JP2012190934A - Optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical device that is less prone to false detection.SOLUTION: The optical device comprises a substrate 1, a wiring pattern 8 formed on the substrate 1, a light-receiving element 3 and a light-emitting element 2 arranged, respectively, on the substrate 1 with a space therebetween in the x direction, a translucent resin 4 covering the light-receiving element 3, a translucent resin 5 covering the light-emitting element 2, and a light-shielding resin 6 covering the translucent resin 4 and the translucent resin 5. The wiring pattern 8 includes a first light interruption part 83 interposed between the light-shielding resin 6 and the substrate 1 and located between the light-receiving element 3 and the light-emitting element 2 in the xy plan view, and the first light interruption part 83 traverses the light-emitting element 2 when viewed in the x direction.

Description

  The present invention relates to an optical device.

  FIG. 38 is a cross-sectional view showing an example of a proximity sensor. A proximity sensor 900 shown in the figure includes a glass epoxy substrate 91, a light emitting element 92, a light receiving element 93, primary mold resin portions 94 and 95, and a secondary mold resin portion 96. The light emitting element 92 and the light receiving element 93 are mounted on a glass epoxy substrate 91. The light emitting element 92 emits infrared light. The light receiving element 93 sends an electrical signal corresponding to the amount of received infrared light. The primary mold resin portions 94 and 95 are transparent and transmit infrared light. The primary mold resin portion 94 covers the light receiving element 93 on the glass epoxy substrate 91. The primary mold resin portion 94 has a convex light incident surface 940. The primary mold resin part 95 covers the light emitting element 92 on the glass epoxy substrate 91. The primary mold resin part 95 has a convex light emitting surface 950. The secondary mold resin part 96 is black and does not transmit infrared light. The secondary mold resin portion 96 covers the primary mold resin portions 94 and 95 on the glass epoxy substrate 91. In the secondary mold resin portion 96, a first opening 961 and a second opening 962 are formed. From the first opening 961, the light incident surface 940 is exposed on the direction z side. From the 2nd opening part 962, the light-projection surface 950 is exposed to the direction z side. The topmost part of the light incident surface 940 is disposed at the same position as the outer edge of the first opening 961 in the direction z. Similarly, the topmost part of the light emitting surface 950 is disposed at the same position as the outer edge of the second opening 962 in the direction z. Such a proximity sensor is described in Patent Document 1, for example.

  The proximity sensor 900 is incorporated in, for example, a touch panel electronic device (such as a mobile phone). The proximity sensor 900 is disposed in the vicinity of the liquid crystal display unit 902 in the electronic device. The proximity sensor 900 and the liquid crystal display unit 902 are opposed to the translucent cover 903. The infrared light L91 emitted from the light emitting element 92 passes through the light emitting surface 950 and travels toward the translucent cover 903. Further, the infrared light L91 passes through the translucent cover 903 and is reflected by the object 901. The infrared light L91 reflected by the object 901 passes through the transparent cover 903 again. The infrared light L91 passes through the light incident surface 940 and is received by the light receiving element 93. The light receiving element 93 sends an electrical signal corresponding to the amount of received infrared light to a control unit (not shown). When the output level from the light receiving element 93 exceeds a preset threshold value, the control unit determines that the object 901 is close to the liquid crystal display unit 902. That is, in the electronic device, for example, when the cheek is brought close to the liquid crystal display unit 902 to make a call, the proximity sensor 900 detects the approach of the cheek. Thereby, during a call, the touch panel operation using the liquid crystal display unit 902 is invalidated, and malfunction during the call is prevented. Also during the call, the liquid crystal display unit 902 is turned off, and the power consumption of the battery of the electronic device is suppressed.

  As shown in FIG. 38, the proximity sensor 900 is disposed with a space between the light transmission cover 903 and the proximity sensor 900. For this reason, the infrared light exiting the light exit surface 950 includes light having a relatively large incident angle with respect to the translucent cover 903. Light having a large incident angle with respect to the translucent cover 903 is reflected by the translucent cover 903 and becomes noise light L92. The noise light L 92 incident on the light incident surface 940 can be received by the light receiving element 93. When the noise light L92 is received by the light receiving element 93, there is a risk of erroneous detection in which the control unit determines that the object 901 is close even though the object 901 is not close to the translucent cover 903. .

  Further, the proximity sensor 900 may include an illuminance sensor in addition to the light receiving element 93. The illuminance sensor and the light receiving element 93 are composed of individual chips, and both are arranged on the glass epoxy substrate 91. In recent years, there is a strong demand for downsizing the proximity sensor 900.

  In the proximity sensor 900, the primary mold resin portions 94 and 95 are formed in the gap between the secondary mold resin portion 96 and the glass epoxy substrate 91 between the primary mold resin portion 94 and the primary mold resin portion 95. The same transparent resin as the material may be formed. In this case, when the proximity sensor 900 is used, the light emitted from the light emitting element 92 may be received by the light receiving element 93 through the transparent resin. When the light from the light emitting element 92 passes through the transparent resin and is received by the light receiving element 93, there is a possibility that the erroneous detection is caused.

JP 2010-341889 A

  The main object of the present invention is to provide an optical device that has been conceived under the circumstances described above and that is less susceptible to erroneous detection.

  According to the first aspect of the present invention, the base material, the wiring pattern formed on the base material, and the first pattern disposed on the base material and perpendicular to the thickness direction of the base material. A light receiving element and a light emitting element that are separated from each other, a first light transmitting resin that covers the light receiving element, a second light transmitting resin that covers the light emitting element, and a light shielding resin that covers the first light transmitting resin and the second light transmitting resin. And the wiring pattern is interposed between the light shielding resin and the base material, and is positioned between the light receiving element and the light emitting element in the thickness direction view. An optical device is provided in which the first light blocking unit crosses the light emitting element in the first direction view.

  The first light blocking part includes a first part and a second part that are separated from each other, and the light shielding resin includes a joint part sandwiched between the first part and the second part and in contact with the base material.

  The joining portion overlaps the light emitting element in a thickness direction of the base material and a second direction orthogonal to the first direction.

  Each of the first part and the second part has a strip shape extending along a thickness direction of the base material and a second direction orthogonal to the first direction.

  The first light blocking portion includes two connecting portions that are separated from each other with the joint portion interposed therebetween in the thickness direction, and the connecting portions are connected to both the first portion and the second portion. .

  The wiring pattern includes a light emitting element pad to which the light emitting element is bonded.

  The wiring pattern includes a second light blocking portion interposed between the light shielding resin and the base material, and the second light blocking portion overlaps the light emitting element pad in the first direction.

  The second light blocking part has a portion covered with the second light-transmitting resin.

  The second light blocking unit is connected to the first light blocking unit.

  The wiring pattern includes a third light blocking portion interposed between the light shielding resin and the base material, and the third light blocking portion overlaps the light emitting element pad in the first direction, and the light emitting element The pad for use is located between the second light blocking unit and the third light blocking unit in the first direction view.

  The third light blocking part has a portion covered with the second light-transmitting resin.

  The third light blocking unit is connected to the first light blocking unit.

  The wire pattern further includes a wire bonded to the light emitting element, the wiring pattern includes a wire bonding pad to which the wire is bonded, and the third light blocking portion is electrically connected to the wire bonding pad.

  The wire pattern further includes a wire bonded to the light emitting element, and the wiring pattern includes a wire bonding pad to which the wire is bonded, and a connecting part connected to the light emitting element pad and the first light blocking part.

  The light emitting element includes a cathode electrode and an anode electrode, and the first light blocking unit is electrically connected to the cathode electrode.

  The first light blocking unit is a ground electrode.

  The wiring pattern includes a light receiving element pad on which the light receiving element is disposed, and a connection portion connected to the light receiving element pad and the first light blocking portion.

  The first light blocking part has a portion covered with the second light-transmitting resin.

  The said wiring pattern contains the mounting terminal part formed in the said base material on the opposite side to the side in which the said 1st light shielding part was formed.

  A through-hole electrode that is electrically connected to the mounting terminal portion and penetrates the base material is further provided.

  According to the second aspect of the present invention, a base material, a light receiving element disposed on the base material, a first light-transmitting resin that covers the light-receiving element, and a first opening that covers the first light-transmitting resin. The first light-transmitting resin has a light incident surface exposed from the first opening, the light-blocking resin has a first uneven surface, and the first light-transmitting resin has a first uneven surface. The uneven surface faces the direction from the light receiving element toward the light incident surface in the depth direction of the first opening, and is more orthogonal to the depth direction of the first opening than the first opening. An optical device located on the first direction side is provided.

  Preferably, the light shielding resin is formed with a plurality of grooves each extending along one direction on the first uneven surface.

  Preferably, the first concavo-convex surface defines any one of the plurality of grooves, and the first groove surface and the second groove are located on opposite sides of the bottom of the one groove. It has a groove surface, and the second groove surface is located farther from the first opening than the first groove surface.

  Preferably, the first groove surface is inclined at a first angle with respect to the first direction, and the second groove surface is inclined with respect to the first direction at a second angle smaller than the first angle.

  Preferably, the first angle is 50 ° to 70 °.

  Preferably, each of the grooves extends along a second direction orthogonal to the depth direction and the first direction.

  Preferably, each said groove | channel extends along the circumferential direction centering on the opening center of a said 1st opening part.

  Preferably, each of the grooves extends along the first direction, and the first uneven surface defines one of the plurality of grooves, and sandwiches the bottom of the one groove. The first groove surface and the second groove surface are located opposite to each other, and the first groove surface is inclined at a first angle with respect to a second direction orthogonal to the depth direction and the first direction. The second groove surface is located on a side farther than the first groove surface from a virtual straight line extending along the first direction through the opening center of the first opening, and the second groove surface. It inclines at a second angle smaller than the first angle with respect to the direction.

  Preferably, the light shielding resin includes a second uneven surface facing a direction from the light receiving element toward the light incident surface in a depth direction of the first opening, and the first opening includes the first unevenness. It is located between the surface and the second uneven surface.

  Preferably, both the first groove surface and the second groove surface are flat.

  According to a third aspect of the present invention, a base material, a light receiving element disposed on the base material, a first light-transmitting resin that covers the light-receiving element, and a first opening that covers the first light-transmitting resin The first light-transmitting resin has a light incident surface exposed from the first opening, and the light receiving element is provided on the semiconductor substrate and the semiconductor substrate. An optical device is provided that includes an infrared light detection unit and a visible light detection unit provided on the semiconductor substrate.

  Preferably, the light incident surface has a portion that overlaps the infrared light detection unit when viewed in the depth direction of the first opening.

  Preferably, the light receiving element includes a laminated optical film that covers the infrared light detection unit and transmits infrared light.

  Preferably, the visible light detection unit has a portion located in the smallest rectangular region having the smallest area among the rectangular regions surrounding the infrared light detection unit in the depth direction view of the first opening.

  Preferably, the visible light detection unit is located outside the smallest rectangular region having the smallest area among the rectangular regions surrounding the infrared light detection unit as viewed in the depth direction of the first opening.

  Preferably, the light receiving element includes a functional element unit that performs an operation on the output of the visible light detection unit and the output of the infrared light detection unit.

  Preferably, the light receiving element includes a laminated optical film that covers the infrared light detection unit and the functional element unit and transmits the infrared light.

  Preferably, the light emitting device further includes a light emitting element disposed on the base material, and the infrared light detection unit is located farther from the light emitting device than the visible light detection unit in the depth direction view of the first opening. To position.

  According to a fourth aspect of the present invention, a base material, a light receiving element disposed on the base material, a first light-transmitting resin that covers the light-receiving element, and a first opening that covers the first light-transmitting resin The first light-transmitting resin has a light incident surface exposed from the first opening, and the light-blocking resin defines a first inner portion that defines the first opening. The first inner peripheral wall has a peripheral wall, and the light from the light receiving element in the depth direction of the first opening is greater than any portion of the first light-transmitting resin exposed from the first opening. An optical device is provided having a first edge located on the direction side towards the entrance surface.

  Preferably, the first inner peripheral wall is an inclined surface that is closer to the opening center side of the first opening as it is closer to the depth side of the first opening.

  Preferably, the first inner peripheral wall includes a first portion and a second portion facing each other in a first direction orthogonal to the depth direction of the first opening, and the first inner peripheral wall is in the depth direction of the first opening. The inclination angle of the first part is larger than the inclination angle of the second part with respect to the depth direction of the first opening.

  Preferably, the inclination angle of the first portion with respect to the depth direction of the first opening is 15 ° or more.

  Preferably, the first translucent resin includes a first convex portion housed in the first opening, and the first convex portion constitutes the light incident surface.

  Preferably, the first convex portion is disposed with a gap between the first inner peripheral wall and the first inner peripheral wall.

  Preferably, the light incident surface is flat.

  Preferably, the light-emitting element disposed on the base material and a second light-transmitting resin that covers the light-emitting element are further provided, and the light-shielding resin includes the first light-transmitting resin and the second light-transmitting resin. And a second opening is formed in the light-shielding resin. The second light-transmitting resin has a light exit surface exposed from the second opening. Have.

  Preferably, the light shielding resin has a second inner peripheral wall that defines the second opening, and the second inner peripheral wall is from any part of the second light-transmitting resin exposed from the second opening. Has a second edge located in a direction from the light emitting element toward the light emitting surface in the depth direction of the second opening.

  Preferably, the second inner peripheral wall is an inclined surface that is closer to the opening center side of the second opening as it becomes deeper in the depth direction of the second opening.

  Preferably, the second translucent resin includes a second convex portion housed in the second opening, and the second convex portion constitutes the light emitting surface.

  Preferably, the second translucent resin includes a first cutout surface formed by the second convex portion and the second convex portion, and is farther from the light receiving element than the first cutout surface. A second notch surface located on the side.

  Preferably, the first cutout surface is opposed to the second inner peripheral wall, and the second cutout surface is exposed from the light shielding resin to a side opposite to the side where the light receiving element is disposed. .

  Preferably, the first notch surface is disposed with a gap between the first notch surface and the second inner peripheral wall.

  Preferably, the light emitting surface is convex.

  According to a fifth aspect of the present invention, an electronic apparatus comprising: the optical device provided by any one of the first to fourth aspects of the present invention; and a translucent cover facing the light emitting surface. Is provided.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

1 is a perspective view of an optical device according to a first embodiment. It is sectional drawing which follows the II-II line | wire of FIG. It is sectional drawing which follows the III-III line of FIG. It is sectional drawing which follows the IV-IV line of FIG. It is a top view of the optical apparatus shown in FIG. It is sectional drawing which follows the VI-VI line of FIG. It is sectional drawing which follows the VII-VII line of FIG. It is a top view of the light receiving element in the optical apparatus shown in FIG. (A) is an equivalent circuit diagram schematically showing the visible light detection unit of the light receiving element shown in FIG. 8, and (b) is an equivalent circuit diagram schematically showing the infrared light detection unit of the light receiving element shown in FIG. It is. It is a top view which abbreviate | omits and shows two translucent resin and light shielding resin from FIG. It is a bottom view of the optical apparatus concerning 1st Embodiment. It is a partial expanded sectional view which follows the XII-XII line | wire of FIG. It is a partial expanded sectional view which follows the XIII-XIII line of FIG. It is a top view which shows 1 process in the manufacturing method of the optical apparatus concerning 1st Embodiment. It is a top view which shows one process following FIG. It is a partial expanded sectional view which follows the XVI-XVI line of FIG. It is a partial expanded sectional view which follows the XVII-XVII line of FIG. FIG. 16 is a plan view showing a step subsequent to FIG. 15. It is a partial expanded sectional view which follows the XIX-XIX line | wire of FIG. It is a partial expanded sectional view which follows the XX-XX line of FIG. It is sectional drawing for demonstrating one manufacturing process of the optical apparatus concerning 1st Embodiment. It is sectional drawing of the electronic device concerning 1st Embodiment. It is sectional drawing of the electronic device concerning 1st Embodiment. It is a graph for demonstrating the reduction effect of noise light. It is a graph for demonstrating the reduction effect of noise light. It is a top view which shows the modification of the optical apparatus concerning 1st Embodiment. It is sectional drawing of the optical apparatus concerning 2nd Embodiment. It is sectional drawing of the optical apparatus concerning 3rd Embodiment. It is a top view of the optical apparatus concerning 4th Embodiment. It is sectional drawing which follows the XXX-XXX line of FIG. It is a top view of the optical apparatus concerning 5th Embodiment. FIG. 32 is a cross-sectional view taken along line XXXII-XXXII in FIG. 31. It is a perspective view of the optical apparatus concerning 6th Embodiment. It is sectional drawing which follows the XXIV-XXIV line | wire of FIG. It is a top view of the light receiving element in the optical apparatus concerning 7th Embodiment. It is sectional drawing of the optical apparatus concerning 8th Embodiment. It is sectional drawing of the electronic device concerning 9th Embodiment. It is sectional drawing which shows an example of the conventional proximity sensor.

<First Embodiment>
The first embodiment will be described with reference to FIGS. An electronic apparatus 801 illustrated in FIG. 22 includes an optical device 101, a liquid crystal display unit 802, and a translucent cover 803. The electronic device 801 is, for example, a touch panel mobile phone.

  The liquid crystal display unit 802 displays icons for exhibiting various functions of the electronic device 801. The translucent cover 803 is made of acrylic, for example. The translucent cover 803 transmits infrared light and visible light. The translucent cover 803 faces the liquid crystal display unit 802 and the optical device 101. The optical device 101 is disposed with a gap d between the optical device 101 and the translucent cover 803. The distance d is, for example, about 0.25 to 1 mm.

  FIG. 1 is a perspective view of the optical device 101 shown in FIG. 2 is a cross-sectional view taken along line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a plan view of the optical device shown in FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. 7 is a cross-sectional view taken along line VII-VII in FIG.

  The optical device 101 shown in these drawings is a proximity sensor, and is composed of a base material 1, a light emitting element 2, a light receiving element 3, light transmitting resins 4 and 5, a light shielding resin 6, and wires 78 and 79 (FIG. 2). And a wiring pattern 8 (see FIG. 2, omitted in FIG. 3, FIG. 4, FIG. 6, FIG. 7, etc.).

  The substrate 1 is made of, for example, a glass epoxy resin. The substrate 1 has a mounting surface 10 and a back surface 11. The mounting surface 10 and the back surface 11 face opposite to each other. The mounting surface 10 and the back surface 11 are both surfaces in which the direction x is the direction in which the long side extends and the direction y is the direction in which the short side extends. The thickness direction of the substrate 1 coincides with the direction z. A wiring pattern 8 is formed on the mounting surface 10 and the back surface 11. The wiring pattern 8 will be described later.

  The light emitting element 2 is an LED chip. The light emitting element 2 emits infrared light. The light emitting element 2 is disposed on the mounting surface 10 of the substrate 1. The light emitting element 2 is electrically connected to the wiring pattern 8 formed on the mounting surface 10 through the wire 78. The light emitting element 2 has a rectangular shape of 0.35 mm × 0.35 mm in the xy plan view (direction z view). The light emitting element 2 includes a cathode electrode 21 and an anode electrode 22. In the present embodiment, the anode electrode 22 is bonded to the wiring pattern 8. On the other hand, a wire 78 is bonded to the cathode electrode 21.

  The light receiving element 3 converts the received infrared light into an electrical signal corresponding to the amount of the infrared light. The light receiving element 3 is electrically connected to the wiring pattern 8 formed on the mounting surface 10 via the wire 79. The light receiving element 3 has a rectangular shape of 1.6 mm × 1.8 mm in the xy plan view. In the present embodiment, the light receiving element 3 further converts the received visible light into an electrical signal corresponding to the amount of visible light.

  FIG. 8 is a plan view of the light receiving element 3 in the optical device 101 shown in FIG. As shown in the figure, the light receiving element 3 includes a semiconductor substrate 30, a visible light detection unit 31, an infrared light detection unit 32, a functional element unit 33, and a laminated optical film 34.

  The semiconductor substrate 30 is, for example, a silicon substrate. The semiconductor substrate 30 is provided with a visible light detection unit 31, an infrared light detection unit 32, and a functional element unit 33. The visible light detection unit 31 and the infrared light detection unit 32 are located in the center of the semiconductor substrate 30 in the xy plan view. As shown in FIG. 8, in the light receiving element 3, the visible light detection unit 31 has a portion located in the smallest rectangular region S <b> 11 having the smallest area among the rectangular regions surrounding the infrared light detection unit 32 in the xy plan view. Have. That is, the infrared light detection unit 32 has an L shape in the xy plan view, and the visible light detection unit 31 bites into the infrared light detection unit 32 (inside the minimum rectangular region S11 and outside the infrared light detection unit 32). It is arranged to bite into the area.

  The functional element unit 33 is located around the visible light detection unit 31 and the infrared light detection unit 32. A wiring layer (not shown) is formed on the semiconductor substrate 30 in multiple layers. Of the wiring layer of the semiconductor substrate 30, a portion overlapping the infrared light detection unit 32 and the functional element 33 is covered with the laminated optical film 34. An opening is provided in a portion of the laminated optical film 34 that overlaps the visible light detection unit 31, and a portion of the wiring layer of the semiconductor substrate 30 that overlaps the visible light detection unit 31 is not covered by the laminated optical film 34. It is exposed from the laminated optical film 34.

  The visible light detector 31 and the semiconductor substrate 30 constitute a plurality of photodiodes PDA1, PDA2, PDA3, PDB1, PDB2, and PDB3. The photodiodes PDA1, PDA2, and PDA3 are each formed by providing a pn junction surface (light receiving surface) at a predetermined depth position from the surface of the semiconductor substrate 30 in the thickness direction of the semiconductor substrate 30. The photodiodes PDA1, PDA2, and PDA3 output photocurrents corresponding to the amounts of received visible light and infrared light by photoelectric conversion, respectively.

  On the other hand, each of the photodiodes PDB1, PDB2, and PDB3 is formed by providing a pn junction surface (light receiving surface) at a predetermined depth position from the surface of the semiconductor substrate 30 in the thickness direction of the semiconductor substrate 30. . The depth position from the surface of the semiconductor substrate 30 where the photodiodes PDB1, PDB2, and PDB3 are formed is deeper than the depth position from the surface of the semiconductor substrate 30 where the photodiodes PDA1, PDA2, and PDA3 are formed. In general, it is known that the spectral sensitivity characteristics of a photodiode depend on the depth of a pn junction surface (light receiving surface) from the surface of a semiconductor substrate. The deeper the position of the pn junction surface (light receiving surface) from the semiconductor substrate surface, the more the spectral sensitivity characteristic peak shifts to the longer wavelength side. Therefore, the spectral sensitivity characteristics of the photodiodes PDB1, PDB2, and PDB3 are shifted to the longer wavelength side than the photodiodes PDA1, PDA2, and PDA3. Therefore, the photodiodes PDB1, PDB2, and PDB3 output a photoelectric current corresponding to only the amount of received infrared light by photoelectric conversion. The areas of the photodiodes PDB1, PDB2, and PDB3 in the xy plan view are smaller than the areas of the photodiodes PDA1, PDA2, and PDA3 in the xy plan view, respectively.

  FIG. 9A is an equivalent circuit diagram schematically showing the visible light detector 31 of the light receiving element 3 shown in FIG. As shown in FIG. 9A, the pair of photodiodes PDA1 and PDB1 constitute a first light receiving unit 311. The photodiodes PDA1 and PDB1 of the first light receiving unit 311 are connected in series between the power supply potential Vcc and the ground potential. In the first light receiving unit 311, a current I1 is output from between the photodiodes PDA1 and PDB1. The current I1 is obtained by subtracting the photocurrent including the infrared light component from the photodiode PDB1 from the photocurrent including the visible light component and the infrared light component from the photodiode PDA1. That is, the first light receiving unit 311 outputs a current I1 corresponding to the difference between the received light amounts of the photodiodes PDA1 and PDB1.

  Similarly, the pair of photodiodes PDA2 and PDB2 constitute a second light receiving unit 312. The photodiodes PDA2 and PDB2 of the second light receiving unit 312 are connected in series between the power supply potential Vcc and the ground potential. Then, the second light receiving unit 312 outputs a current I2 corresponding to the difference between the received light amounts of the photodiodes PDA2 and PDB2.

  Similarly, the pair of photodiodes PDA3 and PDB3 constitute a third light receiving unit 313. The photodiodes PDA3 and PDB3 of the third light receiving unit 313 are connected in series between the power supply potential Vcc and the ground potential. The third light receiving unit 313 outputs a current I3 corresponding to the difference in the amount of light received by each of the photodiodes PDA3 and PDB3.

  As shown in FIG. 8, the area ratio of the light receiving surface of the photodiode PDB1 to the photodiode PDA1 in the first light receiving unit 311, the area ratio of the light receiving surface of the photodiode PDB2 to the photodiode PDA2 in the second light receiving unit 311, The area ratio of the light receiving surface of the photodiode PDB3 to the photodiode PDA3 in the three light receiving units 313 is different from each other. Although not described in detail, the area ratio of the light receiving surface is different in order to obtain a constant output with respect to a constant illuminance regardless of the type of light source incident on the visible light detector 31. It is. That is, in this embodiment, even if the light source is a halogen lamp that generates light containing a large amount of infrared light components or an incandescent lamp that generates light containing more infrared light components, Even a fluorescent lamp that irradiates light that does not contain much light components can obtain a constant output for a certain illuminance.

  The semiconductor substrate 30 and the infrared light detection unit 32 constitute a photodiode PDC. Each of the photodiodes PDC is formed by providing a pn junction surface (light receiving surface) at a predetermined depth position from the surface of the semiconductor substrate 30 in the thickness direction of the semiconductor substrate 30. The depth position from the surface of the semiconductor substrate 30 where the photodiode PDC is formed is approximately the same as the depth position from the surface of the semiconductor substrate 30 where the photodiodes PDB1, PDB2, and PDB3 are formed. Therefore, the photodiode PDC outputs a photoelectric current corresponding to only the amount of received infrared light by photoelectric conversion. The area of the photodiode PDC in the xy plan view is larger than the total area of the visible light detection unit 31 in the xy plan view. FIG. 9B is an equivalent circuit diagram schematically showing the infrared light detection unit 32 of the light receiving element 3 shown in FIG. As shown in the figure, the photodiode PDC is connected to the power supply potential Vcc. The photodiode PDC outputs a photocurrent Ic corresponding to the amount of received infrared light.

  The functional element unit 33 performs an operation on the output of the visible light detection unit 31 and the output of the infrared light detection unit 32. In the functional element section 33, an analog circuit and a digital circuit are formed. The functional element unit 33 receives a current I1 from the first light receiving unit 311, a current I2 from the second light receiving unit 312, a current I3 from the third light receiving unit 313, and a photocurrent Ic from the photodiode PDC. Is done. The functional element unit 33 calculates the amount of infrared light received by the photodiode PDC as a digital value based on the photocurrent Ic. When the amount of infrared light received by the photodiode PDC exceeds a preset threshold value, a proximity signal indicating that there is an adjacent object is output to the outside. The functional element unit 33 calculates the amount of visible light received by the visible light detection unit 31 as a digital value based on the currents I1 to I3. The functional element unit 33 outputs an illuminance signal indicating the illuminance corresponding to the amount of visible light received by the visible light detection unit 31 to the outside.

  The laminated optical film 34 is made of a resin that transmits only light in the infrared wavelength region. As described above, the laminated optical film 34 covers the infrared light detection unit 32 and the functional element unit 33. Therefore, the infrared light detection unit 32 and the functional element unit 33 receive only infrared light without receiving visible light. On the other hand, the laminated optical film 34 does not cover the visible light detector 31. Therefore, the visible light detection unit 31 reliably receives visible light.

  The translucent resin 4 shown in FIGS. 1 to 3 and FIGS. 5 to 7 is a first translucent resin, and covers the light receiving element 3 and the mounting surface 10. The translucent resin 4 is transparent and transmits light in a wavelength range from visible light to infrared light. The translucent resin 4 is made of, for example, an epoxy resin. The translucent resin 4 has a flat surface 43 and a convex portion 40.

  The flat surface 43 is flat and extends along a plane perpendicular to the direction z. The flat surface 43 has a ring shape. The flat surface 43 faces the direction z1. The convex portion 40 is a first convex portion, and has a shape that swells from the flat surface 43 toward the direction z1. The outer shape of the projection 40 in the xy plan view is, for example, a circular shape having a diameter of 1 mm. The convex portion 40 is surrounded by the flat surface 43 in the xy plan view.

  The convex portion 40 has a light incident surface 41. The light incident surface 41 faces the direction z1. In the present embodiment, the light incident surface 41 is flat and extends along a plane perpendicular to the direction z. Unlike the present embodiment, the light incident surface 41 may be a convex surface that swells in the direction z1. The light incident surface 41 overlaps the light receiving element 3 in the xy plan view. More specifically, in the xy plan view, the light incident surface 41 overlaps the infrared light detection unit 32 and the visible light reception unit 31 in the light receiving element 3 shown in FIG. It is preferable that the light incident surface 41 overlaps with the infrared light detection unit 32 in the xy plan view in order to reliably reach the infrared light detection unit 32 with the light traveling in the direction z2. On the other hand, unlike the present embodiment, the light incident surface 41 may not overlap the visible light detector 31 and the flat surface 43 may overlap the visible light detector 31 in the xy plan view.

  The translucent resin 5 shown in FIGS. 1, 2, 4, and 5 is a second translucent resin, and covers the light emitting element 2 and the mounting surface 10. The translucent resin 5 is transparent and transmits light in a wavelength range from visible light to infrared light. The translucent resin 5 is made of, for example, an epoxy resin. The translucent resin 5 has a flat surface 53 and a convex portion 50.

  The flat surface 53 is flat and extends along a plane perpendicular to the direction z. The flat surface 53 faces the direction z1. The convex portion 50 is a second convex portion and has a shape that swells from the flat surface 53 toward the direction z1. The convex portion 50 is surrounded by the flat surface 53 in the xy plan view.

  The convex portion 50 has a light emitting surface 51 and a pair of cutout surfaces 52A and 52B. The light emission surface 51 faces the direction z1. The light emission surface 51 is a convex surface that swells toward the direction z1. The light emitting surface 51 is a convex surface that swells in the direction z1 in order to cause more light from the light emitting element 2 to advance in the direction z1. The light emission surface 51 overlaps the light emitting element 2 in the xy plan view. The light emission surface 51 has an arc-shaped outer edge at each end in the direction y in the xy plan view. The maximum diameter of the light emitting surface 51 that is the distance between the outer edges is, for example, 0.44 mm. Each notch surface 52A, 52B is flat and extends along the yz plane. The cutout surface 52A faces the direction x2, and the cutout surface 52B faces the direction x1. The notch surfaces 52A and 52B are connected to the light exit surface 51 at one end in the direction x. As shown in FIG. 5, the distance between the cutout surface 52 </ b> A and the light receiving element 3 is smaller than the distance between the cutout surface 52 </ b> B and the light receiving element 3. That is, the notch surface 52B is located on the side farther from the light receiving element 3 than the notch surface 52A.

  As shown in FIG. 2, the light shielding resin 6 covers the translucent resins 4 and 5 and the mounting surface 10. The light shielding resin 6 transmits neither visible light nor infrared light. The light shielding resin 6 is made of, for example, an epoxy resin. The light shielding resin 6 is interposed between the translucent resin 4 and the translucent resin 5. The light shielding resin 6 is in direct contact with the mounting surface 10 across the entire direction y of the mounting surface 10 between the light transmitting resin 4 and the light transmitting resin 5. This prevents infrared light emitted from the light emitting element 2 from passing through the optical device 101 and directly entering the light receiving element 3.

  As shown in FIGS. 1 and 5, the light shielding resin 6 has a first surface 6A, a pair of second surfaces 6B and 6C, and a pair of third surfaces 6D and 6E.

  The first surface 6A faces the direction z1. The first surface 6A has a long side along the direction x of 5 mm, for example, and a short side along the direction y of 2.5 mm, for example. As illustrated in FIGS. 1 and 2, the first surface 6 </ b> A includes a surface 601 (second uneven surface), a surface 602, a surface 603 (first uneven surface), and a surface 604. In the present embodiment, the cross-sectional shapes of the surfaces 601 to 604 are the same. Details will be described below.

  As shown in FIGS. 1 and 2, the surface 601 is a portion of the first surface 6 </ b> A that is located closer to the direction x <b> 2 than the first opening 61 described later. On the surface 601, a plurality of grooves 641 are formed in the light shielding resin 6 (not shown in FIG. 5). Each groove 641 extends along one direction. In the present embodiment, each groove 641 extends along the direction y. The surface 601 defines any one groove 641 of the plurality of grooves 641, and the first groove surface 651 a and the second groove surface 651 b are located on opposite sides of the bottom of the one groove 641. Have In each groove 641, the first groove surface 651a is located on the direction x2 side, and the second groove surface 651b is located on the direction x1 side. That is, in each groove 641, the first groove surface 651 a is located on the side farther from the first opening 61 than the second groove surface 651 b. Both the first groove surface 651a and the second groove surface 651b extend along the direction y and are flat.

  The first groove surface 651a is an inclined surface that is directed toward the direction z2 as it is closer to the direction x1. The first groove surface 651a is inclined at the first angle θ11 with respect to the direction x. On the other hand, the second groove surface 651b is an inclined surface that is directed toward the direction z2 as it is closer to the direction x2. The second groove surface 651b is inclined at the second angle θ12 with respect to the direction x. Preferably, the first angle θ11 and the second angle θ12 are each 50 ° to 70 °. In the present embodiment, the first angle θ11 and the second angle θ12 are the same.

  As shown in FIGS. 1 and 2, the surface 602 is a portion of the first surface 6 </ b> A that overlaps a first opening 61 described later in the direction x. On the surface 602, the light shielding resin 6 has a plurality of grooves 642 (not shown in FIG. 5). Each groove 642 extends along one direction. In the present embodiment, each groove 642 extends along the direction y. The surface 602 has a first groove surface 652a and a second groove surface 652b that define any one groove 642 of the plurality of grooves 642 and are located on opposite sides of the bottom of the one groove 642. . In each groove 642, the first groove surface 652a is located on the direction x2 side, and the second groove surface 652b is located on the direction x1 side. Both the first groove surface 652a and the second groove surface 652b extend along the direction y and are flat.

  The first groove surface 652a is inclined so as to be directed toward the direction z2 as it is closer to the direction x1. The first groove surface 652a is inclined at the first angle θ21 with respect to the direction x. On the other hand, the second groove surface 652b is an inclined surface that is directed toward the direction z2 as it is closer to the direction x2. The second groove surface 652b is inclined at the second angle θ22 with respect to the direction x. Preferably, each of the first angle θ21 and the second angle θ22 is 50 ° to 70 °. In the present embodiment, the first angle θ21 and the second angle θ22 are the same.

  As shown in FIGS. 1 and 2, the surface 603 is a portion of the first surface 6 </ b> A that is located on the direction x <b> 1 side with respect to a first opening 61 described later. Further, the surface 603 is a portion located on the direction x2 side with respect to a second opening 62 described later. That is, the surface 603 is located between the first opening 61 and the second opening 62. On the surface 603, the light shielding resin 6 has a plurality of grooves 643 (not shown in FIG. 5). Each groove 643 extends along one direction. In the present embodiment, each groove 643 extends along the direction y. The surface 603 has a first groove surface 653a and a second groove surface 653b that define any one groove 643 of the plurality of grooves 643 and are located on opposite sides of the bottom of the one groove 643. . In each groove 643, the first groove surface 653a is located on the direction x2 side, and the second groove surface 653b is located on the direction x1 side. That is, in each groove 643, the second groove surface 653b is located on a side farther from the first opening 61 than the first groove surface 653a. Both the first groove surface 653a and the second groove surface 653b extend along the direction y and are flat.

  The first groove surface 653a is an inclined surface that is directed toward the direction z2 as it is closer to the direction x1. The first groove surface 653a is inclined at the first angle θ31 with respect to the direction x. On the other hand, the second groove surface 653b is an inclined surface that is directed toward the direction z2 as it is closer to the direction x2. The second groove surface 653b is inclined at the second angle θ32 with respect to the direction x. Preferably, each of the first angle θ31 and the second angle θ32 is 50 ° to 70 °. In the present embodiment, the first angle θ31 and the second angle θ32 are the same.

  As shown in FIGS. 1 and 2, the surface 604 is a portion of the first surface 6 </ b> A that overlaps a later-described second opening 62 in the direction x. A plurality of grooves 644 are formed in the light shielding resin 6 on the surface 604 (not shown in FIG. 5). Each groove 644 extends along one direction. In the present embodiment, each groove 644 extends along the direction y. The surface 604 has a first groove surface 654a and a second groove surface 654b that define any one groove 644 of the plurality of grooves 644 and are located on opposite sides of the bottom of the one groove 644. . In each groove 644, the first groove surface 654a is located on the direction x2 side, and the second groove surface 654b is located on the direction x1 side. Both the first groove surface 654a and the second groove surface 654b extend along the direction y and are flat.

  The first groove surface 654a is an inclined surface that is directed toward the direction z2 as it is closer to the direction x1. The first groove surface 654a is inclined at the first angle θ41 with respect to the direction x. On the other hand, the second groove surface 654b is an inclined surface that is directed toward the direction z2 as it is closer to the direction x2. The second groove surface 654b is inclined at the second angle θ42 with respect to the direction x. Preferably, each of the first angle θ41 and the second angle θ42 is 50 ° to 70 °. In the present embodiment, the first angle θ41 and the second angle θ42 are the same.

  Unlike the present embodiment, the surfaces 601 to 604 may not be uneven as described above, and any of the surfaces 601 to 604 may be a flat surface. Further, of the first surface 6A, only the surface 603 may have the uneven shape as described above, and the surfaces 601, 602, and 604 other than the surface 603 may be flat surfaces.

  The second surface 6B faces the direction x1 and the second surface 6C faces the direction x2. The translucent resin 5 is exposed from the second surface 6B. An exposed surface 5 b that is flush with the second surface 6 </ b> B is formed in the translucent resin 5. The third surface 6D faces the direction y2 and the third surface 6E faces the direction y1. Except for the first surface 6A, the pair of second surfaces 6B and 6C and the pair of third surfaces 6D and 6E are all flat surfaces.

  As shown in FIGS. 1 and 2, the light shielding resin 6 is formed with a first opening 61 and a second opening 62. Both the first opening 61 and the second opening 62 are recessed from the first surface 6A. Both the depth direction of the first opening 61 and the depth direction of the second opening 62 coincide with the direction z. The depth dimension of the first opening 61 and the second opening 62 is, for example, 0.42 mm. The maximum inner diameter of the first opening 61 is, for example, 1.3 mm. The maximum inner diameter along the direction y of the second opening 62 is, for example, 0.59 mm.

  The translucent resin 4 is exposed from the first opening 61. More specifically, the light incident surface 41 and the flat surface 43 of the translucent resin 4 are exposed from the first opening 61. The first opening 61 accommodates the convex portion 40 of the translucent resin 4.

  As shown in FIG. 5, the light shielding resin 6 has an inner peripheral wall 610 that defines the first opening 61. The inner peripheral wall 610 is substantially circular in the xy plan view. The convex portion 40 is disposed with a gap between the inner peripheral wall 610 and the inner peripheral wall 610. The inner peripheral wall 610 is an inclined surface that approaches the opening center side of the first opening 61 as it goes to the depth direction back side (direction z2 side) of the first opening 61. The inner peripheral wall 610 has a larger inclination angle with respect to the direction z as it is farther from the light emitting element 2 in the direction x.

  More specifically, as shown in FIGS. 6 and 7, the inner peripheral wall 610 has portions 610A, 610B, and 610C. The portion 610A is closer to the light emitting element 2 than the portions 610B and 610C. On the other hand, the portion 610C is farther from the light emitting element 2 than the portions 610A and 610B. The portions 610A and 610C face each other in the direction x. The part 610B is located between the parts 610A and 610C in the direction x.

  The portion 610A is a second portion, and the inclination angle φ11 of the portion 610A with respect to the direction z is approximately 0 °. In the portion between the portion 610A and the portion 610B, the inclination angle with respect to the direction z gradually increases from the portion 610A to the portion 610B. The inclination angle φ12 with respect to the direction z of the portion 610B is larger than the inclination angle φ11. The inclination angle φ12 is, for example, 7.5 °. In the portion between the portion 610B and the portion 610C, the inclination angle with respect to the direction z gradually increases from the portion 610B to the portion 610C. The portion 610C is the first portion, and the inclination angle φ13 of the portion 610C with respect to the direction z is larger than both the inclination angles φ11 and φ12. The inclination angle φ13 is 15 °, for example. The inclination angle φ13 may be 15 ° or more depending on the depth dimension, the inner diameter, and the like of the first opening 61.

  As shown in FIGS. 1 to 3, the inner peripheral wall 610 has an edge 611 that is a first edge. The end edge 611 is circular. At the edge 611, the inner peripheral wall 610 and the first surface 6A are connected. The edge 611 is a direction from the light receiving element 3 toward the light incident surface 41 in the depth direction (direction z) of the first opening 61 than any part of the translucent resin 4 exposed from the first opening 61. Located on the (direction z1) side.

  The translucent resin 5 is exposed from the second opening 62. More specifically, the light emitting surface 51 and the flat surface 53 of the translucent resin 5 are exposed from the second opening 62. The second opening 62 accommodates the convex portion 50 of the translucent resin 5.

  As shown in FIG. 5, the light shielding resin 6 has an inner peripheral wall 620 that defines the second opening 62. The convex portion 50 is disposed with a gap between the inner peripheral wall 620 and the inner peripheral wall 620. The inner peripheral wall 620 is an inclined surface that is closer to the opening center side of the second opening 62 as it becomes deeper in the depth direction (direction z2 side) of the second opening 62. The inclination angle of the inner peripheral wall 620 with respect to the depth direction is a substantially uniform angle over the entire circumference.

  The inner peripheral wall 620 has portions 620A and 620B. The portion 610 </ b> A has an arc shape in the xy plan view and is along the outermost edge of the light emitting surface 51. The portion 620B is flat and faces the notch surface 52A. The inner peripheral wall 620 is opened without forming a wall surface on the side far from the light receiving element 3 in the direction x. Thereby, the notch surface 52B is exposed from the light shielding resin 6 toward the direction x1.

  As shown in FIG. 1, the inner peripheral wall 620 has an end edge 621 that is a second end edge. A part of the end edge 621 has an arc shape. At the end edge 621, the inner peripheral wall 620 and the first surface 6A are connected. The edge 621 is a direction from the light emitting element 2 toward the light emitting surface 51 in the depth direction (direction z) of the second opening 62 than any part of the translucent resin 5 exposed from the second opening 62. Located on the (direction z1) side.

  FIG. 10 is a plan view in which the translucent resins 4 and 5 and the light shielding resin 6 are omitted from FIG. In the figure, the light shielding resins 4 and 5 are indicated by imaginary lines. FIG. 11 is a bottom view of the optical device 101.

  The wiring pattern 8 shown in FIGS. 2, 10, and 11 includes a light receiving element pad 811, a light emitting element pad 812, a plurality of wire bonding pads 821, a plurality of through-hole peripheral portions 822, and a first light blocking element. Part 83, second light blocking part 841, third light blocking part 842, connection part 851, connection wiring 861, and mounting terminal part 88.

  Light receiving element pad 811, light emitting element pad 812, wire bonding pad 821, through-hole peripheral part 822, first light blocking part 83, second light blocking part 841, and third light blocking part 842 The connecting portion 851 and the connection wiring 861 are formed on the mounting surface 10 of the base material 1. On the other hand, the mounting terminal portion 88 is formed on the back surface 11 of the substrate 1. That is, the mounting terminal portion 88 is formed on the substrate 1 on the side opposite to the side where the first light blocking portion 83 is formed. The wiring pattern 8 is formed by electrolytic plating, for example. A resist layer (not shown) made of a resin may be formed on the wiring pattern 8.

  The light emitting element 3 is bonded to the light receiving element pad 811 shown in FIG. The light emitting element 2 is bonded to the light emitting element pad 812. The area of the light emitting element pad 812 is smaller than the area of the light receiving element pad 811 in plan view.

  A wire 78 or a wire 79 is bonded to each wire bonding pad 821. Each wire bonding pad 821 has a substantially rectangular shape in plan view. Each through hole peripheral portion 822 is connected to the wire bonding pad 821. Each through hole peripheral portion 822 has a substantially circular portion in plan view.

  12 is a partially enlarged cross-sectional view taken along line XII-XII in FIG.

  The first light blocking portion 83 shown in FIGS. 10 and 12 is interposed between the light blocking resin 6 and the base material 1. As shown in FIG. 10, the first light blocking unit 83 is located between the light receiving element 2 and the light emitting element 3 in the xy plan view. The first light blocking unit 83 crosses the light emitting element 2 in the direction x. That is, the end portion on the direction y1 side of the first light blocking portion 83 is located on the direction y1 side with respect to the light emitting element 2, and the end portion on the direction y2 side of the first light blocking portion 83 is on the side of the light emitting element 2. Is also located on the direction y2 side. In the present embodiment, the first light blocking portion 83 has a shape extending along the direction y, but the first light blocking portion 83 may have a curved shape that opens toward the light emitting element pad 812 in the xy plan view. An opening 839 is formed in the first light blocking unit 83. In the present embodiment, the opening 839 has a shape extending in the direction y. A part of the light shielding resin 6 is formed in the opening 839. A portion of the light shielding resin 6 formed in the opening 839 is in contact with the base material 1. A portion of the light shielding resin 6 formed in the opening 839 is a joint portion 609. In other words, it can be said that the light shielding resin 6 includes a joint portion 609 joined to the base material 1. In FIG. 10, the joint portion 609 is hatched.

  The first light blocking unit 83 includes a first part 831, a second part 832, and connecting parts 833 and 834. The first part 831 and the second part 832 are separated from each other. In the present embodiment, the first part 831 and the second part 832 are separated from each other in the direction x in the xy plan view. Both the first portion 831 and the second portion 832 extend in a band shape along the direction y. The first part 831 and the second part 832 sandwich the joint 609. As shown in FIG. 12, the first part 831 (that is, the first light blocking part 83) may have a part covered with the translucent resin 5. Unlike the present embodiment, the first light blocking portion 83 may not be covered with the translucent resin 5. The connecting portions 833 and 834 are separated from each other with the joint portion 609 interposed therebetween. Each connecting portion 833, 834 is connected to the first part 831 and the second part 832. The first portion 831, the second portion 832, and the connecting portions 833 and 834 constitute the opening 839.

  13 is a partially enlarged cross-sectional view taken along line XIII-XIII in FIG.

  The second light blocking portion 841 shown in FIGS. 10 and 13 is interposed between the light shielding resin 6 and the base material 1. In the present embodiment, the second light blocking portion 841 has a strip shape extending along the direction x. The second light blocking unit 841 overlaps the light emitting element pad 812 in the direction x. The second light blocking portion 841 is located on the direction y2 side of the light emitting element pad 812. As shown in FIG. 13, the second light blocking portion 841 may have a portion covered with the translucent resin 5. Unlike the present embodiment, the second light blocking portion 841 may not be covered with the translucent resin 5. Preferably, the second light blocking unit 841 is connected to the first light blocking unit 83.

  The third light blocking unit 842 shown in FIGS. 10 and 13 is interposed between the light blocking resin 6 and the base material 1. In the present embodiment, the third light blocking unit 842 has a strip shape extending along the direction x. The third light blocking unit 842 overlaps the light emitting element pad 812 in the direction x. The third light blocking unit 842 is located on the direction y2 side of the light emitting element pad 812. Therefore, the light emitting element pad 812 is positioned between the third light blocking unit 842 and the second light blocking unit 841. As shown in FIG. 13, the third light blocking portion 842 may have a portion covered with the translucent resin 5. Unlike the present embodiment, the third light blocking portion 842 may not be covered with the translucent resin 5. Preferably, the third light blocking unit 842 is connected to the first light blocking unit 83.

  In the present embodiment, the third light blocking unit 842 is electrically connected to the wire bonding pad 821 to which the wire 78 is bonded. Therefore, the first light blocking unit 83 connected to the third light blocking unit 842 is electrically connected to the wire bonding pad 821 to which the wire 78 is bonded. As described above, the wire 78 is bonded to the cathode electrode 21 of the light emitting element 2. Therefore, both the third light blocking unit 842 and the first light blocking unit 83 are electrically connected to the cathode electrode 21 of the light emitting element 2. The first light blocking unit 83 may be a ground electrode in a circuit including the light emitting element 2.

  As shown in FIG. 10, the connection portion 851 is connected to the light receiving element pad 811 and the first light blocking portion 83. The connection wiring 861 is connected to the wire bonding pad 821 to which the wire 79 bonded to the light receiving element 3 is bonded and the through hole peripheral portion 822. The connection wiring 861 is insulated from the first light blocking unit 83 and crosses the first light blocking unit 83 in the direction x.

  As shown in FIG. 11, each mounting terminal portion 88 has a rectangular shape in the xy plan view. Each mounting terminal portion 88 is connected to a through-hole peripheral portion 822, a light-receiving element pad 811, or a through-hole electrode 89 (shown in FIG. The light-emitting element pad 812 is electrically connected.

  Next, a method for manufacturing the optical device 101 will be briefly described.

  FIG. 14 is a plan view showing one step in the method for manufacturing the optical device 101. First, as shown in FIG. 14, the base material 1 is prepared. A wiring pattern 8 is formed on the substrate 1. Next, as shown in the figure, the light emitting element 2 and the light receiving element 3 are arranged on the base material 1. Next, the wire 78 is bonded to the light emitting element 2 and the wiring pattern 8, and the wire 79 is bonded to the light receiving element 3 and the wiring pattern 8, respectively.

  FIG. 15 is a plan view showing a step subsequent to FIG. 16 is a partially enlarged cross-sectional view taken along line XVI-XVI of FIG. 17 is a partially enlarged cross-sectional view taken along the line XVII-XVII in FIG. Next, a molding process for forming the translucent resins 4 and 5 is performed. The molding process is referred to as a primary mold resin molding process. In the primary mold resin molding step, first, as shown in FIGS. 16 and 17, the mold 701 is pressed against the substrate 1. The mold 701 has a flat surface 702 that faces the mounting surface 10 of the substrate 1. In FIG. 15, the area | region which overlaps with the flat surface 702 among the base materials 1 is hatched. When pressing the mold 701 against the substrate 1, the flat surface 702 is brought into contact with the first light blocking unit 83. At this time, as shown in FIG. 16, the opening 839 formed in the first light blocking unit 83 is blocked by the flat surface 702. Similarly, as shown in FIG. 17, when pressing the mold 701 against the base material 1, the flat surface 702 is brought into contact with the second light blocking unit 841 and the third light blocking unit 842.

  FIG. 18 is a plan view showing a step subsequent to FIG. FIG. 19 is a partially enlarged cross-sectional view taken along line XIX-XIX in FIG. 20 is a partially enlarged cross-sectional view taken along line XX-XX in FIG. Next, as shown in FIGS. 19 and 20, the resin material is injected into the space surrounded by the base material 1 and the mold 701 and then cured. Thereby, the translucent resin 4 covering the light receiving element 3 and the translucent resin 5 covering the light emitting element 2 are formed. As shown in FIG. 19, when the resin material is injected into the space surrounded by the base material 1 and the mold 701, the opening 839 is blocked by the flat surface 702. Is not filled. Therefore, no translucent resin is formed in the opening 839. In FIG. 18, the region where the light-transmitting resins 4 and 5 are formed in the substrate 1 is indicated by hatching.

  Next, the light shielding resin 6 that covers the translucent resins 4 and 5 and the substrate 1 is formed through a molding process. The molding process is referred to as a secondary mold resin molding process. When the secondary mold resin molding step is finished, as shown in FIGS. 12 and 13, the light shielding resin 6 is formed to cover the first light blocking portion 83, the second light blocking portion 841, and the third light blocking portion 842. Is done. Further, as shown in FIG. 19, since the transparent resin 5 is not formed in the opening 839, the light shielding resin 6 is also formed in the opening 839 as shown in FIG. 12. As a result, a joint portion 609 that joins the base material 1 is formed in the light shielding resin 6.

  Further, as shown in FIG. 21, a mold 7 is used in the secondary mold resin molding step. The mold 7 has a cylindrical portion 70 corresponding to the shape of the first opening 61 and a cylindrical portion 70 corresponding to the shape of the second opening 62. FIG. 21 shows only the cylindrical portion 70 corresponding to the first opening 61. The cylindrical part 70 is arrange | positioned around the convex part 40 or the convex part 50, and is removed from the light shielding resin 6 after resin hardening. As a result, the inner peripheral wall 610 of the opening 61 is formed without the cylindrical portion 70 contacting the convex portion 40. This prevents the resin constituting the light shielding resin 6 from adhering to the light incident surface 41. Similarly, the inner peripheral wall 620 of the second opening 62 is formed without the cylindrical portion 70 contacting the convex portion 50. This prevents the resin constituting the light shielding resin 6 from adhering to the light emitting surface 51. In addition, in order to make it easy to remove the cylindrical part 70 from the light shielding resin 6, as described above, the inner peripheral wall 610 becomes deeper in the depth direction of the first opening 61 (direction z2 side). It is an inclined surface that approaches the center of the opening. The same applies to the inner peripheral wall 620.

  Next, a method for using the electronic device 801 will be described.

  As shown in FIGS. 22 and 23, the infrared light L <b> 11 emitted from the light emitting element 2 travels through the light emitting surface 51 toward the light transmitting cover 803. Further, the infrared light L11 passes through the translucent cover 803. As shown in the figure, when there is an object 891 close to the translucent cover 803, the infrared light L11 transmitted through the translucent cover 803 is reflected by the object 891 and travels again toward the translucent cover 803. . The infrared light L11 reflected by the object 891 passes through the light transmitting cover 803 and the light incident surface 41 and is received by the infrared light detection unit 32 of the light receiving element 3. At this time, the functional element unit 33 of the light receiving element 3 outputs the above-described proximity signal indicating that the object 891 close to the translucent cover 803 exists. When the light emitting element 2 emits infrared light L11, the functional element unit 33 outputting a proximity signal to the outside means that the optical device 101 has detected the object 891 that is in proximity to the translucent cover 803. . On the other hand, when there is no object close to the translucent cover 803, the infrared light L11 emitted from the light emitting element 2 and transmitted through the translucent cover 803 travels in the direction z1 as it is. Therefore, the infrared light L11 emitted from the light emitting element 2 is not received by the infrared light detection unit 32 of the light receiving element 3. At this time, the functional element unit 33 of the light receiving element 3 does not output the above proximity signal to the outside. The fact that the functional element unit 33 does not output the proximity signal when the light emitting element 2 emits the infrared light L11 means that the optical device 101 has not detected the object 891 that is in proximity to the translucent cover 803. . As described above, the optical device 101 detects the presence or absence of the object 891 in the vicinity of the translucent cover 803. In FIG. 22, the traveling direction of the infrared light L <b> 11 is not described as being along the direction z, but actually, infrared light that passes through the light emitting surface 51 and is reflected by the object 891 and received by the light receiving element 3. The traveling direction of the light L11 is substantially along the direction z.

  Next, the effect of this embodiment is demonstrated.

  As shown in FIGS. 10 and 12, in the optical device 101, the wiring pattern 8 includes the first light blocking unit 83. The first blocking portion 83 is interposed between the light shielding resin 6 and the base material 1 and is positioned between the light emitting element 2 and the light receiving element 3 in the xy plan view. The first light blocking unit 83 crosses the light emitting element 2 in the direction y. According to such a configuration, between the light emitting element 2 and the light receiving element 3, the light path from the light transmitting resin 5 to the light transmitting resin 4 through the gap between the light shielding resin 6 and the base material 1 is The first light blocking unit 83 blocks the light. Therefore, between the light emitting element 2 and the light receiving element 3, light from the light emitting element 2 can be prevented from passing from the light transmitting resin 5 to the light transmitting resin 4 through a gap between the light shielding resin 6 and the base material 1. . Thereby, the light from the light emitting element 2 can be prevented from being received by the light receiving element 3 through the gap between the light shielding resin 6 and the substrate 1. Therefore, it is possible to make it difficult to cause erroneous detection in which it is determined that the object 891 is close even though the object 891 is not close to the translucent cover 803.

  As shown in FIGS. 10 and 12, in the optical device 101, the first light blocking unit 83 includes a first part 831 and a second part 832 that are separated from each other. The light shielding resin 6 includes a joint portion 609 that is sandwiched between the first portion 831 and the second portion 832 and is in contact with the substrate 1. In such a configuration, the bonding force between the material constituting the bonding portion 609 which is a part of the light shielding resin 6 and the material constituting the base material 1 constitutes the wiring pattern 8 with the material constituting the light shielding resin 6. It is often greater than the bonding strength with the material. Even when a resist layer (not shown) is laminated on the wiring pattern 8, the bonding force between the material forming the bonding portion 609 and the material forming the base material 1 forms the bonding portion 609. In many cases, the bonding strength between the material and the material constituting the resist layer is larger. Therefore, the configuration including the joint portion 609 in which the light shielding resin 6 is in contact with the base material 1 is suitable for more reliably joining the light shielding resin 6 to the base material 1. Therefore, the optical device 101 is suitable for preventing the light shielding resin 6 from being detached from the substrate 1.

  As shown in FIGS. 10 and 13, in the optical device 101, the wiring pattern 8 includes a second light blocking portion 841 interposed between the light shielding resin 6 and the substrate 1. The second light blocking unit 841 overlaps the light emitting element pad 812 in the direction x. According to such a configuration, even if the light from the light emitting element 2 is directed to the direction y2 side of the light emitting element pad 812 in the translucent resin 5, it is in the gap between the light shielding resin 6 and the base material 1. The passage of the light is blocked by the second light blocking unit 841. Therefore, even if light from the light emitting element 2 is directed to the direction y2 side of the light emitting element pad 812 in the light transmitting resin 5, the light emitting element 2 passes through a gap sandwiched between the light shielding resin 6 and the substrate 1. Can be prevented from reaching the translucent resin 4 from the translucent resin 5. Therefore, the light from the light emitting element 2 can be prevented from being received by the light receiving element 3 through the gap between the light shielding resin 6 and the substrate 1. Therefore, it is possible to further prevent the erroneous detection in which it is determined that the object 891 is close even though the object 891 is not close to the translucent cover 803.

  In the optical device 101, the second light blocking unit 841 is connected to the first light blocking unit 83. According to such a configuration, the gap between the second light blocking unit 841 and the first light blocking unit 83 can be eliminated. Then, the light from the light emitting element 2 passes through the gap between the light shielding resin 6 and the base material 1 between the second light blocking unit 841 and the first light blocking unit 83, and the light from the light transmitting resin 5 is transmitted. It can prevent reaching the translucent resin 4. Thereby, it is possible to prevent light from the light emitting element 2 from being received by the light receiving element 3 through a gap sandwiched between the light shielding resin 6 and the substrate 1. Therefore, it is possible to make the above-described erroneous detection more difficult to invite.

  As shown in FIGS. 10 and 13, in the optical device 101, the wiring pattern 8 includes a third light blocking unit 842 interposed between the light shielding resin 6 and the substrate 1. The third light blocking unit 842 overlaps the light emitting element pad 812 in the direction x. The light emitting element pad 812 is located between the second light blocking unit 841 and the third light blocking unit 842 in the direction y. According to such a configuration, it is possible to further prevent erroneous detection for the same reason as described regarding the second light blocking unit 841.

  In the optical device 101, the third light blocking unit 842 is connected to the first light blocking unit 83. According to such a configuration, it is possible to further prevent erroneous detection for the same reason as described regarding the second light blocking unit 841.

  In the optical device 101, the first light blocking unit 83 that tends to have a relatively large area in the xy plan view can function as an antenna. When the first light blocking unit 83 functions as an antenna, for example, a circuit including the light emitting element 2 may be defective. For this reason, the first light blocking unit 83 is preferably a ground electrode. If the first light blocking unit 83 is a ground electrode, even if the first light blocking unit 83 functions as an antenna, the potential of the first light blocking unit 83 is constant. Hard to occur.

  In the optical device 101, the infrared light L <b> 11 that has exited the light exit surface 51 also includes light that increases the incident angle with respect to the translucent cover 803. As shown in FIGS. 22 and 23, light having a large incident angle with respect to the translucent cover 803 out of the infrared light L11 is reflected by the inner surface of the translucent cover 803 without passing through the translucent cover 803, and noise light. L12. Part of the noise light L <b> 12 forms a relatively large angle with respect to the direction z and travels toward the first surface 6 </ b> A and the first opening 61. In the optical device 101, the edge 611 of the inner peripheral wall 610 has a light receiving element in the depth direction (direction z) of the first opening 61 than any part of the translucent resin 4 exposed from the first opening 61. 3 is located on the side (direction z1) toward the light incident surface 41. Therefore, the light blocking resin 6 can block a part of the noise light L12 that travels at a relatively large angle with respect to the direction z before reaching the light incident surface 41. Thereby, the amount of the noise light L12 that reaches the light receiving element 3 through the light incident surface 41 can be reduced. If the amount of the noise light L12 reaching the light receiving element 3 can be reduced, it is difficult to cause erroneous detection in which it is determined that the object 891 is close even though the object 891 is not close to the translucent cover 103. Can do.

  In the optical device 101, the inner peripheral wall 610 includes portions 610A and 610C that face each other in a direction (direction x) perpendicular to the depth direction (direction z) of the first opening 61. The inclination angle φ13 of the portion 610C with respect to the depth direction (direction z) of the first opening 61 is larger than the inclination angle φ11 of the portion 610A with respect to the depth direction (direction z) of the first opening 61. As shown in FIG. 23, part of the noise light L12 enters the first opening 61. Part of the noise light L12 that has entered the first opening 61 is reflected by the portion 610C. Since the inclination angle φ13 is larger than the inclination angle φ11, the noise light L12 reflected by the portion 610C deviates from the light exit surface 41 and travels toward the portion 610A. Thereby, the amount of the noise light L12 incident on the light emitting surface 41 after being reflected by the portion 610C can be reduced. Therefore, the amount of noise light L12 reaching the light receiving element 3 can be reduced, and erroneous detection can be further prevented.

  FIG. 25 is a graph showing the amount of noise light L12 received by the light receiving element 3 with respect to the inclination angle φ13 of the portion 610C of the inner peripheral wall 610 by simulation. In the figure, the output level of the light receiving element 3 when the inclination angle φ13 is 0 ° is set to “100%” as a reference value. According to the figure, it is understood that if the inclination angle φ13 is 15 ° or more, the amount of the noise light L12 is reduced to the lower limit level.

  In the optical device 101, the light incident surface 41 is flat. According to such a configuration, the amount of noise light L12 incident on the light exit surface 41 after being reflected by the portion 610C can be reduced as compared with the case where the light entrance surface 41 is convex.

  In the optical device 101, the edge 621 of the inner peripheral wall 620 emits light in the depth direction (direction z) of the second opening 62 than any part of the translucent resin 5 exposed from the second opening 62. It is located on the direction (direction z1) side from the element 3 toward the light emitting surface 51. According to such a configuration, light traveling from the light emitting surface 51 in a direction with a large incident angle with respect to the light transmitting cover 803 is easily blocked by the inner peripheral wall 620. For this reason, the amount of noise light L12 received by the light receiving element 3 can be reduced, and erroneous detection can be further prevented.

  In the optical device 101, the notch surface 52B is exposed from the light shielding resin 6 in the direction x1. In such a configuration, the infrared light L11 is emitted also from the cutout surface 52B. Then, the infrared light L11 emitted from the cut-out surface 52B proceeds as it is in the direction x1 without hitting the inner peripheral wall 620. Also by this, the amount of noise light L12 received by the light receiving element 3 can be reduced, and erroneous detection can be further prevented.

  In the optical device 101, the light shielding resin 6 has a surface 603. The surface 603 is an uneven surface and faces the direction z1 and is located on the direction x1 side with respect to the first opening 61. The surface 603 that is an uneven surface is suitable for a configuration in which the noise light L <b> 12 is not reflected toward the first opening 61 after being reflected by the surface 603. Therefore, the noise light L12 traveling toward the first opening 61 can be reduced. In particular, in the optical device 101, a plurality of grooves 643 each extending along one direction on the surface 603 is formed in the light shielding resin 6. The surface 603 defines any one groove 643 of the plurality of grooves 643, and the first groove surface 653a and the second groove surface 653b located on opposite sides of the bottom of the one groove 643. Have In each groove 643, the second groove surface 653b is located on the side farther from the first opening 61 than the first groove surface 653a. According to such a configuration, a part of the noise light L12 can be reflected by the first groove surface 653a and can be directed to the side opposite to the side where the first opening 61 is located. Therefore, the noise light L12 traveling toward the first opening 61 can be reduced. Unlike this embodiment, the surface 603 may be an uneven surface by forming a fine uneven shape on the surface 603.

  FIG. 24 is a graph showing the amount of noise light L12 received by the light receiving element 3 in accordance with the inclination angle θ31 with respect to the distance d between the optical device 101 and the translucent cover 803 by simulation. In the figure, the output level of the light receiving element 3 when the inclination angle θ31 is 0 is set to “1” as the reference value of the optical noise. According to the figure, when the inclination angle θ31 is 50 °, 60 °, and 70 °, the noise light L12 received by the light receiving element 3 even if the distance d changes within the range of 0.25 to 1 mm. It is understood that the amount is effectively reduced.

  In the optical device 101, the light receiving element 3 includes a semiconductor substrate 30, a visible light detection unit 31, and an infrared light detection unit 32. Both the visible light detection unit 31 and the infrared light detection unit 32 are provided on one semiconductor substrate 30. According to such a configuration, a one-chip light receiving element 3 having a visible light detection function and an infrared light detection function can be provided. Therefore, the size of the light receiving element 3 can be reduced as compared with the case where the visible light detection function and the infrared light detection function are realized by individual chips. The downsizing of the light receiving element 3 is suitable for downsizing the optical device 101. In the configuration including the one-chip light receiving element 3 having the visible light detection function and the infrared light detection function, both the light reaching the visible light detection unit 31 and the light reaching the infrared light detection unit 32 are light incident surfaces. 41 will be passed. For this reason, it is not necessary to provide a light incident surface for the light reaching the infrared light detection unit 32 to pass separately from the light incident surface for the light reaching the visible light detection unit 31 to pass. This is also suitable for reducing the size of the optical device 101.

  In the optical device 101, the light receiving element 3 includes a laminated optical film 34 that covers the infrared light detection unit 32 and transmits infrared light. According to such a configuration, when the light receiving element 3 is molded with the translucent resin 4, the visible light detection unit 31 and the infrared light detection unit 32 do not require separate resin molding processes. Moreover, the laminated optical film 34 can be formed by a semiconductor process for forming a thin film on the semiconductor substrate 30. Therefore, it is easy to add a process for forming the laminated optical film 34, and semiconductor manufacturing equipment can be used, so that the production cost can be reduced.

  Next, a modification of the first embodiment will be described with reference to FIG. In the following modification, the same or similar components as those described with respect to the optical device 101 are denoted by the same reference numerals as those described above, and the description thereof is omitted.

  FIG. 6 is a plan view showing a modification of the optical device according to the first embodiment. In the optical device according to this modification, the wiring pattern 8 does not include the third light blocking portion 842 but includes the third light blocking portion 843, the connection portion 852, and the cathode electrode 21 is a light emitting element pad. The optical device 101 is different from the above-described optical device 101 in that the wire 78 is bonded to the anode electrode 812 and the wire 78 is bonded to the anode electrode 22, but the other points are the same.

  In this modification, unlike the third light blocking unit 842 in the optical device 101, the third light blocking unit 843 is not electrically connected to the wire bonding pad 821 to which the wire 78 is bonded. Specifically, it is as follows. The third light blocking portion 843 is interposed between the light shielding resin 6 and the base material 1. In the present modification, the third light blocking portion 843 has a strip shape extending along the direction x. The third light blocking unit 843 overlaps the light emitting element pad 812 in the direction x. The third light blocking portion 843 is located on the direction y2 side of the light emitting element pad 812. Therefore, the light emitting element pad 812 is positioned between the third light blocking unit 843 and the second light blocking unit 841. Similar to the third light blocking unit 842, the third light blocking unit 843 may have a portion covered with the translucent resin 5, or the third light blocking unit 843 is covered with the translucent resin 5. It does not have to be. Preferably, the third light blocking unit 843 is connected to the first light blocking unit 83.

  The communication unit 852 is connected to the light emitting element pad 812 and the first light blocking unit 83. In the present modification, the connecting portion 852 has a strip shape extending along the direction x, but the shape of the connecting portion 852 is not limited to this. The connecting portion 852 is located between the light emitting element pad 812 and the first light blocking portion 83 and is covered with the light transmissive resin 5.

  As described above, the cathode electrode 21 is bonded to the light emitting element pad 812. Therefore, both the communication unit 852 and the first light blocking unit 83 are electrically connected to the cathode electrode 21 of the light emitting element 2. Also in this modification, the first light blocking unit 83 may be a ground electrode in a circuit including the light emitting element 2.

  Even with such a configuration, the same advantages as those of the optical device 101 can be obtained.

  In addition, you may employ | adopt the structure concerning the above-mentioned wiring pattern 8 in the optical apparatus concerning following 2nd Embodiment-6th Embodiment.

  Next, 2nd Embodiment-9th Embodiment are described. In the following embodiment, the same or similar configurations as those described in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the description thereof is omitted.

Second Embodiment
FIG. 27 is a cross-sectional view of the optical device according to the second embodiment.

  The optical device 102 shown in the figure is different from the optical device 101 described above in that the cross-sectional shapes of the grooves 641 to 644 are rectangular. Except for the fact that the cross-sectional shapes of the grooves 641 to 644 are different, each configuration of the optical device 102 is the same as each configuration of the optical device 101, and thus description thereof is omitted. Even with such a configuration, as in the first embodiment, part of the noise light L12 may be reflected by the first groove surface 653a and directed toward the side opposite to the side where the first opening 61 is located. it can. Therefore, the noise light L12 traveling toward the first opening 61 can be reduced.

<Third Embodiment>
FIG. 28 is a cross-sectional view of the optical device according to the third embodiment.

  The optical device 103 shown in the figure is different in the cross-sectional shape of the grooves 641 to 644 from the optical device 101 described above. In the surface 601 of the optical device 103, the first angle θ11 that is the inclination angle with respect to the direction x of the groove surface 651a is smaller than the second angle θ12 that is the inclination angle with respect to the direction x of the groove surface 651b. In the surface 603 of the optical device 103, the first angle θ31 that is the inclination angle with respect to the direction x of the groove surface 653a is larger than the second angle θ32 that is the inclination angle with respect to the direction x of the groove surface 653b. The inclination angle θ21 and the inclination angle θ22 are the same. Similarly, the inclination angle θ41 and the inclination angle 42 are the same.

  According to such a configuration, in the surface 603, the first angle θ31 is larger than the second angle θ32. Therefore, the amount of noise light L12 reflected by the first groove surface 653a and falling on the second groove surface 653b is reduced, and the light reflected by the first groove surface 653a is opposite to the side where the first opening 61 is located. You can be sure to go to. This configuration is suitable for reducing the noise light L12 traveling toward the first opening 61.

  In the surface 601, the first angle θ11 is smaller than the second angle θ12. According to such a configuration, the noise light L12 that has traveled between the surface 601 and the translucent cover 803 from between the surface 603 and the translucent cover 803 is reflected by the first groove surface 651a. It can be directed to the direction x2. This configuration is suitable for reducing the noise light L12 traveling to the first opening 61.

<Fourth embodiment>
FIG. 29 is a plan view of an optical device according to the fourth embodiment. 30 is a cross-sectional view taken along line XXX-XXX in FIG.

  In the optical device 104 shown in the figure, a plurality of grooves 646 are formed in the light shielding resin 6 on the surfaces 601 to 603 of the first surface 6A. Each groove 646 extends along one direction. In the present embodiment, each groove 646 extends along the circumferential direction with the opening center of the first opening 61 as the center. The surfaces 601 to 603 each define any one groove 646 of the plurality of grooves 646, and the first groove surface 656a and the second groove located on opposite sides of the bottom of the one groove 646. It has a surface 656b. In each groove 646 formed in the center of the direction y in the surface 603, the first groove surface 656a is located on the direction x2 side, and the second groove surface 656b is located on the direction x1 side. That is, in each groove 646 formed in the center of the direction y in the surface 603, the second groove surface 656b is located on the side farther from the first opening 61 than the first groove surface 656a. Hereinafter, the first groove surface 656a and the second groove surface 656b formed in the center of the direction y in the surface 603 will be referred to.

  The first groove surface 656a has an inclined surface that is directed toward the direction z2 as it is closer to the direction x1. The first groove surface 656a is inclined at the first angle θ61 with respect to the direction x. On the other hand, the second groove surface 656b is an inclined surface that is directed toward the direction z2 as it is closer to the direction x2. The second groove surface 656b is inclined at the second angle θ62 with respect to the direction x. Preferably, each of the first angle θ61 and the second angle θ62 is 50 ° to 70 °. In the present embodiment, the first angle θ61 and the second angle θ62 are the same. As in the third embodiment, the first angle θ61 may be larger than the second angle θ62.

  Even with such a configuration, part of the noise light L12 can be reflected by the first groove surface 656a and directed toward the side opposite to the side where the first opening 61 is located. Therefore, the noise light L12 traveling toward the first opening 61 can be reduced.

<Fifth Embodiment>
FIG. 31 is a plan view of an optical device according to the fifth embodiment. 32 is a cross-sectional view taken along line XXXII-XXXII in FIG.

  In the optical device 105 shown in the figure, a plurality of grooves 647 are formed in the light shielding resin 6 on the surface 603 of the first surface 6A. Each groove 647 extends along one direction. In FIG. 31, the region where the groove 647 is formed is indicated by hatching for convenience. In the present embodiment, each groove 647 extends along the direction x. The surface 603 defines any one groove 647 of the plurality of grooves 647, and the first groove surface 657a and the second groove surface 657b are located on opposite sides of the bottom of the one groove 647. Have In each groove 647, the second groove surface 657b is located on the far side from the first groove surface 657a from a virtual straight line L15 extending along the direction x through the opening center of the first opening 610.

  The first groove surface 657a is a slope that goes toward the direction z2 as the distance from the virtual straight line L15 increases in the direction y. The first groove surface 657a is inclined at the first angle θ71 with respect to the direction y. On the other hand, the second groove surface 657b is a slope that goes toward the direction z2 as it approaches the virtual straight line L15 in the direction y. The second groove surface 657b is inclined at the second angle θ72 with respect to the direction y. Preferably, each of the first angle θ71 and the second angle θ72 is 50 ° to 70 °. In the present embodiment, the first angle θ71 is larger than the second angle θ72.

  According to such a configuration, the noise light L12 reflected by the first groove surface 657a travels away from the virtual straight line L15 in the xy plan view. Thereby, the amount of the noise light L12 traveling to the first opening 61 can be reduced.

<Sixth Embodiment>
FIG. 33 is a perspective view of an optical device according to the sixth embodiment. 34 is a cross-sectional view taken along line XXXIV-XXXIV in FIG.

  The optical device 106 shown in the figure is different from the optical device 101 described above in that the translucent resin 5 is not exposed from the light shielding resin 6 in the direction x1. The first surface 6 </ b> A of the light shielding resin 6 has a surface 605 positioned on the direction x <b> 1 side with respect to the second opening 62. In the present embodiment, a plurality of grooves 645 are formed on the surface 605. Unlike the present embodiment, the surface 605 may be a flat surface without grooves. Even with such a configuration, substantially the same advantages as those of the optical device 101 can be obtained.

<Seventh embodiment>
FIG. 35 is a plan view of a light receiving element in the optical device according to the seventh embodiment.

  In the figure, in the light receiving element 3, the visible light detection unit 31 is located outside the smallest rectangular region S11 having the smallest area among the rectangular regions surrounding the infrared light detection unit 32 in the xy plan view. In addition, the infrared light detection unit 32 is located farther from the light emitting element 2 than the visible light detection unit 31 in the xy plan view. Even with such a configuration, the same advantages as those of the optical device 101 described above can be obtained.

<Eighth Embodiment>
FIG. 36 is a cross-sectional view of the optical device according to the eighth embodiment.

  The optical device 108 shown in the figure is different from the optical device 101 described above in that the light receiving element 3 is a photodiode having no visible light detection unit. The optical device 108 includes a base material 1, a light emitting element 2, a light receiving element 3, an illuminance sensor element 3 ′, translucent resins 4, 5, 999, and a light shielding resin 6. Since each structure of the base material 1, the light emitting element 2, the translucent resins 4 and 5, and the light shielding resin 6 is substantially the same as the structure in the optical device 101, the description thereof is omitted. The illuminance sensor element 3 ′ has the same function as the visible light detector 31 of the light receiving element 3 in the optical device 101. The translucent resin 999 covers the illuminance sensor element 3 ′ and is exposed from the light shielding resin 6. Visible light enters the illuminance sensor element 3 ′ from a portion of the translucent resin 999 exposed from the light shielding resin 6. Even with such a configuration, it is possible to reduce the noise light L12 traveling toward the first opening 61.

<Ninth Embodiment>
FIG. 37 is a cross-sectional view of an electronic apparatus according to the ninth embodiment.

  The electronic apparatus 808 shown in the figure is different from the electronic apparatus 801 described above in that the optical device 109 does not include the light emitting element 2 and the translucent resin 5. The other points are the same as those of the optical device 101 described above, and thus the description thereof is omitted. For example, the optical device 109 functions as a proximity sensor by being used together with the light emitting device 301 including the light emitting element 2 that is separate from the optical device 109. Even with such a configuration, it is possible to reduce the noise light L12 traveling toward the first opening 61.

  The scope of the present invention is not limited to the embodiment described above. The specific configuration of each part of the present invention can be changed in various ways.

801, 808 Electronic device 802 Liquid crystal display unit 803 Translucent cover 101-106, 108, 109 Optical device 301 Light-emitting device 1 Base material 10 Mounting surface 11 Back surface 2 Light-emitting element 21 Cathode electrode 22 Anode electrode 3 Light-receiving element 30 Semiconductor substrate 31 Visible Photodetector 32 Infrared light detector 33 Functional element unit 34 Laminated optical film 4 Translucent resin 40 Protruding part 41 Light incident surface 43 Flat surface 5 Translucent resin 50 Convex part 51 Light emitting surface 52A, 52B Notch surface 53 Flat Surface 6 Light shielding resin 609 Joint portion 6A First surface 6B, 6C Second surface 6D, 6E Third surface 61 First opening portion 610 Inner peripheral wall 611 End edge 610A, 610B, 610C portion 62 Second opening portion 620 Inner peripheral wall 621 End Edges 601 to 605 Surfaces 641 to 647 Grooves 651a, 652a, 653a, 654a, 656a, 657a, first groove surface 651b, 52b, 653b, 654b, 656b, 657b, second groove surface 7 mold 70 cylindrical portion 701 mold 702 flat surface 78, 79 wire 8 wiring pattern 811 light receiving element pad 812 light emitting element pad 821 wire bonding pad 822 through Hole peripheral portion 83 First light blocking portion 831 First portion 832 Second portion 833, 834 Connecting portion 839 Opening portion 841 Second light blocking portion 842 Third light blocking portion 843 Third light blocking portion 851 Connection portion 852 Contact portion 861 Connection wiring 88 Mounting terminal portion 89 Through-hole electrodes θ11, θ21, θ31, θ41, θ61, θ71 First angles θ12, θ22, θ32, θ42, θ62, θ72 Second angles φ11, φ12, φ13 Inclination angle L11 Infrared light L12 Noise light L15 Virtual straight line S11 Minimum rectangular area

Claims (20)

A substrate;
A wiring pattern formed on the substrate;
A light receiving element and a light emitting element, each disposed on the base material and spaced apart from each other in a first direction orthogonal to the thickness direction of the base material;
A first translucent resin covering the light receiving element;
A second translucent resin covering the light emitting element;
A light-shielding resin that covers the first light-transmitting resin and the second light-transmitting resin,
The wiring pattern includes a first light blocking portion that is interposed between the light shielding resin and the base material and is positioned between the light receiving element and the light emitting element in the thickness direction view,
The optical device, wherein the first light blocking unit traverses the light emitting element in the first direction view. The first light blocking unit includes a first part and a second part that are separated from each other,
2. The optical device according to claim 1, wherein the light shielding resin includes a joint portion that is sandwiched between the first portion and the second portion and is in contact with the base material.   The optical device according to claim 2, wherein the joint portion overlaps the light emitting element in a thickness direction of the base material and in a second direction orthogonal to the first direction.   3. The optical device according to claim 2, wherein the first part and the second part have a strip shape extending along a thickness direction of the base material and a second direction orthogonal to the first direction, respectively. The first light blocking portion includes two connecting portions spaced apart from each other with the joint portion in the thickness direction view,
The optical device according to claim 4, wherein each of the connecting portions is connected to either the first part or the second part.   The optical device according to claim 1, wherein the wiring pattern includes a light emitting element pad to which the light emitting element is bonded. The wiring pattern includes a second light blocking part interposed between the light shielding resin and the base material,
The optical device according to claim 6, wherein the second light blocking unit overlaps the light emitting element pad in the first direction.   The optical device according to claim 7, wherein the second light blocking unit has a portion covered with the second light-transmitting resin.   The optical device according to claim 7, wherein the second light blocking unit is connected to the first light blocking unit. The wiring pattern includes a third light blocking unit interposed between the light shielding resin and the base material,
The third light blocking unit overlaps the light emitting element pad in the first direction,
The optical device according to claim 7, wherein the light emitting element pad is positioned between the second light blocking unit and the third light blocking unit in the first direction view.   The optical device according to claim 10, wherein the third light blocking unit has a portion covered with the second light-transmitting resin.   The optical device according to claim 10, wherein the third light blocking unit is connected to the first light blocking unit. Further comprising a wire bonded to the light emitting element,
The wiring pattern includes a wire bonding pad to which the wire is bonded,
The optical device according to claim 10, wherein the third light blocking unit is electrically connected to the wire bonding pad. Further comprising a wire bonded to the light emitting element,
The optical device according to claim 10, wherein the wiring pattern includes a wire bonding pad to which the wire is bonded, and a connecting portion connected to the light emitting element pad and the first light blocking portion. . The light emitting element includes a cathode electrode and an anode electrode,
The optical device according to claim 1, wherein the first light blocking unit is electrically connected to the cathode electrode.   The optical device according to claim 13, wherein the first light blocking unit is a ground electrode.   The said wiring pattern contains the pad for light receiving elements in which the said light receiving element is arrange | positioned, and the connection part connected to the said pad for light receiving elements and the said 1st light interruption | blocking part. Optical device.   The optical device according to claim 1, wherein the first light blocking unit has a portion covered with the second light-transmitting resin.   The optical device according to claim 1, wherein the wiring pattern includes a mounting terminal portion formed on the base material on a side opposite to the side on which the first light blocking portion is formed.   The optical device according to claim 19, further comprising a through-hole electrode that conducts to the mounting terminal portion and penetrates the base material.

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