JP2012109303A - Electric circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric circuit device in which the constraints on the shape of a connection member being bonded to a connection terminal or a support that supports the connection member can be reduced while ensuring the bonding reliability of the connection terminal and the connection member.SOLUTION: A connection terminal 20 includes a first bonding part 21 being bonded to circuit elements 2, 3 or a substrate 10, a second bonding part 22 provided while spaced apart from the first bonding part 21 in the height direction H perpendicular to an element arrangement surface 11 and being bonded to a conductive connection member 41, a coupling part 23 which couples the first bonding part 21 and one end of the second bonding part 22 in a predetermined reference direction S along the element arrangement surface 11, and an extension 24 provided to extend from the other end of the second bonding part 22 in the reference direction S toward the element arrangement surface 11 side. A surface of an insulating resin 5 is located between the end of the extension 24 on the element arrangement surface 11 side and the second bonding part 22.

Description

  The present invention relates to an electric circuit device comprising: a substrate on which circuit elements are arranged on an element arrangement surface; conductive connection terminals arranged on the element arrangement surface; and an insulating resin provided so as to cover the element arrangement surface. About.

  As a conventional technique related to the above electric circuit device, for example, there is a technique described in Patent Document 1 below. Hereinafter, in the description of the background art, reference numerals of Patent Document 1 are cited. In FIG. 6 of Patent Document 1, a semiconductor provided with an insulating resin (resin 17a) so that the upper surface (upper surface portion P) of the connection terminal (connection conductor 15) joined to the connection member (external terminal 11) is exposed. A device (an example of an electric circuit device) is shown. In this semiconductor device, the circuit elements (semiconductor chip 8) and wires (bonding wires 9) are buried in an insulating resin, which causes the electrical characteristics of the semiconductor device to deteriorate due to sputtering that occurs during joining by laser welding. It is described as being suppressed.

  In the configuration shown in FIG. 6 of Patent Document 1, the connection terminals are separated from each other in the height direction from the first joint portion that is joined to the circuit patterns 5 and 6 formed on the substrate (ceramics 4). And a connecting portion that connects the end portions of the first connecting portion and the second connecting portion to each other. In addition, the following patent document 2 shows the connection terminal provided with such a 1st junction part, a 2nd junction part, and a connection part.

  By the way, in the structure shown by FIG. 6 of patent document 1, insulating resin is provided to such a height that a part of 2nd junction part is buried. For this reason, the difference in position in the height direction between the connection portion (the upper surface of the second bonding portion) of the connection terminal with the connection member and the upper surface of the insulating resin is small, and the connection member or the support body that supports the connection member There is a risk that the shape may be greatly restricted. However, Patent Document 1 and Patent Document 2 do not mention the restriction of the shape of the connecting member or the support body that supports the connecting member, and naturally, any technique for reducing such a restriction is disclosed. Not. Needless to say, it is necessary to ensure the reliability of the connection between the connection terminal and the connection member.

International Publication No. 2009/081723 (Fig. 6 etc.) JP 2010-103222 A (FIG. 1 etc.)

  Therefore, an electrical circuit device capable of reducing the restriction on the shape of the connecting member joined to the connecting terminal or the support body supporting the connecting member while ensuring the reliability of the joining between the connecting terminal and the connecting member. Realization is desired.

  According to the present invention, there is provided a substrate on which circuit elements are arranged on an element arrangement surface, a conductive connection terminal arranged on the element arrangement surface, and an insulating resin provided so as to cover the element arrangement surface. A characteristic configuration of the electric circuit device is that the connection terminal is provided with a first joint part joined to the circuit element or the substrate, and spaced from the first joint part in a height direction perpendicular to the element arrangement surface. And a second joining portion joined to the conductive connecting member, and a connection for connecting the first joining portion and one end portion in the predetermined reference direction along the element arrangement surface in the second joining portion. And an extending portion provided so as to extend from the other end portion of the reference direction in the second joint portion toward the element arrangement surface side, and the surface of the insulating resin has the height End of the extending portion in the direction of the element arrangement surface In a point located between the second bonding section.

According to this characteristic configuration, since the surface of the insulating resin is located between the end portion on the element arrangement surface side of the extending portion in the height direction and the second joint portion, It becomes easy to ensure the difference in the position in the height direction between the joining portion and the surface of the insulating resin. Thereby, even when the connection member or the support that supports the connection member has a portion located on the element arrangement surface side with respect to the bonding portion, the connection terminal and the connection terminal can be secured by appropriately securing the above difference. The connecting member can be appropriately joined. Thus, according to said characteristic structure, it becomes possible to reduce the restrictions of the shape of the connection member joined to a connection terminal, or the support body which supports the said connection member.
And according to said characteristic structure, it connects with at least one part of the connection part connected with the one side edge part of the reference direction in a 2nd junction part, and the other side edge part of the reference direction in a 2nd junction part. An insulating resin is provided so that at least a part of the extending portion is filled. Accordingly, the second bonding portion is supported by the substrate via the insulating resin on both sides in the reference direction. Therefore, it is possible to suppress the deformation of the second joint portion at the time of joining with the connection member, and it is easy to make the joint between the connection terminal and the connection member highly reliable.
As described above, according to the above-described characteristic configuration, the shape of the connection member joined to the connection terminal or the support that supports the connection member is restricted while ensuring the reliability of the connection between the connection terminal and the connection member. Can be reduced.

  Here, the extension portion is provided so as to extend in a direction intersecting the extending direction of the main body portion from a main body portion extending from the second joint portion and an end portion of the main body portion on the element arrangement surface side. It is preferable to provide a bent extended portion.

According to this structure, the freedom degree of the design regarding the extension direction of the part buried in the insulating resin in the extension part can be increased while suppressing an increase in the size of the connection terminal. Therefore, the support direction of the extension part by insulating resin can be appropriately set according to the form of joining of the connection terminal and the connection member.
Further, when at least a part of the main body part and at least a part of the bent extension part are both buried in the insulating resin, two parts whose extending directions intersect each other are supported by the insulating resin. The supporting direction of the extending part by the insulating resin is increased. As a result, it is possible to more firmly support the other end portion in the reference direction in the second joint portion.

  Further, as described above, in the configuration in which the extending portion includes the main body portion and the bent extending portion, the bent extending portion is located in the reference direction from the end portion on the element arrangement surface side in the main body portion. It is preferable to be provided so as to extend toward the connecting portion side.

  According to this configuration, the bent extension portion can be provided without increasing the area that the connection terminal occupies in the plane parallel to the element arrangement surface, and in the second joint portion while suppressing the increase in size of the electric circuit device. The other side end portion in the reference direction can be more appropriately supported.

  Moreover, in the electric circuit device having each configuration described above, it is preferable that the surface of the insulating resin is positioned on the opposite side of the element arrangement surface with respect to the circuit element in the height direction.

  According to this configuration, since the circuit element is buried in the insulating resin, the circuit element can be protected when the connection terminal and the connection member are joined. For example, when the connection terminal and the connection member are joined by laser welding, it is possible to suppress the dielectric breakdown of the circuit element due to sputtering generated by the laser welding.

  Moreover, in the electric circuit device having each configuration described above, when the second joint portion is joined to the connection member in a state of being pressed by the connection member from the side opposite to the element arrangement surface side in the height direction. Is preferred.

  Each of the above configurations is suitable when the second bonding portion is bonded to the connection member while being pressed by the connection member from the side opposite to the element arrangement surface side in the height direction. Even if it exists, the deformation | transformation of a 2nd junction part can be suppressed and joining of a connection terminal and a connection member can be made highly reliable.

1 is a schematic diagram of a semiconductor device according to an embodiment of the present invention. 1 is a partial perspective view of a semiconductor device according to an embodiment of the present invention. It is a figure which shows the connection terminal which concerns on other embodiment of this invention.

  An embodiment of an electric circuit device according to the present invention will be described with reference to the drawings. Here, a case where the electric circuit device according to the present invention is applied to a semiconductor device (electronic circuit device) including a semiconductor element (electronic element) as a circuit element will be described as an example. As shown in FIG. 1, the semiconductor device 1 according to the present embodiment is a switching module including a switching element 2 and a diode element 3 as semiconductor elements, and constitutes an inverter module for controlling a rotating electrical machine together with a bus bar module 40. is doing. The semiconductor device 1 includes a substrate 10 on which a semiconductor element is arranged on an element arrangement surface 11, a first connection terminal 20 arranged on the element arrangement surface 11, and an insulating resin 5 provided so as to cover the element arrangement surface 11. With. In such a configuration, the semiconductor device 1 according to the present embodiment is characterized by the configuration of the first connection terminal 20 and the setting of the thickness of the insulating resin 5. Hereinafter, the configuration of the semiconductor device 1 according to the present embodiment will be described in the order of “the overall configuration of the semiconductor device” and “the configuration of the first connection terminal”.

  In the following description, “upper” refers to a direction in which the height increases along the height direction H (direction perpendicular to the element arrangement surface 11) (+ H direction, upper in FIG. 1), and “lower” refers to A direction in which the height decreases along the height direction H (−H direction, downward in FIG. 1) is indicated. In this example, the predetermined direction (reference direction S) along the element arrangement surface 11 is a direction along the element arrangement surface 11, and the arrangement of the switching elements 2 and the diode elements 3 arranged on the substrate 10. It corresponds to the direction (left-right direction in FIG. 1). The “reference first direction S1” indicates the right side along the reference direction S in FIG. 1, and the “reference second direction S2” indicates the left side along the reference direction S in FIG.

1. Overall Configuration of Semiconductor Device The overall configuration of the semiconductor device 1 will be described with reference to FIG. As shown in FIG. 1, the semiconductor device 1 includes a substrate 10, a case 6, a first connection terminal 20, a second connection terminal 30, an insulating member 7, and an insulating resin 5. The upper surface of the substrate 10 is an element arrangement surface 11 for arranging the switching element 2 and the diode element 3, and the rotating electric machine (not shown) is formed by the switching element 2 and the diode element 3 arranged on the element arrangement surface 11. An inverter circuit for driving is configured. In the present embodiment, the semiconductor device 1 corresponds to an “electric circuit device” in the present invention.

  A current path between the inverter circuit and the power source (not shown) is formed above the switching element 2 and the diode element 3, and the current between the inverter circuit and the rotating electrical machine (not shown). A bus bar module 40 for forming the path is arranged. In this example, the rotating electrical machine is an AC motor driven by three-phase AC, and functions as a motor (electric motor) that generates power by receiving power supply and generates power by receiving power supply. It is possible to fulfill both of the functions as a generator (generator). Such a rotating electrical machine is provided as a driving force source in, for example, an electric vehicle or a hybrid vehicle.

  Although not shown, the inverter circuit constituted by the switching element 2 and the diode element 3 is constituted by a bridge circuit. In the present embodiment, two switching elements 2 are connected in series between the positive side and the negative side of the power supply voltage, and this series circuit is connected in parallel in three lines. That is, in this example, six switching elements 2 constitute an inverter circuit, and the semiconductor device 1 includes six substrates 10 on which the six switching elements 2 are arranged. A diode element 3 that functions as an FWD (Free Wheel Diode) is connected in parallel between the emitter and collector of the switching element 2 on each of the six substrates 10. That is, one switching element 2 and one diode element 3 are arranged on each of the six substrates 10. FIG. 1 shows two of the six substrates 10. In the present embodiment, the semiconductor elements (switching element 2 and diode element 3) correspond to the “circuit element” in the present invention.

  The substrate 10 is placed on the upper surface of the insulating member 7, and the upper surface serves as an element arrangement surface 11 for arranging the switching element 2 and the diode element 3. In this example, the substrate 10 is made of a conductive material (for example, a metal material such as copper or aluminum), and the substrate 10 also functions as a heat spreader.

  The insulating member 7 that supports the substrate 10 (six substrates 10 in this example) is fixed to the case 6. In this example, the case 6 includes a peripheral wall portion 6b that surrounds the substrate 10 and the insulating member 7, and a bottom wall portion 6a to which the lower surface of the insulating member 7 is fixed. In this example, the case 6 is formed of a conductive material (for example, a metal material such as copper or aluminum).

  And the insulating resin 5 is filled in the concave space formed by the bottom wall part 6a and the peripheral wall part 6b of the case 6. The insulating resin 5 is formed of a hard resin having electrical insulation properties such as an epoxy resin or a urethane resin, and is provided so as to cover the element arrangement surface 11. In the present embodiment, as shown in FIG. 1, the surface of the insulating resin 5 is located on the side opposite to the element arrangement surface 11 with respect to the switching element 2 and the diode element 3 in the height direction H. That is, in this embodiment, the thickness (height) of the insulating resin 5 is set so that both the switching element 2 and the diode element 3 are buried in the insulating resin 5. Thereby, the switching element 2 and the diode element 3 can be protected when the first connection terminal 20 and the second connection terminal 30 are joined to the bus bar 41.

  The switching element 2 includes an emitter electrode on the upper surface and a collector electrode on the lower surface. The switching element 2 is fixed on the element arrangement surface 11 with solder, and the collector electrode on the lower surface is electrically connected to the substrate 10. The diode element 3 includes an anode electrode on the upper surface and a cathode electrode on the lower surface. The diode element 3 is fixed on the element arrangement surface 11 with solder, and the cathode electrode on the lower surface is electrically connected to the substrate 10. That is, the substrate 10 has the same potential as the collector electrode of the switching element 2 and the cathode electrode of the diode element 3.

  Then, connection terminals (first connection terminal 20 and second connection terminal 30) for electrically connecting the semiconductor device 1 as a switching module and the bus bar module 40 are arranged on the element arrangement surface 11. . Both the first connection terminal 20 and the second connection terminal 30 are made of a conductive material (for example, a metal material such as copper or aluminum).

  Specifically, the first connection terminal 20 is fixed on the element arrangement surface 11 with solder. That is, in this example, the first connection terminal 20 is directly arranged on the element arrangement surface 11. The first connection terminal 20 is electrically connected to the lower surface (collector electrode) of the switching element 2 and the lower surface (cathode electrode) of the diode element 3 through the substrate 10 formed of a conductive material. In the present embodiment, the first connection terminal 20 corresponds to the “connection terminal” in the present invention.

  The second connection terminal 30 is fixed to the upper surface of the semiconductor element (the switching element 2 and the diode element 3) with solder. That is, in this example, the second connection terminal 30 is disposed on the element arrangement surface 11 with a semiconductor element (circuit element) interposed therebetween. As shown in FIG. 1, the second connection terminal 30 is disposed in a state where the upper surface (emitter electrode) of the switching element 2 and the upper surface (anode electrode) of the diode element 3 are electrically connected.

  In this example, both the first connection terminal 20 and the second connection terminal 30 are formed by bending a band-shaped member (plate-shaped member) having a constant width. Specifically, the first connection terminal 20 includes a first joint 21 joined to the substrate 10, a second joint 22 having a joint surface 20a formed on the upper surface, and the first joint 21 and the second joint. A connecting portion 23 that connects the portion 22 and an extending portion 24 that extends from the second joint portion 22 are provided. The detailed configuration of the first connection terminal 20 will be described later in Section 2.

  As shown in FIG. 1, the second connection terminal 30 includes a non-element-side joint having a joint surface 30 a formed on the upper surface, a first element-side joint fixed to the upper surface of the switching element 2 by solder, a diode A second element side joint fixed to the upper surface of the element 3 by solder, a first connection part for connecting the anti element side joint and the first element side joint, the anti element side joint and the second element side And a second connecting part that connects the joint part.

  The bus bar module 40 includes a bus bar 41 and a support 42 that supports the bus bar 41. The bus bar 41 is made of a conductive material (for example, a metal material such as copper or aluminum). The support 42 is formed of an insulating material (for example, resin). In the present embodiment, the bus bar 41 corresponds to the “connecting member” in the present invention.

  And the joining surface 20a with which the 1st connection terminal 20 is provided, and the bus-bar 41 are joined, The lower surface (collector electrode) of the switching element 2 and the lower surface (cathode electrode) of the diode element 3 connect the 1st connection terminal 20 with it. To the bus bar 41. In addition, the bonding surface 30 a included in the second connection terminal 30 and the bus bar 41 are bonded, so that the upper surface (emitter electrode) of the switching element 2 and the upper surface (anode electrode) of the diode element 3 connect the second connection terminal 30. To the bus bar 41.

  In the present embodiment, the first connection terminal 20, the second connection terminal 30, and the bus bar 41 are joined by laser welding. And in this example, in order to raise the reliability of joining with the 1st connection terminal 20 and the bus bar 41, the 1st connection terminal 20 is joined to the bus bar 41 by the laser welding in the state pressed by the bus bar 41 from the upper side. . Specifically, the first connection terminal 20 and the bus bar 41 are bonded in a state where the second bonding portion 22 is pressed against the bus bar 41 from the side opposite to the element arrangement surface 11 side in the height direction H (that is, the upper side). Is done. Similarly, the second connection terminal 30 is also joined to the bus bar 41 by laser welding while being pressed by the bus bar 41 from above. Specifically, the second connection terminal 30 and the bus bar 41 are joined in a state where the anti-element side joint provided in the second connection terminal 30 is pressed against the bus bar 41 from above. Although spatter may be scattered during such laser welding, the switching element 2 and the diode element 3 are buried in the insulating resin 5 in this example as described above. Therefore, it is suppressed that the switching element 2 and the diode element 3 cause dielectric breakdown due to the spatter generated during laser welding.

  In addition, in order to ensure the electrical insulation of an inverter module, after joining the 1st connecting terminal 20, the 2nd connecting terminal 30, and the bus-bar 41, it is further insulating resin (insulating resin 5 and the insulation resin 5 from the upper side). The resin can be filled with the same or different material, and the entire first connection terminal 20 and second connection terminal 30 can be buried in the insulating resin.

2. Next, the configuration of the first connection terminal 20 will be described in detail. As described above, the first connection terminal 20 includes the first joint portion 21, the second joint portion 22, the connecting portion 23, and the extending portion 24. In the present embodiment, the extending portion 24 includes a main body portion 24a and a bent extending portion 24b. In this example, since the first connection terminal 20 is formed by bending a band-shaped member (plate-shaped member) having a constant width, the first connecting portion 21, the second connecting portion 22, the connecting portion 23, and the extending portion 24 Each of the main body portion 24a and the bent extending portion 24b of the extending portion 24 is formed in a flat plate shape.

  The first bonding portion 21 is a portion bonded to a circuit element (in this example, a semiconductor element, more specifically, the switching element 2 or the diode element 3) or the substrate 10, and in this example, the substrate 10 (specifically, Are bonded to the element arrangement surface 11) of the substrate 10.

  The second bonding portion 22 is a portion that is provided apart from the first bonding portion 21 in the height direction H perpendicular to the element arrangement surface 11 and is bonded to the bus bar 41. Specifically, the upper surface of the second bonding portion 22 is a bonding surface 20 a that is bonded to the bus bar 41. In the present embodiment, the first bonding portion 21 and the second bonding portion 22 are arranged in parallel with each other, and the upper surface (the bonding surface 20 a) of the second bonding portion 22 is arranged in parallel with the element arrangement surface 11. In the present embodiment, the first joint portion 21 and the second joint portion 22 are formed so as to have the same area (rectangular shape of the same size) and are viewed along the height direction H. It is arranged so that it overlaps. More specifically, in this embodiment, even when viewed from either side along the height direction H, the first joint portion 21 and the second joint portion 22 are arranged so as to be hidden behind the other. . In addition, it can also be set as the structure by which the 1st junction part 21 and the 2nd junction part 22 were mutually different areas.

  The connecting portion 23 is a portion that connects the first joint portion 21 and the one end portion in the reference direction S in the second joint portion 22. In the present embodiment, as shown in FIG. 1, the connecting portion between the connecting portion 23 and the first joint portion 21 is an end portion in the reference direction S in the first joint portion 21. That is, in the present embodiment, the connecting portion 23 connects the end portion in the reference direction S in the first joint portion 21 and the end portion in the reference direction S in the second joint portion 22. Furthermore, in this embodiment, the connection part 23 has connected the edge parts of the same side of the reference | standard direction S in each of the 1st junction part 21 and the 2nd junction part 22. FIG. As described above, in this embodiment, even when viewed from either side along the height direction H, one of the first joint 21 and the second joint 22 is arranged to be hidden behind the other. The connecting portion 23 is formed so as to extend along a direction orthogonal to the element arrangement surface 11 (that is, the height direction H).

  For example, with respect to the first connection terminal 20 on the left side in FIG. 1, the connecting portion 23 includes an end portion on the reference second direction S2 side in the first joint portion 21 and a reference second direction S2 side in the second joint portion 22. The end is connected. And the extension part 24 is provided so that it may extend toward the element arrangement | positioning surface 11 side from the edge part by the side of 1st reference | standard direction S1 in the 2nd junction part 22. As shown in FIG. Regarding the first connection terminal 20, the reference first direction S1 side and the reference second direction S2 side correspond to “the other side of the reference direction” and “one side of the reference direction” in the present invention, respectively. Note that “extending toward a certain part or member side” means that the part or member approaches the part along the extension direction, and is not necessarily a straight line connecting the extension source and the part or member. It does not mean extending along.

  Moreover, about the 1st connection terminal 20 of the right side in FIG. 1, the connection part 23 is the edge part of the reference | standard 1st direction S1 side in the 1st junction part 21, and the reference | standard 1st direction S1 side in the 2nd junction part 22. The end is connected. And the extension part 24 is provided so that it may extend toward the element arrangement | positioning surface 11 side from the edge part by the side of the reference | standard 2nd direction S2 in the 2nd junction part 22. As shown in FIG. Regarding the first connection terminal 20, the reference first direction S1 side and the reference second direction S2 side correspond to "one side of the reference direction" and "the other side of the reference direction" in the present invention, respectively.

  The extending portion 24 extends from the end of the second bonding portion 22 in the reference direction S, specifically, from the end opposite to the side where the connecting portion 23 is connected in the reference direction S to the element placement surface 11 side. It is a part provided so that it may extend toward. In the present embodiment, as described above, the extending portion 24 includes the main body portion 24a and the bent extending portion 24b. In the example shown in FIG. 1, the extending part 24 is provided so as to be positioned on the bus bar module 40 side (supporting body 42 side) with respect to the connecting part 23.

  The main body portion 24a is a portion extending from the second joint portion 22, and one end is connected to the end portion of the second joint portion 22 in the reference direction S and the other end is connected to the end portion of the bent extension portion 24b. . In the present embodiment, as shown in FIG. 1, the main body portion 24 a is formed so as to extend downward along the height direction H from the second joint portion 22. Thereby, the main body portion 24 a can be provided without increasing the area occupied by the first connection terminal 20 in a plane parallel to the element arrangement surface 11.

  The bent extending portion 24b is provided so as to extend along the direction intersecting the extending direction of the main body portion 24a from the end portion of the main body portion 24a on the element arrangement surface 11 side. In the present embodiment, the bent extension portion 24b is provided so as to extend from the end portion on the element arrangement surface 11 side in the main body portion 24a toward the connecting portion 23 side in the reference direction S. Thereby, it is possible to provide the bent extended portion 24b without increasing the area occupied by the first connection terminal 20 in the plane parallel to the element arrangement surface 11, and the enlargement of the semiconductor device 1 is suppressed. However, it is possible to support the second joint portion 22 more appropriately. In this example, the bent extended portion 24 b is formed to extend along the reference direction S, and the bent extended portion 24 b is a plate-like member parallel to the element arrangement surface 11.

  The insulating resin 5 is provided such that the surface is positioned between the end portion on the element arrangement surface 11 side of the extending portion 24 in the height direction H and the second bonding portion 22. Thereby, it connects with the edge part on the opposite side to the connection part 23 of the reference direction S in the 2nd junction part 22 at least one part of the connection part 23 connected with the edge part of the reference | standard direction S in the 2nd junction part 22. Both the extended portion 24 and the extended portion 24 are buried in the insulating resin 5. Therefore, the 2nd junction part 22 is supported by the board | substrate 10 via the insulating resin 5 on both sides of the reference | standard direction S, suppresses a deformation | transformation of the 2nd junction part 22 at the time of joining with the bus-bar 41, and a 1st connection terminal 20 and the bus bar 41 can be joined with high reliability.

  Furthermore, in this embodiment, as shown in FIG. 1, the surface of the insulating resin 5 is located at the same height as the middle part of the main body part 24a in the vertical direction, and the lower part of the main body part 24a and the bent extension part 24b. Is buried in the insulating resin 5. That is, in this example, two parts whose extending directions intersect each other, specifically, at least a part (a part in this example) of the main body part 24a whose extending direction extends along the height direction H, and an extension Since at least a part (all in this example) of the bent extending portion 24b whose direction is along the reference direction S is buried in the insulating resin 5, the second bonding portion 22 can be supported more firmly. .

  In addition, since the surface of the insulating resin 5 is located between the end portion on the element arrangement surface 11 side of the extending portion 24 in the height direction H and the second bonding portion 22, in this configuration, the second bonding portion 22 It is easy to ensure a difference in the position in the height direction H between the joint portion with the bus bar 41 (in this example, the upper surface of the second joint portion 22) and the surface of the insulating resin 5. Therefore, as shown in FIG. 1, even when the lower end portion of the support 42 included in the bus bar module 40 is positioned below the lower end portion of the bus bar 41, the first connection terminal 20 and the bus bar 41 are included. And can be joined appropriately.

3. Other Embodiments Finally, other embodiments according to the present invention will be described. Note that the features disclosed in each of the following embodiments can be used only in that embodiment, and can be applied to other embodiments as long as no contradiction arises.

(1) In the above embodiment, the configuration in which the first joint portion 21 included in the first connection terminal 20 is joined to the substrate 10 has been described as an example. However, the embodiment of the present invention is not limited to this, and the first junction 21 may be configured to be joined to a semiconductor element (circuit element) such as the switching element 2 or the diode element 3. FIG. 3 shows an example of a configuration in which the first joint portion 21 is joined to the upper surface of the switching element 2.

(2) In the above-described embodiment, the connection portion 23 is described as an example of a configuration in which the ends on the same side in the reference direction S in each of the first joint portion 21 and the second joint portion 22 are connected. . However, the embodiment of the present invention is not limited to this, and the connecting portion 23 connects the ends on the different sides of the reference direction S in each of the first joint portion 21 and the second joint portion 22. It can also be set as the structure to do. In such a configuration, the connecting portion 23 can be formed so as to extend uniformly along the direction intersecting with the height direction H. Alternatively, the connecting portion 23 may be a single or plural connecting portions in the intermediate portion. It can also be set as the structure which has a bending part (for example, two places). Even in such a configuration, the second bonding portion 22 can be supported from both sides of the reference direction S by the connecting portion 23 and the extending portion 24.

(3) In the above embodiment, the surface of the insulating resin 5 is positioned at the same height as the middle part of the main body portion 24a in the vertical direction, and the lower portion of the main body portion 24a and the entire bent extending portion 24b are insulating resin. The configuration buried in 5 has been described as an example. However, the embodiment of the present invention is not limited to this, and the surface of the insulating resin 5 is located at the same position as the element arrangement surface 11 side end (lower end) of the main body portion 24a or below the end. In addition, it is possible to adopt a configuration in which at least a part of the bent extended portion 24 b is buried in the insulating resin 5. Further, the surface of the insulating resin 5 is located at the same position as the end (upper end) of the main body portion 24a opposite to the element arrangement surface 11, and the entire main body portion 24a is buried in the insulating resin 5, Only the joint portion 22 may be exposed to the outside of the insulating resin 5.

(4) In the above embodiment, the configuration in which the extending portion 24 includes the main body portion 24a and the bent extending portion 24b has been described as an example. However, the embodiment of the present invention is not limited to this, and the extending portion 24 includes only the main body portion 24a, and the extending direction of the extending portion 24 is uniformly formed throughout. You can also

(5) In the above embodiment, the bent extension portion 24b is provided so as to extend from the end portion on the element arrangement surface 11 side in the main body portion 24a toward the connecting portion 23 side in the reference direction S. Described as an example. However, the embodiment of the present invention is not limited to this, and the bent extending portion 24b extends from the end portion on the element arrangement surface 11 side in the main body portion 24a to the side opposite to the connecting portion 23 in the reference direction S. It can also be set as the structure provided so that it might extend toward.

(6) In the above-described embodiment, the configuration in which the bent extension portion 24b is formed to extend along the reference direction S has been described as an example. However, the embodiment of the present invention is not limited to this, and the bending extension portion 24b is inclined in the direction intersecting with the reference direction S from the end portion on the element arrangement surface 11 side in the main body portion 24a. It can also be set as the structure provided so that it may extend toward upper side or lower side along. In the configuration in which the bent extension portion 24b is provided so as to extend upward from the end portion, at least a part of the main body portion 24a and at least a part of the bent extension portion 24b are both embedded in the insulating resin 5. It becomes composition. Further, in the configuration in which the bent extension portion 24b is provided so as to extend downward from the end portion, only a part or all of the bent extension portion 24b can be embedded in the insulating resin 5. In addition, it is possible to adopt a configuration in which all of the bent extension portion 24b and at least a part of the main body portion 24a are both buried in the insulating resin 5.

(7) In the above embodiment, the configuration in which the main body portion 24a is formed to extend downward from the second joint portion 22 along the height direction H has been described as an example. However, the embodiment of the present invention is not limited to this, and the main body portion 24a extends from the second bonding portion 22 along the direction intersecting with the height direction H so as to cross the element placement surface 11. It can also be set as the structure provided so that it might go to either one side of the reference | standard direction S as it goes to the side (lower side).

(8) In the above embodiment, the surface of the insulating resin 5 is positioned on the side opposite to the element placement surface 11 with respect to the switching element 2 and the diode element 3 in the height direction H, that is, the semiconductor element is insulated. The configuration buried in the resin 5 has been described as an example. However, the embodiment of the present invention is not limited to this, and the surface of at least one of the switching element 2, the diode element 3, or other semiconductor elements (circuit elements) arranged on the element arrangement surface 11 is not limited. In addition, it may be configured to be positioned above the surface of the insulating resin 5.

(9) In the above embodiment, the configuration in which the reference direction S coincides with the arrangement direction of the switching elements 2 and the diode elements 3 arranged on the substrate 10 has been described as an example. Can be set in an arbitrary direction along the line (for example, a direction orthogonal to the arrangement direction).

(10) In the above embodiment, the case where the semiconductor device 1 is a switching module constituting an inverter module has been described as an example. However, the embodiment of the present invention is not limited to this, and the present invention can be applied to any semiconductor device including a connection terminal that electrically connects a semiconductor element arranged on a substrate and a connection member. . Further, the present invention can also be applied to an electric circuit device that does not include a semiconductor element as a circuit element.

(11) Regarding other configurations as well, the embodiments disclosed herein are illustrative in all respects, and embodiments of the present invention are not limited thereto. That is, as long as the configuration described in the claims of the present application and a configuration equivalent thereto are provided, a configuration obtained by appropriately modifying a part of the configuration not described in the claims is naturally also included in the present invention. Belongs to the technical scope.

  The present invention relates to an electric circuit device comprising: a substrate on which circuit elements are arranged on an element arrangement surface; conductive connection terminals arranged on the element arrangement surface; and an insulating resin provided so as to cover the element arrangement surface. Can be suitably used.

1: Semiconductor device (electric circuit device)
2: Switching element (circuit element)
3: Diode element (circuit element)
5: Insulating resin 10: Substrate 11: Element arrangement surface 20: First connection terminal (connection terminal)
21: 1st junction part 22: 2nd junction part 23: Connection part 24: Extension part 24a: Main body part 24b: Bending extension part 41: Bus bar (connection member)
H: Height direction S: Reference direction

Claims (5)

An electric circuit device comprising: a substrate on which circuit elements are arranged on an element arrangement surface; a conductive connection terminal arranged on the element arrangement surface; and an insulating resin provided so as to cover the element arrangement surface. And
The connection terminal is provided on the conductive connection member while being provided apart from the first joint portion to be joined to the circuit element or the substrate and in the height direction perpendicular to the element arrangement surface from the first joint portion. A second joining portion to be joined, a connecting portion for joining the first joining portion and one end portion in a predetermined reference direction along the element arrangement surface in the second joining portion, and the second joining portion An extending portion provided so as to extend from the other end portion in the reference direction toward the element arrangement surface side,
An electric circuit device in which a surface of the insulating resin is located between an end portion on the element arrangement surface side of the extending portion in the height direction and the second bonding portion.   The extending portion includes a main body portion extending from the second joint portion, and a bent extension provided so as to extend in a direction crossing the extending direction of the main body portion from an end portion of the main body portion on the element arrangement surface side. The electric circuit device according to claim 1, further comprising a current portion.   The electric circuit device according to claim 2, wherein the bent extension portion is provided so as to extend from an end portion of the main body portion on the element arrangement surface side toward the connecting portion side in the reference direction.   4. The electric circuit device according to claim 1, wherein a surface of the insulating resin is located on a side opposite to the element arrangement surface with respect to the circuit element in the height direction. 5.   The said 2nd junction part is joined to the said connection member in the state pressed by the said connection member from the opposite side to the said element arrangement surface side in the said height direction. Electric circuit device.

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