JP2012186354A - Semiconductor manufacturing apparatus and semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method, which detect ink adhesion even when a front face and a rear face of a semiconductor wafer are not electrically connected.SOLUTION: A conductive ink 2 is adhered to a specific location on a semiconductor wafer 7 by an inker 1 having a conductive inner core 5. A terminal 6 is caused to perform probing on a pad 8 on the semiconductor wafer 7. A current flowing between the inner core 5 and the terminal 6 is measured by a measuring instrument 9. In the case where a current flowing between the inner core 5 and the terminal 6 via the conductive ink 2 can be measured by the measurement instrument 9, it is determined that the conductive ink 2 properly adheres to the semiconductor wafer 7.

Description

  The present invention relates to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device in which ink is attached to a specific location on a semiconductor wafer.

  It is determined whether a plurality of chips formed on the semiconductor wafer are defective or non-defective. Ink is applied to the defective chip by the inker. By recognizing this ink in the next step, it becomes possible to discriminate between good and defective products, and only good products can be assembled.

  Conventionally, it has been confirmed by visual observation or image recognition whether ink has correctly adhered to a defective chip. However, there are problems such as a slow processing speed. On the other hand, there has been proposed a method for electrically measuring whether or not the ink is properly attached by measuring the current flowing through the conductive ink between the stage on which the wafer is mounted and the inker ( For example, see Patent Document 1). As a result, since ink adhesion can be confirmed simultaneously with the ink hitting operation, the processing speed does not slow down.

JP 2002-261134 A

  However, in the conventional method, a through hole or the like for electrically conducting the front surface and the back surface of the semiconductor wafer has to be provided. Further, the size of the ink could not be controlled. Furthermore, insulating ink could not be used.

  The present invention has been made to solve the above-described problems, and a first object is to detect ink adhesion even when the front and back surfaces of a semiconductor wafer are not electrically connected. A semiconductor manufacturing apparatus and a semiconductor device manufacturing method that can be obtained are obtained. The second object is to obtain a semiconductor manufacturing apparatus and a semiconductor device manufacturing method capable of controlling the size of ink. The third object is to obtain a semiconductor manufacturing apparatus and a semiconductor device manufacturing method capable of detecting adhesion of ink even when insulating ink is used.

  A semiconductor manufacturing apparatus according to the present invention has a conductive core, an inker that attaches conductive ink to a specific location on a semiconductor wafer, a terminal that probes to a pad on the semiconductor wafer, and the ink. And a measuring instrument for measuring a current flowing between the core and the terminal.

  According to the present invention, ink adhesion can be detected even when the front surface and back surface of the semiconductor wafer are not electrically connected.

It is a figure which shows the semiconductor manufacturing apparatus which concerns on Embodiment 1 of this invention. It is a figure for demonstrating the manufacturing method of the semiconductor device which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the manufacturing method of the semiconductor device which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the manufacturing method of the semiconductor device which concerns on Embodiment 2 of this invention. It is a figure which shows the semiconductor manufacturing apparatus which concerns on Embodiment 3 of this invention. It is a figure which shows the semiconductor manufacturing apparatus which concerns on Embodiment 4 of this invention. It is a figure which shows the semiconductor manufacturing apparatus which concerns on Embodiment 4 of this invention. It is a figure which shows the semiconductor manufacturing apparatus which concerns on Embodiment 5 of this invention.

  A semiconductor manufacturing apparatus and a semiconductor device manufacturing method according to embodiments of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a semiconductor manufacturing apparatus according to Embodiment 1 of the present invention. The inker 1 has an ink fountain 3 for storing the conductive ink 2, a tip tube portion 4, and a conductive core 5 that penetrates the ink tub 3 and the tip tube portion 4. The terminal 6 is probed to the pad 8 on the semiconductor wafer 7. The measuring device 9 measures the current flowing between the core 5 and the terminal 6 via the conductive ink 2. The stage 10 mounts the semiconductor wafer 7. The control unit 11 controls the height of the stage 10 and the operation of the inker 1.

  Subsequently, a method for manufacturing the semiconductor device according to the first embodiment of the present invention will be described. First, when the control unit 11 gives an inking command to the inker 1, the conductive ink 2 stored in the ink fountain 3 is pushed out by the inner core 5 through the tip tube portion 4 and attached to the semiconductor wafer 7.

  Next, the terminal 6 is probed to the pad 8 on the semiconductor wafer 7. Then, the current flowing between the core 5 and the terminal 6 is measured by the measuring instrument 9.

  As a result, when the current flowing between the core 5 and the terminal 6 through the conductive ink 2 is measured by the measuring device 9, it is determined that the conductive ink 2 is correctly attached on the semiconductor wafer 7. On the other hand, when the current is not measured by the measuring instrument 9, the control unit 11 raises the height of the stage 10, controls the inker 1, and attaches the conductive ink 2 to the semiconductor wafer 7 again.

  In this embodiment, the terminal 6 is probed on the pad 8 on the semiconductor wafer 7, and the current flowing between the core 5 and the terminal 6 through the conductive ink 2 is measured. Thereby, even when the front surface and the back surface of the semiconductor wafer 7 are not electrically connected, the adhesion of the conductive ink 2 can be detected.

  Further, when the current is not measured by the measuring instrument 9, the control unit 11 raises the height of the stage 10 and gives an inking command to the inker 1 again. Since the conductive ink 2 can be reliably attached to the semiconductor wafer 7 by this feedback function, it is possible to eliminate idling.

Embodiment 2. FIG.
A method of manufacturing a semiconductor device according to the second embodiment of the present invention will be described with reference to FIGS.

  First, it is determined whether a plurality of chips formed on the semiconductor wafer 7 are defective or non-defective, and the defective chips 12 shown in FIG. 2 are extracted. The defective chip 12 has first and second pads 13 and 14.

  Next, as shown in FIG. 3, the conductive ink 2 is attached to the area including the first and second pads 13 and 14 of the defective chip 12 on the semiconductor wafer 7 by the inker 1.

  Next, as shown in FIG. 4, the first and second terminals 15 and 16 are probed on the first and second pads 13 and 14, respectively. Then, the current flowing between the first terminal 15 and the second terminal 16 is measured by the measuring instrument 9. As a result, when the current flowing between the first terminal 15 and the second terminal 16 through the conductive ink 2 is measured by the measuring device 9, the conductive ink 2 is correctly attached on the defective chip 12. It is determined that

  Thereby, even when the front surface and the back surface of the semiconductor wafer 7 are not electrically connected, the adhesion of the conductive ink 2 can be detected. The first and second terminals 15 and 16 can also be used as probe needles used in the wafer test.

Embodiment 3 FIG.
FIG. 5 shows a semiconductor manufacturing apparatus according to Embodiment 3 of the present invention. The first terminal 15 is disposed at a predetermined minimum radius of the conductive ink 2. The second terminal 16 is disposed at a predetermined maximum radius position of the conductive ink 2. The measuring instrument 9 measures a current flowing between the core 5 and the first terminal 15 and a current flowing between the core 5 and the second terminal 16, respectively.

  Then, the manufacturing method of the semiconductor device which concerns on Embodiment 3 of this invention is demonstrated. First, the conductive ink 2 is adhered to the defective chip 12 on the semiconductor wafer 7 by the inker 1. At this time, the first terminal 15 is arranged at a predetermined minimum radius position of the conductive ink 2, and the second terminal 16 is arranged at a predetermined maximum radius position of the conductive ink 2. Then, the current flowing between the core 5 and the first terminal 15 and the current flowing between the core 5 and the second terminal 16 are respectively measured by the measuring device 9.

  As a result, the current flowing between the core 5 and the first terminal 15 through the conductive ink 2 is measured by the measuring device 9, and the current flowing between the core 5 and the second terminal 16 is measured. If not, it is determined that the conductive ink 2 is correctly attached on the semiconductor wafer 7. Thereby, the radius of the conductive ink 2 can be controlled.

Embodiment 4 FIG.
6 and 7 are diagrams showing a semiconductor manufacturing apparatus according to Embodiment 4 of the present invention. In the present embodiment, the tip tube portion 17 of the inker 1 is conductive, and the core 18 is insulative. The measuring instrument 9 measures the current flowing between the tip cylindrical portion 17 and the semiconductor wafer 7 via the conductive ink 2.

  Then, the manufacturing method of the semiconductor device which concerns on Embodiment 4 of this invention is demonstrated. First, the conductive ink 2 is adhered to a specific location on the semiconductor wafer 7 by the inker 1. The conductive ink 2 is present between the tip cylindrical portion 17 of the inker 1 and the semiconductor wafer 7. Then, the current flowing between the tip tube portion 17 and the semiconductor wafer 7 through the conductive ink 2 is measured by the measuring instrument 9.

  As a result, as shown in FIG. 6, the conductive ink 2 is low and does not come into contact with the tip tube portion 17, and the current flowing between the tip tube portion 17 and the semiconductor wafer 7 through the conductive ink 2 is measured by the measuring instrument 9. If the measurement is not performed, the height of the conductive ink 2 is determined to be within the specified range. On the other hand, as shown in FIG. 7, when the conductive ink 2 becomes higher and comes into contact with the distal end cylindrical portion 17 and the current is measured, it is determined that it is out of regulation. Thereby, the height of the conductive ink 2 can be controlled.

Embodiment 5 FIG.
FIG. 8 shows a semiconductor manufacturing apparatus according to Embodiment 5 of the present invention. In this embodiment, the insulating ink 19 is used. The measuring device 20 measures the capacity of the insulating ink 19 existing between the core 5 and the semiconductor wafer 7.

  Then, the manufacturing method of the semiconductor device which concerns on Embodiment 5 of this invention is demonstrated. First, the insulating ink 19 is attached to a specific location on the semiconductor wafer 7 by the inker 1. Next, the capacity of the insulating ink 19 existing between the core 5 and the semiconductor wafer 7 is measured by the measuring device 20.

  When the measured capacity is within a predetermined range, it is determined that the insulating ink 19 is correctly attached on the semiconductor wafer 7. Thereby, even when the insulating ink 19 is used, the adhesion of ink can be detected.

DESCRIPTION OF SYMBOLS 1 Inker 2 Conductive ink 5,18 Middle core 6 Terminal 7 Semiconductor wafer 8 Pad 9, 20 Measuring instrument 10 Stage 11 Control part 13 1st pad 14 2nd pad 15 1st terminal 16 2nd terminal 17 Tip Tube part 19 Insulating ink

Claims (10)

An inker that has a conductive core and attaches conductive ink to a specific location on a semiconductor wafer;
A terminal for probing a pad on the semiconductor wafer;
A semiconductor manufacturing apparatus comprising: a measuring device that measures a current flowing between the core and the terminal via the conductive ink. A stage on which the semiconductor wafer is mounted;
A control unit for controlling the height of the stage and the operation of the inker,
The said control part raises the height of the said stage when the said electric current is not measured by the said measuring device, controls the said inker, and makes the said conductive ink adhere to the said semiconductor wafer again, It is characterized by the above-mentioned. Item 2. The semiconductor manufacturing apparatus according to Item 1. A process of attaching conductive ink to a specific location on a semiconductor wafer by an inker having a conductive core;
Probing a terminal on a pad on the semiconductor wafer;
A step of measuring a current flowing between the core and the terminal with a measuring instrument,
When the current flowing between the core and the terminal through the conductive ink is measured by the measuring device, it is determined that the conductive ink is correctly attached on the semiconductor wafer. A method for manufacturing a semiconductor device. Attaching a conductive ink to a specific location on the semiconductor wafer including the first and second pads;
Probing first and second terminals on the first and second pads, respectively, after depositing the conductive ink;
Measuring a current flowing between the first terminal and the second terminal with a measuring instrument,
When the current flowing between the first terminal and the second terminal through the conductive ink is measured by the measuring instrument, it is determined that the conductive ink is correctly attached on the semiconductor wafer. A method of manufacturing a semiconductor device. An inker that has a conductive core and attaches conductive ink to a specific location on a semiconductor wafer;
A first terminal disposed at a position of a predetermined minimum radius of the conductive ink;
A second terminal disposed at a position of a predetermined maximum radius of the conductive ink;
A semiconductor manufacturing apparatus comprising: a measuring instrument that measures a current flowing between the core and the first terminal and a current flowing between the core and the second terminal, respectively. . A process of attaching conductive ink to a specific location on a semiconductor wafer by an inker having a conductive core;
Disposing a first terminal at a position of a predetermined minimum radius of the conductive ink and disposing a second terminal at a position of a predetermined maximum radius of the conductive ink;
Measuring each of the current flowing between the core and the first terminal and the current flowing between the core and the second terminal with a measuring instrument,
When the current flowing between the core and the first terminal via the conductive ink is measured by the measuring instrument, and the current flowing between the core and the second terminal is not measured A method for manufacturing a semiconductor device, comprising: determining that the conductive ink is correctly attached on the semiconductor wafer. An inker that has a conductive tip tube portion and an insulating core that penetrates the tip tube portion, and adheres conductive ink to a specific location on the semiconductor wafer;
A semiconductor manufacturing apparatus comprising: a measuring device that measures a current flowing between the tip tube portion and the semiconductor wafer via the conductive ink. A step of attaching conductive ink to a specific location on a semiconductor wafer by an inker having a conductive tip tube portion and an insulating core passing through the tip tube portion;
A step of measuring a current flowing between the tip cylindrical portion and the semiconductor wafer via the conductive ink by a measuring instrument,
When the current flowing between the tip tube portion and the semiconductor wafer through the conductive ink is not measured by the measuring instrument, the height of the conductive ink is within the specified range, and the current is measured A method for manufacturing a semiconductor device, characterized in that the semiconductor device is determined not to be specified. An inker that has a conductive core and attaches insulating ink to a specific location on a semiconductor wafer;
A semiconductor manufacturing apparatus comprising: a measuring device that measures a capacity of the insulating ink existing between the core and the semiconductor wafer. A process of attaching insulating ink to a specific location on a semiconductor wafer by an inker having a conductive core;
A step of measuring the capacity of the insulating ink existing between the core and the semiconductor wafer with a measuring instrument,
A method of manufacturing a semiconductor device, wherein when the measured capacitance is within a predetermined range, it is determined that the insulating ink is properly attached on the semiconductor wafer.

Images