JP2012109319A - Substrate holder, substrate bonding device, method of manufacturing stacked semiconductor device and stacked semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent failure of a substrate bonding device by managing the identification information of a substrate holder.SOLUTION: The substrate bonding device which bonds a plurality of substrates comprises a plurality of substrate holders which hold a plurality of substrates, respectively, and are assigned with unique identification information, a section which bonds the plurality of substrates held by the plurality of substrate holders, a recognition section which recognizes the identification information assigned to the plurality of substrate holders, and an output section which outputs the fact when the identification information recognized by the recognition section is duplicated.

Description

  The present invention relates to a substrate holder, a substrate bonding apparatus, a stacked semiconductor device manufacturing method, and a stacked semiconductor device.

In order to increase the mounting density of semiconductor devices, a stacked semiconductor device in which a plurality of substrates on which electronic circuits are formed is stacked has been attracting attention. In the process of laminating a plurality of substrates using an apparatus such as the wafer bonding apparatus disclosed in Patent Document 1, the substrates are often held by a substrate holder and conveyed.
Japanese Patent Application Laid-Open No. 2005-302858

  However, if the use and management of the substrate holder are not appropriate, the apparatus may be damaged or broken.

  In order to solve the above-mentioned problem, in the first aspect of the present invention, there is provided a substrate bonding apparatus for bonding a plurality of substrates, each of which holds a plurality of substrates and is assigned a plurality of unique identification information. Recognized by the recognition unit, a recognition unit for recognizing the identification information assigned to the plurality of substrate holders, a bonding unit for bonding the plurality of substrates held by the plurality of substrate holders When the identification information is duplicated, a substrate bonding apparatus is provided that includes an output unit that outputs the fact.

  In the second aspect of the present invention, a substrate bonding method for bonding a plurality of substrates, each of which holds a plurality of substrates and prepares a plurality of substrate holders to which unique identification information is assigned, A bonding step of bonding the plurality of substrates held by the plurality of substrate holders, a recognition step of recognizing the identification information assigned to the plurality of substrate holders, and identification information recognized in the recognition step There is provided a substrate bonding method including an output step of outputting the fact when overlapping.

  In a third aspect of the present invention, there is provided a laminated semiconductor device manufacturing method comprising a step of separating the plurality of substrates bonded together by the substrate bonding method.

  In a fourth aspect of the present invention, a stacked semiconductor device manufactured by the above-described stacked semiconductor device manufacturing method is provided.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a top view which shows typically the board | substrate bonding apparatus 100 which is one Embodiment. It is a perspective view which shows the structure of the holder storage part 128 roughly. It is a front view which shows the structure of the stage apparatus 140 roughly. It is the perspective view which looked at the lower board | substrate holder 125 from upper direction. It is the perspective view which looked at the lower board | substrate holder 125 from the downward direction. The cross section of the lower substrate holder 125 is shown schematically. It is the schematic explaining the process which reads information from the parameter | index of a substrate holder, and compares a result. It is a top view which shows the lower board | substrate holder 125 schematically. 3 is a flowchart of a manufacturing method for manufacturing a laminated semiconductor device. It is the schematic of the board | substrate bonding apparatus which is other embodiment.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view schematically showing a substrate bonding apparatus 100 according to an embodiment. The substrate bonding apparatus 100 stacks and bonds a plurality of substrates. The substrate bonding apparatus 100 includes a housing 102, a normal temperature unit 104, a high temperature unit 106, and substrate cassettes 112, 114, and 116. The normal temperature part 104 and the high temperature part 106 are provided in the common housing 102.

  The substrate cassettes 112, 114, and 116 are detachably attached to the housing 102 outside the housing 102. The substrate cassettes 112, 114, and 116 accommodate the first substrate 122 and the second substrate 123 that are bonded in the substrate bonding apparatus 100. A plurality of first substrates 122 and second substrates 123 are collectively loaded into the substrate bonding apparatus 100 by the substrate cassettes 112, 114, and 116. Further, the first substrate 122 and the second substrate 123 bonded in the substrate bonding apparatus 100 are collected in a lump.

  The room temperature unit 104 includes a pre-aligner 126, a stage device 140, a holder storage unit 128, a substrate removal unit 130, and a pair of robot arms 132 and 134, which are disposed inside the housing 102. The inside of the housing 102 is temperature-controlled so as to maintain substantially the same temperature as the room temperature of the environment where the substrate bonding apparatus 100 is installed. The room temperature unit 104 transports the first substrate 122 and the second substrate 123 in the atmosphere.

  Since the pre-aligner 126 is highly accurate, the positions of the first substrate 122 and the second substrate 123 are temporarily aligned so that the positions of the first substrate 122 and the second substrate 123 are within the narrow adjustment range of the stage device 140. To do. In this case, the pre-aligner 126 positions the first substrate 122 and the second substrate 123 by observing the outer shapes of the first substrate 122 and the second substrate 123. Thereby, the stage apparatus 140 can position the position of the 1st board | substrate 122 and the 2nd board | substrate 123 reliably.

  The holder storage unit 128 stores a plurality of upper substrate holders 124 and a plurality of lower substrate holders 125 for standby. The holder storage 128 is provided with a barcode reader 129 that reads and recognizes barcodes attached to the upper substrate holder 124 and the lower substrate holder 125.

  In the substrate bonding apparatus 100, the upper substrate holder 124 and the lower substrate holder 125 respectively hold the first substrate 122 and the second substrate 123 by electrostatic adsorption and transport them. Each of the upper substrate holder 124 and the lower substrate holder 125 is assigned a barcode. In the barcode, an ID uniquely assigned to each substrate holder is recorded and can be read by an external barcode reader. The ID uniquely assigned to each substrate holder is an example of identification information.

  The stage device 140 aligns the positions of the electrodes to be bonded on the first substrate 122 and the second substrate 123 to be bonded and superimposes them. A heat insulating wall 145 and a shutter 146 are provided surrounding the stage device 140. The space surrounded by the heat insulating wall 145 and the shutter 146 is communicated with an air conditioner or the like, and the temperature is controlled, so that the alignment accuracy in the stage device 140 is maintained. The stage device 140 is an example of a bonding unit.

  The stage device 140 includes an upper stage 141, a lower stage 142, and a control unit 148. The upper stage 141 is fixed to the lower surface of the top plate of the stage device 140. The lower surface of the upper stage 141 holds the upper substrate holder 124 by vacuum suction.

  The lower stage 142 is disposed on the bottom plate of the stage device 140 so as to be movable in the XYZ direction so as to face the upper stage 141. The lower stage 142 has a tilt function. The upper surface of the lower stage 142 holds the lower substrate holder 125 by vacuum suction.

  The control unit 148 controls the movement of the lower stage 142. The control unit 148 moves the lower stage 142 to align the position of the second substrate 123 with respect to the first substrate 122 held on the upper stage 141. The control unit 148 can raise the lower stage 142 and overlap the first substrate 122 and the second substrate 123. Thereafter, the first substrate 122 and the second substrate 123 sandwiched between the upper substrate holder 124 and the lower substrate holder 125 are temporarily fixed by a positioning mechanism. A combination of the upper substrate holder 124 and the lower substrate holder 125 and the first substrate 122 and the second substrate 123 sandwiched between them may be referred to as a “holder pair”.

  The substrate removing unit 130 takes out the first substrate 122 and the second substrate 123 that are sandwiched and bonded between the upper substrate holder 124 and the lower substrate holder 125 that are carried out from the high temperature unit 106. The bonded first substrate 122 and second substrate 123 may be referred to as a “laminated substrate”. The laminated substrate taken out from the upper substrate holder 124 and the lower substrate holder 125 is returned to and stored in one of the substrate cassettes 112, 114, 116 by the robot arms 134, 132 and the lower stage 142. The upper substrate holder 124 and the lower substrate holder 125, from which the laminated substrate has been taken out, are returned to the holder storage unit 128 and stand by. The substrate removal unit 130 is disposed below the holder storage unit 128. The substrate removing unit 130 is an example of a bonding unit.

  The first substrate 122 and the second substrate 123 to be loaded into the substrate bonding apparatus 100 are a single silicon wafer, compound semiconductor wafer, glass substrate, etc., in which elements, circuits, terminals, etc. are formed. It may be. Further, the loaded first substrate 122 and second substrate 123 may be laminated substrates that are already formed by laminating a plurality of wafers.

  Of the pair of robot arms 132, 134, the robot arm 132 disposed on the side closer to the substrate cassettes 112, 114, 116 is the first substrate 122 between the substrate cassettes 112, 114, 116, the pre-aligner 126 and the stage apparatus 140. The second substrate 123 is transported. On the other hand, the robot arm 134 disposed on the side far from the substrate cassettes 112, 114, 116 is between the stage device 140, the holder storage unit 128, the substrate removal unit 130, and the air lock 220, and includes the first substrate 122, the second substrate. 123, the upper substrate holder 124 and the lower substrate holder 125 are conveyed.

  When holding the first substrate 122 on the upper stage 141, the robot arm 134 first takes out one sheet of the upper substrate holder 124 from the holder storage portion 128 and places it on the lower stage 142. The lower stage 142 moves to the side closer to the substrate cassettes 112, 114, and 116. The robot arm 132 takes out the pre-aligned first substrate 122 from the pre-aligner 126, and places the first substrate 122 on the upper substrate holder 124 on the lower stage 142 for electrostatic adsorption.

  The lower stage 142 moves again to the far side from the substrate cassettes 112, 114, and 116. The robot arm 134 receives the upper substrate holder 124 that electrostatically attracts the first substrate 122 from the lower stage 142, turns it over, and approaches the upper stage 141. The upper stage 141 holds the upper substrate holder 124 by vacuum suction.

  The robot arm 134 places the lower substrate holder 125 on the lower stage 142. The robot arm 132 places and holds the second substrate 123 thereon. As a result, the surface of the second substrate 123 held on the lower stage 142 on which the circuits and the like are formed is arranged so as to face the surface of the first substrate 122 held on the upper stage 141 and formed with the circuits. Is done.

  The high temperature unit 106 includes a heat insulating wall 108, an air lock 220, a robot arm 230, a plurality of pressure chambers 240, and a cooling chamber 250. The heat insulating wall 108 surrounds the high temperature part 106 and blocks heat radiation to the outside of the high temperature part 106. Thereby, the influence which the heat of the high temperature part 106 has on the normal temperature part 104 is suppressed. The inside of the high temperature part 106 is maintained in a constant vacuum state. Thereby, contamination and oxidation of the substrate carried into the high temperature part 106 can be suppressed.

  The robot arm 230 conveys the first substrate 122, the second substrate 123, the upper substrate holder 124 and the lower substrate holder 125 between the pressurizing chamber 240, the cooling chamber 250 and the air lock 220. The pressurizing chamber 240, the cooling chamber 250, and the air lock 220 are examples of a bonding unit, respectively.

  The air lock 220 connects the normal temperature part 104 and the high temperature part 106. The air lock 220 includes shutters 222 and 224 that open and close alternately on the normal temperature part 104 side and the high temperature part 106 side.

  When a holder pair including the first substrate 122, the second substrate 123, the upper substrate holder 124, and the lower substrate holder 125 is carried into the high temperature unit 106 from the normal temperature unit 104, first, the shutter 222 on the normal temperature unit 104 side is opened. Then, the robot arm 134 carries the holder pair into the air lock 220. Next, the shutter 222 on the room temperature section 104 side is closed, and the inside of the air lock 220 is evacuated. When the degree of vacuum inside the air lock 220 becomes the degree of vacuum on the high temperature part 106 side, the shutter 224 on the high temperature part 106 side is opened.

  Subsequently, the robot arm 230 unloads the holder pair from the air lock 220 and inserts it into one of the pressurizing chambers 240. The pressurizing chamber 240 heats and pressurizes the holder pair to bond the first substrate 122 and the second substrate 123 together. Thereafter, the robot arm 230 unloads the holder pair from the pressurizing chamber 240 and inserts it into the cooling chamber 250 to cool it. The pressurizing chamber 240 may bond the first substrate 122 and the second substrate 123 only by pressurizing the holder pair. A laminating unit for laminating a plurality of substrates held by a plurality of substrate holders is configured by a laminating unit such as the stage device 140, the air lock 220, the pressurizing chamber 240, the cooling chamber 250, and the substrate removing unit 130.

  When carrying out a holder pair from the high temperature part 106 to the normal temperature part 104, a series of operation | movement in the case of carrying in from the normal temperature part 104 to the high temperature part 106 is performed in reverse order. By a series of these operations, the holder pair can be carried into or out of the high temperature unit 106 without leaking the internal atmosphere of the high temperature unit 106 to the normal temperature unit 104 side.

  In many areas in the substrate bonding apparatus 100, the robot arms 134 and 230 and the lower arm are held with the upper substrate holder 124 holding the first substrate 122 or with the lower substrate holder 125 holding the second substrate 123. It is conveyed by the stage 142. When the upper substrate holder 124 that holds the first substrate 122 or the lower substrate holder 125 that holds the second substrate 123 is transported, the robot arms 134 and 230 are arranged such that the upper substrate holder 124 or the lower substrate by vacuum adsorption or electrostatic adsorption. The holder 125 is sucked and held.

  FIG. 2 is a perspective view schematically showing the structure of the holder storage portion 128. The holder storage unit 128 is a vertical shelf and is divided into an upper rack 262 and a lower rack 264 in the vertical direction. The upper rack 262 includes a plurality of stages for storing the upper substrate holder 124, and the lower rack 264 includes a plurality of stages for storing 125. One upper substrate holder 124 or one lower substrate holder 125 can be stored in each stage. The upper substrate holder 124 or the lower substrate holder 125 is taken in and out of each stage of the holder storage unit 128 by the robot arm 134.

  The holder storage unit 128 is provided with a bar code reader 129. The bar code reader 129 is attached to the ball screw 274 by an attachment 272 and can be moved up and down by the ball screw 274 by driving of the motor 153. The barcode reader 129 moves to the position of each stage of the holder storage unit 128, reads the barcode attached to the upper substrate holder 124 or the lower substrate holder 125 stored in that stage, and is assigned to each substrate holder. ID can be recognized. The barcode reader 129 is an example of a recognition unit.

  The bar code reader 129 transmits the ID read from the upper substrate holder 124 or the lower substrate holder 125 to the control unit 148. When the ID read by the barcode reader 129 is duplicated, the control unit 148 outputs that effect. The control unit 148 is an example of an output unit. As the output, a sound alarm such as a buzzer is sounded. The output may be output as a message to the control monitor. The output may be to stop part or all of the substrate bonding apparatus 100 under the control of the control unit 148.

  The barcode reader 129 reads the ID of the upper substrate holder 124 or the lower substrate holder 125 when the upper substrate holder 124 or the lower substrate holder 125 is carried into and out of the bonding unit. When the barcode reader 129 reads that the substrate holder corresponding to the same ID has been loaded after the substrate holder corresponding to the specific ID has been loaded and before the control unit 148 has been loaded. Then, it is determined that the IDs are duplicated and a message to that effect is output.

  For example, when the robot arm 134 takes out the upper substrate holder 124 whose ID is “0012” from the holder storage unit 128 and places it on the stage device 140, the barcode reader 129 may The ID of the upper substrate holder 124 is read and transmitted to the control unit 148. Accordingly, the control unit 148 stores that the “0012” -numbered upper substrate holder 124 is carried into the bonding unit, and starts tracking the flow with respect to the “0012” -numbered substrate holder 124. The upper substrate holder 124 of “0012” and the lower substrate holder 125 to be subsequently introduced form a holder pair with the first substrate 122 and the second substrate 123 sandwiched in the stage device 140, and the pressurizing chamber 240 and The laminated substrates are bonded together in the cooling chamber 250, disassembled from the holder pair by the substrate removing unit 130, and returned to the holder storage unit 128 by the robot arm 134. As described above, when the upper substrate holder 124 of “0012” is unloaded from the bonding unit and returned to the holder storage unit 128, the barcode reader 129 reads the ID again and transmits it to the control unit 148. Therefore, the control unit 148 stores that the upper substrate holder 124 of “0012” has returned to the holder storage unit 128 and ends the tracking for the upper substrate holder 124. Before the “0012” numbered upper substrate holder 124 is used for the bonding section and is still unloaded and returned to the holder storage unit 128, the same “0012” numbered from other substrate holders into which the barcode reader 129 is loaded. When the ID is read, the control unit 148 determines that the ID is duplicated and issues an alarm as an output.

  The bar code reader 129 is in a state in which the plurality of upper substrate holders 124 and the lower substrate holders 125 are stored in the holder storage unit 128 before the plurality of upper substrate holders 124 and the lower substrate holders 125 are loaded into the bonding unit. Each ID of the substrate holder 125 may be read. The control unit 148 confirms the read information transmitted from the barcode reader 129, and issues an alarm as an output when the same ID is detected from a plurality of substrate holders.

  As described above, when the IDs of the substrate holders overlap, the control unit 148 may stop the operation of the bonding unit as an output instead of an alarm. When the IDs of the substrate holders overlap, the control unit 148 stops the operation of the bonding unit that processes the substrate holder corresponding to the duplicated ID among the bonding units, and operates the other bonding units. May be continued. For example, although the “0012” numbered upper substrate holder 124 is used for the alignment of the substrate in the stage device 140, the bar code reader 129 newly attempts to carry in from the holder storage unit 128. If the ID of “0012” is also detected from 125, the control unit 148 stops only the stage device 140 that processes the upper substrate holder 124 with the duplicated “0012” ID, and pressurizes the pressure chamber 240, etc. The operation of another bonding unit may be continued. Thereafter, the control unit 148 may control the stage device 140 to collect the upper substrate holder 124 of “0012” number, observe an index provided on the upper substrate holder 124 by a method described later, and It may be determined whether or not the upper substrate holder 124 is a regular substrate holder corresponding to the “0012” number ID.

  FIG. 3 schematically shows the structure of the stage apparatus 140. The stage device 140 includes an upper stage 141, a lower stage 142, a control unit 148, a first microscope 344, a second microscope 342, a barcode reader 372, and a comparison unit 380 disposed inside the main body 310. With.

  The main body 310 includes a top plate 312 and a bottom plate 316 that are parallel to each other and a plurality of support columns 314 that couple the top plate 312 and the bottom plate 316. The top plate 312, the support column 314, and the bottom plate 316 are each formed of a highly rigid material and do not deform even when a reaction force relating to the operation of the internal mechanism is applied. When incorporated in the substrate bonding apparatus 100, the space between the columns 314 is sealed with a heat insulating wall 145.

  The lower stage 142 is placed on the bottom plate 316 and moved in the X direction while being guided by guide rails 352 fixed to the bottom plate 316, and moved in the Y direction on the X stage 354. A Y stage 356 and an elevating part 360 placed on the Y stage 356 are included. Under the control of the control unit 148, the member mounted on the lower stage 142 can move in any direction on the XY plane.

  The elevating unit 360 includes a cylinder 362, a piston 364, and a suction plate 368. The piston 364 moves up and down in the Z direction in the cylinder 362 under the control of the control unit 148. A suction plate 368 is provided on the piston 364, and the lower substrate holder 125 is held. Further, the second substrate 123 is held on the lower substrate holder 125.

  As a driving form of the elevating unit 360, driving by a VCM (voice coil motor) may be used. The lower stage 142 may have a coarse / fine movement separation drive mechanism. The lower stage 142 has a function of rotating about the X, Y, and Z axes.

  The first microscope 344 is disposed on the lower stage 142 and can move with respect to the upper stage 141 together with the lower stage 142. The first microscope 344 has an autofocus sensor. The first microscope 344 observes the index M provided on the upper substrate holder 124 held by the upper stage 141 or the index provided on the surface of the first substrate 122 held by the upper substrate holder 124, and Measure position, distance, shape, etc. Data such as position, distance, and shape measured by the first microscope 344 is transmitted to the control unit 148 or the comparison unit 380.

  The second microscope 342 is fixed to the lower surface of the top plate 312 with a known interval with respect to the upper stage 141. The second microscope 342 has an autofocus sensor. The second microscope 342 observes the index M provided on the lower substrate holder 125 held by the lower stage 142 or the index provided on the surface of the second substrate 123 held by the lower substrate holder 125, Measure position, distance, shape, etc.

  Data such as position, distance, and shape measured by the second microscope 342 is transmitted to the control unit 148 or the comparison unit 380. The control unit 148 controls the lower stage 142 based on the received data.

  Since the control unit 148 stores the positions of the first microscope 344 and the second microscope 342 in the upper stage 141 and the lower stage 142, the control unit 148 determines the upper part based on the data transmitted by the first microscope 344 and the second microscope 342. The relative position between the first substrate 122 held on the upper stage 141 via the substrate holder 124 and the second substrate 123 held on the lower stage 142 via the lower substrate holder 125 can be calculated. Based on the calculated result, the control unit 148 can precisely control the lower stage 142 to align the first substrate 122 and the second substrate 123 so as to overlap each other.

  When the upper substrate holder 124 is placed on the lower stage 142, the barcode reader 372 reads a barcode provided on the upper substrate holder 124, and displays the index M in the upper substrate holder 124 stored in the barcode. Information on the observation method to be observed and information on the result to be obtained by the observation method are read out. Information read by the barcode reader 372 is transmitted to the control unit 148 and the comparison unit 380. After the upper substrate holder 124 is held on the upper stage 141, the control unit 148 controls the first microscope 344 based on the information, and observes the index M on the upper substrate holder 124 by the observation method. The barcode reader 372 is an example of a recognition unit.

  The barcode reader 372 reads the barcode 370 provided on the lower substrate holder 125 and obtains information on the observation method for observing the index M in the lower substrate holder 125 stored in the barcode 370 and the observation method. Read power result information. Information read by the barcode reader 372 is transmitted to the control unit 148 and the comparison unit 380. The control unit 148 controls the second microscope 342 based on the information, and observes the index M on the lower substrate holder 125 by the observation method.

  The comparison unit 380 includes information on a result to be obtained by an observation method of observing the index M in the lower substrate holder 125 or the upper substrate holder 124 read by the barcode reader 372, and the second microscope 342 or the first microscope 344. The actual observation result is compared, and the comparison result is output to the control unit 148. When the information of the observation result to be obtained read by the barcode reader 372 does not match the actual observation result of the second microscope 342 or the first microscope 344, or the difference exceeds a predetermined threshold value In this case, the control unit 148 issues an alarm or stops the stage device 140. The comparison unit 380 may be provided inside the control unit 148.

  FIG. 4 is a perspective view of the lower substrate holder 125 as viewed from above. FIG. 5 is a perspective view of the same lower substrate holder 125 as viewed from below. FIG. 6 schematically shows a cross section of the lower substrate holder 125.

  The lower substrate holder 125 includes a main body 422, a barcode 370, an adsorber 424, a groove 426, a notch 428, an electrode 440, and a mark 450. The outer shape of the lower substrate holder 125 has a disk shape whose diameter is slightly larger than that of the second substrate 123.

  The main body 422 may be formed of ceramics or the like. The main body 422 has a substrate holding surface that holds the second substrate 123. The substrate holding surface has high flatness and electrostatically attracts the second substrate 123. FIG. 4 shows the lower substrate holder 125 with the second substrate 123 held on the substrate holding surface. The mark 450 is provided on the upper surface of the main body 422 and on the outer periphery of the substrate holding surface.

  The barcode 370 stores an ID assigned to the lower substrate holder 125, information on an observation method for observing the index M of the lower substrate holder 125, and information on a result to be obtained by the observation method. Information stored in the barcode 370 can be read by the barcode reader 372. In the present embodiment, the barcode 370 is formed on the side surface of the lower substrate holder 125, but may be formed on the upper surface of the lower substrate holder 125 having a substrate holding surface.

  The adsorbers 424 are made of a magnetic material, and a plurality of the adsorbers 424 are arranged outside the held second substrate 123 on the surface holding the second substrate 123. The adsorber 424 may be disposed in a depressed region formed in the main body 422 so that the upper surface of the adsorber 424 is located in a plane that is substantially the same as the plane that holds the second substrate 123.

  In the substrate bonding apparatus 100 of FIG. 1, in the stage device 140, the upper substrate holder 124 holding the first substrate 122 and the lower substrate holder 125 holding the second substrate 123 are aligned and brought into contact with each other. Then, the first substrate 122 and the second substrate 123 brought into contact with each other in the pressurizing chamber 240 are bonded. For this reason, it is required to maintain the relative positions of the first substrate 122 and the second substrate 123 that are not bonded while being transferred from the stage device 140 to the pressurizing chamber 240. In response to such a demand, the first substrate 122 and the second substrate 123 are attached to the lower substrate holder 125 and the upper substrate holder by adsorbing the attractor 424 of the lower substrate holder 125 to a permanent magnet provided on the upper substrate holder 124. The relative position can be maintained by being sandwiched from 124.

  The electrode 440 electrostatically attracts the second substrate 123 to the substrate holding surface of the main body 422. The electrode 440 is provided inside the main body 422. The electrode 440 includes a back surface side terminal 432 and a back surface side terminal 434.

  FIG. 6 is a drawing showing the connection relationship between the electrode 440 and each terminal, and is not a drawing that limits the positional relationship between the terminals. FIG. 6 shows a bipolar electrode 440. That is, the electrode 440 is composed of two parts, and is connected to a positive power source and a negative power source, respectively, and generates a potential difference between the lower substrate holder 125 and the second substrate 123, so that the second substrate 123 becomes the lower substrate holder. Adsorb to 125. Further, the electrostatic adsorption may be a monopolar method.

  The back surface side terminal 432 and the back surface side terminal 434 are exposed on the back surface of the surface on the side where the second substrate 123 is placed in the main body 422. The back-side terminal 432 is connected to the power supply unit of the lower stage 142 and supplies power from the lower stage 142 to the electrode 440. When the lower substrate holder 125 is transported by the transport robot arm, the back surface side terminal 434 is connected to the power supply unit of the robot arm and supplies power from the robot arm to the electrode 440.

  The groove 426 is provided for the purpose of avoiding a power supply unit that supplies power to the upper substrate holder 124 in the robot arm 134 and the robot arm 230. The notch 428 is provided for the purpose of avoiding a power supply unit that supplies power from the lower stage 142 to the upper substrate holder 124 when the lower substrate holder 125 is installed on the lower stage 142.

  FIG. 7 is a schematic diagram illustrating a process of reading information from the index of the substrate holder and comparing the results. The lower substrate holder 125 is placed on the lower stage 142. The lower stage 142 moves the lower substrate holder 125 to a position where the barcode reader 372 can read the barcode 370 provided on the lower substrate holder 125.

  The barcode reader 372 reads the barcode 370, reads the observation method information a for observing the index M in the lower substrate holder 125 stored in the barcode 370, and transmits it to the control unit 148. The control unit 148 outputs a control signal b to the second microscope 342 based on the information a, and observes the index M on the lower substrate holder 125 by the observation method.

  The barcode reader 372 further reads out information c on the result to be obtained by the observation method from the barcode 370 and transmits it to the comparison unit 380. On the other hand, the second microscope 342 observes the index M based on the control signal b from the control unit 148 and transmits the observation result d to the comparison unit 380.

  The comparison unit 380 compares the actual observation result d of the second microscope 342 with the result c to be obtained by the observation method of observing the index M in the lower substrate holder 125 read by the barcode reader 372, The comparison result (cd) is output to the control unit 148. When the information c of the observation result to be obtained read by the barcode reader 372 and the actual observation result d of the second microscope 342 do not match, the control unit 148 sets a threshold value for which the difference is determined in advance. When it exceeds, the lower substrate holder 125 is excluded.

  FIG. 8 is a plan view schematically showing the lower substrate holder 125. FIG. 8 shows an example where the index M is the external shape of the main body 422. For example, the index M may be a notch 428, a groove 426, or a mark 450. As an observation method, for example, the shape dimension or position of the notch 428, the groove 426, or the mark 450 may be observed by the second microscope 342. The distance L between the two notches 428 may be observed with the second microscope 342, and the thickness of the main body 422 may be observed. The cutout 428, the groove 426, and the mark 450 may have different design values for each substrate holder. However, a tolerance for the same design value may be measured in advance, and the tolerance may be observed.

  In the barcode 370, information on an observation method for observing the index M of the lower substrate holder 125 and information on a result to be obtained by the observation method are stored in association with the ID of the lower substrate holder 125. As a specific example, in the barcode 370, information on an observation method for observing the interval L between the two notches 428 with the second microscope 342 and the value of L to be obtained by the observation are the ID of the lower substrate holder 125. Are stored in association with each other.

  When the barcode reader 129 reads overlapping IDs from the plurality of lower substrate holders 125, the lower substrate holder 125 having the IDs is placed on the lower stage 142, and the barcode reader 372 reads and reads the barcode 370. Based on the observation method described above, that is, the observation method of observing the interval L between the two notches 428 with the second microscope 342, the interval L is observed with the second microscope 342. When the observed L value does not coincide with the L value to be obtained by the observation read from the barcode 370, the control unit 148 indicates that the lower substrate holder 125 is not scheduled to be used in the substrate bonding apparatus 100. It is determined that the substrate is a substrate holder, and the robot arm 134 and the like are controlled to exclude the lower substrate holder 125 from the substrate bonding apparatus 100. If the barcode reader 129 does not find a duplicate ID, the above determination need not be made.

  In the above-described embodiment, the barcode is exemplified as the information storage unit that stores identification information such as an ID, information on an observation method for observing an index, and information on a result to be obtained by the observation method. The part may be a QR code or the like. The information storage unit may be a memory or the like that can store identification information, information on an observation method, information on a result to be obtained by the observation method, and the like. In that case, instead of the barcode reader 129 and the barcode reader 372, the reading unit may be a memory reading device capable of reading such a memory.

  In the above-described embodiment, the shape and the like of the lower substrate holder 125 are exemplified as the index to be observed, but the index may be a physical quantity of the main body 422. For example, it may be an electrical or magnetic parameter such as impedance or electrical resistance of the main body 422. The parameter measurement method and the measurement result to be obtained by the method may be stored in the information storage unit.

  The indicator may be an electrical characteristic of the electrode 440. For example, the electrode 440 may have an inherent impedance, or may be a leakage current between the two electrodes 440. The measurement may be performed by the back side terminal 432 or the back side terminal 434. The indicator may be a position where the plate of the barcode 370 is attached. The indicator may be a magnetic force of a magnet provided on the upper substrate holder 124.

  Since the measurement method of these indexes and the measurement result to be obtained by the method are stored in the information storage unit provided in the lower substrate holder 125, the information stored in any apparatus using the lower substrate holder 125 is stored. , And the lower substrate holder 125 is inspected by measuring the index by the measurement method to determine whether the substrate holder is scheduled to be used. When a new substrate holder is inserted, it is possible to know whether the substrate holder is to be used or not from the information of the substrate holder itself without updating the list of substrate holders to be used. For example, in the above-described embodiment, an example in which the index is observed using the first microscope 344 and the second microscope 342 provided in the stage device 140 has been described. However, the holder storage unit 128, the air lock 220, the pressurizing chamber A reading unit that reads information stored in the information storage unit of the lower substrate holder 125, an index observation unit that observes an index, and a comparison unit may be provided in the cooling chamber 250 or the cooling chamber 250 to observe the index of the lower substrate holder 125. . Needless to say, the upper substrate holder 124 may be provided with an index and information storage unit, and the index of the upper substrate holder 124 may be observed by the method described above.

  FIG. 9 shows an outline of a manufacturing method for manufacturing a stacked semiconductor device. In step S010 of preparing a substrate holder, a plurality of upper substrate holders 124 and lower substrate holders 125 to which identification information such as uniquely assigned IDs are readable from the outside are prepared. In step S020 of reading identification information such as ID of the substrate holder, the barcode reader 129 reads identification information such as ID assigned to the plurality of upper substrate holders 124 and lower substrate holders 125. In step S030 for determining whether there is duplication of identification information such as ID, it is determined whether there is duplication in identification information such as ID read in step S020. If there is no duplication in identification information such as ID, the process proceeds to step S040 where the substrates are bonded, and the first substrate 122 and the second substrate held by the upper substrate holder 124 and the lower substrate holder 125 by the bonding unit of the substrate bonding apparatus 100. The substrate 123 is attached. In the step S050 of separating the laminated substrates, the bonded laminated substrates are separated into pieces by dicing or the like, thereby completing the production of the laminated semiconductor device.

  However, if identification information such as IDs read by the barcode reader 129 is duplicated, the process proceeds to step S042 where an alarm is output, and the controller 148 outputs an alarm. Note that all or part of the substrate bonding apparatus 100 may be stopped instead of the alarm. For example, only the bonding unit such as the stage apparatus 140 in which the substrate holder having overlapping identification information such as ID is processed may be stopped. In addition, from the above-described method for manufacturing a laminated semiconductor device, a substrate bonding method for forming a laminated substrate by bonding a plurality of substrates can also be grasped.

  In the substrate bonding apparatus 100, the type of the upper substrate holder 124 and the lower substrate holder 125, the maintenance time of the upper substrate holder 124 and the lower substrate holder 125, and the like are determined according to identification information such as ID attached to each substrate holder. It manages each with respect to a substrate holder. Therefore, if the same identification information such as ID is attached to a plurality of substrate holders for some reason, the management system may be disturbed, causing damage and failure to the substrate bonding apparatus 100.

  For example, although the ID “0012” is registered as the ID of the upper substrate holder 124 in the control unit 148, the same “0012” is used in addition to the upper substrate holder 124 to which the ID “0012” is correctly assigned. In the case where there is a lower substrate holder 125 to which the “#” ID is wrongly attached, a bonding unit such as the stage device 140 processes the lower substrate holder 125 as the upper substrate holder 124. When the structures of the upper substrate holder 124 and the lower substrate holder 125 are greatly different, there is a possibility that the bonding unit that handles the lower substrate holder 125 as the upper substrate holder 124 may be broken or damaged. In addition, when the maintenance time of the upper substrate holder 124 and the lower substrate holder 125 is managed by the number of times of use, if there is a plurality of “0012” IDs, the “0012” number The number of times the upper substrate holder 124 is used cannot be counted and cannot be managed.

  Preventing the use of the upper substrate holder 124 and the lower substrate holder 125 with identification information such as overlapping IDs by the substrate bonding apparatus, the substrate bonding method, and the manufacturing method of the laminated semiconductor device of the above-described embodiment. The upper substrate holder 124 or the lower substrate holder 125 to which identification information such as ID is erroneously attached can be detected and eliminated, so that the failure of the substrate bonding apparatus 100 due to duplication of identification information such as ID Can be prevented.

  FIG. 10 is a schematic view of a substrate bonding apparatus according to another embodiment. In this embodiment, a plurality of substrate bonding apparatuses 100 that operate independently of each other are connected to the central control unit 520 through the network 500. Each substrate bonding apparatus 100 includes a barcode reader 129, a control unit 148, and a bonding unit as described above. The network 500 may be any network such as the Internet, an intranet, etc., capable of bidirectional information communication by exchanging information between the central control unit 520 connected thereto and each substrate bonding apparatus 100.

  The barcode reader 129 of each substrate bonding apparatus 100 reads identification information such as IDs of the upper substrate holder 124 and the lower substrate holder 125 used in the substrate bonding apparatus 100 and transmits them to the central control unit 520 through the network 500. . The central control unit 520 determines whether there is any duplication with respect to identification information such as IDs transmitted from all bar code readers 129. When the central control unit 520 finds identification information such as duplicate IDs, the central control unit 520 controls the control units 148 of all the substrate bonding apparatuses 100 that process the upper substrate holder 124 or the lower substrate holder 125 having the ID identification information. The fact is output. The central control unit 520 is an example of an output unit.

  Upon receiving the output from the central control unit 520, the control unit 148 stops the bonding unit for processing the above-mentioned alarm or the substrate bonding apparatus 100 as a whole or the substrate holder having identification information such as duplicate ID. , Device failure can be prevented. Further, the substrate bonding apparatus 100 controls the control unit 148 to measure the index of the substrate holder having the identification information such as the duplicate ID as described above, so that the substrate holder attaches the identification information such as the ID. It can be determined whether it is a legitimate substrate holder, and it can be eliminated or put on hold.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 100 Substrate bonding apparatus, 102 Case, 104 Normal temperature part, 106 High temperature part, 108 Heat insulation wall, 112 Substrate cassette, 114 Substrate cassette, 116 Substrate cassette, 122 First substrate, 123 Second substrate, 124 Upper substrate holder, 125 Lower substrate holder, 126 Pre-aligner, 128 Holder storage unit, 129 Bar code reader, 130 Substrate removal unit, 132 Robot arm, 134 Robot arm, 140 Stage device, 141 Upper stage, 142 Lower stage, 145 Heat insulation wall, 146 Shutter, 148 Control unit, 153 motor, 220 air lock, 222 shutter, 224 shutter, 230 robot arm, 240 pressurizing chamber, 250 cooling chamber, 262 upper rack, 264 lower rack, 272 attachment, 274 baud Screw, 310 main body, 312 top plate, 314 support, 316 bottom plate, 342 second microscope, 344 first microscope, 352 guide rail, 354 X stage, 356 Y stage, 360 lifting part, 362 cylinder, 364 piston, 368 suction plate 370 Bar code, 372 Bar code reader, 380 Comparison unit, 422 Main body, 424 Adsorber, 426 Groove, 428 Notch, 432 Back side terminal, 434 Back side terminal, 440 Electrode, 450 mark, 500 network, 520 Center Control unit

Claims (9)

A substrate bonding apparatus for bonding a plurality of substrates,
A plurality of substrate holders each holding a plurality of substrates and assigned unique identification information;
A bonding unit for bonding the plurality of substrates held by the plurality of substrate holders;
A recognition unit for recognizing the identification information assigned to the plurality of substrate holders;
When the identification information recognized by the said recognition part overlaps, a board | substrate bonding apparatus provided with the output part which outputs that. The recognizing unit recognizes the identification information when each of the plurality of substrate holders is carried into the bonding unit and when it is unloaded from the bonding unit,
The output unit is configured so that the substrate holder corresponding to the same identification information as the specific identification information is loaded after the substrate holder corresponding to the specific identification information is loaded and before the loading. The substrate bonding apparatus according to claim 1, wherein when the recognition unit recognizes the identification information, it is determined that the identification information is duplicated and the fact is output. A holder storage section for storing the plurality of substrate holders;
The recognition unit recognizes the identification information of the plurality of substrate holders, respectively, before the plurality of substrate holders are carried into the bonding unit and stored in the holder storage unit. The board | substrate bonding apparatus of description.   The said output part is a board | substrate bonding apparatus of any one of Claim 1 to 3 which stops operation | movement of the said bonding part, when the said identification information overlaps. The laminating portion includes a plurality of laminating units,
When the identification information is duplicated, the output unit stops the operation of the bonding unit that is processing the substrate holder corresponding to the duplicated identification information among the plurality of bonding units, and performs another bonding operation. The substrate bonding apparatus according to claim 1, wherein the operation of the alignment unit is continued. With a plurality of the bonding portions that operate independently of each other,
Corresponding to the plurality of pasting parts, a plurality of the recognition parts,
6. The substrate bonding apparatus according to claim 1, wherein the output unit determines whether or not there is an overlap with the identification information recognized by the plurality of recognition units. A substrate laminating method for laminating a plurality of substrates,
Preparing a plurality of substrate holders each holding a plurality of substrates and assigned unique identification information;
A bonding step of bonding the plurality of substrates held by the plurality of substrate holders;
Recognizing the identification information assigned to the plurality of substrate holders;
A substrate bonding method comprising: an output step of outputting the fact when the identification information recognized in the recognition step overlaps.   A method for manufacturing a laminated semiconductor device, comprising the step of separating the plurality of substrates bonded together by the substrate bonding method according to claim 7.   A stacked semiconductor device manufactured by the method for manufacturing a stacked semiconductor device according to claim 8.

Images