JP2012151317A5 - - Google Patents

Download PDF

Info

Publication number
JP2012151317A5
JP2012151317A5 JP2011009397A JP2011009397A JP2012151317A5 JP 2012151317 A5 JP2012151317 A5 JP 2012151317A5 JP 2011009397 A JP2011009397 A JP 2011009397A JP 2011009397 A JP2011009397 A JP 2011009397A JP 2012151317 A5 JP2012151317 A5 JP 2012151317A5
Authority
JP
Japan
Prior art keywords
piezoelectric element
wafer
piezoelectric
base substrate
separating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011009397A
Other languages
English (en)
Japanese (ja)
Other versions
JP5751844B2 (ja
JP2012151317A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011009397A priority Critical patent/JP5751844B2/ja
Priority claimed from JP2011009397A external-priority patent/JP5751844B2/ja
Publication of JP2012151317A publication Critical patent/JP2012151317A/ja
Publication of JP2012151317A5 publication Critical patent/JP2012151317A5/ja
Application granted granted Critical
Publication of JP5751844B2 publication Critical patent/JP5751844B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011009397A 2011-01-20 2011-01-20 圧電デバイスの製造方法 Expired - Fee Related JP5751844B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011009397A JP5751844B2 (ja) 2011-01-20 2011-01-20 圧電デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011009397A JP5751844B2 (ja) 2011-01-20 2011-01-20 圧電デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2012151317A JP2012151317A (ja) 2012-08-09
JP2012151317A5 true JP2012151317A5 (cg-RX-API-DMAC7.html) 2014-03-06
JP5751844B2 JP5751844B2 (ja) 2015-07-22

Family

ID=46793293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011009397A Expired - Fee Related JP5751844B2 (ja) 2011-01-20 2011-01-20 圧電デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP5751844B2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015165619A (ja) * 2014-03-03 2015-09-17 京セラクリスタルデバイス株式会社 水晶振動素子の中間生成品及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009184810A (ja) * 2008-02-08 2009-08-20 Seiko Epson Corp 記録装置
JP5352777B2 (ja) * 2009-01-30 2013-11-27 パナソニック株式会社 水晶デバイスの製造方法
JP2011091685A (ja) * 2009-10-23 2011-05-06 Seiko Epson Corp 圧電デバイス

Similar Documents

Publication Publication Date Title
JP2008012654A5 (cg-RX-API-DMAC7.html)
JP2011060807A5 (ja) 半導体チップの製造方法
JP2013524545A5 (cg-RX-API-DMAC7.html)
JP2009111375A5 (cg-RX-API-DMAC7.html)
JP2015042788A5 (cg-RX-API-DMAC7.html)
EP2267796A3 (en) Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof
WO2010116694A3 (en) Method of manufacturing semiconductor device
JP2013161863A5 (cg-RX-API-DMAC7.html)
JP2010251632A5 (cg-RX-API-DMAC7.html)
JP2011216780A5 (cg-RX-API-DMAC7.html)
WO2013066455A3 (en) Flattened substrate surface for substrate bonding
JP2014237545A5 (cg-RX-API-DMAC7.html)
JP2013070112A5 (cg-RX-API-DMAC7.html)
JP2012195095A5 (cg-RX-API-DMAC7.html)
JP2013513971A5 (cg-RX-API-DMAC7.html)
JP6425941B2 (ja) 電子デバイス及び電子デバイスの製造方法
JP2012069918A5 (ja) チップパッケージビルドアップ方法
WO2009011152A1 (ja) Ｓｏｉ基板およびｓｏｉ基板を用いた半導体装置
JP2009044136A5 (cg-RX-API-DMAC7.html)
JP2013168599A5 (cg-RX-API-DMAC7.html)
JP2010251724A5 (cg-RX-API-DMAC7.html)
JP2009117688A5 (cg-RX-API-DMAC7.html)
JP2008205888A5 (cg-RX-API-DMAC7.html)
WO2011082857A3 (de) Herstellung eines bauelements
JP2015233130A5 (ja) 半導体基板の作製方法及び半導体装置の作製方法