JP2012113796A - Light receiving device and method for manufacturing the same - Google Patents

Light receiving device and method for manufacturing the same Download PDF

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JP2012113796A
JP2012113796A JP2011004923A JP2011004923A JP2012113796A JP 2012113796 A JP2012113796 A JP 2012113796A JP 2011004923 A JP2011004923 A JP 2011004923A JP 2011004923 A JP2011004923 A JP 2011004923A JP 2012113796 A JP2012113796 A JP 2012113796A
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light receiving
insulating resin
receiving element
substrate
receiving device
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JP5444259B2 (en
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敏司 ▲徳▼山
Toshiji Tokuyama
Takahiro Ebisui
崇裕 戎井
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Aoi Electronics Co Ltd
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Aoi Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Abstract

PROBLEM TO BE SOLVED: To obtain a light receiving device covered with an insulating resin without using an expensive metal mold.SOLUTION: In the method for manufacturing the light receiving device which includes applying an insulating resin material 30A onto a substrate 20 having a light receiving element 10 having a light receiving portion 11 arrayed therein, arranging a mask 60 having an opening 61 corresponding to the light receiving portion 11 and a weir projection 62 formed in the peripheral portion of the opening 61 on the substrate 20, and forming an insulating resin 30 for covering the peripheral portion of the light receiving element 10 and the upper surface of the substrate 20 by expanding the insulating resin material 30A with the mask 60, an opening 31 is formed in the insulating resin 30 and a recessed portion 32 is formed in the upper peripheral edge portion of the opening 31.

Description

この発明は、受光部を有する受光素子が絶縁樹脂によりパッケージされた受光装置およびその製造方法に関する。   The present invention relates to a light receiving device in which a light receiving element having a light receiving portion is packaged with an insulating resin, and a method for manufacturing the same.

ＣＤまたはＤＶＤ等の光ディスクに記録された情報を読み取る光ヘッドには受光装置が内臓される。このような受光装置は、光ディスクから反射される４００ｎｍ〜７８０ｎｍ程度の波長の光を受光する受光部を有する受光素子を基板上に搭載し、受光素子の受光部面側全体を絶縁樹脂で被覆した構造を有する。
このような構造の受光装置を製造する方法として、受光素子の電極パッドと基板の接続パッドをワイヤボンディングし、次に、金型に装着し、絶縁樹脂を充填した後、ダイシングする方法が知られている（例えば、特許文献１参照）。 A light receiving device is incorporated in an optical head that reads information recorded on an optical disk such as a CD or a DVD. In such a light receiving device, a light receiving element having a light receiving part for receiving light having a wavelength of about 400 nm to 780 nm reflected from an optical disk is mounted on a substrate, and the entire surface of the light receiving part of the light receiving element is covered with an insulating resin. It has a structure.
As a method of manufacturing a light receiving device having such a structure, a method is known in which electrode pads of light receiving elements and connection pads of a substrate are wire-bonded, then mounted on a mold, filled with an insulating resin, and then diced. (For example, refer to Patent Document 1).

受光素子の受光部面側全体を絶縁樹脂で被覆する構造とすると、絶縁樹脂を透明材料により形成しなければならず高価となること、また、絶縁樹脂の上面に空気中の塵や埃が堆積し、受光素子の受光部に到達される光が遮断されるという不都合がある。そこで、絶縁樹脂における受光素子の受光部に対応する箇所に開口部を設けた構造が知られている（例えば、特許文献２参照）。   If the entire light receiving surface side of the light receiving element is covered with insulating resin, the insulating resin must be formed of a transparent material, which is expensive, and dust and dirt in the air accumulate on the upper surface of the insulating resin. However, there is a disadvantage that light reaching the light receiving portion of the light receiving element is blocked. Thus, a structure is known in which an opening is provided at a location corresponding to the light receiving portion of the light receiving element in the insulating resin (see, for example, Patent Document 2).

特開２００５−５３６３号公報JP 2005-5363 A 特許第４２００４６３号Patent No. 4200143

特許文献１に記載された受光装置の製造方法は、金型を用いる方法であるため、金型の製作費用が高価となる。
特許文献２には、受光装置の製造方法が記載されておらず、より安価に製造する新たな製造方法をなんら示唆するものではない。 Since the manufacturing method of the light receiving device described in Patent Document 1 is a method using a mold, the manufacturing cost of the mold becomes expensive.
Patent Document 2 does not describe a method for manufacturing a light receiving device, and does not suggest any new manufacturing method for manufacturing at a lower cost.

この発明の受光装置は、上面に受光部を有し、基板上に搭載された受光素子が、受光部を露出する開口部を有する絶縁樹脂のみにより、受光素子の上面における受光部の周囲と周囲側面全体、および受光素子から露出された基板の上面が被覆された受光装置であって、絶縁樹脂は、開口部の上部周縁部に全周囲に亘る凹部を有することを特徴とする。
この発明の受光装置の製造方法は、接続パッドを有する基板上に、受光部および電極パッドを有する受光素子を載置し、接続パッドと前記電極パッドを接続部材により接続する工程と、少なくとも受光素子の周囲における基板上に絶縁樹脂材を塗布する工程と、受光素子の受光部に対応する開口部を有し、開口部の全周囲に亘り受光素子側に突き出す堰止め用突起が形成されたマスクにより、基板上に塗布された絶縁樹脂材を押さえ込み、堰止め用突起を堰止め部として絶縁樹脂材を前記受光素子上に押し広げる工程と、絶縁樹脂材を硬化して絶縁樹脂にする工程と、光素子の周囲における基板および絶縁樹脂を切断することにより、受光素子の受光部を露出する開口部を有し、開口部の上部周縁部に凹部が形成された絶縁樹脂により、受光素子の上面と側面、および基板の上面が被覆された受光装置を得る工程とを備えることを特徴とする。 The light receiving device of the present invention has a light receiving portion on the upper surface, and the light receiving element mounted on the substrate is surrounded by and around the light receiving portion on the upper surface of the light receiving element only by an insulating resin having an opening exposing the light receiving portion. A light-receiving device in which the entire side surface and the upper surface of a substrate exposed from a light-receiving element are covered, and the insulating resin has a concave portion that extends around the entire periphery of the upper peripheral portion of the opening.
The method of manufacturing a light receiving device according to the present invention includes a step of placing a light receiving element having a light receiving portion and an electrode pad on a substrate having a connection pad, and connecting the connection pad and the electrode pad by a connection member, and at least the light receiving element And a mask having an opening corresponding to the light receiving portion of the light receiving element, and a blocking protrusion protruding to the light receiving element side over the entire periphery of the opening. And pressing the insulating resin material applied on the substrate and spreading the insulating resin material on the light receiving element using the damming projection as a damming portion; and curing the insulating resin material to make an insulating resin; By cutting the substrate and the insulating resin around the optical element, the light receiving part of the light receiving element is exposed, and the light receiving part is received by the insulating resin having a recess formed in the upper peripheral edge of the opening part. Top and sides of the child, and the upper surface of the substrate, characterized in that it comprises the step of obtaining a light receiving device that is coated.

この発明によれば、絶縁樹脂材を塗布し、堰止め用突起を有するマスクにより絶縁樹脂を押し広げて受光部の周囲における受光素子の上面を被覆するので、高価な金型を用いずに受光装置を得ることができる。   According to the present invention, the insulating resin material is applied, and the insulating resin is spread by the mask having the blocking protrusion to cover the upper surface of the light receiving element around the light receiving portion. A device can be obtained.

この発明の受光装置の一実施の形態を示す外観拡大斜視図。1 is an enlarged external perspective view showing an embodiment of a light receiving device of the present invention. 図１のＩＩ―ＩＩ線切断断面図。The II-II line | wire sectional view taken on the line of FIG. 図１に図示された受光装置の製造方法の一実施の形態を説明するための図であり、最初の工程に係る断面図。FIG. 2 is a diagram for explaining an embodiment of a method for manufacturing the light receiving device shown in FIG. 図３の次の工程を説明するための断面図。Sectional drawing for demonstrating the next process of FIG. 図４の次の工程を説明するための断面図。Sectional drawing for demonstrating the next process of FIG. 図５の次の工程を説明するための断面図。Sectional drawing for demonstrating the next process of FIG. 図６の次の工程を説明するための断面図。Sectional drawing for demonstrating the next process of FIG. 図１に図示された受光装置の製造に用いるマスクの一実施の形態を示す外観斜視図。FIG. 2 is an external perspective view showing an embodiment of a mask used for manufacturing the light receiving device shown in FIG. 1.

以下、この発明の受光装置の一実施の形態を図面と共に説明する。
図１は、この発明の受光装置の一実施の形態を示す拡大外観斜視図であり、図２は図１に図示された受光装置のＩＩ−ＩＩ線に沿う切断断面図である。
受光装置１は、受光素子（図２参照）１０と、基板２０と、受光素子１０と基板２０とを電気的に接続する接続するワイヤ２（図２参照）と、絶縁樹脂３０とを備えている。
受光素子１０は、上面に受光部１１を有する半導体チップである。受光素子１０は平面形状が矩形であり、受光部１１の周囲における上面には複数の電極パッド１２が設けられている。 Hereinafter, an embodiment of a light receiving device of the present invention will be described with reference to the drawings.
FIG. 1 is an enlarged external perspective view showing an embodiment of a light receiving device according to the present invention, and FIG. 2 is a cross-sectional view taken along line II-II of the light receiving device shown in FIG.
The light receiving device 1 includes a light receiving element (see FIG. 2) 10, a substrate 20, a wire 2 (see FIG. 2) that electrically connects the light receiving element 10 and the substrate 20, and an insulating resin 30. Yes.
The light receiving element 10 is a semiconductor chip having a light receiving portion 11 on the upper surface. The light receiving element 10 has a rectangular planar shape, and a plurality of electrode pads 12 are provided on the upper surface around the light receiving portion 11.

基板２０は、ガラスエポキシ樹脂等の絶縁性の樹脂により形成され、平面サイズは、受光素子１０の外形より大きいサイズを有している。受光素子１０は基板２０のほぼ中央部に搭載されており、基板２０における受光素子１０の周囲には接続パッド２１が形成されている。受光素子１０の電極パッド１２と基板２０の接続パッド２１とは、ワイヤ２により接続されている。ワイヤ２はワイヤボンディングにより電極パッド１２および接続パッド２１に接合されている。   The substrate 20 is made of an insulating resin such as glass epoxy resin, and has a plane size larger than the outer shape of the light receiving element 10. The light receiving element 10 is mounted at substantially the center of the substrate 20, and connection pads 21 are formed around the light receiving element 10 on the substrate 20. The electrode pad 12 of the light receiving element 10 and the connection pad 21 of the substrate 20 are connected by a wire 2. The wire 2 is bonded to the electrode pad 12 and the connection pad 21 by wire bonding.

絶縁樹脂３０は、エポキシ樹脂等の熱硬化性樹脂で形成されている。絶縁樹脂３０は、不透明であるが、透明としても差し支えはない。絶縁樹脂３０は、電極パッド１２、接続パッド２１およびワイヤ２を含んで、受光素子１０の上面周縁部および周囲側面全体を覆っている。絶縁樹脂３０の中央部には、平面サイズが受光素子１０の受光部１１より少し大きい開口部３１が形成されており、受光素子１０の受光部１１は、その全体が、開口部３１を介して外部に露出している。また、絶縁樹脂３０には、開口部３１の上部周縁部に凹部３２が形成されている。この凹部３２は、図１に図示されるように、開口部３１の全周囲に亘り設けられている。   The insulating resin 30 is made of a thermosetting resin such as an epoxy resin. The insulating resin 30 is opaque, but can be transparent. The insulating resin 30 includes the electrode pad 12, the connection pad 21, and the wire 2, and covers the upper surface peripheral portion and the entire peripheral side surface of the light receiving element 10. An opening 31 having a plane size slightly larger than the light receiving portion 11 of the light receiving element 10 is formed in the central portion of the insulating resin 30, and the light receiving portion 11 of the light receiving element 10 is entirely disposed through the opening 31. Exposed outside. In addition, the insulating resin 30 has a recess 32 at the upper peripheral edge of the opening 31. As shown in FIG. 1, the recess 32 is provided over the entire periphery of the opening 31.

詳細は後述するが、絶縁樹脂３０の凹部３２は、絶縁樹脂３０の上部側の部分がマスクに設けられた堰止め用突起により受光素子１０の受光部１１側への広がりが堰止められて形成されたものである。   As will be described in detail later, the concave portion 32 of the insulating resin 30 is formed by blocking the spread of the light receiving element 10 toward the light receiving portion 11 by the blocking protrusion provided on the mask on the upper portion of the insulating resin 30. It has been done.

絶縁樹脂３０は、平面形状が、基板２０と同じ大きさのほぼ矩形形状を有している。しかし、基板２０とは異なり、４つの角部に切欠部３３を有している。切欠部３３は、絶縁樹脂３０の厚さの中間位置に達する深さを有する。特に、限定される訳ではないが、切欠部３３の深さを、凹部３２とほぼ同じ深さとしてもよい。切欠部３３の平面形状は、円の１／４の面積部分の形状を有する。切欠部３３の平面形状は、図１では、円弧状としているが、楕円の一部、あるいは多角形状の一部の形状としても差し支えはない。
受光装置１の外形サイズは、一例として、大略、３〜５ｍｍ（長さ）×２．５〜４．５ｍｍ（幅）×０．８〜１．５ｍｍ（厚さ）である。しかし、本発明は、このサイズに限定されるものではない。 The insulating resin 30 has a substantially rectangular shape whose planar shape is the same size as the substrate 20. However, unlike the substrate 20, it has notches 33 at four corners. The notch 33 has a depth that reaches an intermediate position of the thickness of the insulating resin 30. Although not particularly limited, the depth of the notch 33 may be substantially the same as that of the recess 32. The planar shape of the notch 33 has a shape of an area portion that is 1/4 of a circle. The planar shape of the notch 33 is an arc shape in FIG. 1, but may be a part of an ellipse or a part of a polygon.
As an example, the outer size of the light receiving device 1 is approximately 3 to 5 mm (length) × 2.5 to 4.5 mm (width) × 0.8 to 1.5 mm (thickness). However, the present invention is not limited to this size.

次に、図３〜図７を参照して、図１および図２に図示された受光装置１の製造方法の一実施の形態を説明する。
なお、受光装置１の製造方法は、多数の受光素子１０を搭載することができる大面積の基板２０を用いて、多数の受光装置１を一度に得る方法を用いるが、図３〜図７では、１個の受光装置１が形成される領域のみが図示されている。
先ず、受光部１１および複数の電極パッド１２を有する受光素子１０を、複数の接続パッド２１が形成された基板２０上に搭載する。この場合、基板２０は多数の受光素子１０を搭載可能な大面積を有するものであり、受光素子１０は、この大面積の基板２０上に、多数個、マトリクス状に配列される。必要に応じ、各受光素子１０は、基板２０にダイボンドする。
そして、金等からなるワイヤ２を、各受光素子１０の電極パッド１２および基板２０の接続パッド２１にボンディングし、両パッド１２、２１を接続する。この状態を図３に図示する。 Next, an embodiment of a method for manufacturing the light receiving device 1 shown in FIGS. 1 and 2 will be described with reference to FIGS.
The method for manufacturing the light receiving device 1 uses a method of obtaining a large number of light receiving devices 1 at a time using a large-area substrate 20 on which a large number of light receiving elements 10 can be mounted. Only the region where one light receiving device 1 is formed is shown.
First, the light receiving element 10 having the light receiving unit 11 and the plurality of electrode pads 12 is mounted on the substrate 20 on which the plurality of connection pads 21 are formed. In this case, the substrate 20 has a large area on which a large number of light receiving elements 10 can be mounted, and a large number of light receiving elements 10 are arranged in a matrix on the large area substrate 20. Each light receiving element 10 is die-bonded to the substrate 20 as necessary.
Then, the wire 2 made of gold or the like is bonded to the electrode pad 12 of each light receiving element 10 and the connection pad 21 of the substrate 20 to connect both pads 12 and 21. This state is illustrated in FIG.

次に、マトリクス状に配列された受光素子１０から露出する基板２０上に、例えば、エポキシ樹脂等の熱硬化性樹脂からなる絶縁樹脂材３０Ａを塗布する。絶縁樹脂材３０Ａは、粘度２００〜３５０Ｐａ・ｓ程度のものが好ましく、ディスペンサや刷毛を用いて塗布する。この場合、絶縁樹脂材３０Ａは、受光素子１０上には塗布しないが、受光部１１に掛からないように受光素子１０上の周縁部に塗布してもよい。   Next, an insulating resin material 30A made of a thermosetting resin such as an epoxy resin is applied on the substrate 20 exposed from the light receiving elements 10 arranged in a matrix. The insulating resin material 30A preferably has a viscosity of about 200 to 350 Pa · s, and is applied using a dispenser or a brush. In this case, the insulating resin material 30 </ b> A is not applied on the light receiving element 10, but may be applied to the peripheral edge on the light receiving element 10 so as not to be applied to the light receiving part 11.

次に、絶縁樹脂材３０Ａが塗布された基板２０上に、絶縁樹脂材３０Ａが塗布されたマスク６０を配置する。
図８は、マスク６０を基板２０側からみた斜視図である。マスク６０は、ステンレス等の金属で形成されており、繰り返し使用が可能である。マスク６０には、受光素子１０の受光部１１に対応する開口部６１が形成されている。開口部６１の縁部には、基板２０側に向かって突き出す堰止め用突起６２が形成されている。堰止め用突起６２は、開口部６１の縁部全周に亘り形成されている。また、マスク６０には、図１に図示された受光装置１の切欠部３３を形成するための４個の突出部６３が形成されている。各突出部６３は円筒形状を有し、その高さは、絶縁樹脂３０の厚さより薄く、例えば、堰止め用突起６２の高さとほぼ同一に高さに形成されている。 Next, the mask 60 coated with the insulating resin material 30A is disposed on the substrate 20 coated with the insulating resin material 30A.
FIG. 8 is a perspective view of the mask 60 as viewed from the substrate 20 side. The mask 60 is made of metal such as stainless steel and can be used repeatedly. An opening 61 corresponding to the light receiving portion 11 of the light receiving element 10 is formed in the mask 60. A damming projection 62 is formed on the edge of the opening 61 so as to project toward the substrate 20 side. The damming projection 62 is formed over the entire periphery of the edge of the opening 61. The mask 60 is formed with four protrusions 63 for forming the notches 33 of the light receiving device 1 shown in FIG. Each protrusion 63 has a cylindrical shape, and the height thereof is smaller than the thickness of the insulating resin 30. For example, the protrusion 63 is formed to have substantially the same height as that of the damming projection 62.

マスク６０は、多数の開口部６１と開口部６１の周囲に形成された突出部６３がマトリクス状に配列されて構成されている。そして、図示はしないが、マスク６０の周側縁部には、各側辺部に沿って所定の間隔で配列された筒状の押し当て部が形成されている。各押し当て部の高さは、絶縁樹脂３０の厚さと同一である。   The mask 60 includes a large number of openings 61 and protrusions 63 formed around the openings 61 arranged in a matrix. Although not shown, cylindrical pressing portions arranged at predetermined intervals along each side portion are formed on the peripheral edge portion of the mask 60. The height of each pressing portion is the same as the thickness of the insulating resin 30.

図４に図示されるように、マスク６０に塗布される絶縁樹脂材３０Ａは、受光素子１０に対面する側の面における堰止め用突起６２の外側に薄く形成される。そして、基板２０上に配列された各受光素子１０の受光部１１が開口部６１内に配置されるように、マスク６０を基板２０上に位置決めする。この状態を図４に図示する。   As shown in FIG. 4, the insulating resin material 30 </ b> A applied to the mask 60 is thinly formed on the outside of the damming projection 62 on the surface facing the light receiving element 10. Then, the mask 60 is positioned on the substrate 20 such that the light receiving portions 11 of the respective light receiving elements 10 arranged on the substrate 20 are disposed in the opening 61. This state is illustrated in FIG.

次に、マスク６０を基板２０側に押圧して、マスク６０の周側縁に配列された押し当て部の下面を基板２０の上面に当接する。これにより、基板２０上に塗布されていた絶縁樹脂材３０Ａが押し広げられて、受光素子１０の周縁部を覆う。また、マスク６０に塗布されていた絶縁樹脂材３０Ａは、基板２０上に塗布されていた絶縁樹脂材３０Ａと一体になり、受光素子１０の周縁部を覆う。このため、受光素子１０の電極パッド１２、基板２０の接続パッド２１およびワイヤ２を含んで、受光素子１０の上面周縁部、側面全体および基板２０の受光素子１０から露出した上面全体が絶縁樹脂材３０Ａにより被覆される。つまり、マスク６０の突出部６３の高さは、絶縁樹脂材３０Ａの厚さと実質的に同一となる。但し、後述する如く、絶縁樹脂材３０Ａを加熱して絶縁樹脂３０にする際の絶縁樹脂材３０Ａの収縮分、絶縁樹脂３０の厚さは、突出部６３の高さより小さくなる。   Next, the mask 60 is pressed toward the substrate 20, and the lower surface of the pressing portion arranged on the peripheral edge of the mask 60 is brought into contact with the upper surface of the substrate 20. Thereby, the insulating resin material 30 </ b> A applied on the substrate 20 is spread and covers the peripheral edge of the light receiving element 10. Further, the insulating resin material 30 </ b> A applied to the mask 60 is integrated with the insulating resin material 30 </ b> A applied onto the substrate 20 and covers the peripheral edge of the light receiving element 10. For this reason, the electrode pad 12 of the light receiving element 10, the connection pad 21 of the substrate 20, and the wire 2, and the upper surface peripheral portion, the entire side surface, and the entire upper surface exposed from the light receiving element 10 of the substrate 20 are insulated resin materials. Covered with 30A. That is, the height of the protrusion 63 of the mask 60 is substantially the same as the thickness of the insulating resin material 30A. However, as will be described later, when the insulating resin material 30A is heated to become the insulating resin 30, the shrinkage of the insulating resin material 30A and the thickness of the insulating resin 30 are smaller than the height of the protruding portion 63.

絶縁樹脂材３０Ａが押し広げられる際、マスク６０には、受光素子１０の受光部１１に対応して堰止め用突起６２が形成されているため、絶縁樹脂材３０Ａの広がりは、この堰止め用突起６２に堰止められる。絶縁樹脂材３０Ａは、堰止め用突起６２から、厚さ方向において遠くに位置する下部側では受光部１１側に向かって広がる。しかし、絶縁樹脂材３０Ａの上部側では堰止め用突起６２により広がりが抑制される。この状態を図５に図示する。   When the insulating resin material 30 </ b> A is spread out, the mask 60 is formed with damming protrusions 62 corresponding to the light receiving portions 11 of the light receiving element 10. The protrusion 62 is dammed up. The insulating resin material 30A spreads from the damming projection 62 toward the light receiving unit 11 on the lower side located farther in the thickness direction. However, on the upper side of the insulating resin material 30 </ b> A, the spreading is suppressed by the blocking protrusion 62. This state is illustrated in FIG.

ここで、マスク６０に堰止め用突起６２が形成されていない場合には、絶縁樹脂材３０Ａが、開口部３１の縁部にばりとなって絶縁樹脂材３０Ａの上面に突き出して形成される。ばりは、絶縁樹脂材３０Ａの上面から突き出して形成されるため、光ヘッドを組み立てる際の精度を低下する。これに対して、本実施形態では、マスク６０に堰止め用突起６２が形成されている。このため、仮に、絶縁樹脂材３０Ａが堰止め用突起６２を越え、開口部３１内に上方に突き出すばりが形成されたとしても、図５に３０Ａ’で示す如く、ばり３０Ａ’は絶縁樹脂材３０Ａの上面から突き出すことはない。つまり、本実施形態の場合には、堰止め用突起６２の高さ分だけ、ばり３０Ａ’の位置が低くなる。これにより、光ヘッドを組み立てる際の精度を確保することができる。   Here, when the blocking protrusion 62 is not formed on the mask 60, the insulating resin material 30 </ b> A is formed as a flash at the edge of the opening 31 and protrudes from the upper surface of the insulating resin material 30 </ b> A. Since the flash protrudes from the upper surface of the insulating resin material 30A, the accuracy when assembling the optical head is lowered. On the other hand, in this embodiment, a damming projection 62 is formed on the mask 60. Therefore, even if the insulating resin material 30A exceeds the damming projection 62 and a flash protruding upward into the opening 31 is formed, the flash 30A ′ is formed of the insulating resin material as indicated by 30A ′ in FIG. It does not protrude from the upper surface of 30A. That is, in the case of this embodiment, the position of the flash 30 </ b> A ′ is lowered by the height of the damming projection 62. Thereby, the precision at the time of assembling an optical head is securable.

マスク６０を基板２０側に押圧してマスク６０の突出部６３の下面を基板２０の上面に当接する際に、マスク６０の突出部６３に対応する部分の絶縁樹脂材３０Ａは、マスク６０の突出部６３に押し出されるため、この部分は空隙となる。   When the mask 60 is pressed toward the substrate 20 and the lower surface of the protrusion 63 of the mask 60 is brought into contact with the upper surface of the substrate 20, the portion of the insulating resin material 30 </ b> A corresponding to the protrusion 63 of the mask 60 is protruded from the mask 60. Since it is pushed out by the part 63, this part becomes a gap.

次に、図５に図示された状態で加熱することにより絶縁樹脂材３０Ａを硬化し、絶縁樹脂３０を形成する。そして、絶縁樹脂３０上に配置されたマスク６０を剥離する。この状態において、絶縁樹脂３０には、受光素子１０の受光部１１に対応する開口部３１が形成され、開口部３１の上部周縁部に全周囲に亘る凹部３２が形成されている。また、マスク６０の突出部６３に対応する部分に絶縁樹脂３０の厚さの中間位置に達する深さの切欠部３３が形成されている。   Next, the insulating resin material 30 </ b> A is cured by heating in the state illustrated in FIG. 5, thereby forming the insulating resin 30. Then, the mask 60 disposed on the insulating resin 30 is peeled off. In this state, an opening 31 corresponding to the light receiving portion 11 of the light receiving element 10 is formed in the insulating resin 30, and a concave portion 32 is formed around the entire periphery of the upper periphery of the opening 31. Further, a notch 33 having a depth reaching an intermediate position of the thickness of the insulating resin 30 is formed in a portion corresponding to the protrusion 63 of the mask 60.

次に、絶縁樹脂３０上全面に保護シート７１を貼り付ける。保護シート７１としては剥離可能な粘着層を有するものを用いる。この状態を図６に図示する。   Next, the protective sheet 71 is attached to the entire surface of the insulating resin 30. As the protective sheet 71, a sheet having a peelable adhesive layer is used. This state is illustrated in FIG.

次に、基板２０、絶縁樹脂３０および保護シート７１を切断して、多数の受光装置１を得る。
基板２０、絶縁樹脂３０および保護シート７１を切断する場合、マスク６０の突出部６３に対応して形成された絶縁樹脂３０の円筒形状の空隙が、その軸心を通る切断線により４つに等分割されるように切断する。図６における切断位置Ａは、このような、空隙を４つに等分割する位置を示しており、この切断位置Ａにおいて、基板２０および絶縁樹脂３０を点線に示す如く切断する。これにより、各絶縁樹脂３０の４隅には、円筒が１／４に等分割された形状の面積を有する切欠部３３が形成される。この状態を図７に図示する。 Next, the board | substrate 20, the insulating resin 30, and the protection sheet 71 are cut | disconnected, and many light-receiving devices 1 are obtained.
When the substrate 20, the insulating resin 30 and the protective sheet 71 are cut, the cylindrical voids of the insulating resin 30 formed corresponding to the protrusions 63 of the mask 60 are divided into four by the cutting line passing through the axis. Cut to be split. A cutting position A in FIG. 6 shows such a position where the gap is equally divided into four, and at this cutting position A, the substrate 20 and the insulating resin 30 are cut as shown by dotted lines. As a result, at the four corners of each insulating resin 30, cutout portions 33 having an area of a shape in which the cylinder is equally divided into ¼ are formed. This state is illustrated in FIG.

保護シート７１は、光ヘッドを組み立てるまでの保護部材であるから、光ヘッドを組み付ける直前に剥離して、図１および図２に図示された受光装置１を形成する。保護シート７１を剥離する際、受光装置１の絶縁樹脂３０には４隅に切欠部３３が形成されている。従って、いずれかの切欠部３３にピンセットの一端を差し込み、この一端と、保護シート７１の外部に位置された他端とにより保護シート７１を摘まんで剥離することができる。このように、本実施形態によれば、絶縁樹脂３０に切欠部３３を形成したので、保護シート７１の剥離が容易となり生産性の効率化を図ることができる。   Since the protective sheet 71 is a protective member until the optical head is assembled, it is peeled off immediately before the optical head is assembled to form the light receiving device 1 shown in FIGS. 1 and 2. When the protective sheet 71 is peeled off, the insulating resin 30 of the light receiving device 1 has cutout portions 33 at four corners. Therefore, one end of the tweezers can be inserted into one of the cutout portions 33, and the protective sheet 71 can be picked and peeled by this one end and the other end located outside the protective sheet 71. Thus, according to this embodiment, since the notch part 33 was formed in the insulating resin 30, peeling of the protection sheet 71 becomes easy and efficiency of productivity can be achieved.

以上説明した如く、上記一実施の形態によれば、下記の効果を得ることができる。
（１）絶縁樹脂材３０Ａを塗布し、堰止め用突起６２を有するマスク６０により絶縁樹脂材３０Ａを押し広げて受光部１１の周囲における受光素子１０の上面を被覆するので、高価な金型を用いずに受光装置を得ることができる
（２）マスク６０に、絶縁樹脂材３０Ａが開口部６１側に広がるのを堰止めるための堰止め用突起６２が形成されているので、絶縁樹脂３０にばりが発生するのを防止することができる。このため、光ヘッドを組み立てる際の精度を確保することが可能となる。
（３）マスク６０に、絶縁樹脂材３０Ａの厚さ方向の中間位置に達する深さの突出部６３を設け、受光装置１の絶縁樹脂３０に切欠部３３が形成されるようにした。このため、絶縁樹脂３０上に貼り付けた保護シート７１を、切欠部３３にピンセットの一端を差し込んで容易に剥離することができ、生産効率が向上する。
（４）マスク６０をステンレス等の金属で形成したので、繰り返し使用することができる。
この場合、マスクを樹脂フィルムにより形成する従来の方法では、絶縁樹脂材３０Ａを成形する際の熱によりマスクが変形してしまい、使い捨てとなっていた。従って、従来に比して製造コストを低減することができる。 As described above, according to the above embodiment, the following effects can be obtained.
(1) The insulating resin material 30A is applied, and the insulating resin material 30A is spread by the mask 60 having the damming projections 62 to cover the upper surface of the light receiving element 10 around the light receiving portion 11, so that an expensive mold is used. The light receiving device can be obtained without using (2) Since the mask 60 is formed with a damming projection 62 for damming the spreading of the insulating resin material 30A toward the opening 61, the insulating resin 30 Generation of flash can be prevented. For this reason, it becomes possible to ensure the accuracy at the time of assembling the optical head.
(3) The mask 60 is provided with a protrusion 63 having a depth reaching an intermediate position in the thickness direction of the insulating resin material 30 </ b> A so that the notch 33 is formed in the insulating resin 30 of the light receiving device 1. For this reason, the protective sheet 71 affixed on the insulating resin 30 can be easily peeled by inserting one end of the tweezers into the notch 33, and the production efficiency is improved.
(4) Since the mask 60 is made of metal such as stainless steel, it can be used repeatedly.
In this case, in the conventional method in which the mask is formed of a resin film, the mask is deformed due to heat generated when the insulating resin material 30A is molded, and the mask is disposable. Therefore, the manufacturing cost can be reduced as compared with the conventional case.

なお、上記一実施の形態においては、絶縁樹脂材３０Ａを塗布する工程において、絶縁樹脂材３０Ａを、受光素子１０から露出する基板２０上のみに塗布するものとして説明した。しかし、絶縁樹脂材３０Ａは、受光素子１０の受光部１１上に掛からなければ、受光素子１０の周縁部にも塗布してもよい。また、絶縁樹脂材３０Ａをマスク６０にも塗布する場合で説明したが、絶縁樹脂材３０Ａをマスク６０には塗布しないようにしてもよい。   In the above embodiment, the insulating resin material 30A is applied only on the substrate 20 exposed from the light receiving element 10 in the step of applying the insulating resin material 30A. However, the insulating resin material 30 </ b> A may be applied to the peripheral portion of the light receiving element 10 as long as it does not hang over the light receiving part 11 of the light receiving element 10. Moreover, although the case where the insulating resin material 30 </ b> A is applied also to the mask 60 has been described, the insulating resin material 30 </ b> A may not be applied to the mask 60.

上記一実施の形態では、絶縁樹脂材３０Ａの堰止め用突起６２をマスク６０のみに設けた場合で説明した。しかし、堰止め用突起を受光素子１０にも設けるようにしてもよい。受光素子１０に堰止め用突起を設ける場合は、ウエハ製造工程において設けるようにすると効率的である。この場合の一例を示せば、ウエハ状態において、樹脂材料をスピンコーティングし、乾燥後、フォトレジストにより堰止め用突起状にパターニングされたマスクを形成して、堰止め用突起以外の部分をエッチングすればよい。   In the above-described embodiment, the case where the blocking protrusion 62 of the insulating resin material 30 </ b> A is provided only on the mask 60 has been described. However, a damming protrusion may also be provided on the light receiving element 10. In the case where the light-receiving element 10 is provided with a damming projection, it is efficient to provide it in the wafer manufacturing process. As an example of this case, in the wafer state, a resin material is spin-coated, and after drying, a mask patterned in the shape of a damming protrusion is formed by a photoresist, and portions other than the damming protrusion are etched. That's fine.

上記一実施の形態では、マスク６０の周側縁に設けた押し当て部の下面を基板２０の上面に当接させて、絶縁樹脂３０の厚さを確保する方法で説明した。しかし、マスク６０に形成する突出部６３の高さを絶縁樹脂３０の厚さと同一にして、マスク６０を、突出部６３の下面が基板２０の上面に当接するまで絶縁樹脂材３０Ａを押さえ込むようにしてもよい。この場合には、マスク６０の周側縁に押し当て部を形成してもしなくてもよい。あるいは、他の方法として、絶縁樹脂３０の厚さは、マスク６０を上下に移動する駆動部材にセンサを設け、このセンサにより調整するようにしてもよい。   In the above-described embodiment, the method has been described in which the lower surface of the pressing portion provided on the peripheral edge of the mask 60 is brought into contact with the upper surface of the substrate 20 to ensure the thickness of the insulating resin 30. However, the height of the protrusion 63 formed on the mask 60 is the same as the thickness of the insulating resin 30, and the mask 60 is pressed down until the lower surface of the protrusion 63 contacts the upper surface of the substrate 20. May be. In this case, the pressing portion may or may not be formed on the peripheral edge of the mask 60. Alternatively, as another method, the thickness of the insulating resin 30 may be adjusted by a sensor provided on a driving member that moves the mask 60 up and down.

上記一実施の形態では、受光装置１の４隅に切欠部３３が形成された構造であった。しかし、切欠部３３は、１箇所としてもよく、また、角部ではない箇所に設けるようにしてもよい。   In the above embodiment, the light receiving device 1 has the structure in which the notches 33 are formed at the four corners. However, the notch 33 may be provided at one place or may be provided at a place other than the corner.

その他、本発明の受光装置は、発明の趣旨の範囲内において、種々、変形して構成することが可能であり、要は、上面に受光部を有し、基板上に搭載された受光素子が、受光部を露出する開口部を有する絶縁樹脂のみにより、受光素子の上面における受光部の周囲と周囲側面全体、および受光素子から露出された基板の上面が被覆された受光装置であって、絶縁樹脂は、開口部の上部周縁部に全周囲に亘る凹部を有するものであればよい。   In addition, the light receiving device of the present invention can be variously modified within the scope of the invention. In short, the light receiving device mounted on the substrate has a light receiving portion on the upper surface. A light receiving device in which the periphery of the light receiving portion and the entire surrounding side surface on the upper surface of the light receiving element, and the upper surface of the substrate exposed from the light receiving element are covered only by an insulating resin having an opening that exposes the light receiving portion. The resin should just have a recessed part over the perimeter in the upper peripheral part of an opening part.

また、本発明の受光装置の製造方法は、接続パッドを有する基板上に、受光部および電極パッドを有する受光素子を載置し、接続パッドと前記電極パッドを接続部材により接続する工程と、少なくとも受光素子の周囲における基板上に絶縁樹脂材を塗布する工程と、受光素子の受光部に対応する開口部を有し、開口部の全周囲に亘り受光素子側に突き出す堰止め用突起が形成されたマスクにより、基板上に塗布された絶縁樹脂材を押さえ込み、堰止め用突起を堰止め部として絶縁樹脂材を前記受光素子上に押し広げる工程と、絶縁樹脂材を硬化して絶縁樹脂にする工程と、受光素子の周囲における基板および絶縁樹脂を切断することにより、受光素子の受光部を露出する開口部を有し、開口部の上部周縁部に凹部が形成された絶縁樹脂により、受光素子の上面と側面、および基板の上面が被覆された受光装置を得る工程とを備えるものであればよい。   The method of manufacturing the light receiving device of the present invention includes a step of placing a light receiving element having a light receiving portion and an electrode pad on a substrate having a connection pad, and connecting the connection pad and the electrode pad by a connection member, A step of applying an insulating resin material on the substrate around the light receiving element, and an opening corresponding to the light receiving part of the light receiving element, and a damming protrusion protruding to the light receiving element side over the entire periphery of the opening are formed. And pressing the insulating resin material applied on the substrate with the mask, spreading the insulating resin material on the light receiving element using the damming projection as a damming portion, and curing the insulating resin material to make an insulating resin. A process and an insulating resin having an opening that exposes the light receiving portion of the light receiving element by cutting the substrate and the insulating resin around the light receiving element, and a recess formed in the upper peripheral edge of the opening Upper and side surfaces of the light receiving element, and the upper surface of the substrate as long as it comprises a step of obtaining a light receiving device that is coated.

１ 受光装置
１１ 受光部
２０ 基板
３０ 絶縁樹脂
３０Ａ 絶縁樹脂材
３１ 開口部
３２ 凹部
３３ 切欠部
６０ マスク
６１ 開口部
６２ 堰止め用突起
６３ 突出部
７１ 保護シート
Ａ 切断位置
DESCRIPTION OF SYMBOLS 1 Light receiving device 11 Light receiving part 20 Board | substrate 30 Insulating resin 30A Insulating resin material 31 Opening part 32 Recessed part 33 Notch part 60 Mask 61 Opening part 62 Damping protrusion 63 Projecting part 71 Protection sheet A Cutting position

Claims (13)

上面に受光部を有し、基板上に搭載された受光素子が、前記受光部を露出する開口部を有する絶縁樹脂のみにより、前記受光素子の上面における前記受光部の周囲と周囲側面全体、および前記受光素子から露出された前記基板の上面が被覆された受光装置であって、
前記絶縁樹脂は、前記開口部の上部周縁部に全周囲に亘る凹部を有することを特徴とする受光装置。 The light receiving element having a light receiving part on the upper surface and mounted on the substrate is made of only an insulating resin having an opening that exposes the light receiving part, and the periphery of the light receiving part and the entire peripheral side surface on the upper surface of the light receiving element; A light receiving device in which an upper surface of the substrate exposed from the light receiving element is coated;
The light-receiving device, wherein the insulating resin has a concave portion extending over the entire periphery in an upper peripheral portion of the opening. 請求項１に記載の受光装置において、前記絶縁樹脂は多角形状を有し、少なくとも１つの角部に前記絶縁樹脂の上面から陥没した切欠部を有することを特徴とする受光装置。   2. The light receiving device according to claim 1, wherein the insulating resin has a polygonal shape, and has a notch that is recessed from an upper surface of the insulating resin at at least one corner. 請求項１または２に記載の受光装置において、前記絶縁樹脂は矩形形状を有し、角部のすべてに前記切欠部を有することを特徴とする受光装置。   3. The light receiving device according to claim 1, wherein the insulating resin has a rectangular shape, and the cutout portion is provided at all corners. 4. 請求項２または３の受光装置において、前記絶縁樹脂上に、前記切欠部上を含み前記絶縁樹脂の上面全体を覆う保護シートが剥離可能に貼り付けられていることを特徴とする受光装置。   4. The light receiving device according to claim 2, wherein a protective sheet that covers the entire top surface of the insulating resin including the top of the notch is detachably attached to the insulating resin. 請求項２乃至４のいずれか１項に記載の受光装置において、前記切欠部は前記絶縁樹脂の厚さ方向の中間位置までの深さを有することを特徴とする受光装置。   5. The light receiving device according to claim 2, wherein the notch has a depth to an intermediate position in a thickness direction of the insulating resin. 請求項２乃至４のいずれか1項に記載の受光装置において、前記切欠部は前記絶縁樹脂を厚さ方向に貫通する深さを有し、前記基板の上面は前記切欠部に表出していることを特徴とする受光装置。   5. The light receiving device according to claim 2, wherein the notch has a depth penetrating the insulating resin in a thickness direction, and an upper surface of the substrate is exposed to the notch. A light receiving device characterized by that. 接続パッドを有する基板上に、受光部および電極パッドを有する受光素子を載置し、前記接続パッドと前記電極パッドを接続部材により接続する工程と、
少なくとも前記受光素子の周囲における前記基板上に絶縁樹脂材を塗布する工程と、
前記受光素子の受光部に対応する開口部を有し、前記開口部の全周囲に亘り前記受光素子側に突き出す堰止め用突起が形成されたマスクにより、前記基板上に塗布された前記絶縁樹脂材を押さえ込み、前記堰止め用突起を堰止め部として前記絶縁樹脂材を前記受光素子上に押し広げる工程と、
前記絶縁樹脂材を硬化して絶縁樹脂を形成する工程と、
前記受光素子の周囲における前記基板および前記絶縁樹脂を切断することにより、前記受光素子の受光部を露出する開口部を有し、前記開口部の上部周縁部に凹部が形成された絶縁樹脂により、前記受光素子の上面と側面、および前記基板の上面が被覆された受光装置を得る工程と、
を備えることを特徴とする受光装置の製造方法。 Placing a light receiving element and a light receiving element having an electrode pad on a substrate having a connection pad, and connecting the connection pad and the electrode pad with a connection member;
Applying an insulating resin material on the substrate at least around the light receiving element;
The insulating resin applied on the substrate by a mask having an opening corresponding to the light receiving portion of the light receiving element, and having a damming protrusion that protrudes toward the light receiving element over the entire periphery of the opening Pressing the material, the step of spreading the insulating resin material on the light receiving element as the damming protrusion as a damming portion;
Curing the insulating resin material to form an insulating resin;
By cutting the substrate and the insulating resin around the light receiving element, the insulating resin having an opening that exposes the light receiving part of the light receiving element and having a recess formed in the upper peripheral edge of the opening, Obtaining a light receiving device in which the upper surface and side surfaces of the light receiving element and the upper surface of the substrate are coated;
A method of manufacturing a light-receiving device. 請求項７に記載の受光装置の製造方法において、前記絶縁樹脂材を前記受光素子上に押し広げる工程は、前記マスクの前記堰止め用突起の周囲に前記絶縁樹脂材を塗布する工程を含むことを特徴とする受光装置の製造方法。   8. The method for manufacturing a light receiving device according to claim 7, wherein the step of spreading the insulating resin material onto the light receiving element includes a step of applying the insulating resin material around the damming projection of the mask. A method for manufacturing a light receiving device. 請求項７または８に記載の受光装置の製造方法において、前記マスクは、前記受光素子の周囲に対応する部分に突出部を有し、前記堰止め用突起を堰止め部として前記絶縁樹脂材を前記受光素子上に押さえ込む工程は、前記突出部の下面に対応する部分の前記絶縁樹脂材を押圧して、前記絶縁樹脂材に切欠部を形成する工程を含むことを特徴とする受光装置の製造方法。   9. The method of manufacturing a light receiving device according to claim 7, wherein the mask has a protruding portion at a portion corresponding to the periphery of the light receiving element, and the insulating resin material is formed using the blocking protrusion as a blocking portion. The step of pressing onto the light receiving element includes a step of pressing a portion of the insulating resin material corresponding to the lower surface of the protruding portion to form a notch in the insulating resin material. Method. 請求項９に記載の受光装置の製造方法において、前記マスクは、前記突出部よりも外周に、前記突出部よりも高さが高い押し当て部を有し、前記絶縁樹脂材を前記受光素子上に押さえ込む工程は、前記押し当て部の下面が前記基板の上面に当接するまで前記マスクを押圧する工程を含むことを特徴とする受光装置の製造方法。   10. The method of manufacturing a light receiving device according to claim 9, wherein the mask has a pressing portion having a height higher than the protruding portion on an outer periphery of the protruding portion, and the insulating resin material is disposed on the light receiving element. Pressing the mask until the lower surface of the pressing portion abuts against the upper surface of the substrate. 請求項９または１０に記載の受光装置の製造方法において、前記受光素子を前記基板上に載置する工程は、複数個の前記受光素子を前記基板上に載置する工程であり、前記絶縁樹脂材を前記受光素子上に押し広げる工程は、複数個の前記受光素子に対応する面積を有するマスクを用いて行う工程であり、前記受光素子の周囲における前記基板および前記絶縁樹脂を切断する工程は、前記絶縁樹脂材を押し出して形成された前記切欠部を分割するように切断する工程であることを特徴とする受光装置の製造方法。   The method for manufacturing a light receiving device according to claim 9 or 10, wherein the step of placing the light receiving element on the substrate is a step of placing a plurality of the light receiving elements on the substrate, and the insulating resin. The step of spreading the material on the light receiving element is a step performed using a mask having an area corresponding to a plurality of the light receiving elements, and the step of cutting the substrate and the insulating resin around the light receiving element is performed A method of manufacturing a light receiving device, characterized by being a step of cutting so as to divide the cutout portion formed by extruding the insulating resin material. 請求項７乃至１１のいずれか１項に記載の受光装置の製造方法において、さらに、前記絶縁樹脂材を硬化して絶縁樹脂を形成する工程と前記受光素子の周囲における前記基板および前記絶縁樹脂を切断する工程との間に、前記受光素子上に保護シートを貼り付ける工程を備えることを特徴とする受光装置の製造方法。   The method for manufacturing a light receiving device according to claim 7, further comprising: a step of curing the insulating resin material to form an insulating resin; and the substrate and the insulating resin around the light receiving element. The manufacturing method of the light-receiving device characterized by including the process of sticking a protective sheet on the said light receiving element between the process of cut | disconnecting. 請求項７乃至１２のいずれか１項に記載の受光素子の製造方法において、前記絶縁樹脂材は粘度が２００〜３５０Ｐａ・ｓであることを特徴とする受光装置の製造方法。
The method for manufacturing a light receiving device according to any one of claims 7 to 12, wherein the insulating resin material has a viscosity of 200 to 350 Pa · s.
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