JP2012129429A5 - - Google Patents

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Publication number
JP2012129429A5
JP2012129429A5 JP2010281121A JP2010281121A JP2012129429A5 JP 2012129429 A5 JP2012129429 A5 JP 2012129429A5 JP 2010281121 A JP2010281121 A JP 2010281121A JP 2010281121 A JP2010281121 A JP 2010281121A JP 2012129429 A5 JP2012129429 A5 JP 2012129429A5
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JP
Japan
Prior art keywords
processing method
plasma processing
frequency power
time
etching
Prior art date
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Pending
Application number
JP2010281121A
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English (en)
Japanese (ja)
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JP2012129429A (ja
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Publication date
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Priority to JP2010281121A priority Critical patent/JP2012129429A/ja
Priority claimed from JP2010281121A external-priority patent/JP2012129429A/ja
Publication of JP2012129429A publication Critical patent/JP2012129429A/ja
Publication of JP2012129429A5 publication Critical patent/JP2012129429A5/ja
Pending legal-status Critical Current

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JP2010281121A 2010-12-17 2010-12-17 プラズマ処理方法 Pending JP2012129429A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010281121A JP2012129429A (ja) 2010-12-17 2010-12-17 プラズマ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010281121A JP2012129429A (ja) 2010-12-17 2010-12-17 プラズマ処理方法

Publications (2)

Publication Number Publication Date
JP2012129429A JP2012129429A (ja) 2012-07-05
JP2012129429A5 true JP2012129429A5 (https=) 2014-01-23

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ID=46646147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010281121A Pending JP2012129429A (ja) 2010-12-17 2010-12-17 プラズマ処理方法

Country Status (1)

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JP (1) JP2012129429A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6567943B2 (ja) * 2015-01-09 2019-08-28 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297679A (ja) * 1998-02-13 1999-10-29 Hitachi Ltd 試料の表面処理方法および装置
JP2000012529A (ja) * 1998-06-26 2000-01-14 Hitachi Ltd 表面加工装置
JP2002324967A (ja) * 2001-04-24 2002-11-08 Ngk Spark Plug Co Ltd 基板の製造方法
JP4932133B2 (ja) * 2002-06-06 2012-05-16 日本電気株式会社 積層膜パターンの形成方法
JP2007053391A (ja) * 2006-09-28 2007-03-01 Hitachi Ltd 半導体集積回路装置の製造方法
US7718538B2 (en) * 2007-02-21 2010-05-18 Applied Materials, Inc. Pulsed-plasma system with pulsed sample bias for etching semiconductor substrates
JP5308080B2 (ja) * 2008-06-18 2013-10-09 Ｓｐｐテクノロジーズ株式会社 シリコン構造体の製造方法及びその製造装置並びにその製造プログラム

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