JP2012132451A5 - - Google Patents

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Publication number
JP2012132451A5
JP2012132451A5 JP2011278136A JP2011278136A JP2012132451A5 JP 2012132451 A5 JP2012132451 A5 JP 2012132451A5 JP 2011278136 A JP2011278136 A JP 2011278136A JP 2011278136 A JP2011278136 A JP 2011278136A JP 2012132451 A5 JP2012132451 A5 JP 2012132451A5
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JP
Japan
Prior art keywords
substrate
knuckles
laser
node
passage
Prior art date
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Granted
Application number
JP2011278136A
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English (en)
Japanese (ja)
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JP6110590B2 (ja
JP2012132451A (ja
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Priority claimed from US12/977,554 external-priority patent/US20120164376A1/en
Application filed filed Critical
Publication of JP2012132451A publication Critical patent/JP2012132451A/ja
Publication of JP2012132451A5 publication Critical patent/JP2012132451A5/ja
Application granted granted Critical
Publication of JP6110590B2 publication Critical patent/JP6110590B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011278136A 2010-12-23 2011-12-20 基板に通路孔を形成するための基板改修方法及び関連する物品 Expired - Fee Related JP6110590B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/977,554 US20120164376A1 (en) 2010-12-23 2010-12-23 Method of modifying a substrate for passage hole formation therein, and related articles
US12/977,554 2010-12-23

Publications (3)

Publication Number Publication Date
JP2012132451A JP2012132451A (ja) 2012-07-12
JP2012132451A5 true JP2012132451A5 (enExample) 2016-09-15
JP6110590B2 JP6110590B2 (ja) 2017-04-05

Family

ID=46210515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011278136A Expired - Fee Related JP6110590B2 (ja) 2010-12-23 2011-12-20 基板に通路孔を形成するための基板改修方法及び関連する物品

Country Status (5)

Country Link
US (1) US20120164376A1 (enExample)
JP (1) JP6110590B2 (enExample)
CN (1) CN102528413B (enExample)
DE (1) DE102011056623B4 (enExample)
FR (1) FR2969521B1 (enExample)

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