JP2012123907A - Lamp - Google Patents

Lamp Download PDF

Info

Publication number
JP2012123907A
JP2012123907A JP2010271021A JP2010271021A JP2012123907A JP 2012123907 A JP2012123907 A JP 2012123907A JP 2010271021 A JP2010271021 A JP 2010271021A JP 2010271021 A JP2010271021 A JP 2010271021A JP 2012123907 A JP2012123907 A JP 2012123907A
Authority
JP
Japan
Prior art keywords
light
lamp
led
reflector
scattering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010271021A
Other languages
Japanese (ja)
Other versions
JP5337786B2 (en
Inventor
Akiko Iizuka
亜紀子 飯塚
Norio Nakazato
典生 中里
Atsushi Hatakeyama
篤史 畠山
Kazuo Nomura
和男 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Appliances Inc
Original Assignee
Hitachi Appliances Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Appliances Inc filed Critical Hitachi Appliances Inc
Priority to JP2010271021A priority Critical patent/JP5337786B2/en
Priority to TW100138866A priority patent/TWI449864B/en
Priority to CN201110400028.0A priority patent/CN102563412B/en
Publication of JP2012123907A publication Critical patent/JP2012123907A/en
Application granted granted Critical
Publication of JP5337786B2 publication Critical patent/JP5337786B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve problems wherein a lamp using LEDs has a small amount of emission light to the sides and hardly has emission of light to the back and scattering of light to the back of the lamp is desirable when using the lamp equivalent to a conventional incandescent bulb and wiring for mounting and power feeding becomes complicated if the LEDs do not exist on the same board.SOLUTION: In the lamp, the plurality of LEDs 4 are arranged on the same LED board 3, and a cover 2 having a light-transmitting property and light-scattering nature covers the whole LED board 3 by internally preparing a space. A reflector structure 1 existing on the same normal to a light-emitting surface and covering at least a part of the light-emitting surface is arranged at an upper part of the light-emitting surface of LEDs 4 and inside the cover 2.

Description

本発明は、ランプ(照明装置)に関し、特に光源としてLED(Light Emitting Diode)などの半導体発光素子を備え、主に白熱電球の代替品として用いられるランプに関するものである。   The present invention relates to a lamp (illuminating device), and more particularly to a lamp that includes a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source and is mainly used as an alternative to an incandescent bulb.

近年、地球温暖化の防止のために、省エネルギ化が進められており、照明分野において、従来の白熱電球の代替として、LEDを用いたランプの研究・開発が行われている。既存の白熱電球と比べて、LEDを用いたランプは高いエネルギ効率を持つ。LEDを用いたランプの用途拡大を考える場合、既存の白熱電球のソケットをそのまま利用ができることが求められ、従来の白熱電球と同等に用いられることが望ましい。   In recent years, energy saving has been promoted in order to prevent global warming, and in the lighting field, research and development of lamps using LEDs have been conducted as an alternative to conventional incandescent bulbs. Compared with existing incandescent bulbs, lamps using LEDs have higher energy efficiency. When considering expanding the application of lamps using LEDs, it is required that the sockets of existing incandescent bulbs can be used as they are, and it is desirable to use them in the same manner as conventional incandescent bulbs.

LEDは光出射時の直進性が強く、従来の白熱電球と同等に用いる場合には、光の配光をある程度広げる必要がある。   The LED has a strong straightness at the time of light emission, and when used in the same way as a conventional incandescent bulb, it is necessary to widen the light distribution to some extent.

本技術分野の背景技術として、特開2010−62005号公報(特許文献1)がある。この公報には、半導体発光素子を光源とすることで、省エネルギ化を図りながら、外観サイズの大小に関係なく、種々の配光特性を実現することができるランプを提供する、と記載されている。ランプの側方に光を出射するために、基台と、給電口金と、発光ユニットと、点灯回路と反射体とを主な構成要素として備えている。特許文献1の図1に示されたランプでは、中空円錐状の反射体は、円環状に複数個配置された発光ユニットと基台における他方の円形開口の中心部から突出した点灯回路の電子部品の間に介挿され、発光ユニット側が光反射面となっている。特許文献1の図3に示されたランプでは、反射体の形状を逆錐台形状とすることにより、反射体側壁で反射された光が、LED基板の取り付けた面よりも下側にも反射させている。   As background art of this technical field, there is JP 2010-62005 A (Patent Document 1). In this publication, it is described that a lamp capable of realizing various light distribution characteristics regardless of the size of the appearance size while providing energy saving by using a semiconductor light emitting element as a light source is described. Yes. In order to emit light to the side of the lamp, a base, a feeding base, a light emitting unit, a lighting circuit and a reflector are provided as main components. In the lamp shown in FIG. 1 of Patent Document 1, a plurality of hollow conical reflectors are light emitting units arranged in an annular shape and an electronic component of a lighting circuit protruding from the center of the other circular opening in the base The light emitting unit side is a light reflecting surface. In the lamp shown in FIG. 3 of Patent Document 1, the shape of the reflector is inverted frustum, so that the light reflected by the reflector side wall is also reflected below the surface on which the LED substrate is attached. I am letting.

特開2010−62005号公報JP 2010-62005 A

しかしながら、特許文献1の図1に示されたランプでは、反射体の光反射面の形が円錐状でありかつ発光ユニットが円錐状の反射体の底部外周に配置されているため、側方への光の出射が小さく、後方への光の出射はほとんど無い。従来の白熱電球では、電球の前方,側方だけでなく、後方へも光が及ぶため、従来の白熱電球と同等に用いる場合には、ランプ後方へも光の散乱があることが望ましい。   However, in the lamp shown in FIG. 1 of Patent Document 1, the shape of the light reflecting surface of the reflector is conical and the light emitting unit is disposed on the outer periphery of the bottom of the conical reflector. The emission of light is small and there is almost no emission of light backward. In the conventional incandescent bulb, the light reaches not only the front and side of the bulb but also the rear. Therefore, when used in the same manner as the conventional incandescent bulb, it is desirable that the light is scattered also behind the lamp.

特許文献1の図3に示されたランプでは、反射体の形状を逆錐台形状とすることにより、反射体側壁で反射された光が、LED基板の取り付けた面よりも下側にも反射させているが、上方への光量を確保するために、反射体の上面にもLEDを配置しているため、複数のLEDが同一基板上に存在せず、実装や給電用の配線が複雑になる。   In the lamp shown in FIG. 3 of Patent Document 1, the shape of the reflector is inverted frustum, so that the light reflected by the reflector side wall is also reflected below the surface on which the LED substrate is attached. However, in order to secure the amount of light upward, LEDs are also arranged on the upper surface of the reflector, so that a plurality of LEDs do not exist on the same substrate, and the wiring for mounting and feeding is complicated. Become.

本発明は、複数のLEDを同一基板上に配置することでLEDの実装を簡易化し、様々な配光特性を実現することができるランプを提供することを目的とする。   An object of this invention is to provide the lamp | ramp which simplifies mounting of LED by arrange | positioning several LED on the same board | substrate, and can implement | achieve various light distribution characteristics.

本発明は、発光体の発光面の上方かつカバー内部空間に設置される構造体に、透光性を持たせ、かつ光を散乱させる機能を持たせたことを特徴とする。   The present invention is characterized in that the structure installed above the light emitting surface of the light emitter and in the space inside the cover is provided with a light transmitting property and a function of scattering light.

または、本発明は、LEDの発光面に対向する面を有するリフレクタを、透光性を持つ材料で構成し、さらにリフレクタのLEDの発光面に対向する面に、光を散乱させる処理を施したことを特徴とする。   Alternatively, in the present invention, the reflector having a surface facing the light emitting surface of the LED is made of a light-transmitting material, and the surface of the reflector facing the light emitting surface of the LED is subjected to a process of scattering light. It is characterized by that.

または、本発明は、LEDの発光面に対向する面を有するリフレクタを、透光性を持つ材料で構成し、さらにリフレクタのLEDの発光面に対向する面での光の散乱を、リフレクタの他の面よりも強くしたことを特徴とする。   Alternatively, according to the present invention, the reflector having a surface facing the light emitting surface of the LED is made of a light-transmitting material, and light scattering on the surface of the reflector facing the light emitting surface of the LED is performed in addition to the reflector. It is characterized by being stronger than the surface.

本発明によれば、構造体に、透光性を持たせ、かつ光を散乱させる機能を持たせたことにより、発光体の発光方向とは異なる方向への光の出射を確保しつつ、ランプ点灯時にカバー表面上に構造体の影が投影されるのを抑制できる。   According to the present invention, the structure is provided with a light-transmitting property and a function of scattering the light, thereby ensuring the emission of light in a direction different from the light-emitting direction of the light-emitting body, and the lamp. It is possible to prevent the shadow of the structure from being projected on the cover surface during lighting.

本発明によれば、LEDの発光面に対向する面を有するリフレクタを、透光性を持つ材料で構成し、さらにリフレクタのLEDの発光面に対向する面に、光を散乱させる処理を施したことにより、LEDの発光方向とは異なる方向への光の出射を確保しつつ、ランプ点灯時にリフレクタの影がカバー表面上に投影されるのを抑制できる。   According to the present invention, the reflector having a surface facing the light emitting surface of the LED is made of a material having translucency, and the surface of the reflector facing the light emitting surface of the LED is subjected to a process of scattering light. Thus, it is possible to prevent the shadow of the reflector from being projected onto the cover surface when the lamp is lit while ensuring the emission of light in a direction different from the light emission direction of the LED.

本発明によれば、LEDの発光面に対向する面を有するリフレクタを、透光性を持つ材料で構成し、さらにリフレクタのLEDの発光面に対向する面での光の散乱を、リフレクタの他の面よりも強くしたことにより、LEDの発光方向とは異なる方向への光の出射を確保しつつ、ランプ点灯時にリフレクタの影がカバー表面上に投影されるのを抑制できる。   According to the present invention, the reflector having a surface facing the light emitting surface of the LED is made of a light-transmitting material, and light scattering on the surface of the reflector facing the light emitting surface of the LED is performed in addition to the reflector. By making it stronger than this surface, it is possible to prevent the shadow of the reflector from being projected onto the cover surface when the lamp is lit while ensuring the emission of light in a direction different from the light emission direction of the LED.

本発明の実施例1の発光部の側方から見た断面図である。It is sectional drawing seen from the side of the light emission part of Example 1 of this invention. 本発明のランプの上面図である。It is a top view of the lamp of the present invention. 本発明の実施例2の発光部の側方から見た断面図である。It is sectional drawing seen from the side of the light emission part of Example 2 of this invention. 本発明の実施例3の発光部の側方から見た断面図である。It is sectional drawing seen from the side of the light emission part of Example 3 of this invention. 本発明の実施例4の発光部の側方から見た断面図である。It is sectional drawing seen from the side of the light emission part of Example 4 of this invention. 本発明の発光部を白熱電球に利用した場合の断面図である。It is sectional drawing at the time of utilizing the light emission part of this invention for an incandescent lamp.

本発明に係るランプは、同一基板上に複数の発光体が設置され、発光体を保護し、透光性があり、かつ光の散乱性を持つカバーが有り、発光体の発光面の上方かつカバー内部に、発光面の少なくとも一部を覆う構造体を有することを特徴とする。別例として、前記発光体に半導体発光素子を用いたことを特徴とする。別例として、発光面の少なくとも一部を覆う前記構造体に、透光性を持ちかつ光を散乱させる材料を用いたことを特徴とする。
別例として、発光面の少なくとも一部を覆う前記構造体に、透光性を持つ材料を用い、発光体と対する面にのみ、光を散乱させる機能を持つことを特徴とする。別例として、前記構造体に、透光性を持ちかつ光を散乱させる材料を用い、発光体と対する面にのみ、光を散乱させる機能を持つことを特徴とする。別例として、前記基板に、配線が絶縁されている金属材料を用い、発光体設置面の裏側にヒートシンクを持ち、電源と接続するための口金を持つことを特徴とし、前記構造体に透光性や光を散乱させるなどの機能を持つことを特徴とする。また、別例として、前記基板と前記ヒートシンクは熱結合されており、前記ヒートシンクと前記口金は電気的に絶縁されているが、熱結合されていることを特徴とする。
The lamp according to the present invention has a plurality of light emitters installed on the same substrate, protects the light emitters, has a light-transmitting cover, and has a light-scattering cover. It has a structure that covers at least a part of the light emitting surface inside the cover. As another example, a semiconductor light emitting element is used for the light emitter. As another example, the structure that covers at least a part of the light emitting surface is made of a light-transmitting material that scatters light.
As another example, a light-transmitting material is used for the structure covering at least a part of the light-emitting surface, and only the surface facing the light-emitting body has a function of scattering light. As another example, the structure has a function of scattering light only on a surface facing the light emitter by using a light-transmitting material that scatters light. As another example, the substrate is made of a metal material whose wiring is insulated, has a heat sink on the back side of the light-emitting body installation surface, and has a base for connecting to a power source. It is characterized by having functions such as scattering of light and light. As another example, the substrate and the heat sink are thermally coupled, and the heat sink and the base are electrically insulated, but are thermally coupled.

本発明に係るランプでは、複数の発光体が設置された基板,透光性があり、かつ光の散乱性を持つカバー,発光体の発光面の少なくとも一部を覆う構造体で主に構成されている。以下、この構造体の名前をリフレクタ構造体と名付けて説明する。リフレクタ構造体が、発光面からの光を散乱させるため、側方や後方にも光が出射させることができる。また、本発明に係るランプでは、発光体に半導体発光素子、例えばLEDを用いることにより、省エネルギ化や発光体の小型化が期待できる。また、本発明に係るランプでは、リフレクタ構造体に、透光性を持ちかつ光を散乱させる材料を用いることで、光を側方や後方に出射させる。また、透光性を持つため、点灯時にリフレクタ構造体の影がカバー表面上に投影されにくい特徴も持つ。また、本発明に係るランプでは、リフレクタ構造体に、透光性を持つ材料を用い、発光体と面する面にのみ、光を散乱させる面を持つ。発光体と面する面にのみ、光を散乱させる材料が存在するので、散乱剤の濃度や性質を変更することにより、配光特性を制御することができる。また、本発明に係るランプでは、リフレクタ構造体に、透光性を持ちかつ光を散乱させる材料を用い、発光体と対する面にのみ、さらに散乱機能を持たせることにより、様々な配光特性を制御することができる。また、本発明に係るランプでは、白熱電球の代替用途として用いることを考えると、電球と類似形状を持つことが望ましい。複数のLEDが設置されている前記基板の裏側に、ヒートシンクを持ち、従来の白熱電球のソケットと接続するための口金を持つ。また、ヒートシンクは空洞になっており、LEDを家庭用交流電源で駆動させるために、交流から直流に変換する回路を備えることができる。また、本発明に係るランプでは、LEDは温度が低いほうが発光効率は高く、高温下では寿命が短くなるためヒートシンクを設けている。ヒートシンクと口金を熱結合することにより放熱性を高めることができ、また、電気的に絶縁することにより、ユーザがヒートシンクに触れた時の感電を防止するため、安全性を確保することができる。   The lamp according to the present invention is mainly composed of a substrate on which a plurality of light emitters are installed, a cover that is translucent and has light scattering properties, and a structure that covers at least a part of the light emitting surface of the light emitter. ing. Hereinafter, the name of this structure will be described as a reflector structure. Since the reflector structure scatters light from the light emitting surface, the light can be emitted to the side and the rear. Further, in the lamp according to the present invention, energy saving and downsizing of the light emitter can be expected by using a semiconductor light emitting element such as an LED as the light emitter. In the lamp according to the present invention, the reflector structure is made of a light-transmitting material that scatters light, thereby emitting light laterally or rearward. Moreover, since it has translucency, it has the characteristic that the shadow of a reflector structure is hard to be projected on the cover surface at the time of lighting. Further, in the lamp according to the present invention, a material having translucency is used for the reflector structure, and the light scattering surface is provided only on the surface facing the light emitter. Since there is a material that scatters light only on the surface facing the light emitter, the light distribution characteristics can be controlled by changing the concentration and properties of the scattering agent. Further, in the lamp according to the present invention, various light distribution characteristics can be obtained by using a material having translucency and light scattering for the reflector structure, and further providing a scattering function only on the surface facing the light emitter. Can be controlled. In addition, it is desirable that the lamp according to the present invention has a shape similar to that of a light bulb when considering use as an alternative to an incandescent bulb. On the back side of the substrate on which a plurality of LEDs are installed, there is a heat sink and a base for connecting to a conventional incandescent light bulb socket. Further, the heat sink is hollow, and a circuit for converting from alternating current to direct current can be provided in order to drive the LED with a household alternating current power supply. In the lamp according to the present invention, the LED is provided with a heat sink because the lower the temperature, the higher the luminous efficiency and the shorter the life at high temperatures. Heat dissipation can be enhanced by thermally coupling the heat sink and the base, and electrical insulation can prevent electrical shock when the user touches the heat sink, thus ensuring safety.

以下、実施例1から4について図面を用いて説明する。   Hereinafter, Examples 1 to 4 will be described with reference to the drawings.

本実施例では、光の配光制御を行うリフレクタ構造体の例を説明する。   In this embodiment, an example of a reflector structure that performs light distribution control will be described.

図1は本発明の実施例1の発光部の側方から見た断面図である。基本構成は、リフレクタ構造体1(反射構造体)と、LED4が実装されるLED基板3と、光源であるLED4(発光体)と、カバー2である。図1では、LED4は上面に発光面を持つ。蛍光灯や白熱電球に比較すると、LED4からの光は指向性が高い。よって、上面に発光面を持つLED4では、上方向に光が集中し、上方向の光強度が側方などの光強度よりも高い。   FIG. 1 is a cross-sectional view of a light emitting unit according to Example 1 of the present invention viewed from the side. The basic configuration is a reflector structure 1 (reflection structure), an LED substrate 3 on which the LED 4 is mounted, an LED 4 (light emitter) as a light source, and a cover 2. In FIG. 1, the LED 4 has a light emitting surface on the upper surface. Compared with fluorescent lamps and incandescent lamps, the light from the LED 4 has higher directivity. Therefore, in the LED 4 having the light emitting surface on the upper surface, the light concentrates in the upward direction, and the light intensity in the upward direction is higher than the light intensity on the side.

リフレクタ構造体1は、円柱の上に逆円錐台が乗った形状を有する。つまり、リフレクタ構造体1は、下端から上方にいくに従って外周径が変わらず、途中から上方にいくに従って外周径が次第に(直線的に)大きくなり、上端付近から上端までは外周径が変わらない形状を有する。リフレクタ構造体1の高さ方向(上下方向)に対する逆円錐台の側面の傾斜角aは、略45度程度である。ただし、45度よりも大きくてもよいし、45度よりも小さくてもよい。リフレクタ構造体1の円柱部から逆円錐台部への切り返し部分が、なだらかに湾曲していてもよい。円柱部から逆円錐台部への切り返し部分は、リフレクタ構造体1の全高の半分よりもやや低い位置である。ただし、円柱部から逆円錐台部への切り返し部分は、LED基板3上に配置されたLED4の発光面であるLED4の上面よりも高ければよい。リフレクタ構造体1の高さ方向の断面は、円形状であるが、多角形状であってもよい。複数のLED4は、リフレクタ構造体1の根元(円柱部)の外周側に配置される。リフレクタ構造体1のうちLED4に近い側を円柱形状とすることによって、リフレクタ構造体1とLED4との物理的距離を長くすることができ、LED4の熱によってリフレクタ構造体1が劣化または損傷するのを抑制することができる。   The reflector structure 1 has a shape in which an inverted truncated cone rides on a cylinder. That is, the reflector structure 1 has a shape in which the outer diameter does not change as it goes upward from the lower end, the outer diameter gradually increases (linearly) as it goes from the middle to the upper side, and the outer diameter does not change from the vicinity of the upper end to the upper end. Have The inclination angle a of the side surface of the inverted truncated cone with respect to the height direction (vertical direction) of the reflector structure 1 is about 45 degrees. However, it may be larger than 45 degrees or smaller than 45 degrees. The turned-back portion from the cylindrical portion of the reflector structure 1 to the inverted truncated cone portion may be gently curved. The turned-back portion from the cylindrical portion to the inverted truncated cone portion is at a position slightly lower than half of the total height of the reflector structure 1. However, the turning portion from the cylindrical portion to the inverted truncated cone portion only needs to be higher than the upper surface of the LED 4 that is the light emitting surface of the LED 4 arranged on the LED substrate 3. The cross section in the height direction of the reflector structure 1 is circular, but may be polygonal. Several LED4 is arrange | positioned at the outer peripheral side of the base (column part) of the reflector structure 1. FIG. By making the side close to the LED 4 in the reflector structure 1 cylindrical, the physical distance between the reflector structure 1 and the LED 4 can be increased, and the reflector structure 1 is deteriorated or damaged by the heat of the LED 4. Can be suppressed.

リフレクタ構造体1は、ガラスやポリカーボネート(樹脂)などの透光性材料を用いている。透光性材料は無色透明であるのが好ましいが、有色や半透明であってもよい。透光性材料の透光率は、80%以上であるのが好ましい。ガラスを用いた場合には、LED4との対向面100(逆円錐台部の側面(傾斜面))の表面に、シリカ(二酸化ケイ素)などの微粒子を固着させることで、散乱特性を持たせることができる。また、対向面100の表面には、アルミなどの金属を蒸着などで形成しても良い。逆円錐台部の側面だけでなく、円柱部の側面にも、微粒子固着や金属蒸着などの光散乱処理を施してもよい。よって、微粒子固着や金属蒸着などの光散乱処理を施した対向面100は、光散乱処理を施さないリフレクタ構造体1の他の表面、例えばリフレクタ構造体1の上面(逆円錐台の底面)よりも、光の散乱が強い(光が散乱しやすい)。そして、例えば、微粒子固着や金属蒸着などの光散乱処理を施した対向面100の透光率は、50%前後である。つまり、対向面100に入射する光の半分は、反射し、残りの半分は、通過(透過)する。つまり、図1のように対向面100がLED4の発光面に対向するようにリフレクタ構造体1とLED4を配置した場合には、LED4から対向面100に入射する光の半分は、対向面100よりも下側へ反射し、残りの約半分は、対向面100よりも上側へ通過する。ただし、微粒子固着や金属蒸着などの光散乱処理を施した対向面100の透光率は、50%より小さくてもよいし、50%より大きくてもよい。また、ガラス内に1000nm程度の大きさのシリカなどの微粒子を混ぜて散乱特性を持たせることが可能である。対向面100に散乱特性を持たせ、さらにガラス内に微粒子を混ぜても良い。   The reflector structure 1 uses a translucent material such as glass or polycarbonate (resin). The translucent material is preferably colorless and transparent, but may be colored or translucent. The translucency of the translucent material is preferably 80% or more. When glass is used, scattering characteristics are obtained by fixing fine particles such as silica (silicon dioxide) on the surface of the surface 100 facing the LED 4 (side surface (inclined surface) of the inverted truncated cone). Can do. Further, a metal such as aluminum may be formed on the surface of the facing surface 100 by vapor deposition or the like. Not only the side surface of the inverted truncated cone part but also the side surface of the cylindrical part may be subjected to light scattering treatment such as fine particle fixation and metal deposition. Therefore, the opposing surface 100 subjected to the light scattering process such as fine particle fixation or metal vapor deposition is from the other surface of the reflector structure 1 that is not subjected to the light scattering process, for example, the upper surface of the reflector structure 1 (the bottom surface of the inverted truncated cone). However, light scattering is strong (light is easily scattered). For example, the transmissivity of the facing surface 100 subjected to light scattering treatment such as fine particle fixation or metal deposition is about 50%. That is, half of the light incident on the facing surface 100 is reflected and the other half is transmitted (transmitted). That is, when the reflector structure 1 and the LED 4 are arranged so that the facing surface 100 faces the light emitting surface of the LED 4 as shown in FIG. 1, half of the light incident on the facing surface 100 from the LED 4 is from the facing surface 100. Is reflected downward, and the remaining half passes above the opposing surface 100. However, the transmissivity of the facing surface 100 subjected to light scattering treatment such as fine particle fixation or metal vapor deposition may be smaller than 50% or larger than 50%. Further, it is possible to give scattering characteristics by mixing fine particles such as silica having a size of about 1000 nm in glass. The opposing surface 100 may have scattering characteristics, and fine particles may be mixed in the glass.

リフレクタ構造体1にポリカーボネートを用いた場合には、ポリカーボネートに1000nm程度の微粒子、例えばポリカーボネートやPMMA(ポリメチルメタクリレート)などを混ぜたものを用いる。対向面100には、シリカなどの微粒子を固着させても良いし、アルミなどの金属を蒸着などで形成しても良い。リフレクタ構造体1は、内部までガラスやポリカーボネートで構成されてもよいし、中空であってもよい。リフレクタ構造体1にポリカーボネートよりもガラスを用いたほうが、リフレクタ構造体1の透光率を高く、耐熱性も高くすることができ、劣化も抑えることができる。   When polycarbonate is used for the reflector structure 1, a mixture of polycarbonate with fine particles of about 1000 nm, such as polycarbonate or PMMA (polymethyl methacrylate), is used. Fine particles such as silica may be fixed to the facing surface 100, or a metal such as aluminum may be formed by vapor deposition. The reflector structure 1 may be made of glass or polycarbonate up to the inside, or may be hollow. When glass is used for the reflector structure 1 rather than polycarbonate, the light transmittance of the reflector structure 1 can be increased, heat resistance can be increased, and deterioration can be suppressed.

LED基板3は放熱を考えると、配線と絶縁されている金属材料(例えば、アルミニウムやアルミニウム合金,銅)であることが望ましい。LED基板3に樹脂を用いた場合には、LED基板3下に金属材料(例えば、アルミニウムやアルミニウム合金,銅)などの基板を配置すると、伝熱特性を改善することができる。   The LED substrate 3 is preferably made of a metal material (for example, aluminum, aluminum alloy, or copper) that is insulated from the wiring in consideration of heat dissipation. When a resin is used for the LED substrate 3, heat transfer characteristics can be improved by disposing a substrate such as a metal material (for example, aluminum, aluminum alloy, copper) under the LED substrate 3.

カバー2は、ガラスやポリカーボネートなどの透光性材料を用いる。例えば、カバー2は、内部がクリアに見えないように、乳白色であることが望ましい。カバー2の内側面(LED4の配置側面)には、カバー内側散乱剤200が塗布されている。ガラスを用いた場合には、カバー内側散乱剤200に、シリカなどの微粒子を固着させることで、散乱特性を持たせることができる。また、ガラス内に1000nm程度の大きさのシリカなどの微粒子を混ぜて散乱特性を持たせても良い。カバー2にポリカーボネートを用いた場合は、ポリカーボネートに1000nm程度の大きさの微粒子、例えばポリカーボネートやPMMAなどを混ぜて、散乱性を持たせることができる。この場合はカバー内側散乱剤200を形成しなくても良い。   The cover 2 is made of a translucent material such as glass or polycarbonate. For example, the cover 2 is preferably milky white so that the inside does not appear clear. The cover inner scattering agent 200 is applied to the inner side surface of the cover 2 (the side surface on which the LEDs 4 are arranged). When glass is used, scattering properties can be imparted by fixing fine particles such as silica to the cover inner scattering agent 200. Further, fine particles such as silica having a size of about 1000 nm may be mixed in the glass so as to have scattering characteristics. When polycarbonate is used for the cover 2, the polycarbonate can be mixed with fine particles having a size of about 1000 nm, for example, polycarbonate or PMMA, so as to have scattering properties. In this case, the cover inner scattering agent 200 may not be formed.

図2は本発明の発光部の上面図である。LED基板3には、複数のLED4(図2では8個)が同心円上に配置され、LED4の発光面の少なくとも一部を覆う様にリフレクタ構造体1が設置されている。つまり、発光部上方から見ると、LED4の内周側が、リフレクタ構造体1の外周端部にオーバーラップしている。リフレクタ構造体1が透光性を持つため、LED4の発光面の少なくとも一部を覆っても、上方への光量をある程度確保できる。例えば、リフレクタ構造体1が覆う部分は、LED4の幅d(複数のLED4が配置された同心円を基準にすると半径方向の長さ)の1/2である。つまり、LED4の光の半分が、リフレクタ構造体1で散乱され、残りの半分が、リフレクタ構造体1で散乱されずに、直接放出される。リフレクタ構造体1が覆う部分は、LED4の幅dの1/2よりも大きくてもよいし、小さくてもよい。リフレクタ構造体1が覆う部分がLED4の幅dの1/2より大きくなると、LED4からの直接光が減り、上方への光量が減り、逆に、リフレクタ構造体1が覆う部分がLED4の幅dの1/2より小さくなると、LED4からの直接光が増え、上方への光量も増える。配線が簡素なため、複数のLED4は、1つのLED基板3(同一のLED基板3)上に実装されるのが好ましいが、複数のLED基板3に分散されて実装されてもよい。複数のLED4は、1つの同心円上に配置される代わりに、複数の同心円上に交互に配置されてもよい。つまり、複数のLED4は、内周側,外周側と交互に配置されてもよい。   FIG. 2 is a top view of the light emitting portion of the present invention. A plurality of LEDs 4 (eight in FIG. 2) are concentrically arranged on the LED substrate 3, and the reflector structure 1 is installed so as to cover at least a part of the light emitting surface of the LEDs 4. That is, when viewed from above the light emitting unit, the inner peripheral side of the LED 4 overlaps the outer peripheral end of the reflector structure 1. Since the reflector structure 1 has translucency, even if it covers at least a part of the light emitting surface of the LED 4, it is possible to secure a certain amount of light upward. For example, the portion covered by the reflector structure 1 is ½ of the width d of the LED 4 (the length in the radial direction with reference to the concentric circle in which the plurality of LEDs 4 are arranged). That is, half of the light from the LED 4 is scattered by the reflector structure 1 and the other half is directly emitted without being scattered by the reflector structure 1. The portion covered by the reflector structure 1 may be larger or smaller than ½ of the width d of the LED 4. When the portion covered by the reflector structure 1 is larger than ½ of the width d of the LED 4, the direct light from the LED 4 is reduced and the amount of light upward is reduced. Conversely, the portion covered by the reflector structure 1 is the width d of the LED 4. If it becomes smaller than 1/2 of this, the direct light from LED4 will increase and the light quantity upward will also increase. Since the wiring is simple, the plurality of LEDs 4 are preferably mounted on one LED substrate 3 (the same LED substrate 3), but may be distributed and mounted on the plurality of LED substrates 3. The plurality of LEDs 4 may be alternately arranged on a plurality of concentric circles instead of being arranged on one concentric circle. That is, the plurality of LEDs 4 may be alternately arranged on the inner peripheral side and the outer peripheral side.

リフレクタ構造体1は、LED基板3上に形成されてもよいし、LED基板3の中心部に貫通孔を設け、その貫通孔に形成されてもよい。カバー2は、LED基板3上に形成されてもよい。つまり、LED基板3の外周部に、カバー2の円周端面が連結されてもよい。また、LED基板3の外周側に形成されてもよい。   The reflector structure 1 may be formed on the LED substrate 3, or a through hole may be provided in the center of the LED substrate 3 and formed in the through hole. The cover 2 may be formed on the LED substrate 3. That is, the circumferential end surface of the cover 2 may be coupled to the outer peripheral portion of the LED substrate 3. Further, it may be formed on the outer peripheral side of the LED substrate 3.

リフレクタ構造体1の散乱剤の組み合わせを変更することにより、散乱特性を制御することができるので、発光部の配光を制御することができる。   Since the scattering characteristics can be controlled by changing the combination of the scattering agents of the reflector structure 1, the light distribution of the light emitting unit can be controlled.

リフレクタ構造体1が、LED4の発光面からの光を散乱させるため、発光部の側方や後方にも光を出射させることができる。発光体に半導体発光素子、例えばLED4を用いることにより、省エネルギ化や発光体の小型化が期待できる。リフレクタ構造体1に、透光性を持ちかつ光を散乱させる材料を用いることで、光を側方や後方に出射させることができる。また、透光性を持つため、発光部点灯時にリフレクタ構造体1の影がカバー2に投影されにくい。よって、上方,側方,後方への配光を確保しつ、光(強度)のムラも低減できる。また、リフレクタ構造体1に、透光性を持つ材料を用い、LED4と面する対向面100にのみ、光を散乱させる面を持つので、散乱剤の濃度や性質を変更することにより、配光特性を制御することができる。また、リフレクタ構造体1に、透光性を持ちかつ光を散乱させる材料を用い、さらにLED4と対する対向面100のみに散乱機能を持たせることにより、様々な配光特性を制御することができる。   Since the reflector structure 1 scatters the light from the light emitting surface of the LED 4, the light can be emitted to the side and the rear of the light emitting unit. By using a semiconductor light emitting element such as the LED 4 for the light emitter, energy saving and size reduction of the light emitter can be expected. By using a material that has translucency and scatters light for the reflector structure 1, light can be emitted sideways or rearward. Moreover, since it has translucency, the shadow of the reflector structure 1 is hard to be projected on the cover 2 when the light emitting unit is turned on. Therefore, unevenness of light (intensity) can be reduced while ensuring the light distribution upward, laterally, and backward. In addition, since the reflector structure 1 is made of a light-transmitting material and only the facing surface 100 facing the LED 4 has a light scattering surface, the light distribution can be achieved by changing the concentration and properties of the scattering agent. Properties can be controlled. Moreover, various light distribution characteristics can be controlled by using a light-transmitting material that scatters light for the reflector structure 1 and by providing a scattering function only to the facing surface 100 facing the LED 4. .

リフレクタ構造体1が、透光性を持つため、リフレクタ構造体1の上面(逆円錐台の底面)に、LED4を配置しなくても、発光部上方への光量を確保できる。また、発光部上方から見ると、LED4の外周側がリフレクタ構造体1にオーバーラップしていないため、リフレクタ構造体1の上面(逆円錐台の底面)に、LED4を配置しなくても、発光部上方への光量を確保できる。カバー2の内部に、散乱機能を持つリフレクタ構造体1を備えたことにより、リフレクタ構造体1がない場合に比較して、散乱効果を向上でき、光(強度)のムラも低減できる。   Since the reflector structure 1 has translucency, the amount of light above the light emitting unit can be secured without arranging the LED 4 on the upper surface of the reflector structure 1 (the bottom surface of the inverted truncated cone). Moreover, since the outer peripheral side of the LED 4 does not overlap the reflector structure 1 when viewed from above the light emitting part, the light emitting part can be obtained without arranging the LED 4 on the upper surface of the reflector structure 1 (the bottom surface of the inverted truncated cone). The amount of light upward can be secured. By providing the reflector structure 1 having a scattering function inside the cover 2, the scattering effect can be improved and the unevenness of light (intensity) can be reduced as compared with the case where the reflector structure 1 is not provided.

次に、白熱電球の代替用途を考えたランプに付いて説明する。図6は、本発明のランプを白熱電球に利用した場合の断面図である。リフレクタ構造体1,カバー2,LED基板3,LED4,ヒートシンク10(ランプ本体),口金11,LED4を駆動するためのLED駆動回路(図示せず)で主に構成されている。   Next, a lamp for an alternative use of an incandescent bulb will be described. FIG. 6 is a cross-sectional view when the lamp of the present invention is used in an incandescent bulb. The reflector structure 1, the cover 2, the LED substrate 3, the LED 4, the heat sink 10 (lamp body), the base 11, and an LED drive circuit (not shown) for driving the LED 4 are mainly configured.

図6に示すように、カバー2がLED基板3上に形成される場合は、LED基板3の下面が、ヒートシンク10の上面に連結される。ただし、カバー2をヒートシンク10の上面に連結し、カバー2の内側で、ヒートシンク10の上面にLED基板3を配置してもよい。LED基板3は、放熱を考慮するために配線と絶縁された金属材料、例えばアルミニウムなどを用いることが望ましい。ヒートシンク10は、逆円錐台形状を有し、上端から下端に向かって外周径が次第に小さくなる形状を有する。ヒートシンク10は内部にLED駆動回路を入れるために、空洞がある。ヒートシンク10も、放熱を考慮するために金属材料、例えばアルミニウムなどを用いることが望ましい。ヒートシンク10の側面は、平滑に形成されているが、放熱用のフィンが形成されていてもよい。LED駆動回路とヒートシンク10は、シリコーン樹脂などを挿入することにより、電気的に絶縁されている。既存の白熱電球のソケットを用いるために、同様の形状の口金11を持つ。ヒートシンク10と口金11を熱結合することにより放熱性を高めることができ、また、電気的に絶縁することにより、ユーザがヒートシンクに触れた時の感電を防止するため、安全性を確保することができる。熱結合と絶縁の両立をするために、伝熱効果の高い樹脂を用いる。   As shown in FIG. 6, when the cover 2 is formed on the LED substrate 3, the lower surface of the LED substrate 3 is connected to the upper surface of the heat sink 10. However, the cover 2 may be connected to the upper surface of the heat sink 10, and the LED substrate 3 may be disposed on the upper surface of the heat sink 10 inside the cover 2. For the LED substrate 3, it is desirable to use a metal material insulated from the wiring, for example, aluminum in order to consider heat dissipation. The heat sink 10 has an inverted frustoconical shape, and has a shape in which the outer diameter gradually decreases from the upper end toward the lower end. The heat sink 10 has a cavity for containing an LED driving circuit therein. The heat sink 10 is also preferably made of a metal material such as aluminum in order to consider heat dissipation. Although the side surface of the heat sink 10 is formed smoothly, a fin for heat dissipation may be formed. The LED drive circuit and the heat sink 10 are electrically insulated by inserting silicone resin or the like. In order to use an existing incandescent light bulb socket, the base 11 has a similar shape. It is possible to improve heat dissipation by thermally coupling the heat sink 10 and the base 11 and to ensure safety in order to prevent electric shock when the user touches the heat sink by being electrically insulated. it can. In order to achieve both thermal coupling and insulation, a resin having a high heat transfer effect is used.

この形態については、白熱電球用のソケットに取り付けるランプを例に説明したが、前述したリフレクタ構造体1は、このような白熱電球用に限定されず、他タイプのランプにも適用可能であり、特許請求項の範囲に記載した事項の範囲内において、様々に変更した形態にて実施可能である。   About this form, although the lamp attached to the socket for incandescent bulbs was described as an example, the reflector structure 1 described above is not limited to such incandescent bulbs, and can be applied to other types of lamps. Various modifications can be made within the scope of the matters described in the scope of the claims.

また、以上の実施形態において、光源として表面実装型のLED4を用いているが、これに限定されず、他タイプのLEDやその他の発光素子、例えば有機EL、無機ELなどを用いても良い。   In the above embodiment, the surface-mounted LED 4 is used as the light source. However, the present invention is not limited to this, and other types of LEDs and other light emitting elements such as organic EL and inorganic EL may be used.

本実施例2では、実施例1の別方式について説明する。図3は、本発明の実施例2の発光部の側方から見た断面図である。リフレクタ構造体101は、円柱の上に円板が乗った形状を有する。リフレクタ構造体101の断面は、側面から見ると、T字形状を有する。
つまり、リフレクタ構造体101は、下端から上方にいくに従って外周径が変わらず、上端付近で外周径が大きくなり、その上端付近から上端までは外周径が変わらない形状を有する。対向面100は、円板の下面(T字形状の腕部の下面)に形成される。
In the second embodiment, another method of the first embodiment will be described. FIG. 3 is a cross-sectional view seen from the side of the light emitting unit of Example 2 of the present invention. The reflector structure 101 has a shape in which a disk is placed on a cylinder. The cross section of the reflector structure 101 has a T shape when viewed from the side.
That is, the reflector structure 101 has a shape in which the outer diameter does not change as it goes upward from the lower end, the outer diameter increases near the upper end, and the outer diameter does not change from the upper end to the upper end. The facing surface 100 is formed on the lower surface of the disk (the lower surface of the T-shaped arm portion).

リフレクタ構造体101の構造は実施例1と異なるが、そのほかの性質は、実施例1と同様である。リフレクタ構造体101の形状を変更することにより、発光部側方や後方への出射を大きくすることができる。   Although the structure of the reflector structure 101 is different from that of the first embodiment, other properties are the same as those of the first embodiment. By changing the shape of the reflector structure 101, it is possible to increase the emission to the side and rear of the light emitting unit.

本実施例3は、実施例1の別方式について説明する。図4は、本発明の実施例3の発光部の側方から見た断面図である。リフレクタ構造体102は、円柱の上に半球がその曲面を下にして乗った形状を有する。つまり、リフレクタ構造体102は、下端から上方にいくに従って外周径が変わらず、途中から上方にいくに従って外周径が次第に大きくなり、上端付近から上端までは外周径が変わらない形状を有する。対向面100は、半球の曲面に形成される。   In the third embodiment, another method of the first embodiment will be described. FIG. 4 is a cross-sectional view seen from the side of the light emitting unit of Example 3 of the present invention. The reflector structure 102 has a shape in which a hemisphere rides on a cylinder with its curved surface down. That is, the reflector structure 102 has a shape in which the outer peripheral diameter does not change as it goes upward from the lower end, gradually increases from the middle to the upper part, and the outer peripheral diameter does not change from near the upper end to the upper end. The facing surface 100 is formed in a hemispherical curved surface.

リフレクタ構造体102の構造は実施例1と異なるが、そのほかの性質は、実施例1と同様である。リフレクタ構造体102の上面は凹面としても良い。リフレクタ構造体102の形状を変更することにより、発光部側方や後方への出射を大きくすることができる。   The structure of the reflector structure 102 is different from that of the first embodiment, but other properties are the same as those of the first embodiment. The upper surface of the reflector structure 102 may be a concave surface. By changing the shape of the reflector structure 102, it is possible to increase the emission to the side and rear of the light emitting unit.

本実施例4は、実施例1の別方式について説明する。図5は、本発明の実施例4の発光部の側方から見た断面図である。リフレクタ構造体103は、円筒の上に中空の逆円錐台が乗った形状を有する。つまり、リフレクタ構造体103は、下端から上方にいくに従って外周径が変わらず、途中から上方にいくに従って外周径が次第に(直線的に)大きくなり、さらに、下端から上端まで上方にいくに従って内周径が変わらない形状を有する。リフレクタ構造体103は、リフレクタ構造体1の内周をくりぬいた形状を有する。対向面100は、リフレクタ構造体1と同様に、逆円錐台の外周側の側面(傾斜面)に形成される。そして、リフレクタ構造体103の中空部の底面の中央部には、1つのLED4が配置される。この中央部に配置された1つのLED4と、同心円上に配置された複数のLED4とは、同一のLED基板3上に実装されるのが好ましい。   In the fourth embodiment, another method of the first embodiment will be described. FIG. 5 is a cross-sectional view seen from the side of the light emitting unit of Example 4 of the present invention. The reflector structure 103 has a shape in which a hollow inverted truncated cone rides on a cylinder. That is, the outer diameter of the reflector structure 103 does not change as it goes upward from the lower end, the outer diameter gradually increases (linearly) as it goes from the middle to the upper side, and further, the inner circumference increases from the lower end to the upper end. It has a shape whose diameter does not change. The reflector structure 103 has a shape in which the inner periphery of the reflector structure 1 is hollowed out. Similar to the reflector structure 1, the facing surface 100 is formed on the outer peripheral side surface (inclined surface) of the inverted truncated cone. One LED 4 is arranged at the center of the bottom surface of the hollow portion of the reflector structure 103. It is preferable that one LED 4 arranged in the central portion and the plurality of LEDs 4 arranged concentrically are mounted on the same LED substrate 3.

リフレクタ構造体103の構造は実施例1と異なるが、そのほかの性質は、実施例1と同様である。LED基板3中央にリフレクタ構造体103によってLED4の上方が覆われていないLED4を配置することにより、発光部前方への出射を強くすることができる。   The structure of the reflector structure 103 is different from that of the first embodiment, but other properties are the same as those of the first embodiment. By disposing the LED 4 whose upper portion is not covered by the reflector structure 103 at the center of the LED substrate 3, emission to the front of the light emitting unit can be strengthened.

1,101,102,103 リフレクタ構造体
2 カバー
3 LED基板
4 LED
10 ヒートシンク
11 口金
100 対向面
200 カバー内側散乱剤
1, 101, 102, 103 Reflector structure 2 Cover 3 LED substrate 4 LED
10 Heat sink 11 Base 100 Opposing surface 200 Cover inner scattering agent

Claims (11)

発光体と、前記発光体が設置される基板の全面に対して空間を設けて覆うカバーと、前記発光体の発光面の上方かつ前記カバー内部空間に設置される構造体とを備え、
前記構造体は、透光性を持ち、かつ光を散乱させる機能を持つことを特徴とするランプ。
A light emitter, a cover that covers and covers the entire surface of the substrate on which the light emitter is installed, and a structure that is installed above the light emitting surface of the light emitter and in the cover internal space,
The structure has a light-transmitting property and has a function of scattering light.
請求項1記載のランプにおいて、
前記構造体は、当該ランプの上方から見て、前記発光面の少なくとも一部を覆うことを特徴とするランプ。
The lamp of claim 1, wherein
The lamp is characterized in that the structure covers at least a part of the light emitting surface when viewed from above the lamp.
請求項1記載のランプにおいて、
前記発光体に半導体発光素子を用いたことを特徴とするランプ。
The lamp of claim 1, wherein
A lamp using a semiconductor light emitting element as the light emitter.
請求項1記載のランプにおいて、
前記構造体は、透光性を持ちかつ光を散乱させる材料で構成されたことを特徴とするランプ。
The lamp of claim 1, wherein
The said structure is comprised with the material which has translucency and scatters light, It is characterized by the above-mentioned.
請求項1記載のランプにおいて、
前記構造体は、透光性を持つ材料で構成され、前記構造体の表面のうち前記発光体と対向する面にのみ光を散乱させる機能を持つことを特徴とするランプ。
The lamp of claim 1, wherein
The structure is made of a light-transmitting material, and has a function of scattering light only on a surface of the structure that faces the light emitter.
請求項1記載のランプにおいて、
前記構造体は、透光性を持ちかつ光を散乱させる材料で構成され、前記構造体の表面のうち前記発光体と対向する面にのみ光を散乱させる機能がさらに付加されたことを特徴とするランプ。
The lamp of claim 1, wherein
The structure is made of a light-transmitting material that scatters light, and further has a function of scattering light only on the surface of the structure that faces the light emitter. Lamp to do.
請求項1記載のランプにおいて、
前記基板の前記発光体が設置される面の反対面に形成されるヒートシンクと、
電源と接続するための口金を備え、
前記基板に、前記発光体の配線が絶縁されている金属材料を用いたことを特徴とするランプ。
The lamp of claim 1, wherein
A heat sink formed on an opposite surface of the substrate on which the light emitter is installed;
It has a base for connecting to the power supply,
A lamp characterized in that a metal material, in which the wiring of the light emitter is insulated, is used for the substrate.
請求項7記載のランプにおいて、
前記基板と前記ヒートシンクは熱結合されており、
前記ヒートシンクと前記口金は電気的に絶縁されているが、熱結合されていることを特徴とするランプ。
The lamp of claim 7,
The substrate and the heat sink are thermally coupled;
The lamp, wherein the heat sink and the base are electrically insulated but thermally coupled.
LEDと、前記LEDの発光面に対向する面を有するリフレクタとを備えたランプにおいて、
前記リフレクタは、透光性を持つ材料で構成され、
前記リフレクタの前記LEDの発光面に対向する面は、光を散乱させる処理が施されたことを特徴とするランプ。
In a lamp comprising an LED and a reflector having a surface facing the light emitting surface of the LED,
The reflector is made of a translucent material,
The lamp | ramp of the surface which opposes the light emission surface of the said LED of the said reflector was given to the light scattering process, The lamp | ramp characterized by the above-mentioned.
請求項9記載のランプにおいて、
前記リフレクタの前記LEDの発光面に対向する面は、前記LEDの発光面からの光の一部を透過し、他の一部を反射することを特徴とするランプ。
The lamp of claim 9,
The lamp | ramp which faces the light emission surface of the said LED of the said reflector permeate | transmits a part of light from the light emission surface of the said LED, and reflects another part.
LEDと、前記LEDの発光面に対向する面を有するリフレクタとを備えたランプにおいて、
前記リフレクタは、透光性を持つ材料で構成され、
前記リフレクタの前記LEDの発光面に対向する面での光の散乱は、前記リフレクタの他の面よりも強いことを特徴とするランプ。
In a lamp comprising an LED and a reflector having a surface facing the light emitting surface of the LED,
The reflector is made of a translucent material,
The lamp is characterized in that light scattering on the surface of the reflector facing the light emitting surface of the LED is stronger than that of the other surface of the reflector.
JP2010271021A 2010-12-06 2010-12-06 lamp Expired - Fee Related JP5337786B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010271021A JP5337786B2 (en) 2010-12-06 2010-12-06 lamp
TW100138866A TWI449864B (en) 2010-12-06 2011-10-26 Light bulb
CN201110400028.0A CN102563412B (en) 2010-12-06 2011-12-05 Light fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010271021A JP5337786B2 (en) 2010-12-06 2010-12-06 lamp

Publications (2)

Publication Number Publication Date
JP2012123907A true JP2012123907A (en) 2012-06-28
JP5337786B2 JP5337786B2 (en) 2013-11-06

Family

ID=46409595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010271021A Expired - Fee Related JP5337786B2 (en) 2010-12-06 2010-12-06 lamp

Country Status (3)

Country Link
JP (1) JP5337786B2 (en)
CN (1) CN102563412B (en)
TW (1) TWI449864B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098100A (en) * 2011-11-04 2013-05-20 Wun Song Hu High-illumination led bulb having whole emitting angle of 360°
CN103925561A (en) * 2013-01-10 2014-07-16 海洋王(东莞)照明科技有限公司 Light emitting diode (LED) annulus illumination light distribution structure

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102878457A (en) * 2012-09-14 2013-01-16 本科照明有限公司 Wide-angle light-emitting diode (LED) illuminating lamp
CN103712140A (en) * 2012-09-29 2014-04-09 深圳市海洋王照明工程有限公司 Vehicle-mounted signal lamp
CN103712141A (en) * 2012-09-29 2014-04-09 深圳市海洋王照明工程有限公司 Vehicle-mounted signal lamp
CN103712143A (en) * 2012-09-29 2014-04-09 深圳市海洋王照明工程有限公司 Vehicle-mounted warning lamp
CN103712142A (en) * 2012-09-29 2014-04-09 深圳市海洋王照明工程有限公司 Vehicle-mounted warning lamp
CN103411141B (en) * 2012-12-27 2016-09-07 中国计量大学 A kind of LEDbulb lamp with aspheric surface angular mirror structure
CN103343898A (en) * 2013-06-28 2013-10-09 惠州市华阳光电技术有限公司 LED bulb lamp capable of emitting light in wide angle

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3148997U (en) * 2008-12-24 2009-03-05 佑浩股▲分▼有限公司 Light bulb structure
JP2010067363A (en) * 2008-09-08 2010-03-25 Shinmaywa Industries Ltd Lamplight device
JP2010129300A (en) * 2008-11-26 2010-06-10 Keiji Iimura Semiconductor light-emitting lamp and electric-bulb-shaped semiconductor light-emitting lamp
JP2010157459A (en) * 2008-12-31 2010-07-15 Keiji Iimura Led lamp, and bulb-type led lamp
JP3169376U (en) * 2010-08-20 2011-07-28 旭麗電子(廣州)有限公司 Light-emitting diode type lighting device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09167508A (en) * 1995-12-15 1997-06-24 Patoraito:Kk Signal informative display light
CN2618045Y (en) * 2003-03-10 2004-05-26 许顺喜 LED lamp bulb
US7791274B2 (en) * 2004-01-07 2010-09-07 Panasonic Corporation LED lamp
CN1598397A (en) * 2004-09-05 2005-03-23 殷为民 Novel scenery lamp under water
KR100593933B1 (en) * 2005-03-18 2006-06-30 삼성전기주식회사 Side-emitting led package having scattering area and backlight apparatus incorporating the led lens
CN200949767Y (en) * 2006-10-08 2007-09-19 周志邦 LED illumination lamp
TWM329737U (en) * 2007-08-08 2008-04-01 Atom Technology Inc LED lantern structure with lampshades
TWM353290U (en) * 2008-11-19 2009-03-21 U How Co Ltd Bulb structure
KR101027557B1 (en) * 2008-12-16 2011-04-06 한국광기술원 Luminescent diode Lighting Apparatus
TWI375774B (en) * 2009-02-12 2012-11-01 Yuuichi Suzuki Lighting apparatus and display apparatus
CN201425248Y (en) * 2009-04-14 2010-03-17 福建联合动力设备制造有限公司 Lamp
CN201555059U (en) * 2009-10-16 2010-08-18 深圳市众明半导体照明有限公司 LED three-dimensional light source
TWM392322U (en) * 2010-06-09 2010-11-11 Wang Xiang Yun LED bulb with wide-angle illumination

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067363A (en) * 2008-09-08 2010-03-25 Shinmaywa Industries Ltd Lamplight device
JP2010129300A (en) * 2008-11-26 2010-06-10 Keiji Iimura Semiconductor light-emitting lamp and electric-bulb-shaped semiconductor light-emitting lamp
JP3148997U (en) * 2008-12-24 2009-03-05 佑浩股▲分▼有限公司 Light bulb structure
JP2010157459A (en) * 2008-12-31 2010-07-15 Keiji Iimura Led lamp, and bulb-type led lamp
JP3169376U (en) * 2010-08-20 2011-07-28 旭麗電子(廣州)有限公司 Light-emitting diode type lighting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098100A (en) * 2011-11-04 2013-05-20 Wun Song Hu High-illumination led bulb having whole emitting angle of 360°
CN103925561A (en) * 2013-01-10 2014-07-16 海洋王(东莞)照明科技有限公司 Light emitting diode (LED) annulus illumination light distribution structure
CN103925561B (en) * 2013-01-10 2015-10-28 海洋王(东莞)照明科技有限公司 LED ring illumination light distribution structure

Also Published As

Publication number Publication date
CN102563412A (en) 2012-07-11
TWI449864B (en) 2014-08-21
JP5337786B2 (en) 2013-11-06
TW201224361A (en) 2012-06-16
CN102563412B (en) 2015-09-30

Similar Documents

Publication Publication Date Title
JP5337786B2 (en) lamp
US8297797B2 (en) Lighting apparatus
US8807792B2 (en) Lighting apparatus
JP5999498B2 (en) LED and lighting device
US8931929B2 (en) Light emitting diode primary optic for beam shaping
JP5557105B2 (en) Lamp with lamp and lighting equipment
JP2010205553A (en) Lighting device
JP2006202612A (en) Light emission device and lighting system
JP2012181969A (en) Bulb type light-emitting element lamp, and lighting fixture
KR101349843B1 (en) Lighting apparatus
JP2010129501A (en) Illumination device and luminaire
JP4989791B2 (en) lamp
JP2011054340A (en) Lighting device
JP2011108396A (en) Lamp with base, and lighting fixture
JP2011524615A (en) LED lamp with combined heat dissipation structure
US20130250543A1 (en) Lighting device
JP2009009870A (en) Light source unit and compact self-ballasted lamp
JP2012048950A (en) Lamp with base and lighting fixture
TW201326667A (en) LED bulb lamp and LED lamp
TWM457847U (en) Lighting device having a widely light emitting angle
JP5320627B2 (en) Lamp with lamp and lighting equipment
JP6047488B2 (en) Single chamber lighting device
KR101167043B1 (en) Led light with multi-reflector
JP3176524U (en) Wide-area light-emitting diode bulb
TWI457515B (en) Lamp

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20120521

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121029

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121029

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121218

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130319

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130520

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130709

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130805

R150 Certificate of patent or registration of utility model

Ref document number: 5337786

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees