JP2012169548A - Pickup method of chip-shaped component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent scattering, etc. (scattering and inclination) of peripheral chips during deformation of a dicing tape, when performing dicing by using the dicing tape with thermal deformation characteristics and picking up a chip-shaped component.SOLUTION: A pickup method for chip-shaped components includes: a dicing step of cutting and separating a plate-shaped component adhered to a dicing tape DT including a layer deformed by heating, to obtain a plurality of chips including peripheral chips 6 and chip-shaped components 5; a suction step of making a back face of the dicing tape DT oppose to a suction member 11 which can suck the dicing tape, to suck the back face corresponding to portions holding the peripheral chips 6; a heating step of performing heating, to deform the tape DT; and a pickup step of holding the chip-shaped components 5 in a sucking manner by a suction collet from upper faces of the chip-shaped components 5, to pick up the chip-shaped components 5 from the dicing tape DT. In the heating step, suction in the suction step is performed.

Description

  The present invention relates to a method for picking up a chip-shaped component such as a semiconductor chip. More specifically, for example, in the manufacturing process of small electronic parts such as semiconductor chips, the adhesive force is reduced by heat-deforming the dicing tape of the chip-like parts held on the dicing tape having a layer that is deformed by heating. And a method for picking up chip-shaped components.

Conventional technology

  Conventionally, when a plate-like component on which a large number of components such as a semiconductor wafer are formed is divided into chip bodies for each component, the plate-like member is fixed with a dicing tape and cut and separated (diced) for each component. A dicing process is performed. Then, the individual chip-like parts divided by this dicing process are picked up (taken up) from the dicing tape, for example, die-bonded to a film carrier tape for mounting electronic parts such as a separately prepared TAB tape, A desired device such as a semiconductor device is obtained.

  When picking up chip-shaped parts from the dicing tape, a method is adopted in which the needle is pushed up from the back of the dicing tape, the chip-shaped article is peeled from the dicing tape, and sucked and held by the suction collet from the upper surface of the chip-shaped part. Has been. In recent years, semiconductor wafers have been made extremely thin in order to improve mounting efficiency. For this reason, there is an increased risk of damage to the chip-like component due to the impact at the time of pushing up.

  Particularly in recent years, so-called TSV (Through Silicon Via) chips provided with through electrodes have been used with the trend of thinning of the chips, but such TSV chip wafers are provided with through electrodes. Therefore, there is a need for a pickup method that does not push up with a push-up needle because the adjacent through-electrodes are easily broken even by a slight impact.

  In view of such circumstances, the present applicant has disclosed Patent Document 1 (Japanese Patent Laid-Open No. 10-233373), Patent Document 2 (Japanese Patent Laid-Open No. 10-284446), and Patent Document 3 (Japanese Patent Laid-Open No. 11-3875). ), And as disclosed in Japanese Patent Application Laid-Open No. 2004-199992, when picking up, a chip-like component is picked up from a dicing tape only by suction by a suction collet without being pushed up by a push-up needle. We proposed a dicing tape and equipment that can be used.

  The schematic mechanism of the pickup method using the dicing tape disclosed in Patent Documents 1 to 4 is as follows. That is, as shown in FIG. 1, the dicing tape DT includes a non-shrinkable film 1, a shrinkable film 2, and an adhesive layer 3. The non-shrinkable film 1 and the shrinkable film 2 are directly laminated. Alternatively, they may be laminated via an adhesive layer 4 as illustrated.

  The adhesive layer 3 of the dicing tape DT as described above is attached to the semiconductor wafer SW and diced into a plurality of chips. As a result of the dicing, the peripheral portion of the semiconductor wafer is also cut, and the “peripheral chip 6” to be described later is generated in addition to the chip-like component 5 to be a product. At the time of dicing, as shown in FIG. 2, the shrinkable film 2 is completely cut together with the semiconductor wafer. Further, the outer peripheral portion of the dicing tape DT is fixed by the ring frame 7. Immediately after the dicing, the chips are aligned at intervals of the width of the dicing blade. Subsequently, the shrinkable film 2 is shrunk by heating. As the shrinkable film 2 immediately below the chip shrinks, the pressure-sensitive adhesive layer 3 is also deformed, and as shown in FIG. 3, the contact area between the chip-shaped component 5 and the pressure-sensitive adhesive layer 3 is drastically reduced. Since a deviation stress is generated between the component 5 and the pressure-sensitive adhesive layer 3, the adhesive force between the chip-shaped component 5 and the pressure-sensitive adhesive layer 3 is reduced, and pickup becomes easy.

  Further, in Patent Document 5 (Japanese Patent Laid-Open No. 2002-280330), a plate-like member is diced using the dicing tape as described above, the dicing tape is heated and deformed, and adhesion between the chip and the dicing tape is performed. A technique for facilitating pick-up is disclosed by further reducing the adhesive force between the chip and the dicing tape by sucking from the back side of the dicing tape after the force is reduced.

JP-A-10-233373 Japanese Patent Laid-Open No. 10-284446 Japanese Patent Laid-Open No. 11-3875 JP 2004-119992 A JP 2002-280330 A

  As represented by semiconductor chips, chip-like components are continuously required to be reduced in size, thickness, and weight. As a result of the progress of miniaturization, thinning, and weight reduction of chip-shaped parts, when using the dicing tape as described above, phenomena such as so-called “peripheral chips” are likely to occur, especially in the heating process. Became.

  As shown in FIG. 4, when the semiconductor wafer SW is cut and separated along a dicing line DL that is divided for each circuit 8, a chip-like component 5 that is a product is generated in the inner peripheral portion, and a so-called “periphery” is formed in the outer peripheral portion. Chip 6 ”is generated (hereinafter, the chip-like component and the peripheral chip may be collectively referred to as“ chip ”in some cases). The peripheral chip 6 is normally not formed with a circuit, and the shape thereof is irregular, which is not a product. Many of the peripheral chips are in a state where only three sides or two sides are cut.

  The shrinkable film 2 is completely cut at the side of the peripheral chip 6 adjacent to the chip-like component 5 that is the product, but the shrinkable film 2 on the ring frame 7 side is not cut. That is, while the chip-like component 5 is held on the shrinkable film 2 separated from the ring frame via the adhesive layer 3, the peripheral chip 6 has a shrinkable film having one end fixed to the ring frame. 2 is held via an adhesive layer 3.

  If the shrinkable film is deformed (shrinked) in such a state, the peripheral chip 6 may be peeled off from the pressure-sensitive adhesive layer 3 and scattered. In particular, with the recent downsizing, thinning, and weight reduction of chips, peripheral chips have been similarly reduced in size, thickness, and weight. The scattered peripheral chip 6 also falls on the chip-like component 5, which damages the circuit of the chip-like component 5 or obstructs the pickup of the chip-like component 5. Further, even if the peripheral chip 6 does not scatter, it may be inclined due to heat deformation and remain on the dicing tape without being kept horizontal with respect to the dicing tape, which may cause problems during transportation.

  The present invention has been made in view of the above situation, and by using a heat-deformable dicing tape, a plate-like member such as a semiconductor wafer is diced to produce a chip-like component, and this is picked up. A chip-shaped component pick-up method that can prevent peripheral chips from being scattered (scattered or tilted) when the dicing tape is deformed, and can pick up chip-shaped components without being pushed up by a push-up needle. The purpose is to provide.

The present invention for solving the above problems includes the following gist.
[1] A dicing step (1) for cutting and separating a plate-like component attached to a dicing tape having a layer that is deformed by heating to obtain a plurality of chips including peripheral chips and chip-like components;
The suction member capable of sucking the dicing tape is made to face the back of the dicing tape holding the peripheral chip and the chip-shaped component,
A suction step (2) for sucking a back surface corresponding to a portion holding peripheral chips of the dicing tape;
A heating step (3) for heating to deform the tape;
From the upper surface of the chip-shaped component, the chip-shaped component is sucked and held with a suction collet, and picked up from the dicing tape (4),
A chip-shaped component pick-up method for performing suction in the suction step (2) during the heating step (3).

[2] The pickup method according to [1], wherein the suction step (2) and the heating step (3) are started simultaneously.

[3] Furthermore, a suction step (5-1) for sucking a back surface corresponding to a portion holding the chip-shaped part of the dicing tape with a suction member during the heating step (3) is provided [1] or [2] To pick up chip-shaped parts.

[4] The method according to [1] or [2], further including a suction step (5-2) for sucking a back surface corresponding to a portion holding the chip-shaped part of the dicing tape with a suction member after the heating step (3). Pickup method for chip-shaped parts.

[5] The pickup method according to any one of [1] to [4], wherein the plate-shaped component is a semiconductor wafer having a circuit, and the chip-shaped component is a semiconductor chip.

  In the present invention, when picking up the chip-shaped components aligned and held on the heat-deformable dicing tape by heat-deforming the dicing tape, the back surface corresponding to the portion holding the peripheral chips of the dicing tape is provided. The tape is heated and deformed while being sucked. Since the back surface corresponding to the portion holding the peripheral chip of the dicing tape is fixed by suction during the heating process, rapid and excessive deformation in the heating process of the peripheral edge of the dicing tape holding the peripheral chip can be suppressed. For this reason, scattering of peripheral chips and the like are suppressed, and damage to the chip-like components is prevented.

It is a schematic sectional drawing of one Embodiment of the dicing tape which can be used by this invention. It is a schematic sectional drawing which shows a dicing process. It is a schematic sectional drawing which shows a heating process. It is a top view of the semiconductor wafer in which the circuit was formed. It is sectional drawing which shows the usage condition of the vacuum suction heating apparatus which concerns on the embodiment of this invention. It is sectional drawing which shows the usage condition of the vacuum suction heating apparatus which concerns on the embodiment of this invention.

BEST MODE FOR CARRYING OUT THE INVENTION

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a chip-like component pickup method according to the present invention will be described below with reference to the accompanying drawings.

  The pickup method according to the present invention includes a dicing step (1), a suction step (2), a heating step (3) for performing heating to deform the tape while the back surface of the dicing tape is sucked, and a pickup. And a step (4). Hereinafter, it demonstrates for every process.

<Dicing process (1)>
In the dicing step (1), the plate-like component attached to the dicing tape DT having a layer that is deformed by heating is cut and separated into a plurality of chips. Thereby, the chip-like component 5 which is a normal product and the peripheral chip 6 which is disposed on the outer periphery of the chip-like component 5 and which is discarded or recycled are obtained from the inside of the plate-like member.

  The plate-like component applicable to the present invention is not limited to the material, and a semiconductor wafer such as a TSV chip wafer, a glass substrate, a ceramic substrate, an FPC, a light emitting element material, and a semiconductor chip are placed and resin-sealed. The present invention can be applied to various articles such as organic material substrates such as conductive substrates, metal materials such as precision parts, or composite materials thereof.

  In this specification, as shown in FIG. 4, a semiconductor wafer SW having a circuit 8 formed on the surface thereof will be described as a representative example of a plate member. However, the plate member in the present invention is limited to a semiconductor wafer. There is no.

  The heat-deformable dicing tape DT that can be used in the present invention includes, for example, a non-shrinkable film 1, a shrinkable film 2, and an adhesive layer 3 laminated in this order as shown in FIG. Although a thing can be employ | adopted, if it has a layer which deform | transforms by heating, it will not specifically limit. The non-shrinkable film 1 and the shrinkable film 2 may be directly laminated, or may be laminated via an adhesive layer 4 as illustrated. The shrinkable film is preferably a heat-shrinkable film that shrinks when heated. The pressure-sensitive adhesive layer 3 is preferably an ultraviolet curable type so that the chip-like component 5 is easily peeled off from the pressure-sensitive adhesive layer 3 after being heated and deformed. Details of such a dicing tape are described in Patent Documents 1 to 4. In addition, the dicing tape DT is not limited to this, and may have a layer that can be deformed by heating. For example, an adhesive tape in which a heating foaming agent is added to any layer of the tape and the layer is deformed by heat foaming is used. May be.

  A plate-like member is stuck on the dicing tape DT as described above, and the plate-like member is cut by a known method such as dicing using a dicing blade or the like to obtain a chip-like component 5 (see FIG. 2). When the plate-like member is the semiconductor wafer SW having the circuit 8 formed on the surface, the semiconductor chip 5 is obtained by cutting and separating the semiconductor wafer along the dicing lines DL partitioned for each circuit. Normally, no circuit is formed on the outer periphery of the semiconductor wafer. When the semiconductor wafer is cut and separated along the dicing line DL, the outer peripheral portion is also cut into irregularly shaped chips, and peripheral chips 6 are generated.

  When dicing the plate member, the shrinkable film 2 is completely cut together with the plate member. Further, the outer peripheral portion of the dicing tape DT is fixed by the ring frame 7. Immediately after the dicing, the chips are aligned at intervals of the width of the dicing blade.

  Prior to the description of the suction step (2), the heating step (3), and the suction steps (5-1) and (5-2) of the present invention, the chip-shaped component pickup method of the present invention will be described with reference to FIG. Embodiment of the vacuum suction heating apparatus for implementing is described. As shown in FIG. 5, the vacuum suction heating apparatus 10 includes a suction table 11 formed of, for example, a porous ceramic material, and an operation of a vacuum source such as a vacuum pump (not shown) via a vacuum line 12. Thus, the back surface of the dicing tape DT corresponding to the portion where the chip-like component 5 and the peripheral chip 6 are held is sucked and fixed by negative pressure. The porous ceramic material 11 is provided with a partition wall 14 so that the back surface of the dicing tape DT corresponding to the portion holding the chip-like component and the portion holding the peripheral chip 6 can be sucked separately. Moreover, the vacuum line 12 branches so that the area | region divided by the partition 14 can be attracted | sucked separately, and the branch valve 15 is provided in the branch part. The suction table 11 is not limited to the ceramic material as described above, and uses a metal disk having a large number of suction holes arranged so that the back surface of the tape corresponding to the chip holding portion can be sucked. May be. Further, when simultaneously sucking the back surface of the dicing tape DT corresponding to the portion where the chip-like component 5 and the peripheral chip 6 are held, the partition wall 14 may not be provided as shown in FIG. The line 12 may not be branched and the branch valve 15 may not be provided. In addition to the smooth surface of the table, various known suction table configurations such as using a table in which irregularities smaller than the size of the chip are formed can be used.

  In addition, the vacuum suction heating apparatus 10 includes heating means 13 that is located below the porous ceramic material and is disposed so as to avoid the position of the vacuum line 12 in order to thermally contract the dicing tape DT. As this heating means 13, a well-known heating means such as a structure in which a sheathed heater is arranged in a table or a rubber heater can be adopted, and it is not particularly limited. Further, above the vacuum suction heating device 10, a suction collet, which is not shown, is movable up and down and left and right in the space above the suction table 11 in order to suck and peel the chip from the dicing tape DT. The chips on the dicing tape DT are sucked and fixed for each chip by the action of a vacuum pump (not shown).

  In the vacuum suction heating device 10 of this embodiment, vacuum suction from the tape back surface is performed on the tape back surface corresponding to the chip holding portion. Moreover, since the heating device 13 is provided, heating can be performed while sucking the tape DT.

<Suction process (2)>
In the pickup method of the present invention, after the dicing step, the back surface of the dicing tape DT holding the chip-like component 5 and the peripheral chip 6 faces the suction member at the time of the heating step (3) described later, and at least the dicing tape The back surface corresponding to the portion holding the peripheral chip 6 is sucked. When carrying out the heating step (3), the back surface corresponding to the portion holding the peripheral chip 6 of the dicing tape DT is sucked by the suction member, and deformation of the dicing tape DT due to heating is suppressed.

  By operating a suction source such as a vacuum pump connected to the suction heating device as described above, the back surface of the dicing tape can be sucked and the tape can be temporarily fixed. The negative pressure at the time of suction by the vacuum suction heating device is 20 KPa or more, preferably 70 KPa or more so as not to damage the chip. The suction on the back surface of the dicing tape in the present invention may be based on a negative pressure generated by the operation of the suction source, or may be based on a negative pressure remaining after the suction source is operated and stopped. .

<Heating step (3)>
In the present invention, in the state where the back surface corresponding to the portion holding the peripheral chip 6 of the dicing tape DT is sucked by the suction member and hermetically fixed using the suction member as described above, the heating step (3) I do.

  Specifically, at least the heating step (3) needs to be in a state where the portion of the dicing tape DT where the peripheral chip 6 is held is sucked just before the deformation occurs.

  After the heating process (3) starts, the time until the scattering of peripheral chips etc. varies depending on the conditions and there are individual differences, so do the suction process (2) and the heating process (3) start at the same time? It is preferable to start the suction step (2) first, and start the heating step (3) while maintaining the suction state. When simultaneously starting the suction step (2) and the heating step (3), for example, the contact portion of the suction heating device with the back surface corresponding to the portion holding the peripheral chip 6 of the dicing tape is heated. Thereafter, the back surface side of the dicing tape is placed on the suction portion of the suction heating device, and at the same time, suction to the back surface corresponding to the portion holding the peripheral chip 6 of the dicing tape may be started.

  When the heating step (3) is started after the suction step (2), the back side of the dicing tape is placed on the suction portion of the suction heating device, the suction source is operated, and the peripheral chip 6 of the dicing tape is operated. After starting the suction to the back surface corresponding to the portion holding the wafer, the heating device is operated while continuing the operation of the suction source, and the contact portion with the back surface corresponding to the portion holding the peripheral chip 6 of the dicing tape is set. What is necessary is just to heat. Since the suction heating device is often kept at a high temperature during operation, it is more preferable that the suction step (2) and the heating step (3) are started simultaneously.

  The suction may be terminated as long as the deformation of the dicing tape proceeds to such an extent that scattering of peripheral chips does not occur. However, suction is preferably performed until the heating step (3) is completed.

  The heating temperature and the heating time in the heating step (3) are not particularly limited, and may be any temperature and time at which the shrinkable film 2 can be deformed, and are appropriately set according to the material and properties of the shrinkable film. . Although it is not limited at all, generally, the dicing tape DT may be heated at 80 to 150 ° C. for about 30 to 120 seconds.

  The shrinkable film 2 is deformed by heating the dicing tape DT as described above. As the shrinkable film 2 immediately below the chip shrinks, the pressure-sensitive adhesive layer 3 is also deformed, and as shown in FIG. 3, the contact area between the chip-shaped component 5 and the pressure-sensitive adhesive layer 3 is drastically reduced. Since a shift stress is generated between the component 5 and the pressure-sensitive adhesive layer 3, the adhesive force between the chip-shaped component 5 and the pressure-sensitive adhesive layer 3 is reduced. In addition, when the adhesive layer 3 of the dicing tape DT is formed of an ultraviolet curable adhesive, the adhesive layer 3 is cured by irradiating ultraviolet rays from the back side of the dicing tape DT to reduce the adhesive force. The ultraviolet irradiation is performed in order to efficiently perform the peeling in the heating step and optionally the suction steps (5-1) and (5-2) described later. It is preferably performed before 1) and (5-2), but may be performed thereafter.

  In the present invention, since the back surface corresponding to the portion holding the peripheral chip of the dicing tape is fixed by suction during the heating process, rapid and excessive deformation in the heating process of the peripheral portion of the dicing tape holding the peripheral chip Can be suppressed. For this reason, scattering of peripheral chips and the like are suppressed, and damage to the chip-like components is prevented.

  The reason why the peripheral chips are scattered is that, in the case of the shrinkable film under the chip-like component 5, the shrinkable film is separated and isolated by dicing, and the shrinkage is in the central direction of the surface of the shrinkable film. The shrinkable film in which the peripheral chip 6 is held via the adhesive layer 3 is fixed to the ring frame, so that the shrinkage is biased toward the outer peripheral direction in comparison with the case where the peripheral chip 6 is held through the adhesive layer 3. It is presumed that the peripheral chip 6 has a small area and is likely to be scattered even with a small force.

  However, by sucking the back surface corresponding to the portion of the dicing tape that holds the peripheral chip 6 in the suction step (2), the dicing tape is temporarily fixed, and the force applied to the peripheral chip 6 due to the shrinkage is restricted, and heating is performed. It is considered that scattering of the peripheral chips 6 in the step (3) can be suppressed.

<Pickup process (4)>
After passing through the suction step (2), the heating step (3) as described above, and the suction steps (5-1) and (5-2) described later, the adhesive layer surface of the dicing tape DT The chip-shaped parts 5 are aligned at a constant interval, and the adhesive force between the pressure-sensitive adhesive layer and the chip-shaped parts 5 is reduced. Therefore, it is possible to easily pick up chip-shaped components.

  The method for picking up the chip-shaped component is not particularly limited, and may be a conventional pick-up method using a push-up needle. However, in the present invention, the adhesive force between the chip-shaped component 5 and the pressure-sensitive adhesive layer 3 is low. Therefore, it is possible to pick up the chip-like component only by the suction collet without using the push-up needle.

  Specifically, the chip-like component 5 is individually picked up and picked up by detecting the position of the chip-like component 5 with a sensor or the like, moving the suction collet (not shown) left and right, positioning and lowering, It is die-bonded (mounted) to a film carrier tape for mounting electronic components such as a separately prepared TAB tape. At this time, since it is not necessary to use a push-up pin as in the prior art, damage to the chip-shaped component and adhesion of the adhesive to the lower surface of the chip-shaped component can be prevented.

  The pickup method of the present invention is particularly suitable for picking up a TSV chip because it can not be pushed up by a push-up needle and the scattering of peripheral chips is suppressed.

<Suction process (5-1)>
In the pickup method of the present invention, after the dicing step, the back surface of the dicing tape DT holding the chip-like component 5 and the peripheral chip 6 is made to face the suction member in the heating step (3), so that the chip-like shape of the dicing tape is obtained. The back surface corresponding to the part holding the component 5 may be sucked.

  By using the pick-up method of the present invention as such a process, it is possible to suppress scattering and tilting of the chip-shaped component 5 that occurs when the chip-shaped component 5 is a very thin chip, a specially shaped TSV chip, or the like. it can. Further, the chip peeling due to the heat deformation of the dicing tape DT can be advanced to facilitate the pickup.

  In the heating step (3), when the back surface of the dicing tape DT corresponding to the portion holding the chip-like component 5 is sucked and fixed, the chip-like component 5 is prevented from being peeled off and scattered, It is surprising that two seemingly contradictory phenomena occur at the same time, that is, the peeling of the chip-like component 5 progresses. The action of suction on the back of the dicing tape suppresses rapid and excessive deformation of the dicing tape, suppresses the rapid peeling that progresses instantaneously, and causes deformation in a mode different from the deformation caused by heating, thereby relaxing peeling. It is thought that there are coexisting effects.

  The specific method of performing the suction step (5-1) during the heating step (3) is that the suction and heating are performed in the suction step (2) corresponding to the portion holding the chip-like component 5. Except for the above, it can be performed by the same procedure as in the suction step (2).

  When the suction step (5-1) is performed during the heating step (3), the suction may be completed before the completion of the heating step (3) or simultaneously with the completion of the heating step (3). You may complete | finish and may continue after completion of a heating process (3). In order to suppress the scattering of the chip-like component 5 and the like, it is preferable to keep the suction until at least the completion of the heating step (3). In the case where the suction is continued even after the heating step (3) is completed, the suction step (5-1) is performed during the heating step (3), and the suction step (after the heating step (3) described below ( Both 5-2) are performed.

  Since the suction step (5-1) is common to the suction step (2) to be performed during the heating step (3), it may be started simultaneously with the suction step (2), or the suction step (2). ) At the same time.

<Suction process (5-2)>
In the pick-up method of the present invention, after the dicing process, after completion of the heating process (3), the back surface of the dicing tape DT holding the chip-shaped component 5 and the peripheral chip 6 is made to face the suction member, and the chip-shaped dicing tape is formed. The back surface corresponding to the part holding the component 5 may be sucked. When the pickup method of the present invention is such a process, when the back surface of the dicing tape DT corresponding to the portion holding the chip-like component 5 is not fixed by suction during the heating step (3), the chip-like component is used. Although there is no effect of suppressing the scattering of 5, etc., chip peeling due to heat deformation of the dicing tape DT can be advanced to facilitate picking up. By making the pickup method of the present invention such a process, even a larger chip-like component 5 can be easily picked up without being pushed up by a push-up needle.

  When the suction step (5-2) is performed after the heating step (3), the suction step (5-2) is started after the heating step (3) is completed. Specifically, when the suction step (2) and the suction step (5-1) are performed during the heating step (3), these suction steps may be continued. In addition, after placing the back side of the dicing tape on the suction part of the suction heating device, the heating means is operated to perform the suction step (2), and without performing the suction step (5-1), the chip of the dicing tape The contact portion with the back surface corresponding to the portion holding the shaped part 5 and the peripheral chip 6 is heated, and after a sufficient time has passed for the dicing tape to deform, the heating device is stopped, and then the suction source is activated. What is necessary is just to start the suction | inhalation to the back surface corresponding to the part holding the chip-shaped component 5 of a dicing tape. In the case where the suction step (5-2) is performed after the heating step, the suction step (5-2) may be finished after the progress of peeling.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples. The pick-up property when the chip was picked up using the pick-up method was evaluated as follows.

[Pickup property]
It was evaluated 5 times whether it can peel only with a suction collet. In the table, “◯” means that the chip could be peeled off without any problem 5 times, and “Δ” means that the chip could not be peeled even once.

Example 1
<Manufacture of dicing tape>
(1) Obtained by reacting 33.6 g of methacryloyloxyethyl isocyanate with 100 g of a copolymer comprising 60 parts by weight of butyl acrylate, 20 parts by weight of methyl methacrylate, and 28 parts by weight of 2-hydroxyethyl acrylate in an organic solvent. A reaction product of 100 parts by weight of a polymer, 3 parts by weight of an ultraviolet curable reaction initiator, and 1 part by weight of a crosslinking agent (isocyanate type) was prepared.

(2) The pressure-sensitive adhesive composition obtained in the above (1) was applied onto a polyethylene terephthalate film having a thickness of 38 μm which had been subjected to a release treatment so that the thickness after drying was 10 μm, and heated at 100 ° C. for 1 minute. And dried. Subsequently, a heat-shrinkable polyethylene terephthalate film (thickness 30 μm, shrinkage rate at 120 ° C. is 50%) was bonded to the pressure-sensitive adhesive layer side on the peeled polyethylene terephthalate film to prepare a shrinkable pressure-sensitive adhesive film. .

(3) A mixture of 100 parts by weight of a copolymer comprising 80 parts by weight of butyl acrylate and 20 parts by weight of acrylic acid, 0.1 part by weight of a crosslinking agent (isocyanate type), and an organic solvent was prepared.

(4) Thickness after drying the pressure-sensitive adhesive composition prepared in (3) above on a non-shrinkable ethylene-methacrylic acid copolymer film (thickness 80 μm, shrinkage at 120 ° C. is 0.1%) Was applied to a thickness of 10 μm, heated at 100 ° C. for 1 minute and dried to prepare a non-shrinkable adhesive film. Subsequently, the adhesive layer of the non-shrinkable adhesive film was bonded to the shrinkable film substrate side of the shrinkable adhesive film prepared in (2) to prepare a dicing tape.

<Chip manufacturing and pickup>
A silicon wafer having a diameter of 8 inches and a thickness of 30 μm was attached to the adhesive surface exposed by peeling off the 38 μm-thick polyethylene terephthalate film from the dicing tape. The pressure-sensitive adhesive surface on the outer periphery of the tape was stuck and fixed to an 8-inch wafer ring frame. The wafer on the tape was diced (chip size: 12 mm × 8 mm) with a dicing apparatus (DFD651, manufactured by DISCO Corporation) to obtain chip-shaped components and peripheral chips. At the time of dicing, dicing was performed so that the wafer and the adhesive layer surface of the dicing tape were cut to a depth of 70 μm to completely cut the heat-shrinkable polyethylene terephthalate film.

After completion of dicing, the dicing tape was irradiated with ultraviolet rays (230 mW / cm ² , 190 mJ / cm ² ) using an ultraviolet irradiation device (Adwill RAD-2000m / 8, manufactured by Lintec Corporation). A suction table similar to that shown in FIG. 6 is heated to 110 ° C. to suck and fix the portion holding the chip-like component and the portion holding the peripheral chip, that is, the back of the tape corresponding to the entire wafer before cutting and separation. (Suction pressure 85 KPa (negative pressure), 60 sec). After completion of the suction, the dicing tape was taken up from the suction table. Thereby, in the case of a heating process (3), the suction process (2) and the suction process (5-1) were started simultaneously and performed. Small chip-like portions (peripheral chips) on the outer periphery of the wafer were fixed to the tape without scattering and tilting. Thereafter, the picked-up dicing tape was used to pick up chip-like components without using a pin to push up with a suction collet (AG-I / 50N-100kN, manufactured by SHIMADZU). The results are shown in Table 1.

(Example 2)
As in Example 1, tape preparation, wafer sticking, dicing, and ultraviolet irradiation (230 mW / cm ² , 190 mJ / cm ² ) were performed. The portion holding the chip-like component and the portion holding the peripheral chip on the same suction table as in Example 1, that is, the back surface of the tape corresponding to the entire wafer before cutting and separation were sucked and fixed (suction pressure 85 KPa (negative pressure)). . After the suction fixation, the same operation as in Example 1 was performed except that heating (110 ° C., 60 sec) was performed while maintaining the suction state. Thereby, in the case of a heating process (3), the suction process (2) and the suction process (5-1) were performed. Small chip-like portions (peripheral chips) on the outer periphery of the wafer were fixed to the tape without scattering and tilting. Thereafter, chip-shaped components were picked up from the picked dicing tape in the same manner as in Example 1. The results are shown in Table 1.

(Comparative Example 1)
As in Example 1, tape preparation, wafer sticking, dicing, and ultraviolet irradiation (230 mW / cm ² , 190 mJ / cm ² ) were performed. After the ultraviolet irradiation, the tape was heated (110 ° C., 60 sec) with a suction table having a structure similar to that shown in FIG. Thereafter, the back surface of the dicing tape corresponding to the portion holding the peripheral chip was sucked (suction pressure 85 KPa (negative pressure), 60 sec). Thereby, the suction process (2) was performed after the heating process (3). Small chip portions on the outer periphery of the wafer were scattered during heating. Thereafter, chip-shaped components were picked up from the dicing tape taken up from the suction table in the same manner as in Example 1. The results are shown in Table 1.

(Comparative Example 2)
As in Example 1, tape preparation, wafer sticking, dicing, and ultraviolet irradiation (230 mW / cm ² , 190 mJ / cm ² ) were performed. After the ultraviolet irradiation, the tape was heated (110 ° C., 60 sec) with a suction table similar to that shown in FIG. Next, the part holding the chip-shaped part and the part holding the peripheral chip, that is, the back surface of the tape corresponding to the whole wafer before cutting and separation were sucked to cause peeling (suction pressure 85 KPa (negative pressure), 60 sec). Thereby, the suction process (2) and the suction process (5-2) were performed after the heating process (3). Small chip portions on the outer periphery of the wafer were scattered from the tape during heating. Thereafter, chip-shaped components were picked up from the dicing tape taken up from the suction table in the same manner as in Example 1. The results are shown in Table 1.
The above results are summarized in the table below.

DT: Dicing tape 1: Non-shrinkable film 2: Shrinkable film 3: Adhesive layer 4: Adhesive layer 5: Chip-shaped component (semiconductor chip)
6: Peripheral chip 7: Ring frame SW: Plate member (semiconductor wafer)
8: Circuit 10: Vacuum suction heating device 11: Suction table 12: Vacuum lines 13, 23, 33: Heating device 14: Septum 15: Branch valve

Claims (5)

A dicing step (1) for cutting and separating a plate-like component attached to a dicing tape having a layer that is deformed by heating to obtain a plurality of chips including peripheral chips and chip-like components;
The suction member capable of sucking the dicing tape is made to face the back of the dicing tape holding the peripheral chip and the chip-shaped component,
A suction step (2) for sucking a back surface corresponding to a portion holding peripheral chips of the dicing tape;
A heating step (3) for heating to deform the tape;
From the upper surface of the chip-shaped component, the chip-shaped component is sucked and held with a suction collet, and picked up from the dicing tape (4),
A chip-shaped component pick-up method for performing suction in the suction step (2) during the heating step (3).   The pickup method according to claim 1, wherein the suction step (2) and the heating step (3) are started simultaneously.   The chip-shaped component according to claim 1 or 2, further comprising a suction step (5-1) for sucking a back surface corresponding to a portion of the dicing tape holding the chip-shaped component with a suction member during the heating step (3). Pickup method.   Furthermore, the pick-up of the chip-shaped component of Claim 1 or 2 provided with the suction process (5-2) which attracts | sucks the back surface corresponding to the part holding the chip-shaped component of a dicing tape with a suction member after a heating process (3). Method.   The pick-up method according to claim 1, wherein the plate-shaped component is a semiconductor wafer having a circuit, and the chip-shaped component is a semiconductor chip.

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