JP2012163525A - Temperature measuring instrument, deposition device and deposited substrate manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a temperature measuring instrument with improved heat insulation capacity and improved heat resistance, a deposition device equipped with the same and a deposited substrate manufacturing method using the same.SOLUTION: A temperature measuring instrument resists heat by keeping a logger 2, which logs a signal from a temperature detection part 1, in an inner container 3 and by keeping the inner container 3 in outer containers 4 to 6. The outer containers 4 to 6 comprise multiple wall bodies including space portions at prescribed intervals in a board thickness direction, which reduce heat conduction between adjacent wall bodies in the board thickness direction. Similarly, a space portion is formed between the outer container 4 and the inner container 3, and a space portion is formed between the inner container 3 and the logger 2. Moreover, the wall bodies of the outer containers are formed with materials with higher heat conductivity and smaller heat capacity than the material of the inner container. As a result, since heat received at the outer containers is transferred within the same wall bodies and is homogenized, generation of a local hot section is prevented.

Description

  The present invention relates to a temperature measuring device, a film forming apparatus, and a film forming substrate manufacturing method.

  2. Description of the Related Art Conventionally, for example, a film forming apparatus that performs substrate processing in a vacuum chamber heats or cools the inside of the chamber and measures the temperature in the chamber. Therefore, a temperature measurement sensor is fixed to the chamber. And since the inside of the vacuum chamber which performs a film-forming process is a high temperature environment, it is necessary to protect sensors with a heat insulating material.

  As a heat insulation technique in a vacuum environment, a multilayer heat insulation blanket described in Patent Document 1 below is known. In the technique described in Patent Document 1, for the purpose of improving heat insulation performance, for example, by laminating films deposited with metal, heat transfer due to radiation is suppressed.

JP 2004-251369 A

  Here, in the manufacturing process of the deposition substrate, it is required to measure the temperature history of the substrate as part of quality control. Since the temperature sensor fixed to the chamber can only measure the temperature in the vicinity of the installation part, it is difficult to measure the temperature history of the moving substrate. In addition, since the temperature in the film forming chamber becomes a high temperature environment, improvement in heat insulation performance is required. The conventional heat insulation structure has a problem that it cannot withstand a high temperature environment, the recording unit connected to the sensor is broken, and the temperature history cannot be measured.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a temperature measuring instrument with improved heat insulation performance and improved heat resistance temperature.

  In addition, the present invention is made to solve the above-described problems, and includes a temperature measuring instrument with improved heat insulation performance and improved heat resistant temperature, and can measure the temperature history of the substrate. An object of the present invention is to provide a possible film forming apparatus.

  Another object of the present invention is to provide a method for manufacturing a film-formed substrate that can measure the temperature history of the substrate.

  The temperature measuring device according to the present invention is a temperature measuring device in which a recording unit for recording a signal relating to temperature is accommodated in a heat insulating container, and the heat insulating container forms a gap between the recording unit and accommodates the recording unit. A gap between the inner container and the outer container. The outer container wall body has a higher thermal conductivity than the inner container material. And it is formed by the material with small heat capacity.

  In such a temperature measuring device, a recording unit for recording a signal output from the temperature detection unit is accommodated in the inner container, and the inner container is insulated by being accommodated in the outer container. Specifically, since the gap portion is provided between the outer container and the inner container and the gap portion is provided between the inner container and the recording portion, the heat conduction between the outer container and the recording portion is caused. Heat transfer can be reduced without limit. When the temperature measuring device is used in a vacuum environment, it is not necessary to consider heat transfer due to convective heat transfer, so that only heat transfer can be achieved. Further, in the temperature measuring device, the material of the wall of the outer container is made of a material having a higher thermal conductivity and a smaller heat capacity than the material of the inner container. Thereby, the temperature received in the outer container is transferred by heat conduction in the same wall body, so that the temperature in the same wall body can be made uniform. That is, in the outer container, it is possible to disperse heat while suppressing the occurrence of local high temperature portions. In addition, since the inner container can have a larger heat capacity than the outer container, local heat transfer is avoided and temperature rise is suppressed for the inner container closest to the recording unit. It becomes possible to do. Accordingly, it is possible to provide a temperature measuring instrument with improved heat insulation performance and improved heat resistant temperature.

  Here, it is preferable that the outer container has a plurality of wall bodies that are arranged apart from each other in the plate thickness direction. Since the outer container is composed of a plurality of wall bodies having gaps at a predetermined interval in the plate thickness direction, heat transfer due to heat conduction between the wall bodies adjacent in the plate thickness direction can be reduced as much as possible. When the temperature measuring device is used in a vacuum environment, it is not necessary to consider heat transfer due to convective heat transfer, so that the heat is transferred almost exclusively by radiation. According to the outer container having such a configuration, the heat insulation performance can be further improved.

  Further, the inner container and the outer container wall are provided with through-holes through which wires for electrically connecting the temperature detection unit and the recording unit are passed. It is preferable that they are arranged out of focus. Thereby, it is possible to prevent the through holes provided in the outer container and the inner container from being arranged on the same axis, and the outside of the outer container and the inside of the inner container are connected through a series of through holes. Direct communication with the hole is prevented. As a result, the heat insulation performance can be improved.

  The inner container is preferably made of copper, and the outer container is preferably made of stainless steel. Thus, the wall body of an outer side container can be equalize | homogenized by comprising the wall body of an outer side container with stainless steel, and comprising an inner side container with copper. In addition, the inner container can have a larger heat capacity than the outer container, and the heat insulation performance can be improved.

  The recording unit is preferably supported by a block body made of ceramic. Accordingly, it is possible to support the recording unit by securing a gap between the inner container and the recording unit using a ceramic having a relatively low thermal conductivity.

  The film forming apparatus of the present invention is a film forming apparatus for forming a thin film layer on a substrate, and is provided with a film forming material for forming the thin film layer and forming the thin film layer on the substrate. A film chamber; a transport means for transporting the substrate; and a temperature measuring device that is movable in conjunction with the transport of the substrate and that has a recording unit that records a signal related to the temperature of the substrate housed in a heat insulating container. The heat insulation container of the temperature measuring device includes a recording unit that records a signal related to the temperature output from the temperature detection unit, an inner container that forms a gap portion between the recording unit and accommodates the recording unit, and a plate thickness direction. A plurality of wall bodies spaced apart from each other, forming a gap between the inner container and an outer container for accommodating the inner container, wherein the outer container wall body is made of a material of the inner container Compared to the above, it is made of a material with high thermal conductivity and low heat capacity. There.

  Such a film forming apparatus includes a temperature measuring device that can move in conjunction with the transport of the substrate and can measure the temperature history of the substrate. In this temperature measuring device, a recording unit for recording a signal output from the temperature detection unit is accommodated in an inner container, and the inner container is insulated by being accommodated in an outer container. Specifically, since the gap portion is provided between the outer container and the inner container and the gap portion is provided between the inner container and the recording portion, the heat conduction between the outer container and the recording portion is caused. Heat transfer can be reduced without limit. When the temperature measuring device is used in a vacuum environment, it is not necessary to consider heat transfer due to convective heat transfer, so that the heat is transferred almost exclusively by radiation. Further, in the temperature measuring device, the material of the wall of the outer container is made of a material having a higher thermal conductivity and a smaller heat capacity than the material of the inner container. Thereby, the temperature received in the outer container is transferred by heat conduction in the same wall body, so that the temperature in the same wall body can be made uniform. That is, in the outer container, it is possible to disperse heat while suppressing the occurrence of local high temperature portions. In addition, since the inner container can have a larger heat capacity than the outer container, local heat transfer is avoided and temperature rise is suppressed for the inner container closest to the recording unit. It becomes possible to do. Accordingly, it is possible to provide a film forming apparatus including a temperature measuring instrument that has improved heat insulation performance and improved heat-resistant temperature. The temperature measuring device may be moved by a temperature measuring device transported by a transporting device that transports the substrate, or by a dedicated transporting device that transports the recording unit separately from the substrate transporting device. But you can. The fact that the temperature measuring device can be moved in conjunction with the conveyance of the substrate is not limited to the case where the temperature measuring device can be conveyed together with the substrate, but also includes the case where the temperature measuring device and the substrate can run together.

  Here, it is preferable that the outer container has a plurality of wall bodies that are arranged apart from each other in the plate thickness direction. Since the outer container is composed of a plurality of wall bodies having gaps at a predetermined interval in the plate thickness direction, heat transfer due to heat conduction between the wall bodies adjacent in the plate thickness direction can be reduced as much as possible. When the temperature measuring device is used in a vacuum environment, it is not necessary to consider heat transfer due to convective heat transfer, so that the heat is transferred almost exclusively by radiation. According to the outer container having such a configuration, the heat insulation performance can be further improved.

  Further, the inner container and the outer container wall are provided with through-holes through which wires for electrically connecting the temperature detection unit and the recording unit are passed. It is preferable that they are arranged out of focus. Thereby, it is possible to prevent the through holes provided in the outer container and the inner container from being arranged on the same axis, and the outside of the outer container and the inside of the inner container are connected through a series of through holes. Direct communication with the hole is prevented. As a result, the heat insulation performance can be improved.

  Further, it is preferable that the inner container is made of stainless steel and the outer container is made of copper. Thus, the wall body of an outer side container can be equalize | homogenized by comprising the wall body of an outer side container with copper, and comprising an inner side container with stainless steel copper. In addition, the inner container can have a larger heat capacity than the outer container, and the heat insulation performance can be improved.

  The recording unit is preferably supported by a block body made of ceramic. Accordingly, it is possible to support the recording unit by securing a gap between the inner container and the recording unit using a ceramic having a relatively low thermal conductivity.

  Further, the film formation substrate manufacturing method of the present invention is a method for manufacturing a film formation substrate in which a thin film layer is formed on a substrate, and a film formation material in which a film formation material for forming a thin film layer is installed is provided. In a room, a film forming process for forming a thin film layer on a substrate, a transporting process for transporting the substrate, and a recording unit of a temperature measuring device for measuring the temperature history of the substrate are housed in a heat insulating container, And a temperature measuring step of measuring a temperature history while moving in conjunction with the conveyance of the substrate.

  In such a film formation substrate manufacturing method, the temperature history of the substrate is measured because the temperature measurement step of measuring the temperature history of the substrate while moving the temperature measuring device is interlocked with the conveyance of the substrate. Can do. The movement of the temperature measuring device in conjunction with the transport of the substrate is not limited to the case where the temperature measuring device is transported together with the substrate, but includes the case where the temperature measuring device and the substrate are run together.

  According to the temperature measuring device of the present invention, the inner container and the outer container that protect the recording unit are provided, and the heat insulation performance is improved by the inner container and the outer container. Temperature measurement in the environment can be made possible.

  According to the film forming apparatus of the present invention, it is possible to measure the temperature history of the substrate by providing a temperature measuring device with improved heat insulation performance and improved heat resistant temperature.

  According to the method for producing a film formation substrate of the present invention, the temperature history of the substrate can be measured using a temperature measuring device.

It is sectional drawing which shows the temperature measuring device which concerns on embodiment of this invention. It is a top view which shows the conveyance tray with which the temperature measuring device which concerns on embodiment of this invention is mounted. It is a side view which shows the conveyance tray with which the temperature measuring device which concerns on embodiment of this invention is mounted. It is a schematic block diagram which shows the film-forming apparatus which concerns on embodiment of this invention.

  A temperature measuring device, a film forming apparatus, and a film forming substrate manufacturing method according to the present invention will be described with reference to the drawings. It should be noted that words indicating directions such as “up” and “down” are based on the state shown in the drawings and are for convenience.

(Temperature measuring device)
FIG. 1 is a cross-sectional view showing a temperature measuring device according to an embodiment of the present invention. As shown in FIG. 1, the temperature measuring device 10 according to this embodiment includes a temperature detection unit 1, a logger (recording unit) 2, a first container (inner container) 3, a second container (outer container) 4, and a third container. A container (outer container) 5 and a fourth container (outer container) 6 are provided. And the 1st container 3, the 2nd container 4, the 3rd container 5, and the 4th container 6 are equivalent to the heat insulation container of this invention.

  The temperature detection unit 1 detects temperature and is configured to output a signal related to temperature. For example, a thermocouple thermometer can be applied. A wiring 1a capable of transmitting an electrical signal is connected to the temperature detection unit 1. The wiring 1 a electrically connects the temperature detection unit 1 and the logger 2.

  The logger 2 receives and records the signal output from the temperature detection unit 1. The logger 2 records the received signal every predetermined time (for example, 1 second).

(First container: inner container)
The first container 3 is a container that houses the logger 2. The first container 3 has, for example, a box shape and includes a container main body 31 that houses the logger 2 and a lid body 32 that covers the opening of the container main body 31. The container main body 31 includes a bottom plate (wall body) 31a that covers the logger 2 from below and a side plate (wall body) 31b that covers the logger 2 from the side (four directions). In these bottom plate 31a and side plate 31b, the edge portions of the adjacent wall bodies are joined by welding or the like, for example. The lid 32 functions as a top plate (wall plate) that covers the logger 2 from above. The lid 32 is configured to be detachable from the container main body 31.

  Each wall (31a, 31b, 32) which comprises the 1st container 3 is formed with the copper plate, for example. The thickness of the copper plate is, for example, about 0.1 mm.

  The logger 2 is supported from below by a ceramic block body (support body) 12 and placed on the bottom plate 31a. Examples of the shape of the support that supports the logger 2 include a cube, a rectangular parallelepiped, a cylinder, a cylinder, a rectangular tube, and a plate material. As the shape of the block body 12, it is preferable to make the contact surface between the logger 2 and the first container 3 small, thereby reducing heat transfer due to heat conduction. Examples of the material constituting the block body 12 include a ceramic having heat resistance and low thermal conductivity.

  In addition, the logger 2 is arranged so as to have a predetermined gap portion with respect to each wall body (31a, 31b, 32) constituting the first container 3. The size of the gap between each wall of the first container 3 and the logger 2 is, for example, about 1 mm. The logger 2 is disposed at the center of the bottom plate 31a in plan view. Moreover, the through-hole 14 penetrated in the plate | board thickness direction is formed in the wall body (for example, side plate 31b) of the 1st container 3, and the wiring 1a is penetrated.

(Second container: outer container)
The second container 4 is a container that houses the first container 3. The second container 4 has, for example, a box shape, and includes a container body 41 that houses the first container 3 and a lid body 42 that covers the opening of the container body 41. The container main body 41 includes a bottom plate (wall plate) 41a that covers the first container 3 from below and a side plate (wall plate) 41b that covers the first container 3 from the side (four directions). In these bottom plate 41a and side plate 41b, the edges of adjacent wall bodies are joined together by welding or the like, for example. The lid body 42 functions as a top plate (wall plate) that covers the first container 3 from above. The lid body 42 is configured to be detachable from the container main body 41.

  Each wall (41a, 41b, 42) constituting the second container 4 is formed of, for example, a stainless steel plate. The thickness of the stainless steel plate is, for example, about 0.5 mm.

  The first container 3 is supported from below by a ceramic block body (support body) 12 and placed on the bottom plate 41a. Examples of the shape of the support that supports the first container 3 include a cube, a rectangular parallelepiped, a cylinder, a cylinder, a rectangular tube, and a plate material. As the shape of the block body 12, it is preferable to make the contact surface between the first container 3 and the second container 4 small, and this can reduce heat transfer by heat conduction. Examples of the material constituting the block body 12 include a ceramic having heat resistance and low thermal conductivity.

  Further, the first container 3 is disposed so as to have a predetermined gap portion with respect to each wall body (41 a, 41 b, 42) constituting the second container 4. The size of the gap between each wall of the second container 4 and each wall of the first container 3 is, for example, about 1 mm. The first container 3 is disposed at the center of the bottom plate 41a in plan view. Moreover, the through-hole 14 penetrated in the plate | board thickness direction is formed in the wall body (for example, side plate 41b) of the 2nd container 4, and the wiring 1a is penetrated.

(Third container: outer container)
The third container 5 is a container that houses the second container 4. The third container 5 has, for example, a box shape and includes a container main body 51 that houses the second container 4 and a lid body 52 that covers the opening of the container main body 51. The container body 51 includes a bottom plate (wall plate) 51a that covers the second container 4 from below, and a side plate (wall plate) 51b that covers the second container 4 from the side (four directions). In these bottom plate 51a and side plate 51b, the edges of adjacent wall bodies are joined together by welding or the like, for example. The lid 52 functions as a top plate (wall plate) that covers the second container 5 from above. The lid body 52 is configured to be detachable from the container main body 51.

  Each wall (51a, 51b, 52) which comprises the 3rd container 5 is formed with the board | plate material made from stainless steel, for example. The thickness of the stainless steel plate is, for example, about 0.5 mm.

  The second container 4 is supported from below by a ceramic block body (support body) 12 and placed on the bottom plate 51a. Examples of the shape of the support that supports the second container 4 include a cube, a rectangular parallelepiped, a cylinder, a cylinder, a rectangular tube, and a plate material. As the shape of the block body 12, it is preferable to make the contact surface between the second container 4 and the third container 5 small, thereby reducing heat transfer due to heat conduction. Examples of the material constituting the block body 12 include a ceramic having heat resistance and low thermal conductivity.

  Further, the second container 4 is arranged so as to have a predetermined gap with respect to each wall body (51a, 51b, 52) constituting the third container 5. The size of the gap between each wall of the third container 5 and each wall of the second container 4 is, for example, about 1 mm. The second container 4 is disposed at the center of the bottom plate 51a in plan view. Further, a through hole 14 penetrating in the thickness direction is formed in the wall body (for example, the side plate 51b) of the third container 5, and the wiring 1a is inserted therethrough.

(4th container: outer container)
The fourth container 6 is a container that houses the third container 5. The fourth container 6 has, for example, a box shape, and includes a container main body 61 that houses the third container 5, and a lid 62 that covers the opening of the container main body 61. The container main body 61 includes a bottom plate (wall plate) 61a that covers the third container 5 from below, and a side plate (wall plate) 61b that covers the third container 5 from the side (four directions). In these bottom plate 61a and side plate 61b, the edges of adjacent wall bodies are joined together by welding or the like, for example. The lid 62 functions as a top plate (wall plate) that covers the third container 6 from above. The lid 62 is configured to be detachable from the container main body 61.

  Each wall (61a, 61b, 62) which comprises the 4th container 6 is formed with the board | plate material made from stainless steel, for example. The thickness of the stainless steel plate is, for example, about 0.5 mm.

  The third container 5 is supported from below by a ceramic block body (support body) 12 and placed on the bottom plate 61a. Examples of the shape of the support that supports the third container 5 include a cube, a rectangular parallelepiped, a cylinder, a cylinder, a rectangular tube, and a plate material. As the shape of the block body 12, it is preferable to make the contact surface between the third container 5 and the fourth container 6 small, thereby reducing heat transfer due to heat conduction. Examples of the material constituting the block body 12 include a ceramic having heat resistance and low thermal conductivity.

  Further, the third container 5 is arranged so as to have a predetermined gap portion with respect to each wall body (61a, 61b, 62) constituting the fourth container 6. The size of the gap between each wall of the fourth container 6 and each wall of the third container 5 is, for example, about 1 mm. The third container 5 is disposed at the center of the bottom plate 61a in plan view. Moreover, the through-hole 14 penetrated in the plate | board thickness direction is formed in the wall body (for example, side plate 61b) of the 4th container 6, and the wiring 1a is penetrated. In addition, the external shape of the 4th container 6 can be made into length L30cm x width W20cm x height H15cm grade, for example.

(Function)
Temperature measurement using the temperature measuring device 10 of the present embodiment will be described. The temperature measuring instrument 10 can perform measurement while moving together with a moving measurement object. The temperature detection unit 1 is disposed at a measurement target site (for example, on a substrate). The temperature detector 1 outputs a signal related to the detected temperature. The logger 2 receives and records the signal output from the temperature detection unit 1. After the temperature measurement is completed, the temperature history can be acquired by analyzing the signal recorded by the logger 2.

  Next, use in a high temperature vacuum environment will be described. The temperature measuring device 10 according to the present embodiment is configured to be able to measure temperature in a high temperature environment of, for example, 600 ° C. or higher. FIG. 1 shows a state in which the temperature measuring device 10 moves to the right side in the figure and is heated from above and below. Heat from the heating source is transferred by radiation, and the lid 62 and the bottom plate 61a of the fourth container 6 are heated. The heat transferred to the lid 62 and the bottom plate 61a is transferred to the side plate 61b by heat conduction. Each wall body (61a, 61b, 62) which comprises the 4th container 6 becomes substantially the same temperature.

  The heat transmitted to the wall bodies (61a, 61b, 62) constituting the fourth container 6 is transmitted to the wall bodies (51a, 51b, 52) constituting the third container 5 by radiation. Each wall body which comprises the 3rd container 5 becomes substantially the same temperature. The heat transferred to the wall constituting the third container 5 is transferred to the wall (41a, 41b, 42) constituting the second container 4 by radiation. Each wall body which comprises the 3rd container 5 becomes substantially the same temperature. Moreover, the heat transmitted to the wall body which comprises the 2nd container 4 is transmitted to the wall body (31a, 31b, 32) which comprises the 1st container 3 by radiation. Each wall body which comprises the 1st container 3 becomes substantially the same temperature, and the temperature in the 1st container 3 is maintained at about 30 to 40 degreeC.

  According to such a temperature measuring instrument 10 according to the present embodiment, the logger 2 is protected by the heat insulating container and the inside of the heat insulating container is prevented from becoming a high temperature environment, so a signal related to the measurement result is recorded on the logger 2. As a result, information on the temperature history can be acquired. The heat insulating container includes an inner container and an outer container, and the outer container is constituted by a plurality of wall bodies having gap portions with a predetermined interval in the plate thickness direction by the second container, the third container, and the fourth container. Therefore, heat transfer due to heat conduction between the wall bodies adjacent in the plate thickness direction can be reduced as much as possible. When the temperature measuring device 10 is used in a vacuum environment, it is not necessary to consider heat transfer due to convective heat transfer, so that the heat is transferred almost only by radiation.

  In the temperature measuring instrument 10, a gap is formed between the second container 4 and the first container 3, and a gap is formed between the first container 3 and the logger 2. It becomes possible to reduce heat transfer by conduction as much as possible, and almost only heat transfer can be achieved.

  Furthermore, the temperature measuring instrument 10 is made of a material (stainless steel: SUS304) in which the walls of the outer containers 4 to 6 have higher thermal conductivity and smaller heat capacity than the material (copper) of the first container 3. Is formed. Thereby, the temperature of the wall body of the same container can be equalize | homogenized by transferring the heat received by the 4th container 6 by heat conduction in the wall body of the same container. That is, in the 4th container 6, generation | occurrence | production of a local high temperature part can be suppressed and heat can be disperse | distributed. Similarly, the temperature of the wall body can be made uniform in the third container 5, and the temperature of the wall body can be made uniform in the second container 4.

  Moreover, since the inner first container 3 has a larger heat capacity than the outer containers 4 to 6, it avoids local heat transfer to the first container 3 closest to the logger 2 and increases the temperature. It becomes possible to suppress. As a result, a temperature measuring instrument with improved heat insulation performance and improved heat resistant temperature is realized.

  In addition, the temperature measuring instrument 10 is provided with through holes 14 through the wirings 1a that electrically connect the temperature detection unit 1 and the logger 2 to the walls 31b, 41b, 51b, 61b of the containers 3 to 6, The through-holes 14 provided in the respective wall bodies 31b, 41b, 51b, 61b are configured such that their axis centers are shifted from each other. Therefore, the through holes 14 provided in the containers 3 to 6 are prevented from being arranged on the same axis, and the outer containers 4 to 6 and the inner first container 3 are formed by a series of through holes. A linear communication is prevented. As a result, the heat insulation performance is improved.

(Conveyer tray with temperature measuring device)
FIG. 2 is a plan view showing a transport tray on which the temperature measuring device according to the embodiment of the present invention is mounted, and FIG. 3 is a side view showing the transport tray on which the temperature measuring device according to the embodiment of the present invention is mounted. is there. As shown in FIGS. 2 and 3, the temperature measuring device 10 is used by being installed on a substrate transfer tray 80, for example.

  The transport tray 80 is formed from a rectangular plate material, and places and transports the substrate 81. The conveyance tray 80 is formed with an opening 80a penetrating in the thickness direction. A substrate 81 having a length of about 2/3 of the length of the transport tray 80 (length in the transport direction) is disposed on the transport tray 80. That is, an area of about 2/3 of the opening 80 a of the transport tray 80 is covered with the substrate 81, and the remaining area can be used as an area where the temperature measuring device 10 is arranged. In addition, the temperature measuring device 10 may be arrange | positioned at the center part of the conveyance tray 80, and may be arrange | positioned at the one end side of the longitudinal direction.

  A support member 82 for supporting the temperature measuring device 10 is provided in the opening 80 a of the transport tray 80. In FIG. 2, a plurality of rod-like support members 82 extending in the width direction of the transport tray 80 are provided. Such a transport tray 80 is transported by the transport means 91 and used for measuring the temperature history of the substrate.

(Deposition system)
FIG. 4 is a schematic configuration diagram showing a film forming apparatus according to an embodiment of the present invention. A film forming apparatus 100 shown in FIG. 4 is for performing a film forming process on a substrate. The film forming apparatus 100 is an apparatus that forms a film by evaporating an ionized evaporation material on a substrate using, for example, an RPD (Reactive Plasma Deposition) method.

  The film forming apparatus 100 includes a load lock chamber 121, a buffer chamber 122, a film forming chamber (film forming chamber) 123, a buffer chamber 124, and a load lock chamber 125. These chambers 121 to 125 are arranged in this order. All the chambers 121 to 125 are constituted by vacuum containers, and open / close gates 131 to 136 are provided at the entrances and exits of the chambers 121 to 125. The film forming apparatus 100 is provided with a transfer device 91 (see FIG. 3) for transferring the substrate. The transport device 91 includes, for example, a known roller 91a and a drive mechanism (not shown) that rotates the roller 91a. Then, the substrate is transferred by the transfer device 91 and sequentially passes through the chambers 121 to 125. Further, in the film forming apparatus 100, a substrate is placed and a transport tray 80 on which the temperature measuring device 10 capable of measuring the temperature of the substrate is placed is transported to measure the temperature of the substrate.

  The load lock chamber 121 is a chamber into which the substrate to be processed is introduced by opening the open / close gate 131 provided on the inlet side to open the atmosphere. The outlet side of the load lock chamber 121 is connected to the inlet side of the buffer chamber 122 through an open / close gate 132. The load lock chamber 121 is provided with a heater 92 for heating the substrate. The heaters 92 are respectively installed on both sides in the vertical direction in order to heat both the upper and lower surfaces of the substrate. In the load lock chamber 121, the substrate temperature is heated to about 200 ° C., for example.

  The buffer chamber 122 is a pressure adjusting chamber that is communicated with the load lock chamber 121 by opening the open / close gate 132 provided on the inlet side and into which the substrate that has passed through the load lock chamber 121 is introduced. The outlet side of the buffer chamber 122 is connected to the inlet side of the film forming chamber 123 through an open / close gate 133. The buffer chamber 122 is provided with a heater 92 for heating the substrate. The heaters 92 are respectively installed on both sides in the vertical direction in order to heat both the upper and lower surfaces of the substrate. In the buffer chamber 122, the substrate temperature is heated to about 400 ° C., for example.

  The film forming chamber 123 is a processing chamber that opens the open / close gate 133 provided on the inlet side, communicates with the buffer chamber 122, introduces the substrate that has passed through the buffer chamber 22, and forms a thin film layer on the substrate. is there. The outlet side of the film forming chamber 123 is connected to the inlet side of the buffer chamber 124 via an open / close gate 134. A film forming material (not shown) for forming a thin film layer is installed in the film forming chamber 123. The film formation chamber 123 is provided with a heater 92 for heating the substrate. The heaters 92 are respectively installed on both sides in the vertical direction in order to heat the upper and lower surfaces of the substrate. In the film forming chamber 123, the substrate temperature is maintained at about 600 ° C., for example.

  The buffer chamber 124 is a pressure adjusting chamber that is communicated with the film forming chamber 123 by opening an open / close gate 134 provided on the inlet side, and into which a substrate formed by the film forming chamber 123 is introduced. The outlet side of the buffer chamber 124 is connected to the inlet side of the load lock chamber 125 via an open / close gate 135. The buffer chamber 124 is provided with a cooling plate (not shown) for cooling the substrate. The cooling plates are respectively installed on both sides in the vertical direction in order to cool both the upper and lower surfaces of the substrate. In the buffer chamber 124, the substrate temperature is cooled to about 400 ° C., for example.

  The load lock chamber 125 is a chamber that communicates with the buffer chamber 124 by opening the open / close gate 35 provided on the inlet side, and into which the substrate that has passed through the buffer chamber 124 is introduced. An opening / closing gate 36 is provided on the outlet side of the load lock chamber 125, and the load lock chamber 125 is opened to the atmosphere by opening the opening / closing gate 36. The load lock chamber 125 is provided with a cooling plate (not shown) for cooling the substrate. The cooling plates are respectively installed on both sides in the vertical direction in order to cool both the upper and lower surfaces of the substrate. In the load lock chamber 125, the substrate temperature is cooled to about 200 ° C., for example.

  The film forming apparatus 100 includes a chamber pressure adjusting device (not shown) that adjusts the pressure in the chambers 121 to 125. In the film forming apparatus 100, the film forming chamber 123 is maintained at the lowest pressure (for example, in a vacuum state). That is, the pressure of the buffer chambers 122 and 124 adjacent to the film forming chamber 123 is adjusted based on the pressure of the film forming chamber 123, and the pressure of the load lock chambers 121 and 125 adjacent to the buffer chambers 122 and 124 is adjusted to It adjusts on the basis of the pressure of 122,124.

  In the film forming apparatus 100 of this embodiment, the temperature measuring device 10 can be mounted on the transport tray 80 together with the substrate, and the transport tray 80 can be transported using a transport means. Since the logger 2 of the temperature measuring device 10 is protected and insulated by the heat insulating container, the temperature in the first container 3 is maintained at about 30 ° C. to 40 ° C. in a high temperature vacuum environment of 660 ° C., for example. Can do. As a result, damage to the logger 2 can be prevented and the temperature history of the substrate can be measured.

(Method for manufacturing a film formation substrate)
Next, a method for manufacturing a film formation substrate according to an embodiment of the present invention will be described. In this embodiment, a method for manufacturing a film formation substrate using the film formation apparatus 100 shown in FIG. 4 will be described. This manufacturing method includes a heating process (conveying process), a film forming process, a cooling process (conveying process), and a temperature measuring process.

(Preheating process, transport process)
First, the substrate is placed on the transfer tray, transferred, and introduced into the load lock chamber 121. In the load lock chamber 121, the open / close gates 131 and 132 are closed to be sealed, and the pressure is reduced to a predetermined pressure. The load lock chamber 122 is heated by the heater 92 to heat the substrate. The substrate is transported in the load lock chamber 121 and introduced into the adjacent buffer chamber 122. In the buffer chamber 122, the open / close gates 132 and 133 are closed and sealed, and the pressure is reduced to a predetermined pressure (vacuum state). The buffer chamber 122 is heated by the heater 92 to heat the substrate. The substrate is heated to a temperature suitable for film formation. The substrate is transferred through the buffer chamber 122 and introduced into the adjacent film formation chamber 123.

(Film formation process)
The film formation chamber 123 is in a vacuum state before the substrate is introduced. When the substrate is introduced into the film formation chamber 123, the open / close gates 133 and 134 are closed to be hermetically sealed. In addition, the inside of the film forming chamber 123 is heated by the heater 91 to maintain the substrate temperature. Then, a film forming process is performed on the substrate, and a metal film is formed on the substrate.

(Cooling process, transport process)
The substrate is transported through the film forming chamber 123 and introduced into the adjacent buffer chamber 124. Inside the buffer chamber 124, the open / close gates 134 and 135 are closed and sealed, and the pressure is increased from a vacuum state to a predetermined pressure. In addition, the inside of the buffer chamber 124 is cooled by a cooling plate to cool the substrate. The substrate is transported through the buffer chamber 124 and introduced into the adjacent load lock chamber 125. Inside the load lock chamber 125, the open / close gates 135 and 136 are closed to be hermetically sealed and pressurized to atmospheric pressure. In addition, the load lock chamber 125 is cooled by a cooling plate to cool the substrate.

(Temperature measurement process)
In the temperature measurement step, first, the logger 2 of the temperature measuring device 10 that measures the temperature history of the substrate is accommodated in a heat insulating container (containers 3 to 6). The temperature measuring device 10 is mounted on the transfer tray 80 together with the substrate. The temperature detector 1 of the temperature measuring device 10 is disposed at a predetermined position on the substrate. In the temperature measurement process, the preheating (transfer) process, the film forming process, and the cooling (transfer) process are performed on the substrate mounted on the transfer tray 80 for temperature measurement. The logger 2 records information on the temperature detected by the temperature detection unit 1 in the series of steps described above.

  According to the film formation substrate manufacturing method of the present embodiment, the temperature history of the substrate can be measured because the temperature measurement step of measuring the temperature history of the substrate is performed while the temperature measuring device 10 is being transported with the substrate. Further, since the logger 2 is housed in a heat insulating container with improved heat insulating performance, the logger 2 is not likely to be damaged in a high temperature environment. In addition, since the film formation substrate manufacturing method of the present embodiment includes a temperature measurement step and can acquire information on the temperature history of the substrate, the temperature management is adjusted based on the acquired information on the temperature history. Can do. As a result, the quality of the film formation substrate can be improved.

  As mentioned above, although this invention was concretely demonstrated based on the embodiment, this invention is not limited to the said embodiment. In the above embodiment, the material of the inner container 3 is stainless steel, but other materials may be used. As a material of the inner container 3, for example, a titanium alloy, tungsten, or the like may be used. Moreover, it is good also as a structure provided with several inner side containers. The plurality of inner containers 3 may be made of the same material, or may be made of a different material for each container. A material having a lower thermal conductivity and a larger heat capacity is preferably arranged on the logger 2 side.

  Moreover, in the said embodiment, although the material of the outer containers 4-6 is made into copper, another material may be sufficient. As a material of the outer containers 4 to 6, for example, an aluminum alloy may be used. Further, the plurality of outer containers 4 to 6 may all be made of the same material, or may be made of a different material for each container. A material having a higher thermal conductivity and a smaller heat capacity is preferably arranged on the outer side. The outer container of the above embodiment is composed of the second container 4, the third container 5, and the fourth container 6, but the outer container may be composed of one container, and four or more containers. It may be constituted by. Further, the outer container may be constituted by a single container having a plurality of wall bodies in the plate thickness direction (inner and outer directions).

  Moreover, as a heat capacity of the heat insulation container of the temperature measuring device 10, it is preferable that it is 1000 J / K or more, for example. Moreover, as a heat conductivity of the heat insulation container of the temperature measuring device 10, it is preferable that it is 200 W / m / K or more, for example.

  Moreover, in the said embodiment, although the through-hole for inserting wiring is formed in the position shifted so that it may become a different axial center for every wall body, a plurality of through-holes are arranged on the same axis. It may be configured. Moreover, the through hole may be formed in the bottom plate or the lid (top plate). When the through hole is formed in the side plate, the position of the wiring can be easily observed from above by removing the lid. Further, other through holes may be formed in the wall of the container.

  In the above container, the top plate portion is used as a lid, but other side plates, bottom plates, and the like may be used as removable lids.

  Moreover, although the case where the temperature measuring device 10 is applied to the film forming apparatus 100 has been described in the above embodiment, the temperature measuring device 10 may be applied to temperature measurement in a processing apparatus other than the film forming apparatus. . Further, the temperature measuring device 10 may be used without being conveyed. Further, the film forming apparatus is not limited to the one using the RFD method, and other film forming apparatuses may be used. As a film forming apparatus and a substrate manufacturing method, there are those using an ion plating method, a sputtering method, a physical or chemical vapor deposition method.

  Moreover, although the said embodiment demonstrated the case where the temperature measuring device 10 was mounted and conveyed on the conveyance tray 80 which conveys the board | substrate 81, the temperature measuring device 10 is mounted in the conveyance tray 80 which conveys the board | substrate 81. FIG. For example, it may be transported by a dedicated transport mechanism for transporting the temperature measuring device 10.

  The substrate manufacturing method may include a process other than the film forming process, the transport process, and the temperature measurement process.

  DESCRIPTION OF SYMBOLS 10 ... Temperature measuring device, 1 ... Temperature detection part, 12 ... Block body (support body), 2 ... Logger (recording part), 3 ... 1st container (inner container), 31 ... Container main body, 31a ... Bottom plate (wall body) ), 31b ... side plate (wall body), 32 ... lid body (wall body), 4 ... second container (outer container), 41 ... container body, 41a ... bottom plate (wall body), 41b ... side plate (wall body), 42 ... Lid (wall), 5 ... Third container (outer container), 51 ... Container body, 51a ... Bottom plate (wall), 51b ... Side plate (wall), 52 ... Lid (wall), 6 ... 4th container (outer container), 61 ... Container body, 61a ... Bottom plate (wall body), 61b ... Side plate (wall body), 62 ... Lid body (wall body), 80 ... Transport tray, 81 ... Substrate, 82 ... Support bar, 91 ... conveying means, 92 ... heater, 100 ... film forming apparatus.

Claims (11)

A temperature measuring device in which a recording unit for recording a signal related to temperature is housed in an insulated container,
The insulated container is
An inner container for accommodating the recording unit by forming a gap between the recording unit,
Forming a gap between the inner container and an outer container for accommodating the inner container;
The temperature measuring instrument characterized in that the wall of the outer container is made of a material having a higher thermal conductivity and a smaller heat capacity than the material of the inner container.   The temperature measuring device according to claim 1, wherein the outer container has a plurality of wall bodies that are arranged apart from each other in the plate thickness direction. The inner container and the outer container wall body is provided with a through-hole through which a wiring for electrically connecting the temperature detection part and the recording part passes.
The temperature measuring device according to claim 1, wherein the through-holes provided in each wall body are arranged with their axis centers shifted from each other.   The temperature measuring device according to any one of claims 1 to 3, wherein the inner container is made of stainless steel, and the outer container is made of copper.   The temperature measuring device according to claim 1, wherein the recording unit is supported by a block body made of ceramic. A film forming apparatus for forming a thin film layer on a substrate,
A film forming material for forming the thin film layer is installed, and a film forming chamber for forming the thin film layer on the substrate;
Transport means for transporting the substrate;
A temperature measuring instrument that is movable in conjunction with the conveyance of the substrate, and in which a recording unit that records a signal related to the temperature of the substrate is housed in a heat insulating container,
The insulated container of the temperature measuring instrument is
A recording unit that records a temperature-related signal output from the temperature detection unit;
An inner container for accommodating the recording unit by forming a gap between the recording unit,
Forming a gap between the inner container and an outer container for accommodating the inner container;
The film forming apparatus, wherein the wall of the outer container is made of a material having a higher thermal conductivity and a lower heat capacity than the material of the inner container.   The film forming apparatus according to claim 6, wherein the outer container has a plurality of wall bodies that are arranged apart from each other in the plate thickness direction. The inner container and the outer container are provided with through-holes through which wires for electrically connecting the temperature detection unit and the recording unit pass,
The film forming apparatus according to claim 6, wherein the through holes provided in each wall body are misaligned with each other.   The film forming apparatus according to claim 6, wherein the inner container is made of copper, and the outer container is made of stainless steel.   The film forming apparatus according to claim 6, wherein the recording unit is supported by a block body made of ceramic. A method of manufacturing a film formation substrate in which a thin film layer is formed on a substrate,
A film forming step of forming the thin film layer on the substrate in a film forming chamber provided with a film forming material for forming the thin film layer;
A transporting process for transporting the substrate;
A temperature measuring step for measuring the temperature history while accommodating a recording unit of a temperature measuring device for measuring the temperature history of the substrate in a heat insulating container, and moving the temperature measuring device in conjunction with conveyance of the substrate; A film forming substrate manufacturing method comprising:

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