JP2012173315A - Wavelength variable interference filter, optical module and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wavelength variable interference filter, an optical module and an electronic apparatus with excellent environmental performance and charge removal property.SOLUTION: In a wavelength variable interference filter, an etalon 5 comprises: a movable substrate 52; a fixed substrate 51 facing the movable substrate 52; a movable reflection coat 57 provided for the movable substrate 52 on a face facing the fixed substrate 51; a fixed reflection coat 56 provided for the fixed substrate 51 on a face facing the movable substrate 52 and facing the movable reflection coat 57 across a gap; a movable protective coat 59 that coats the movable reflection coat 57 on a face facing the fixed substrate 51 and on an end face thereof and has a first pull-out portion extending along a periphery of the etalon 5; and a fixed protective coat 58 that coats the fixed reflection coat 56 on a face facing the movable substrate 52 and an end face thereof and has a second pull-out portion extending along the periphery of the etalon 5.

Description

  The present invention relates to a tunable interference filter that selects and emits light having a desired target wavelength from incident light, an optical module including the tunable interference filter, and an electronic device including the optical module.

2. Description of the Related Art Conventionally, a wavelength variable interference filter that emits light having a desired wavelength by causing multiple interference of light between a pair of reflective films is known (see, for example, Patent Document 1).
The optical filter device (wavelength variable interference filter) described in Patent Literature 1 includes a first substrate and a second substrate that are arranged to face each other, and an optical reflection film is provided on the surfaces of the first substrate and the second substrate that face each other Are provided. The distance between the optical reflecting films can be controlled by bonding the first substrate and the second substrate with a silicon film and a gold thin film, and light having a wavelength corresponding to the gap dimension between the optical reflecting films can be obtained from incident light. It can be taken out.

In such a wavelength tunable interference filter, for example, a single-layer film of an Ag alloy, or a dielectric multilayer film in which the high refractive layer is TiO ₂ and the low refractive layer is SiO ₂ can be used as the optical reflection film. These optical reflecting films may be charged, and this charging may make it difficult to control the gap size between the optical reflecting films.

Here, a technique for improving the scratch resistance and antistatic property by providing a carbon film on the surface of the optical film has been proposed (see, for example, Patent Document 2).
An ND (neutral density) filter used in an imaging system such as a camera or video in Patent Document 2 is composed of alternately laminated SiO ₂ and Ti metal compounds, and has excellent scratch resistance and antistatic properties on the outermost layer. The carbon film is laminated.

JP 2008-76749 A JP 2006-84994 A

The wavelength tunable interference filter of Patent Document 1 is likely to be deteriorated when the optical reflection film is exposed to various chemicals and gases in the manufacturing process after the optical film is formed. In particular, when an Ag alloy single-layer film is used as the optical reflection film, the film tends to deteriorate. For this reason, the optical reflection film is required to have excellent environmental resistance such as chemical resistance and gas barrier properties.
Further, in Patent Document 2, it may be possible to prevent charging to some extent by providing a carbon film on the outermost layer of the ND filter. However, since the carbon film is electrically floating, it is necessary to completely prevent charging. I can't. Moreover, although the upper surface of the ND filter is covered with a carbon film, since the end surface is exposed, the filter may be deteriorated because it is exposed to various chemicals and gases in the manufacturing process.

  In view of the problems as described above, it is an object of the present invention to provide a wavelength tunable interference filter, an optical module, and an electronic device that are excellent in environmental resistance and charge removability.

  The wavelength tunable interference filter of the present invention includes a first substrate, a second substrate facing the first substrate, a first reflecting film provided on a surface of the first substrate facing the second substrate, A second reflection film provided on a surface of the second substrate facing the first substrate, facing the first reflection film via a gap, and a surface and an end surface of the first reflection film facing the second substrate; A first protective film covering the first substrate of the second reflective film, and a second protective film covering an end surface of the second reflective film facing the first substrate, wherein the first protective film includes the wavelength tunable interference. A first lead-out portion that extends to an outer peripheral portion of the filter and releases charge charged in the first protective film, and the second protective film extends to the outer peripheral portion and releases charge charged in the second protective film It has the 2nd drawer part, It is characterized by the above-mentioned.

  In the present invention, the first protective film is completely covered with the first protective film and the first substrate by covering the surface and the end surface of the first reflective film facing the second substrate. It becomes a state. Therefore, if the first protective film is formed after forming the first reflective film, the first reflective film is not exposed to chemicals or gases in the subsequent manufacturing steps. That is, since the environment resistance is excellent, the first reflective film can be prevented from being deteriorated. Similarly, the second protective film covers the surface and the end surface of the second reflective film facing the first substrate, so that the second reflective film is completely covered by the second protective film and the second substrate. It becomes. Therefore, if the second protective film is formed after forming the second reflective film, the second reflective film is not exposed to chemicals or gas in the subsequent manufacturing steps. That is, since the environment resistance is excellent, it is possible to prevent the second reflective film from being deteriorated.

  In addition, the first protective film can release the electric charge charged in the first reflective film to the outside via the first lead portion extending to the outer peripheral portion of the wavelength variable interference filter. Similarly, the second protective film can release the electric charge charged in the second reflective film to the outside through the second lead portion extending to the outer peripheral portion of the wavelength variable interference filter. Therefore, it is possible to completely remove the electric charge existing when forming the first reflective film or the second reflective film, the electric charge stored in the manufacturing process after the formation, and the electric charge stored by electrostatic driving. As described above, since the antistatic property is excellent, the gap between the first reflective film and the second reflective film, which has been difficult to be controlled by charging, can be accurately controlled. Therefore, the gap accuracy between the first reflective film and the second reflective film can be maintained well, and the resolution of the wavelength variable interference filter can be improved.

In the variable wavelength interference filter according to the aspect of the invention, it is preferable that the resistivity of the first protective film and the second protective film is 8 × 10 ⁷ Ω · cm or more and 10 ¹⁰ Ω · cm or less.

In this invention, the resistivity of the first protective film and the second protective film is within the above range. If the resistivity is less than 8 × 10 ⁷ Ω · cm, it may be difficult to control the gap size between the first reflective film and the second reflective film. On the other hand, if the resistivity exceeds 10 ¹⁰ Ω · cm, it is difficult to release the charge, and the charge may not be completely removed. Therefore, when the resistivity is within the above range, the first protective film easily releases the charge to the outside through the first lead portion, and is more excellent in antistatic property. Similarly, the second protective film easily releases the charge to the outside through the second lead portion, and is excellent in antistatic properties.

  In the wavelength tunable interference filter according to the aspect of the invention, it is preferable that the first protective film and the second protective film are carbon films.

  Since the carbon film has a dense composition and high hardness, the carbon film is excellent in resistance to chemicals and gases (environment resistance), and high protection performance can be obtained for the first reflective film and the second reflective film. In addition, since the carbon film has a surface resistance value lower than that of the inorganic insulating dielectric film, the carbon film has excellent antistatic properties. Therefore, by using such a carbon film for the first protective film and the second protective film, it is possible to provide a variable wavelength interference filter excellent in environmental resistance and antistatic properties.

The carbon film is known to have a diamond structure, a diamond-like carbon (DLC) structure, or a graphite structure, and among these, a carbon film having a DLC structure (hereinafter referred to as a DLC film) is preferably used.
Since the DLC film is provided with environment resistance and antistatic properties in a single layer, the structure as a wavelength variable interference filter is simplified, and the cost can be reduced. In addition, since the DLC film can be etched by O ₂ plasma treatment, the manufacturing process can be simplified and the cost can be reduced.

  In the wavelength tunable interference filter of the present invention, the first reflective film and the second reflective film are dielectric multilayer films in which high refractive index layers and low refractive index layers are alternately stacked, and the first protective film and The second protective film preferably has the same refractive index as a layer adjacent to the outermost layer of the dielectric multilayer film.

In the present invention, the first reflective film and the second reflective film are dielectric multilayer films. The dielectric multilayer film can obtain predetermined optical characteristics by alternately laminating high refractive index layers and low refractive index layers. The first protective film and the second protective film are laminated on the outermost layer of the dielectric multilayer film, and have the same refractive index as the layer adjacent to the outermost layer. For example, when the outermost layer is a low refractive index layer, the layer adjacent to the outermost layer is a high refractive index layer, so the first protective film and the second protective film have the same refractive index as the high refractive index layer. Here, “same” does not mean that they are completely coincident with each other, but has a certain range because it is sufficient that the outermost layer has a high refractive index.
Thus, since the first protective film and the second protective film can serve as the first reflective film and the second reflective film, the optical characteristics are not impaired. That is, predetermined optical characteristics can be maintained.

An optical module according to the present invention includes the above-described variable wavelength interference filter and a detection unit that detects light transmitted through the variable wavelength interference filter.
In the present invention, as described above, the wavelength tunable interference filter is excellent in environmental resistance and antistatic property, so that the first reflective film and the second reflective film are prevented from being deteriorated, and the first reflective film and the second reflective film are prevented. The gap accuracy of the film is improved and high resolution can be realized. Therefore, in an optical module equipped with such a variable wavelength interference filter, light of a desired wavelength extracted with high resolution can be received by the detection unit, and the amount of light of the desired wavelength can be accurately detected. .

In the optical module of the present invention, it is preferable that the optical module further includes a ground wiring connected to the first lead portion and the second lead portion.
In the present invention, since the first lead portion is connected to the ground, the electric charge charged in the first protective film can be released to the outside through the first lead portion and the ground wiring. Similarly, since the second lead portion is connected to the ground, the charge charged in the second protective film can be released to the outside through the second lead portion and the ground wiring. Accordingly, the first reflective film and its surroundings and the second reflective film and the charges charged in the peripheral area can be completely removed, so that the gap accuracy between the first reflective film and the second reflective film is improved and high resolution is achieved. realizable.

An electronic apparatus according to the present invention includes the optical module as described above.
Here, as an electronic device, based on the amount of light detected by the optical module as described above, a photometer that analyzes the chromaticity and brightness of light incident on the interference filter, the absorption wavelength of the gas Examples thereof include a gas detection device that detects the type of gas by detecting it, and an optical communication device that acquires data included in light of that wavelength from received light.
In the present invention, as described above, the optical module can detect the exact amount of light of the desired wavelength, and thus the electronic device performs an accurate optical analysis process based on such accurate data. it can.

1 is a diagram illustrating a schematic configuration of a color measurement device according to a first embodiment of the present invention. It is a top view which shows schematic structure of the etalon which is a wavelength variable interference filter of 1st embodiment. It is sectional drawing which shows schematic structure of the etalon of 1st embodiment. It is a figure which shows the manufacturing process of the fixed board | substrate of the etalon of 1st embodiment. It is a figure which shows the manufacturing process of the movable substrate of the etalon of 1st embodiment. It is principal part sectional drawing which shows schematic structure of the etalon of 2nd embodiment which concerns on this invention. It is the schematic which shows the gas detection apparatus which is an example of the electronic device of other embodiment which concerns on this invention. It is a block diagram which shows the structure of the control system of the said gas detection apparatus. It is the schematic which shows the food analyzer which is an example of the electronic device of other embodiment which concerns on this invention. It is the schematic which shows the spectroscopic camera which is an example of the electronic device of other embodiment which concerns on this invention.

[First embodiment]
Hereinafter, a first embodiment according to the present invention will be described with reference to the drawings.
[1. Overall configuration of the color measuring device]
FIG. 1 is a diagram illustrating a schematic configuration of a color measurement device (electronic device) according to an embodiment of the present invention.
The colorimetric device 1 is an electronic apparatus according to the present invention, and as shown in FIG. 1, a light source device 2 that emits light to an inspection target A, a colorimetric sensor 3 that is an optical module according to the present invention, and a colorimetric sensor. And a control device 4 that controls the overall operation of the color device 1. The colorimetric device 1 reflects the light emitted from the light source device 2 on the inspection target A, receives the reflected inspection target light on the colorimetric sensor 3, and outputs the light from the colorimetric sensor 3. This is an apparatus for analyzing and measuring the chromaticity of the inspection target light, that is, the color of the inspection target A based on the detected signal.

[2. Configuration of light source device]
The light source device 2 includes a light source 21 and a plurality of lenses 22 (only one is shown in FIG. 1), and emits white light to the inspection target A. The plurality of lenses 22 may include a collimator lens. In this case, the light source device 2 converts the white light emitted from the light source 21 into parallel light by the collimator lens, and inspects from a projection lens (not shown). Inject toward the subject A.
In the present embodiment, the colorimetric device 1 including the light source device 2 is illustrated. However, for example, when the inspection target A is a light emitting member such as a liquid crystal panel, the light source device 2 may not be provided.

[3. (Configuration of colorimetric sensor)
The colorimetric sensor 3 constitutes the optical module of the present invention. As shown in FIG. 1, the colorimetric sensor 3 transmits the etalon 5 constituting the tunable interference filter of the present invention, a detection unit 31 that receives and detects the light transmitted through the etalon 5, and transmits the light through the etalon 5. A voltage control unit 6 that varies the wavelength of light. Further, the colorimetric sensor 3 includes an incident optical lens (not shown) that guides the reflected light (inspection target light) reflected by the inspection target A at a position facing the etalon 5. The colorimetric sensor 3 uses the etalon 5 to split only the light having a predetermined wavelength out of the inspection target light incident from the incident optical lens, and the detection unit 31 receives the split light.
The detection unit 31 includes a plurality of photoelectric exchange elements, and generates an electrical signal corresponding to the amount of received light. And the detection part 31 is connected to the control apparatus 4, and outputs the produced | generated electric signal to the control apparatus 4 as a light reception signal.

(3-1. Composition of etalon)
FIG. 2 is a plan view showing a schematic configuration of the etalon 5 constituting the tunable interference filter of the present invention, and FIG. 3 is a cross-sectional view showing a schematic configuration of the etalon 5.
As shown in FIG. 2, the etalon 5 is a planar square plate-shaped optical member, and one side is formed to be 10 mm, for example. As shown in FIG. 3, the etalon 5 includes a fixed substrate 51, which is the second substrate of the present invention, and a movable substrate 52, which is the first substrate of the present invention. These two substrates 51 and 52 are made of, for example, various glasses such as soda glass, crystalline glass, quartz glass, lead glass, potassium glass, borosilicate glass, and non-alkali glass, or crystal. . These two substrates 51 and 52 are integrally formed by bonding later-described bonding portions 513 and 523 by, for example, room temperature activation bonding or siloxane bonding using a plasma polymerization film. Yes.

The fixed substrate 51 is provided with a fixed reflective film 56 constituting the second reflective film of the present invention, and the movable substrate 52 is provided with a movable reflective film 57 constituting the first reflective film of the present invention. Here, the fixed reflective film 56 is fixed to the surface of the fixed substrate 51 facing the movable substrate 52, and the movable reflective film 57 is fixed to the surface of the movable substrate 52 facing the fixed substrate 51. In addition, the fixed reflection film 56 and the movable reflection film 57 are disposed to face each other via a gap.
Further, an electrostatic actuator 54 for adjusting the size of the gap between the fixed reflection film 56 and the movable reflection film 57 is provided between the fixed substrate 51 and the movable substrate 52. The electrostatic actuator 54 includes a fixed electrode 541 provided on the fixed substrate 51 side and a movable electrode 542 provided on the movable substrate 52 side.

(3-1-1. Configuration of Fixed Substrate)
The fixed substrate 51 is formed by processing a glass base material having a thickness of, for example, 500 μm. Specifically, as shown in FIG. 3, the fixed substrate 51 is formed with an electrode formation groove 511 and a reflective film fixing portion 512 by etching. The fixed substrate 51 is formed to have a larger thickness dimension than the movable substrate 52.

The electrode forming groove 511 is formed in a circular shape centered on the plane center point in a plan view (hereinafter referred to as etalon plan view) of the etalon 5 as seen from the thickness direction as shown in FIG. The reflection film fixing portion 512 is formed so as to protrude from the central portion of the electrode forming groove 511 toward the movable substrate 52 in the plan view.
The fixed substrate 51 is provided with a lead forming groove extending from the electrode forming groove 511 toward the apex direction of the outer peripheral edge of the fixed substrate 51 (for example, the upper right direction in FIG. 2).
In addition, the fixed substrate 51 is provided with an antistatic lead forming groove extending from the electrode forming groove 511 toward the apex direction of the outer peripheral edge of the fixed substrate 51 (for example, the upper left direction in FIG. 2).

A C-shaped fixed electrode 541 is formed on the electrode forming surface 511 </ b> A that is the groove bottom of the electrode forming groove 511 of the fixed substrate 51. The fixed electrode 541 has conductivity, and an electrostatic attractive force can be generated between the fixed electrode 541 and the movable electrode 542 by applying a voltage to the movable electrode 542 of the movable substrate 52 described later. However, in the present embodiment, an ITO film is used.
Further, a fixed extraction electrode 541A extending from the outer peripheral edge of the fixed electrode 541 along the extraction formation groove (upper right direction in FIG. 2) is provided. A fixed electrode pad 541B is formed at the tip of the fixed extraction electrode 541A, and the fixed electrode pad 541B is connected to the voltage control unit 6. The fixed extraction electrode 541A is formed at the same time as the film formation of the fixed electrode 541, and is made of an ITO film like the fixed electrode 541.

As described above, the reflection film fixing portion 512 is formed in a columnar shape coaxial with the electrode forming groove 511 and having a smaller diameter than the electrode forming groove 511. In the present embodiment, as shown in FIG. 3, the reflective film fixing surface 512A facing the movable substrate 52 of the reflective film fixing portion 512 is formed closer to the movable substrate 52 than the electrode forming surface 511A. However, the present invention is not limited to this. The height positions of the electrode forming surface 511A and the reflective film fixing surface 512A are the size and fixing of the gap between the fixed reflective film 56 fixed to the reflective film fixed surface 512A and the movable reflective film 57 formed on the movable substrate 52. The thickness is appropriately set according to the dimension between the electrode 541 and a movable electrode 542 described later formed on the movable substrate 52 and the thickness dimension of the fixed reflective film 56 and the movable reflective film 57. For example, when a dielectric multilayer film is used as the reflection films 56 and 57 and the thickness thereof increases, the electrode formation surface 511A and the reflection film fixing surface 512A are formed on the same surface, or the center of the electrode formation surface 511A. The reflective film fixing groove on the cylindrical concave groove may be formed in the part, and the reflective film fixing surface 512A may be formed on the bottom surface of the reflective film fixing groove.
However, the electrostatic attractive force acting between the fixed electrode 541 and the movable electrode 542 is inversely proportional to the square of the distance between the fixed electrode 541 and the movable electrode 542. Therefore, as the distance between the fixed electrode 541 and the movable electrode 542 becomes closer, the electrostatic attractive force with respect to the applied voltage also increases, and the amount of variation in the gap also increases. In particular, when the variable dimension of the gap is very small (for example, 250 nm to 450 nm) as in the etalon 5 of the present embodiment, it is difficult to control the gap. Therefore, as described above, even when the reflective film fixing groove is formed, it is preferable to secure the depth dimension of the electrode forming groove 511 to some extent. In this embodiment, for example, it is formed to be 1 μm. preferable.

  In addition, it is preferable that the reflection film fixing surface 512A of the reflection film fixing portion 512 is designed to have a groove depth in consideration of a wavelength region that transmits the etalon 5. For example, the initial value of the gap between the fixed reflective film 56 and the movable reflective film 57 (the dimension of the gap when no voltage is applied between the fixed electrode 541 and the movable electrode 542) is set to 450 nm, and the fixed electrode 541 and When a voltage is applied between the movable electrodes 542 so that the movable reflective film 57 can be displaced until the gap reaches, for example, 250 nm, the film thicknesses of the fixed reflective film 56 and the movable reflective film 57 and the reflective film The height dimension of the fixed surface 512A and the electrode forming surface 511A only needs to be set to a value that allows the gap G to be displaced between 250 nm and 450 nm.

A fixed reflection film 56 formed in a circular shape is fixed to the reflection film fixing surface 512A. The fixed reflective film 56 may be formed of a metal single layer film, or may be formed of a dielectric multilayer film, and further, an Ag alloy is formed on the dielectric multilayer film. It is good also as a structure in which is formed. As the metal single layer film, for example, a single layer film of an Ag alloy can be used. In the case of a dielectric multilayer film, for example, a dielectric multilayer film in which the high refractive layer is TiO ₂ and the low refractive layer is SiO ₂ is used. be able to.
In the present embodiment, an Ag alloy single layer film is formed as the fixed reflection film 56, and a reflection film that can cover the entire visible light region as a wavelength range that can be dispersed by the etalon 5 can be formed. On the other hand, when the fixed reflective film 56 is formed of a dielectric multilayer film, the wavelength range that can be dispersed by the etalon 5 is narrower than the Ag alloy single layer film, but the transmittance of the dispersed light is large, and the half-value width of the transmittance. The resolution can be improved well.

Further, a fixed protective film 58 is formed on the fixed reflective film 56 in a region that completely covers the surface of the fixed reflective film 56 on the movable substrate 52 side and its end surface (side surface). That is, the fixed reflective film 56 is completely covered with the fixed protective film 58 and the reflective film fixing portion 512.
An antistatic wiring 58A extending from the outer peripheral edge of the fixed protective film 58 along an antistatic lead forming groove (upper left direction in FIG. 2) is provided. An antistatic pad 58B is formed at the tip of the antistatic wiring 58A, and the antistatic pad 58B is connected to the ground. Since the fixed protective film 58 is formed inside the fixed electrode 541, it can be connected to the antistatic pad 58B through the antistatic wiring 58A in the C-shaped gap of the fixed electrode 541. The antistatic wiring 58A and the antistatic pad 58B are the second lead portion of the present invention.

The fixed protective film 58, the antistatic wiring 58A, and the antistatic pad 58B are formed simultaneously with the formation of the fixed protective film 58, and are formed with the same material and the same film thickness. A DLC film is used as the fixed protective film 58, the antistatic wiring 58A, and the antistatic pad 58B. The DLC film is a kind of carbon film, and has excellent resistance to the environment such as chemical resistance and gas barrier property, and also has antistatic properties. In order to obtain effective antistatic properties, the resistivity of the fixed protective film 58 is preferably in the range of 8 × 10 ⁷ Ω · cm to 10 ¹⁰ Ω · cm.
In addition, the carbon film has a dense composition and high hardness, so it is resistant to chemicals and has excellent environmental resistance, and has a lower surface resistance and antistatic properties than inorganic dielectric dielectric films. There is. In addition to the DLC structure, a film having a diamond structure or a graphite structure may be used.

  Further, the fixed substrate 51 is provided with an antireflection film (AR) (not shown) at a position corresponding to the fixed reflection film 56 on the lower surface opposite to the upper surface facing the movable substrate 52. This antireflection film is formed by alternately laminating a low refractive index film and a high refractive index film, and reduces the reflectance of visible light on the surface of the fixed substrate 51 and increases the transmittance.

(3-1-2. Configuration of movable substrate)
The movable substrate 52 is formed by processing a glass substrate having a thickness of, for example, 200 μm by etching.
Specifically, the movable substrate 52 includes a circular movable portion 521 centering on the substrate center point and a holding portion 522 that is coaxial with the movable portion 521 and holds the movable portion 521 in a plan view as shown in FIG. And.

The movable part 521 is formed to have a thickness dimension larger than that of the holding part 522. For example, in this embodiment, the movable part 521 is formed to be 200 μm, which is the same dimension as the thickness dimension of the movable substrate 52. The movable portion 521 includes a movable surface 521A parallel to the reflective film fixing portion 512, and a movable reflective film 57 facing the fixed reflective film 56 via a gap is fixed to the movable surface 521A.
Here, the movable reflective film 57 is a reflective film having the same configuration as the above-described fixed reflective film 56.

In addition, a movable protective film 59 having the same configuration as the above-described fixed protective film 58 is formed on the movable reflective film 57. That is, the movable reflective film 57 is completely covered with the movable protective film 59 and the movable portion 521, and is formed with the same material and the same film thickness as the above-described fixed protective film 58.
From a part of the outer peripheral edge of the movable protective film 59, an antistatic wiring 59A extending along an antistatic lead forming groove (in the upper left direction in FIG. 2) is provided. An antistatic pad 59B is formed at the tip of the antistatic wiring 59A, and the antistatic pad 59B is connected to the ground. The antistatic wiring 59A and the antistatic pad 59B are formed simultaneously with the formation of the movable protective film 59, and have the same configuration as the movable protective film 59.

  Further, the movable portion 521 has an antireflection film (AR) (not shown) formed at a position corresponding to the movable reflective film 57 on the upper surface opposite to the movable surface 521A. This antireflection film has the same configuration as the antireflection film formed on the fixed substrate 51, and is formed by alternately laminating a low refractive index film and a high refractive index film.

The holding part 522 is a diaphragm surrounding the periphery of the movable part 521, and has a thickness dimension of, for example, 50 μm. For this reason, the holding part 522 is more easily bent than the movable part 521 and can be bent toward the fixed substrate 51 by a slight electrostatic attraction. At this time, since the movable portion 521 has a thickness dimension larger than that of the holding portion 522 and has a large rigidity, even when a force that bends the movable substrate 52 by electrostatic attraction acts, the movable portion 521 is hardly bent. Deflection of the movable reflective film 57 formed on the movable portion 521 can also be prevented.
A C-shaped movable electrode 542 is formed on the surface of the holding portion 522 that faces the fixed substrate 51 and faces the fixed electrode 541 with a gap of about 1 μm. Since the movable protective film 59 is formed inside the movable electrode 542, the movable electrode 542 can be connected to the antistatic pad 59B through the antistatic wiring 59A in the C-shaped gap. The antistatic wiring 59A and the antistatic pad 59B are the first lead portion of the present invention.

Further, a movable extraction electrode 542A is formed from the part of the outer peripheral edge of the movable electrode 542 toward the outer peripheral direction. Specifically, the movable extraction electrode 542A is provided so as to extend in a direction opposite to the extraction formation groove formed in the fixed substrate 51 in plan view of the etalon. The movable extraction electrode 542A has a movable electrode pad 542B formed at the tip and is connected to the voltage controller 6.
The movable extraction electrode 542A is formed at the same time as the formation of the movable electrode 542, and has the same configuration as the movable electrode 542. Since the movable extraction electrode 542A is formed on a portion having a thickness dimension equivalent to that of the movable portion 521 of the movable substrate 52, the movable extraction electrode 542A can be applied even when a force that deflects the movable substrate 52 due to electrostatic attraction acts. There is no bending of the portion where the film is formed.

(3-2. Configuration of voltage control means)
The voltage control unit 6 controls the voltage applied to the fixed electrode 541 and the movable electrode 542 of the electrostatic actuator 54 based on the control signal input from the control device 4.

[4. Configuration of control device]
The control device 4 controls the overall operation of the color measurement device 1.
As the control device 4, for example, a general-purpose personal computer, a portable information terminal, other color measurement dedicated computer, or the like can be used.
As shown in FIG. 1, the control device 4 includes a light source control unit 41, a colorimetric sensor control unit 42, a colorimetric processing unit 43, and the like.
The light source control unit 41 is connected to the light source device 2. Then, the light source control unit 41 outputs a predetermined control signal to the light source device 2 based on, for example, a user setting input, and causes the light source device 2 to emit white light with a predetermined brightness.
The colorimetric sensor control unit 42 is connected to the colorimetric sensor 3. The colorimetric sensor control unit 42 sets a wavelength of light received by the colorimetric sensor 3 based on, for example, a user's setting input, and outputs a control signal for detecting the amount of light received at this wavelength. Output to the colorimetric sensor 3. Thereby, the voltage control unit 6 of the colorimetric sensor 3 sets the applied voltage to the electrostatic actuator 54 so as to transmit only the wavelength of light desired by the user based on the control signal.
The colorimetric processing unit 43 analyzes the brightness and chromaticity of the inspection target A from the amount of received light detected by the detection unit 31.

[5. Etalon Manufacturing Method)
Next, a method for manufacturing the etalon 5 will be described with reference to the drawings.
(5-1. Production of fixed substrate)
First, both surfaces are precisely polished until the surface roughness Ra of the quartz glass substrate, which is the manufacturing material of the fixed substrate 51, is 1 nm or less, to produce a glass substrate (fixed substrate 51) having a thickness dimension of 500 μm. Then, a resist is applied to both surfaces of the glass substrate, a resist for forming the electrode forming groove 511 is applied to the surface facing the movable substrate 52, and the applied resist is exposed and developed by a photolithography method to obtain an electrode. A portion where the formation groove 511 is formed is patterned. Then, the glass substrate is etched to a depth dimension (for example, 0.5 μm) of the reflective film fixing surface 512A by wet etching using a hydrofluoric acid aqueous solution. After the etching is completed, the resist is peeled off. Next, a resist is applied to both surfaces of the glass substrate, and resist patterning for forming the electrode formation surface 511A is performed. Then, an etching process (for example, 0.5 μm) is performed by wet etching using a hydrofluoric acid aqueous solution, and the resist is peeled to form an electrode formation surface 511A as shown in FIG.

  Next, an ITO film by sputtering is formed on the entire surface of the fixed substrate 51 facing the movable substrate 52 so that the thickness dimension is 250 nm. Then, a resist is applied on the ITO film, and resist patterning for forming the fixed electrode 541, the fixed extraction electrode 541A, and the fixed electrode pad 541B is performed. Then, the ITO film is etched with an acidic liquid, and the resist is peeled off, thereby forming a fixed electrode 541, a fixed extraction electrode 541A, and a fixed electrode pad 541B as shown in FIG.

  Next, a single film of Ag alloy by sputtering is formed on the entire surface of the fixed substrate 51 on the movable substrate 52 side so as to have a thickness dimension of 50 nm. Then, a resist is applied on the single film of the Ag alloy, and resist patterning for forming the fixed reflective film 56 is performed. Then, for example, a single film of Ag alloy is etched with an aqueous solution of phosphoric acid and acetic acid, and the resist is peeled off to form the fixed reflective film 56 as shown in FIG.

Next, a DLC film with a film thickness of 10 nm is formed on the entire surface of the fixed substrate 51 on the movable substrate 52 side by a plasma CVD method. Specifically, a high frequency power supply (RF) 2500 W is applied, toluene (C ₇ H ₈ ) gas is flowed at a flow rate of 2.5 sccm, and nitrogen (N ₂ ) gas is flowed at a flow rate of 2.5 sccm, and the heating temperature of the substrate Is formed at room temperature.
Then, a resist is applied on the DLC film, resist patterning of the fixed protective film 58, the antistatic wiring 58A, and the antistatic pad 58B is performed, the DLC film is removed by oxygen (O ₂ ) plasma treatment, and the resist is peeled off. As a result, as shown in FIG. 4D, the fixed protective film 58, the antistatic wiring 58A, and the antistatic pad 58B are formed.

  Thereafter, a metal mask or silicon mask in which only the region where the joint portion 513 is formed is aligned on the surface of the fixed substrate 51 on the movable substrate 52 side, and is bonded to the fixed substrate 51, and plasma using polyorganosiloxane is used. A polymerized film is formed by plasma CVD so that the thickness dimension becomes 100 nm, and the mask is removed. As described above, as shown in FIG. 4E, the joint portion 513 is formed, and the fixed substrate 51 is completed.

(5-2. Manufacture of movable substrate)
A quartz glass substrate, which is a manufacturing material of the movable substrate 52, is prepared. As shown in FIG. 5A, both surfaces are precisely polished until the surface roughness Ra of the glass substrate is 1 nm or less, and the thickness dimension is 200 μm. A glass substrate is produced.
Then, a Cr film (thickness dimension 50 nm) and an Au film (thickness dimension 500 nm) are formed on both surfaces of the glass substrate by sputtering, and the holding portion 522 and the fixed substrate 51 are formed on the surface opposite to the fixed substrate 51. Resist patterning is performed to form a space on the fixed electrode pad 541B, the Au film is etched with a mixed solution of iodine and potassium iodide, and the Cr film is etched with an aqueous cerium ammonium nitrate solution. Then, by immersing the glass substrate in a hydrofluoric acid aqueous solution, the portion to be the portion on the fixed electrode pad 541B of the holding portion 522 and the fixed substrate 51 is etched by 170 μm, and the Cr / Au film remaining on both surfaces of the glass substrate is peeled off. . Thereby, as shown in FIG. 5B, a movable portion 521 and a holding portion 522 having a thickness of 30 μm are formed.

  Next, an ITO film is formed on the entire surface of the glass substrate facing the fixed substrate 51 by sputtering so that the thickness dimension becomes 200 nm. Then, a resist is applied on the ITO film, and resist patterning for forming the movable electrode 542, the movable extraction electrode 542A, and the movable electrode pad 542B is performed. Then, the ITO film is etched with an acidic liquid, and the resist is peeled off to form the movable electrode 542, the movable extraction electrode 542A, and the movable electrode pad 542B as shown in FIG.

  Next, a single film of Ag alloy by sputtering is formed on the entire surface of the glass substrate on the fixed substrate 51 side so as to have a thickness dimension of 50 nm. Then, a resist is applied on the Ag alloy single film, and resist patterning for forming the movable reflective film 57 is performed. Then, for example, a single film of an Ag alloy is etched with a phosphorous nitric acid aqueous solution, and the resist is peeled off to form a movable reflective film 57 as shown in FIG.

Next, a DLC film with a thickness of 10 nm is formed on the entire surface of the glass substrate on the fixed substrate 51 side by plasma CVD. Specifically, a high frequency power supply (RF) 2500 W is applied, toluene (C ₇ H ₈ ) gas is flowed at a flow rate of 2.5 sccm, and nitrogen (N ₂ ) gas is flowed at a flow rate of 2.5 sccm, and the heating temperature of the substrate Is formed at room temperature.
Then, a resist is applied on the DLC film, resist patterning is performed on the movable protective film 59, the antistatic wiring 59A, and the antistatic pad 59B, the DLC film is removed by oxygen (O ₂ ) plasma treatment, and the resist is peeled off. As a result, as shown in FIG. 5E, the movable protective film 59, the antistatic wiring 59A, and the antistatic pad 59B are formed.

  Thereafter, a metal mask or a silicon mask that exposes only the region where the bonding portion 523 is formed is aligned on the surface of the glass substrate on the side of the fixed substrate 51 and bonded to the glass substrate, and plasma polymerization using polyorganosiloxane is performed. The film is formed by plasma CVD so that the thickness dimension becomes 100 nm, and the mask is removed. As described above, as shown in FIG. 5F, the joint portion 523 is formed, and the movable substrate 52 is completed.

(5-3. Bonding of fixed substrate and movable substrate)
In the bonding of the fixed substrate 51 and the movable substrate 52, first, a surface activation process for activating the bonding portion 513 of the fixed substrate 51 and the bonding portion 523 of the movable substrate 52 is performed. In this surface activation process, the molecular bonds on the surfaces of the bonding portion 513 and the bonding portion 523 are broken, and unbonded bonds are generated. Specifically, O ₂ plasma treatment or UV treatment is performed. In the case of O ₂ plasma treatment, the treatment is performed for 30 seconds under the conditions of an O ₂ flow rate of 30 cc / min, a pressure of 27 Pa, and an RF power of 200 W. In the case of UV treatment, the treatment is performed for 3 minutes using excimer UV (wavelength 172 nm) as a UV light source. At this time, since damage occurs when activation energy is applied to the fixed reflection film 56 and the movable reflection film 57, a metal mask or the like that exposes only the joint portions 513 and 523 is attached, and the activation energy is applied only to the joint portions 513 and 523. To be added.
After applying activation energy to the plasma polymerized film, the two substrates are aligned, and the substrates are bonded to each other by applying a load by overlapping the fixed bonding portion 513 and the movable bonding portion 523.

[6. Effect of First Embodiment)
As described above, the etalon 5 of the above embodiment is formed such that the fixed reflective film 56 is completely covered with the fixed protective film 58 and the movable reflective film 57 is completely covered with the movable protective film 59. Since the fixed protective film 58 and the movable protective film 59 are formed of a DLC film, the fixed reflective film 56 and the movable reflective film 57 are excellent in environmental resistance, and after the fixed reflective film 56 and the movable reflective film 57 are formed. Damage caused by exposure to chemicals and gases in the manufacturing process can be prevented. That is, it has excellent environmental resistance.
Further, the resistivity of the DLC film is in the range of 8 × 10 ⁷ Ω · cm to 10 ¹⁰ Ω · cm, and the DLC film is grounded via the antistatic wirings 58A and 59A and the antistatic pads 58B and 59B. Therefore, the charge charged in the DLC film can be released to the outside. For this reason, the charge existing when the fixed reflective film 56 and the movable reflective film 57 are formed, the charge stored in the manufacturing process after the formation of the fixed reflective film 56 and the movable reflective film 57, and the charge stored by electrostatic driving are It can be completely removed. As described above, since the antistatic property is excellent, the gap between the fixed reflective film 56 and the movable reflective film 57, which has been difficult to be controlled by charging, can be accurately controlled. Therefore, the gap accuracy between the movable reflective film 57 and the fixed reflective film 56 can be maintained well, and the resolution of the etalon 5 can be improved.

Since the fixed protective film 58 and the movable protective film 59 are provided with environment resistance and antistatic properties by forming a single layer of the DLC film, the structure as the wavelength variable interference filter is simplified, and the cost can be reduced. . In addition, since the DLC film can be etched by O ₂ plasma treatment, the manufacturing process can be simplified and the cost can be reduced.

[Second Embodiment]
Next, a second embodiment of the present invention will be described based on FIG. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.
As shown in FIG. 6, the fixed reflective film 56A of the etalon 5 of the second embodiment is a TiO ₂ film (film thickness 100 nm) / SiO ₂ film (film thickness 160 nm) / TiO ₂ film (film thickness) from the fixed substrate 51 side. 100 nm) / SiO ₂ film (thickness 160 nm) in this order, and a fixed protective film 58 (thickness 100 nm) completely covers the fixed reflection film 56A. Similarly, the movable reflective film 57A is formed of TiO ₂ film (film thickness 100 nm) / SiO ₂ film (film thickness 160 nm) / TiO ₂ film (film thickness 100 nm) / SiO ₂ film (film thickness 160 nm) from the movable substrate 52 side. The movable multi-layered film is formed in order, and the movable protective film 59 (film thickness 100 nm) completely covers the movable reflective film 57A.

(Operational effects of the second embodiment)
In the etalon 5 of the second embodiment, the same effect as that of the first embodiment can be obtained. In particular, in the second embodiment, since the fixed reflective film 56A is composed of a dielectric multilayer film, the SiO ₂ film that is the outermost layer of the dielectric multilayer film is easily charged, but the fixed reflective film 56A is a fixed protective film. Since it is covered with 58, the charged charges can be released to the outside through the fixed protective film 58, the antistatic wiring 58A and the antistatic pad 58B. For this reason, it is possible to completely remove the charge existing when the fixed reflective film 56A is formed, the charge stored in the manufacturing process after the formation of the fixed reflective film 56A, and the charge stored by electrostatic driving. The same effect can be obtained for the movable reflective film 57A.
As described above, since the antistatic property is excellent, the gap between the fixed reflective film 56A and the movable reflective film 57A, which has been difficult to be controlled by charging, can be accurately controlled. Therefore, the gap accuracy between the movable reflective film 57A and the fixed reflective film 56A can be maintained well, and the resolution of the etalon 5 can be improved.

In addition, a DLC film is laminated on the SiO ₂ film that is the outermost layer of the dielectric multilayer film. Close to the refractive index of the DLC film (2.0 to 2.4) is the refractive index of the TiO ₂ film (2.5 to 2.7), an optical unchanged from the conventional be laminated a DLC film on the SiO ₂ film The characteristic can be exhibited. That is, it has excellent environmental resistance and antistatic properties while maintaining excellent optical properties.

[Other Embodiments]
It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.

For example, in the above-described embodiment, the antistatic wiring 58A and the antistatic pad 58B for removing the electric charge charged to the fixed protective film 58 are provided. However, when the fixed electrode 541 is grounded, the fixed protective film 58 is provided. It may be connected to the fixed extraction electrode 541A. In this case, the charge charged to the fixed protective film 58 can be released to the outside through the fixed extraction electrode 541A and the fixed electrode pad 541B, and the fixed extraction electrode 541A and the fixed electrode pad 541B are connected to the second extraction portion of the present invention. Become.
Similarly, the antistatic wiring 59A and the antistatic pad 59B for removing the electric charge charged in the movable protective film 59 are provided. However, when the movable electrode 542 is grounded, the movable protective film 59 is connected to the movable extraction electrode 542A. You may connect to. According to this, the charge charged to the movable protective film 59 can be released to the outside via the movable extraction electrode 542A and the movable electrode pad 542B, and the movable extraction electrode 542A and the movable electrode pad 542B are used as the first extraction of the present invention. Part.

In the above-described embodiment, an example in which the diaphragm-shaped holding portion 522 is formed on the movable substrate 52 is shown, but the present invention is not limited to this.
The holding unit 522 may be configured to hold the movable unit 521 with respect to the fixed substrate 51 so as to be movable back and forth. For example, the holding unit 522 may include a plurality of bridging units. In this case, the movable electrode 542 is formed on all of these bridging portions or on the bridging portion provided at a target position with respect to the center point of the movable substrate 52. Thereby, the bending balance of a bridge | crosslinking part can be made favorable and the movable part 521 can be moved in the state which maintained the movable reflective film 57 in parallel with respect to the fixed reflective film 56. FIG.

  In the above embodiment, the etalon 5 having a structure in which the dimension between the fixed reflection film 56 and the movable reflection film 57 facing each other is smaller than the dimension between the fixed electrode 541 and the movable electrode 542 facing each other has been described. Even if the optical filter has a structure in which the dimension between the film and the movable reflective film is larger than the dimension between the fixed electrode and the movable electrode, the same effect as in the present embodiment can be obtained.

Although the colorimetric device 1 is exemplified as the electronic apparatus of the present invention, the wavelength variable interference filter, optical module, and electronic apparatus of the present invention can be used in various other fields.
For example, it can be used as a light-based system for detecting the presence of a specific substance. As such a system, for example, an in-vehicle gas leak detector that detects a specific gas with high sensitivity by adopting a spectroscopic measurement method using the variable wavelength interference filter of the present invention, or a photoacoustic rare gas detection for a breath test. A gas detection device such as a vessel can be exemplified.
An example of such a gas detection device will be described below with reference to the drawings.

FIG. 7 is a schematic diagram illustrating an example of a gas detection device including a wavelength variable interference filter.
FIG. 8 is a block diagram showing a configuration of a control system of the gas detection device of FIG.
As shown in FIG. 7, the gas detection device 100 includes a sensor chip 110, a flow path 120 including a suction port 120A, a suction flow path 120B, a discharge flow path 120C, and a discharge port 120D, a main body 130, It is configured with.
The main body part 130 includes a sensor part cover 131 having an opening through which the channel 120 can be attached and detached, a discharge unit 133, a housing 134, an optical part 135, a filter 136, an etalon 5 (wavelength variable interference filter), and a light receiving element 137 (light receiving element). A control unit 138 that processes a detected signal and controls the detection unit, a power supply unit 139 that supplies power, and the like. The optical unit 135 emits light, and a beam splitter that reflects light incident from the light source 135A toward the sensor chip 110 and transmits light incident from the sensor chip toward the light receiving element 137. 135B and lenses 135C, 135D, and 135E.
As shown in FIG. 8, an operation panel 140, a display unit 141, a connection unit 142 for interfacing with the outside, and a power supply unit 139 are provided on the surface of the gas detection device 100. When the power supply unit 139 is a secondary battery, a connection unit 143 for charging may be provided.
Further, as shown in FIG. 8, the control unit 138 of the gas detection apparatus 100 includes a signal processing unit 144 configured by a CPU, a light source driver circuit 145 for controlling the light source 135A, and a voltage for controlling the etalon 5. A control unit 146, a light receiving circuit 147 for receiving a signal from the light receiving element 137, a sensor chip detecting circuit 149 for receiving a signal from a sensor chip detector 148 for reading the code of the sensor chip 110 and detecting the presence or absence of the sensor chip 110, And a discharge driver circuit 150 for controlling the discharge means 133.

Next, operation | movement of the above gas detection apparatuses 100 is demonstrated below.
A sensor chip detector 148 is provided inside the sensor unit cover 131 at the upper part of the main body unit 130, and the sensor chip detector 148 detects the presence or absence of the sensor chip 110. When the signal processing unit 144 detects the detection signal from the sensor chip detector 148, the signal processing unit 144 determines that the sensor chip 110 is attached, and displays a display signal for displaying on the display unit 141 that the detection operation can be performed. put out.

  For example, when the operation panel 140 is operated by the user and an instruction signal to start the detection process is output from the operation panel 140 to the signal processing unit 144, the signal processing unit 144 first sends the signal processing unit 144 to the light source driver circuit 145. A light source activation signal is output to activate the light source 135A. When the light source 135A is driven, a linearly polarized laser beam having a single wavelength is emitted from the light source 135A. The light source 135A includes a temperature sensor and a light amount sensor, and the information is output to the signal processing unit 144. When the signal processing unit 144 determines that the light source 135A is stably operating based on the temperature and light quantity input from the light source 135A, the signal processing unit 144 controls the discharge driver circuit 150 to operate the discharge unit 133. Thereby, the gas sample containing the target substance (gas molecule) to be detected is guided from the suction port 120A to the suction channel 120B, the sensor chip 110, the discharge channel 120C, and the discharge port 120D.

The sensor chip 110 is a sensor that incorporates a plurality of metal nanostructures and uses localized surface plasmon resonance. In such a sensor chip 110, an enhanced electric field is formed between the metal nanostructures by laser light, and when gas molecules enter the enhanced electric field, Raman scattered light and Rayleigh scattered light including information on molecular vibrations are generated. appear.
These Rayleigh scattered light and Raman scattered light enter the filter 136 through the optical unit 135, and the Rayleigh scattered light is separated by the filter 136, and the Raman scattered light enters the etalon 5. Then, the signal processing unit 144 controls the voltage control unit 146 to adjust the voltage applied to the etalon 5 and causes the etalon 5 to split the Raman scattered light corresponding to the gas molecule to be detected. Thereafter, when the dispersed light is received by the light receiving element 137, a light reception signal corresponding to the amount of received light is output to the signal processing unit 144 via the light receiving circuit 147.
The signal processing unit 144 compares the spectrum data of the Raman scattered light corresponding to the gas molecule to be detected obtained as described above and the data stored in the ROM, and determines whether or not the target gas molecule is the target gas molecule. To determine the substance. Further, the signal processing unit 144 displays the result information on the display unit 141 or outputs the result information from the connection unit 142 to the outside.

  7 and 8 exemplify the gas detection device 100 that performs gas detection from the Raman scattered light obtained by separating the Raman scattered light with the etalon 5, but the gas detection device detects absorbance specific to the gas. By doing so, you may use as a gas detection device which specifies gas classification. In this case, a gas sensor that allows gas to flow into the sensor and detects light absorbed by the gas in the incident light is used as the optical module of the present invention. A gas detection device that analyzes and discriminates the gas flowing into the sensor by such a gas sensor is an electronic apparatus of the present invention. Even in such a configuration, the gas component can be detected by using the variable wavelength interference filter of the present invention.

In addition, the system for detecting the presence of a specific substance is not limited to the detection of the gas as described above, but a non-invasive measuring device for saccharides by near-infrared spectroscopy, and non-invasive information on food, living body, minerals, etc. A substance component analyzer such as a measuring device can be exemplified.
Hereinafter, a food analyzer will be described as an example of the substance component analyzer.

FIG. 9 is a diagram illustrating a schematic configuration of a food analysis apparatus which is an example of an electronic apparatus using the etalon 5.
As shown in FIG. 9, the food analysis apparatus 200 includes a detector 210 (optical module), a control unit 220, and a display unit 230. The detector 210 includes a light source 211 that emits light, an imaging lens 212 into which light from a measurement object is introduced, an etalon 5 (wavelength variable interference filter) that splits the light introduced from the imaging lens 212, and a spectroscope. And an imaging unit 213 (light receiving unit) for detecting the emitted light.
In addition, the control unit 220 controls the light source control unit 221 that controls the turning on / off of the light source 211 and the brightness control at the time of lighting, the voltage control unit 222 that controls the etalon 5, and the imaging unit 213. A detection control unit 223 that acquires the spectral image captured at 213, a signal processing unit 224, and a storage unit 225 are provided.

  In the food analyzer 200, when the system is driven, the light source 211 is controlled by the light source control unit 221, and light is irradiated from the light source 211 to the measurement object. Then, the light reflected by the measurement object enters the etalon 5 through the imaging lens 212. The etalon 5 is applied with a voltage capable of dispersing a desired wavelength under the control of the voltage control unit 222, and the dispersed light is imaged by an imaging unit 213 configured by, for example, a CCD camera or the like. The captured light is accumulated in the storage unit 225 as a spectral image. Further, the signal processing unit 224 controls the voltage control unit 222 to change the voltage value applied to the etalon 5, and acquires a spectral image for each wavelength.

Then, the signal processing unit 224 performs arithmetic processing on the data of each pixel in each image accumulated in the storage unit 225, and obtains a spectrum at each pixel. In addition, the storage unit 225 stores, for example, information related to food components with respect to the spectrum, and the signal processing unit 224 analyzes the obtained spectrum data based on the information related to food stored in the storage unit 225. The food component contained in the detection target and the content thereof are obtained. Moreover, a food calorie, a freshness, etc. are computable from the obtained food component and content. Furthermore, by analyzing the spectral distribution in the image, it is possible to extract a portion of the food to be inspected that has reduced freshness, and to detect foreign substances contained in the food. Can also be implemented.
Then, the signal processing unit 224 performs processing for causing the display unit 230 to display information such as the component and content of the food to be inspected and the calories and freshness obtained as described above.

FIG. 9 shows an example of the food analysis apparatus 200, but it can also be used as a non-invasive measurement apparatus for other information as described above with a substantially similar configuration. For example, it can be used as a biological analyzer for analyzing biological components such as measurement and analysis of body fluid components such as blood. As such a bioanalytical device, for example, as a device for measuring a body fluid component such as blood, a device for detecting ethyl alcohol can be used as a drunk driving prevention device for detecting a driver's drinking state. Further, it can also be used as an electronic endoscope system provided with such a biological analyzer.
Furthermore, it can also be used as a mineral analyzer for performing component analysis of minerals.

Furthermore, the wavelength variable interference filter, optical module, and electronic device of the present invention can be applied to the following devices.
For example, by changing the intensity of light of each wavelength over time, it is also possible to transmit data using light of each wavelength. In this case, light of a specific wavelength is transmitted by a wavelength variable interference filter provided in the optical module. The data transmitted by the light of the specific wavelength can be extracted by separating the light and receiving the light at the light receiving unit, and the electronic device equipped with such an optical module for data extraction can be used to extract the light data of each wavelength. By processing, optical communication can be performed.

Further, the electronic apparatus can be applied to a spectroscopic camera, a spectroscopic analyzer, or the like that captures a spectroscopic image by dispersing light with the variable wavelength interference filter of the present invention. An example of such a spectroscopic camera is an infrared camera incorporating a wavelength variable interference filter.
FIG. 10 is a schematic diagram showing a schematic configuration of the spectroscopic camera. As shown in FIG. 10, the spectroscopic camera 300 includes a camera body 310, an imaging lens unit 320, and an imaging unit 330.
The camera body 310 is a part that is gripped and operated by a user.
The imaging lens unit 320 is provided in the camera body 310 and guides incident image light to the imaging unit 330. Further, as shown in FIG. 10, the imaging lens unit 320 includes an objective lens 321, an imaging lens 322, and an etalon 5 provided between these lenses.
The imaging unit 330 includes a light receiving element, and images the image light guided by the imaging lens unit 320.
In such a spectroscopic camera 300, a spectral image of light having a desired wavelength can be captured by transmitting light having a wavelength to be imaged by the etalon 5.

Furthermore, the wavelength tunable interference filter of the present invention may be used as a bandpass filter. For example, only light in a narrow band centered on a predetermined wavelength out of light in a predetermined wavelength range emitted from the light emitting element can be wavelength-variable. It can also be used as an optical laser device that spectrally transmits through an interference filter.
In addition, the tunable interference filter of the present invention may be used as a biometric authentication device, and can be applied to authentication devices such as blood vessels, fingerprints, retinas, and irises using light in the near infrared region and visible region.

  Furthermore, an optical module and an electronic device can be used as a concentration detection device. In this case, the infrared energy (infrared light) emitted from the substance is spectrally analyzed by the variable wavelength interference filter, and the analyte concentration in the sample is measured.

  As described above, the tunable interference filter, the optical module, and the electronic device of the present invention can be applied to any device that splits predetermined light from incident light. Since the wavelength tunable interference filter according to the present invention can split a plurality of wavelengths with one device as described above, it is possible to accurately measure a spectrum of a plurality of wavelengths and detect a plurality of components. it can. Therefore, compared with the conventional apparatus which takes out a desired wavelength with multiple devices, size reduction of an optical module or an electronic device can be promoted, and for example, it can be suitably used as a portable or vehicle-mounted optical device.

  In addition, the specific structure and procedure for carrying out the present invention can be appropriately changed to other structures and the like within a range in which the object of the present invention can be achieved.

  DESCRIPTION OF SYMBOLS 1 ... Color measurement apparatus as an electronic device, 3 ... Color measurement sensor as an optical module, 5 ... Etalon as a wavelength variable interference filter, 31 ... Detection part, 43 ... Color measurement processing part, 51 ... Fixation as a 2nd board | substrate Substrate, 52... Movable substrate as first substrate, 56... Fixed reflection film as second reflection film, 57... Movable reflection film as first reflection film, 58... Fixed protection film as second protection film, 59. Movable protective film as a first protective film, 521... Movable part, 522... Holding part, 541.

Claims (7)

A first substrate;
A second substrate facing the first substrate;
A first reflective film provided on a surface of the first substrate facing the second substrate;
A second reflective film provided on a surface of the second substrate facing the first substrate and facing the first reflective film via a gap;
A first protective film covering a surface and an end surface of the first reflective film facing the second substrate;
A second protective film that covers a surface and an end surface of the second reflective film facing the first substrate;
The first protective film has a first extraction part that extends to the outer peripheral part of the wavelength tunable interference filter and releases electric charges charged in the first protective film,
The tunable interference filter according to claim 1, wherein the second protective film has a second lead portion that extends to the outer peripheral portion and releases charges charged in the second protective film. The tunable interference filter according to claim 1,
The resistivity of the first protective film and the second protective film is 8 × 10 ⁷ Ω · cm or more and 10 ¹⁰ Ω · cm or less. In the wavelength tunable interference filter according to claim 1 or 2,
The wavelength tunable interference filter, wherein the first protective film and the second protective film are carbon films. In the wavelength variable interference filter according to any one of claims 1 to 3,
The first reflective film and the second reflective film are dielectric multilayer films in which high refractive index layers and low refractive index layers are alternately laminated,
The wavelength tunable interference filter, wherein the first protective film and the second protective film have the same refractive index as a layer adjacent to the outermost layer of the dielectric multilayer film. The wavelength variable interference filter according to any one of claims 1 to 4,
An optical module comprising: a detection unit that detects light transmitted through the wavelength variable interference filter. The optical module according to claim 5,
An optical module, further comprising a ground wiring connected to the first lead portion and the second lead portion. An electronic device comprising the optical module according to claim 5.

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