JP2012196697A - Soldering device and method of manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering device capable of preventing defective continuity from occurring even if a thread solder is used and capable of performing welding with high accuracy; and to provide a method of manufacturing electronic components.SOLUTION: In an embodiment, the soldering device includes: a supplying device for supplying the continuing thread solder; a cutting device for cutting as much thread solder thus supplied by the supplying device as necessary to perform soldering on a portion to be soldered; a carrying device for carrying the thread solder thus cut by the cutting device to the portion while holding the thread solder; and a melting device for melting the thread solder thus carried by the carrying device to the portion.

Description

  Embodiments described herein relate generally to a soldering apparatus that solders an electronic component using thread solder and a method for manufacturing the electronic component.

  Currently, soldering with a solder material is performed on electronic components of electronic equipment, such as circuit boards, wires, and semiconductor devices. As such a solder material, cream solder, solder balls, thread solder, or the like is used.

  Cream solder has limitations on the parts and types of electronic components that can be used depending on the material and melting method. In addition, cream solder may be deteriorated due to oxidation or the like. Moreover, cream solder is relatively expensive.

  Solder balls are expensive. Moreover, the technique for arrange | positioning a solder ball in the position of soldering is required, and it may be difficult to arrange | position a solder ball depending on the shape of an electronic component.

  In contrast to these solder materials, thread solder is relatively inexpensive. However, since the thread solder has a continuous shape wound around a bobbin or the like, there is a problem that it is difficult to supply a necessary amount to the soldered portion and that alignment is difficult.

JP 2008-142769 A JP-A-6-31438 International Publication No. 2008/023461

  Therefore, the problem to be solved by the present invention is to provide a soldering apparatus and an electronic component manufacturing method capable of preventing poor conduction and soldering with high accuracy even when using thread solder.

  According to the embodiment, the soldering apparatus includes a supply device, a cutting device, a transport device, and a melting device. The supply device supplies continuous yarn solder. The cutting device cuts the thread solder supplied from the supply device by an amount necessary for soldering at the soldered portion. The transport device holds the thread solder cut by the cutting device and transports it to the soldered portion. The melting device melts the yarn solder transported to the soldered part by the transport device.

Explanatory drawing which shows typically the structure of the soldering apparatus which concerns on this embodiment. Explanatory drawing which shows typically the soldering by the same soldering apparatus.

A soldering apparatus 1 according to this embodiment will be described with reference to FIGS. 1 and 2.
FIG. 1 is an explanatory view schematically showing a configuration of a soldering apparatus 1 according to the present embodiment, and FIG. 2 is an explanatory view schematically showing soldering of a part to be soldered 111 using the soldering apparatus 1. .

  As shown in FIG. 1, the soldering device 1 includes a supply device 3 for a thread solder 100, a guide device 4, a cutting device 5, a conveying device 6, a melting device 7, a position detecting device 8, and a control device. 9.

  Note that the thread solder 100 used in the soldering apparatus 1 is a thread-like solder material wound around a bobbin 101, and a flux is provided at the center thereof. Such a soldering apparatus 1 can be soldered (joined by soldering) with threaded solder 102 that is cut into pieces to be soldered 111 such as terminals and electrodes of an electronic component 110 such as an electronic component substrate. Is formed.

  The supply device 3 is formed so that the thread solder 100 can be fed and unwound. For example, the supply device 3 is formed so that the bobbin 101 can be attached and rotated. The supply device 3 sends the thread solder 100 wound around the bobbin 101 to the guide device 4 by rotating the bobbin 101 in one direction. Further, the supply device 3 rewinds the thread solder 100 by rotating the bobbin 101 in the other direction.

  The guide device 4 is formed so that the yarn solder 100 fed from the bobbin 101 by the supply device 3 can be guided to the cutting device 5. The guide device 4 includes, for example, a conveyance roller 11 having a pair of drive rollers 11a and 11a that guides the thread solder 100 and feeds the thread solder 100 by applying a constant tension, and a guide roller 12 that guides the thread solder 100. ing.

  The transport roller 11 is formed to be able to switch between normal rotation and reverse rotation of the drive rollers 11a and 11a. The conveyance roller 11 is provided on the secondary side of the guide roller 12 and on the primary side of the cutting device 5. The driving of the conveying roller 11 is controlled by the control device 9 to send out the thread solder 100 by a predetermined amount.

  In FIG. 1, the guide device 4 has a configuration in which each has one transport roller 11 and one guide roller 12, but the distance from the supply device 3 to the cutting device 5, the positional relationship, and the yarn solder 100. Depending on the shape such as the wire diameter, a plurality may be provided as appropriate.

  The cutting device 5 cuts the thread solder 100 by a predetermined amount (that is, a predetermined length of the thread solder 100) to form individual thread solders 102.

  The conveying device 6 is formed so as to be able to hold the thread solder 102 that has been cut and separated into pieces, and to be able to transport the thread solder 102 held in the soldered portion 111. The conveyance device 6 includes, for example, a holding unit 15 that holds the thread solder 102 and a conveyance unit 16 that moves the holding unit 15.

  The holding unit 15 holds the separated thread solder 102 by sucking the thread solder 102 by, for example, vacuum pressure or mechanically picking it. Note that the holding unit 15 may hold the thread solder 100 in advance and cut the thread solder 100 into pieces by the cutting device 5 in a state in which the holding state is maintained.

  In addition, the holding portion 15 is formed so as to be arranged by releasing the holding of the thread solder 102 in the soldered portion 111. In other words, the holding part 15 places the thread solder 102 on the soldered part 111.

  The transport unit 16 transports the holding unit 15 that holds the separated piece of thread solder 102 to the soldered unit 111. Further, the transport unit 16 transports the holding unit 15 to a position where the thread solder 102 is held. As shown in FIG. 2, the transport unit 16 is formed so that the thread solder 102 can be transported so that the center in the longitudinal direction of the thread solder 102 is located at the center of the soldered part 111.

  Moreover, the conveyance part 16 is formed so that position alignment of the thread solder 102 conveyed to the to-be-soldered part 111 is possible. Specifically, the conveyance unit 16 is formed to be movable in three axial directions orthogonal to each other and to be rotatable in a rotation direction that rotates around the vertical direction. The conveyance unit 16 aligns the thread solder 102 by changing the mounting direction of the thread solder 102 by rotating the holding unit 15 or the like.

  The conveying unit 16 only needs to be able to place the thread solder 102 on the soldered part 111 by changing the direction or the like as appropriate in accordance with the shape around the soldered part 111. For this reason, depending on the shape of the electronic component 110 and the shape of the soldered portion 111, the transport unit 16 is formed to be rotatable about any one of the three axial directions instead of rotating about the vertical direction. Moreover, the structure which can move only to a biaxial direction may be sufficient.

  The melting device 7 is formed so that the semiconductor laser 20 can be irradiated onto the thread solder 102 placed on the soldered portion 111. The melting device 7 irradiates the semiconductor laser 20 so that the focal point of the semiconductor laser 20 is in the center in the longitudinal direction of the thread solder 102 and melts the thread solder 102.

  The position detection device 8 is formed so as to be able to detect the feed amount of the thread solder 102 and to detect the transport of the thread solder 102 by the transport device 6. The position detection device 8 is formed so as to be able to detect the soldered portion 111 of the electronic component 110 and the thread solder 102 placed on the soldered portion 111.

  The control device 9 is connected to the supply device 3, the guide device 4, the cutting device 5, the transport device 6, the melting device 7, and the position detection device 8 through a signal line S and the like, so that each component can be controlled. Has been. The control device 9 is configured to be able to drive the cutting device 5 and the conveying device 6 based on the feed amount of the thread solder 100 detected by the position detection device 8. Further, the control device 9 is configured to be able to drive the melting device 7 based on the position of the conveyed thread solder 102 detected by the position detection device 8.

An electronic component manufacturing method using the soldering apparatus 1 configured as described above will be described below.
First, the electronic component 110 is placed at a predetermined position by a conveyance device (not shown). The control device 9 detects the soldered portion 111 of the electronic component 110 by the position detection device 8. The control device 9 drives the supply device 3 based on the detected information and supplies the yarn solder 100 wound around the bobbin 101 to the guide device 4. The guide device 4 guides the supplied yarn solder 100 to the transport roller 11 via the guide roller 12 and only a predetermined amount necessary for soldering the soldered portion 111 by the transport roller 11. Send it out.

  When the position detection device 8 detects that the length of the solder solder 100 delivered by the supply device 3 has reached a predetermined amount, the control device 9 drives the cutting device 5 and the conveyance device 6 based on the information. To do. Specifically, the control device 9 first cuts the yarn solder 100 supplied by a predetermined amount by the conveying roller 11 into pieces by cutting the predetermined length by the cutting device 5. Next, the control device 9 moves the holding unit 15 to the pieced thread solder 102 by the transport unit 16 and holds the thread solder 102 by the holding unit 15.

  The control device 9 moves the holding part 15 to the soldered part 111 by the transport part 16 and places the thread solder 102 on the soldered part 111 in a predetermined direction. When the position detection device 8 detects the placement, the control device 9 moves the transport unit 16 so that the holding unit 15 is separated from the soldered unit 111. When the position detection device 8 confirms that the conveying device 6 is not positioned on the soldered part 111, the control device 9 detects the center of the thread solder 102 with the position detection device 8.

  The control device 9 drives the melting device 7 and irradiates the semiconductor laser 20 to the approximate center of the thread solder 102 detected by the position detection device 8 as shown in FIG. Soldering of the attaching part 111 is performed.

  According to the soldering apparatus 1 configured as described above, the thread solder 100 is cut into a predetermined length, so that an amount necessary for soldering the soldered portion 111 is separated into pieces, and the predetermined predetermined amount is ensured. It is possible to supply the amount of yarn solder 102 to the soldered portion 111. Further, by cutting the thread solder 100 into pieces by a predetermined amount, it becomes possible to prevent variations in the supply amount of the thread solder 100 and so-called poor bonding due to so-called thread drawing or the like.

  The thread drawing means that when soldering using continuous thread solder, in order to prevent an excessive amount of thread solder from being melted, the thread solder is conveyed while the thread solder is melted. In this case, when the soldered part is returned to the standby position, the molten solder solidifies while moving together with the thread solder.

  The stringing in which the melted thread solder is solidified into a thread shape causes a bonding failure such that the solder adheres to the part to be soldered and the part to be soldered and the part other than the part to be soldered conduct. In the present soldering apparatus 1, since the yarn solder 100 is previously cut into pieces by a predetermined amount, occurrence of the yarn drawing can be prevented.

  Also, the soldering apparatus 1 can reduce the running cost by melting the yarn solder 102 using the semiconductor laser 20 by the melting apparatus 7 as compared with the case where a soldering iron or the like is used.

  That is, the melting device 7 using the semiconductor laser 20 does not oxidize even when the thread solder 102 is melted, unlike the soldering iron. For this reason, it is not necessary to replace the melting device 7, the maintainability is good, and the running cost can be reduced. In addition, it is possible to prevent the thermal effect on the other part of the electronic component 110 that occurs when the solder is melted in the reflow furnace.

  As described above, according to the soldering apparatus 1 according to the present embodiment, even when yarn solder is used, poor bonding due to soldering can be prevented and soldering can be performed with high accuracy.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... Soldering apparatus, 3 ... Supply apparatus, 4 ... Guide apparatus, 5 ... Cutting apparatus, 6 ... Conveyance apparatus, 7 ... Melting apparatus, 8 ... Position detection apparatus, 9 ... Control apparatus, 11a. DESCRIPTION OF SYMBOLS 11a ... A pair of drive roller, 11 ... Conveyance roller, 12 ... Guide roller, 15 ... Holding part, 16 ... Conveyance part, 20 ... Semiconductor laser, 100 ... Yarn solder, 101 ... Bobbin, 102 ... Separated thread solder, 110: electronic component, S: signal line.

Claims (4)

A supply device for supplying continuous thread solder;
A cutting device for cutting the thread solder supplied by the supply device in an amount necessary for soldering at the soldered portion;
A conveying device for holding the yarn solder cut by the cutting device and conveying the solder to the soldered portion;
A melting device for melting the yarn solder transported to the soldered portion by the transport device;
A soldering apparatus comprising:   2. The soldering apparatus according to claim 1, wherein the melting device is formed so as to be capable of irradiating a semiconductor laser, and the yarn solder is melted by irradiating the yarn solder with the semiconductor laser. Supplying the thread solder;
Cutting the supplied thread solder in an amount necessary for soldering at a soldered portion of an electronic component,
Holding the cut thread solder and transporting it to the soldered part,
The method of manufacturing an electronic component, wherein the yarn solder transported to the soldered portion is melted.   4. The method of manufacturing an electronic component according to claim 3, wherein the yarn solder conveyed to the soldering is melted by a semiconductor laser.

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