JP2012180583A - Long metal foil with multiple pores and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a long metal foil with multiple pores, in which a number of micropores are formed and which is free from folded wrinkles, deformation and strain, is wound up in a roll form, and has a small thickness, and to provide a method for manufacturing the long metal foil with multiple pores.SOLUTION: The long metal foil A with multiple pores having a length of 500 m or more and suitable as an electrode for a winding type capacitor is manufactured by laminating dry film resists, one of which serves as a resist layer 3a and the other of which serves as a reinforcing layer 3b on both surfaces of an extremely thin and long copper foil A, to obtain a long laminated copper foil, and then performing an exposure process, a development process, an etching process, and a process for removing the residual resist layer and reinforcing layer by using the laminated copper foil, and directly winding up the long metal foil A with multiple pores obtained through the process for removing the residual resist layer and reinforcing layer, in a roll form.

Description

  The present invention relates to a porous long metal foil used as, for example, an electrode material of a capacitor and a method for manufacturing the same.

Capacitors are attracting attention as a regenerative power source for infrastructure and automobiles due to advantages such as large current, ultra-rapid charge / discharge characteristics, and semi-permanent lifetime.
In the case of a capacitor for ultra-instantaneous power supply, the electrode needs to be devised to increase the instantaneous charge / discharge power, and is required to satisfy the requirements that enable the internal resistance of the electrode itself to be reduced and the capacity to be increased.

Further, as the capacitor, there is a swivel capacitor in which a dielectric film is alternately wound between a long metal foil serving as a cathode and a long metal foil serving as an anode (see Patent Documents 1 and 2). ).
Examples of a method for making such a capacitor lightweight and large in capacity without increasing the size include the following methods.
(1) An electrode material having good electrical conductivity is used.
(2) Use a wide and seamless cathode and anode.
(3) Use as thin a metal foil as possible.
(4) A large number of holes are provided in the metal foil in order to increase the electrode surface area.

JP 61-121317 A JP-A-2-137211

In order to satisfy the above condition (1), the same aluminum foil or copper foil as in the past may be used. Further, when the condition (2) is to be satisfied, a large number of holes may be drilled in a commercially available metal foil by roll-to-roll.
However, when the metal foil is made extremely thin as in (3), when trying to satisfy the condition of (4), the roll-to-roll mechanical perforation method causes problems such as burrs and surface scratches. There's a problem.

  Therefore, a chemical etching method is generally used for perforation. However, if the thickness of the foil is extremely thin, even in the chemical etching method, folds and deformations that impair the reliability of the dielectric layer are impaired. There is a problem that distortion occurs.

  SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a thin porous long metal foil having a large number of micropores and wound in a roll shape free from creases, deformation, and distortion, and a method for producing the same. The purpose is to do.

  In order to achieve the above object, the method for producing a porous long metal foil according to the present invention (hereinafter referred to as “the production method of the present invention”) has a large number of fine holes penetrating from one surface to the other surface. A method for producing a porous long metal foil drilled over almost the entire length, comprising a resist layer having a dry film resist adhered or pressure-bonded to one surface of the long metal foil, and the other of the metal foil A long laminated metal foil provided with a reinforcing layer having a chemically dissolved and peelable reinforcing film bonded or pressure-bonded to the surface is fed from one side of the laminated metal foil in the longitudinal direction to the other side to the exposure apparatus, and the resist An exposure process in which the layer is exposed at predetermined widths, and the repeated pattern of the fine holes is successively printed, and the exposed portion exposed in this exposure process is sent from one side of the longitudinal direction to the other side in the development direction. , Les A developing step for dissolving and removing the easily soluble portion for forming micropores in the strike layer with a developing solution, and the developed portion of the laminated metal foil is fed from one side of the laminated metal foil to the other side in the longitudinal direction. Etching the exposed portion of the metal foil to form fine holes, and sending the etched portion of the laminated metal foil from one side of the laminated metal foil to the other side in the longitudinal direction to the peeling device, A residual resist layer and a reinforcing layer removing step that peels and removes the layer and the reinforcing layer by exposing to a stripping solution, and directly winds the porous long metal foil obtained through the residual resist layer and the reinforcing layer removing step into a roll shape It is characterized by.

The production method of the present invention is not particularly limited, but in the exposure step, a non-removable portion with a developer having a diameter smaller than the diameter is provided in the center of the easily soluble portion, and in the etching step, the resist layer side of the laminated metal foil is placed below. The etching solution may be sprayed from the lower side of the laminated metal foil and etched in the etching device.
That is, if it carries out as mentioned above, a micropore will be formed in cross-sectional mortar shape which is diameter-reduced gradually toward the upper surface from a lower surface. Therefore, if the large diameter side is directed to the counter electrode, the electrode area can be increased.

In the manufacturing method of the present invention, the laminated metal foil may be a preformed one, but one side of the metal foil is drawn while pulling out one end of the long metal foil wound in a roll shape. First, a long laminated metal foil forming process is performed in which a dry film resist is bonded or pressure bonded to form a resist layer, and a chemically soluble reinforcing film is bonded or pressure bonded to the other surface to form a reinforcing layer. It doesn't matter.
The metal foil is not particularly limited and includes, for example, copper foil, silver foil, aluminum foil, and the like, and copper foil is preferable because of its high electrical conductivity, corrosion resistance, and cost.

The dry film resist (photosensitive film) used in the production method of the present invention may be either a negative type or a positive type, and commercially available products generally used for the production of printed wiring boards are used. As a characteristic, it is an alkali-dissolving dry film resist that does not shatter at the time of peeling (for example, product name 102J30 manufactured by Nichigo Morton Co., Ltd., product names H9030, PH1033 manufactured by Hitachi Chemical Co., Ltd.) , RY3310, and commercial products such as trade names AQ4038 and MVA506 manufactured by Asahi Kasei Co., Ltd. can be used).
The chemical dissolution peeling type reinforcing film that becomes the reinforcing layer of the production method of the present invention is not particularly limited as long as at least the interface with the metal foil can be chemically dissolved and removed by the peeling solution, not a photosensitive resin. Alternatively, the dry film resist can be used as a chemically dissolving and peeling type reinforcing film for the reinforcing layer.

As the photomask used in the exposure step, a resin film or a glass plate is used, but a glass plate is preferable in consideration of exposure accuracy.
The light source for the exposure step is not particularly limited as long as the dry film resist can be satisfactorily exposed. However, in order to improve the finishing accuracy, it is preferable that the light can be irradiated so as to be parallel rays.

The developer used in the development step is not particularly limited as long as the removal portion can be dissolved and removed with high precision. For example, a dilute alkali solution (alkali concentration of 0, such as sodium carbonate, potassium carbonate, sodium hydroxide, sodium tetraborate) is used. About 1 to 5% by mass).
In the development step, the developer is preferably sprayed from below.
In the development step, usually, after completion of the development process, the developer is washed and removed and then dried. The drying may be performed with an air knife or the like.

The etching solution used in the etching step is not particularly limited as long as the metal foil can be accurately etched, and examples thereof include a cupric chloride solution, a ferric chloride solution, and a copper ammonia complex solution.
In the etching step, the etching solution is preferably sprayed from below.

The stripping solution used in the remaining resist layer and reinforcing layer removing step is not particularly limited, and examples thereof include a high concentration solution of an alkaline solution used in the developing step. You may use the chemical | medical agent for peeling only for a commercially available dry film.
In the residual resist layer and reinforcing layer removing step, the peeling method may be either an immersion method or a spray method, but a spray method is preferable.
In the step of removing the remaining resist layer and the reinforcing layer, usually, after the peeling is completed, the peeling solution is washed and removed, and then dried. The drying may be performed with an air knife or the like.

The porous long metal foil obtained by the production method of the present invention is not particularly limited. For example, it is suitably used as an electrode material for a swivel (winding) capacitor, an electrolytic capacitor, a lithium ion capacitor, a fuel cell, or the like. It is done.
The electrode material includes not only the cathode and the positive electrode but also those used as a current collector, for example.

As described above, the method for producing a porous long metal foil according to the present invention has a resist layer in which a dry film resist is bonded or pressure-bonded to one surface of a long metal foil, and the other of the metal foils A long laminated metal foil provided with a reinforcing layer having a chemically dissolved and peelable reinforcing film bonded or pressure-bonded to the surface is fed from one side of the laminated metal foil in the longitudinal direction to the other side to the exposure apparatus, and the resist An exposure process in which the layer is exposed at predetermined widths, and the repeated pattern of the fine holes is successively printed, and the exposed portion exposed in this exposure process is sent from one side of the longitudinal direction to the other side in the development direction. A developing step of dissolving and removing the easily soluble portion for forming micropores of the resist layer with a developer, and an already developed portion of the laminated metal foil is transferred from one side of the laminated metal foil to the other side in the longitudinal direction. Etching, etching the exposed portion of the metal foil to form micropores, and sending the etched portion of the laminated metal foil from one side of the laminated metal foil to the other side in the longitudinal direction, A residual resist layer and a reinforcing layer removing step for removing the residual resist layer and the reinforcing layer by exposing them to a stripping solution, and winding the porous long metal foil obtained through the residual resist layer and the reinforcing layer removing step directly in a roll shape As a result, it is possible to manufacture a porous long metal foil having a large number of micropores with high productivity without occurrence of creases, deformation, or distortion even when a thin metal foil is used. it can.
And the porous elongate metal foil obtained using the metal foil with thin thickness is used suitably as an electrode of a swivel type capacitor, for example.
That is, by reducing the thickness of the metal foil, the capacitor can be made light and large without increasing the size of the capacitor, and the reliability of the dielectric layer is impaired because there is no crease, deformation, or distortion. There is nothing.

It is a perspective view showing one embodiment of the porous long copper foil concerning the present invention. It is an expanded sectional view of the copper foil of FIG. It is a figure which illustrates typically the laminated metal foil formation process in the manufacturing method of the porous long copper foil of FIG. It is a figure which illustrates typically the exposure process in the manufacturing method of the porous elongate copper foil of FIG. It is a top view of the photomask used at an exposure process. It is a figure which illustrates typically the image development process in the manufacturing method of the porous long copper foil of FIG. It is a figure explaining the development method in a development process. It is a figure which illustrates typically the process after the etching process in the manufacturing method of the porous long copper foil of FIG. It is a figure explaining the etching method in an etching process.

Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments thereof.
FIG.1 and FIG.2 represents the porous long copper foil which is one Embodiment of the porous long metal foil concerning this invention.

  As shown in FIG. 1, this porous long copper foil A is wound in a roll shape, and has a large number of fine holes 2 penetrating from one surface in the thickness direction of the electrolytic copper foil 1 to the other surface. It is drilled throughout.

  Next, an example of a method for producing the porous long copper foil A will be described in the order of steps with reference to FIGS.

(1) Laminated metal foil forming step As shown in FIG. 3, one end of the electrolytic copper foil 1 is drawn from the electrolytic copper foil raw material roll on which the long electrolytic copper foil 1 is wound, and passed through the laminated metal foil forming apparatus. Resist layer formed from dry film resist 3 on one surface of electrolytic copper foil 1 by thermocompression bonding of dry film resist (for example, product name 102J30 manufactured by Nichigo-Morton Co., Ltd.) 3 on both surfaces of electrolytic copper foil 1 3a is laminated, and a laminated copper foil B as a laminated metal foil in which a reinforcing layer 3b made of the same dry film resist 3 is laminated on the other side is wound into a roll by a winder.
That is, in the laminated metal foil forming apparatus, the dry film resists 3 and 3 are attached to the electrolytic copper foil 1 so that air does not get caught between the electrolytic copper foil 1 and the dry film resists 3 and 3, and Thermocompression bonding is performed by rollers R1 and R2.
The rollers R1 and R2 are not particularly limited, but a fluororubber roller and a silicone rubber roller are preferably used. Among them, a fluororubber (for example, trade name Viton manufactured by DuPont) is used in order to make the heat roller parallel. It is more preferable to use a roller.
In addition, although it does not specifically limit, It is preferable to wash | clean the front and back of the electrolytic copper foil 1 with a washing | cleaning liquid as a pre-process which lets the electrolytic copper foil 1 pass the said laminated metal foil formation apparatus. Although it does not specifically limit as a washing | cleaning liquid, For example, a pure water is used.
Further, in the laminated metal foil forming step, a dummy film formed of PET (polyethylene terephthalate) or the like is passed through the laminated metal foil forming apparatus so that there is no tear at the start of winding and no loss of the electrolytic copper foil 1.
Then, the end of the dummy film on the winder side is wound around the core of the winder, and the other end is slightly overlapped with the drawn end of the electrolytic copper foil 1 drawn from the electrolytic copper foil raw material roll. Join in state. In addition, the bonding is performed by adhering the overlapping portion with a double-sided adhesive tape, and further sticking an adhesive tape to the periphery of the overlapping portion, so that the etching solution does not enter between the dummy film and the electrolytic copper foil 1 in the etching step. It is preferable to keep the sealed state.
The electrolytic copper foil 1 is not particularly limited, but when used as an electrode of a swivel capacitor, for example, a length of 500 m, a thickness of 15 μm, and a width of 350 mm are used.
Further, when the dry film resist 3 is laminated on both surfaces of the electrolytic copper foil 1 up to the terminal end (the core side of the roll) of one electrolytic copper foil raw material roll, a dummy is formed at the terminal of the electrolytic copper foil 1 in the same manner as described above. Connect the beginning of the film, and connect one end of the electrolytic copper foil 1 from the new electrolytic copper foil raw material roll to the end of the connected dummy film, and connect the laminated copper foil B to the previous laminated copper foil B. It does not matter if it is rolled up.

(2) Exposure Step As shown in FIG. 4, a dummy film (not shown) connected to the starting end of the roll-shaped laminated copper foil B obtained in the laminated metal foil forming step is passed through the exposure device 4, It is wound around the core of a winder (not shown) provided on the exit side of the exposure apparatus 4.
Then, the laminated copper foil B is wound up on the winding side while intermittently repeating the winding operation and stopping operation of the laminated copper foil B by the winder.
The one winding operation time is substantially equal to the width of the exposure area of the photomask 41 shown in FIG. 5 in which the laminated copper foil B is provided in the exposure apparatus 4 (the dimension in the longitudinal direction of the laminated copper foil B). The time to be wound is set. On the other hand, one stop operation time is set to be longer than one exposure processing time,
The exposure apparatus 4 is set so that the resist layer 3a corresponding to the photomask 41 is exposed to the exposure pattern of the photomask 41 within the exposure apparatus 4 within one stop operation time.
The exposure process is such that the photomask 41 is in close contact with the surface of the resist layer 3a for a predetermined time (3 to 8 seconds, preferably 6 seconds) and in a vacuum state (the vacuum pressure is preferably 85 kPa or less and 82 kPa or less). Then, the resist layer 3a is irradiated with a parallel light beam (the wavelength and the light amount are appropriately determined according to the type of dry film used for the resist layer 3a) through the photomask 41.
Further, the photomask photomask 41 is made of a glass plate, and as shown in FIG. 5, a large number of circular mask portions 41a, a large light transmission portion 41b provided so as to surround the mask portion 41a, And a small light transmitting portion 41c provided in the center of the mask portion 41a. Although the diameter of the small light transmission part 41c is not specifically limited, About 50 micrometers is preferable.
That is, in the exposure process, the winding operation and the stop operation are repeated, and the exposure process is performed during the stop operation. The laminated copper foil B has the resist layer 3a and the island-shaped small cured portion 33 in the center, and the large cured portion. As the exposed laminated copper foil C having a large number of uncured portions 31 that are round easily meltable portions surrounded by 32, the film is wound in a roll shape by a winder.

(3) Development process As shown in FIG. 6, the dummy film (not shown) connected to the beginning of the roll-shaped exposed laminated copper foil C obtained in the above-described exposure process is formed on the exposed laminated copper foil C. The resist layer 3a is passed through the developing device 5 so that the resist layer 3a faces downward in the developing device 5, and is wound around a roll core of a winder (not shown) provided on the outlet side of the developing device 5.
And a constant speed (depending on processing conditions such as the length of the developing device 5, the type of dry film resist used for the resist layer 3a, the type of developer, etc., for example, 3 to 3.5 m / min)
As shown in FIG. 7, in the developing device 5, the resist layer 3 a is sprayed from below (spray pressure, for example, 0.07 to 0.09 MPa) 51 with a developing solution (for example, 0.1). .About.5 mass% sodium carbonate) 52 is sprayed to dissolve and remove the resist layer 3a.
That is, in the development step, the uncured portion 31 is dissolved and removed, thereby having an island-shaped small cured portion 33 at the center which is the non-etched portion shown in FIG. A large number of through-holes 34 reaching the electrolytic copper foil 1 are formed into a developed laminated copper foil D formed in the resist layer 3a and wound up in a roll shape by a winder.
Although not shown, when the dry film resist has a base film layer, the film constituting the base film layer is peeled off from the surface of the resist layer 3a immediately before the exposed laminated copper foil C enters the developing device 5. To do.

(4) Etching Step As shown in FIG. 8, a dummy film (not shown) connected to the starting end of the roll-shaped developed laminated copper foil D obtained in the developing step is used as the developed laminated copper foil D. The resist layer 3a is passed through the final processing apparatus so that the resist layer 3a faces downward in the final processing apparatus, and wound around a roll core of a winder (not shown) provided on the outlet side of the final processing apparatus.
As shown in FIG. 8, the final processing apparatus includes an etching unit 6 and a residual resist layer and reinforcing layer removal unit 7 in series.
The etching unit 6 includes an etching device 6a and a first cleaning / drying device 6b. The remaining resist layer / reinforcing layer removing unit 7 includes a remaining resist layer / reinforcing layer removing device 7a and a second cleaning / drying device 7b.
In the etching step, as shown in FIG. 9, an etching solution (for example, cupric chloride) is applied to the resist layer 3a from below by spraying (spray pressure, for example, 0.05 to 0.07 MPa) 61 in the etching apparatus 6a. Solution) 62 is sprayed.
The sprayed etching solution enters the through hole 34 and etches the portion facing the through hole 34 portion of the electrolytic copper foil 1.
Since the small hardening part 33 remains in the center of the through-hole 34, the mortar-shaped fine hole 2 as shown in FIG.
Subsequently, in the etching process, after the fine holes 2 are formed, the fine holes 2 are cleaned and dried in the first cleaning / drying apparatus 6b (not shown).

(5) Residual resist layer and reinforcing layer removing step The remaining resist layer and reinforcing layer removing step is performed by first removing the residual resist layer and the reinforcing layer from the etched portion wound on the winding side from the first cleaning / drying device 6b. Although entering into the apparatus 7a, although not shown in figure, the residual resist layer and the reinforcement layer removal apparatus 7a are peeled from the top and bottom (spray pressure, for example, 0.08 to 0.12 MPa) with sodium hydroxide as a main component. The liquid is sprayed to peel and remove the remaining resist layer (large cured portion 32 and small cured portion 33) and the reinforcing layer 3b.
Then, the electrolytic copper foil 1 from which the remaining resist layer (the large cured portion 32 and the small cured portion 33) and the reinforcing layer 3b have been removed is washed and dried in the second water washing and drying apparatus 7b.
Subsequently, the porous long copper foil A, which is dried and purified and is formed from the second washing and drying apparatus 7b and having the fine holes 2 formed thereon, is wound into a roll shape without breaking and is commercialized.

As described above, in this manufacturing method, first, a dry copper resist B is obtained by laminating the dry film resist 3 on both sides while pulling out the starting end of the long copper foil wound in a roll shape, and then the laminated copper foil B is obtained. Since the exposure process, the development process, and the etching process are performed using the copper foil B, even if the electrolytic copper foil 1 is long and extremely thin, the exposure process, the development process, and the etching process. It can be processed without creases, deformations and distortions, and has good handling properties.
In addition, since it is immediately wound up in a roll shape through the residual resist layer and reinforcing layer removing step, the product porous long metal foil A can also be obtained in a state free from creases, deformation, distortion, burrs and scratches.

  In the residual resist layer and reinforcing layer removing step, the residual resist layer (large cured portion 32 and small cured portion 33) and the reinforcing layer 3b are chemically removed by the stripping solution, so that a large number of fine holes are removed. The peeling stress to the electrolytic copper foil 1 on which 2 is formed can be prevented, and the electrolytic copper foil 1 can be obtained in a state free from creases, deformation, and distortion.

Further, as described above, an extremely thin one can be used as the electrolytic copper foil 1, so that the porous long copper foil A can be made extremely thin, and the finished porous long copper foil A is immediately wound into a roll. Since it was taken, even if it is very thin, it can wind up in a state without a crease, a deformation | transformation, and distortion.
And if the obtained ultra-thin porous long copper foil A is used, for example, a capacitor or the like can be reduced in size and increased in capacity.

Moreover, since the obtained ultra-thin porous long copper foil A is seamless and long, it can be suitably used as an electrode of a swivel capacitor.
Furthermore, in the above manufacturing method, not only the resist layer 3a but also the reinforcing layer 3b is formed of the dry film resist 3, so that the reinforcing layer 3b is used as the resist layer 3a (the resist layer 3a is used as the reinforcing layer 3b). Can do. That is, in the exposure process, the structure of the exposure apparatus 4 can be used regardless of the structure of the exposure apparatus 4, even if the starting end of the roll is pulled out from the upper side or the lower end.

The present invention is not limited to the above embodiment. For example, in the above embodiment, the etching process and the remaining resist layer and the reinforcing layer removing process are performed in series and the developing process is performed separately. However, the developing process, the etching process, the remaining resist layer and the reinforcing process are performed separately. You may make it perform a layer removal process in series.
In the above embodiment, in the laminated metal foil forming step, the dry film resist to be the resist layer and the dry film resist to be the reinforcing layer are thermocompression bonded along the electrolytic copper foil at the same position above and below the electrolytic copper foil. However, the position may be shifted back and forth.

A porous copper foil B laminated copper foil C exposed laminated copper foil D developed laminated copper foil R1, R2 roller 1 electrolytic copper foil 2 micropore 3a resist layer 3b reinforcing layer 31 uncured part (easily soluble part)
32 Large curing portion 33 Small curing portion 34 Through-hole 4 Exposure device 41 Photomask 41a Mask portion 41b Large light transmission portion 41c Small light transmission portion 5 Development device 51 Spray 52 Development treatment liquid 6 Etching portion 6a Etching device 6b First cleaning and drying Device 61 Spray 62 Etching solution 7 Residual resist layer / reinforcement layer removal unit 7a Residual resist layer / reinforcement layer removal device 7b Second cleaning / drying device

Claims (7)

A method for producing a porous long metal foil in which a large number of micropores penetrating from one surface to the other surface are formed over substantially the entire length,
It has a resist layer to which a dry film resist is bonded or pressure-bonded on one surface of a long metal foil, and a reinforcing layer to which a chemically dissolving peelable reinforcing film is bonded or pressure-bonded to the other surface of the metal foil The long laminated metal foil is sent from one side of the laminated metal foil in the longitudinal direction to the other side of the exposure apparatus, and the resist layer is exposed for each predetermined width, and the repeated pattern of the fine holes is successively baked. An exposure process;
A development process in which the exposed portion exposed in this exposure process is sent from one side to the other in the longitudinal direction to the developing device, and the easy-dissolving part for forming micropores in the resist layer is dissolved and removed with a developer;
An etching process in which the developed portion of the laminated metal foil is sent to an etching apparatus from one side in the longitudinal direction of the laminated metal foil to the other side, and the exposed portion of the metal foil is etched to form micropores;
The etched portion of the laminated metal foil is sent to a peeling device from one side to the other side in the longitudinal direction of the laminated metal foil, and the residual resist film and the reinforcing layer are peeled and removed by exposing the residual resist film and the reinforcing layer to a peeling solution. A method for producing a porous long metal foil comprising a removing step, and winding the porous long metal foil obtained through the residual resist film and reinforcing layer removing step directly in a roll shape.   The method for producing a porous long metal foil according to claim 1, wherein the porous long metal foil is used as an electrode of a swivel capacitor. In the exposure step, a non-removable part with a developer having a smaller diameter than the diameter is provided at the center of the easily dissolving part,
3. The etching process according to claim 1, wherein the etching is performed by spraying an etching solution from the lower side of the laminated metal foil in the etching apparatus in the etching apparatus with the resist layer side of the laminated metal foil facing downward. Manufacturing method of porous long metal foil.   While pulling out one end of a long metal foil wound in a roll shape, a dry film resist is adhered or pressure-bonded to one surface of the metal foil to form a resist layer, and a chemically soluble reinforcing film is formed on the other surface. The manufacturing method of the porous elongate metal foil of Claims 1-3 which performs an exposure process through the elongate laminated metal foil formation process which adhere | attaches or crimps | bonds and forms a reinforcement layer.   Metal foil is copper foil, The manufacturing method of the porous elongate metal foil in any one of Claims 1-4.   The method for producing a porous long metal foil according to any one of claims 1 to 5, wherein the reinforcing layer is formed of a dry film resist.   A porous long metal foil obtained by the manufacturing method according to claim 3, wherein a plurality of micropores penetrating from one surface to the other surface are formed over substantially the entire length, and a cross-section of the micropores A porous long metal foil characterized by a mortar.

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