezo element 44 are disposed. The minute gap between the surfaces is filled by capillary action. For this reason, while being able to join a conductive adhesive over the whole opposing surface 17c of the frame part 17, the joining area of a conductive adhesive and the piezo element 44 can be increased. As a result, the bonding strength between the piezo element 44 and the suspension substrate 1 can be improved, and the reliability of electrical connection between the piezo element 44 and the suspension substrate 1 can be improved.

  Hereinafter, a modification of the first embodiment will be described with reference to FIGS. 11 and 12. 11 and 12, the same reference numerals are given to the same portions as those of the first embodiment shown in FIGS. 1 to 10, and detailed description thereof is omitted.

  As shown in FIG. 11, the groove 18 may be formed in a spiral shape on the facing surface 17 c of the frame body portion 17. In this case, the length of each groove 18 is increased, the ratio of the area of the groove 18 to the area of the opposing surface 17c of the frame body part 17 is increased, and the bonding strength between the conductive adhesive and the frame body part 17 is further increased. Can be improved. Also in this case, when the conductive adhesive is injected into the metal support layer through-hole 32 and the insulating layer through-hole 33, the air in the metal support layer through-hole 32 and the insulating layer through-hole 33 is changed to the frame body portion 17. Can escape to the outside efficiently. As a result, the bonding strength between the conductive adhesive and the frame body portion 17 can be improved, and the reliability of electrical connection between the piezo element 44 and the suspension substrate 1 can be improved.

  Further, as shown in FIG. 12, the groove 18 may be formed in a ring shape on the facing surface 17 c of the frame body portion 17. That is, in the embodiment shown in FIG. 12, one circular ring-shaped groove 18 is provided on the opposing surface 17c of the frame body portion 17, and this groove 18 is formed on the inner peripheral surface 17a and the outer periphery of the frame body portion 17. It is formed concentrically with respect to the surface 17b. In this case, the bonding strength between the conductive adhesive and the frame body portion 17 can be improved uniformly over the circumferential direction of the frame body portion 17, and the electrical connection between the piezo element 44 and the suspension substrate 1 is reliable. Can be improved. In addition, the groove | channel 18 is not restricted to circular ring shape, If it is ring shape, it can be made into arbitrary shapes.

  Further, in the above-described embodiment, a pair of connection structures disposed on both sides of the substrate body region 2 so that the suspension substrate 1 can be connected to the pair of piezo elements 44 as shown in FIG. The example which has the area | region 3 was demonstrated. However, the present invention is not limited to this, and the suspension has a single connection structure region 3 so that it can be connected to an integrated piezo element (not shown) having a function equivalent to that of the pair of piezo elements 44. The present embodiment may be applied to the substrate 1. For example, as shown in FIG. 13, the present invention can be applied to a suspension substrate 1 in which a connection structure region 3 is provided on one side of a substrate body region 2 via a connection region 4. Alternatively, although not shown, the present invention is also applied to the suspension substrate 1 in which the single connection structure region 3 is arranged in the substrate body region 2 without forming the connection region 4 as shown in FIG. can do.

  Furthermore, in the above-described embodiment, the example in which the step of forming the metal support layer through hole 32 and the wiring connection portion 16 and the step of forming the groove 18 are performed simultaneously has been described. However, the present invention is not limited to this, and the step of forming the groove 18 may be performed simultaneously with the step of forming the frame body portion 17. Alternatively, the step of forming the metal support layer through hole 32 and the wiring connection portion 16 and the step of forming the groove 18 may be performed separately. That is, the step of forming the groove 18 may be performed before the step of forming the metal support layer through-hole 32 and the wiring connection portion 16, or may be performed after the step.

(Second Embodiment)
Next, with reference to FIG. 14 and FIG. 15, description will be given of a manufacturing method of the suspension substrate, the suspension, the suspension with head, the hard disk drive, and the suspension substrate in the second embodiment of the present invention.

  The second embodiment shown in FIG. 14 and FIG. 15 is mainly different in that the outer peripheral surface of the frame body portion is formed in a divergent shape from the surface on the insulating layer side toward the opposing surface. The configuration is substantially the same as that of the first embodiment shown in FIGS. 14 and 15, the same parts as those of the first embodiment shown in FIGS. 1 to 10 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 14, the outer peripheral surface 17 b of the frame body portion 17 is formed in a divergent shape from the surface 17 d on the insulating layer side toward the facing surface 17 c. In this way, the frame body portion 17 is formed in a truncated cone shape that is widened like the metal support layer through-hole 32.

  The suspension substrate 1 according to the present embodiment can be manufactured by forming the frame body portion 17 as follows after the plating layer 15 is formed (see FIG. 10H).

  First, a patterned frame body portion forming resist 83 is formed so as to extend outward of the frame body portion 17 from the opposing surface 17c of the formed frame body portion 17 (see FIG. 15A). That is, the metal support layer 11 is covered with the frame body portion forming resist 83 not only in the region corresponding to the frame body portion 17 to be formed, but also in the surrounding region. Subsequently, the portion of the metal support layer 11 exposed from the frame portion forming resist 83 is etched (see FIG. 15B). In this case, since the frame body forming resist 83 is formed to extend outward from the frame body portion 17, the outer peripheral surface 17 b of the frame body portion 17 is etched only from the insulating layer 10 side (upper side in FIG. 15). The liquid flows in, and the etching liquid does not flow from the lower side shown in FIG. As a result, the outer peripheral surface 17b of the frame body portion 17 can be formed in a divergent shape from the surface 17d on the insulating layer side toward the opposing surface 17c. Thereafter, the frame portion forming resist 83 is removed, and the suspension substrate 1 according to the present embodiment is obtained (see FIG. 15C).

  In addition, since the frame part 17 in this Embodiment is formed as mentioned above, the insulating layer 10 of the connection area | region 4 (refer FIG. 1) is provided upwards among the outer peripheral surfaces 17b of the frame part 17. FIG. In some cases, it is difficult to form the portion in a divergent shape from the surface 17d on the insulating layer side toward the facing surface 17c. In this case, the portion of the outer peripheral surface 17b may be formed in a divergent shape from the facing surface 17c toward the surface 17d on the insulating layer side as shown in FIG. It may be formed vertically. That is, in the present invention, the entire outer peripheral surface 17b of the frame body portion 17 is formed in a divergent shape from the surface 17d on the insulating layer side toward the facing surface 17c, and the outer peripheral surface 17b of the frame body portion 17 A part of the insulating layer is formed in a divergent shape from the surface 17d on the insulating layer side toward the facing surface 17c. Even in the latter case, the ratio of the portion where the insulating layer 10 of the connection region 4 is provided above the entire outer peripheral surface 17b of the frame body portion 17 is small, and therefore the outer peripheral surface 17b of the frame body portion 17 is not provided. Many portions can be formed in a diverging shape from the surface 17d on the insulating layer side toward the facing surface 17c.

  As described above, according to the present embodiment, the outer peripheral surface 17b of the frame body portion 17 is formed so as to expand from the surface 17d on the insulating layer side toward the opposing surface 17c. Thereby, the area of the opposing surface 17c of the frame part 17 can be increased. For this reason, it is possible to increase the bonding area between the conductive adhesive and the frame body portion 17 and improve the bonding strength. As a result, the joint strength between the conductive adhesive and the frame body portion 17 is improved together with the effect of increasing the joint strength by the grooves 18 provided on the facing surface 17c of the frame body portion 17, and the piezo element 44 and the suspension are improved. The reliability of electrical connection with the substrate 1 can be improved.

  In the above-described embodiment, a pair of connection structures disposed on both sides of the substrate body region 2 so that the suspension substrate 1 can be connected to the pair of piezoelectric elements 44 as shown in FIG. Although the example having the region 3 has been described, the present invention is not limited to this. As shown in FIG. 13, the connection structure region 3 is provided on one side of the substrate body region 2 via the connection region 4. It is also possible to apply the present invention to the suspension substrate 1 formed.

  Moreover, in this Embodiment, the example in which the groove | channel 18 was provided in the opposing surface 17c of the frame part 17 was demonstrated. However, the present invention is not limited to this, and the groove 18 as shown in FIG. 14 may not be provided on the facing surface 17 c of the frame body portion 17. Even in this case, as described above, since the area of the facing surface 17c of the frame body portion 17 can be increased, the bonding strength between the conductive adhesive and the frame body portion 17 is improved, and the piezo element 44 and the suspension are increased. The reliability of electrical connection with the substrate 1 can be improved.

  Although the embodiments of the present invention have been described in detail, the suspension substrate, the suspension, the suspension with a head, the hard disk drive, and the suspension substrate manufacturing method according to the present invention are not limited to the above-described embodiments. Instead, various modifications can be made without departing from the spirit of the present invention, and the embodiments can be partially combined.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Board | substrate body area | region 3 Connection structure area | region 4 Connection area | region 5 Head terminal 6 External apparatus connection terminal 10 Insulation layer 11 Metal support layer 12 Wiring layer 13 Wiring 15 Plating layer 16 Wiring connection part 17 Frame part 17a Inner peripheral surface 17b Outer peripheral surface 17c Opposing surface 17d Insulating layer side surface 18 Groove 18a Inner surface 20 Protective layer 31 Injection hole 32 Metal support layer through hole 33 Insulating layer through hole 35 Laminate 41 Suspension 42 Base plate 43 Load beam 44 Piezo element 44a Electrode 44b Piezoelectric Material part 48 Conductive adhesive part 51 Suspension with head 52 Head slider 61 Hard disk drive 62 Case 63 Disk 64 Spindle motor 65 Voice coil motor 66 Arm 71 FPC board 81 First resist 81a Groove formation opening 81b Injection hole formation opening 82 2 Strike 83 frame portion for forming a resist

Claims (19)

In a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive,
An insulating layer;
A metal support layer provided on one surface of the insulating layer;
A wiring layer provided on the other surface of the insulating layer, provided in a plurality of wirings and in the connection structure region, connected to the corresponding wirings, and the conductive adhesive is applied to the actuator elements. A wiring connection portion electrically connected via the wiring layer, and
The connection structure region has a metal support layer through hole penetrating the metal support layer and an insulating layer through hole penetrating the insulating layer, and exposes the actuator element side surface of the wiring connection portion. An injection hole into which the conductive adhesive is injected at least in part,
The metal support layer has a frame part that forms the metal support layer through-hole,
The frame portion includes a facing surface that is disposed on a surface opposite to the insulating layer and faces the actuator element;
A suspension substrate, wherein a groove is provided on the facing surface of the frame body.   The suspension substrate according to claim 1, wherein the groove extends from an inner peripheral surface defining the metal support layer through hole to an outer peripheral surface.   The suspension substrate according to claim 2, wherein the plurality of grooves are formed radially on the facing surface of the frame body portion.   The suspension substrate according to claim 2, wherein a plurality of the grooves are formed in a spiral shape on the facing surface of the frame body portion.   The suspension substrate according to claim 1, wherein the groove is formed in a ring shape on the facing surface of the frame body portion.   The suspension substrate according to any one of claims 1 to 5, wherein an inner surface of the groove is rougher than the facing surface of the frame body portion.   The suspension substrate according to any one of claims 1 to 6, wherein an outer peripheral surface of the frame body portion is formed so as to expand from the surface on the insulating layer side toward the facing surface. In a suspension substrate having a connection structure region that can be connected to an actuator element via a conductive adhesive,
An insulating layer;
A metal support layer provided on one surface of the insulating layer;
A wiring layer provided on the other surface of the insulating layer, provided in a plurality of wirings and in the connection structure region, connected to the corresponding wirings, and the conductive adhesive is applied to the actuator elements. A wiring connection portion electrically connected via the wiring layer, and
The connection structure region has a metal support layer through hole penetrating the metal support layer and an insulating layer through hole penetrating the insulating layer, and exposes the actuator element side surface of the wiring connection portion. An injection hole into which the conductive adhesive is injected at least in part,
The metal support layer has a frame part that forms the metal support layer through-hole,
The frame portion includes a facing surface that is disposed on a surface opposite to the insulating layer and faces the actuator element;
The suspension substrate according to claim 1, wherein an outer peripheral surface of the frame body portion is formed in a divergent shape from a surface on the insulating layer side toward the opposing surface. A base plate;
The suspension substrate according to any one of claims 1 to 8, which is attached to the base plate via a load beam;
The suspension comprising: the actuator element joined to at least one of the base plate and the load beam, and connected to the connection structure region of the suspension substrate via the conductive adhesive. . The suspension according to claim 9,
A suspension with a head, comprising: a head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 10. In a method for manufacturing a suspension substrate having a connection structure region connectable to an actuator element via a conductive adhesive,
Preparing a laminate having an insulating layer, a metal support layer provided on one surface of the insulating layer, and a wiring layer provided on the other surface of the insulating layer;
In the wiring layer, a plurality of wirings, a wiring connection portion provided in the connection structure region, connected to the corresponding wiring, and electrically connected to the actuator element via a conductive adhesive, Forming a step;
In the metal support layer, a step of forming a metal support layer through-hole provided in the connection structure region and penetrating the metal support layer;
Forming a groove on a surface of the metal support layer opposite to the insulating layer;
Forming an insulating layer through-hole penetrating the insulating layer in the insulating layer;
In the metal support layer, the frame body portion forming the metal support layer through-hole, the frame body portion being disposed on a surface opposite to the insulating layer and including a facing surface facing the actuator element, Forming, and
The metal support layer through-hole and the insulating layer through-hole are provided in the connection structure region, expose the surface of the wiring connection portion on the actuator element side, and the conductive adhesive is injected into at least a part thereof. The suspension substrate manufacturing method is characterized in that an injection hole is formed, and the groove is disposed on the facing surface of the frame body portion.   The method for manufacturing a suspension substrate according to claim 12, wherein the groove is formed by half etching.   The method for manufacturing a suspension substrate according to claim 12 or 13, wherein the step of forming the metal support layer through hole and the step of forming the groove are performed simultaneously.   The method for manufacturing a suspension substrate according to claim 12 or 13, wherein the step of forming the groove and the step of forming the frame body portion are performed simultaneously.   16. In the step of forming the frame body portion, the outer peripheral surface of the frame body portion is formed in a divergent shape from the surface on the insulating layer side toward the opposing surface. A method for producing a suspension substrate according to claim 1.   In the step of forming the frame body part, a resist for forming a frame body part is formed so as to extend outward from the facing surface of the frame body part to be formed, and the metal support layer is The method of manufacturing a suspension substrate according to claim 16, wherein the suspension substrate is etched. In a method for manufacturing a suspension substrate having a connection structure region connectable to an actuator element via a conductive adhesive,
Preparing a laminate having an insulating layer, a metal support layer provided on one surface of the insulating layer, and a wiring layer provided on the other surface of the insulating layer;
In the wiring layer, a plurality of wirings, a wiring connection portion provided in the connection structure region, connected to the corresponding wiring, and electrically connected to the actuator element via a conductive adhesive, Forming a step;
In the metal support layer, a step of forming a metal support layer through-hole provided in the connection structure region and penetrating the metal support layer;
Forming an insulating layer through-hole penetrating the insulating layer in the insulating layer;
In the metal support layer, the frame body portion forming the metal support layer through-hole, the frame body portion being disposed on a surface opposite to the insulating layer and including a facing surface facing the actuator element, Forming, and
The metal support layer through-hole and the insulating layer through-hole are provided in the connection structure region, expose the surface of the wiring connection portion on the actuator element side, and the conductive adhesive is injected into at least a part thereof. The injection hole to be configured,
In the step of forming the frame body portion, the outer peripheral surface of the frame body portion is formed so as to be divergent from the surface on the insulating layer side toward the opposing surface.   In the step of forming the frame body part, a resist for forming a frame body part is formed so as to extend outward from the facing surface of the frame body part to be formed, and the metal support layer is The method of manufacturing a suspension substrate according to claim 18, wherein the suspension substrate is etched.

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