JP2012176483A - Method for manufacturing abrasive grain-fixed wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an abrasive grain-fixed wire in which, without any addition of a leveling agent to a plating solution, the adhesive strength of abrasive grains to a wire body is enhanced, and also, the machining performance or cutting performance by the abrasive grains is also improved.SOLUTION: The method includes: a positive electrolysis processing step in which the application of a positive electrolytic voltage is carried out so that electrode members placed opposite to each other in the plating solution containing a group of abrasive grains become anodes and the wire body becomes a cathode, and a plating layer containing the group of abrasive grains is electrodeposited on the wire body; and a reverse electrolysis processing step in which the application of a reverse electrolytic voltage is carried out after the positive electrolysis processing step so that the electrode members placed opposite to each other in the plating solution become cathodes and the wire body becomes an anode, and the plated layer is peeled to expose at least a part of the summit of the abrasive grains in the plated layer.

Description

  The present invention relates to a method for manufacturing a fixed abrasive wire in which abrasive grains are fixed to a wire by electrolytic plating.

  As a method for manufacturing a fixed abrasive wire used for cutting hard materials such as silicon and ceramic, a method has been proposed in which abrasive particles are fixed to the surface of a wire body by electrolytic plating (see, for example, Patent Document 1 below).

  Specifically, in Patent Document 1, the electrode plate and the wire body face each other in a plating tank containing a plating solution containing a group of abrasive grains, the electrode plate serves as an anode, and the wire body serves as a cathode. In the method of manufacturing a fixed abrasive wire, including applying a voltage so as to form a plating layer containing abrasive grains on the surface of the wire body, a leveling agent is contained in the plating solution. Is disclosed.

  The manufacturing method described in Patent Literature 1 includes a leveling agent in a plating solution containing an abrasive grain group, thereby improving the cutting performance or cutting performance of the abrasive grains while improving the fixing strength of the abrasive grains. It is said that a grain wire can be manufactured.

  That is, the leveling agent in the plating solution is preferentially adsorbed on a portion adjacent to the electrode plate that acts as an anode, that is, near the apex of the abrasive grains. As a result, the growth rate of the plating layer in the vicinity of the apex of the abrasive grains is that of the plating layer in the base end side portion (the portion of the abrasive grains close to the wire body) that is separated from the electrode plate. Slower than the growth rate. Accordingly, the plating layer deposited relatively thick on the base end side portion of the abrasive grains improves the adhesive strength of the abrasive grains while thinning the plating layer near the apex of the abrasive grains, or the cutting performance by the abrasive grains or It is said that cutting performance can be improved.

  However, by adding the leveling agent to the plating solution, the thickness of the plating layer deposited near the top of the abrasive grains can be reduced, but the leveling agent is adsorbed near the top of the abrasive grains. Therefore, this leveling agent may cause a problem that the cutting performance or cutting performance of the abrasive grains deteriorates.

  In addition, as described in Patent Document 1, the leveling agent has a difference in function depending on the type. Therefore, even with a leveling agent that exhibits an appropriate leveling effect on abrasive grains of a specific size and shape, the leveling effect is effective on abrasive grains of a different size and shape. Not exclusively.

  The abrasive grain group contained in the plating solution includes a plurality of abrasive grains each having a specific size and shape. Therefore, it is difficult to obtain an effective leveling effect with a leveling agent for a plurality of abrasive grains having different sizes and shapes.

Japanese Patent No. 4538049

  The present invention has been made in view of the above prior art, and is a method for producing a fixed abrasive wire in which abrasive grains are fixed to a wire body by electrolytic plating using a plating solution containing abrasive grains. A method for producing a fixed-abrasive wire capable of simultaneously improving the fixing strength of the abrasive grains to the wire body and improving the cutting performance or cutting performance of the abrasive grains without adding a leveling agent to the plating solution The purpose is to provide

  In order to achieve the above object, the present invention produces a fixed abrasive wire in which abrasive particles are fixed to the wire body by electrodepositing a plating layer on the wire body using a plating solution containing a group of abrasive grains. A plating layer containing an abrasive grain group is applied by applying a positive electrolysis voltage such that an electrode member disposed oppositely in a plating solution containing an abrasive grain group serves as an anode and a wire body serves as a cathode. A positive electrolytic treatment step for electrodepositing the main body, and a plating layer applied by applying a reverse electrolytic voltage such that the electrode member opposed to the plating solution after the positive electrolytic treatment step serves as a cathode and the wire main body serves as an anode. There is provided a method for producing a fixed abrasive wire comprising a reverse electrolytic treatment step of peeling the plating layer so that the top of at least a part of the abrasive grains is exposed.

  Preferably, the abrasive grains are coated with the same metal as a part or all of the metals included in the plating solution in the stage of being included in the plating solution.

  Preferably, the reverse electrolysis treatment step applies a reverse electrolysis voltage so that a current flowing between the wire body and the electrode member becomes a pulse current.

  More preferably, the frequency of the pulse current is 10 Hz or more and 1200 Hz or less, and more preferably 50 Hz or more and 1000 Hz or less.

  According to the method for manufacturing a fixed abrasive wire according to the present invention, the positive electrode voltage is applied so that the electrode member disposed opposite to the plating solution containing the abrasive grain group serves as an anode and the wire body serves as a cathode. A plating layer containing an abrasive grain group is electrodeposited on the wire body, and then the plating is applied by applying a reverse electrolysis voltage so that the electrode member opposed to the plating solution serves as a cathode and the wire body serves as an anode. Since the plating layer is peeled off so that the tops of at least some of the abrasive grains in the layer are exposed, cutting performance or cutting by the abrasive grains is achieved while improving the strength of fixing the abrasive grains to the wire body. The performance can be improved.

In particular, since the effect can be obtained without adding a leveling agent to the plating solution, the cutting performance or cutting performance of abrasive grains caused by the leveling agent is not deteriorated, and various grains The said effect can be effectively show | played with respect to the abrasive grain group containing an abrasive grain of a diameter and a shape.
In addition, more abrasive grains are exposed from the plated layer while effectively preventing the abrasive grains from dropping than when at least a part of the abrasive grains of the abrasive grains group is exposed by dressing treatment or polishing treatment. be able to.

FIG. 1 is a schematic view of a plating tank used in a method for manufacturing a fixed abrasive wire according to an embodiment of the present invention. Fig.2 (a) is a partial schematic cross section which shows the state after the positive electrolysis process in the manufacturing method of the fixed abrasive wire which concerns on one embodiment of this invention. FIG.2 (b) is a partial schematic cross section which shows the state after the reverse electrolysis process in the manufacturing method of the fixed abrasive wire which concerns on one embodiment of this invention. FIG. 3 is a particle size distribution diagram of an example of an abrasive grain group used in the method of manufacturing a fixed abrasive wire according to an embodiment of the present invention. FIG. 4 is a process schematic diagram in the method of manufacturing a fixed abrasive wire according to one embodiment of the present invention. FIG. 5 is a schematic diagram of an apparatus used in an experiment conducted on a method for manufacturing a fixed abrasive wire according to an embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of a fixed abrasive wire before reverse electrolysis manufactured using the experimental apparatus. FIG. 7 is a graph showing a waveform of the pulse current when reverse electrolysis treatment with pulse current is performed on the fixed abrasive wire before reverse electrolysis. FIGS. 8A to 8D show Example 1 in which reverse electrolysis treatment was performed so that pulse currents having frequencies of 5 Hz, 10 Hz, 20 Hz, and 50 Hz flow through the fixed abrasive wire before reverse electrolysis. It is the photograph which observed ~ 4 with the electron microscope. FIGS. 9A to 9D show Example 5 in which reverse electrolysis treatment was performed so that pulse currents with frequencies of 80 Hz, 100 Hz, 400 Hz, and 700 Hz flow through the fixed abrasive wire before reverse electrolysis, respectively. It is the photograph which observed ~ 8 with the electron microscope. 10 (a) to 10 (d) are examples 9 in which reverse electrolysis treatment was performed so that pulse currents with frequencies of 1000 Hz, 1200 Hz, 1400 Hz, and 1750 Hz flow through the fixed abrasive wire before reverse electrolysis, respectively. It is the photograph which observed ~ 12 with the electron microscope. FIG. 11 is a graph showing a waveform of the direct current when reverse electrolytic treatment with direct current is performed on the fixed abrasive wire before reverse electrolysis. FIG. 12 is a photograph of Example 13 in which reverse electrolysis treatment was performed on the fixed abrasive wire before reverse electrolysis so that a direct current flows through an electron microscope.

  Hereinafter, preferred embodiments of a method for producing a fixed abrasive wire according to the present invention will be described with reference to the accompanying drawings.

The fixed abrasive wire is fixed to a wire body such as carbon steel coated with copper such as diamond and is suitably used for cutting or cutting a hard material such as silicon or ceramic.
In the method for manufacturing a fixed abrasive wire according to the present embodiment, the abrasive grains are fixed to the wire body by electrodepositing a plating layer made of a plating solution containing the abrasive grains on the wire body.

In FIG. 1, the schematic diagram of the plating apparatus used for the manufacturing method which concerns on this Embodiment is shown.
As shown in FIG. 1, the manufacturing method includes the electrode member 20 in a state where the electrode member 20 and the wire body 5 are opposed to each other in a plating solution 10 including an abrasive grain group housed in a positive electrolytic voltage vessel 30. A positive electrolytic treatment step (see FIG. 2 (a)) in which a positive electrolysis voltage is applied so that the wire body 5 becomes a cathode and a plated layer containing the abrasive grains is electrodeposited on the wire body. By applying a reverse electrolysis voltage such that the electrode member opposed to the plating solution after the positive electrolysis treatment step becomes a cathode and the wire body becomes an anode, at least a part of the abrasive grains in the plating layer And a reverse electrolytic treatment step (see FIG. 2B) for peeling the plating layer so that the top of the substrate is exposed.

In FIG. 1, reference numeral 35 denotes a reserve tank for the plating solution 10, and the plating solution 10 is circulated between the positive electrolysis voltage tank 30 and the reserve tank 35 via a pump 40.
In addition, the said reverse electrolysis process is performed using the same apparatus as the plating apparatus in the said positive electrolysis process except the point from which the voltage application direction to the said electrode member and the said wire main body differs.

Thus, according to the manufacturing method according to the present embodiment, the plating layer 11 including the abrasive grains 15 is deposited on the surface of the wire body 5 by applying a positive electrolysis voltage (see FIG. 2A). Thereafter, the plating layer is peeled off by applying a reverse electrolysis voltage so that the tops of at least some of the abrasive grains in the plating layer are exposed (see FIG. 2B). The cutting performance or cutting performance of the abrasive grains 15 can be improved while improving the adhesion strength of 15 to the wire body 5.
This point will be described in detail.

  In a positive electrolysis treatment step in which a positive electrolysis voltage is applied so that the electrode member 20 becomes an anode and the wire body 5 becomes a cathode to deposit the plating layer 11 including the abrasive grains on the surface of the wire body 5. The deposition rate of the plating layer 11 increases as the area closes to the electrode member 20 acting as an anode.

That is, when a plating layer having a layer thickness sufficient to obtain a sufficient bonding strength of the abrasive grains 15 to the wire body 5 is formed, as shown in FIG. The layer thickness of the plating layer 11 at the top portion is increased.
Since the cutting action or the cutting action in the fixed abrasive wire is performed by the plurality of abrasive grains 15, when the plating layer 11 having a layer thickness is laminated on the top portion of the plurality of abrasive grains 15, the abrasive The cutting ability or cutting ability by the grains 15 deteriorates.

  Here, when a plating layer containing abrasive grains is deposited on the wire body by applying a positive electrolysis voltage, a leveling agent is added in advance to the plating solution for forming the plating layer, so that the top of the abrasive grains is added. Conventionally, it has been proposed to reduce or eliminate the plating layer.

  Specifically, the leveling agent in the plating solution is preferentially adsorbed in the vicinity of the electrode plate that acts as an anode during the positive electrolysis treatment, that is, in the vicinity of the apex of the abrasive grains. As a result, the growth rate of the plating layer in the vicinity of the apex of the abrasive grains is that of the plating layer in the base end side portion (the portion of the abrasive grains close to the wire body) that is separated from the electrode plate. Slower than the growth rate. Accordingly, the plating layer deposited relatively thick on the base end side portion of the abrasive grains improves the adhesive strength of the abrasive grains while thinning the plating layer near the apex of the abrasive grains, or the cutting performance by the abrasive grains or It is said that cutting performance can be improved.

  However, by adding the leveling agent to the plating solution, the thickness of the plating layer deposited near the top of the abrasive grains can be reduced, but the leveling agent is adsorbed near the top of the abrasive grains. become. Therefore, this leveling agent may cause a problem that the cutting performance or cutting performance of the abrasive grains is deteriorated.

Moreover, the leveling agent has a difference in function depending on the type. Therefore, even with a leveling agent that exhibits an appropriate leveling effect on abrasive grains of a specific size and shape, the leveling effect is effective on abrasive grains of a different size and shape. Not exclusively.
Usually, the group of abrasive grains contained in the plating solution is specified by the average particle diameter, but the size and shape are different from each other.
Therefore, it is difficult to obtain an effective leveling effect for a plurality of abrasive grains having different sizes and shapes.

  Furthermore, as another method of exposing the abrasive grains from the plating layer deposited on the surface of the wire body, a plating layer containing an abrasive grain group is deposited on the surface of the wire body by positive electrolytic treatment, and then dressing treatment or polishing treatment. It is proposed to expose at least a part of the abrasive grain group.

However, with this conventional method, only about 20% of the abrasive grains in the group of abrasive grains can be exposed.
In this regard, a case where a diamond particle group having an average particle diameter of 15 μm by a laser diffraction scattering method is used as the abrasive grain group will be described as an example.
FIG. 3 shows a particle size distribution diagram of the diamond particle group.

  As shown in FIG. 3, the diamond particle group having an average particle diameter of 15 μm contains the largest number of diamond particles having a particle diameter of 15 μm, but includes particles having a particle diameter of 10 μm or less to particles having a particle diameter of 20 μm or more.

  If a polishing process is performed to such a degree that, for example, particles having a particle diameter of 15 μm are exposed to a group of diamond particles including particles having such various particle diameters, particles having a particle diameter larger than 15 μm are over-polished.

  That is, when diamond particles are exposed by polishing, it is necessary to set the polishing amount so that particles having a relatively large particle size do not fall off. For example, a particle size of 17 corresponding to about 20% of the entire particle group. Only diamond particles of 5 μm or more can be exposed.

  In contrast to these prior arts, the manufacturing method according to the present embodiment, as described above, applies the reverse electrolysis voltage after the forward electrolysis treatment step, so that the tops of at least some of the abrasive grains in the plating layer are applied. The plating layer is peeled off so as to be exposed.

By applying the reverse electrolysis voltage, a portion of the plated layer 11 that is close to the electrode member 20, that is, a portion that is stacked on top portions of the plurality of abrasive grains 15 is peeled off preferentially.
Therefore, as shown in FIG. 2 (b), the base end side portion of the plurality of abrasive grains 15 forming the abrasive grain group is maintained firmly fixed to the wire body 5 by the plating layer 11. However, it is possible to improve the cutting ability or cutting ability of the abrasive grains 15 by exposing the top portions of at least some of the abrasive grains 15 in the abrasive grain group.

  In particular, in the present embodiment, the above effect can be obtained without adding a leveling agent to the plating solution 10. Therefore, the cutting ability or cutting ability due to the leveling agent adhering to the abrasive grains 15 is not reduced.

Furthermore, the leveling agent has a difference in function depending on the type. That is, in order to obtain an appropriate leveling effect with respect to an abrasive having a specific size and shape, it is necessary to use a dedicated leveling agent.
However, the abrasive grain group contained in the plating solution includes a plurality of abrasive grains 15 each having a specific size and shape. Therefore, it is difficult to effectively obtain a leveling effect for an abrasive grain group including a plurality of abrasive grains 15 having different sizes and shapes with a specific leveling agent.

  With respect to this point as well, in the present embodiment in which the plating layer 11 at the top of at least some of the abrasive grains 15 in the abrasive grain group is peeled off by applying a reverse electrolysis voltage, the size and shape are different. It is possible to effectively improve the cutting performance while improving the fixing strength with respect to the plurality of abrasive grains 15.

In addition, when a reverse electrolysis voltage is applied, the plating layer 11 at the top portion of the abrasive grains 15 can be peeled off preferentially, so that the bonding strength to the wire body 5 is sufficient for the abrasive grains 15 of various sizes. The top can be effectively exposed while maintaining the above.
For example, when a diamond particle group having an average particle diameter of 15 μm is used as the abrasive particle group, diamond particles having a particle diameter of about 13 μm or more can be exposed according to the method according to the present embodiment. This corresponds to about 70% of the entire particle group.

Here, specific steps of the manufacturing method according to the present embodiment will be described.
In FIG. 4, the process schematic diagram in the said manufacturing method is shown.

As shown in FIG. 4, the long wire main body supplied from the supply machine 100 passes through the following treatment tanks and is wound up by the winder 200.
The wire body is, for example, copper-plated carbon steel and has a diameter of 0.1 to 0.3 mm.

  As described above, the manufacturing method includes a positive electrolytic treatment process in which a plating layer 11 including the abrasive grain group is electrodeposited on the wire body 5 by applying a positive electrolytic voltage, and reverse electrolysis after the positive electrolytic treatment process. Applying a voltage includes a reverse electrolysis treatment step in which the plating layer 11 is peeled off so that the tops of at least some of the abrasive grains 15 in the plating layer 11 are exposed, and the positive electrolysis treatment step and the reverse electrolysis treatment step. Prior to the treatment step, a pretreatment step can preferably be included.

As shown in FIG. 4, the pretreatment process includes a degreasing process using a degreasing tank 110 and a water washing process using a water washing tank 120.
When the wire body 5 is previously coated by plating or the like, the pretreatment process further includes a coating peeling process using a coating peeling tank 130.

Further, the pretreatment process may include a strike plating process in the strike plating tank 140.
In the strike plating step, a thin plating layer is formed on the surface of the wire body 5 prior to the deposition of the plating layer 11, and the wire of the plating layer 11 including the abrasive grains 15 is formed by the thin plating layer. Adhesion to the main body can be improved.

  As described above, the positive electrolysis treatment step is configured to apply a positive electrolysis voltage in a state where the electrode member 20 and the wire body 5 are opposed to each other in the plating solution 10 including the abrasive grain group. Yes.

For example, diamond particles can be used as the abrasive grains 15, and nickel sulfamate can be used as the plating solution 10, for example.
The electrode member 20 can be made of nickel.

Preferably, the abrasive grains 15 of the group of abrasive grains are coated with the same metal as a part or all of the metals contained in the plating solution 10 when included in the plating solution 10. .
According to such a configuration, the fixing strength between the abrasive grains 15 and the plating layer 11 can be improved.

  The reverse electrolysis treatment step is configured to apply a reverse electrolysis voltage to the electrode member and the wire main body which are disposed to face each other in the reverse electrolysis tank 30 ′ in which the plating solution is accommodated.

As shown in FIG. 4, the manufacturing method may include a post-treatment after the reverse electrolysis treatment step.
The post-treatment includes a post-plating process in the post-plating tank 150, a water-washing process in the water-washing tank 160, and a rust-proofing process process in the rust-proofing tank 170.
The post-plating step is a step for improving the adhesion strength of the abrasive grains 15, and the electrode member 20 and the wire body 5 are opposed to each other in the post-plating tank 150 in which the plating solution 10 is accommodated. In this state, a plating layer is deposited by applying a positive electrolysis voltage so that the electrode member 20 becomes an anode and the wire body 5 becomes a cathode.

  In the state after the reverse electrolytic treatment step, the top of the abrasive grains 15 is exposed (that is, the plating layer 11 and the coating on the top of the abrasive grains 15 are peeled off). Depending on the post-plating process, the plating layer is not deposited on the exposed tops of the abrasive grains 15.

Here, the result of an experiment performed on the manufacturing method according to the present embodiment will be described.
FIG. 5 shows a schematic diagram of the experimental apparatus.

  In this experiment, as shown in FIG. 5, diamond particles 115 having an average particle diameter of 10 to 20 μm and subjected to electroless Ni—P plating that act as abrasive grains in an electrolytic bath 130 (see FIG. 6 below). In this plating solution, an electrode member 120 and a piano wire (JIS symbol: SWRS82A-S) 105 having a wire diameter of 0.12 mm are disposed to face each other.

5 is a stainless nut connected to the free end of the piano wire 105, which prevents bending of the piano wire 105 and ensures parallelism of the electrode member 120 and the piano wire 105. Prepared to do.
Reference numeral 107 denotes a stirrer installed in the electrolytic bath 130, and is provided to make the abrasive grain concentration uniform in the plating solution.

  In this state, a voltage is applied by the power source 101 so that the electrode member 120 serves as an anode and the piano wire 105 serves as a cathode, and a plated layer 111 having a thickness of 5 to 6 μm is formed on the surface of the piano wire 105 (the following figure). 6).

FIG. 6 shows a schematic cross-sectional view of the piano wire 105 provided with the plating layer 111.
As shown in FIG. 6, in this experiment, the plating layer 111 is a base plating layer 111 a with a sulfamic acid basic bath provided on the surface of the piano wire 105 after degreasing and washing the piano wire 105, and A plating layer 111b with abrasive grains provided on the surface of the underlying plating layer 111a, the plating layer with abrasive grains 111b by the sulfamic acid basic bath containing the diamond particles 115 with Ni-P plating, and the plating with abrasive grains And a post-plating layer 111c by a sulfamic acid basic bath provided on the surface of the layer 111b.
In this experiment, the diamond particles 115 with Ni-P plating have a weight ratio of diamond particles and Ni-P plating of 7: 3.

  Fixed abrasive wire before reverse electrolysis formed in this way (fixed abrasive grains in which the plated layer 111 having a thickness of 5 to 6 μm including the diamond 115 with Ni—P plating is deposited on the surface of the piano wire 105. The wire was subjected to reverse electrolysis treatment with a pulse current.

Specifically, in the state where the electrode member 120 is a cathode and the piano wire 105 is an anode, a pulse current (see FIG. 7) with a current density of 20 A / dm ² has a frequency of 5 Hz (Example 1), 10 Hz ( Example 2), 20 Hz (Example 3), 50 Hz (Example 4), 80 Hz (Example 5), 100 Hz (Example 6), 400 Hz (Example 7), 700 Hz (Example 8), 1000 Hz (Implementation) Example 9) A reverse electrolysis voltage was applied so as to flow under conditions of 1200 Hz (Example 10), 1400 Hz (Example 11) and 1750 Hz (Example 12).

  In each of the first to twelfth embodiments, as shown in FIG. 7, the duty ratio of the pulse current is set to 0.3 (the current having the current density is allowed to flow for 30% of one period, and the remaining 70%. Was deenergized).

Moreover, the time of the reverse electrolysis treatment was set so that the work amount (current density × time) of the reverse electrolysis treatment in each of Examples 1 to 12 was constant (260 A · s / dm ² ).
That is, in each of Examples 1 to 12, the time for the reverse electrolysis treatment was set so that the total time during which the pulse current having the current density flows was 13 seconds.

The results of Examples 1 to 12 were observed at a magnification of 1500 to 3000 using an electron scanning microscope (JEOL model number: JSM-6363LA, manufactured by JEOL Ltd.).
The result of Examples 1-4 is shown to Fig.8 (a)-(d), respectively.
The results of Examples 5 to 8 are shown in FIGS. 9 (a) to 9 (d), respectively.
The results of Examples 9 to 12 are shown in FIGS. 10 (a) to 10 (d), respectively.

Furthermore, as Example 13, reverse electrolysis treatment with direct current was performed on the fixed abrasive wire before reverse electrolysis.
Specifically, as shown in FIG. 11, in order to make the conditions of the reverse electrolysis process coincide with those in Examples 1 to 12, the current density of the direct current is set to 20 A / dm ² and the work amount is 260 A · s / dm ^2. The energization time was 13 s so that

  The result of observing the result of Example 13 at a magnification of 3000 times using the electron scanning microscope (JEOL model number: JSM-6363LA manufactured by JEOL) is shown in FIG.

  In the case of reverse electrolysis treatment using a direct current, it was confirmed from FIG. 12 that the plating layer around the abrasive grains was thinned substantially uniformly as a whole.

On the other hand, in the case of the reverse electrolysis treatment using a pulse current, it was confirmed from FIGS. 8 to 10 that the plating layer around the abrasive grains was locally thin.
This means that according to the reverse electrolysis treatment using a pulse current, the cutting performance of the abrasive grains can be improved while maintaining the adhesion strength of the abrasive grains to the plating layer.

Further, when the frequency of the pulse current is in the range of 10 Hz (Example 2) to 1200 Hz (Example 11), a part of the abrasive grains can be surely obtained without substantially impairing the adhesion strength of the abrasive grains to the plating layer. It was confirmed that it could be exposed.
More preferably, it was confirmed that when the frequency of the pulse current is 50 Hz (Example 4) to 1000 Hz (Example 9), the exposed region of the abrasive grains can be expanded.

5 Wire body 10 Plating solution 11 Plating layer 15 Abrasive grain 20 Electrode member

Claims (5)

A method for producing a fixed abrasive wire in which abrasive particles are fixed to the wire body by electrodepositing a plating layer on the wire body using a plating solution containing a group of abrasive grains,
A positive electrolysis voltage is applied so that the electrode member disposed oppositely in the plating solution containing the abrasive grain group serves as an anode and the wire body serves as a cathode. An electrolytic treatment process;
After the positive electrolysis treatment step, a reverse electrolysis voltage is applied so that the electrode member opposed to the plating solution serves as a cathode and the wire main body serves as an anode, so that the top of at least some of the abrasive grains in the plating layer And a reverse electrolytic treatment step of peeling the plating layer so as to be exposed.   2. The fixing according to claim 1, wherein the abrasive grains are coated with the same metal as a part or all of the metal contained in the plating solution in the step of being contained in the plating solution. A method for producing an abrasive wire.   The said reverse electrolysis process process applies a reverse electrolysis voltage so that the electric current which flows between the said wire main body and the said electrode member may turn into a pulse current, The manufacture of the fixed abrasive wire of Claim 1 or 2 characterized by the above-mentioned. Method.   The frequency of the said pulse current is 10 Hz or more and 1200 Hz or less, The manufacturing method of the fixed abrasive wire of Claim 3 characterized by the above-mentioned.   The method of manufacturing a fixed abrasive wire according to claim 4, wherein the frequency of the pulse current is 50 Hz or more and 1000 Hz or less.