CN102618908A - Method for making fixed abrasive grain metal wire - Google Patents
Method for making fixed abrasive grain metal wire Download PDFInfo
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- CN102618908A CN102618908A CN2012100208566A CN201210020856A CN102618908A CN 102618908 A CN102618908 A CN 102618908A CN 2012100208566 A CN2012100208566 A CN 2012100208566A CN 201210020856 A CN201210020856 A CN 201210020856A CN 102618908 A CN102618908 A CN 102618908A
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Abstract
The method comprises: a positive decomposition voltage applied to make the electrode parts oppositely configured in the plating solution containing abrasive particle group into an anode and the metal wire body into a cathode, a positive electrolytic treatment procedure that makes the plating containing abrasive grains electrically deposit upon the metal wire body, an anti-decomposition voltage applied to make the oppositely configured electrode parts in the plating solution into the cathode and the metal wire body into the anode, and an anti-electrolytic treatment procedure that makes the plating layer peel off in a manner that the tops of at least part of the abrasive grains in the plating layer are exposed.
Description
Technical field
The present invention relates to make the abrasive particle bonded-abrasive of set method of manufacture wiry on wire through plating.
Background technology
As the employed bonded-abrasive method of manufacture wiry such as cut-out of the mechanically resistant material of silicon and pottery etc., the method that had once proposed to make the abrasive particle set on the surface of wire main body through plating is (for example, with reference to No. 4538049 communique of Japanese Patent; Below be called patent documentation 1).
At length say, in above-mentioned patent documentation 1, once disclosed following proposal: a kind of bonded-abrasive method of manufacture wiry comprises: in the coating bath of having accommodated the plating bath that contains the abrasive particle crowd, make battery lead plate and the wire main body operation of configuration relatively; Apply voltage with the mode that becomes anode and above-mentioned wire main body with above-mentioned battery lead plate and become negative electrode, the operation that the coating of the state that contains abrasive particle is separated out on the surface of above-mentioned wire main body in this method of manufacture, makes in the above-mentioned plating bath and contains flow agent.
The method of manufacture of record in above-mentioned patent documentation 1 through in the plating bath that contains the abrasive particle crowd, containing flow agent, can be made the set intensity raising that can make abrasive particle and make the cutting ability of being brought by abrasive particle or the bonded-abrasive wire that cuts off the performance raising.
That is, the above-mentioned flow agent in the above-mentioned plating bath near the part as the acting above-mentioned battery lead plate of anode, is promptly preferentially adsorbed near the summit of above-mentioned abrasive particle.Its result, near the speed of growth of the coating the summit of above-mentioned abrasive particle is slower than the speed of growth of the coating from the base end side part (part of the approaching above-mentioned wire main body among the above-mentioned abrasive particle) that above-mentioned battery lead plate is sowed discord among the above-mentioned abrasive particle.Therefore; Base end side through at above-mentioned abrasive particle partly compares the coating that heavy back is separated out; The set intensity of above-mentioned abrasive particle is improved, thereby and near the coating can the summit of the above-mentioned abrasive particle of attenuate make the cutting ability of bringing by above-mentioned abrasive particle or cut off performance and improve.
But; Thereby on the other hand at the bed thickness through in above-mentioned plating bath, adding near the coating that above-mentioned flow agent separates out can the summit of attenuate at above-mentioned abrasive particle; Because above-mentioned flow agent is adsorbed near the summit of above-mentioned abrasive particle, therefore can produces the cutting ability of bringing by above-mentioned abrasive particle or cut off the problem that performance worsens because of this flow agent.
In addition, as also putting down in writing in the above-mentioned patent documentation 1, above-mentioned flow agent there are differences on function according to kind.Therefore, even, also not necessarily the abrasive particle of size different with it and shape is brought into play the levelling effect effectively to the flow agent of the suitable levelling effect of the abrasive particle of certain specific size and shape performance.
The abrasive particle crowd of in above-mentioned plating bath, containing comprises a plurality of abrasive particles that have inherent size and shape respectively.Therefore, be difficult to these a plurality of abrasive particles with different size and shape obtained effective levelling effect through flow agent.
Summary of the invention
The present invention accomplishes in view of above-mentioned prior art; Its objective is provides a kind of bonded-abrasive method of manufacture wiry; This method is to make following bonded-abrasive method wiry; This bonded-abrasive wire is through having used the plating of the plating bath that contains the abrasive particle crowd; Abrasive particle set on the wire main body is formed, and this method is not added flow agent in above-mentioned plating bath, can seek cutting ability that above-mentioned abrasive particle brings to the raising of the set intensity of above-mentioned wire main body with by above-mentioned abrasive particle or the raising of cutting off performance simultaneously.
The present invention to achieve these goals; Provide a kind of bonded-abrasive method of manufacture wiry; This method is to make following bonded-abrasive method wiry; This bonded-abrasive wire contains the abrasive particle crowd through use plating bath makes the coating galvanic deposit on the wire main body, fixation abrasive grain forms on above-mentioned wire main body thus, and this method comprises: positive electrolysis treatment process; This positive electrolysis treatment process applies and makes in the plating bath that contains the abrasive particle crowd electrod assembly of configuration relatively become the positive electrolysis voltage that anode and wire main body become negative electrode, makes the coating galvanic deposit that contains the abrasive particle crowd on above-mentioned wire main body; And back-electrolysis (contrary electrolysis) treatment process; This back-electrolysis treatment process is after above-mentioned positive electrolysis treatment process; Apply and make in plating bath the electrod assembly of configuration relatively become negative electrode and the wire main body becomes anodic back-electrolysis voltage, the mode of exposing with the top of the abrasive particle of at least a portion in the above-mentioned coating is peeled off above-mentioned coating.
According to the bonded-abrasive that the present invention relates to method of manufacture wiry; Apply and make the electrod assembly that in the plating bath that contains the abrasive particle crowd, has disposed relatively become the positive electrolysis voltage that anode and wire main body become negative electrode; Make the coating galvanic deposit that contains above-mentioned abrasive particle crowd on above-mentioned wire main body; Thereafter; Apply and make that the electrod assembly that in plating bath, has disposed relatively becomes negative electrode and the wire main body becomes anodic back-electrolysis voltage; The mode of exposing with the top of the abrasive particle of at least a portion in the above-mentioned coating is peeled off above-mentioned coating, therefore can seek the raising of above-mentioned abrasive particle to the set intensity of above-mentioned wire main body, and can seek cutting ability of being brought by above-mentioned abrasive particle or the raising of cutting off performance.
Particularly obtain above-mentioned effect owing to flow agent can in above-mentioned plating bath, not added; Therefore can not cause result from above-mentioned flow agent abrasive particle cutting ability or cut off the deterioration of performance; And then, can bring into play above-mentioned effect effectively to the abrasive particle crowd of the abrasive particle that comprises various particle diameters and shape.
In addition, and compare, can prevent coming off and more abrasive particle being exposed from above-mentioned coating of abrasive particle effectively through the situation that finishing is handled or milled processed is exposed the abrasive particle of at least a portion of above-mentioned abrasive particle crowd.
Preferably: the stage of above-mentioned abrasive particle in being contained in above-mentioned plating bath by with above-mentioned plating bath in the metal that comprised a part or all identical coating metals.
Preferably: above-mentioned back-electrolysis treatment process is that the mode of pulsed current applies back-electrolysis voltage with the electric current that between above-mentioned wire main body and above-mentioned electrod assembly, circulates.
More preferably the frequency of above-mentioned pulsed current is 10Hz～1200Hz, further is preferably 50Hz～1000Hz.
Description of drawings
Fig. 1 is the mode chart of the coating bath that in the bonded-abrasive method of manufacture wiry that an embodiment of the present invention relates to, uses.
Fig. 2 (a) is the partial mode sectional view of the state after the positive electrolysis treatment process that is illustrated in the bonded-abrasive method of manufacture wiry that an embodiment of the present invention relates to.
Fig. 2 (b) is the partial mode sectional view of the state after the back-electrolysis treatment process that is illustrated in the bonded-abrasive method of manufacture wiry that an embodiment of the present invention relates to.
Fig. 3 is the size distribution figure of the abrasive particle crowd's that in the bonded-abrasive method of manufacture wiry that an embodiment of the present invention relates to, uses a example.
Fig. 4 is the operation mode chart in the bonded-abrasive method of manufacture wiry that an embodiment of the present invention relates to.
Fig. 5 is the mode chart of the device that uses in the experiment of carrying out about the bonded-abrasive method of manufacture wiry that an embodiment of the present invention relates to.
The preceding bonded-abrasive pattern sectional view wiry of back-electrolysis that Fig. 6 is to use above-mentioned experimental installation to make.
The figure of the waveform of the above-mentioned pulsed current of Fig. 7 when to be expression to bonded-abrasive wire before the above-mentioned back-electrolysis carried out adopting the back-electrolysis of pulsed current to handle.
Fig. 8 (a)～(d) has utilized electron microscope observation respectively the bonded-abrasive wire before the above-mentioned back-electrolysis to be carried out back-electrolysis and handle and to make the photo of its circulation frequency for the embodiment 1～4 of the pulsed current of 5Hz, 10Hz, 20Hz and 50Hz.
Fig. 9 (a)～(d) has utilized electron microscope observation respectively the bonded-abrasive wire before the above-mentioned back-electrolysis to be carried out back-electrolysis and handle and to make the photo of its circulation frequency for the embodiment 5～8 of the pulsed current of 80Hz, 100Hz, 400Hz and 700Hz.
Figure 10 (a)～(d) has utilized electron microscope observation respectively the bonded-abrasive wire before the above-mentioned back-electrolysis to be carried out back-electrolysis and handle and to make the photo of its circulation frequency for the embodiment 9～12 of the pulsed current of 1000Hz, 1200Hz, 1400Hz and 1750Hz.
The figure of the waveform of the above-mentioned galvanic current of Figure 11 when to be expression to bonded-abrasive wire before the above-mentioned back-electrolysis carried out adopting the back-electrolysis of galvanic current to handle.
Figure 12 has utilized electron microscope observation bonded-abrasive wire before the above-mentioned back-electrolysis has been carried out the photo of the embodiment 13 that back-electrolysis handles with the mode of circulation galvanic current.
Embodiment
Below, for the preferred implementation of the bonded-abrasive method of manufacture wiry that the present invention relates to, Yi Bian explain on one side with reference to accompanying drawing.
Said fixing abrasive particle wire is the abrasive particle bonded-abrasive wire that set forms on the wire main body of having carried out copper-plated carbon steel etc. of diamond etc., can perform well in the cut-out or the cutting of the mechanically resistant material of silicon and pottery etc.
The bonded-abrasive that this embodiment relates to method of manufacture wiry is through making the coating galvanic deposit that is formed by the plating bath that contains the abrasive particle crowd make above-mentioned abrasive particle crowd anchor at the method on the above-mentioned wire main body on the wire main body.
Fig. 1 is illustrated in the mode chart of the plater that uses in the method for manufacture that this embodiment relates to.
Above-mentioned method of manufacture; As shown in Figure 1; Comprise: make in the plating bath that contains the abrasive particle crowd 10 in being contained in positive electrolysis voltage groove 30 under the state of electrod assembly 20 and the 5 relative configurations of wire main body; Apply and make above-mentioned electrod assembly 20 become the positive electrolysis voltage that anode and above-mentioned wire main body 5 become negative electrode, make the positive electrolysis treatment process (with reference to Fig. 2 (a)) of coating galvanic deposit on above-mentioned wire main body that contains above-mentioned abrasive particle crowd; With after above-mentioned positive electrolysis treatment process; Apply and make in plating bath the electrod assembly of configuration relatively become negative electrode and the wire main body becomes anodic back-electrolysis voltage, the back-electrolysis treatment process (with reference to Fig. 2 (b)) that the mode of exposing with the top of the abrasive particle of at least a portion in the above-mentioned coating is thus peeled off above-mentioned coating.
Moreover mark 35 is reserve tanks (reserve tank) of plating bath 10 among Fig. 1, and above-mentioned plating bath 10 circulates between above-mentioned positive electrolysis voltage groove 30 and above-mentioned reserve tank 35 through pump 40.
Moreover above-mentioned back-electrolysis treatment process except the voltage to above-mentioned electrod assembly and above-mentioned wire main body applies the different point of direction, is used with the identical device of plater in above-mentioned positive electrolysis treatment process and is carried out.
Like this; The method of manufacture that relates to according to this embodiment; Make the above-mentioned coating 11 that contains above-mentioned abrasive particle 15 separate out (with reference to Fig. 2 (a)) on the surface of above-mentioned wire main body 5 through positive electrolysis voltage application; Thereafter, the mode of exposing with the top of the abrasive particle of at least a portion in the above-mentioned coating through the back-electrolysis voltage application makes above-mentioned coating peel off (with reference to Fig. 2 (b)), therefore; The set intensity of 15 pairs of above-mentioned wire main bodys 5 of above-mentioned abrasive particle is improved, and make the cutting ability of bringing by above-mentioned abrasive particle 15 or cut off the performance raising.
Detail about this point.
Mode becoming anode and above-mentioned wire main body 5 with above-mentioned electrod assembly 20 and becoming negative electrode applies positive electrolysis voltage; Thereby separate out in the positive electrolysis treatment process of the coating 11 that contains above-mentioned abrasive particle crowd on the surface of above-mentioned wire main body 5; Near the zone as the acting above-mentioned electrod assembly 20 of anode, the speed of separating out of above-mentioned coating 11 is just fast more.
That is to say, if form the coating of the bed thickness of the set intensity obtain 15 pairs of above-mentioned wire main bodys 5 of above-mentioned abrasive particle fully, then shown in Fig. 2 (a), the bed thickness thickening of the coating 11 on the top, top of each abrasive particle 15 in above-mentioned abrasive particle crowd.
Because shear action wiry of said fixing abrasive particle or cutting action obtain through above-mentioned a plurality of abrasive particles 15; Therefore if on the top, top of above-mentioned a plurality of abrasive particles 15 the range upon range of thicker above-mentioned coating 11 of bed thickness, then worsen by cutting power or the cut-out ability that above-mentioned abrasive particle 15 brings.
At this; Once proposed when the coating that contains abrasive particle is separated out on the wire main body in the past; Through in the plating bath that forms above-mentioned coating, adding flow agent in advance, make coating attenuation or the scheme of disappearance on the top, top of above-mentioned abrasive particle.
At length say, the flow agent in the above-mentioned plating bath, near in positive electrolysis treatment the time as the part of the acting above-mentioned battery lead plate of anode, promptly near the summit of above-mentioned abrasive particle by preferentially absorption.Its result, near the speed of growth of the coating the summit of above-mentioned abrasive particle becomes slower than the speed of growth of the coating of the base end side part of sowing discord from above-mentioned battery lead plate among the above-mentioned abrasive particle part of above-mentioned wire main body (among the above-mentioned abrasive particle near).Therefore; Through at the base end side of the above-mentioned abrasive particle heavy back coating of separating out relatively partly, thus the set intensity of above-mentioned abrasive particle is improved and can the summit of the above-mentioned abrasive particle of attenuate near coating make the cutting ability of bringing by above-mentioned abrasive particle or cut off performance and improve.
But, thereby at the bed thickness through in above-mentioned plating bath, adding near the coating that above-mentioned flow agent separates out can the summit of attenuate at above-mentioned abrasive particle on the other hand, above-mentioned flow agent is adsorbed near the summit of above-mentioned abrasive particle.Therefore, can produce the cutting ability brought by above-mentioned abrasive particle or cut off the problem that performance worsens because of this flow agent.
In addition, above-mentioned flow agent there are differences on function according to kind.Therefore, even, also not necessarily bring into play the levelling effect effectively for the abrasive particle of size different and shape with it for the flow agent of the suitable levelling effect of the abrasive particle of certain specific size and shape performance.
Usually, the abrasive particle crowd of in above-mentioned plating bath, containing is according to median size and by specific, different each other with shape for its size.
Therefore, be difficult to a plurality of abrasive particles with different size and shape are obtained effective levelling effect.
In addition; As the additive method that abrasive particle is exposed from the coating of separating out on the surface of wire main body; Once proposed at the coating that utilizes positive electrolysis treatment to make to contain the abrasive particle crowd after separate out on the surface of wire main body, through the scheme that finishing is handled or milled processed is exposed at least a portion of above-mentioned abrasive particle crowd.
But, in this existing method, about 20% among the above-mentioned abrasive particle crowd's abrasive particle is exposed.
About this point,, be that the field of the bortz subgroup of 15 μ m is combined into example and describes with the median size that use to adopt the laser diffraction and scattering method to obtain as above-mentioned abrasive particle crowd.
Fig. 3 representes the size distribution figure of above-mentioned bortz subgroup.
As shown in Figure 3, median size is the bortz subgroup of 15 μ m, though contain the diamond particles that particle diameter is 15 μ m at most, containing from particle diameter is that particle below the 10 μ m is the particle more than the 20 μ m to particle diameter.
If carrying out milled processed for the bortz subgroup of such particle that contains various particle diameters is the degree that the particle of 15 μ m exposes to for example particle diameter, then concerning the big particle of particle diameter ratio 15 μ m, become the over-mastication state.
That is to say; Under the situation that diamond particles is exposed; Need to set amount of grinding so that the bigger particle of particle diameter ratio does not come off, for example, can only make that to be equivalent to about 20% whole particle diameter of population be that the above diamond particles of 17.5 μ m is exposed.
For these prior aries, the above-mentioned method of manufacture that this embodiment relates to is as above-mentioned, and after positive electrolysis treatment process, through applying back-electrolysis voltage, the mode of exposing with the top of the abrasive particle of at least a portion in the above-mentioned coating is peeled off above-mentioned coating.
Through this back-electrolysis voltage application, near the part of above-mentioned electrod assembly 20, promptly range upon range of part is preferentially peeled off on the top, top of above-mentioned a plurality of abrasive particles 15 among the above-mentioned coating 11.
Therefore; Shown in Fig. 2 (b); Base end side part for a plurality of abrasive particles 15 that form above-mentioned abrasive particle crowd; Can keep the state that anchors at securely on the above-mentioned wire main body 5 through above-mentioned coating 11, thereby and the top, top of the abrasive particle 15 of at least a portion in above-mentioned abrasive particle crowd exposed cutting power or the cut-out ability brought by above-mentioned abrasive particle 15 are improved.
Particularly in this embodiment, can in above-mentioned plating bath 10, not add flow agent and obtain above-mentioned effect.Therefore, can not cause by of the reduction of above-mentioned flow agent attached to the caused cutting power on the above-mentioned abrasive particle 15 or the ability of cut-out yet.
In addition, above-mentioned flow agent there are differences on function according to kind.That is to say,, need to use its special-purpose flow agent for the abrasive particle to certain specific size and shape obtains suitable levelling effect.
But the abrasive particle crowd of in above-mentioned plating bath, containing comprises a plurality of abrasive particles 15 that have inherent size and shape respectively.Therefore, be difficult to, the abrasive particle crowd of a plurality of abrasive particles 15 of containing different sizes and shape is obtained the levelling effect effectively through certain specific flow agent.
About this point; In this embodiment that the coating 11 on the top, top of the abrasive particle 15 of at least a portion make above-mentioned abrasive particle crowd through the back-electrolysis voltage application among is peeled off; To a plurality of abrasive particles 15 with different size and shape; Set intensity is improved, and seek the raising of cutting ability effectively.
In addition,, the coating 11 on the top, top of above-mentioned abrasive particle 15 is preferentially peeled off, therefore can be kept set intensity fully, and the top is exposed effectively wire main body 5 to the abrasive particle 15 of various sizes if apply back-electrolysis voltage.
For example, be under the situation of bortz subgroup of 15 μ m use median size as above-mentioned abrasive particle crowd, according to the method that this embodiment relates to, can make particle diameter be about the above diamond particles of 13 μ m and expose.This is equivalent to about 70% of population integral body.
At this, the concrete operation of the method for manufacture that relates to for this embodiment describes.
Fig. 4 is illustrated in the operation mode chart in the above-mentioned method of manufacture.
As shown in Figure 4, the wire main body of the length of supplying with from feeding machine 100 is batched by reeling machine 200 through following each treatment trough.
For example for having carried out copper-plated carbon steel, diameter is 0.1～0.3mm to above-mentioned wire main body.
Above-mentioned method of manufacture comprises as above-mentioned: make the positive electrolysis treatment process of coating 11 galvanic deposit on above-mentioned wire main body 5 that contains above-mentioned abrasive particle crowd through applying positive electrolysis voltage; The back-electrolysis treatment process that above-mentioned coating 11 is peeled off with the mode of after above-mentioned positive electrolysis treatment process, exposing with the top of the abrasive particle 15 of at least a portion in the above-mentioned coating 11 through applying back-electrolysis voltage; But before above-mentioned positive electrolysis treatment process and above-mentioned back-electrolysis treatment process, can preferably contain pretreatment process.
In above-mentioned pretreatment process, as shown in Figure 4, comprise degreasing process that has used degreasing tank 110 and the washing step that has used washing bath 120.
In addition, under the situation that above-mentioned wire main body 5 has coated through quilts such as preplating, in above-mentioned pretreatment process, also comprise the coating stripping process that has used coating peel groove 130.
In addition, above-mentioned pretreatment process can be included in the striking plating operation in the striking coating bath 140.
Above-mentioned striking plating operation is to separate out the operation that forms thin coating before on the surface of above-mentioned wire main body 5 at above-mentioned coating 11, through this thin coating the adhesivity of the 11 pairs of above-mentioned wire main bodys of above-mentioned coating that contain above-mentioned abrasive particle 15 is improved.
Above-mentioned positive electrolysis treatment process is constituted as as above-mentioned: apply positive electrolysis voltage under the state that above-mentioned electrod assembly 20 and above-mentioned wire main body 5 are disposed relatively.
As above-mentioned abrasive particle 15, can use for example diamond particles, above-mentioned plating bath 10 can use for example nickel sulfamic acid.
In addition, above-mentioned electrod assembly 20 can use nickel.
Preferably: above-mentioned abrasive particle crowd's abrasive particle 15, in the stage that is contained in above-mentioned plating bath 10, by with above-mentioned plating bath 10 in the metal that comprised a part or all identical coating metals.
If should constitute, the set intensity of above-mentioned abrasive particle 15 and above-mentioned coating 11 is improved.
Above-mentioned back-electrolysis treatment process is constituted as: to the electrod assembly and the wire main body of configuration apply back-electrolysis voltage relatively in having accommodated the back-electrolysis groove 30 ' of plating bath.
As shown in Figure 4, above-mentioned method of manufacture can comprise aftertreatment after above-mentioned back-electrolysis treatment process.
In above-mentioned aftertreatment, comprise: the back plating operation in the coating bath 150 of back; Washing step in washing bath 160; With the antirust treatment process in antirust groove 170.
Above-mentioned back plating operation is the operation that is used to make the set intensity of above-mentioned abrasive particle 15 to improve; Be constituted as: in having accommodated the above-mentioned back coating bath 150 of above-mentioned plating bath 10, make under the relative state of above-mentioned electrod assembly 20 and above-mentioned wire main body 5; The mode that becomes anode and above-mentioned wire main body 5 and become negative electrode with above-mentioned electrod assembly 20 applies positive electrolysis voltage, and coating is separated out.
Moreover; Because under the state after above-mentioned back-electrolysis treatment process; (that is, because the coating 11 and/or the coating at the top of above-mentioned abrasive particle 15 are stripped from) exposed at the top of above-mentioned abrasive particle 15, therefore do not separate out coating through above-mentioned back plating operation at the top of exposing of above-mentioned abrasive particle 15.
At this, the experimental result that the method for manufacture that relates to for this embodiment is carried out describes.
Fig. 5 representes the mode chart of experimental installation.
In this experiment; As shown in Figure 5; Make and accommodate thionamic acid plating bath 110 in the electrolyzer 130; The diamond particles 115 that it is 10～20 μ m that this thionamic acid plating bath 110 contains as the acting median size that has applied no electrolysis Ni-P coating of abrasive particle (with reference to following Fig. 6) makes electrod assembly 120 and line directly be the piano wire of 0.12mm (piano wire) (JIS label: SWRS82A-S) 105 configurations relatively in this plating bath.
Moreover the mark 106 among Fig. 5 is the stainless steel nuts that have been connected with the free end of above-mentioned piano wire 105, for the collimation of the deflection, the above-mentioned electrod assembly 120 of guarantee and the above-mentioned piano wire 105 that prevent above-mentioned piano wire 105 is purchased.
In addition, mark 107 is arranged on the stirrer in the above-mentioned electrolyzer 130, for the homogenizing of seeking the wear particle concentration in the above-mentioned plating bath is purchased.
Under this state, the mode that becomes anode and above-mentioned piano wire 105 and become negative electrode with above-mentioned electrod assembly 120 applies voltage through power supply 101, and being provided with thickness on the surface of above-mentioned piano wire 105 is the coating 111 (with reference to following Fig. 6) of 5～6 μ m.
Fig. 6 representes to be provided with the pattern sectional view of the piano wire 105 of above-mentioned coating 111.
As shown in Figure 6, in this experiment, above-mentioned coating 111 comprises: the employing thionamic acid that after the degreasing of having carried out above-mentioned piano wire 105 and washing, is arranged on the surface of above-mentioned piano wire 105 is bathed the substrate coating 111a of formation basically; Be arranged on the coating 111b that has abrasive particle on the surface of above-mentioned stratum basale 111a, this coating 111b that has abrasive particle adopts the thionamic acid of the diamond particles 115 that contains the above-mentioned Ni-P of having coating to bathe formation basically; Basically bathe the back coating 111c of formation with the employing thionamic acid on the surface that is arranged on the above-mentioned coating 111b that has an abrasive particle.
Moreover, in this experiment, have the diamond particles 115 of Ni-P coating, the weight ratio of diamond particles and Ni-P coating was made as 7: 3.
For the bonded-abrasive wire before such back-electrolysis that has formed (thickness that contains the diamond 115 of the above-mentioned Ni-P of having coating is the bonded-abrasive wire that the above-mentioned coating 111 of 5～6 μ m has been separated out on the surface of above-mentioned piano wire 105), carried out adopting the back-electrolysis of pulsed current handle.
Specifically, with above-mentioned electrod assembly 120 as negative electrode and with above-mentioned piano wire 105 as the anodic state under, with current density 20A/dm
2The mode that under the condition of frequency 5Hz (embodiment 1), 10Hz (embodiment 2), 20Hz (embodiment 3), 50Hz (embodiment 4), 80Hz (embodiment 5), 100Hz (embodiment 6), 400Hz (embodiment 7), 700Hz (embodiment 8), 1000Hz (embodiment 9), 1200Hz (embodiment 10), 1400Hz (embodiment 11) and 1750Hz (embodiment 12), circulates of pulsed current (with reference to Fig. 7) apply back-electrolysis voltage.
Moreover, as shown in Figure 7 in above-mentioned each embodiment 1～12, the dutycycle of pulsed current is made as 0.3 (the circulate electric current of above-mentioned current density of 30% time only among 1 cycle, remaining 70% stops energising).
In addition, set the work done amount (current density * time) that time that back-electrolysis handles makes back-electrolysis among above-mentioned each embodiment 1～12 handle and be certain (260As/dm
2).
That is, in each embodiment 1～12, set time that back-electrolysis handles make above-mentioned current density the pulsed current circulation time add up to 13 seconds.
Utilize scanning electron microscope (the system JEOL of NEC model: be 1500～3000 times of results that observe the foregoing description 1～12 JSM-6363LA) with multiplying power.
The result of embodiment 1～4 is shown in Fig. 8 (a)～(d) respectively.
The result of embodiment 5～8 is shown in Fig. 9 (a)～(d) respectively.
The result of embodiment 9～12 is shown in Figure 10 (a)～(d) respectively.
In addition, as embodiment 13, carried out adopting the back-electrolysis of galvanic current to handle to the bonded-abrasive wire before the above-mentioned back-electrolysis.
At length say, shown in figure 11, for the condition that back-electrolysis is handled is consistent with the foregoing description 1～12, will be made as conduction time and make that the current density of above-mentioned galvanic current is 20A/dm in 13 seconds
2And the work done amount is 260As/dm
2
(NEC system JEOL model: the result who JSM-6363LA) has observed the foregoing description 13 with 3000 times multiplying power is shown in Figure 12 will to utilize scanning electron microscope.
Under the situation that the back-electrolysis that adopts galvanic current is handled, confirmed the coating roughly attenuation equably on the whole on every side of above-mentioned abrasive particle from Figure 12.
Relative therewith, under the situation that the back-electrolysis that adopts pulsed current is handled, confirmed the coating attenuation partly on every side of above-mentioned abrasive particle from Fig. 8～Figure 10.
This means: the back-electrolysis through adopting pulsed current is handled, and can keep the set intensity of above-mentioned abrasive particle to above-mentioned coating, and the cutting ability of being brought by above-mentioned abrasive particle is improved.
In addition, when the frequency of pulsed current was the scope of 10Hz (embodiment 2)～1200Hz (embodiment 11), confirmed did not have to damage the set intensity of above-mentioned abrasive particle to above-mentioned coating substantively, and the part of above-mentioned abrasive particle is exposed effectively.
Confirm:, then can enlarge the zone of exposing of above-mentioned abrasive particle if more preferably the frequency of pulsed current is made as 50Hz (embodiment 4)～1000Hz (embodiment 9).
Claims (5)
1. bonded-abrasive method of manufacture wiry; Be to make following bonded-abrasive method wiry; Said bonded-abrasive wire is the plating bath electrodeposition cladding on the wire main body that contains the abrasive particle crowd through use; Formed on the said wire main body thereby abrasive particle anchors at, this method of manufacture is characterised in that, comprising:
Positive electrolysis treatment process, this operation apply and make in the plating bath that contains the abrasive particle crowd electrod assembly of configuration relatively become the positive electrolysis voltage that anode and wire main body become negative electrode, make the coating galvanic deposit that contains the abrasive particle crowd on said wire main body; With
The back-electrolysis treatment process; This operation is after said positive electrolysis treatment process; Apply and make in plating bath the electrod assembly of configuration relatively become negative electrode and the wire main body becomes anodic back-electrolysis voltage, the mode of exposing with the top of the abrasive particle of at least a portion in the said coating is peeled off said coating.
2. bonded-abrasive according to claim 1 method of manufacture wiry is characterized in that, the stage of said abrasive particle in being contained in said plating bath by with said plating bath in the metal that comprised a part or all identical coating metals.
3. bonded-abrasive according to claim 1 and 2 method of manufacture wiry is characterized in that, said back-electrolysis treatment process is that the mode of pulsed current applies back-electrolysis voltage with the electric current that between said wire main body and said electrod assembly, circulates.
4. bonded-abrasive according to claim 3 method of manufacture wiry is characterized in that the frequency of said pulsed current is 10Hz～1200Hz.
5. bonded-abrasive according to claim 4 method of manufacture wiry is characterized in that the frequency of said pulsed current is 50Hz～1000Hz.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011017930 | 2011-01-31 | ||
| JP017930/2011 | 2011-01-31 | ||
| JP2011271150A JP5863170B2 (en) | 2011-01-31 | 2011-12-12 | Method for manufacturing fixed abrasive wire |
| JP271150/2011 | 2011-12-12 |
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