JP2012164820A - Resin molding method and resin molding device of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To equalize the molding temperature of each molding unit 4 (molding temperature of the molding unit and molding temperature of a resin molding die) efficiently, in a resin molding device 1 of an electronic component having a plurality of required number of molding units 4 mounting a compression molding die 3 (upper die 3a, lower die 3b) of the electronic component.SOLUTION: In the resin molding device of an electronic component where a plurality of required number of molding units 4 (4A, 4B, 4C) are arranged in one row, heat insulation means (resin plates 20, vacuum insulation members 30) are provided on both sides of a molding unit group 7 arranged in one row between the molding units 4. In a state where the heat insulation means (the resin plate 20, the vacuum insulation member 30) is provided in the molding unit 4, the electronic component attached to a substrate 2 is compression molded by means of the compression molding die 3 of the molding unit 4 provided in a molding device 1.

Description

  The present invention relates to a resin molding method of an electronic component and an apparatus for molding the electronic component in which an electronic component such as an IC mounted on a substrate is sealed with a resin material.

  Conventionally, an electronic component such as an IC mounted on a substrate is sealed with a resin material by a transfer molding method, a compression molding method (compression molding method), or an injection molding method (injection molding method). ing.

For example, regarding a compression molding method in which an electronic component mounted on the substrate 2 is compression molded (sealed molding) with a resin material, a resin molding apparatus 81 for an electronic component as shown in FIGS. 7 (1) and 7 (2). Using the compression molding die 3 (the upper die 3a and the lower die 3b) mounted on the substrate is performed as follows.
That is, using a compression molding die 3 (upper die 3a and lower die 3b) for electronic parts, first, the die 3 is heated by a heating means to a required die molding temperature (molding temperature), for example, 175 degrees. While heating to C, a resin material (for example, a granular resin or a liquid resin) is supplied into the lower mold cavity 16 covered with a release film (not shown).
At this time, the resin material supplied into the lower mold cavity 16 covered with the release film is heated to become a molten resin (a resin having fluidity).
Next, by tightening the compression molding die 3 (upper die 3a and lower die 3b), the electronic component mounted on the substrate 2 is immersed in the molten resin in the lower die cavity 16, and the lower die The resin in the lower mold cavity 16 is pressurized by moving the cavity bottom member 18 provided on the bottom surface of the cavity 16 upward.
Accordingly, the electronic component mounted on the substrate 2 is compression molded (sealed molded) in a resin molded body (package) corresponding to the shape of the lower mold cavity 16 in the lower mold cavity 16, and a molded product (substrate and resin molded body) is formed. ) Can be obtained.
After the time required for curing has elapsed, the mold 3 is opened to release the resin molded body from the lower mold cavity 16.

By the way, with the aim of improving the productivity of molded products (products) efficiently, the required number of molding units 4 equipped with the above-mentioned compression molding mold 3 for electronic parts are arranged in a row. A resin molding apparatus 81 for electronic parts has been studied.
For example, a resin molding apparatus 81 for an electronic component as shown in FIGS. 7A and 7B is being studied.
In this apparatus 81, three molding units 4 (4A, 4B, 4C) are arranged in a line.
That is, in this apparatus, first, in each of the molding units 4A, 4B, and 4C, the molds 3 (the upper mold 3a and the lower mold 3b) separately mounted on the molding units 4A, 4B, and 4C by the heating means. Are heated individually to the required molding temperature (molding temperature of the mold).
Next, in each of the molding units 4A, 4B, and 4C, as described above, the electronic parts mounted on the substrate 2 are individually compression-molded with a resin material using the mold 3 mounted on the unit 4 to obtain a product. (Molded product) was obtained.
In addition, since the fundamental structural member of the conventional apparatus 81 is the same as Example 1 mentioned later, the same code | symbol is attached | subjected.

Similarly to the compression molding method described above, conventionally, the electronic component mounted on the substrate 2 is sealingly molded by the transfer molding method or the injection molding method described above.
Similarly to the above-described compression molding method, conventionally, in order to seal and mold an electronic component mounted on the substrate 2, a mold for resin molding of an electronic component (electronic component by the above-described transfer molding method or injection molding method) A resin molding apparatus for electronic parts is used in which a plurality of molding units equipped with a resin molding die are arranged in a row.
Conventionally, for example, a multilayer die (for example, a double layer method) in which a plurality of compression molding dies 3 (mold assemblies) are vertically laminated is used, and a molding unit equipped with this multilayer die is used. In addition, a resin molding apparatus for electronic components arranged in a required number in a row is used.

Japanese Patent Laying-Open No. 2007-251094 (FIGS. 1 and 2) JP 2009-39985 A (FIGS. 2 and 3) Japanese Patent No. 2932136 (FIG. 4) Japanese Patent No. 2932137 (FIG. 4) Japanese Patent No. 2666041 (FIG. 4) Japanese Patent No. 4162474 (FIG. 10) JP 2010-94931 (FIG. 2, FIG. 4, paragraph 0062)

Further, as described above, in each of the molding units 4 (4A, 4B, 4C) arranged in a row, the electronic component mounted on the substrate 2 with the mold (resin molding die) 3 mounted on the molding unit 4 The product (molded product) was obtained by compression molding each with a resin material.
The mold 3 mounted in the molding unit 4 is controlled and configured to be set to a required molding temperature by a heating means.
At this time, in each of the molding units 4 (4A, 4B, 4C) arranged in a row, the molding unit 4 is heated by the heat of the mold 3 heated to a required molding temperature for each molding unit 4. (Whole) will be heated to the required unit molding temperature.
For example, the molding unit 4 (entire) is heated by conduction heat and radiant heat from the mold 3 and by convection heat of air in the unit 4.

However, although the mold 3 is controlled to be heated up to a required molding temperature by the heating means, it is easily influenced by the atmosphere of the outer periphery, and the heat of the mold affects other molding units. Yes.
That is, since the difference in the amount of heat entering and exiting each molding unit is large, the mold temperature cannot be controlled efficiently and evenly, and the temperature between the molds 3 mounted on the molding unit 4 varies and the temperature difference is large. Easy to be.
For this reason, the unit molding temperature between the units of the molding unit 4 (4A, 4B, 4C) is not uniform, and the temperature difference tends to become very large.
For example, as indicated by a line 82 (upwardly convex line) in the schematic graph in FIG. 7C, the molding units 4 (4A, 4B, 4C) arranged in a line, that is, the molding unit group 7 arranged in a line. It is known that the unit molding temperature in FIG. 1 shows a unique tendency among the respective molding units 4 (4A, 4B, 4C).
That is, when the unit molding temperatures of the molding units 4 (4A, 4B, 4C) in the molding unit group 7 arranged in a row are compared, the temperature of the molding unit 4B located at the center of the molding unit group 7 arranged in a row is adjacent thereto. It tends to be higher than the two molding units 4A and 4C.
This seems to be because the two adjacent molding units 4A and 4C are easy to cool, and the central unit 4B heats up. As a result, energy loss occurs and energy efficiency is deteriorated. It is.
This affects the temperature of the mold 3 itself mounted on the molding unit 4, and the mold molding temperature (molding temperature of the mold) mounted on the molding unit 4 is similar to the unit molding temperature. It cannot be controlled uniformly and efficiently, and variation occurs.
Further, a difference due to thermal expansion is likely to occur in the tie bar 13 in each molding unit 4, and the length of the tie bar 13 is not usually uniform among the molding units 4 in the molding apparatus 81.

Therefore, conventionally, it is desired that the molding units 4 of the molding units 7 arranged in a row or the mold 3 mounted on the molding unit 4 be molded under the same molding conditions.
For this reason, it has been demanded that the unit molding temperatures of the molding units 4 (4A, 4B, 4C) arranged in a row be made uniform (set) efficiently.

  In addition, in order to solve the above-described problem, a configuration in which the molding units 4 (4A, 4B, 4C) are installed apart from each other has been studied. However, the installation space in the factory (device footprint) can be minimized. Because of the demand, the problem of the present invention has not been solved.

In other words, in the conventional resin molding apparatus 81 for electronic parts, the unit molding temperature among the three molding units 4 (4A, 4B, 4C) is likely to vary, and the molding unit 4 (4A, 4B, 4C) There is a detrimental effect that the unit temperature cannot be equalized efficiently.
In addition, the molding temperature of the mold 3 mounted in each of the molding units 4 (4A, 4B, 4C) is likely to vary, and there is a problem that the mold molding temperature cannot be equalized efficiently. .
In the schematic graph (graph line 82) shown in FIG. 7 (3), the horizontal axis is the arrangement (horizontal axis) of the molding units 4 (4A, 4B, 4C), and the vertical axis is the unit molding temperature.

  Therefore, the present invention provides a resin for electronic parts that can efficiently equalize the molding temperature (unit molding temperature and mold molding temperature) in a plurality of required molding units provided in the resin molding apparatus for electronic parts. An object is to provide a molding method and a molding apparatus.

The resin molding method for an electronic component according to the present invention for solving the technical problem described above uses a resin molding apparatus for an electronic component including a required plurality of molding units each having a resin molding die for an electronic component, A resin molding method of an electronic component that forms a molded product by resin molding of an electronic component separately in each molding unit, the step of providing heat insulation means at a required portion of the molding unit,
And a step of resin-molding an electronic component in a state in which the molding unit is thermally insulated from each other by a heat insulating means provided at a required portion of the molding unit.

  An electronic component resin molding apparatus according to the present invention for solving the above technical problem is an electronic component resin molding apparatus provided with a plurality of molding units each having a resin molding die for an electronic component. Further, the present invention is characterized in that a heat insulating means is provided at a required portion of the molding unit.

  An electronic component resin molding apparatus according to the present invention for solving the above technical problem is an electronic component resin molding apparatus provided with a plurality of molding units each having a resin molding die for an electronic component. The plurality of required molding units are arranged adjacent to each other, and a heat insulating means is provided between the molding units.

  An electronic component resin molding apparatus according to the present invention for solving the technical problem is an electronic component resin molding apparatus comprising a plurality of required molding units each having a resin molding die for an electronic component, The required plurality of molding units are arranged in a row, and heat insulating means are provided between the respective molding units.

  In addition, a resin molding apparatus for an electronic component according to the present invention for solving the technical problem is characterized in that a heat insulating means is provided on both sides of the molding unit arranged in a row.

  An electronic component resin molding apparatus according to the present invention for solving the above technical problem is an electronic component resin molding apparatus provided with a plurality of molding units each having a resin molding die for an electronic component. The plurality of required molding units are arranged in a row, and in each of the molding units described above, heat insulating means are provided separately on the unit connection surfaces that are both side surfaces of the molding unit. To do.

  The resin molding apparatus for an electronic component according to the present invention for solving the technical problem is characterized in that the required plurality of molding units are detachably mounted.

  Moreover, the resin molding apparatus for an electronic component according to the present invention for solving the technical problem described above is characterized in that the heat insulating means is a resin plate.

  Moreover, the resin molding apparatus for an electronic component according to the present invention for solving the technical problem is characterized in that the heat insulating means is a vacuum heat insulating member having a vacuum part.

  ADVANTAGE OF THE INVENTION According to this invention, the resin of the electronic component which can equalize | mold efficiently the molding temperature (the molding temperature of a unit and the molding temperature of a shaping | molding die) in the required several molding unit provided in the resin molding apparatus of an electronic component. This provides an excellent effect that a molding method and a molding apparatus can be provided.

FIG. 1 is a schematic plan view schematically showing a resin molding apparatus for an electronic component according to the present invention (Example 1). 2 (1) is a schematic plan view schematically showing the main part of the apparatus shown in FIG. 1, and FIG. 2 (2) is a schematic front view schematically showing the apparatus shown in FIG. 2 (1). 2 (3) is a schematic graph schematically showing a tendency of unit molding temperature corresponding to the arrangement of molding units in the apparatus shown in FIG. 2 (2) (Example 1). 3 (1) is a schematic plan view schematically showing a resin molding apparatus for another electronic component according to the present invention, and FIG. 3 (2) is a vacuum heat insulating member provided in the apparatus shown in FIG. 3 (1). (Example 2) which is a schematic sectional drawing which shows these. 4 (1) is a schematic plan view schematically showing the main part of the apparatus shown in FIG. 3 (1), and FIG. 4 (2) is a schematic front view schematically showing the apparatus shown in FIG. 4 (1). FIG. 4 (3) is a schematic graph schematically showing the tendency of the unit molding temperature corresponding to the arrangement of the molding units in the apparatus shown in FIG. 4 (2) (Example 2). FIG. 5 is a schematic plan view schematically showing a resin molding apparatus for another electronic component according to the present invention (Example 3). FIG. 6 is a schematic plan view schematically showing a resin molding apparatus for another electronic component according to the present invention (Example 4). FIG. 7A is a schematic plan view schematically showing a main part of a conventional resin molding apparatus for electronic components, and FIG. 7B is a schematic front view schematically showing the apparatus shown in FIG. FIG. 7 (3) is a schematic graph schematically showing a tendency of unit molding temperature corresponding to the arrangement of the molding units in the apparatus shown in FIG. 7 (2).

According to the present invention, in a resin molding apparatus for an electronic component in which a plurality of molding units equipped with a resin molding die for electronic components are installed, a heat insulating means is provided at a required portion of the molding unit.
The heat insulating means can be provided at a required place on the outer periphery of the molding unit.
Moreover, the heat insulation means can be configured by providing, for example, a heat insulation member (heat insulation plate) as described later or a vacuum heat insulation member having a vacuum part.
Moreover, the resin molding die of the electronic component is configured so as to be arranged inside the molding unit.
That is, according to the present invention, heat (amount of heat) such as conduction heat, radiant heat, and convection heat generated in the molding unit (molding die) is insulated from the molding unit by the heat insulation means, so that it does not move to the outside from the molding unit. So that it can be cut off efficiently.
Therefore, it is possible to efficiently prevent heat from being transferred between the molding units by the heat insulating means.
For this reason, the unit molding temperature of each molding unit in the molding apparatus can be equalized efficiently, and the molding temperature of the resin molding die mounted on each molding unit can be controlled efficiently and stably. Can be set to
Therefore, according to the present invention, the molding temperature (the molding temperature of the molding unit and the molding temperature of the molding die) among the required plurality of molding units provided in the resin molding apparatus for electronic components can be equalized efficiently. A resin molding method and a molding apparatus for an electronic component can be provided.
For this reason, since each molding unit (resin molding die) can be molded under the same molding conditions, an equivalent product can be obtained efficiently.
Moreover, the difference by the thermal expansion of the tie bar which comprises a shaping | molding apparatus can be prevented efficiently, and the length of a tie bar can be made equal equally between the shaping | molding units in a shaping | molding apparatus.

In the present invention, for example, in an electronic component resin molding apparatus in which a plurality of required molding units are arranged in a row, a required number of heat insulating means are provided between the molding units of the molding unit group arranged in a row. can do.
In this case, heat insulation means can be provided on both sides of the group of molding units arranged in a row.
In addition, on the front and rear surfaces of the molding unit installed in the molding apparatus according to the present invention, and the left and right side surfaces that become the unit connection surface, for example, heat insulating means are provided on the left and right side surfaces that become the unit connection surface. Can be configured.
In this case, heat insulation means may be provided on the back surface (or front surface) of the molding unit.
In the present invention, a configuration in which a plurality of required molding units are detachably attached to each other can be employed.

That is, according to the present invention, the molding is heated by the heat of the resin mold heated by the heating means by the heat insulating means (provided on the unit connection surface) provided between the molding units arranged in a row. The heat generated from the unit can be efficiently blocked so as not to move to other molding units.
That is, heat (heat amount) is transferred from the molding unit to another molding unit by insulating heat such as conduction heat, radiation heat, and convection heat generated from the molding unit (resin molding die) with a heat insulating means. Can be cut off efficiently.
Therefore, it is possible to efficiently prevent heat from moving between the molding units by this heat insulating means.
For this reason, in the shaping | molding apparatus which concerns on this invention, the unit shaping | molding temperature of each shaping | molding unit can be equalized efficiently.
Moreover, since the unit molding temperature can be made uniform efficiently, the molding temperature of the resin molding die mounted on each molding unit can be efficiently controlled and made uniform.
Therefore, according to the present invention, the molding temperature (the molding temperature of the molding unit and the molding temperature of the molding die) among the required plurality of molding units provided in the resin molding apparatus for electronic components can be equalized efficiently. A resin molding method and a molding apparatus for an electronic component can be provided.

In the present invention, since each molding unit (resin molding die) of the molding unit group arranged in a row can be molded under the same molding conditions, an equal product can be efficiently produced by each molding unit (resin molding die). Obtainable.
In addition, as described above, according to the present invention, heat that is emitted from the molding unit to the outside can be blocked by the heat insulating means, so that energy loss can be efficiently reduced and energy efficiency can be improved efficiently. Can do.
Further, as described above, since the molding temperature between the molding units can be made uniform efficiently, the difference due to the thermal expansion of the tie bars in each molding unit can be efficiently prevented, and the length of the tie bar can be reduced. Can be made evenly and efficiently between the molding units.

First, Example 1 will be described in detail with reference to FIGS. 1 and 2 (1) to (3).
FIGS. 1 and 2 (1) to 2 (2) show an electronic component resin molding apparatus (electronic component compression molding apparatus) according to the first embodiment.
FIG. 2 (3) is a schematic graph showing the tendency of unit molding temperature according to Example 1.

(About the structure of the resin molding apparatus of the electronic component which concerns on Example 1)
As shown in FIGS. 1 and 2 (1) to 2 (2), the electronic component compression molding apparatus (resin molding apparatus for electronic components) 1 according to the first embodiment compresses the electronic component mounted on the substrate 2. A molding unit 4 equipped with a compression molding die (electronic component resin molding die) 3 for the electronic component to be performed; an in-unit 5 for supplying the molding unit 4 with a material before molding (substrate 2 before molding, resin material); An out unit 6 for accommodating a molded product (sealed substrate) taken out from the molding unit 4 is provided.
Further, in the apparatus according to the first embodiment, the required plurality (three in the illustrated example) of the molding units 4 (4A, 4B, 4C) are arranged in a row (the molding units 4 arranged in a row). A group of forming units 7) arranged in a single row.
In the illustrated example, the arrangement of the molding units 4 is shown in the order of 4A, 4B, and 4C from the left side to the right side, and the molding units 4 are arranged adjacent to each other.
Further, in the molding unit 4, 10a is a front surface, 10b is a back surface, 10c is a left side surface, and 10d is a right side surface in a horizontal plane.
It should be noted that the required plurality of molding units 4 (4A, 4B, 4C) can be detachably installed.

Further, an in-unit 5 is detachably provided on one side of the required plurality of molding units 4 (molded unit group 7 arranged in a row), and is output to the other side of the required plurality of molding units 4, 7. A unit 6 is detachably provided.
That is, the in-unit 5 and the out unit 6 are provided on both sides of the required plural molding units 4 (molding unit group 7 arranged in a row) (in-out separation type).
In the illustrated example, an in unit 5 is provided on the left side surface 10c of the molding unit 4A, and an out unit 6 is provided on the right side surface 10d of the molding unit C.

In addition, the apparatus 1 according to the first embodiment includes an inloader 8 that conveys the pre-molding material (2) from the in unit 5 to the molding unit 4, and an outloader 9 that conveys the molded product from the molding unit 4 to the out unit 6. Is provided.
Further, the pre-molding material (2) engaged with the inloader 8 is supplied from the front surface 10a of the molding unit 4, and the molded product is taken out from the rear surface 10d of the molding unit 4 by the outloader 9. .
Further, the two side surfaces (left side surface 10c, right side surface 10d) of the molding unit are configured to be detachably mounted (connected) to the adjacent molding unit. The two side surfaces (left side surface) 10c, the right side surface 10d) is a unit connection surface.
Therefore, in Example 1, the pre-molding material (pre-molding substrate 2, resin material) is engaged with the inloader 8, and the pre-molding material (2) can be supplied from the in-unit 5 to each molding unit 4. It is configured as follows.
Further, it is configured such that a molded product compression-molded separately by each molding unit 4 can be taken out by the outloader 9 and accommodated in the out unit 9.
In addition, in FIG. 1, you may employ | adopt the structure which makes the inloader 8 and the outloader 9 run on the front surface 10a side in the molding unit group 7 (each molding unit 4A, 4B, 4C) arranged in a row.

(Regarding the configuration of the molding unit according to Example 1)
That is, the molding unit 4 includes an upper fixed platen 11, a lower fixed platen 12, a required number of tie bars (four in the illustrated example) 13 fixed to the upper fixed platen 11 and the lower fixed platen 12, and tie bars (posts). ) 13 is provided so as to be slidable up and down, and a moving board 14 is provided.
An electronic component compression molding die (electronic component resin molding die) 3 mounted on the molding unit 4 includes an upper die 3a and a lower die 3b disposed opposite to the upper die 3a.
The upper die 3 a is provided on the lower surface of the upper fixed platen 11, and the lower die 3 b is provided on the upper surface of the movable platen 14.
Further, a mold clamping mechanism 15 is disposed on the upper surface of the lower fixed platen 12, and the mold platen of the upper mold 3a and the mold surface of the lower mold 3b are moved by moving the movable platen 14 upward by the mold clamping mechanism 15. The mold surface of the upper mold 3a and the mold surface of the lower mold 3b are separated from each other by moving the moving plate 14 downward by the mold clamping mechanism 15. The mold can be opened.

(Configuration of mold for compression molding of electronic parts according to embodiment 1)
That is, as shown in the figure, an electronic component compression molding mold (resin molding die for electronic components) 3 mounted on a molding unit 4 includes an upper die 3a, a lower die 3b, and a lower die cavity. 16, a substrate setting portion 17 of the upper die 3a, a cavity bottom member 17 provided on the bottom surface of the lower die cavity 16, heating means (not shown) provided on the upper die 3a and the lower die 3b, A control mechanism (not shown) for controlling the mold 3 (upper mold 3a, lower mold 3b) to a required molding temperature is provided.
Accordingly, at least the mold (molding die) 3 mounted on the molding unit 4 is heated to a required molding temperature by the heating means by the control mechanism.
In Example 1, a release film coated in the lower mold cavity 16 may be used.

That is, in the mold 3 mounted on the molding unit 4 in the electronic component compression molding apparatus 1 according to the first embodiment, first, a resin material (for example, a granular resin material or a liquid resin material) is supplied into the lower mold cavity 16. And heat.
Next, by clamping the mold 3, the electronic component mounted on the substrate 2 supplied and set to the upper mold substrate setting portion 17 is immersed in the molten resin (resin having fluidity) in the lower mold cavity 16. To do.
Next, the resin in the lower mold cavity 16 can be pressurized by the cavity bottom surface member 18.
Therefore, an electronic component can be sealed and molded in a resin molded body (package) corresponding to the shape of the lower mold cavity 16 to obtain a molded product (substrate 2 and resin molded body).
After the time required for curing has elapsed, the mold (upper mold and lower mold) is opened to release the resin molded body (solidified resin) from the upper mold cavity by an appropriate mold release means. .

(About the heat insulation member concerning Example 1)
The required place of the molding unit 4 in the molding apparatus 1 according to the present invention is provided with heat insulation means.
As will be described later, this heat insulating means insulates the molding units 4 or keeps the molding units 4 themselves warm.
That is, a heat insulating member (heat insulating plate) 20 is provided as a heat insulating means at a required portion of the molding unit 4 in the molding apparatus 1 shown in the first embodiment.
For example, a heat insulating member (heat insulating plate) 20 can be provided as a heat insulating means between the respective forming units 4 (one row arrangement of forming unit group 7; 4A, 4B, 4C) shown in the first embodiment. .
Further, heat insulating members (heat insulating plates) 20 are provided on both sides of the molding unit group 7 arranged in a row, that is, on the in-unit 5 side (10c) of the molding unit 4A and on the out unit 6 side (10d) of the molding unit 4C. Each is provided separately.

Further, in each of the molding units 4 in the first embodiment, a heat insulating member (heat insulating plate) 20 is separately provided on both side surfaces (unit connection surfaces) 10c and 10d excluding the unit front surface 10a and the unit rear surface 10b. ing.
Further, the heat insulating plate 20 of the molding unit 4 is configured to cover the entire surface of the unit connection surfaces 10c and 10d, and is provided in a state of being attached between the upper fixed platen 11 and the lower fixed platen 12. ing.
For this reason, the two heat insulating plates 20 are provided between the molding units 4 so as to overlap each other.
Moreover, in each shaping | molding unit 4 (4A, 4B, 4C) of the apparatus 1 shown in Example 1, the heat insulation member (heat insulation board) 20 is provided in the state which affixed separately on both unit connection surfaces 10c and 10d, and is comprised. Has been.
Accordingly, the first embodiment is configured by the molding units 4 provided with the heat insulating members (heat insulating plates) 20 on both unit connection surfaces 10c and 10d are mounted in a row (detachable).

(About the effect in Example 1)
In Example 1, the heat generated from the molding unit 4 heated by the heat of the mold 3 heated by the heating means in the heat insulating plate 20 provided between the molding units 4 is converted into the adjacent molding unit. 4 so that it can be blocked efficiently so as not to move.
That is, since heat generated in the molding unit 4 (mold 3) can be efficiently blocked by the heat insulating plate 20 provided on the unit connection surfaces 10c and 10d, for example, conduction heat, Heat transfer due to radiant heat and convection heat can be efficiently prevented.
Therefore, the heat insulating plate 20 can efficiently prevent heat from moving between the adjacent molding units 4.
Therefore, according to Example 1, each molding unit 4 (4A, 4B, 4C) in the apparatus 1 is schematically shown as a graph line 19 (horizontal line) in the graph of FIG. ) Unit molding temperature can be made uniform efficiently.
Further, since the unit molding temperature can be made uniform efficiently, the molding temperature of the mold 3 mounted on each molding unit 4 can be controlled efficiently and made uniform.
Therefore, according to Example 1 (the present invention), the molding temperature (the molding temperature of the molding unit 4) between the required plurality of molding units 4 provided in the resin molding apparatus (electronic component compression molding apparatus) 1 for electronic components. In addition, it is possible to provide a resin molding method and a molding apparatus for an electronic component that can efficiently equalize the molding temperature of the molding die 3).

Further, as described above, according to the first embodiment, the heat that is emitted from the molding unit 4 to the outside can be blocked by the heat insulating plate 20, so that the energy loss can be efficiently reduced and the energy efficiency is efficiently improved. It can be improved.
Further, as described above, since the molding temperature between the molding units 4 (4A, 4B, 4C) can be made equal, the difference due to the thermal expansion of the tie bar 13 in each molding unit can be efficiently prevented. Thus, the length of the tie bars 13 can be made uniform efficiently between the molding units 4 (4A, 4B, 4C) in the molding apparatus.

Next, Example 2 will be described in detail.
FIG. 3A and FIG. 4A to FIG. 4B are an electronic component resin molding apparatus (electronic component resin sealing molding apparatus) according to the second embodiment.
FIG. 3B is a vacuum heat insulating member.
FIG. 4 (3) is a schematic graph showing the tendency of the unit molding temperature according to Example 1.

(About the structure of the resin molding apparatus of the electronic component which concerns on Example 2)
As shown in FIG. 3 (1) and FIGS. 4 (1) to (2), the electronic component resin sealing molding apparatus (resin molding apparatus for electronic parts) 21 according to Example 2 was mounted on the substrate 2. A molding unit 23 on which a mold for resin sealing molding of an electronic component (resin molding die for electronic component) 22 for resin sealing molding of an electronic component is mounted, and a material before molding (substrate 2 before molding, resin material) on the molding unit 23 ) And an in / out unit 24 that accommodates a molded product (sealed substrate) taken out from the molding unit 23.
In addition, in the apparatus 21 according to the second embodiment, a required plurality (four in the illustrated example) of the molding units 23 (23E, 23F, 23G, 23H) are arranged in a row with respect to the in / out unit 24 (detachable). Arranged and configured.

Further, in the molding unit 23 (23E, 23F, 23G, 23H) shown in Example 2, as in Example 1, when viewed in a horizontal plane, 25a is a front surface, 25b is a back surface, and 25c is a left side surface. 25d is the right side surface.
In the illustrated example, the arrangement of the molding unit 23 is indicated by 23E, 23F, 23G, and 23H in order from the left side to the right side, and the in-out unit 24 is provided on the left side surface 25c of the molding unit 24E.
Further, in the apparatus 21 according to the second embodiment, as in the first embodiment, the inloader 8 that transports the pre-molding material (2) from the in-out unit 24 to the molding unit 23, and the molding unit 23 to the in-out unit 24. An outloader 9 for conveying a molded product (the substrate 2 and the resin molded body) is provided and configured.
The pre-molding material (2) attached to the inloader 8 is supplied from the back surface 25d of the molding unit 23, and the molded product is taken out from the front surface 25a of the molding unit 23 by the outloader 9. ing.
The two side surfaces (the left side surface 25c and the right side surface 25d) are unit connection surfaces.
Further, the two side surfaces (the left side surface 25c and the right side surface 25d) of the molding unit 23 are configured to be detachably mounted (connected) to the adjacent molding unit 23.
Therefore, in Example 2, the pre-molding material (pre-molding substrate 2, resin material) is engaged with the inloader 8 and is transferred from the in-out unit 24 to each molding unit 23 (23E, 23F, 23G, 23H) before molding. It is comprised so that material (2) can be supplied.
In addition, each molded unit 23 (23E, 23F, 23G, 23H) is configured to be able to take out molded products individually molded with resin sealing by the outloader 9 and store them in the in-out unit 24.

(Regarding the configuration of the molding unit according to Example 2)
In addition, the configuration of the molding unit 23 (23E, 23F, 23G, 23H) shown in the second embodiment is basically the same as that of the first embodiment, and includes a resin sealing molding die 22 and an upper fixing. The board 11, the lower fixed board 12, the tie bar 13, the moving board 14, and the mold clamping mechanism 15 are provided.
Therefore, in the second embodiment, similarly to the first embodiment, the mold clamping mechanism 15 can clamp the mold 22 and open the mold 22.

(About the structure of the resin sealing molding die of the electronic component which concerns on Example 2)
That is, the mold shown in the second embodiment is a mold 22 formed by a transfer mold method, and includes an upper mold 22a and a lower mold 22b arranged to face the upper mold 22a.
Further, the mold 22 (upper mold 22a and lower mold 22b) shown in the second embodiment includes an upper mold cavity, a lower mold cavity 26 provided on the upper mold cavity, and a lower mold substrate setting portion (for setting). Recess), a lower mold pot 27 for supplying resin material, a plunger 28 for resin pressurization that slides up and down in the lower mold pot 27, a heating means provided in the mold 22, and when the mold 22 is clamped Resin passages (calves, gates, runners) that connect the upper and lower cavities (26) and the pots 27 are provided.
The control mechanism is configured to heat at least the mold 22 mounted on the molding unit 23 to a required molding temperature.

That is, by using an electronic component resin molding apparatus 21 equipped with an electronic component resin sealing molding die (electronic component resin molding die) 22, first, a resin material (for example, supplied into the lower mold pot 27 (for example, , The resin tablet) is heated and melted, and the molten resin in the lower mold pot 27 is pressurized with the plunger 28 for pressurizing the resin, whereby the upper and lower cavities in which the electronic components mounted on the substrate 2 are fitted and set ( 26) It is injected and filled through resin passages (cal, runner, gate).
Therefore, next, an electronic component mounted on the substrate 2 is sealed and molded in a resin molded body corresponding to the shape of the upper and lower cavities (26) in the upper and lower cavities (26) to form a molded product (the substrate 2 and the resin molded body). Obtainable.
After the time necessary for curing has elapsed, the mold 22 (upper mold 22a and lower mold 22b) is opened to remove the resin molded body (package) from the upper and lower cavities (26) with an appropriate release means (for example, , Ejector pin).

(Vacuum insulation member according to Example 2)
Further, in the apparatus 21 according to the second embodiment, similarly to the first embodiment, the vacuum heat insulating member 30 can be separately provided as a heat insulating means at a required portion of the molding unit 23.
For example, a vacuum heat insulating member 30 can be provided as a heat insulating unit between the forming units 23 (unit connection surfaces 25c and 25d of the forming unit 23) shown in the second embodiment.
That is, the vacuum heat insulating member 30 can be provided between the right side surface 25d of the molding unit 23E and the left side surface 25c of the molding unit 23F.
Furthermore, a vacuum heat insulating member 30 can be provided as a heat insulating means on both sides of the group of forming units 29 (23E, 23F, 23G, 23H) arranged in a row.
As shown in FIG. 4 (2), for example, the vacuum heat insulating member 30 is located at the lower end position between the molding unit 23F and the molding unit 23G (in the mold open state). You may comprise by providing in the covered state between the moving boards 14.

(About the structure of the vacuum heat insulation member which concerns on Example 2)
Moreover, the vacuum heat insulating member 30 is a partition part which has a required space | interval between the two sheets 31 (31a, 31b), for example by closing the outer periphery of the two sheets 31 (31a, 31b) of the same size (Hollow part) is formed, and the inside of the partition walls is shut off to the outside air to form a vacuum part 32 having a required degree of vacuum. This vacuum part 32 has a heat insulating action.
Moreover, in the vacuum heat insulating member 30, the inner surface or outer surface of the sheet 31 (31a, 31b) can be a mirror surface.
It is comprised so that heat can be reflected in the mirror surface of this sheet | seat 31 (31a, 31b), and it is comprised so that heat can be reflected.
Moreover, in the vacuum heat insulating member 30, the heat insulating performance can be improved by loading the inside (vacuum part 32) with a heat insulating material 33 such as glass wool or hard urethane foam.
Moreover, in the vacuum heat insulating material 30, the closed cells formed inside the rigid urethane foam can be formed in a vacuum state.

(About the effect in Example 2)
In the second embodiment, the same effect as that of the first embodiment can be obtained.
That is, the vacuum heat insulating member (heat insulating means) 30 provided between the molding units 23 (provided on the unit connecting surfaces 25c and 25d) is heated by the heat of the mold 22 heated by the heating means. In order not to move the heat generated (radiated) from the forming unit 23 to the adjacent forming unit 23, for example, the heat transfer by conduction heat, radiant heat, and convection heat can be efficiently blocked. Has been.
Therefore, the vacuum heat insulating member 30 can efficiently prevent heat from moving between the adjacent molding units 23.
For this reason, according to Example 2, unit molding of each molding unit 23 (23E, 23F, 23G, 23H) in the apparatus 21, as schematically indicated by the graph line 34 in the graph of FIG. The temperature can be equalized efficiently.
Further, since the unit molding temperature can be made uniform efficiently, the molding temperature of the mold 22 mounted on each molding unit 23 can be controlled efficiently and can be made uniform.
Therefore, according to Example 2 (the present invention), the molding temperature (the molding temperature of the molding unit 23 and the molding temperature of the molding die 22) between the required plurality of molding units 23 provided in the resin molding apparatus 21 for electronic components. It is possible to provide a resin molding method and a molding apparatus for an electronic component that can efficiently equalize the above.

Further, as described above, according to the second embodiment, the heat that is emitted from the molding unit 23 to the outside can be blocked by the vacuum heat insulating member 30, so that energy loss can be efficiently reduced and energy efficiency is improved. It can be improved well.
Further, as described above, since the molding temperature between the molding units 23 can be made uniform efficiently, a difference due to thermal expansion of the tie bar 13 in each molding unit 23 can be efficiently prevented, and the length of the tie bar 13 can be increased. Therefore, it is possible to efficiently equalize the molding units 23 in the molding apparatus 21.

Next, Example 3 will be described in detail.
FIG. 5 illustrates a resin molding apparatus for an electronic component according to the third embodiment.
FIG. 5 shows a resin molding apparatus for an electronic component in which a molding unit equipped with a compression molding die is detachably mounted.
In FIG. 5, a loader is used which serves both as a mechanism for transporting and supplying the material before molding to the molding unit and a mechanism for taking out and transporting the molded product from the molding unit, and the loader moves between the molding units. It is a configuration.
Further, in each of the molding units, heat insulating means is provided on three surfaces (for example, the rear surface excluding the front surface and the left and right side surfaces).

[Regarding the resin molding apparatus for electronic parts shown in Example 3]
That is, an electronic component resin molding apparatus (electronic component compression molding apparatus) 41 shown in FIG. 5 has two compression molding cavities 42 (compression molding cavity 16 and cavity bottom member 18). , A substrate set unit), an in-out unit 44 that is loaded with a pre-molding material (for example, the substrate (2), a resin material) and accommodates a molded product, and the in-out unit 44 to the molding unit 43. And a loader 45 for supplying a pre-molding material and taking out a molded product from the molding unit 43 (also used).

(About the arrangement of the molding unit shown in Example 3)
In the arrangement of the molding unit 43 of the apparatus 41 shown in FIG. 5, four molding units 43 (43J, 43K, 43L, 43M) are arranged on one side (right side in the example) of the in-out unit 44 in two rows and two columns. Are arranged and configured.
Accordingly, the two molding unit groups 43J and 43K connected and arranged in the row direction (left and right in the example) and the two molding unit groups 43L and 43M connected and arranged in the row direction are between the two groups. A moving area of the loader 45 is set in the row direction.
Further, the loader 45 can supply the pre-molding material and take out the molded product separately from the front surface 46a for each of the four molding units 43 (43J, 43K, 43L, 43M). It is configured.
In the apparatus 41 shown in FIG. 5, the molding unit 43 (43J, 43K) and the molding unit 43 (43L, 43M) are configured to be detachable in the row direction (right direction in the example). ing.
Further, the loader 45 shown in FIG. 5 enters and exits from the front surface 46a on the loader moving area side of the molding unit 43 (43J, 43K, 43L, 43M).

(Insulation means and operational effects shown in Example 3)
Further, on the three surfaces of the molding unit 43 (43J, 43K, 43L, 43M) of the apparatus shown in FIG. 5 (excluding the front surface 46a, on the back surface 46b, the left side surface 46c, and the right side surfaces 46d), heat insulating means 47 (heat insulating member) 20, a vacuum heat insulating member 30) is provided.
Therefore, in the third embodiment, the above-described heat insulation means 47 can provide the same operational effects as those of the respective embodiments described above.
That is, between the molding units 43 in Example 3, that is, the mold heated by the heating means by the heat insulating means 47 (heat insulating member 20 and vacuum heat insulating member 30) provided on the unit connection surfaces 46c and 46d. The heat generated from the molding unit 43 heated by heat can be efficiently blocked so as not to move to the adjacent molding unit 43.
Therefore, the heat insulating means 47 can efficiently prevent heat from moving between the adjacent molding units 43.
For this reason, according to Example 3, the unit molding temperature of each molding unit 43 in the apparatus 41 can be made uniform efficiently.
Further, since the unit molding temperature can be made uniform efficiently, the molding temperature of the mold 42 mounted on each molding unit 43 can be controlled efficiently and can be made uniform.
Therefore, according to the third embodiment, the molding temperature (the molding temperature of the molding unit and the molding temperature of the molding die) between the required plurality of molding units 43 provided in the resin molding apparatus for electronic components can be made uniform efficiently. It is possible to provide a resin molding method and a molding apparatus for electronic parts that can be manufactured.

Next, Example 4 will be described in detail.
FIG. 6 illustrates an electronic component resin molding apparatus according to the fourth embodiment.
FIG. 6 shows a resin molding apparatus for an electronic component in which a molding unit equipped with a resin sealing molding die (transfer system) is detachably mounted.
In FIG. 6, a loader is used which serves both as a mechanism for supplying the pre-molding material to the molding unit and a mechanism for taking out the molded product from the molding unit, and the dual loader moves between the molding units.
Further, in each of the molding units, heat insulating means is provided on three surfaces (for example, the rear surface excluding the front surface and the left and right side surfaces).

6 includes a resin sealing molding die 52 (resin molding cavity 26, pot 27, plunger 28, substrate setting unit). ) Is mounted, an in / out unit 54, and a dual-purpose loader 55 are provided.
In addition, regarding the arrangement of the molding unit 53 of the apparatus 51 shown in FIG. 6, four molding units 53 (53P, 53Q, 53R, 53S) are arranged in two rows and two columns on both sides of the in-out unit (left and right sides in the illustrated example). Is arranged and configured.
Further, in the apparatus 51 shown in FIG. 6, the molding unit 53 (53P, 53Q, 53R, 53S) is configured to be detachable in the row direction (left direction or right direction in the figure). .
Therefore, similarly to the apparatus 41 shown in FIG. 5, the molding units 53P and 53R arranged in the row direction (row arrangement) or between the molding units 53Q and 53S arranged in a row are arranged. , The movement area of the loader 55 is set in the row direction.
Further, each of the four molding units 53 (53P, 53Q, 53R, 53S) is configured such that the loader 55 can supply the pre-molding material and take out the molded product.
Further, the loader 55 shown in FIG. 6 enters and exits from the front surface 56a on the loader moving area side of the molding unit 53 (53P, 53Q, 53R, 53S).
Further, on three surfaces (excluding the front surface 56a, on the back surface 56b, the left side surface 56c, and the right side surface 56d) of the molding unit 53 (53P, 53Q, 53R, 53S) of the apparatus 51 shown in FIG. A member 20 and a vacuum heat insulating member 30) are provided.

Regarding the arrangement of the molding units 53 in the apparatus 51 shown in the fourth embodiment, each molding unit 53 has a moving area of the in-out unit 54 or the loader 55 in between them as compared with the respective embodiments described above. Although they are arranged slightly apart from each other, conventionally, the molding temperature (the molding temperature of the molding unit and the molding temperature of the molding die) could not be equalized efficiently.
However, in Example 4 (the present invention), the heat insulating means 57 can be provided on the three surfaces of the molding unit 53 of the device 51 (for example, the back surface 56b excluding the front surface 56a and the left and right side surfaces 56c, 56d).
Therefore, in the fourth embodiment, the above-described heat insulation means 57 can provide the same functions and effects as those of the above-described embodiments.

That is, the molding unit 53 heated by the heat of the mold 52 heated by the heating means by the heat insulating means 57 (the heat insulating member 20 and the vacuum heat insulating member 30) provided in the molding unit 53 in the fourth embodiment. It is comprised so that the heat | fever generated from can be interrupted | blocked efficiently so that it may not move to the shaping | molding unit 53. FIG.
Therefore, heat transfer between the molding units 53 can be efficiently prevented by the heat insulating means 57 (the heat insulating member 20 and the vacuum heat insulating member 30) installed on the three surfaces of the molding unit 53.
For this reason, according to Example 4, the unit molding temperature of each shaping | molding unit 53 in the apparatus 51 can be equalized efficiently.
Further, since the unit molding temperature can be made uniform efficiently, the molding temperature of the mold 52 mounted on each molding unit 53 can be controlled efficiently and made uniform.
Therefore, according to the fourth embodiment, the molding temperature (the molding temperature of the molding unit and the molding temperature of the molding die) between the plurality of required molding units 53 provided in the resin molding apparatus for electronic components can be made uniform efficiently. It is possible to provide a resin molding method and a molding apparatus for electronic parts that can be manufactured.

  Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as appropriate as necessary without departing from the spirit of the present invention.

(Insulation plate material)
Moreover, in each above-mentioned Example, the heat insulation member (heat insulation board) 20 can be used as a heat insulation means.
As this heat insulating plate (20), a resin plate (a plate member made of resin) can be used, and as a material for forming the resin plate, a thermosetting resin or a thermoplastic resin having heat resistance can be used.
Examples of the thermosetting resin include an epoxy resin, a silicon resin, a phenol resin, a melamine resin, a polyester resin, and a diallyl phthalate resin.
Moreover, a metal plate can be used as a material which forms a heat insulation board (20).
About the heat insulation by this metal plate, the heat reflective effect | action in the surface of a metal plate can be utilized.
Examples of the material of the metal plate include iron, copper, gold, silver, aluminum, zinc, tin, and stainless steel.

  Moreover, in each above-mentioned Example, it can comprise by providing the vacuum heat insulation member which has a vacuum part as mentioned above as a heat insulation means.

(About the configuration using a release film)
Further, in each of the above-described embodiments, it is possible to employ a configuration in which a mold release film is coated on the inner surface of the molding cavity, and a resin is supplied or injected into the cavity coated with the mold release film.

(Configuration using forced exhaust means)
Further, in each of the above-described embodiments, before the electronic component mounted on the substrate in the molding cavity is sealed with a resin material, first, at least the molding cavity is formed in an outside air blocking state, and the outside air blocking is performed. It is possible to employ a configuration in which the inside of the cavity is set to a required vacuum degree by forcibly exhausting the air in the cavity in a state by forced exhaust means such as a vacuum pump.

(Regarding a configuration using a laminated type)
Further, in each of the above-described embodiments, a configuration in which one resin molding die (mold assembly) is mounted on one molding unit is illustrated. However, a plurality of required resin molding dies are stacked vertically in one molding unit. A configuration in which the laminated type is provided may be employed.

(Other mounting positions in the heat insulation means)
In each of the above-described embodiments, heat insulating means (for example, the above-described heat insulating member (heat insulating plate) or vacuum heat insulating member) can be provided at a required portion of the molding unit.
Further, in each of the above-described embodiments, heat insulating means can be provided at required portions on the front surface, the back surface, and the left and right side surfaces of the molding unit.
For example, heat insulation means can be provided on the rear surface and the left and right side surfaces of the molding unit, excluding the front surface of the molding unit.

Moreover, in each above-mentioned Example, the structure which provides the heat insulation means 20 can be employ | adopted in the surface except the work area | region (vertical surface) in which the inloader 8 enters / exits in the front surface of a shaping | molding unit [FIG. 2 (2). In the illustrated example, the heat insulating means 20 is indicated by a two-dot chain line in the molding unit 4A. ].
Further, in each of the above-described embodiments, a configuration in which the heat insulating means 20 is provided on the surface excluding the work area (vertical surface) where the outloader 9 enters and retreats on the rear surface of the molding unit is adopted, similarly to the front surface of the molding unit. be able to.

  In each of the above-described embodiments, the heat insulating means is provided on the top surface (upper surface of the upper fixed platen 11) side of the molding unit 4 or on the bottom surface (lower surface of the lower fixed platen 12) side of the molding unit 4. You may do it.

  In each of the above-described embodiments, a configuration in which at least one of the heat insulating means provided between the respective molding units 4 is omitted can be employed.

(About resin materials that seal electronic components)
In each of the above-described embodiments, a thermosetting resin material or a thermoplastic resin material may be used.
In each of the above-described embodiments, for example, a granular resin material (granular resin), a powdery resin material (powder resin) having a required particle size distribution, a powdery resin material (powder resin), and a paste Various resin materials such as a solid resin material such as a resin material (paste resin), a tablet-like resin material (tablet resin), and a liquid resin material (liquid resin) can be employed.
In each of the above embodiments, for example, a silicon-based resin material (silicone resin) or an epoxy-based resin material (epoxy resin) can be used.
In each of the above-described embodiments, various resin materials such as a resin material having transparency, a resin material having translucency, a phosphorescent material, and a resin material containing a fluorescent substance can be used.

1. Electronic parts compression molding equipment (resin molding equipment for electronic parts)
2 Pre-molding substrate (substrate)
3 Mold for compression molding (resin mold)
3a Upper mold 3b Lower mold 4 Molding unit 4A Molding unit 4B Molding unit 4C Molding unit 5 In unit 6 Out unit 7 Molded unit group arranged in one row 8 Inloader 9 Outloader 10a Front 10b Rear 10c Left side (unit connection surface)
10d Right side (unit connection side)
11 Upper fixed platen 12 Lower fixed platen 13 Tie bar (post)
14 Moving plate 15 Clamping mechanism 16 Lower mold cavity 17 Substrate setting part 18 Cavity bottom member 19 Graph line 20 Thermal insulation member (thermal insulation plate)
21 Resin sealing molding equipment for electronic parts (resin molding equipment for electronic parts)
22 Resin sealing mold (resin mold)
22a Upper mold 22b Lower mold 23 Molding unit 23E Molding unit 23F Molding unit 23G Molding unit 23H Molding unit 24 In-out unit 25a Front surface 25b Rear surface 25c Left side surface 25d Right side surface 26 Lower mold cavity 27 Pot 28 Plunger 29 One-row arrangement of molding unit group 30 Vacuum insulation member 31 Sheet 31a Sheet 31b Sheet 32 Vacuum part (hollow part)
33 Insulating Material 34 Graph Line 41 Electronic Component Compression Molding Device (Electronic Component Resin Molding Device)
42 Mold for compression molding (resin mold)
43 molding unit 43J molding unit 43K molding unit 43L molding unit 43M molding unit 44 in-out unit 45 loader 46a front surface 46b rear surface 46c left side surface 46d right side surface 47 heat insulation means 51 resin sealing molding apparatus for electronic parts (resin molding apparatus for electronic parts) )
52 Mold for Resin Sealing Mold (Resin Mold)
53 molding unit 53P molding unit 53Q molding unit 53R molding unit 53S molding unit 54 in-out unit 55 loader 56a front surface 56b back surface 56c left side surface 56d right side surface 57 heat insulation means

Claims (9)

Resin for electronic parts forming a molded product by resin molding of electronic parts individually in each molding unit using a resin molding apparatus for electronic parts provided with a plurality of molding units having a resin mold for electronic parts A molding method,
Providing a heat insulating means at a required portion of the molding unit described above;
And a step of resin-molding the electronic component in a state in which the molding unit is thermally insulated from each other by a heat insulating means provided at a required portion of the molding unit.   An electronic component resin molding apparatus comprising a plurality of molding units each having a resin molding die for an electronic component, wherein the electronic component is configured by providing heat insulating means at a required portion of the molding unit. Resin molding equipment.   An electronic component resin molding apparatus comprising a plurality of molding units each having a resin molding die for an electronic component, wherein the required plurality of molding units are arranged adjacent to each other and between the molding units. A resin molding apparatus for electronic parts, characterized in that a heat insulating means is provided on the electronic part.   An electronic component resin molding apparatus provided with a plurality of molding units each having a resin molding die for an electronic component, wherein the plurality of molding units are arranged in a row, and heat insulating means is provided between the molding units. A resin molding apparatus for electronic parts, comprising:   5. The resin molding apparatus for an electronic component according to claim 4, wherein heat insulation means is provided on both sides of the molding units arranged in a row.   A resin molding apparatus for an electronic component comprising a plurality of molding units each having a resin molding die for an electronic component, wherein the plurality of molding units are arranged in a row, and in each of the molding units described above, A resin molding apparatus for electronic parts, characterized in that a heat insulating means is provided on each of the unit connection surfaces which are both side surfaces of the molding unit.   The resin molding apparatus for an electronic component according to claim 4, wherein the required plurality of molding units are detachably installed.   The electronic component resin molding apparatus according to claim 2, 3, 4, 5, or 6, wherein the heat insulating means is a resin plate.   The resin molding apparatus for an electronic component according to claim 2, claim 3, claim 4, claim 5, or claim 6, wherein the heat insulating means is a vacuum heat insulating member having a vacuum part.

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