JP2012109441A - Conductive connection structure, conductive connection method, and conductive connection film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To interconnect a plurality of conductive members to be connected in free shape by a simple process in a conductive connection structure.SOLUTION: In a conductive connection structure 2, a plurality of conductive members to be connected 31, 32 are connected via a conductive connection film 1. The conductive connection structure 2 includes, as the conductive connection film 1, an uncured or semi-cured curable resin film 11, and a conductive pattern 21 formed on at least one surface of the curable resin film 11 and having a conductive connection 21C being connected with the plurality of conductive members to be connected 31, 32. At least the connection side surface of the conductive connection 21C is exposed in the conductive pattern 21, and the conductive connection film 1 is cured and shaped during conductive connection thus performing conductive connection of the plurality of conductive members to be connected 31, 32.

Description

  The present invention relates to a conductive connection structure in which a plurality of conductive connection members are connected via a conductive connection film, and a conductive connection method and a conductive connection film for obtaining the conductive connection structure.

  In electronic devices such as mobile phones, the connection structure between multiple printed circuit boards (PCBs) or the connection structure between a printed circuit board and various functional parts is made smaller, thinner, lighter, more multifunctional, Due to the demand for design and the like, further liberalization and efficiency of design are required.

  As a conventional connection structure, a connection structure in which a plurality of PCBs are connected using a surface mount (SMD: Surface Mount Device) connector, or an anisotropic conductive film (ACF) is connected to the PCB. For example, a connection structure for connecting a flexible printed board (FPC) is adopted.

However, the connection structure using the SMD connector does not have a high degree of design freedom, and there is a limit to freely connecting a plurality of PCBs in a three-dimensional positional relationship within the casing of the electronic device.
Specifically, in the connection structure using the SMD connector, there is a limitation in reducing the height and the like for convenience of connector fitting. Changing the PCB's three-dimensional position requires measures such as changing the connector mold, and changing the design requires cost and time. In addition, since there is no flexibility in the connection part, the adaptability to the PCB misalignment and the connection durability when mechanical stress is applied from the outside tend to be weaker than the connection structure using ACF and FPC. .

On the other hand, the connection structure using ACF and FPC has the following limitations.
In general, since the connection strength of a connection structure using ACF depends on the adhesive strength of ACF, when a force is applied to peel off ACF from the outside, a load is applied to the thin adhesive portion of ACF in the thickness direction. It is easy to concentrate and this part tends to be weak. Therefore, in the connection structure using ACF and FPC, it is necessary to devise the connection direction so as to avoid the load in the peeling direction of the ACF.

  In Patent Document 1, a conductor pattern (14) is attached between two insulating film substrates (12, 13) in the extending direction of these film substrates, and a conductor is attached to the insulating film substrate (12, 13). Metal plates (15, 16) having a strength stronger than that of the conductor pattern are attached so as not to contact the pattern (14), and flexible insulating film substrates (17, 18) are provided outside the metal plates. ) Is attached, and the flat wire harness (11) is disclosed in which the shape of the insulating film substrate (12, 13, 17, 18) and the conductor pattern (14) is fixed by bending the metal plate (15, 16). (Claim 1, FIG. 1 and FIG. 2).

  In Patent Document 2, a first wiring resin group (30) provided in a plurality of stages and a second wiring resin (40) for connecting the first wiring resin group (30) in the height direction; A metal layer (60) covering the outer surfaces of the first wiring resin group (30) and the second wiring resin (40), and the first wiring resin group (30) and the second wiring resin (40). A three-dimensional circuit board (10) having a configuration in which an insulating layer (50) to be embedded is provided, and at least a connection portion between the first wiring resin group (30) and the second wiring resin (40) is provided in the same shape. ) Is disclosed (Claim 1, FIGS. 1A to 1C, and FIGS. 2A to 2B).

  In Patent Document 3, a wiring pattern (3) is formed on an insulating material (2a) that has a semi-cured state and is cured by heating and pressurization, and is further covered with a similar insulating material (2b). A flexible printed wiring board (2) having a structure is described (paragraph 0008, FIG. 1). And in the one end part of this flexible printed wiring board (2), it comprises so that each wiring board may branch by selectively performing heating and pressurization, and the front-end | tip of the branched flexible printed wiring board (2) is different, respectively. A connection structure is described which is connected to a rigid printed wiring board (4) (Claim 1, FIG. 1).

  In Patent Document 4, a flexible wiring board (1) laminated with a coverlay film (3) is laminated with an interlayer adhesive sheet (4) and a rigid wiring board (6), and is integrally molded by heating and pressurizing. An unnecessary portion of the board is removed to partially expose the flexible wiring board. A conductive pattern of the connection terminal (8) is provided on the flexible wiring board, and an adhesive sheet (4 ′) is provided on the rigid wiring board. Thus, there is disclosed a flex-rigid multilayer wiring board in which an exposed portion of a flexible wiring board having a conductor pattern of a connection terminal is bent and heat-pressed and integrated, and a connection terminal (8) is disposed on a rigid wiring board portion ( Claim 1, FIG. 1).

  In Patent Document 5, a photocurable resin is applied on a temporary substrate (1), exposed and developed to form a reversal pattern opposite to the conductor wiring pattern, and then an electric circuit formed between the reversal patterns ( 3) Conductor wiring (4) is formed by electroplating, and then the obtained temporary substrate is placed in a mold and an insulating substrate is formed on the wiring pattern forming surface, and then temporary substrate (1) is formed. A method of manufacturing a molded circuit body is described by removing the molded body from the molded body and transferring the insulating mask (2) together with the conductor wiring pattern to the surface of the molded body (abstract, FIGS. 1 (a) to (g)). .

  In Patent Document 6, a wiring sheet (5) in which a wiring pattern (2) is formed in advance on at least one surface of a film formed from a polymer capable of forming an optically anisotropic molten phase, and a three-dimensional resin. A molded circuit component (10) in which a molded body (7) having a structure is integrated when the molded body (7) is molded is disclosed (claim 1, Fig. 1 (a) to (c)).

JP 2000-133051 A JP 2007-208027 A Japanese Unexamined Patent Publication No. 08-139455 JP 09-191182 A Japanese Patent Laid-Open No. 11-017314 Japanese Patent Laid-Open No. 11-307904

In the connection structure using the flat wire harness described in Patent Document 1, there is a certain degree of freedom in connection shape by bending the metal plates (15, 16). However, the metal plates (15, 16) are less flexible than the resin, and tend to be less adaptable to displacement of the conductive connecting member and less durable when mechanical stress is applied from the outside. The metal plates (15, 16) easily transmit vibrations and shocks generated in one conductive connection member to the other conductive connection member.
Moreover, in the flat wire harness of patent document 1, in order to make a conductor pattern (14) and a metal plate (15,16) non-contact, the number of film lamination | stacking necessarily increases, and it is high-cost. Even if they are not contacted, the conductor pattern (14) may be electrically affected by the presence of the metal plates (15, 16).

  The three-dimensional circuit board described in Patent Literature 2 is a three-dimensional wiring in the circuit board, and does not connect a plurality of conductive connection members in a free shape. In addition, the three-dimensional wiring in the circuit board is implemented by an optical modeling method using a photocurable resin (claim 10), and the design and manufacture are complicated.

In the connection structure of Patent Document 3, only by heat-pressing the flexible wiring board (2) and the rigid printed wiring board (4), the insulating layer (2a, 2b) on the flexible wiring board (2) side causes both of them. Conductivity between the wiring patterns (5, 3) cannot be obtained, and through-holes (6, 6 ′) are provided in the flexible wiring board (2) to obtain conduction (paragraph 0013).
Thus, in Patent Document 3, it is essential to devise such as providing through holes (6, 6 ') for conduction in the flexible wiring board (2). The rigid printed wiring board (4) and the flexible wiring board (2 ) Is not simple, the efficiency of the conductive connection process is poor, and the cost is increased.

According to the flex-rigid multilayer wiring board of Patent Document 4, the space of the substrate can be effectively used by bending the exposed portion having the connection terminal of the flexible wiring board and attaching and bonding the flexible wiring board to the rigid wiring board. (Paragraph 0012).
However, the flex-rigid multilayer wiring board described in Patent Document 4 does not connect a plurality of conductive connection members in a free shape.

  The circuit bodies and circuit components described in Patent Documents 5 and 6 are already molded into a predetermined shape, and do not connect a plurality of conductive connection members in a free shape.

  The present invention has been made in view of the above circumstances, and can be connected between a plurality of conductive connection members in a free shape and with a simple process, easily adaptable to positional deviation of the plurality of conductive connection members, An object of the present invention is to provide a conductive connection film in which durability of a connection portion is improved when mechanical stress is applied from the outside after conductive connection with a conductive connection member, and a conductive connection structure and a conductive connection method using the conductive connection film. It is what.

The conductive connection structure of the present invention is
A conductive connection structure in which a plurality of conductive connection members are connected via a conductive connection film,
As the conductive connection film, a conductive pattern having an uncured or semi-cured curable resin film and a conductive connection portion formed on at least one surface of the curable resin film and connected to the plurality of conductive connection members. The conductive pattern is cured and molded at the time of conductive connection, and the plurality of conductive connection members are conductively connected using at least the surface of the conductive connection portion exposed in the conductive pattern in the conductive pattern. It is a thing.

In this specification, “semi-curing” means a state in which the curing reaction is partially occurring but not completely completed.
In this specification, the “conductive pattern” includes a wiring and / or a terminal.

The conductive connection method of the present invention comprises:
An uncured or semi-cured curable resin film, and a conductive pattern having a conductive connection portion formed on at least one surface of the curable resin film and connected to a plurality of conductive connection members. In step (X) of preparing a conductive connection film in which at least the surface on the connection side of the conductive connection part is exposed,
Connecting the conductive connection portions of the plurality of conductive connection members and the conductive connection film (Y);
And a step (Z) of curing and forming the conductive connection film.

  In the conductive connection method of the present invention, the order of the step (Y) and the step (Z) is not limited, and these steps may be performed simultaneously.

The conductive connection film of the present invention is
A conductive connection film for conductively connecting between a plurality of conductive connection members,
A curable resin film made of an uncured or semi-cured curable resin and formed on at least one surface of the curable resin film which can be cured and formed and connected to the plurality of conductive connection members A conductive pattern having at least a connection-side surface of the conductive connection portion exposed in the conductive pattern.

  According to the present invention, a plurality of conductive connection members can be connected to each other in a free shape and with a simple process, and it is easy to adapt to positional deviation of the plurality of conductive connection members, and conductive connection with a plurality of conductive connection members. It is possible to provide a conductive connection film in which durability of a connection portion is improved when mechanical stress is applied from the outside later, and a conductive connection structure and a conductive connection method using the conductive connection film.

It is a perspective view of the conductive connection film of one embodiment concerning the present invention. It is a perspective view of the conductive connection structure using the conductive connection film of FIG. 1A. It is a side view of FIG. 2A. It is a top view which shows the example of a design change of an electroconductive connection film. It is a top view which shows the example of a design change of an electroconductive connection film. It is a top view which shows the example of a design change of an electroconductive connection film. It is a top view which shows the example of a terminal pattern. It is a top view which shows the example of a terminal pattern. It is a top view which shows the example of a terminal pattern. It is a top view which shows the example of a terminal pattern. It is a top view which shows the example of a terminal pattern.

With reference to drawings, the conductive connection film of one Embodiment concerning this invention, the conductive connection structure using this, and the conductive connection method are demonstrated.
1 is a perspective view of the conductive connection film of the present embodiment, FIG. 2A is a perspective view of the conductive connection structure of the present embodiment, and FIG. 2B is a side view of FIG. 2A. In order to facilitate visual recognition, the illustration of each component in the drawing is simplified by making it appropriately different from the actual one.

  As shown in FIG. 1, the conductive connection film 1 of the present embodiment is made of an uncured or semi-cured curable resin, and can be curable and formed with a curable resin film 11 and at least one surface of the curable resin film 11. And a conductive pattern 21 formed on the substrate.

The conductive connection film 1 has a conductive pattern 21 composed of a plurality of wirings 21 </ b> W formed in a stripe pattern on the upper surface of the curable resin film 11 having a rectangular shape in plan view.
Both ends of each wiring 21 </ b> W are conductive connection terminals 21 </ b> T connected to a conductive connection member such as a wiring board. The conductive connection film 1 has conductive connection portions 21 </ b> C made of a group of a plurality of conductive connection terminals 21 </ b> T at both ends in the longitudinal direction of the curable resin film 11.
In the illustrated example, the terminal 21T is a part of the wiring 21W, and these are not clearly separated.

In the present embodiment, the entire surface of the conductive pattern 21 opposite to the curable resin film 11 is exposed.
The conductive pattern 21 may be partially covered with an insulating film, an insulating film, or the like, but at least the surface on the connection side of the conductive connection portion 21C in the conductive pattern 21 needs to be exposed.

The constituent resin of the curable resin film 11 is not particularly limited, and may be a thermosetting resin or a photocurable resin. Examples of the photocurable resin include resins that are cured by ultraviolet irradiation or electron beam irradiation. Any known curable resin can be used.
Considering the process efficiency of the conductive connection, the curable resin preferably has a short curing time when compared under the same curing conditions.
Moreover, components, such as arbitrary semiconductor elements, may be mounted on the conductive connection member such as a wiring board and / or the conductive connection film 1 using solder. In such a case, it is preferable to use a resin that can be crimped and cured at a temperature lower than the melting point of the solder as the curable resin.

The curable resin film 11 may be in a state in which the curing reaction is not completely completed when the conductive connection film 1 is not used, may be in an uncured state in which no curing reaction has occurred, or the curing reaction is partially performed. However, it may be in a semi-cured state that is not completely finished.
However, since the degree of freedom of shape design of the conductive connection film 1 when connecting to the conductive connection member is expanded, the curable resin film 11 is in an uncured state in which no curing reaction occurs when the conductive connection film 1 is not used. It is preferable that it exists in.

The conductive connection film 1 can be manufactured by the following method, for example.
A metal foil such as a copper foil is laminated on a resin base film such as polyimide or polyamide. Thereafter, the metal foil is patterned by a chemical etching process or the like to form the conductive pattern 21. Thereby, the conductive pattern film in which the conductive pattern 21 is formed on the resin base film is obtained.
The conductive pattern film is laminated on a separately prepared curable resin film 11. At this time, the conductive pattern 21 side of the conductive pattern film is bonded to the curable resin film 11.
Although this state may be maintained, physical etching such as laser irradiation is performed on a base resin such as polyimide or polyamide existing at least in the gap between the conductive patterns 21 of the conductive connection portion 21C (specifically, at least between adjacent terminals 21T). It is preferable to remove by treatment or chemical etching treatment.
By removing at least the base material resin in the gap between the conductive patterns 21 of the conductive connection portion 21C, the constituent resin of the curable resin film 11 becomes the gap between the conductive patterns 21 of the conductive connection portion 21C when connecting to the conductive connection member. The conductive connection portions of the conductive connection film 1 and the conductive connection member are well bonded to each other by the constituent resin of the curable resin film 11.

The conductive connection film 1 is formed by pattern-printing (applying) a conductive paste containing metal particles such as silver nanoparticles and / or copper nanoparticles on the curable resin film 11, and then removing the solvent to form a conductive pattern 21. Can also be manufactured.
The conductive connection film 1 is also formed by depositing a conductive material on the curable resin film 11 by vapor deposition or the like and then etching to form a conductive pattern 21. The conductive material is patterned on the curable resin film 11 using a mask. By doing so, it can also be manufactured by a method of forming the conductive pattern 21.
In the above method for forming the conductive pattern 21 on the curable resin film 11, the above-described steps are performed within the range of the heat resistant temperature of the curable resin film 11.
In the case where the curable resin film 11 is made of a thermosetting resin, the above-described method of forming the conductive pattern 21 on the curable resin film 11 is performed within the temperature range where the curing of the curable resin film 11 does not proceed. A process is performed.
Specifically, in the method of pattern printing (coating) the conductive paste, the solvent is removed by drying under reduced pressure or drying at a relatively low temperature. In a method of depositing a conductive material, film formation is performed by room temperature deposition or relatively low temperature deposition. Here, “relatively low temperature” means a temperature within the range of the heat resistance temperature of the curable resin film 11.

As shown in FIGS. 2A and 2B, the conductive connection structure 2 of the present embodiment has a plurality (two in this embodiment) of conductive connection members 31 and 32 connected via the conductive connection film 1. It is a thing.
The conductive connection film 1 is cured at the time of conductive connection with the conductive connection members 31 and 32 and is formed into a predetermined shape.
In FIG. 2A, for ease of understanding, a part of the curable resin film 11 is not illustrated, and a plurality of conductive connection terminals 21T that are not actually visually recognized are visually recognized. Actually, in FIG. 2A, the conductive pattern 21 is entirely covered with the curable resin film 11 (see FIGS. 1A and 2B).

  In the present embodiment, each of the plurality of conductive connection members 31 and 32 is a printed circuit board (PCB). The type of the wiring board is not particularly limited, and is arbitrary such as a rigid board, a flexible board, a rigid flex board, a ceramic board, or a glass board.

As shown in FIG. 2B, the conductive connection member 31 includes a plurality of conductive connection terminals 31T to which a plurality of conductive connection terminals 21T formed at one end portion (the left end portion in the drawing) of the conductive connection film 1 are respectively connected. A conductive connection portion 31C is formed.
Similarly, the conductive connection member 32 includes a plurality of conductive connection terminals 32 </ b> T to which a plurality of conductive connection terminals 21 </ b> T formed on the other end portion (the right end portion in the drawing) of the conductive connection film 1 are respectively connected. 32C is formed.
In the conductive connection structure 2 of the present embodiment, the conductive connection portions of the conductive connection film 1 and the plurality of conductive connection members 31 and 32 are connected to each other.

  In the present embodiment, the installation height of one conductive connection member 31 and the other conductive connection member 32 is different. In the illustrated example, the position of the conductive connection member 31 on the left side of the drawing is relatively low, and the position of the conductive connection member 32 on the right side of the drawing is relatively high. The conductive connection member 32 is connected in a shape bent in a staircase shape.

  With reference to FIG. 2B, the example of the conductive connection method of the conductive connection film 1 and the some to-be-conductive connected members 31 and 32 is demonstrated.

<Process (X)>
A conductive connection film 1 in which the curable resin film 11 is uncured or semi-cured is prepared. The manufacturing method is as described above.

<Process (Y-1)>
Next, the conductive connection portions of the conductive connection film 1 and the conductive connection member 32 are connected.
Specifically, the conductive connection portion 21C of the conductive connection film 1 and the conductive target are connected so that each conductive connection terminal 32T of the conductive connection member 32 and the corresponding conductive connection terminal 21T formed on the conductive connection film 1 overlap each other. After aligning and overlapping the conductive connection portion 32C of the connection member 32, they are thermocompression bonded. In this step, a known apparatus provided with positioning means, heating means, and pressurizing means can be used.
In this step, each conductive connection terminal 32T of the conductive connection member 32 and the corresponding conductive connection terminal 21T of the conductive connection film 1 are brought into conduction by mutual contact, and the conductive connection film 1 and the conductive connection member 32 The conductive connection parts are bonded together by a resin that has flowed by heating and pressing.

<Process (Z)>
Next, the conductive connection film 1 is cured and formed.

When the curable resin film 11 is made of a thermosetting resin, a mold having a desired shape of the conductive connection film 1 (stepped shape shown in FIG. 2B) is prepared, which is made of a metal having good heat conductivity. Is heated to the curing temperature of the curable resin film 11. This is brought into contact with the conductive connection film 1 to cure and mold the conductive connection film 1. The mold may be heated after the mold is brought into contact with the conductive connection film 1.
In this step, the conductive connecting portion 21C with the conductive connecting member 31 in the conductive connecting film 1 has a temperature equal to the resin melting temperature and curing by arranging a cooling means around the conductive connecting portion 21C so as not to cause thermosetting and resin flow. It is necessary to control so as not to exceed the temperature.

When the curable resin film 11 is made of a photocurable resin, a mold that transmits a wavelength of light used for resin curing and has a desired shape of the conductive connection film 1 (stepped shape shown in FIG. 2B) is prepared. The mold is brought into contact with the conductive connection film 1 and the conductive connection film 1 is irradiated with light such as ultraviolet rays to cure and mold the conductive connection film 1.
In this step, it is necessary to shield the periphery of the conductive connection part 21 </ b> C with the conductive connection member 31 in the conductive connection film 1 so that photocuring does not occur.

<Process (Y-2)>
Next, similarly to the step (Y-1), the conductive connection portions of the conductive connection film 1 and the conductive connection member 31 are connected.
Specifically, the conductive connection portion 21 </ b> C of the conductive connection film 1 and the conductive connection so that each conductive connection terminal 31 </ b> T of the conductive connection member 31 and the corresponding conductive connection terminal 21 </ b> T formed on the conductive connection film 1 overlap each other. After aligning and overlapping the conductive connection part 31C of the member 31, these are thermocompression bonded.
In this step, each conductive connection terminal 31T of the conductive connection member 31 and the corresponding conductive connection terminal 21T of the conductive connection film 1 are electrically connected to each other, and the conductive connection film 1 and the conductive connection member 31 are electrically connected. The conductive connection parts are bonded together by a resin that has flowed by heating and pressing.

Through the above steps, the conductive connection between the conductive connection film 1 and the plurality of conductive connection members 31 and 32 is completed.
The order of a process (Y-1), a process (Y-2), and a process (Z) can be changed suitably. Also, these steps can be performed simultaneously.

  Components such as arbitrary semiconductor elements are mounted on the conductive connection members 31 and 32 using solder or the like as necessary. The component mounting on the conductive connection members 31 and 32 may be performed before or after the conductive connection between the conductive connection film 1 and the conductive connection members 31 and 32.

In the present embodiment, the conductive connection film 1 is used which is made of an uncured or semi-cured curable resin and includes a curable resin film 11 which is flexible and can be changed in shape.
Therefore, according to this embodiment, since the conductive connection film 1 can be formed into a desired shape at the time of conductive connection between the conductive connection film 1 and the plurality of conductive connection members 31, 32, the plurality of conductive connection members 31, 32. Conductive connection can be established in a three-dimensional free shape.
According to the present embodiment, the other conductive connection member 32 can be arranged in a three-dimensional free position (such as height and angle direction) with respect to one conductive connection member 31.
The curable resin film 11 can be cured and molded by thermosetting or photocuring a mold having a desired shape in contact with the curable resin film 11, and the curing molding process is not particularly complicated.

In this embodiment, since at least the surface on the connection side of the conductive connection portion 21C is exposed in the conductive pattern 21 formed on the conductive connection film 1, the conductive connection film 1 and the plurality of conductive connection members 31, 32 These conductions can be obtained simply by bringing the conductive connection portions into direct contact with each other.
Therefore, the conductive connection between the conductive connection film 1 and the conductive connection members 31 and 32 only needs to be performed by heat-compression by overlapping the conductive connection portions, and this is not particularly complicated.

  In the present embodiment, the conductive connection film 1 can be conductively connected between the plurality of conductive connection members 31 and 32 in a free shape, and the conductive connection film 1 uses resin even after curing to some extent. Therefore, it is easy to adapt to the displacement of the conductive connecting members 31 and 32.

Since the conductive connection portion 21C of the conductive connection film 1 uses a resin, it has a certain degree of flexibility, and also has a connection durability when mechanical stress is applied from the outside, compared to a connection structure using ACF and FPC. Good and reliable conductive connection is obtained.
Since the relatively flexible conductive connection film 1 is interposed between the plurality of conductive connection members 31 and 32, the effect of relaxing the transmission of the stress generated in one conductive connection member to the other conductive connection member is also achieved. can get.
In addition, although the conductive connection film 1 is flexible compared with a wiring board etc., since it has hardened | cured after conductive connection, the shape is maintained in a desired shape.

In the present embodiment, the conductive connection film 1 allows the conductive connection members 31 and 32 to be conductively connected in a free shape. For example, the following effects can be obtained.
The degree of freedom in designing the layout of the plurality of wiring boards and their connection structures in the casing of the electronic device is increased. Therefore, these designs are simplified and it becomes easy to deal with design changes accompanying model changes and the like. In addition, board mounting efficiency can be improved, such as reducing the board mounting area and reducing the number of components.

  In this embodiment, since the conductive connection film 1 can be retrofitted to a wiring board or the like, it is easy to cope with function replacement, function selection, and the like.

  As described above, according to the present embodiment, the plurality of conductive connection members 31 and 32 can be connected to each other in a free shape and with a simple process, and are adapted to the positional deviation of the plurality of conductive connection members 31 and 32. The conductive connection film 1 in which the durability of the connection portion is good when mechanical stress is applied from the outside after the conductive connection with the plurality of conductive connection members 31 and 32, and the conductive connection structure 2 using the same And a conductive connection method can be provided.

  The conductive connection of this embodiment is, for example, a connection between the main board and the sub board, which are electronic components inside the mobile phone, a connection between the camera and the main board, which are electronic parts inside the mobile phone, or an electronic component inside the mobile phone. It can be applied to any conductive connection such as a connection between a microphone and a main board.

(Design changes)
The present invention is not limited to the above-described embodiment, and design changes can be made as appropriate without departing from the spirit of the present invention.

The planar shape of the curable resin film and the conductive pattern formed thereon can be appropriately designed.
A part such as an arbitrary semiconductor element may be mounted on the conductive connection film using solder or the like. The conductive pattern may be arranged at a plurality of locations for reasons such as prevention of disconnection or convenience of component mounting design.

Drawing 3A-Drawing 3C are top views showing the example of a design change of a conductive connection film.
The conductive connection film 3 shown in FIG. 3A has a plurality of wirings 22 </ b> W formed in a stripe pattern on the upper surface of the rectangular curable resin film 11 in a plan view and a circular conductive in a plan view formed at both ends of each of the wirings. It has a conductive pattern 22 composed of connection terminals 22T.
The conductive connection film 3 has conductive connection portions 22 </ b> C made of a group of a plurality of conductive connection terminals 22 </ b> T at both ends in the longitudinal direction of the curable resin film 11.

The conductive connection film 4 shown in FIG. 3B is formed on the upper surface of the curable resin film 12 that is substantially L-shaped in plan view (shown in a left-right inverted shape in FIG. 3B). Component mounting regions 41 and 42 are provided at two locations across the corner, and a first conductive pattern 23 formed of a plurality of wirings 23 </ b> W formed in a stripe pattern is formed adjacent to the component mounting region 41. Then, adjacent to the component mounting region 42, a second conductive pattern 24 composed of a plurality of wirings 24W formed in a stripe pattern is formed.
In this example, a portion excluding both end portions of the first conductive pattern 23 is a conductive connection portion 23C, and a portion excluding both end portions of the second conductive pattern 24 is a conductive connection portion 24C.

In the example shown in FIG. 3C, an opening 33H is opened in the conductive connection portion 33C of the conductive connection member, and a plurality of conductive connection terminals 33T of the conductive connection member are provided in two portions with the opening 33H interposed therebetween. Yes.
The curable resin film 13 of the conductive connection film 5 has a shape in which the opening 33H of the conductive connection portion 33C of the conductive connection member and the vicinity thereof are cut out in accordance with the design of the conductive connection member. And in the conductive connection film 5, the conductive pattern 25 which consists of several wiring 25W is provided in two places on both sides of this notch. Reference numeral 25 </ b> C is a conductive connection portion of the conductive connection film 5.

4A to 4D are plan views showing a planar shape and arrangement pattern examples of conductive connection terminals in the conductive connection film.
In the figure, reference symbols T1 to T6 indicate conductive connection terminals, and reference symbols C1 to C6 indicate conductive connection portions, respectively. Reference numeral H denotes an opening opened in the conductive connection member.
The planar shape of the conductive connection terminal is arbitrary such as a circle, an ellipse, a rectangle, an L shape, and a cross shape.
Arrangement | positioning of a some conductive connection terminal is arbitrary, such as circular arc shape, such as linear shape, L shape, and semicircle shape.
The plurality of conductive connection terminals may be arranged in a plurality of locations with an opening or a part opened in the conductive connection member interposed therebetween.

  In the above embodiment, the conductive connection between the conductive connection film 1 and the two conductive connection members 31 and 32 has been described as an example. However, the conductive connection film conductively connects three or more conductive connection members. It doesn't matter.

1, 3, 4 Conductive connection film 2 Conductive connection structures 11-13 Curable resin films 21-25 Conductive patterns 21W-25W Wiring 21T, 22T Conductive connection terminals 21C-25C Conductive connection portions 31, 32 Conductive connection members 31C-33C Conductive connection portions 31T to 33T Conductive connection terminals T1 to T6 Conductive connection terminals C1 to C6 Conductive connection portions

Claims (5)

A conductive connection structure in which a plurality of conductive connection members are connected via a conductive connection film,
As the conductive connection film, a conductive pattern having an uncured or semi-cured curable resin film and a conductive connection portion formed on at least one surface of the curable resin film and connected to the plurality of conductive connection members. The conductive pattern is cured and molded at the time of conductive connection, and the plurality of conductive connection members are conductively connected using at least the surface of the conductive connection portion exposed in the conductive pattern in the conductive pattern. Conductive connection structure.   The conductive connection film according to claim 1, wherein at least one of the plurality of conductive connection members is a wiring board. An uncured or semi-cured curable resin film, and a conductive pattern having a conductive connection portion formed on at least one surface of the curable resin film and connected to a plurality of conductive connection members. In step (X) of preparing a conductive connection film in which at least the surface on the connection side of the conductive connection part is exposed,
Connecting the conductive connection portions of the plurality of conductive connection members and the conductive connection film (Y);
And a step (Z) of curing and molding the conductive connection film. A conductive connection film for conductively connecting between a plurality of conductive connection members,
A curable resin film made of an uncured or semi-cured curable resin and formed on at least one surface of the curable resin film which can be cured and formed and connected to the plurality of conductive connection members And a conductive connection film in which at least the surface on the connection side of the conductive connection portion is exposed in the conductive pattern.   The conductive connection film according to claim 4, wherein the curable resin film is made of a thermosetting resin or a photocurable resin.

Images