JP2012119571A - Anodization apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anodization apparatus capable of performing batch processing and enhancing an operation rate by minimizing electrode exchange frequency.SOLUTION: In an anodization apparatus, if a substrate holder 41 disposed in a storage tank 9 is allowed to hold a plurality of substrates and electrodes 21 and 23 are electrified, ions move between electrode tanks 21 and 23, which causes a chemical conversion reaction on the plurality of substrates through ion-exchange membranes 29 and 35. Therefore, batch processing that processes the plurality of substrates becomes possible. Moreover, the concentration of the electrolyte solution stored in electrode tanks 5 and 7 is set to be lower than that of the electrolyte solution stored in the storage tank 9. Therefore, since the chemical conversion reaction in the electrode tanks 5 and 7 is suppressed as compared to the inside of the storage tank 9, a local chemical conversion reaction caused at the electrodes 21 and 23 in the electrode tanks 5 and 7 is suppressed. Consequently, the degradation of the electrodes 21 and 23 can be minimized to enhance the operation rate of the apparatus.

Description

  The present invention relates to a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, an organic EL device substrate, an FED (Field Emission Display) substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate. In particular, it relates to anodizing equipment that performs electrolytic etching on various substrates such as solar cell substrates and micro-electro-mechanical system (MEMS) substrates, especially batches that process multiple substrates simultaneously at high throughput. It relates to processing technology.

  Conventionally, as this type of apparatus (first apparatus), a fluororesin chemical conversion tank (2), a pair of platinum electrodes (3a, 3b), and a substrate support (4) for holding the substrate (1) are provided. (See, for example, Patent Document 1).

  The fluororesin chemical conversion tank (2) stores the electrolyte (6a, 6b). A pair of platinum electrodes (3a, 3b) are arranged in a state of being separated in the fluororesin chemical conversion tank (2). The substrate support jig (4) has an opening similar to the outer dimension of the substrate (1), and the notch is widened to insert the substrate (1) into the substrate support jig (4). ) To hold the single substrate (1) liquid-tight with respect to the electrolyte (6a, 6b). By immersing the substrate support jig (4) in the electrolytic solution (6a, 6b) in the fluororesin chemical conversion tank (2) together with the substrate (1) and energizing the pair of platinum electrodes (3a, 3b), A chemical conversion reaction starts, and the substrate (1) is made porous through the openings.

  As another device of this type (second device), a tank lower stage (103), a tank upper stage (104), an anode (101), a silicon wafer (106), and a cathode (102) are provided. (See, for example, Patent Document 2).

  The tank lower stage (103) and the tank upper stage (104) store an electrolytic solution, and a wafer (105) to be processed is disposed between them. The silicon wafer (106) is disposed so as to be in electrical contact with the anode (101) and not in contact with the electrolyte in the lower tank stage (103). Then, by supplying current to the anode (101) and the cathode (102), a chemical conversion reaction occurs, and a porous treatment is performed on the wafer (105).

  In the second apparatus, since the anode (101) is not in contact with the electrolytic solution by the silicon wafer (106), the metal of the electrode (101) is not eluted into the electrolytic solution, and the wafer (105) is contaminated with metal. Can be prevented.

JP-A-5-198556 (FIGS. 1 and 2) JP-A-6-275598 (FIG. 1)

However, the conventional example having such a configuration has the following problems.
That is, in the first conventional apparatus, in order to support the substrate (1) by the substrate support jig (4), the notch portion of the substrate support jig (4) is expanded and then the substrate (1) is opened. It is necessary to insert. Therefore, it is difficult to automatically support the substrate (1) on the substrate support jig (4) by a mechanical mechanism, and when applied to batch processing for processing a plurality of substrates (1) simultaneously, It becomes more difficult to automate and process appropriately.

  In addition, the conventional second apparatus has the same problem as the first apparatus, and the silicon wafer (106) becomes porous due to the chemical conversion reaction. Therefore, it is necessary to frequently replace the silicon wafer (106). Occurs. For this reason, there is another problem in that maintenance takes time and the operating rate decreases.

  The present invention has been made in view of such circumstances, and provides an anodizing apparatus capable of batch processing and capable of improving the operating rate by suppressing the replacement frequency of electrodes. Objective.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is an anodizing apparatus for performing an anodizing reaction by immersing a substrate in an electrolyte solution, and a storage tank for storing an electrolyte solution of a first concentration, and the entire peripheral surface of the substrate It is liquid-tight with respect to the electrolyte solution of the first concentration, holds a plurality of substrates, is disposed adjacent to the storage tank, and is disposed adjacent to the storage tank, A pair of electrode tanks storing an electrolyte solution having a second concentration lower than the concentration of 1, an electrode disposed in each of the pair of electrode tanks, and the storage tank and the pair of electrode tanks And an ion exchange membrane that allows movement of ions between the electrolyte solution in the storage tank and the electrolyte solution in the pair of electrode tanks.

  [Operation / Effect] According to the invention described in claim 1, when a plurality of substrates are held by the substrate holder disposed in the storage tank and the electrodes disposed in the pair of electrode tanks are energized, Ions move between the electrode chambers, and at that time, a chemical reaction occurs on a plurality of substrates through the ion exchange membrane. Therefore, batch processing for processing a plurality of substrates is possible. In addition, the second concentration of the electrolyte solution stored in the electrode tank is set lower than the first concentration of the electrolyte solution stored in the storage tank and in contact with the substrate. Therefore, since the chemical reaction in the electrode tank is suppressed as compared with that in the storage tank, the local chemical reaction occurring in each electrode in each electrode tank can be suppressed. As a result, electrode deterioration can be suppressed, contamination of the substrate can be prevented, and the operating rate of the apparatus can be improved.

  In the present invention, the substrate holder has a cylindrical appearance, and has through holes on one end side and the other end side corresponding to the alignment direction of the substrates, and the through holes are directed to lines connecting the electrodes. (Claim 2). Since the electric field between the electrodes is directed to the plurality of substrates through the through holes, the chemical conversion reaction can be efficiently generated.

  In the present invention, each of the electrodes is electrically connected to a power source, and is electrically connected to the first electrode member that is not in contact with the electrolyte solution, and to the first electrode member. And a second electrode member in contact with the electrolyte solution. Since the 1st electrode member does not touch electrolyte solution, degradation of the 1st electrode member can be prevented.

  Moreover, in this invention, it is preferable that a said 2nd electrode member is the same kind as the board | substrate processed with the said substrate holder (Claim 4). The substance constituting the second electrode member elutes into the electrolyte solution, but the second electrode member is the same type as the substrate to be processed, so that the substrate to be processed is prevented from being contaminated with a different substance. Can do.

  Moreover, in this invention, it is preferable to provide the partition which has an opening part between the said storage tank and a pair of said electrode tank, and the said ion exchange membrane is provided in the said opening part (Claim 5). . It is possible to allow movement of ions between the pair of electrode tanks through the ion exchange membrane in the opening.

  According to the anodizing apparatus according to the present invention, when a plurality of substrates are held by the substrate holder arranged in the storage tank and the electrodes arranged in the pair of electrode tanks are energized, between the pair of electrode tanks The ions move, and at that time, a chemical reaction occurs on a plurality of substrates through the ion exchange membrane. Therefore, batch processing for processing a plurality of substrates is possible. In addition, the second concentration of the electrolyte solution stored in the electrode tank is set lower than the first concentration of the electrolyte solution stored in the storage tank and in contact with the substrate. Therefore, since the chemical reaction in the electrode tank is suppressed as compared with that in the storage tank, the local chemical reaction occurring in each electrode in each electrode tank can be suppressed. As a result, electrode deterioration can be suppressed, contamination of the substrate can be prevented, and the operating rate of the apparatus can be improved.

It is the longitudinal cross-sectional view which looked at schematic structure of the anodizing apparatus which concerns on an Example from the front. It is the longitudinal cross-sectional view which looked at schematic structure of the anodizing apparatus which concerns on an Example from the side. It is a top view of schematic structure of the anodizing apparatus which concerns on an Example. It is a figure which shows a substrate holder, (a) is a top view, (b) is a side view, (c) is a front view. It is a front view of a 1st support unit. It is a figure which shows a 1st support unit, (a) is a top view, (b) is AA arrow sectional drawing of (a). It is a figure which shows a 2nd support unit, (a) is a front view, (b) is a left 2nd support unit, (c) is a right 2nd support unit. It is a schematic diagram which shows the operation | movement at the time of the connection of a 1st support unit and a 2nd support unit, (a) shows at the time of separation and (b) shows at the time of connection. It is a schematic diagram which shows the operation | movement at the time of connection of a left 2nd support unit and a right 2nd support unit, (a) shows at the time of separation and (b) shows at the time of connection. It is a schematic diagram which shows the state at the time of mounting a board | substrate on the 1st support unit, (a) shows the state which mounted the board | substrate, (b) shows the state which pressed the board | substrate with the 2nd support unit. It is a schematic diagram which shows the state at the time of a chemical conversion reaction. It is a figure which shows the modification of a 1st support unit, (a) is a top view, (b) is a longitudinal cross-sectional view. It is a figure which shows the modification of a 2nd support unit. It is a figure which shows the modification of a 1st support unit and a 2nd support unit. It is a figure which shows the other modification of a 1st support unit and a 2nd support unit.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a longitudinal sectional view of the schematic configuration of the anodizing apparatus according to the embodiment as viewed from the front, and FIG. 2 is a longitudinal sectional view of the schematic configuration of the anodizing apparatus according to the embodiment as viewed from the side. FIG. 3 is a plan view of a schematic configuration of the anodizing apparatus according to the embodiment.

  The anodizing apparatus according to the embodiment has a function of causing an anodizing reaction on a plurality of substrates at the same time, for example, performing a porous process on a silicon substrate. This anodizing apparatus includes an outer container 1 and an inner container 3. The inner container 3 is accommodated in the outer container 1. In FIG. 1, the outer container 1 and the inner container 3 are not shown because of the illustration.

  The inner container 3 includes a pair of electrode tanks 5 and 7 and one storage tank 9. The storage tank 9 stores an electrolyte solution. The storage tank 9 has an inner tank 11 and an outer tank 13. Examples of the electrolyte solution include a mixed solution of hydrofluoric acid. The electrolyte solution is supplied from a weighing tank (not shown) to the bottom of the inner tank 11, and the excess is overflowed into the outer tank 13 and collected.

  The storage tank 9 includes a pair of covers 15 that open and close the upper opening. The pair of covers 15 has a rectangular shape in plan view (shown by a two-dot chain line in FIG. 3). Each cover 15 is attached to the support arm 17 along the outer long side. The support arm 17 has a distal end attached to the cover 15 and a proximal end portion extended from the outer container 1.

  A pair of air cylinders 19 is attached to one side surface of the outer container 1 (left side surface in FIG. 3). The pair of air cylinders 19 are attached to the outer container 1 in a horizontal posture, and are in a state where the sides on which the operating pieces advance and retreat are opposed to each other. Further, as shown in FIG. 2, the pair of air cylinders 19 are attached at positions that are stepped in the height direction. Each of the operating pieces of the pair of air cylinders 19 is connected to the base end side of each support arm 17. When the pair of air cylinders 19 are operated and the operating piece is advanced, the pair of covers 15 approach each other in conjunction with the support arm 17, and the pair of covers 15 covers the upper center of the inner tank 11 (in FIG. 1). (Indicated by a solid line). When the pair of air cylinders 19 are operated to the opposite side and the operating piece is retracted, the pair of covers 15 are separated from each other in conjunction with the support arm 17, and the pair of covers 15 are removed from above the inner tank 11. It moves upward of the tank 13 (indicated by a two-dot chain line in FIGS. 1 and 3).

  An electrode tank 5 is provided on one side of the inner tank 11 (left side in FIGS. 2 and 3). This electrode tank 5 stores an electrolyte solution, and an electrode 21 is disposed at a position where it is immersed in the electrolyte solution. An electrode tank 7 is provided on the other side of the inner tank 11 (the right side in FIGS. 2 and 3). This electrode tank 7 also stores an electrolyte solution, and an electrode 23 is provided at a position where it is immersed in the electrolyte solution. The pair of electrode tanks 5 and 7 store the same type of electrolyte solution supplied to the inner tank 11. However, the concentration is preferably set lower than that of the inner tank 11. For example, when the electrolyte solution in the inner tank 11 is hydrofluoric acid solution: isopropyl alcohol: pure water = 1: 1: 1, the electrolyte solution in the electrode tanks 5 and 7 is 50 times the electrolyte solution in the inner tank 11. It is preferable to make it thinner.

  For example, the electrode 21 is connected to a negative electrode of a power source (not shown), and the electrode 23 is connected to a positive electrode of a power source (not shown). The electrode 21 preferably has a double structure including, for example, a metal 21a connected to a power source (not shown) and a silicon substrate 21b on the side in contact with the electrolyte solution. Similarly, the electrode 23 preferably has a double structure including a metal 23a connected to a power source (not shown) and a silicon substrate 23b on the side in contact with the electrolyte solution. The metal may be anything as long as it has resistance to the electrolyte solution, and examples thereof include platinum, palladium, gold, silver, and copper. What was illustrated as an electrolyte solution contains hydrofluoric acid, and even if it has a certain amount of tolerance, a metal component elutes. However, since the silicon substrates 21b and 23b, which are the same type of material as the processing target, are provided on the electrolyte solution side, it is possible to prevent the processing target substrate from being contaminated by different kinds of metals.

  Further, since the electrodes 21a and 23a do not touch the electrolyte solution through the silicon substrates 21b and 23b, the electrodes 21a and 23a can be prevented from being deteriorated.

  The metals 21a and 23a correspond to the “first electrode member” in the present invention, and the silicon substrates 21b and 23b correspond to the “second electrode member” in the present invention.

  The partition wall 25 on the inner tank 11 side of the electrode tank 5 has a circular opening 27. An ion exchange membrane 29 is attached to the opening 27. The partition wall 31 on the inner tank 11 side of the electrode tank 7 is similarly provided with an opening 33, and an ion exchange membrane 35 is attached thereto. Examples of the ion exchange membranes 29 and 35 include Nafion (registered trademark) manufactured by DuPont. Preferably, the ion exchange membranes 29 and 35 are used by being sandwiched by a punching plate having a plurality of holes. Thereby, the osmotic pressure expands the ion exchange membranes 29 and 35, and the concentration fluctuation caused by the fluctuation of the ion exchange action can be prevented. As a result, the processing unevenness can be suppressed.

  Reference is further made to FIGS. 4A and 4B are diagrams showing the substrate holder, where FIG. 4A is a plan view, FIG. 4B is a side view, and FIG. 4C is a front view. FIG. 5 is a front view of the first support unit. 6A and 6B are views showing the first support unit, in which FIG. 6A is a plan view and FIG. 6B is a cross-sectional view taken along line AA in FIG. 7A and 7B are diagrams showing the second support unit, in which FIG. 7A is a front view, FIG. 7B is a left second support unit, and FIG. 7C is a right second support unit.

  A substrate holder 41 is disposed in the inner tank 11 in the storage tank 9. The substrate holder 41 includes a holder base portion 43 and holder end portions 45 and 47. The holder base 43 has a space for accommodating a plurality of substrates. The holder end portions 45 and 47 are formed with through holes 49 and 51. The holder end portions 45 and 47 have a cylindrical appearance, and O-rings 53 and 55 are attached to the cylindrical outer peripheral portion. These O-rings 53 and 55 are provided for attaching the substrate holder 41 to the partition walls 25 and 31 in a liquid-tight manner by an attachment member (not shown). In other words, the substrate holder 41 is arranged so that the through holes 49 and 51 pass through a line connecting the electrodes 21 and 23. Thereby, since the electric field by the electrodes 21 and 23 can be easily passed, a chemical conversion reaction can be efficiently produced with respect to a some board | substrate.

  The holder base 43 includes a first support unit 57 shown in FIGS. 5 and 6 (not shown in FIG. 4). As shown in FIG. 5, the first support unit 57 has an arc shape having a string shorter than the diameter of the substrate W when viewed from the front. The first support unit 57 includes a plurality of first support portions 59. For example, if the number of substrates W processed at one time is 25, the first support unit 57 includes 25 first support portions 59 in the alignment direction of the substrates W. Since the first support unit 57 has an arc shape having a string shorter than the diameter of the substrate W, a portion below the maximum diameter portion of the substrate W can be locked by the lifter LF shown in FIG. Therefore, it is difficult to apply stress to the substrate W during transportation, and damage to the substrate W can be prevented.

  The first support part 59 abuts only the lower part of the peripheral surface of the substrate W and supports it liquid-tightly. As for the 1st support part 59, the recessed part 61 is formed in the upper surface. The recess 61 is set to be slightly wider than the thickness of the substrate W. Guide pins 63 are attached at positions facing each other with the recess 61 therebetween. As shown in FIG. 5, the guide pins 63 are provided at three locations near the center and on the left and right when viewed from the surface direction of the substrate W. Each guide pin 63 has its central axis directed to the center of the substrate W. The guide pin 63 includes a base portion 65 and a guide portion 67. An elastic member 69 is attached to the surface of the first support part 59. A base portion 65 of the guide pin 63 protrudes from the surface of the elastic member 69, and a guide portion 67 is formed on the upper portion thereof. The guide portion 67 includes an inclined surface 71 on the concave portion 61 side, and projects from the base portion 65 to the concave portion 61 side. The elastic member 69 is composed of a member having resistance to the electrolyte solution, and examples thereof include a tetrafluoroethylene resin.

  The first support portions 59 are provided adjacent to each other in the arrangement direction of the substrates W, and the guide pins 63 of the adjacent first support portions 59 are attached so as to be in alternate positions (staggered). Thereby, the length of the 1st support unit 57 in the alignment direction of the board | substrate W can be shortened, and size reduction of an apparatus can be achieved. The first support unit 57, the second support unit 73, and the guide pin 63 are synthetic resins having resistance to the electrolyte solution, and examples thereof include vinyl chloride resin (polyvinyl chloride, PVC).

  The substrate holder 41 includes a second support unit 73 shown in FIG. The second support unit 73 includes a left second support unit 75 and a right second support unit 77. The left second support unit 75 and the right second support unit 77 have a C shape and an inverted C shape when viewed from the front. The second support unit 73 liquid-contacts and supports the remaining outer peripheral surface of the outer peripheral surfaces of the substrate W that is liquid-tightly supported by the first support unit 57. The left second support unit 75 includes a plurality of left second support portions 79 that support one substrate W adjacent to each other in the alignment direction of the substrates W. The right second support unit 77 includes a plurality of right second support portions 81 that support one substrate W adjacent to each other in the alignment direction of the substrates W. An exhaust passage 83 is formed in the upper boundary of the boundary between adjacent left second support portions 79. The exhaust passage 83 is formed at two locations along the peripheral surface of the substrate W. The upper opening of the exhaust passage 83 is located above the level of the electrolyte solution stored in the storage tank 9 (reference numeral SL in FIG. 1). Similarly to each left second support portion 79, exhaust passages 85 are formed at two locations on the inner surface at the boundary where each right second support portion 81 is adjacent. The left second support unit 75 has an elastic member 87 attached to the inner surface, and the right second support unit 77 has an elastic member 89 attached thereto in the same manner. However, the elastic members 87 and 89 do not block the exhaust passages 83 and 85.

  The elastic members 87 and 89 described above are members having resistance to the electrolyte solution. For example, although tetrafluoroethylene resin is mentioned, it is preferable that it is softer than the elastic member 69 of the first support unit 57. In other words, the elastic member 69 of the first support unit 57 is preferably harder than the elastic members 87 and 89.

  The second support unit 73 is configured to be openable and closable as shown in FIG. 1 and is attached to and detached from the first support unit 57. Specifically, the second left support unit 75 includes a base portion 91, a fulcrum 93, a swing arm 95, and a connecting portion 97. The base 91 is fixed and attached to the bottom of the inner tank 11 with the first support unit 57 interposed therebetween. The fulcrum 93 is provided at a portion where one side of the swing arm 95 is attached to the base 91. The other side of the swing arm 95 is fixed to the outer peripheral portion of the left second support unit 75. Similarly to the left second support unit 75, the right second support unit 77 includes a base 99, a fulcrum 101, a swing arm 103, and a connecting portion 105.

  The connecting portion 97 includes a suspension member 107, a sliding pin 109, and a fixing member 111. The suspension member 107 is attached to the lower surface of the cover 15 in a suspended posture. The suspension member 107 is formed with a long hole 113 penetrating in the paper surface direction in FIG. The fixing member 111 includes a sliding pin 109 that is fixed to the upper outer peripheral surface of the left second support unit 75 and is inserted through the elongated hole 113. The sliding pin 109 is movable within the elongated hole 113. In addition, although the code | symbol is abbreviate | omitted, the connection part 105 is also the structure similar to the connection part 97. FIG. Therefore, when the pair of air cylinders 19 are actuated to open the pair of covers 15, the left second support unit 75 and the right second support unit around the fulcrums 93 and 101 as shown by the two-dot chain line in FIG. 77, and the upper and both side surfaces of the substrate holder 41 are opened leaving the first support unit 57. When the pair of air cylinders 19 are operated to the opposite side and the pair of covers 15 are closed, the left second support unit 75 and the right second support unit 77 approach each other around the fulcrums 93 and 101, and the substrate holder The upper part and both side surface parts of 41 are closed, and the substrate W is sealed in the substrate holder 41 with respect to the electrolyte solution in the inner tank 11. At this time, the force generated by the left second support unit 75 and the right second support unit 77 is directed toward the center of the substrate as indicated by a two-dot chain line arrow in FIG.

  In this way, since the opening and closing of the second support unit 73 is driven by the pair of air cylinders 19 that drive the pair of covers 15, the configuration relating to the driving can be simplified, and the substrate W Control of each part at the time of conveyance can be made easy.

  Reference is now made to FIG. FIGS. 8A and 8B are schematic views showing the operation at the time of connecting the first support unit and the second support unit. FIG. 8A shows the time of separation and FIG. 8B shows the time of connection.

  A buffer member 117 is attached to the side surface portion 115 of the first support unit 57. Examples of the buffer member 117 include a sponge material having resistance to the electrolyte solution. The buffer member 117 weakens the impact when the second support unit 73 is brought into contact with the first support unit 57 and maintains the liquid density at the joint. In addition, the elastic member 69 of the first support unit 57 has an end extending longer than the buffer member 117. Therefore, when the first support unit 57 and the second support unit 73 are separated from each other as shown in FIG. 8A, and the connection state shown in FIG. Can be maintained.

  Reference is now made to FIG. FIGS. 9A and 9B are schematic diagrams illustrating an operation when the left second support unit and the right second support unit are connected, in which FIG. 9A shows the separated state and FIG. 9B shows the connected state.

  The left second support unit 75 includes a slide member 119. The slide member 119 is in contact with the outer surface of the elastic member 87, and is placed on the upper right side surface portion of the left second support unit 75 in the height direction (center direction of the substrate W) when the left second support unit 75 is closed. It is slidably attached. The slide member 119 includes an inclined surface 121 that is inclined toward the right second support unit 77 side. The right second support unit 77 includes a pressing member 123. The pressing member 123 is fixedly attached to the upper left side surface portion of the right second support unit 77. The pressing member 123 is formed with an inclined surface 125 having a gentler inclination angle than the inclined surface 121 of the pressing member 123. The slide member 119 and the pressing member 123 constitute a notch pressing mechanism 127. Therefore, when the left second support unit 75 and the right second support unit 77 shown in FIG. 9A are separated from the connected state shown in FIG. 9B, the pressing member 123 is moved to the slide member 119. Is moved toward the center of the substrate W, the elastic member 87 of the second left support unit 75 is moved toward the notch N of the substrate W. As a result, the notch N of the substrate W is covered with the elastic member 87, and the electrolyte solution on both surfaces of the substrate W can be prevented from flowing through the notch N. Therefore, it is possible to improve the uniformity of processing by suppressing the concentration fluctuation of the electrolyte solution.

  The notch pressing mechanism 127 may be configured such that the left second support unit 75 includes the pressing member 123 and the right second support unit 77 includes the slide member 119.

  Reference is now made to FIG. FIG. 10 is a schematic diagram showing a state when the substrate is placed on the first support unit. (A) is a state where the substrate is placed, and (b) is a state where the substrate is pressed by the second support unit. Indicates the state.

  When the substrate W is placed on the first support unit 57 by a lifter (not shown) in a state where the second support unit 73 is separated from the first support unit 57, the substrate is moved by the guide pins 63 as shown in FIG. The lower surface of W is guided and positioned at the upper part of the recess 61. When the second support unit 73 is connected to the first support unit 57 as described above, the substrate W is pressed from the upper left and right of the substrate W. Then, as shown in FIG. 10B, the elastic member 69 is pressed by the lower surface of the substrate W and enters the recess 61 side. The elastic member 69 of the first support unit 57 is set to be harder than the elastic members 87 and 89 of the second support unit 73, whereby when the substrate W is supported and pressed by the second support unit 73, the substrate It is possible to prevent the position of W from moving too much toward the first support unit 57 side. Therefore, the entire peripheral surface including the remaining peripheral surface as well as the lower portion of the peripheral surface of the substrate W can be supported substantially uniformly and in a liquid-tight manner with respect to the electrolyte solution.

  In addition, since the peripheral surface of the substrate W enters the recess 61, a part of the front and back surfaces of the substrate W including the peripheral surface of the substrate W can be supported, and the electrolyte solution between the adjacent substrates W can circulate. There is no. As a result, the concentration of the electrolyte solution acting on the substrate W can be stabilized and the processing can be performed stably.

  As shown in FIG. 11, a space sp is generated between the base portion 65 of the guide pin 63 and the surface of the substrate W. This space sp allows the electrolyte solution to stay between the base 65 and the surface of the substrate W. Therefore, it is possible to minimize the portion where the chemical reaction does not easily occur during the electrolytic anodization.

  The anodizing apparatus configured as described above first supplies an electrolyte solution having a predetermined concentration to the storage tank 9 and supplies an electrolyte solution having a predetermined concentration to the pair of electrode tanks 5 and 7. Next, the pair of air cylinders 19 are operated to open the pair of covers 15 (see the two-dot chain line in FIG. 1). At this time, the left second support unit 75 and the right second support unit 77 are separated from each other, and the electrolyte solution in the storage tank 9 flows into the substrate holder 41. Next, the plurality of substrates W are transported by a lifter, and the plurality of substrates W are placed on the first support unit 57 (see FIG. 10A). Next, the pair of air cylinders 19 are operated to the opposite side to close the pair of covers 15 (see the solid line in FIG. 1). At this time, the left second support unit 75 and the right second support unit 77 are linked to the first support unit 57 in conjunction with each other (see FIGS. 8A and 8B), and the notch pressing mechanism 127 is activated ( (See FIGS. 9A and 9B). Accordingly, the plurality of substrates W are in a state where the entire peripheral surface including the notch N is sealed, and are accommodated in the substrate holder 41 in a liquid-tight state with respect to the electrolyte solution in the storage tank 9. In this state, when the electrode 21 and the electrode 23 are energized, a chemical conversion reaction occurs and a plurality of substrates W are made porous (porous). Although gas is generated by the anodizing reaction, the second support unit 73 includes the exhaust passages 83 and 85, so that bubbles are discharged from the substrate holder 41 to the outside. Therefore, it is possible to prevent processing unevenness due to bubbles.

  When the chemical reaction treatment for a predetermined time is completed, energization to the electrode 21 and the electrode 23 is stopped, and the pair of air cylinders 19 are operated to open the pair of covers 15. Then, in conjunction with this, the left second support unit 75 and the right second support unit 77 are separated, and the electrolyte solution in the storage tank 9 flows into the substrate holder 41. This refreshes the electrolyte solution when the next plurality of substrates W are processed. Next, the plurality of substrates W processed by the lifter are sandwiched and carried out of the substrate holder 41.

  According to this embodiment apparatus, when a plurality of substrates W are held by the substrate holder 41 arranged in the storage tank 9 and the electrodes 21 and 23 arranged in the pair of electrode tanks 5 and 7 are energized, Ions move between the electrode chambers 21 and 23, and a chemical reaction occurs on the plurality of substrates W through the ion exchange membranes 29 and 35. Therefore, batch processing for processing a plurality of substrates W is possible. The concentration of the electrolyte solution stored in the electrode tanks 5 and 7 is set lower than the concentration of the electrolyte solution stored in the storage tank 9. Therefore, since the chemical reaction in the electrode tanks 5 and 7 is suppressed as compared with that in the storage tank 9, the local chemical reaction occurring in the electrodes 21 and 23 in the electrode tanks 5 and 7 can be suppressed. As a result, deterioration of the electrodes 21 and 23 can be suppressed, and the operating rate of the apparatus can be improved.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the above-described embodiment, the first support unit 59 includes a pair of guide pins 63 on the front and back surfaces of the substrate W, and the first support unit 57 is arranged in a staggered manner in the alignment direction of the substrates W. However, the first support unit 57 of the present invention is not limited to such a configuration, and may be configured as shown in FIG. 12, for example. FIG. 12 is a view showing a modification of the first support unit, where (a) is a plan view and (b) is a longitudinal sectional view.

  The first support portion 59A includes guide pins 63A on both sides of the recess 61. The guide pin 63A includes a guide portion 67A that protrudes toward the concave portion 61 on the upper portion of the base portion 65A. The guide portion 67A includes guide surfaces 71A on both sides in the alignment direction of the substrates W. Further, the guide pins 63A are not arranged in a staggered manner, but are linearly arranged in the alignment direction of the substrates W. Since the guide pins 63A are provided with guide surfaces 71A on both sides, the adjacent first support portions 59A can also serve as the guide pins 63A, and the length of the first support unit 57A in the alignment direction of the substrates W is shortened. Can contribute to downsizing of the apparatus.

  (2) In the above-described embodiment, the left second support unit 75 and the right second support unit 77 are rotated at the fulcrums 93 and 101 at the bottom of the storage tank 9, but the present invention is limited to this configuration. It is not a thing. For example, it is good also as a structure shown in FIG. In addition, FIG. 13 is a figure which shows the modification of a 2nd support unit.

  In this modification, the left second support unit 75A and the right second support unit 77A are composed of a second support unit 73A having a fulcrum 129 at the top. Further, a mechanism for retracting the second support unit 73A is required when the substrate W is carried in / out, but the mechanism is not required in the storage tank 9, and the configuration of the storage tank 9 can be simplified.

  (3) In the above-described embodiment, the first support unit 57 and the second support unit 73 are provided, and the second support unit 73 is composed of the left second support unit 75 and the right second support unit 77. The present invention is not limited to the above configuration, and for example, a configuration as shown in FIG. 14 may be adopted. In addition, FIG. 14 is a figure which shows the modification of a 1st support unit and a 2nd support unit.

  The first support unit 57B and the second support unit 73B are not divided from the second support unit 73B. Further, the first support unit 57B and the second support unit 73B are divided vertically in the vicinity of the maximum diameter of the substrate W. The first support unit 57B and the second support unit 73B are configured such that the second support unit 73B can rotate with respect to the first support unit 57B at a fulcrum 131. By configuring in this way, the number of parts can be reduced and the cost can be reduced. In addition, the configuration of the apparatus can be simplified.

  (4) In the above-described embodiments, the circular substrate W has been described. However, the present invention can process, for example, a rectangular substrate W other than the circular substrate W. For this purpose, for example, a configuration as shown in FIG. 15 may be used. FIG. 15 is a diagram showing another modification of the first support unit and the second support unit.

  In this modification, the rectangular substrate W is processed in a posture in which opposite corners are directed in the vertical direction (horizontal direction). In this case, the first support unit 57C is configured in a V shape. Further, the second support unit 73C is divided into a left second support unit 75C and a right second support unit 77C. With such a configuration, the rectangular substrate W can be processed with the same configuration as the above-described embodiment.

  In addition, even if it is the square board | substrate W, you may employ | adopt together the structure as said (2) and (3).

  (5) Although the above-described embodiment includes the notch pressing mechanism 127, the present invention does not necessarily require the notch pressing mechanism 127.

  (6) Although the exhaust passages 83 and 85 are provided in the above-described embodiment, the exhaust passages 83 and 85 are not necessary when the influence of bubbles generated by the processing is small or negligible.

  (7) In the above-described embodiment, the second support unit 73 is driven by the pair of air cylinders 19 that open and close the pair of covers 15, but a dedicated drive mechanism may be employed for the second support unit 73.

  (8) In the embodiment described above, the electrodes 21 and 23 have a double structure of the metals 21a and 23a and the silicon substrates 23a and 23b. However, this configuration is not essential for the present invention. That is, the electrodes 21 and 23 may be composed only of the metals 21a and 23a. Even in this configuration, since the concentration of the electrolyte solution in the electrode tanks 5 and 7 is set low, deterioration of the metals 21a and 23a can be suppressed.

W ... Substrate 1 ... Outer container 3 ... Inner container 5, 7 ... Electrode tank 9 ... Storage tank 11 ... Inner tank 13 ... Outer tank 15 ... Cover 17 ... Support arm 19 ... Air cylinders 21, 23 ... Electrodes 25, 31 ... Septum 29, 35 ... Ion exchange membrane 41 ... Substrate holder 57 ... First support unit 59 ... First support part 61 ... Recess 63 ... Guide pin 65 ... Base 67 ... Guide part 73 ... Second support unit 75 ... Left second support unit 77 ... Right second support unit 79 ... Left second support portion 81 ... Right second support portion 83, 85 ... Exhaust passage 93, 101 ... Support point 119 ... Slide member 123 ... Press member 127 ... Notch press mechanism

Claims (5)

In an anodizing apparatus for performing an anodizing reaction by immersing a substrate in an electrolyte solution,
A storage tank for storing the electrolyte solution of the first concentration;
Holding the entire circumference of the substrate liquid-tight with respect to the electrolyte solution of the first concentration, holding a plurality of substrates, and a substrate holder disposed in the storage tank;
A pair of electrode tanks disposed adjacent to the storage tank and storing an electrolyte solution having a second concentration lower than the first concentration;
Electrodes disposed in each of the pair of electrode vessels;
An ion exchange membrane that is provided between the storage tank and the pair of electrode tanks and allows ion movement between the electrolyte solution in the storage tank and the electrolyte solution in the pair of electrode tanks;
An anodizing apparatus comprising: The anodizing apparatus according to claim 1,
The substrate holder has a cylindrical appearance, is provided with through holes on one end side and the other end side corresponding to the alignment direction of the substrates, and the through holes are directed to lines connecting the electrodes. Anodizing equipment. In the anodizing apparatus in any one of Claim 1 to 3,
Each of the electrodes is electrically connected to a power source, and is electrically connected to the first electrode member that is not in contact with the electrolyte solution, and to the electrolyte solution. An anodizing device comprising a second electrode member in contact with the second electrode member. The anodizing apparatus according to claim 3, wherein
The anodizing apparatus, wherein the second electrode member is the same type as a substrate processed by the substrate holder. The anodizing apparatus according to any one of claims 1 to 4,
A partition having an opening between the storage tank and the pair of electrode tanks,
The anodizing apparatus, wherein the ion exchange membrane is provided in the opening.

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