JP2012195030A - Substrate for suspension, suspension, suspension with device, hard disk drive, method for manufacturing substrate for suspension, and method for manufacturing suspension with device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for suspension suited to joining using a solder jet method and not impairing followability of a device.SOLUTION: The substrate for suspension includes: a metal support substrate; an insulating layer formed on the metal support substrate; and a wiring layer formed on the insulating layer. The insulating layer includes an insulating layer end portion which overhangs from an end face of a terminal section of the wiring layer and supports the device. A penetrating section in which the insulating layer end portion and a tongue portion of the metal support substrate are not superposed in a plan view is formed between the insulating layer end portion and the tongue portion of the metal support substrate. The present invention solves the problem by providing this substrate for suspension.

Description

  The present invention relates to a suspension substrate that is suitable for bonding using a solder jet method and that does not hinder followability of an element.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required. A suspension substrate (flexure) used in an HDD usually has a basic structure in which a metal support substrate (for example, stainless steel), an insulating layer (for example, polyimide resin), and a wiring layer (for example, Cu) are laminated in this order.

  The metal support substrate of the suspension substrate has a tongue portion for mounting an element such as a magnetic head slider. The tongue portion contacts the dimple and performs a pivoting motion at the contact point. This pivot movement maintains the distance and attitude of the element with respect to the disk. In order to improve the followability of the element to the disk, it is known to process the tongue portion and the metal support substrate in the vicinity thereof (Patent Documents 1 and 2).

  Also, a so-called ball place method is known as one method for electrically connecting a terminal portion of a wiring layer and an element (Patent Documents 3 to 6). The ball place method is a method in which a solder ball is formed between a terminal portion of a wiring layer and an element, and the solder ball is irradiated with a laser beam to melt the solder ball. In the ball place method, the arranged solder balls are usually irradiated with laser light. For example, in Patent Document 3, in order to prevent deterioration of the insulating layer due to laser light irradiation, the end surface of the pattern end portion is directly below it. The insulating layer is aligned with the end face of the insulating layer or protrudes in the tip direction from the end face of the insulating layer.

  On the other hand, as another method for electrically connecting the terminal portion of the wiring layer and the element, a so-called solder jet method is known (Patent Documents 7 to 9). The solder jet method is a method in which a solder ball is loaded into a microtubule such as a capillary, and then the solder ball is melted by laser light and simultaneously extruded with an inert gas to form a solder joint.

JP 2010-40115 A JP 2009-259362 A JP 2006-120288 A JP-A-10-79105 JP 2003-123217 A JP 2007-58999 A JP 2007-128574 A Japanese Patent Laid-Open No. 2002-50018 Patent No. 3181600

  In joining using the ball place method, it is necessary to stabilize the position of the solder ball before irradiating the laser beam, and usually a recess or a hole is formed in the terminal portion. On the other hand, the number of terminal portions required is increasing as the functionality of HDDs increases. As a result, the size of the terminal portion is reduced, and it is difficult to secure a space for forming the recess and the hole.

  On the other hand, in joining using the solder jet method, there is an advantage that it is easy to cope with an increase in the number of terminals because it is not necessary to form recesses or holes in the terminal portions. However, a suspension substrate that is suitable for joining by the solder jet method and that takes into consideration an important matter for the suspension substrate, such as element followability, has not been studied.

  The present invention has been made in view of the above circumstances, and it is a main object of the present invention to provide a suspension substrate that is suitable for bonding using the solder jet method and that does not hinder the followability of the element.

  In order to solve the above problems, the present invention provides a suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. The wiring layer has a terminal portion that is electrically connected to the element, and the insulating layer extends beyond an end surface of the terminal portion, and has an insulating layer end portion that supports the element, and the metal The support substrate has a tongue portion, and a suspension substrate is provided in which a through portion is formed between the end portion of the insulating layer and the tongue portion so that they do not overlap in plan view.

  According to the present invention, by providing the insulating layer end portion and the penetrating portion, it is possible to provide a suspension substrate that is suitable for bonding using the solder jet method and does not hinder the followability of the element.

  In the above invention, the metal support board includes the tongue portion, a support arm portion that supports the tongue portion, and an outrigger portion that is disposed between the tongue portion via an opening region, It is preferable that the layer and the wiring layer are formed so as to pass over the support arm portion, and the terminal portion is formed on the tip side of the support arm portion. This is because the followability of the element can be improved.

  The present invention also provides a suspension comprising the above-described suspension substrate and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  According to the present invention, by using the suspension substrate described above, it is possible to provide a suspension that is suitable for bonding using the solder jet method and does not hinder the followability of the element.

  According to the present invention, there is provided a suspension with an element, comprising the above-described suspension, an element disposed on the suspension, and a solder joint portion for electrically connecting the terminal portion and the element. To do.

  According to the present invention, by using the suspension described above, it is possible to provide a suspension with an element that has high connection reliability and good element followability even when the number of terminal portions is large.

  The present invention also provides a hard disk drive having the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  In the present invention, a laminated member preparation step of preparing a laminated member having a metal supporting member, an insulating member formed on the metal supporting member, and a conductor member formed on the insulating member, A wiring layer forming step of forming a wiring layer having a terminal portion electrically connected to the element by etching the conductor member; and etching the insulating member to protrude from an end face of the terminal portion and support the element An insulating layer forming step for forming an insulating layer having an insulating layer end portion, and a metal supporting substrate forming step for etching the metal supporting member to form a metal supporting substrate having a tongue portion. Provided is a method for manufacturing a suspension substrate, characterized in that a penetrating portion that does not overlap in plan view is formed between the end portion and the tongue portion.

  According to the present invention, it is possible to obtain a suspension substrate that is suitable for bonding using the solder jet method and does not hinder the followability of the element by forming the insulating layer end portion and the through portion.

  Further, the present invention is characterized by having a solder joint forming step in which an element is arranged on the suspension described above and a solder joint for electrically connecting the terminal portion and the element is formed by a solder jet method. A method for manufacturing a suspension with an element is provided.

  According to the present invention, by using the suspension described above, it is possible to obtain a suspension with an element that has high connection reliability and good element followability even when the number of terminal portions is large.

  The suspension substrate of the present invention is suitable for bonding using the solder jet method, and has an effect of not inhibiting the followability of the element.

It is a schematic diagram which shows an example of the board | substrate for suspensions of this invention. It is a schematic plan view which shows an example of the board | substrate for suspensions of this invention. It is AA sectional drawing of FIG. FIG. 3 is a schematic plan view showing the suspension substrate of FIG. 2 for each member. It is a schematic sectional drawing explaining the effect of the penetration part in this invention. It is a schematic sectional drawing explaining the effect of the penetration part in this invention. It is a schematic sectional drawing which illustrates the penetration part in the present invention. It is a schematic sectional drawing which shows an example of the board | substrate for suspensions of this invention. It is a schematic plan view which shows an example of the board | substrate for suspensions of this invention. It is a schematic diagram which shows an example of the metal support substrate in this invention. It is a schematic plan view which shows an example of the metal support substrate in this invention. It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with an element of this invention. It is a schematic sectional drawing which shows an example of the suspension with an element of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the suspension with an element of this invention.

  Hereinafter, the suspension substrate, suspension, suspension with element, hard disk drive, suspension substrate manufacturing method, and element suspension manufacturing method of the present invention will be described in detail.

A. Suspension substrate The suspension substrate of the present invention is a suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer, The wiring layer has a terminal portion that is electrically connected to the element, and the insulating layer protrudes from an end surface of the terminal portion and has an insulating layer end portion that supports the element, and the metal support substrate Has a tongue portion, and a penetration portion is formed between the end portion of the insulating layer and the tongue portion so that they do not overlap in plan view.

  FIG. 1A is a schematic plan view showing an example of a suspension substrate according to the present invention, and FIG. 1B is a cross-sectional view taken along line AA of FIG. In FIG. 1A, the cover layer is not shown for convenience. A suspension substrate 20 shown in FIG. 1A includes an element mounting region 11 formed at one tip portion, an external circuit board connection region 12 formed at the other tip portion, an element mounting region 11 and an external portion. A plurality of wiring layers 13a to 13d for electrically connecting the circuit board connection region 12 are provided. The wiring layer 13a and the wiring layer 13b are a pair of wiring layers. Similarly, the wiring layer 13c and the wiring layer 13d are also a pair of wiring layers. One of these two wiring layers is a write wiring layer, and the other is a read wiring layer. As shown in FIG. 1B, the suspension substrate 20 includes a metal support substrate 1, an insulating layer 2 formed on the metal support substrate 1, and a wiring layer 3 formed on the insulating layer 2. And a cover layer 4 formed so as to cover the wiring layer 3.

  2 is a schematic plan view showing an example of the suspension substrate of the present invention, and FIG. 3 is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 2, the wiring layer 3 has a terminal portion 3a that is electrically connected to an element (not shown). The terminal portion 3a is, for example, in a pad shape, and it is preferable that an Au plated portion or the like is formed on the surface. Further, as shown in FIG. 3, the insulating layer 2 has an insulating layer end 2 a that protrudes beyond the end surface 3 α of the terminal portion 3 a and supports the element 31. Furthermore, between the insulating layer end 2a and the tongue 1a, there is formed a through-hole T where they do not overlap in plan view.

  FIG. 4 is a schematic plan view showing the suspension substrate of FIG. 2 for each member. As shown in FIG. 4 (a), the metal support substrate 1 includes an outrigger disposed between the tongue portion 1a, the support arm portion 1b that supports the tongue portion 1a, and the tongue portion 1a via the opening region X. Part 1c. In addition, as shown in FIG. 4B, the insulating layer 2 has an insulating layer end 2a. Moreover, the limiter 5 connects the support arm part 1b and the outrigger part 1c in FIG. 4A via the opening area | region X, and the pillow part 6 supports an element. The limiter 5 and the pillow part 6 are preferably made of the same material as the insulating layer 2. Further, as shown in FIG. 4C, the wiring layer 3 has a terminal portion 3a. Further, as shown in FIG. 4D, the cover layer 4 is formed so as to cover the wiring layer 3 in FIG.

  According to the present invention, by providing the insulating layer end portion and the penetrating portion, it is possible to provide a suspension substrate that is suitable for bonding using the solder jet method and does not hinder the followability of the element. In other words, according to the present invention, by adjusting the position of the end face of the insulating layer end to a predetermined position, the suspension substrate is suitable for bonding using the solder jet method and does not hinder the followability of the element. can do.

  That is, as shown in FIG. 3, in the present invention, the position of the end surface 2α of the insulating layer end portion 2a is set to a position protruding from the end surface 3α of the terminal portion 3a. Further, the position of the end surface 2α of the insulating layer end 2a is projected so as to support the element 31. Thereby, the insulating layer end 2a functions as a pillow part for supporting the element 31, and the end surface 3α of the terminal part 3a and the electrode pad formed on the side surface of the element 31 are brought into close contact with each other in a perpendicular relationship. Can do. As a result, the position of the element 31 can be stabilized, and at the same time, the molten solder can be prevented from falling between the end face 3α of the terminal portion 3a and the side face of the element 31. In addition, even if the molten solder falls between the two, the insulating layer end 2a serves as a receiving tray, so there is an advantage that it does not affect other products. Thus, the suspension substrate of the present invention can be suitable for bonding using the solder jet method.

  Further, as shown in FIG. 3, in the present invention, the position of the end surface 2α of the insulating layer end 2a is set to a position where the through-hole T is formed between the tongue 1a. Thereby, it can be set as the board | substrate for suspension which does not inhibit the followable | trackability of an element. For example, as shown in FIG. 5, when the insulating layer end portion 2a is formed on the tongue portion 1a and there is no penetrating portion, the insulating layer end portion 2a obstructs the pivoting movement of the tongue portion 1a and is mounted. There is a problem in that the followability (flexibility) is impaired. On the other hand, since the suspension substrate of the present invention has a through portion, there is an advantage that such a problem does not occur.

Further, in order to relieve the stress generated when the solder is solidified, as shown in FIG. 6A, the terminal portion 3a may be bent (a portion indicated by an arrow in the drawing). At this time, if the penetrating portion T exists between the insulating layer end portion 2a and the tongue portion 1a, the followability (flexibility) of the mounted element is not impaired by the bending process. On the other hand, as shown in FIG. 6B, when the insulating layer end 2a is formed on the tongue 1a and there is no penetrating portion, the insulating layer end 2a and the tongue 1a are bent by bending. Stress is generated in the contact portion, and the followability (flexibility) of the mounted element is impaired. Thus, by providing the through portion, there is an advantage that the terminal portion can be easily bent. In addition, as shown to Fig.7 (a), the edge part of the pillow part 6 may become a flush relationship with the edge part of the tongue part 1a, and as shown to FIG. The end portion may protrude from the end portion of the tongue portion 1a.
Hereinafter, the suspension substrate of the present invention will be described separately for the suspension substrate member and the suspension substrate configuration.

1. First, members of the suspension substrate of the present invention will be described. The suspension substrate of the present invention has at least a metal support substrate, an insulating layer, and a wiring layer.

  The metal support substrate in the present invention functions as a support for the suspension substrate. The material of the metal support substrate is preferably a metal having a spring property, and specific examples include stainless steel. Moreover, although the thickness of a metal support substrate changes with kinds of the material, it exists in the range of 10 micrometers-20 micrometers, for example.

  The insulating layer in the present invention is formed on a metal support substrate. The material of the insulating layer is not particularly limited as long as it has insulating properties, and examples thereof include a resin. Examples of the resin include polyimide resin, polybenzoxazole resin, polybenzimidazole resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Of these, polyimide resin is preferred. It is because it is excellent in insulation, heat resistance and chemical resistance. In addition, the material of the insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer is, for example, preferably in the range of 5 μm to 30 μm, more preferably in the range of 5 μm to 18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The wiring layer in the present invention is formed on the insulating layer. The material of the wiring layer is not particularly limited as long as it has conductivity, but for example, a metal can be cited, and copper (Cu) is particularly preferable. Moreover, the material of the wiring layer may be rolled copper or electrolytic copper. The thickness of the wiring layer is preferably in the range of 5 μm to 18 μm, for example, and more preferably in the range of 9 μm to 12 μm. Moreover, it is preferable that the plating part is formed in the one part surface of a wiring layer. This is because the deterioration (corrosion or the like) of the wiring layer can be prevented by providing the plating portion. Especially, in this invention, it is preferable that the plating part is formed in the terminal part which connects with an element and an external circuit board. Although the kind of plating part is not specifically limited, For example, Au plating, Ni plating, Ag plating etc. can be mentioned. Especially, in this invention, it is preferable that Ni plating and Au plating are formed from the surface side of the wiring layer. The thickness of the plating portion is, for example, in the range of 0.1 μm to 4 μm.

  The suspension substrate of the present invention may have a cover layer formed so as to cover the wiring layer. By providing the cover layer, deterioration (corrosion etc.) of the wiring layer can be prevented. Examples of the material for the cover layer include the resins described as the material for the insulating layer described above, and among them, a polyimide resin is preferable. The material of the cover layer may be a photosensitive material or a non-photosensitive material. The thickness of the cover layer on the wiring layer (on the upper surface of the wiring layer) is, for example, in the range of 2 μm to 30 μm, preferably in the range of 2 μm to 20 μm, and in the range of 2 μm to 15 μm. Is more preferable.

2. Next, the configuration of the suspension substrate of the present invention will be described. Since the suspension substrate of the present invention has the insulating layer end portion and the penetrating portion, the suspension substrate can be a suspension substrate that is suitable for bonding using the solder jet method and does not hinder the followability of the element.

The end portion of the insulating layer in the present invention protrudes from the end face of the terminal portion and supports the element. As shown in FIG. 8, if the length of the insulating layer end 2a and a L _1, L ₁ must be long enough to support the device, is preferably, 20 [mu] m or more that is for example 10μm or more More preferably, it is more preferably 30 μm or more. On the other hand, L ₁ is preferably 125 μm or less, for example, and more preferably 62.5 μm or less. L ₁ is preferably, for example, 1/10 or less of the length of the element (eg, slider), and more preferably 1/20 or less.

The penetrating portion in the present invention is a region that is formed between the end portion of the insulating layer and the tongue portion and does not overlap in plan view. As shown in FIG. 8, if the length of the penetrating portion T was L _2, it is preferable that L ₂ is, for example 30μm or more, more preferably 40μm or more, more preferably 50μm or more. On the other hand, L ₂ is preferably 125 μm or less, for example, and more preferably 62.5 μm or less. In addition, L ₂ is preferably, for example, 1/10 or less of the length of the element (eg, slider), and more preferably 1/20 or less.

  The wiring layer in the present invention is not particularly limited as long as it is electrically connected to the element. For example, the wiring layer for writing, the wiring layer for reading, the wiring layer for ground, the wiring layer for power supply, Examples include a flight height control wiring layer, a sensor wiring layer, an actuator wiring layer, a heat assist wiring layer, and the like. Among these, a write wiring layer, a read wiring layer, and a ground wiring layer are preferable. . The wiring layer in the present invention has a terminal portion that is electrically connected to the element. Although the shape of a terminal part is not specifically limited, For example, a pad shape can be mentioned.

  The number of terminal portions in the present invention is not particularly limited, but is, for example, 4 or more, preferably 6 or more, and more preferably in the range of 8-12. In the case of a general ball place method, if the number of terminal portions is 8 or more, there is a high possibility that a problem will occur in the installation of solder balls. Considering that the suspension substrate of the present invention is suitable for joining using the solder jet method, the effect of the present invention can be further exhibited when the number of terminal portions is 8 or more.

Further, as shown in FIG. 9, when W ₁ width of the terminal portion _3a, width W ₂ between the adjacent terminal portions _3a, the width between the most distant terminal portions 3a was set to W _3, W ₁ Is preferably in the range of 20 μm to 80 μm, for example, and more preferably in the range of 30 μm to 60 μm. W ₂ is preferably in the range of 20 μm to 80 μm, for example, and more preferably in the range of 30 μm to 60 μm. W ₃ is preferably in the range of 400 μm to 1000 μm, for example, and more preferably in the range of 600 μm to 700 μm.

  Moreover, the metal support board | substrate in this invention has a tongue part at least. A tongue part is a site | part which mounts elements, such as a magnetic head slider. Moreover, it is preferable that the metal support substrate in this invention further has a support arm part and an outrigger part, as shown in FIG. The support arm is a portion that supports the tongue portion, and usually refers to a portion that extends in the width direction of the suspension substrate (the width direction W in FIG. 2).

  An outrigger part is a site | part arrange | positioned through an opening area | region between tongue parts. By disposing the outrigger portion with respect to the tongue portion via the opening region (opening region X in FIG. 2), the followability of the element with respect to the disk can be improved. Moreover, the outrigger part is normally connected with the support arm part indirectly or directly.

  FIG. 10A is a schematic plan view showing an example of a metal support substrate in the present invention, and shows a case where the support arm portion 1b and the outrigger portion 1c are indirectly connected. The support arm portion 1b is connected to the rear arm portion 1e, and the rear arm portion 1e is connected to the front arm portion 1d. The front arm portion 1d corresponds to the outrigger portion 1c in the present invention. The metal support substrate in FIG. 10A is formed on the head side with respect to the tongue portion 1a, and includes a first support region including the first fixing point 101, and a ring-shaped spring coupled to the first support region. A front ring FR that has a structure and gives peel rigidity and is constituted by the front arm portion 1d; a second support region that is formed on the tail side of the tongue portion 1a and includes the second fixing point 102; and a second support region A ring-shaped spring structure coupled to the rear ring RR, which has a yaw rigidity larger than that of the front ring and a peel rigidity smaller than that of the front ring, and a rear ring RR composed of the rear arm portion 1e. With such a configuration, it is possible to increase the yaw rigidity while maintaining a large peel rigidity, a small roll rigidity and a pitch rigidity. 10B is a cross-sectional view taken along the line AA in FIG. 10A. As shown in FIG. 10B, the tongue portion 1a, the support arm portion 1b, and the front arm with respect to the load beam 21 are illustrated. By interlocking the part 1d and the rear arm part 1e, the element 31 can exhibit good followability to the disk. In the tongue 1a, the element 31 is mounted on one surface, and the dimple 22 is in contact with the other surface.

  On the other hand, FIG. 11 is a schematic plan view showing another example of the metal support substrate in the present invention. As shown in FIG. 11, the support arm part 1b and the outrigger part 1c may be directly connected.

  Further, in the present invention, as shown in FIG. 2, the metal support board is disposed between the tongue portion 1a, the support arm portion 1b that supports the tongue portion 1a, and the tongue portion 1a via the opening region X. The insulating layer 2 and the wiring layer 3 are formed so as to pass over the support arm portion 1b, and the terminal portion 3a is formed on the tip side of the support arm portion 1b. It is preferable. This is because the followability of the element can be improved. In FIG. 2, the insulating layer 2 and the wiring layer 3 are disposed so as to surround the tongue portion 1a.

B. Suspension Next, the suspension of the present invention will be described. The suspension according to the present invention includes the suspension substrate described above and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  FIG. 12 is a schematic plan view showing an example of the suspension of the present invention. A suspension 30 shown in FIG. 12 has the suspension substrate 20 described above and a load beam 21 provided on the surface of the suspension substrate 20 on the metal support substrate side.

  According to the present invention, by using the suspension substrate described above, it is possible to provide a suspension that is suitable for bonding using the solder jet method and does not hinder the followability of the element.

  The suspension of the present invention has at least a suspension substrate and a load beam. The suspension substrate in the present invention is the same as the content described in the above “A. Suspension substrate”, and therefore description thereof is omitted here. On the other hand, the load beam in the present invention is provided on the surface of the suspension substrate on the metal support substrate side. Although the material of the load beam is not particularly limited, for example, a metal can be used, and stainless steel is preferable.

C. Next, the suspension with an element of the present invention will be described. A suspension with an element of the present invention includes the above-described suspension, the element disposed on the suspension, and the solder joint portion that electrically connects the terminal portion and the element.

  FIG. 13 is a schematic plan view showing an example of the suspension with an element of the present invention. A suspension with an element 40 shown in FIG. 13 includes the above-described suspension 30 and an element 31 mounted on the suspension 30 (the element mounting region 11 of the suspension substrate 20). FIG. 14 is a schematic cross-sectional view showing an example of the suspension with an element of the present invention, and corresponds to the cross-sectional view taken along the line AA of FIG. As shown in FIG. 14, the element 31 is directly disposed on the surfaces of the insulating layer terminal 2 a and the pillow portion 6. For example, when the insulating layer terminal 2a and the pillow portion 6 are formed by etching the same insulating member, the insulating layer terminal 2a and the pillow portion 6 have the same height, so that the horizontality of the element 31 is maintained. It becomes easy to be done. Further, the end surface 3α of the terminal portion 3a and the electrode pad formed on the side surface of the element 31 are in close contact with each other in a perpendicular relationship. The terminal portion 3 a and the electrode pad of the element are electrically connected by a solder joint portion 32.

  According to the present invention, by using the suspension described above, it is possible to provide a suspension with an element that has high connection reliability and good element followability even when the number of terminal portions is large.

  The suspension with an element of the present invention has at least a suspension, an element, and a solder joint. The suspension according to the present invention is the same as the content described in “B. Suspension” above, and thus the description thereof is omitted here.

  Examples of the element in the present invention include a magnetic head slider, an actuator, and a semiconductor. The actuator may have a magnetic head or may not have a magnetic head. Further, the element in the present invention is preferably an element (recording / reproducing element) that performs recording / reproducing with respect to a disk, such as a magnetic head slider.

  The solder joint portion in the present invention is for electrically connecting the terminal portion and the element. Examples of the material for the solder joint include lead-containing solder and lead-free solder. The lead-containing solder is preferably composed mainly of lead (Pb) and tin (Sn), for example. Specific examples include Sn—Pb, Sn—Ag—Pb, Sn—Pb—Bi, Sn—Sb—Pb, and Sn—Ag—Sb—Pb solders. On the other hand, it is preferable that the lead-free solder contains, for example, lead (Pb) and contains tin (Sn) as a main component. Specifically, Sn—Sb, Sn—Cu, Sn—Cu—Ni, Sn—Ag, Sn—Ag—Cu, Sn—Ag—Cu—Bi, Sn—Zn, Sn— Examples thereof include Ag—In—Bi, Sn—Zn, Sn—Bi, Sn—In, and Sn—Sb solders. Moreover, it is preferable that the solder joint part in this invention is formed by the solder jet method.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention has the above-described suspension with an element.

  FIG. 15 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 50 shown in FIG. 15 includes the above-described suspension 40 with an element, a disk 41 on which data is written and read by the suspension 40 with an element, a spindle motor 42 that rotates the disk 41, and the elements of the suspension 40 with an element. Arm 43 and voice coil motor 44, and a case 45 for sealing the above-described members.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  The hard disk drive of the present invention has at least a suspension with an element, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with an element is the same as the content described in “C. Suspension with an element”, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

E. Next, a method for manufacturing a suspension substrate according to the present invention will be described. The manufacturing method of the suspension substrate according to the present invention provides a laminated member preparation for preparing a laminated member having a metal supporting member, an insulating member formed on the metal supporting member, and a conductor member formed on the insulating member. Etching the conductor member to form a wiring layer having a terminal layer electrically connected to the element; etching the insulating member; projecting from the end surface of the terminal portion; and An insulating layer forming step of forming an insulating layer having an insulating layer end portion supporting the element; and a metal supporting substrate forming step of etching the metal supporting member to form a metal supporting substrate having a tongue portion. In addition, a penetrating portion that does not overlap in plan view is formed between the insulating layer end portion and the tongue portion.

  FIG. 16 is a schematic cross-sectional view showing an example of a method for manufacturing a suspension substrate according to the present invention. 16 is a cross-sectional view corresponding to the AA cross-sectional view of FIG. In FIG. 16, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 16 (a)). Next, the conductive member 3A is patterned by wet etching to form the wiring layer 3 having the terminal portions 3a (FIG. 16B). Next, the cover layer 4 is formed so as to cover the wiring layer 3 (FIG. 16C).

  Thereafter, the insulating member 2A is patterned by wet etching to form the insulating layer 2 having the insulating layer end 2a (FIG. 16D). At this time, it is preferable to form the pillow portion 6 at the same time. Further, although not shown, it is preferable to simultaneously form the limiter 5 shown in FIG. Finally, the metal support member 1A is patterned by wet etching to form the metal support substrate 1 having the tongue 1a (FIG. 16E). At this time, the metal support member 1 </ b> A is etched so that the through portion T is formed. Thereby, a suspension substrate is obtained.

According to the present invention, it is possible to obtain a suspension substrate that is suitable for bonding using the solder jet method and does not hinder the followability of the element by forming the insulating layer end portion and the through portion.
Hereinafter, the manufacturing method of the suspension substrate according to the present invention will be described step by step.

1. Laminated member preparation step The laminated member preparation step in the present invention is a step of preparing a laminated member having a metal supporting member, an insulating member formed on the metal supporting member, and a conductor member formed on the insulating member. It is.

  In the present invention, the metal support substrate is obtained by etching the metal support member of the laminate member, the insulating layer is obtained by etching the insulation member of the laminate member, and the wiring is obtained by etching the conductor member of the laminate. A layer is obtained. The laminated member may be a commercially available three-layer material, or may be obtained by sequentially forming an insulating layer and a conductor member on a metal support member.

2. Wiring layer forming step The wiring layer forming step in the present invention is a step of etching the conductor member to form a wiring layer having a terminal portion electrically connected to the element.

  Examples of the method for forming the wiring layer include a method in which a resist pattern is formed on a conductive member of a laminated member using a dry film resist (DFR) or the like, and the conductive member exposed from the resist pattern is wet-etched. Can do. The type of etching solution used for wet etching is preferably selected as appropriate according to the type of conductor member. For example, when the material of the conductor member is Cu, an iron chloride-based etching solution or the like can be used.

  In the present invention, the metal support member may be etched simultaneously with the etching of the conductor member. Examples of the etching of the metal support member include etching for forming a jig hole. Further, if necessary, at least a part of the processing performed in the metal support substrate forming step described later may be performed simultaneously with the etching of the conductor member.

3. Cover Layer Forming Step The suspension substrate manufacturing method of the present invention preferably includes a cover layer forming step of forming a cover layer so as to cover the wiring layer. This is because deterioration (corrosion, etc.) of the wiring layer can be prevented.

  The method for forming the cover layer is not particularly limited, and is preferably selected as appropriate according to the material of the cover layer. For example, when the material of the cover layer is a photosensitive material, a patterned cover layer can be obtained by exposing and developing the cover layer formed on the entire surface. In addition, when the cover layer material is a non-photosensitive material, a predetermined resist pattern is formed on the entire surface of the cover layer, and a portion exposed from the resist pattern is removed by wet etching. The cover layer can be obtained.

4). Insulating layer forming step The insulating layer forming step in the present invention is a step of etching the insulating member to form an insulating layer that protrudes from the end face of the terminal portion and has an insulating layer end portion that supports the element. .

  Examples of the method for forming the insulating layer include a method of forming a resist pattern on the insulating member using a dry film resist (DFR) or the like, and wet etching the insulating member exposed from the resist pattern. . The type of etchant used for wet etching is preferably selected as appropriate according to the type of insulating member. For example, when the material of the insulating member is a polyimide resin, an alkaline etchant or the like can be used.

5. Metal support substrate forming step The metal support substrate forming step in the present invention is a step of etching the metal support member to form a metal support substrate having a tongue portion.

  In this step, the outer shape of the metal support substrate is usually processed. Note that the tongue portion may be formed after the insulating layer forming step or simultaneously with the wiring layer forming step described above. In this step, it is preferable to form the above-described support arm portion and outrigger portion in addition to the tongue portion.

  Although the method for etching the metal support member is not particularly limited, specific examples include wet etching. The type of etchant used for wet etching is preferably selected as appropriate according to the type of metal support member. For example, when the material of the metal support member is stainless steel, an iron chloride-based etchant or the like can be used. .

6). Other Steps The method for manufacturing a suspension substrate according to the present invention may include a plating portion forming step of forming a plating portion on the terminal portion of the wiring layer. Specific examples of the method for forming the plated portion include an electrolytic plating method. In addition, the method for manufacturing a suspension substrate according to the present invention may include a via forming step of forming a via for electrically connecting the wiring layer and the metal support substrate (metal support member). Specific examples of the method for forming the via include an electrolytic plating method.

F. Next, a method for manufacturing the suspension with elements of the present invention will be described. The method for manufacturing a suspension with an element of the present invention includes a solder joint forming step in which an element is disposed on the suspension described above and a solder joint for electrically connecting the terminal portion and the element is formed by a solder jet method. It is characterized by this.

  FIG. 17 is a schematic cross-sectional view showing an example of a method for manufacturing a suspension with an element of the present invention. FIG. 17 is a cross-sectional view corresponding to the AA cross-sectional view of FIG. In FIG. 17, first, the suspension 30 described above is prepared (FIG. 17A). For convenience, the description of the load beam is omitted. Next, the element 31 is disposed at a predetermined position, and the molten solder ball 34 is sprayed by the solder jet device 33 (FIG. 17B). As a result, the solder joint portion 32 that electrically connects the terminal portion 3a and the element 31 is formed, and a suspension with an element is obtained.

  According to the present invention, by using the suspension described above, it is possible to obtain a suspension with an element that has high connection reliability and good element followability even when the number of terminal portions is large.

  The suspension used in the present invention is the same as that described in “B. Suspension”, and therefore, the description thereof is omitted here. Moreover, the solder jet method in this invention can use the method similar to the past. The size of the solder ball used is preferably in the range of 0.03 mm to 0.1 mm, for example, and more preferably in the range of 0.04 mm to 0.07 mm.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example]
First, a laminated member having SUS304 (metal support member) having a thickness of 18 μm, a polyimide resin layer (insulating member) having a thickness of 10 μm, and an electrolytic copper layer (conductor member) having a thickness of 9 μm was prepared (FIG. 16A). . Next, a dry film resist was laminated on both surfaces of the laminated member to form a resist pattern. Next, etching was performed using a ferric chloride solution, and a resist film was removed after the etching. Thereby, the wiring layer which has a terminal part was formed from the conductor member (FIG.16 (b)). Although not shown, a jig hole was formed in the metal support member.

Thereafter, the polyimide precursor solution was coated with a die coater so as to cover the patterned wiring layer. After drying, resist engraving was performed and the polyimide precursor film was etched simultaneously with development, and then cured (imidized) by heating in a nitrogen atmosphere to form a cover layer (FIG. 16C). Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was removed by wet etching to form an insulating layer having an insulating layer end (FIG. 16D). The length of the obtained insulating layer end (L ₁ in FIG. 8) was 25 μm.

Thereafter, an Au plating portion was formed on the terminal portion of the wiring layer by electrolytic plating. Finally, wet etching was performed on the metal support member to form a metal support substrate having a tongue portion, a support arm portion, and an outrigger portion, and at the same time, a penetration portion was formed (FIG. 16E). As a result, a suspension substrate was obtained. The length of the obtained through portion (L ₂ in FIG. 8) was 45 μm.

  DESCRIPTION OF SYMBOLS 1 ... Metal support board | substrate, 1a ... tongue part, 1b ... support arm part, 1c ... outrigger part, 1d ... front arm part, 1a ... rear arm part, 2 ... insulating layer, 2a ... insulating layer edge part, 3 ... wiring layer, 3 ... Terminal part, 4 ... Cover layer, 5 ... Limiter, 6 ... Pillow part, 11 ... Device mounting area, 12 ... External circuit board connection area, 13 ... Wiring layer, 20 ... Suspension board, 21 ... Load beam, 22 DESCRIPTION OF SYMBOLS ... Dimple, 31 ... Element, 32 ... Solder junction part, 33 ... Solder jet apparatus, 34 ... Molten solder ball, X ... Opening area | region

Claims (7)

A suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer,
The wiring layer has a terminal portion that is electrically connected to the element,
The insulating layer protrudes from the end surface of the terminal portion, and has an insulating layer end portion that supports the element,
The metal support substrate has a tongue portion,
A suspension substrate, wherein a penetrating portion that does not overlap in plan view is formed between the insulating layer end portion and the tongue portion. The metal support board includes the tongue portion, a support arm portion that supports the tongue portion, and an outrigger portion that is disposed between the tongue portion via an opening region,
The insulating layer and the wiring layer are formed so as to pass over the support arm portion,
The suspension substrate according to claim 1, wherein the terminal portion is formed on a tip side of the support arm portion.   A suspension board comprising: the suspension substrate according to claim 1; and a load beam provided on a surface of the suspension substrate on the metal support substrate side.   4. A suspension with an element, comprising: the suspension according to claim 3; an element disposed on the suspension; and a solder joint that electrically connects the terminal portion and the element.   A hard disk drive comprising the suspension with an element according to claim 4. A laminated member preparing step of preparing a laminated member having a metal supporting member, an insulating member formed on the metal supporting member, and a conductor member formed on the insulating member;
A wiring layer forming step of etching the conductor member to form a wiring layer having a terminal portion electrically connected to the element;
An insulating layer forming step of etching the insulating member, projecting from an end face of the terminal portion, and forming an insulating layer having an insulating layer end portion supporting the element;
A metal support substrate forming step of etching the metal support member to form a metal support substrate having a tongue portion,
A method for manufacturing a suspension substrate, wherein a through-portion is formed between the end portion of the insulating layer and the tongue portion so that they do not overlap in plan view.   An element is disposed on the suspension according to claim 3, and has a solder joint forming step for forming a solder joint for electrically connecting the terminal part and the element by a solder jet method. Suspension manufacturing method.

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